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27th week of 2013 patent applcation highlights part 29
Patent application numberTitlePublished
20130170082INTEGRATED CIRCUIT HAVING A CHARGED-DEVICE MODEL ELECTROSTATIC DISCHARGE PROTECTION MECHANISM - An integrated circuit having charged-device model (CDM) electrostatic discharge (ESD) protection includes an I/O circuit, at least one CDM ESD protection device, and at least one internal circuit. The integrated circuit further includes at least one TSV (Through Silicon Via) each being coupled between a ground of at least one ground of the input/output circuit and one of the at least one ESD protection device, wherein each of the at least one ESD protection device is coupled between one of the at least one TSV and a ground of one of the at least one internal circuit.2013-07-04
20130170083POWER-ON RESET GFCI - A circuit interrupting device, such as a GFCI receptacle device, is provided that automatically resets itself when power is initially applied to the device, for example, when the device is first installed or when power is reapplied after a power outage occurs. When power is applied correctly to the line side of the device, as opposed to the load side, a voltage is generated that turns on a switching device. Turning on the switching device allows a low level of electric current to flow which, in turn, allows a higher level electric current to flow which closes the latching mechanism of the device and places the device in the reset condition.2013-07-04
20130170084METHOD AND DEVICE FOR SAFELY SWITCHING A PHOTOVOLTAIC SYSTEM AFTER DIFFERENTIATING THE ARC TYPE - A method and a device for safely switching a direct-voltage system, in particular a photovoltaic system, in the event of an arc occurring on a direct-current side. Wherein the generated direct current and the produced direct voltage are set with regard to power guidance. In the event of a sensor-detected arc, the power guidance is adjusted and a power change of the arc is detected. In the event of a power drop of the arc, a serial or parallel arc is detected according to the adjustment direction of the power guidance. In the event of a serial arc a direct-current interruption is produced, and in the event of a parallel arc a short-circuit current is produced.2013-07-04
20130170085POWER SUPPLY APPARATUS INCLUDING OVERVOLTAGE PROTECTION FUNCTION - There is provided a power supply apparatus including an overvoltage protection function, the power supply apparatus including: a power supply unit supplying a predetermined input power supply; a rectification unit generating a first power supply by rectifying the input power supply; a main circuit unit generating a second power supply from the first power supply; and an overvoltage blocking unit blocking overvoltages and overcurrents, wherein the overvoltage blocking unit includes varistors connected between at least one of a live line and a neutral line of the input power supply and a ground.2013-07-04
20130170086OVERVOLTAGE PROTECTION CIRCUIT AND PORTABLE ELECTRONIC DEVICE COMPRISING SAME - An overvoltage protection circuit is configured to protect a battery pack from overvoltage when the battery pack is in charge. The overvoltage protection circuit includes a power supply, an overvoltage protection chip, a controller and switching circuit. The power supply is configured to charge the battery pack. The overvoltage protection chip is electronically connected between the power supply and the battery pack, the overvoltage protection chip comprising a voltage detection pin. The controller is electronically connected to the battery pack and configured to detect whether the battery pack is a high voltage type battery pack or a normal voltage type battery, and outputting corresponding control signals according to the detection. The switching circuit comprises a switch and two voltage dividing circuits, the switch connecting a corresponding voltage dividing circuit to the positive pole of the battery pack and the voltage detection pin under control of the control signal.2013-07-04
20130170087PROTECTION CIRCUIT FOR MEMORY CONTROL CHIP - A protection circuit for a memory control chip of a computer includes a controller, a switch circuit, a memory control chip, and a delay circuit. The controller outputs a high level control signal when the computer is in a first state, and outputs a low level control signal when the computer is in a second state. The switch circuit connects or disconnects the connection between a power pin of the memory control chip and a power terminal, according to the control signal. The delay circuit imposes a predetermined time delay for receiving a high level control signal, and outputs an enable signal to an enable pin of the memory control chip to make the memory control chip operate again, after a predetermined delay.2013-07-04
20130170088Electromechanical Excess Temperature Protection Element - The invention is an excess temperature protection element for photovoltaic installations. The element has a cylindrical housing closed off with two cover plates, encasing therein a plug-and-socket connection that is certified for photovoltaic installations. The plug connector is connected to the interior face of one cover plate and the socket connector to the interior face of the second cover plate, so that the two connectors are in electrical contact with each other when the housing is closed. A pressure element between the two cover plates biases the plates away from the housing. One of the plates is a releasable plate secured to the housing by a hot-melt material. When the temperature of the PV installation rises above a threshold value, the hot-melt material softens, allowing the pressure element to push the releasable cover plate away from the housing, thereby disconnecting the plug-in connection in the housing.2013-07-04
20130170089MAGNETIC SYSTEM FOR PARTICLE ATTRACTION IN A PLURALITY OF CHAMGERS - The invention relates to a magnetic sample-processing device, particularly a sensor device (2013-07-04
20130170090METHOD AND APPARATUS FOR ENHANCING FLAME RADIATION - An apparatus for enhancing flame radiation includes a flame charging system and an electrically isolated electrode. A time-varying voltage is applied to the flame charging system and the flame charging system imparts a corresponding time-varying charge or time-varying voltage onto the flame. The flame responds to the time-varying charge or voltage by increasing its luminosity.2013-07-04
20130170091VARIABLE CAPACITANCE ELECTRONIC DEVICE AND MICROELECTROMECHANICAL DEVICE INCORPORATING SUCH ELECTRONIC DEVICE - An electronic device includes a capacitive component with variable capacitance coupled to a control stage that controls the capacitance, based on a reference signal, with a reference frequency, and an excitation signal, that is a multiple of the reference frequency. The capacitive component includes a variable capacitive network having a plurality of switched capacitors, each being switchable between a first configuration, where it is connected between connection terminals of the capacitive component, and a second configuration, where it is connected at most to one of the connection terminals. The control stage includes a logic module, coupled to the variable capacitive network for switching periodically each capacitor between the first configuration and the second configuration. A sign circuit, coupled to the capacitive component supplies a control signal having edges concordant with the excitation signal in one half-period of each cycle of the reference signal and discordant edges in the other half-period.2013-07-04
20130170092VARIABLE CAPACITANCE DEVICE - A variable capacitance device includes a substrate, a beam portion, lower drive electrodes and upper drive electrodes. The beam portion is made of an insulating material and is connected to the substrate via an anchor portion. In the lower drive electrode and the upper drive electrode, electrostatic attraction generated by the application of a DC voltage continuously changes. In the lower drive electrodes and the upper drive electrode, electrostatic capacitance generated by the application of an RF signal between the electrodes on both sides continuously changes in accordance with the deformation of the beam portion due to the electrostatic attraction. The beam portion includes an inner circumferential portion including the upper drive electrode, an outer circumferential portion including the upper drive electrode, and ladder portions sandwiched by the inner circumferential portion and the outer circumferential portion. The beam portion has a cross-sectional area that is reduced by the ladder portions.2013-07-04
20130170093CAPACITANCE ELECTRODE STRUCTURE FOR MEASURING MOISTURE2013-07-04
20130170094MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L2013-07-04
20130170095MULTI LAYER CERAMIC CAPACITOR - Provided is a multilayer ceramic capacitor including a multilayer ceramic plastic body formed so that a plurality of internal electrode layers intersects; and a plurality of external electrodes, each formed to cover one side or another side of the multilayer ceramic plastic body and connected to the plurality of internal electrode layers. Each of the plurality of external electrodes includes a plurality of conductive layers that is sequentially formed to cover one side or another side of the multilayer ceramic plastic body, and one of the plurality of conductive layers is formed of conductive resin hardened through an irradiation cross-linking method using gamma ray.2013-07-04
20130170096BIAXIALLY ORIENTED POLYPROPYLENE FILM, METALLIZED FILM, AND FILM CAPACITOR - A biaxially oriented polypropylene film has projections on both surfaces of the film, wherein the height of the most common projection (PhZ) among the projections on each surface is not less than 100 nm and less than 400 nm on both surfaces, and the number of projections per 0.1 mm2013-07-04
20130170097YTTRIA-STABILIZED ZIRCONIA BASED CAPACITOR - Devices and methods for storing energy at a high density are described. In some embodiments, the devices include a first electrode and a second electrode containing a transition metal oxide. A solid electrolyte having yttria-stabilized zirconia (YSZ) is located between the first and second electrode. The thickness of the electrolyte located between the two electrodes is less than one micrometer.2013-07-04
20130170098ASYMMETRIC HYBRID SUPERCAPACITORS BASED ON NANOTUBE NANOWIRE COMPOSITES - An asymmetric supercapacitor includes a first structure and a second structure spaced apart from said second structure. One of the structures comprises an anode, and the other of the first and second structures comprises a cathode, wherein the first structure comprises an activated carbon electrode, and the second structure comprises a nanocomposite electrode. The nanocomposite electrode comprises a first network of nanowires that are interpenetrating with a second network of carbon nanotubes.2013-07-04
20130170099ELECTRODE OF ENERGY STORAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an electrode of an energy storage and a method for manufacturing the same. The electrode includes: a current collector; a first electrode layer provided on one surface or both surfaces of the current collector; and a second electrode layer bonded to an outer surface of the first electrode layer, wherein in each of the first and second electrode layers, content ratios of an active material, a conductive material, and a binder, and materials thereof are different. Therefore, reliability of the energy storage may be increased and resistance thereof may be decreased.2013-07-04
20130170100ELECTRODE, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR INCLUDING THE SAME - Disclosed herein are an electrode including a plurality of electrode active material layers formed above an electrode current collector, each of the electrode active material layers including different structures of binders; a method for manufacturing the same; and an electrochemical capacitor. 2013-07-04
20130170101ELECTROCHEMICAL CAPACITOR - Disclosed herein is a super capacitor electrical storage device, including a cathode and an anode respectively including electrode active materials having different average particle sizes, or a cathode and an anode respectively including electrode active materials having different pore structures in an active material.2013-07-04
20130170102ELECTROLYTIC MATERIAL FORMULATION, ELECTROLYTIC MATERIAL POLYMER FORMED THEREFROM AND USE THEREOF - An electrolytic material formulation and a polymer polymerized therefrom are provided. The formulation includes: 2013-07-04
20130170103ELECTROLYTE MATERIAL FORMULATION, ELECTROLYTE MATERIAL COMPOSITION FORMED THEREFROM AND USE THEREOF - The present invention provides an electrolyte material formulation comprising: 2013-07-04
20130170104GAS INSULATED SWITCHGEAR WITH WITHDRAWABLE CIRCUIT BREAKER UNIT - A GIS (Gas Insulated Switchgear) includes a main bus compartment including a main bus-bar unit, a transfer bus compartment including a transfer bus-bar unit, a sealed circuit breaker compartment including a circuit breaker unit and a load side compartment including a current transforming unit and a transfer bus conductor electrically coupling the transfer bus-bar unit and the current transformer unit. The circuit breaker unit is contained in the sealed circuit breaker compartment being separately independent from other compartments. The transfer bus conductor passes from the transfer bus-bar unit through the load side compartment to the current transformer unit without passing through the circuit breaker compartment. The sealed circuit breaker compartment and the load side compartment do not share insulating gas.2013-07-04
20130170105LOAD MONITORING NODES AND APPARATUSES - Load monitoring nodes and apparatuses are disclosed. According to an aspect, apparatus for load monitoring at a power measurement input may include a load monitoring node configured to capture load data at a power measurement input of an electrical outlet. The node may communicate the captured load data to a network communications device. The apparatus may also include a frame configured to hold the load monitoring node. Further, the apparatus may include an attachment mechanism configured to attach the frame to the electrical outlet.2013-07-04
20130170106CELLULAR TELEPHONE SEPARATION APPARATUS - An apparatus for maintaining a physical separation between a cell phone and its user.2013-07-04
20130170107Enclosure for Preventing Tampering of Mobile Communication Equipment in Transportation Industry - An enclosure configured to enclose, and prevent the tampering of, mobile communication equipment for transportation industry vehicles, and which enclosure is accessible by authorized personnel. In one preferred embodiment, the enclosure is a case configured to receive mobile communication equipment when selectively opened, and which when closed prevents the tampering with the mobile communication equipment. Openings are provided in the case such that cables and harnesses can extend from the equipment to external connectors, yet which cables cannot be accessed or tampered with while the case is closed during operation of the vehicle. The openings have restricted spacing allowing the cabling to extend there through, yet which have smaller dimensions than the equipment connectors such that the connectors cannot be disengaged or accessed by unintended personnel.2013-07-04
20130170108HINGE AND ELECTRONIC DEVICE WITH THE HINGE - A hinge comprises a twin-shaft body, a first shaft, a first connecting part, a second shaft, and a second connecting part: the twin-shaft body is designed to have mounting holes on its both sides for the holes securely inserted into the first shaft and the second shaft which are coupled with the first connecting part and the second connecting part separately for the connecting parts turning around the shafts and turning angles restricted by two pairs of retainers and stoppers, each of which is designed on one shaft and one connecting part, respectively; the first connecting part is effective in enabling rotation of an electronic device's first device body which turns to a specific angle and drive the twin-shaft body to turn around the second shaft for the electronic device's first device body over the second device body.2013-07-04
20130170109Mesh Structure Providing Enhanced Acoustic Coupling - A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). According to one aspect, mesh structures, such as mesh barriers, are formed to facilitate improved acoustic sealing in a space efficient manner. In one embodiment, a mesh barrier for an audio port can be reliably acoustically sealed (or coupled) with an audio chamber and/or outer device housing in a space efficient manner. A mesh barrier can serve to block undesired foreign substances from entry or further entry into an audio port and/or serve as a cosmetic barrier which obscures vision into an audio port. In one embodiment, a portion of a mesh structure can be provided with a substantially planar surface that facilitates improved acoustic sealing.2013-07-04
20130170110PROP STAND AND PROTECTIVE CASE STRUCTURE FOR ELECTRONIC PRODUCT - A prop stand includes a guide seat mounted to a rear side of an electronic device or a protective case thereof, a revolving seat rotatably assembled to the guide seat, and a propping unit movably connected to the revolving seat via a plurality of links pivotally connected to between the revolving seat and the propping unit. The links, the revolving seat and the propping unit together form a four-bar or five-bar linkage and a rotatable structure, such that the propping unit is movable by the links between a folded and an extended position and rotatable by the revolving seat to different angular positions relative to the guide seat. Therefore, the prop stand can be easily operated to conveniently prop the electronic product in a horizontally upright position, a vertically upright position or an inclined typing position. An electronic product protective case structure with the above-described prop stand is introduced.2013-07-04
20130170111PANEL - A panel includes a main body, an assisting member, and an arm. The main body defines a receiving groove. The assisting member is located in the receiving groove. The arm protrudes from the assisting member. The assisting member is located between the main body and the arm, and one end of the assisting member from which the arm protruding is considered as a molding surface when demolded.2013-07-04
20130170112ELECTRONIC DEVICE - An electronic device includes a panel, and a first housing, to maintain an aesthetic quality to the electronic device when assembled. The panel has a main body, and a first sidewall extending from the main body. The first housing has a top board, and a second sidewall extending from the top board. The second sidewall has a blocking member. The second sidewall is located outside of the first sidewall, and the blocking member is located inside of the first sidewall to stop the second sidewall moving with respect to the first sidewall.2013-07-04
20130170113BRACKET AND ELECTRONIC DEVICE - A bracket fixing hole that is configured to insert a screw part of a bracket fixing screw that is configured to mount the bracket to a bracket mounting part, a clamp hole that is configured to mount a cable clamp, and at least two notches that are configured to position the bracket to the at least two convex parts of the bracket mounting part are formed to a bracket. The bracket fixing hole and the clamp hole are faced on the opposed sides in such a manner that a first line segment that connects parts of the two notches is disposed between the holes. A second line segment that connects a center of the bracket fixing hole and a center of the clamp hole and the first line segment generally bisect each other at right angles. A gravity center is disposed on the side of the bracket fixing hole to the first line segment.2013-07-04
20130170114COMMUNICATION DEVICE AND EJECTION MECHANISM - An ejection mechanism includes a top cover, a bottom cover having a first sidewall and a second sidewall, and a sliding assembly. The sliding assembly includes a sliding block and an elastic rod. The sliding block defines a containing groove which is divided into an insertion rail and an ejection rail. The sliding block is configured to move back and force between the first and second sidewalls. A first distal end of the elastic rod is fixed in a fixing hole of the first sidewall. When the card is inserted into the ejection mechanism, the second distal end slides along the insertion rail until the second distal end is locked in a joint of the insertion and ejection rails. When the second distal end of the elastic rod disengages from the locked position by an external force, the second distal end slides in the ejection rail.2013-07-04
20130170115DISPLAY DEVICE - A display device including a display panel having an active area to display an image, and an inactive area provided with a pattern disposed thereto to apply an electrical signal to the active area, a side cover having a peripheral frame disposed at an outer portion of the display panel to form a side portion exterior of the display device, and a support frame extended from the peripheral frame to be disposed at a rear of the display panel and supporting the display panel, and a black matrix disposed at a front of the inactive area to hide a pattern of the inactive area.2013-07-04
20130170116DISPLAY DEVICE - A display device including a display panel, a rear cover, disposed at a rear of the display panel, which forms a rear exterior of the display panel, and a reinforcing member disposed between the display panel and the rear cover, such that the strength of the display device is increased, wherein the reinforcing member includes a body unit having a shape of the display panel and forms an external appearance of the reinforcing member, and a plurality of cells that penetrate the body unit.2013-07-04
20130170117HOUSING FOR PORTABLE ELECTRONIC APPARATUS, PORTABLE ELECTRONIC APPARATUS, AND METHOD FOR ASSEMBLING PORTABLE ELECTRONIC APPARATUS - A mobile phone includes a housing (2013-07-04
20130170118ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes a chassis and a cover. The chassis defines two through holes and a receiving space configured to receive a power supply. The cover includes two latching portions. Each of the two latching portions is engaged in each of the through holes to engage the cover with the chassis, and the cover is configured to cover the receiving space when no power supply is received in the receiving space.2013-07-04
20130170119ELECTRONIC APPARATUS - An electronic apparatus includes a first casing, a second casing, a hinge structure and an elastic structure. The hinge structure is pivotally connected with the first casing and the second casing to open or close the first casing in relative to the second casing. Two ends of the elastic structure are connected with the first casing and the second casing respectively, and disposed adjacent to the hinge structure. The elastic structure supports the first casing when the first casing is opened in relative to the second casing. Otherwise, the elastic structure cushions the first casing when the first casing is closed in relative to the second casing.2013-07-04
20130170120Apparatus - An apparatus including a main section including a display configured to be located on a first face of the main section; at least one movable section coupled to the main section, the at least one movable section including at least one acoustic transducer port located on a first face of the movable section, wherein in a first mode of operation the first face of the at least one movable section is configured to form an extension of the first face of the apparatus and locate the acoustic transducer port on the same face as the display.2013-07-04
20130170121IMAGE FORMING APPARATUS CONNECTABLE TO MULTIPLE HOSTS AND METHOD OF CONTROLLING IMAGE FORMING JOBS OF THE IMAGE FORMING APPARATUS - An image forming apparatus connectable to multiple hosts includes a plurality of USB interfaces to connect with the respective multiple hosts to receive job request data for image forming jobs requested by the multiple hosts; a driver module to process the job request data received via the respective multiple USB interfaces; a USB data manager to generate job data that corresponds to each of types of the requested image forming jobs by using the processed job request data; and a main controller to control the image forming apparatus to perform the image forming jobs based on the generated job data.2013-07-04
20130170122ELECTRONIC APPARATUS AND HINGE STRUCTURE THEREOF - An electronic apparatus includes a first casing, a second casing and a hinge structure. The hinge structure is pivotally connected to the first and second casings, and has a base, a rotating base, a first connecting element and a second connecting element. The base is disposed on the first casing. The rotating base is disposed on the second casing. Two ends of the first connecting element are pivotally connected to the base and the rotating base, respectively, and two ends of the second connecting element are also pivotally connected to the base and the rotating base, respectively. The rotating base rotates with respect to the base between a first position and a second position through the first and second connecting elements. When the first connecting element contacts the second connecting element, the rotating base is located at the second position.2013-07-04
20130170123REINFORCING STRUCTURE FOR SLIM KEYBOARDS - A reinforcing structure for a slim keyboard includes a baseboard with a plurality of coupling portions, a top board including at least one opening and connecting to the baseboard, and at least one keyboard portion coupling with one coupling portion and movable within the opening of the top board and against the a circuit board to form a depressing movement and generate a key command signal. The baseboard has a reinforcing portion extended vertically upwards from one end thereof via a first bending line, and the reinforcing portion has a connecting portion extended horizontally outwards from one end thereof via a second bending line. The connecting portion and top board have respectively at least one fastening hole and fastening portion that are run through by a fastening element for fastening. The reinforcing structure thus formed improves stroke feedback feeling, makes the keyboard lighter, and reduces assembly process and cost.2013-07-04
20130170124FOLDABLE ELECTRONIC DEVICE - A foldable electronic device includes a first body, a second body and a hinge body. The hinge body is pivoted to the first body around a first pivoting axis and pivoted to the second body around a second pivoting axis so that the first body is able to rotate relatively to the second body. When the first body rotates to a first position relatively to the second body, a first front surface of the first body is closed to a second front surface of the second body on a closing plane, and a pivoting plane where the first pivoting axis and the second pivoting axis are located on and the closing plane are oblique to each other.2013-07-04
20130170125TERMINAL DEVICE - The present invention discloses a terminal device, comprising a first terminal part and a second terminal part, the first terminal part comprising a base part; a keyboard part on the a first region of the base part; a bracket part on a second region of the base part adjacent to the first region, wherein, the thickness of the keyboard part matches the thickness of the bracket part; a first shaft on a side of the base part away from the keyboard part and connected with the bracket part so that the bracket part can rotate clockwise or counterclockwise with respect to the first shaft; a second shaft on a side of the bracket part away from the first shaft and connected with the second terminal part, so that the second terminal part can rotate clockwise or counterclockwise with respect to the second shaft.2013-07-04
20130170126MOBILE APPARATUS - A mobile apparatus includes a first body, a second body, a rotary adaptor including an accommodation portion to accommodate the second body, rotatably installed on the first body, and to move the second body to a position where the second body is stacked on the first body and a position where the second body is unfolded, first magnets disposed on the accommodation portion, and second magnets disposed on the second body so as to face the first magnets and having different polarity from the first magnets.2013-07-04
20130170127MEMORY ASSEMBLY - A computer includes an enclosure, a motherboard, a memory slot, a memory, a heat-dissipating memory, and a grounding element. The enclosure includes a cover. The motherboard is received in the enclosure. The memory slot is mounted on the motherboard. The memory is inserted into the memory slot. The heat-dissipating member partially wraps the memory. The grounding element is mounted on an inner surface of the cover. When the cover covers a base of the enclosure, the grounding element elastically abuts the heat-dissipating member, to electrically connect the heat-dissipating member to the cover and ground.2013-07-04
20130170128MOTHERBOARD - A motherboard includes a processor socket, a platform controller hub (PCH), a power circuit, a switch unit, and a memory slot. The PCH is connected to the memory slot and output a bus signal to a serial advanced technology attachment dual in-line memory module (SATA DIMM) when a SATA DIMM is inserted in the memory slot and when the switch unit is in a first state. When a memory module is in the memory slot the power circuit outputs a voltage to the memory module in response to a second state of the switch unit.2013-07-04
20130170129SYSTEMS AND METHODS FOR PROVIDING A DYNAMIC ELECTRONIC STORAGE UNIT - The present invention relates to a modular electronic storage unit. The unit includes an electronic circuit board riser. An electronic storage card having a storage device is removably coupled to the electronic circuit board riser and is in communication with the electronic circuit board riser. A controller is couple to the electronic circuit board rise that provides support for communicating between the electronic storage card and an external computing device. In one embodiment, two or more electronic storage cards are removably coupled to the electronic circuit board riser and are in a RAID. Further the controller is a RAID controller. In another embodiment, the storage device is a solid state storage device.2013-07-04
20130170130ELECTRONIC APPARATUS AND CARRYING STRUCTURE THEREOF - A carrying structure is used to fix an electronic element on a casing. The carrying structure includes a main body, a blocking part and a hooking part. The main body is fixed on the casing and has an accommodating space for accommodating the electronic element. The blocking part is disposed on one side of the main body and used to block the electronic element from moving vertically. The hooking part is disposed on another side of the main body. When the electronic element is pushed in the accommodating space, one end of the electronic element enters the blocking part and the other end of the electronic element presses the hooking part. Accordingly, the electronic element is accommodated in the accommodating space, and the hooking part hooks the other end of the electronic element.2013-07-04
20130170131DOCKING STATION FOR ELECTRONIC APPARATUS AND CONNECTOR MECHANISM THEREFOR - A docking station for electronic apparatus includes a base, a hinge, a support, and a connector mechanism. The support is pivotally connected to the base through the hinge. The connector mechanism includes an angle transmission mechanism and a connecting module. The angle transmission mechanism is disposed in the base and includes a transmission device and a rotation part. The transmission device connects a pivot of the hinge and the rotation part so that the pivot can drive the rotation part to rotate through the transmission device. The connecting module is fixed on the rotation part and includes a connector exposed out the base through a window of the base. When an electronic apparatus is electrically connected to the connector, the support supports the electronic apparatus. Therefore, a user can adjust the support and the connector simultaneously, which reduces the time for connecting the electronic apparatus onto the docking station.2013-07-04
20130170132Electronic Computer Comprising an Air Channeling System for Cooling Electronic Boards - The electronic computer according to the invention comprises: 2013-07-04
20130170133HEAT DISSIPATING APPARATUS - A heat dissipating apparatus includes a base, a first fin assembly, a second fin assembly, and at least one heat pipe. The base includes a top surface and a bottom surface, the bottom surface makes contact with an electronic heat-generating component. The first fin assembly is disposed on the top surface of the base. The second fin assembly is separate from the first fin assembly. The at least one heat pipe includes a first contacting portion in contact with the base and a second contacting portion in contact with the second fin assembly.2013-07-04
20130170134SERVER SYSTEM WITH FAN SPEED CONTROL AND SERVERS THEREOF - A server system includes a server cabinet, several servers, several fan groups coupled to a rear side of the server cabinet, and several fan control boards each connected to a group of the servers and a corresponding one of the fan groups. Each server includes several electronic components, a detecting module to detect performance characteristics of the electronic components, a comparison module to obtain a rotation speed according to the performance characteristics, and an executing module to convert the rotation speed into a fan speed control signal. Each fan group corresponds to a group of the servers. When the fan control board receives fan speed control signals from the servers, the fan control board converts the fan speed controls into an electrical signal to the fan group, thereby controlling the fan group to rotate at a corresponding speed to satisfy heat dissipation needs of the servers.2013-07-04
20130170135AIRFLOW GUIDE MEMBER AND ELECTRONIC DEVICE HAVING THE SAME - An airflow guide member includes a base, a top plate, and at least one resilient plate. Two rows of stop tabs are formed on a top surface of the base respectively adjacent to front and rear sides of the base. Two rows of stop tabs are formed on a bottom surface of the top plate respectively adjacent to front and rear sides of the top plate. A slot is bounded by every two adjacent stop tabs. Front ends of a top and a bottom of each resilient plate are selectively inserted into two slots respectively at the front sides of the top plate and the base, and rear ends of the top and the bottom of each resilient plate are selectively inserted into two slots respectively at the rear sides of the top plate and the base. The resilient plate can be adjusted to direct air to different directions.2013-07-04
20130170136PCB HEAT SINK FOR POWER ELECTRONICS - A PCB with improved cooling. Openings are provided below electronic components on the PCB of an electronics device. Raised mounts or bosses on the device housing or base extend into the openings and make contact with the electronic components to act as heat sinks. A thermal pad member can be positioned between the bosses and the components to aid in the contact and heat conduction. Other embodiments include direct contact of the raised mounts or bosses with the PCB and through openings are not provided.2013-07-04
20130170137SERVER WITH GUIDING AIR FLOW STRUCTURE - An electronic device includes a chassis, a number of electronic components, and at least one block. The at least one block is fitted between two of the electronic components. At least one air flow passage is defined under the at least one block to direct air flow to enter between the two electronic components.2013-07-04
20130170138ELECTRONIC DEVICE HAVING COOLING UNIT - There is provided an electric device configured to cool a plurality of plug-in units, the electric device including a plurality of slots, each slot configured to install a plug-in unit, a first fan configured to create a current of air for cooling the plug-in units, a first plug-in unit installed into a first slot, and a second plug-in unit including a second fan configured to create a current of air for cooling the first plug-in unit, the second plug-in unit being installed into a second slot adjacent to the first slot, arranged to a side of mounting component of the first plug-in unit.2013-07-04
20130170139SYSTEM AND METHOD FOR SELECTIVELY ENGAGING COOLING FANS WITHIN AN ELECTRONIC DISPLAY - A system and method for cooling an electronic image assembly having a plurality of cooling gas pathways place behind the electronic image assembly. A first fan may be used to force cooling gas through a first grouping of cooling gas pathways while a second fan may be used to force cooling gas through a second grouping of cooling gas pathways. Temperature sensing devices may be positioned so as to measure the temperature of the first and second groupings of cooling gas pathways. The speeds of the first and second fans may be adjusted based on the temperature measurements of the cooling gas pathway groupings. Additional fans with additional temperature sensing devices may be used for further accuracy and control over the temperature gradients of the electronic image assembly. Manifolds may be used to distribute/collect cooling gas to/from the cooling gas pathways.2013-07-04
20130170140System for Cooling an Electronic Display - A system for cooling an electronic display where an isolating structure may be used to allow ambient air to cool power modules. The isolating structure substantially prohibits contaminants which may be present within the ambient air from contacting sensitive electrical components on the power modules or otherwise. A gasket may be used to seal the interface between the power modules and the isolating structure. Heat sinks may be placed in thermal communication with the power supplies and fans may draw air through a narrow channel in which the heat sinks are located. In some embodiments the narrow channel may have the opposing surface of the channel defined by the rear portion of an LED assembly. Exemplary embodiments may use the ambient air to cool both the power modules and a closed loop of isolated gas within the electronic display.2013-07-04
20130170141Method for providing power supply, and a power supply device - A device for a power supply system of a working machine, for supplying electric power to at least one actuator is disclosed. The device includes a frame part with a bottom and a cooling liquid channel system The frame part includes a recess which can be arranged in a flow connection with the cooling liquid channel system). The device may be combined with other devices to form modules for the power supply system of the working machine.2013-07-04
20130170142HEAT EXCHANGE ASSEMBLY FOR USE WITH ELECTRICAL DEVICES AND METHODS OF ASSEMBLING AN ELECTRICAL DEVICE - An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.2013-07-04
20130170143HEAT SINK MECHANSIM AND ELECTRONIC DEVICE USING THE SAME - An electronic device includes an electronic component and a heat sink mechanism. The heat sink mechanism includes a first heat sink component and a second heat sink component arranged on opposite surfaces of the electronic component. The first heat sink component includes a first conduction portion and a second conduction portion extending from the first conduction portion. The first conducting portion is secured to the electronic component, and the second conducting portion is secured to the second heat sink component, for dissipating the heat produced by the electronic component away from the electronic device.2013-07-04
20130170144ELECTRONIC DEVICE WITH HEAT SINK MECHANSIM - An electronic device includes an electronic component and a heat sink mechanism. The electronic component includes at least one heat sink portion defining a plurality of heat sink holes. The heat sink mechanism includes at least one first conducting portion secured to an end of the heat sink holes, for dissipating heat produced by the electronic component away from the electronic device.2013-07-04
20130170145THERMAL CONNECTOR - A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.2013-07-04
20130170146MEMORY ASSEMBLY - A motherboard includes a circuit board, a memory slot, a memory, a heat-dissipating member, an electrically conductive latching element, and a grounding element. The grounding element includes two electrically conductive first securing members mounted on the circuit board. The first securing members are electrically connected to a ground layer of the circuit board. The latching element includes a latching portion abutting the heat-dissipating member and two hooking portions formed on two ends of the latching portion. The hooking portions respectively latch the first securing members.2013-07-04
20130170147RDL SYSTEM IN PACKAGE - In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.2013-07-04
20130170148PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF - A manufacturing method of a package carrier is provided. A supporting board having an upper surface which a patterned circuit layer formed thereon is provided. A portion of the upper surface is exposed by the patterned circuit layer. An insulating layer and a conducting layer located at a first surface of the insulating layer are laminated onto the patterned circuit layer. The patterned circuit layer and the exposed portion of the upper surface are covered by the insulating layer. Plural conductive connection structures are formed on the patterned circuit layer. Plural of pads respectively connecting the conductive connection structures and exposing a portion of the first surface of the insulating layer is defined by patterning the conductive layer. The supporting board is removed so as to expose a second surface of the insulating layer. The second surface and a bonding surface of the patterned circuit layer are coplanar.2013-07-04
20130170149CONNECTOR AND ELECTRONIC CIRCUIT ASSEMBLY FOR IMPROVED WET INSULATION RESISTANCE - The present invention is premised upon a connector and electronic circuit assembly (2013-07-04
20130170150LOCKING MECHANISM FOR COMMUNICATION MODULE AND COMMUNICATION DEVICE - A locking mechanism for a communication module is provided. The locking mechanism includes a handle, a upper-and-lower bolt, a handle stopping mechanism, a handle self-locking mechanism, and a module frame on which those components are arranged; wherein the handle is connected with the upper-and-lower bolt through the linkage mechanism of the upper-and-lower bolt; when rotating under the action of a force, the handle is moved with the upper-and-lower bolt through the linkage mechanism, and the communication module is inserted into or pulled out of communication device by the elastic function of the upper-and-lower bolt; when the communication module is not inserted into the communication equipment, a stopping bolt on the handle stopping mechanism stops the handle and the handle is locked; when the communication module is inserted, the stopping bolt separates from and releases the handle and the handle is self-locked. The locking mechanism avoids mounting by screws.2013-07-04
20130170151DISPLAY SUBSTRATE, MOTHER SUBSTRATE FOR MANUFACTURING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY SUBSTRATE - A display substrate includes a circuit mounted part that has a driving IC mounted thereon. The circuit mounted part includes an input pad part connected to an input terminal of the driving IC and an output pad part connected to an output terminal of the driving IC. A flexible pad part connected to a terminal of a FPCB includes a driving pad part to receive a drive signal of the driving IC. A driving line part is connected to the driving pad part to be extended along a length direction of the circuit mounted part within the circuit mounted part. Connection lines are extended from the driving line part disposed within the circuit mounted part toward the output pad part. The connection lines are partially removed in a trimming area defined between the driving line and the output pad part.2013-07-04
20130170152PRINTED CIRCUIT AND PRINTED CIRCUIT OF TOUCH PANEL - A printed circuit includes a number of conductive wires. Each of the conductive wires includes a first conductive wire section, a second conductive wire section, and a first connection section. The first connection section includes a first end and a second end opposite to the first end, the first end of the first connection section is connected to the first conductive wire section, and the second end of the first connection section is connected to the second conductive wire section. An angle between the first conductive wire section and the first connection section can be in a range from about 90 degrees to about 180 degrees.2013-07-04
20130170153PRINTED CIRCUIT AND PRINTED CIRCUIT OF TOUCH PANEL - A printed circuit includes a number of conductive wires. The conductive wires include at least one first conductive wire section, at least one second conductive wire section, and at least one first connection section. An angle between the at least one first conductive wire section and the at least one first connection section is defined as angle α2013-07-04
20130170154PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate.2013-07-04
20130170155PRINTED WIRING BOARD, AND METHOD OF SUPPLYING POWER AND FORMING WIRING FOR PRINTED WIRING BOARD - Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial wiring patterns each forming a current path from the power source to the LSIs are provided by forming gaps in the power supply wiring.2013-07-04
20130170156DISPLAY DEVICE - Disclosed herein is a display device having an intermediate panel firming supporting a display panel, maximizing heat dissipation and having a light weight, and a bracket facilitating assembly of the intermediate panel with other components. The display device includes the display panel, the intermediate panel disposed on the rear surface of the display panel, the bracket including a first combining part combined with the intermediate panel and a second combining part combined with the display panel and provided with guide grooves on the second combining part, a side cover including a frame part disposed at the edges of the display panel and the bracket, support parts extending from the frame part and supporting the bracket and a guide rib protruding in the forward direction of the support part and combined with the guide groove, and a rear cover disposed on the rear surface of the intermediate panel.2013-07-04
20130170157BACK PLATE OF FLEXIBLE DISPLAY AND FLEXIBLE DISPLAY TERMINAL HAVING THE SAME - A back plate arranged at a back surface of a flexible display of a flexible display terminal is provided. The back plate may include a substrate with divided regions having similar displacements, so that when the flexible display is deformed, a plurality of divided plates are formed. A connected part formed of a flexible material may connect the divided plates with each other, and may be deformable in response deformation of the flexible display.2013-07-04
20130170158Knitted textile substrate with different stitch patterns and electronic textile - A knitted substrate (2013-07-04
20130170159HOUSING FOR PORTABLE ELECTRONIC DEVICES - A housing for a portable electronic device includes a first housing member. The first housing member includes a metal member and a plastic member integrally molded with the metal member. The metal member includes a main portion and a peripheral wall perpendicular to the main portion. The peripheral wall defines a plurality of notches. Each notch is substantially wedge-shaped with a top opening smaller than a bottom thereof. The peripheral wall tightly abuts against the plastic member with portions of the plastic member filling in the notches.2013-07-04
20130170160ELECTRONIC DEVICE - An electronic device includes a circuit substrate, a bottom case, and a top case. The circuit substrate has a plurality of slits penetrating therethrough. The bottom case has a groove portion positioned at an inside surface of the bottom case such that edge portions of the circuit substrate are slidable and inserted into the groove portion. Besides, a plurality of pin-shaped protrusion portions is provided in the bottom case to be snib-fitted with the top case, and each protrusion portion has a plurality of locking portions at a tip end portion. Each protrusion portion elastically biases the circuit substrate toward the top side of the bottom case and presses the circuit substrate to a top surface of the groove portion by locking the locking portions to the circuit substrate after the locking portions are respectively inserted into the slits.2013-07-04
20130170161ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT - An attachment mechanism for an electronic component includes a circuit board and a fastener. A first connector is fastened to the circuit board to be connected to a second connector of the electronic component. The first connector includes a mounting portion fastened to the circuit board and a large main body on a top of the mounting portion to connect to the second connector. A fastener includes a top wall, two engaging portions engaging with opposite sides of the electronic component, and two cantilevers slantingly extending toward each other from bottoms of the corresponding engaging walls. Two claws extend from each cantilever to engage with a corresponding end of the mounting portion and abut against a bottom surface of the main body.2013-07-04
20130170162BRIDGING BOARD AND SERVER SYSTEM - A bridging board configured for connecting a processor with a hard disk backboard includes a first signal connecting apparatus, a second signal connecting apparatus, a plurality of duplexer and a signal conditioner. The first signal connecting apparatus is electronically connected to the processor. The second signal connecting apparatus electronically connected to the hard disk backboard. Each duplexer has an input terminal electronically connected to the first signal connecting apparatus, and two output terminals electronically connected to the second signal connecting apparatus to allow the processor to communicate with the backboard via the bridging board. The signal conditioner is electronically connected between the first signal connecting apparatus and the second signal connecting apparatus to amplify signals transmitted from the processor to the hard disk backboard.2013-07-04
20130170163ELECTRICAL COMPONENT WHICH CAN BE RELIABLY SOLDERED - Electrical component (2013-07-04
20130170164ADHESIVE DAM - On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.2013-07-04
20130170165ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUIT BOARD - An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.2013-07-04
20130170166SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.2013-07-04
20130170167PRINTED CIRCUIT BOARD - A multi-layer printed circuit board includes an embedded capacitor substrate composed of a power source conductor layer and a ground conductor layer, the layers being disposed close to each other. The power source conductor layer has a first power source plane to supply power to a circuit element, and a second power source plane that is separated from the first power source plane by a gap and functions as a main power source. The first power source plane is partially connected to the second power source plane by a connecting line. The ground conductor layer has an opening at a position overlapping with a projected image when the connecting line is projected on the ground conductor layer. This structure suppresses propagation of the noise caused at the circuit element and reduces radiation noise in the printed circuit board.2013-07-04
20130170168SIGNAL CONVERSION DEVICE WITH DUAL CHIP - The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.2013-07-04
20130170169CIRCUIT MODULE WITH MULTIPLE SUBMODULES - An embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, and the second submodule is disposed over the first submodule and has a second submodule node. The conductive structure couples the first submodule node to one of the module nodes and couples the second submodule node to one of the module nodes. Another embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has first submodule nodes, and the second submodule is disposed over the first submodule and has second submodule nodes. The conductive structure couples one of the first and second submodule nodes to one of the module nodes and couples one of the first submodule nodes to one of the second submodule nodes.2013-07-04
20130170170COUNTER MACHINE WITH DISPLAY - A counter machine includes a display, a first connecting member, a support, and a second connecting member. The first connecting member is secured to the display and includes a first block. The second connecting member is engaged with the first connecting member and includes a second block. The first connecting member is rotatable relative to the second connecting member. When the first block is blocked by the second block, the first connecting member is blocked from rotating relative to the second connecting member.2013-07-04
20130170171EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEM FOR 3D STRUCTURAL ELECTRONIC, ELECTROMAGNETIC AND ELECTROMECHANICAL COMPONENTS/DEVICES - The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.2013-07-04
20130170172METHOD FOR PRODUCING A PLURALITY OF ELECTRONIC DEVICES HAVING ELECTROMAGNETIC SHIELDING AND IN PARTICULAR HAVING HEAT DISSIPATION AND ELECTRONIC DEVICE HAVING ELECTROMAGNETIC SHIELDING AND IN PARTICULAR HAVING HEAT DISSIPATION - An electronic device comprises a substrate (2013-07-04
20130170173DISPLAY DEVICE AND OPTICAL MULTI-LAYER STRUCTURE FOR DISPLAY DEVICE - An optical multi-layer structure for a flat panel display device is provided. The optical multi-layer structure includes a first optical layer, a second optical layer, a surface strengthening layer, and an adhesive layer. The first optical layer converts a light into a first polarized light. The second optical layer is disposed on the first optical layer and converts the first polarized light into a second polarized light. The surface strengthening layer is disposed on the second optical layer. The adhesive layer is disposed between the second optical layer and the surface strengthening layer, and is in direct contact with the second optical layer and the surface strengthening layer. A flat panel display device having the optical multi-layer structure is also disclosed.2013-07-04
20130170174MULTI-CAVITIES LIGHT EMITTING DEVICE - A Multi-Cavities light emitting device includes a base, a blue light emitting unit, at least two red light emitting units, a light conversion layer and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the blue light emitting unit is installed in the central slot, and the two red light emitting units are installed in the two side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and at least two side slots, so as to achieve the effects of improving the light extraction efficiency of an LED chip and the yield rate of the product and reducing the overall assembling time and cost.2013-07-04
20130170175LAMP WITH LED ARRAY - A lamp with an LED array is disclosed. The centralized nature of the LEDs allows the LEDs to be configured in a filament-like way using a supporting power structure, near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs are cooled by a fluid medium to enable the LEDs to maintain appropriate mechanical stability and operating temperature. In some embodiments, the lamp operates at a power of at least 5 watts. Since the LED array can be centralized to form a filament-like structure, the light pattern from the lamp is not adversely affected by the presence of a heat sink or mechanical supporting parts. In some embodiments, phosphor is used provide wavelength conversion. The phosphor can be suspended within the optically transmissive fluid medium, placed remotely in the lamp structure, or applied to un-encapsulated LED die.2013-07-04
20130170176LIQUID COOLED LED SYSTEMS - Liquid cooled LED systems are disclosed. Embodiments of the invention provide an LED lighting system in which the LED devices are cooled by circulating liquid or fluid. In example embodiments, a flow return member provides a way for a fluid medium to enter and exit an envelope containing the LED devices. An additional cooling mechanism, such as a radiator or thermoelectric cooler can be provided. The optically transmissive fluid medium can be, for example, oil or a fluorinated or halogenated liquid or gel, and can optionally provide index matching. The fluid medium can optionally include a phase change material in order to enhance cooling. In some embodiments, a pump is used to circulate the fluid medium. However, the optical envelope and/or the flow return member could also be oriented so that the fluid medium circulates by gravity and/or temperature difference.2013-07-04
20130170177Three-Dimensional Display for Displaying Volumetric Images - An apparatus including a three-dimensional display, for displaying volumetric images, including a three-dimensional non linear photoluminescent medium defining a display volume and including nanostructures distributed throughout the display volume; and a scanner configured to scan an output volume, where a first photon flux and a second photon flux meet, in three dimensions within the display volume.2013-07-04
20130170178LIGHT SOURCE MODULE AND ILLUMINATION APPARATUS HAVING THE SAME - A light source module including: a cover unit having a pipe structure with one open end or two open ends; a cap unit coupled to the one open end or two open ends of the cover unit; a light source unit including a light emitting device, the light source unit mounted on the cap unit and covered by the cover unit; and a wavelength conversion unit disposed in an internal space of the cover unit and coupled to the light source unit while covering the light emitting device, the wavelength conversion unit converting a wavelength of light emitted from the light emitting device to allow the wavelength-converted light to be emitted through the cover unit.2013-07-04
20130170179WAVELENGTH CONVERSION ELEMENT AND LIGHT SOURCE PROVIDED WITH SAME - A light source using a wavelength conversion member is increased in brightness. A wavelength conversion element 2013-07-04
20130170180LIGHT EMITTING DIODE LAMP - The LED lamp includes a housing, an LED chip, a control module, a battery and a heater with a temperature controlled switch. The housing is composed of a front cover and a back cover. The LED chip, control module and the battery are received in the housing. The control module is electrically connected to the LED chip for driving the LED chip. The battery is electrically connected to the control module for providing alternative power to the LED chip.2013-07-04
20130170181LED LAMP - An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The body includes a rear cover, a transparent front cover, a lamp board, a number of LED light sources, a driving circuit board, and a fixing member. The front cover has a honeycombed pattern including a plurality of cells. The LED light sources are mounted on the lamp board facing an inside of the front cover, and each LED light source is configured to emit a light beam toward the front cover so as to create a light spot in a corresponding cell on the front cover. The driving circuit board is electrically connected to the socket and the lamp board, and is configured for driving the LED light sources to emit light beams. The fixing member is configured for fixing the rear cover, the driving circuit board and the lamp board together.2013-07-04
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