28th week of 2019 patent applcation highlights part 57 |
Patent application number | Title | Published |
20190214308 | FIN REVEAL FORMING STI REGIONS HAVING CONVEX SHAPE BETWEEN FINS | 2019-07-11 |
20190214309 | MONOLITHIC CO-INTEGRATION OF MOSFET AND JFET FOR NEUROMORPHIC/COGNITIVE CIRCUIT APPLICATIONS | 2019-07-11 |
20190214310 | STABLE MIXED OXIDE CATALYSTS FOR DIRECT CONVERSION OF ETHANOL TO ISOBUTENE AND PROCESS FOR MAKING | 2019-07-11 |
20190214311 | LOW UNDERCUT N-P WORK FUNCTION METAL PATTERNING IN NANOSHEET REPLACEMENT METAL GATE PROCESS | 2019-07-11 |
20190214312 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | 2019-07-11 |
20190214313 | LOCAL WIRING IN BETWEEN STACKED DEVICES | 2019-07-11 |
20190214314 | Source and Drain Isolation for CMOS Nanosheet with One Block Mask | 2019-07-11 |
20190214315 | GATE-LAST SEMICONDUCTOR FABRICATION WITH NEGATIVE-TONE RESOLUTION ENHANCEMENT | 2019-07-11 |
20190214316 | METHOD OF INSPECTING SURFACE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214317 | Semiconductor Device and Method | 2019-07-11 |
20190214318 | METHOD AND APPARATUS TO MONITOR A PROCESS APPARATUS | 2019-07-11 |
20190214320 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF | 2019-07-11 |
20190214321 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, PREPREG | 2019-07-11 |
20190214322 | POWER MODULE AND METHOD OF MANUFACTURING THE SAME | 2019-07-11 |
20190214323 | FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES | 2019-07-11 |
20190214324 | CHIP PACKAGING STRUCTURE, AND PACKAGING METHOD THEREOF | 2019-07-11 |
20190214325 | Circuit Package | 2019-07-11 |
20190214326 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-07-11 |
20190214327 | THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES | 2019-07-11 |
20190214328 | STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT | 2019-07-11 |
20190214329 | LIQUID HEAT DISSIPATION SYSTEM | 2019-07-11 |
20190214330 | HIGH POWER TRANSISTORS | 2019-07-11 |
20190214331 | Semiconductor Device with Flexible Circuit for Enabling Non-destructive Attaching and Detaching of Device to System Board | 2019-07-11 |
20190214332 | SERIALLY-CONNECTED TRANSISTOR DEVICE | 2019-07-11 |
20190214333 | SERIALLY-CONNECTED TRANSISTOR DEVICE | 2019-07-11 |
20190214334 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-07-11 |
20190214335 | INTRA-PACKAGE INTERFERENCE ISOLATION | 2019-07-11 |
20190214336 | MULTIPLE-LAYER, SELF-EQUALIZING INTERCONNECTS IN PACKAGE SUBSTRATES | 2019-07-11 |
20190214337 | LOW LOSS SUBSTRATE FOR HIGH DATA RATE APPLICATIONS | 2019-07-11 |
20190214338 | SEMICONDUCTOR PACKAGE HAVING INTEGRATED STIFFENER REGION | 2019-07-11 |
20190214339 | REDUCTION OF STRESS IN VIA STRUCTURE | 2019-07-11 |
20190214340 | POWER MODULE | 2019-07-11 |
20190214341 | INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTURING METHOD | 2019-07-11 |
20190214342 | VIAS AND GAPS IN SEMICONDUCTOR INTERCONNECTS | 2019-07-11 |
20190214343 | REPLACEMENT METAL GATE PROCESSES FOR VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR | 2019-07-11 |
20190214344 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HYDROGEN DIFFUSION BARRIER STRUCTURES FOR CMOS UNDER ARRAY ARCHITECTURE AND METHOD OF MAKING THE SAME | 2019-07-11 |
20190214345 | SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE PATTERNS AND METHOD OF FABRICATING THE SAME | 2019-07-11 |
20190214346 | SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214347 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2019-07-11 |
20190214348 | IC WAFER FOR IDENTIFICATION OF CIRCUIT DIES AFTER DICING | 2019-07-11 |
20190214349 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | 2019-07-11 |
20190214350 | ACTIVATABLE ELECTRONIC COMPONENT DESTRUCTION DEVICE | 2019-07-11 |
20190214351 | FRAGMENTING COMPUTER CHIPS | 2019-07-11 |
20190214352 | ELECTRONIC PACKAGE | 2019-07-11 |
20190214353 | VERTICAL CAPACITORS FOR MICROELECTRONICS | 2019-07-11 |
20190214354 | FRONT END SYSTEMS WITH LINEARIZED LOW NOISE AMPLIFIER AND INJECTION-LOCKED OSCILLATOR POWER AMPLIFIER STAGE | 2019-07-11 |
20190214355 | SWITCH IC, FRONT-END MODULE, AND COMMUNICATION APPARATUS | 2019-07-11 |
20190214356 | Package with Solder Regions Aligned to Recesses | 2019-07-11 |
20190214357 | SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-07-11 |
20190214358 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214359 | SEMICONDUCTOR PACKAGES | 2019-07-11 |
20190214360 | SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214361 | SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214362 | LASER BONDING APPARATUS, METHOD OF BONDING SEMICONDUCTOR DEVICES, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2019-07-11 |
20190214363 | SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CLAMPING SYSTEMS | 2019-07-11 |
20190214364 | A METHOD OF ALIGNING SEMICONDUCTOR CHIPS, METHOD OF ARRANGING SEMICONDUCTOR CHIPS, DEVICE THAT PRODUCES A SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR COMPONENT | 2019-07-11 |
20190214365 | HBM SILICON PHOTONIC TSV ARCHITECTURE FOR LOOKUP COMPUTING AI ACCELERATOR | 2019-07-11 |
20190214366 | STACKED PACKAGE INCLUDING EXTERIOR CONDUCTIVE ELEMENT AND A MANUFACTURING METHOD OF THE SAME | 2019-07-11 |
20190214367 | STACKED PACKAGE AND A MANUFACTURING METHOD OF THE SAME | 2019-07-11 |
20190214368 | MAGNETIC COUPLING PACKAGE STRUCTURE FOR MAGNETICALLY COUPLED ISOLATOR WITH DUO LEADFRAMES AND METHOD FOR MANUFACTURING THE SAME | 2019-07-11 |
20190214369 | SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING REDUCED HEIGHT SEMICONDUCTOR PACKAGES FOR MOBILE ELECTRONICS | 2019-07-11 |
20190214370 | STAIR-STACKED DICE DEVICE IN A SYSTEM IN PACKAGE, AND METHODS OF MAKING SAME | 2019-07-11 |
20190214371 | INPUT OUTPUT FOR AN INTEGRATED CIRCUIT | 2019-07-11 |
20190214372 | METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A SHIELDING LAYER | 2019-07-11 |
20190214373 | LIGHT EMITTING DEVICE WITH LED STACK FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME | 2019-07-11 |
20190214374 | LIGHT EMITTING COMPONENT WITH PROTECTIVE REFLECTING LAYER | 2019-07-11 |
20190214375 | Optoelectronic Semiconductor Component | 2019-07-11 |
20190214376 | DISPLAY DEVICE | 2019-07-11 |
20190214377 | SEMICONDUCTOR DEVICES, METHODS OF DESIGNING LAYOUTS OF SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES | 2019-07-11 |
20190214378 | CIRCUIT FOR PROVIDING ELECTROSTATIC DISCHARGE PROTECTION ON AN INTEGRATED CIRCUIT AND ASSOCIATED METHOD AND APPARATUS | 2019-07-11 |
20190214379 | SEMICONDUCTOR APPARATUS | 2019-07-11 |
20190214380 | ESD PROTECTION CIRCUIT AND INTEGRATED CIRCUIT FOR BROADBAND CIRCUIT | 2019-07-11 |
20190214381 | ELECTROSTATIC DISCHARGE CLAMP WITH REDUCED OFF-STATE POWER CONSUMPTION | 2019-07-11 |
20190214382 | SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214383 | SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214384 | DIODE CONNECTED VERTICAL TRANSISTOR | 2019-07-11 |
20190214385 | QUANTUM DOT ARRAY DEVICES | 2019-07-11 |
20190214386 | METHOD AND STRUCTURE OF FORMING STRAINED CHANNELS FOR CMOS DEVICE FABRICATION | 2019-07-11 |
20190214387 | METHODS OF FORMING A GATE-TO-SOURCE/DRAIN CONTACT STRUCTURE | 2019-07-11 |
20190214388 | SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214389 | SPACER FOR DUAL EPI CMOS DEVICES | 2019-07-11 |
20190214390 | Array Of Cross Point Memory Cells And Methods Of Forming An Array Of Cross Point Memory Cells | 2019-07-11 |
20190214391 | SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME | 2019-07-11 |
20190214392 | DENSE VERTICAL FIELD EFFECT TRANSISTOR STRUCTURE | 2019-07-11 |
20190214393 | STATIC RANDOM-ACCESS MEMORY AND FABRICATION METHOD THEREOF | 2019-07-11 |
20190214394 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING STRESSOR | 2019-07-11 |
20190214395 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING PARTIALLY SURROUNDING SELECT GATES AND FRINGE FIELD ASSISTED PROGRAMMING THEREOF | 2019-07-11 |
20190214396 | Twin Bit Non-volatile Memory Cells With Floating Gates In Substrate Trenches | 2019-07-11 |
20190214397 | Non-volatile Memory Cells With Floating Gates In Dedicated Trenches | 2019-07-11 |
20190214398 | STACKED FINFET EEPROM | 2019-07-11 |
20190214399 | MEMORY INCLUDING BLOCKING DIELECTRIC IN ETCH STOP TIER | 2019-07-11 |
20190214400 | MEMORY STRUCTURE AND PROGRAMING AND READING METHODS THEREOF | 2019-07-11 |
20190214401 | SINGLE-POLY NONVOLATILE MEMORY UNIT | 2019-07-11 |
20190214402 | THREE-DIMENSIONAL NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF | 2019-07-11 |
20190214403 | SEMICONDUCTOR MEMORY DEVICE | 2019-07-11 |
20190214404 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2019-07-11 |
20190214405 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-07-11 |
20190214406 | SEMICONDUCTOR MEMORY DEVICE | 2019-07-11 |
20190214407 | VERTICAL MEMORY DEVICE | 2019-07-11 |
20190214408 | SEMICONDUCTOR DEVICE, OPERATION METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2019-07-11 |