28th week of 2020 patent applcation highlights part 56 |
Patent application number | Title | Published |
20200219703 | DOGBONE INLET CONE PROFILE FOR REMOTE PLASMA OXIDATION CHAMBER | 2020-07-09 |
20200219704 | DEPOSITION SYSTEM WITH INTEGRATED COOLING ON A ROTATING DRUM | 2020-07-09 |
20200219705 | REDUCTION OF CONDENSED GASES ON CHAMBER WALLS VIA HEATED CHAMBER HOUSING FOR SEMICONDUCTOR PROCESSING EQUIPMENT | 2020-07-09 |
20200219706 | APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING | 2020-07-09 |
20200219707 | PLASMA PROCESSING SYSTEM | 2020-07-09 |
20200219708 | METAL CONTAMINATION REDUCTION IN SUBSTRATE PROCESSING SYSTEMS WITH TRANSFORMER COUPLED PLASMA | 2020-07-09 |
20200219709 | Method for Quantitative Analysis of Polymer Using Maldi Mass Spectrometry, and Method for Manufacturing Sample for Maldi Mass Spectrometry for Quantitative Analysis of Polymer | 2020-07-09 |
20200219710 | MASS SPECTROMETER AND MASS SPECTROMETRY METHOD | 2020-07-09 |
20200219711 | ION FOCUSING | 2020-07-09 |
20200219712 | SAMPLE SUPPORT BODY | 2020-07-09 |
20200219713 | LASER DESORPTION/IONIZATION METHOD AND MASS SPECTROMETRY METHOD | 2020-07-09 |
20200219714 | TIME-OF-FLIGHT MASS SPECTROMETER | 2020-07-09 |
20200219715 | SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER THEREOF | 2020-07-09 |
20200219716 | Method of Forming Nitride Film and Apparatus for Forming Nitride Film | 2020-07-09 |
20200219717 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | 2020-07-09 |
20200219718 | SELECTIVE DEPOSITION OF SILICON OXIDE | 2020-07-09 |
20200219719 | HEALING METHOD BEFORE TRANSFER OF A SEMICONDUCTING LAYER | 2020-07-09 |
20200219720 | APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH ASPECT RATIO NANOSTRUCTURES | 2020-07-09 |
20200219721 | METHOD (AND RELATED APPARATUS) THAT REDUCES CYCLE TIME FOR FORMING LARGE FIELD INTEGRATED CIRCUITS | 2020-07-09 |
20200219722 | SUBNANOMETER-LEVEL LIGHT-BASED SUBSTRATE CLEANING MECHANISM | 2020-07-09 |
20200219723 | SILICON CARBIDE SEMICONDUCTOR SUBSTRATE | 2020-07-09 |
20200219724 | LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-07-09 |
20200219725 | TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING | 2020-07-09 |
20200219726 | DEVICE AND METHOD FOR BONDING OF SUBSTRATES | 2020-07-09 |
20200219727 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2020-07-09 |
20200219728 | DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING METHOD | 2020-07-09 |
20200219729 | Reactive Ion Etching Apparatus | 2020-07-09 |
20200219730 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2020-07-09 |
20200219731 | DISPLAY APPARATUS, INTERLAYER FILM FOR LAMINATED GLASS, AND LAMINATED GLASS | 2020-07-09 |
20200219732 | METHOD OF FORMING A PATTERN AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME | 2020-07-09 |
20200219733 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2020-07-09 |
20200219734 | METHOD OF PRODUCING ELECTRONIC DEVICE | 2020-07-09 |
20200219735 | SWITCH-MODE CONVERTER MODULE | 2020-07-09 |
20200219736 | SUBSTRATE PROCESSING APPARATUS | 2020-07-09 |
20200219737 | SEMICONDUCTOR PROCESSING CHAMBER | 2020-07-09 |
20200219738 | SPLIT CHAMBER ASSEMBLY | 2020-07-09 |
20200219739 | SUBSTRATE TEMPERATURE MEASUREMENT DEVICE AND AN APPARATUS HAVING SUBSTRATE TEMPERATURE MEASUREMENT DEVICE | 2020-07-09 |
20200219740 | PLASMA PROCESSING APPARATUS AND HEATER TEMPERATURE CONTROL METHOD | 2020-07-09 |
20200219741 | WAFER CASSETTE PACKING APPARATUS | 2020-07-09 |
20200219742 | SUBSTRATE TRANSFER DEVICE | 2020-07-09 |
20200219743 | WAFER TRANSFER BOX AND WAFER AUTOMATIC TRANSFER SYSTEM | 2020-07-09 |
20200219744 | SEMICONDUCTOR MANUFACTURING DEVICE | 2020-07-09 |
20200219745 | SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM | 2020-07-09 |
20200219746 | ALIGNMENT SYSTEM | 2020-07-09 |
20200219747 | ELECTROSTATIC CHUCK | 2020-07-09 |
20200219748 | CHUCK ASSEMBLY AND METHOD OF SECURING ELECTROSTATIC CHUCK | 2020-07-09 |
20200219749 | ELECTROSTATIC CHUCK AND PLASMA PROCESSING DEVICE HAVING THE SAME | 2020-07-09 |
20200219750 | SUPPORT, ADHESIVE SHEET, LAMINATED STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 2020-07-09 |
20200219751 | WORKPIECE HOLDING METHOD AND WORKPIECE PROCESSING METHOD | 2020-07-09 |
20200219752 | Material Handling Robot | 2020-07-09 |
20200219753 | PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF | 2020-07-09 |
20200219754 | Systems and Methods for Controlling Substrate Approach Toward a Target Horizontal Plane | 2020-07-09 |
20200219755 | WAFER MOUNTING TABLE AND METHOD OF MANUFACTURING THE SAME | 2020-07-09 |
20200219756 | Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording Medium | 2020-07-09 |
20200219757 | INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL AND PRECURSOR GAS TO A DOWNSTREAM CHAMBER TO ENABLE REMOTE PLASMA FILM DEPOSITION | 2020-07-09 |
20200219758 | METHOD TO CREATE AIR GAPS | 2020-07-09 |
20200219759 | BACK END OF LINE INTEGRATION FOR INTERCONNECTS | 2020-07-09 |
20200219760 | CAVITY STRUCTURES UNDER SHALLOW TRENCH ISOLATION REGIONS | 2020-07-09 |
20200219761 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | 2020-07-09 |
20200219762 | Method For Layer Transfer With Localised Reduction Of A Capacity To Initiate A Fracture | 2020-07-09 |
20200219763 | CHAMFERLESS INTERCONNECT VIAS OF SEMICONDUCTOR DEVICES | 2020-07-09 |
20200219764 | ETCH STOP LAYER FOR SEMICONDUCTOR STRUCTURE | 2020-07-09 |
20200219765 | INTERCONNECT STRUCTURES CONTAINING PATTERNABLE LOW-K DIELECTRICS AND ANTI-REFLECTIVE COATINGS AND METHOD OF FABRICATING THE SAME | 2020-07-09 |
20200219766 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2020-07-09 |
20200219767 | DOUBLE PLUG METHOD FOR TONE INVERSION PATTERNING | 2020-07-09 |
20200219768 | Method Of Forming Self-Aligned Via | 2020-07-09 |
20200219769 | PLASMA DIE SINGULATION SYSTEMS AND RELATED METHODS | 2020-07-09 |
20200219770 | Organic Light Emitting Diode Display Device and Method of Fabricating the Same | 2020-07-09 |
20200219771 | 3D Chip Sharing Power Interconnect Layer | 2020-07-09 |
20200219772 | MASKLESS PROCESS FOR FABRICATING GATE STRUCTURES AND SCHOTTKY DIODES | 2020-07-09 |
20200219773 | FIN-TYPE FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2020-07-09 |
20200219774 | SUBSTRATE DEFECT BLOCKING LAYERS FOR STRAINED CHANNEL SEMICONDUCTOR DEVICES | 2020-07-09 |
20200219775 | INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED WORKFUNCTION LAYERS | 2020-07-09 |
20200219776 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-07-09 |
20200219777 | GATE-LAST PROCESS FOR VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR | 2020-07-09 |
20200219778 | METHODS AND APPARATUS FOR TEST PATTERN FORMING AND FILM PROPERTY MEASUREMENT | 2020-07-09 |
20200219779 | PIXEL STRUCTURE AND REPAIRING METHOD THEREOF | 2020-07-09 |
20200219780 | FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF | 2020-07-09 |
20200219781 | COMPOSITE COMPOSITIONS FOR ELECTRONICS APPLICATIONS | 2020-07-09 |
20200219782 | POWER MODULE AND METHOD FOR FABRICATING THE SAME, AND POWER CONVERSION DEVICE | 2020-07-09 |
20200219783 | SEMICONDUCTOR PACKAGE | 2020-07-09 |
20200219784 | SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME | 2020-07-09 |
20200219785 | Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources | 2020-07-09 |
20200219786 | Package Structure and Method and Equipment for Forming the Same | 2020-07-09 |
20200219787 | System and Method to Enhance Solder Joint Reliability | 2020-07-09 |
20200219788 | SEMICONDUCTOR STRUCTURE AND ASSOCIATED METHOD FOR MANUFACTURING THE SAME | 2020-07-09 |
20200219789 | THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USING PHASE CHANGE MATERIALS | 2020-07-09 |
20200219790 | PHASE CHANGE MATERIALS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING AND HEAT DISSIPATION IN INTEGRATED CIRCUIT ASSEMBLIES | 2020-07-09 |
20200219791 | SEMICONDUCTOR DEVICE | 2020-07-09 |
20200219792 | METHODS OF FORMING POWER ELECTRONIC ASSEMBLIES USING METAL INVERSE OPALS AND CAP STRUCTURES | 2020-07-09 |
20200219793 | MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND ASSOCIATED METHODS | 2020-07-09 |
20200219794 | MULTI-LAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTI-LAYER SUBSTRATE | 2020-07-09 |
20200219795 | Integrated Assemblies Comprising Redundant Wiring Routes, and Integrated Circuit Decks Having Openings Extending Therethrough | 2020-07-09 |
20200219796 | MULTILAYER HYBRID BATTERY SEPARATORS FOR LITHIUM ION SECONDARY BATTERIES AND METHODS OF MAKING SAME | 2020-07-09 |
20200219797 | ELECTRONIC DEVICE, CONNECTION BODY, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE | 2020-07-09 |
20200219798 | Multi-Layer Die Attachment | 2020-07-09 |
20200219799 | SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES | 2020-07-09 |
20200219800 | MOLDED INTEGRATED CIRCUIT PACKAGES | 2020-07-09 |
20200219801 | Quad Flat No-Lead Package with Wettable Flanges | 2020-07-09 |
20200219802 | FINE PITCH COPPER PILLAR PACKAGE AND METHOD | 2020-07-09 |