28th week of 2022 patent applcation highlights part 77 |
Patent application number | Title | Published |
20220225504 | DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME - A display panel includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed on the pad area, and an insulating layer disposed between adjacent ones of the plurality of pad electrodes and including a heat absorbing particle. A laser is irradiated to heat the insulating layer, and the heat absorbing particle in the insulating layer absorbs the heat and cures an anisotropic conductive film by heat transfer to electrically connect the plurality of pad electrodes to a plurality of bump electrodes. | 2022-07-14 |
20220225505 | DISPLAY PANEL AND DISPLAY DEVICE HAVING SAME - A display panel and a display device are disclosed. By disposing a binding film over a gap between adjacent circuit boards, and then forming connection wires on the binding film, connections between different circuit boards are achieved. The present disclosure solves a problem of high costs caused by traditional flexible circuit boards and connectors, thereby saving a large number of connectors and flexible circuit boards, and thereby reducing costs significantly. | 2022-07-14 |
20220225506 | ELECTRONIC DEVICE INCLUDING HOST BOX AND ONE OR MORE EXTENSION BOXES - An electronic device includes: a host box comprising a host processor configured to control an operation of the electronic device, a host motherboard in which the host processor is disposed, and a host power supply unit (PSU) configured to supply power to a component connected to the host motherboard; and one or more extension boxes controlled by the host box, wherein each of the one or more extension boxes comprises an extension motherboard independent of the host box, and an extension PSU independent of the host box and configured to supply power to a component connected to the extension motherboard. | 2022-07-14 |
20220225507 | CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE | 2022-07-14 |
20220225508 | PRINTED STACKED MICRO-DEVICES - A stacked electronic component comprises a stack of three or more print layers. Each print layer has an area less than any print layers beneath the print layer in the stack. Each print layer comprises a dielectric layer and a functional layer disposed on the dielectric layer. The functional layer comprises an exposed conductive portion that is not covered with a dielectric layer of any of the print layers and each exposed conductive portion is nonoverlapping with any other exposed conductive portion. A patterned electrode layer is coated on at least a portion of the stack and defines one or more electrodes. Each electrode of the one or more electrodes in electrical contact with an exclusive subset of the exposed conductive portions. The functional layers can be passive conductors forming capacitors, resistors, inductors, or antennas, or active layers forming electronic circuits. | 2022-07-14 |
20220225509 | SUPPORTER FOR ELECTRONIC COMPONENT - A supporter for electronic parts includes: an adsorption plate which is attached to an upper surface of a first electronic part among the first electronic part and a second electronic part where the first electronic part and a second electronic part are spaced apart from each other on a plane; and a supporting member which includes 1) a first support part which supports a lower surface of the second electronic part and 2) a connection part which connects the adsorption plate and the first support part. On the plane, about 70-90% of the area of the first support part is overlapped with the second electronic part. | 2022-07-14 |
20220225510 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a circuit board is disclosed. An inner laminated structure with a conductive wiring layer and an outermost cover layer is provided. The conductive wiring layer includes a connection pad. A mask is disposed on a side of the cover layer away from the conductive wiring layer, and the mask defines a plurality of first openings penetrating the mask. A second opening is formed on the cover layer by laser etching through the mask to expose the connection pad. A surface treatment is applied to the connection pad and an electronic component is electrically connected with the connection pad. A circuit board is also disclosed. | 2022-07-14 |
20220225511 | RIGID-FLEXIBLE CIRCUIT BOARD WITH EASY AND SIMPLE MANUFACTURE AND METHOD FOR MANUFACTURING THE SAME - A rigid-flexible circuit board which can be simply and easily manufactured includes a wiring substrate, two adhesive layers, and two outer conductive wiring layers. The wiring substrate defines an opening penetrating and splitting the wiring substrate. The two outer conductive wiring layers are stacked on opposite surfaces of the wiring substrate. Each of the two adhesive layers is bonded between one of the two outer conductive wiring layers and the wiring substrate and infills the opening. A simplified method for manufacturing the rigid-flexible circuit board is also disclosed. | 2022-07-14 |
20220225512 | EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element. | 2022-07-14 |
20220225513 | ELECTRONIC DEVICE INCLUDING CONNECTOR - An electronic device includes a housing including a front plate, a rear plate, a first support member, at least a portion of which is disposed between the front plate and the rear plate, and a second support member which faces the first support member, a display including a first display surface visually exposed to an exterior of the electronic device, and a second display surface which is opposite to the first display surface, a first connector mounted on the second display surface, a main printed circuit board disposed in the housing, and a first flexible printed circuit board connected to the main printed circuit board, where the first flexible printed circuit board includes a second connector facing the second support member and connected to the first connector. | 2022-07-14 |
20220225514 | Flexible Display Devices - Electronic devices may be provided that contain multiple housing portions. The housing portions may be coupled together using hinges. The hinges may include hinges based on a three-bar linkage, hinges based on a four-bar linkage, hinges with slotted members, hinges formed from flexible support structures, and hinges based on flexible housing structures. Flexible displays may be mounted to the housing portions overlapping the hinges. When the housing portions in a device are rotated relative to each other, the flexible display may bend. The hinge may be configured to allow the flexible display to be placed in a front-to-front configuration in which an active side of the display faces itself or a back-to-back configuration. Engagement structures may be used to help the housing grip external objects and to hold the housing portions together. The hinges may be provided with rotational detents to help hold the flexible display in desired positions. | 2022-07-14 |
20220225515 | Method for Producing a Housing Enclosing a Control Unit - The invention relates to a method for producing a housing ( | 2022-07-14 |
20220225516 | Electronic Control Unit - An electronic control unit ( | 2022-07-14 |
20220225517 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is an electronic device. The electronic device includes a housing provided to accommodate a printed circuit board, a cover coupled to the housing, and including a coupling protrusion protruding to a side of the housing to be accommodated in the housing, and including a coupling hole formed in the coupling protrusion, a fastening pin arranged in the coupling hole and configured to couple to the housing, and a sealing member arranged between an inner wall forming the coupling hole and the fastening pin to seal the coupling hole. Various other embodiments are possible. | 2022-07-14 |
20220225518 | Apparatus and Method for Module Retention in a Motor Control Center - An apparatus to retain modules within a Motor Control Center (MCC) includes a plate mounted to each side of the module housing and at least one spring mounted to each plate within the module housing. The plate includes a hook at one end which connects to and pivots about an opening in the module while retaining the plate to the module. The plate also includes a retaining member extending through an opening in the module housing and configured to receive one end of the spring. The spring is under tension when connected between the retaining member of the plate and the module housing, pulling the retaining member toward the module housing. A biasing member which engages the housing of the MCC as the module is inserted is compressed toward the module during insertion. The spring pushes the biasing member outward after insertion, positively retaining the module to the MCC. | 2022-07-14 |
20220225519 | DISPLAY APPARATUS - A display apparatus includes a flexible display panel, a drive board that drives the display panel, a flexible board that connects the display panel and the drive board, a core to which the drive board is fixed, rolls up the display panel and the flexible board, and a connection member including a plate-shaped member that is layered on the display panel, connects the display panel and the core, and is rolled up around the core along with the display panel and the flexible board. The plate-shaped member includes a first part overlapping the display panel and curved when the display panel is rolled up around the core and a second part overlapping the flexible board and curved when the flexible board is rolled up around the core. In a roll-up direction, an elongation rate of the second part is smaller than that of the first part. | 2022-07-14 |
20220225520 | CABINET AND POWER CONVERTER - A power converter includes a cabinet and an electric device accommodated in the cabinet. The cabinet includes a housing, a door, a support member, and a rotation mechanism. The door is rotatably supported around a first axis with respect to the housing. The support member is interposed between the housing and the door to support the door in the housing. The rotation mechanism rotates the door with respect to the housing around a second axis along a direction orthogonal to a plane direction of an opening of the housing. | 2022-07-14 |
20220225521 | ELECTRONIC DEVICE - An electronic device includes a back frame, a panel, an adhesive layer, an adhesive member, and a connecting member. The panel is arranged on the back frame. The adhesive layer is adhered to the panel. The adhesive member is adhered to the back frame. The connecting member is adhered to the adhesive layer and the adhesive member. | 2022-07-14 |
20220225522 | INFORMATION DEVICE AND COVER - An information device and a cover that are suitable for forming design marks on a soft material and enhance the appearance quality. The cover includes: a core as a base; an auxiliary sheet closer to a surface than the core; a surface material closer to the surface than the auxiliary sheet, the surface material being softer than the core; and a design mark part including a baseplate and a design mark protruding from the baseplate. The baseplate is disposed in a plate recessed portion having a shape corresponding to a contour of the baseplate and disposed in a surface of the core. The design mark is exposed to the surface through design mark holes in the auxiliary sheet and the surface material, the design mark holes having a contour shape of the design mark. The auxiliary sheet covers at least the contour of the baseplate and the plate recessed portion. | 2022-07-14 |
20220225523 | Electronic Devices With Durable Folding Displays - A foldable display may have a display cover layer and a flexible display panel. The foldable display may bend around a bend axis. The display panel may have an array of pixels configured to display an image through the display cover layer. The display cover layer may be formed from a layer of glass. A recess may be formed in the layer of glass that extends along the bend axis. The recess may form a flexible locally thinned portion in the layer of glass that allows the glass layer to bend about the bend axis. To ensure that the display cover layer exhibits satisfactory impact resistance during drop events, corner portions of the display cover layer and other edge portions of the display cover layer may be provided with greater thickness relative to other portions of the display cover layer outside of the locally thinned portion. | 2022-07-14 |
20220225524 | Rackmount Systems and Methods - Systems and methods for improved circuit board removal and/or reinstallation are provided. A circuit board removal system can include a frame including a channel arranged in a plate of the frame. A disengagement slider can include a mounting surface and a first portion including a first cam surface, where the disengagement slider is arranged within the frame. A separator can include a second cam surface and can be arranged in the channel of the plate. The first cam surface and the second cam surface can be nested with each other when the disengagement slider is in an inserted position. The disengagement slider can be configured to slide the separator in the longitudinal direction when the disengagement slider is removed from the frame due to the interaction of the first cam surface with the second cam surface. | 2022-07-14 |
20220225525 | ELECTRONIC DEVICE - An electronic device includes a housing, first and second wiring substrates disposed to face each other, a fixing member that is made of an electrically conductive member and fixes the first and second wiring substrates to each other, and an external connection terminal provided in the housing. The fixing member has first and second fixing portions, and is interposed between the first and second wiring substrates. The fixing member is electrically conductive to a first electrically conductive portion provided in the first wiring substrate by fixing the first fixing portion to the first wiring substrate. The fixing member is electrically conductive to a second electrically conductive portion provided in the second wiring substrate by fixing the second fixing portion to the second wiring substrate. The external connection terminal is electrically conductive to the fixing member by electrically connecting the fixing member to the external connection terminal. | 2022-07-14 |
20220225526 | Tool-Less Installation Structure For Dual Slot PCIE Card - A bracket for holding an electronic device in a carrier in a computing system is described. The bracket includes an outer plate and an inner compressible sleeve. The outer plate includes a front side and a back side. The inner compressible sleeve including a front section, a back section, and an aperture. The front section of the inner compressible sleeve is coupled to the back side of the outer plate. When the electronic device is inserted in the aperture, the electronic device compresses the inner compressible sleeve within the aperture. The bracket may also include a hole, on the outer plate, configured to mate with a fastener on the electronic device. The bracket also includes a protrusion on the outer plate. The protrusion prevents the electronic device from moving through the front side of the outer plate. The inner compressible sleeve of the bracket is a shock dampener. | 2022-07-14 |
20220225527 | IMMERSION LIQUID COOLING ELLIPTICAL TANK ASSEMBLY - An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle. | 2022-07-14 |
20220225528 | IMMERSION LIQUID COOLING TANK ASSEMBLY - An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover is located generally opposite to the base. | 2022-07-14 |
20220225529 | POWER ELECTRONICS SYSTEM WITH BUSBARS OF HOLLOW DESIGN FOR DIRECT CAPACITOR COOLING; AND ELECTRIC MOTOR - A power electronics system for an electric motor of a motor vehicle drive includes a first busbar, a second busbar which is electrically insulated relative to the first busbar, and at least one capacitor. The at least one capacitor, by way of its first electrode, makes contact with a plate-like receiving region of the first busbar and, by way of its second electrode, makes contact with a plate-like receiving region of the second busbar. At least one of the two busbars is of hollow design, with direct formation of a cooling duct. | 2022-07-14 |
20220225530 | FAN ON PRINTED CIRCUIT BOARD - Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a first side and an opposite second side. A first air mover can be coupled to the first side of the support structure, where a motor of the first air mover is on the support structure and an air mover controller where the air mover controller controls the first air mover through trace in the support structure. In some examples, a second air mover can be located on the second side of the support structure, where a motor of the second air mover is on the second side of the support structure and the second air mover is controlled by the air mover controller through trace in the support structure. The support structure can be a printed circuit board or motherboard. | 2022-07-14 |
20220225531 | DEVICE FOR AIRFLOW MANAGEMENT AND COOLING IMPROVEMENT IN HYBRID-COOLED ELECTRONICS - Embodiments are disclosed of a baffle unit. The baffle unit includes an elastic member and one or more baffle blades. Each baffle blade has a first edge and a second edge, and each baffle blade has its first edge coupled to the elastic member, so that each baffle blade rotates about and deforms the elastic member in response to aerodynamic forces applied to the one or more baffle blades. Implementation of one or more of the baffle units preventing or reduces thermal impact of the airflow on liquid cooling devices and enables airflow management optimization. | 2022-07-14 |
20220225532 | HEAT DISSIPATOR AND COMMUNICATIONS DEVICE - Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole. | 2022-07-14 |
20220225533 | APPARATUS FOR HEAT MANAGEMENT IN AN ELECTRONIC DEVICE - An apparatus and heat management mechanism are described. The apparatus includes an outer casing enclosing at least one heat generating electronic structure, such as a plurality of electronic components included on at least printed circuit board, the outer casing having an inner surface and an outer surface. The apparatus and the heat management mechanism further include a heat dissipation structure thermally coupled to the heat generating structure or printed circuit board, the heat dissipation structure forming an open-ended columnar channel, the open-ended columnar channel allowing air to flow within the heat dissipation structure in a direction parallel to a surface of the heat generating structure or printed circuit board. | 2022-07-14 |
20220225534 | TELECOMMUNICATION CABINET WITH HIDDEN ANTI-THEFT HEAT DISSIPATION MODULE - A telecommunication cabinet with anti-theft function includes a cabinet body, a cabinet door, a fan module, and a plurality of coupling parts. The cabinet body includes a cabinet and a telecommunication module. The cabinet door covers the cabinet body and is provided with a snap hole. A bottom side of the cabinet door is provided with an installation opening. The fan module includes multiple fans and an elastic clip, and the elastic clip is provided with a bump. When the fan module is placed into the cabinet door from the installation opening, the bump is positioned in the snap hole. The fan module is coupled to the bottom side of the cabinet door. | 2022-07-14 |
20220225535 | DUAL-SIDED FAN TRAY ASSEMBLY OF AN ELECTRONIC SYSTEM - Example implementations relate to a dual-sided fan tray assembly of an electronic system. The fan tray assembly includes a housing having a front panel, a back panel, and a pair of side walls coupled to the front and back panels. The fan tray assembly further includes a handle assembly pivotably connected to the pair of side walls such that the handle assembly is at least rotatable around the housing to at least first and second positions spaced apart from each other. When the handle assembly is rotated to the first position, the fan tray assembly is slidably insertable into a chassis of an electronic system with the front panel facing the chassis to install the fan tray assembly to the electronic system. When the handle assembly is rotated to the second position, the fan tray assembly is slidably insertable into the chassis with the back panel facing the chassis. | 2022-07-14 |
20220225536 | THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS - Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader. | 2022-07-14 |
20220225537 | LOCALIZED IMMERSION COOLING ENCLOSURE - In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device. | 2022-07-14 |
20220225538 | SINGLE-PHASE IMMERSION COOLING SYSTEM AND METHOD OF THE SAME - A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, and at least a second conduit. The at least a first and second conduits have first and second modifiable portions comprising first and second openings submerged within the dielectric thermally conductive fluid, respectively. The at least one of the first conduit or second conduit circulates dielectric thermally conductive fluid from a heat exchanger outlet into the fluid-tight containment vessel and the other, circulates dielectric thermally conductive fluid from the fluid-tight containment vessel to a heat exchanger inlet via the pump. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel. | 2022-07-14 |
20220225539 | LOCALIZED FLUID ACCELERATION IN IMMERSED ENVIRONMENT - A cooling system comprises an information technology (IT) container including a plurality of IT chambers, a fluid supply channel disposed at a bottom of the IT container to receive the fluid from a cooling unit and to supply the fluid to the IT chambers, a fluid return channel disposed on a top of the IT chambers to return the fluid received from the IT chambers to the cooling unit, a fluid acceleration channel disposed separately from the fluid return channel to return at least some of the fluid to the cooling unit in an accelerated manner, and one or more pumps disposed between at least some of the IT chambers immerged in the fluid environment and the fluid acceleration channel to increase a flowrate of the fluid from the corresponding IT chambers to the cooling unit via the fluid acceleration channel. For example, each IT chamber to store fluid and to populate IT equipment submerged in the fluid for immersion cooling. In an embodiment, the IT chamber includes acceleration sections. | 2022-07-14 |
20220225540 | BOX TYPE COOLING STRUCTURE FOR CONTROLLER - Disclosed is a box type cooling structure of a controller, which includes an upper water channel substrate, a front water channel substrate, a left water channel substrate, a rear water channel substrate, a right water channel substrate, a lower water channel substrate and an intermediate water channel substrate sequentially surrounding the controller in six directions to form a box structure. Each water channel substrate is internally provided with a water channel structure. | 2022-07-14 |
20220225541 | SYSTEMS FOR COOLING ELECTRONIC COMPONENTS IN A SEALED COMPUTER CHASSIS - A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink. | 2022-07-14 |
20220225542 | THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS - A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient. | 2022-07-14 |
20220225543 | CASE, FAN MODULE AND FAN FRAME - A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell. | 2022-07-14 |
20220225544 | Refrigeration Device and Data Center - A refrigeration device includes an indoor unit and an outdoor unit. The indoor unit is used for heat exchange with air inside an equipment room. To adapt to different cabinets, one or more ventilation ducts of the indoor unit include a plurality of channels, and a baffle assembly is disposed in the indoor unit. An air flow direction in the ventilation duct is changed using the baffle assembly, and the baffle assembly is adjusted to block different positions to apply the refrigeration device to different types of cabinets. | 2022-07-14 |
20220225545 | INTELLIGENT DUAL PURPOSE HEAT EXCHANGER AND FAN WALL FOR A DATACENTER COOLING SYSTEM - Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air heat exchanger is associated with a fan wall of a rack and enables a datacenter cooling system to address a first cooling requirement of the rack in a first mode by air through the rack from the fan wall and to address a second cooling requirement of a fluid from at least one cold plate in the rack using the air through the liquid-to-air heat exchanger. | 2022-07-14 |
20220225546 | COOLING AUTOMOTIVE POWER ELECTRONICS - The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module. | 2022-07-14 |
20220225547 | POWER ELECTRONICS UNIT HAVING AT LEAST ONE SEMICONDUCTOR MODULE ATTACHED BY MEANS OF A PLASTIC HOLDER - A power electronics unit for an electric motor of a motor vehicle drive, having a plate-like cooling element, at least one semiconductor module and a module holder which consists of plastic and secures the at least one semiconductor module relative to the cooling element. The module holder is fixed to the cooling element via an interlocking snap connection. | 2022-07-14 |
20220225548 | Vehicle Power Module Assembly - A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot. | 2022-07-14 |
20220225549 | SEMICONDUCTOR COMPONENT ON A HEAT PIPE - The invention relates to a method for joining a power semiconductor component ( | 2022-07-14 |
20220225550 | ELECTROMAGNETIC INTERFERENCE SHIELDING COMPOSITE AND ELECTRONIC DEVICE INCLUDING THE SAME - Disclosed are an electromagnetic interference shielding composite that selectively absorbs and shields an electromagnetic wave, and an electronic device using the same. The electromagnetic interference shielding composite includes a first composite layer, wherein the first composite layer includes: a matrix; and reflective particles and absorbent particles dispersed in the matrix, wherein the reflective particles reflect an electromagnetic wave, wherein the absorbent particles absorb the electromagnetic wave and convert the absorbed electromagnetic wave to heat energy and emit the heat energy. | 2022-07-14 |
20220225551 | ELECTROMAGNETIC WAVES ABSORBING MATERIAL - The present invention relates to an electromagnetic millimetre wave absorber material, preferably having a volume resistivity of more than 1 Ω cm, containing solid particles having an aspect ratio (length:diameter) of at least 5 of a first electrically conductive material, particles having an aspect ratio (length:diameter) of less than 5 of a second electrically conductive material and an electrically non-conductive polymer, wherein the absorber material is capable of absorbing electromagnetic waves in a frequency region of 60 GHz or more. The invention also relates to its use and method for absorbing as well as a sensor apparatus comprising said absorber material. | 2022-07-14 |
20220225552 | Buddleja Plant Named 'BotEx 001' - A new cultivar of | 2022-07-14 |
20220225553 | Buddleja plant named 'BotEx 002' - A new cultivar of | 2022-07-14 |
20220225554 | SALVIA PLANT NAMED 'TL966' - A new and distinct cultivar of | 2022-07-14 |