27th week of 2020 patent applcation highlights part 65 |
Patent application number | Title | Published |
20200211741 | SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL - A superconducting wire includes: a superconducting laminate including a superconducting layer formed on a taped-shaped base material via an intermediate layer; and a stabilization layer that covers at least a portion of the superconducting laminate. A residual stress inside the stabilization layer is a tensile stress. A residual stress in a side surface portion of the stabilization layer that covers a side surface of the superconducting laminate is a tensile stress along a thickness direction of the superconducting laminate. | 2020-07-02 |
20200211742 | METHOD OF PREPARING BONDED MAGNET AND BONDED MAGNET - The present disclosure aims to provide a bonded magnet having good magnetic properties and a method of preparing the bonded magnet. The present disclosure provides a method of preparing a bonded magnet, including: a first compression step of compressing a magnetic powder having an average particle size of 10 μm or less while magnetically orienting it to obtain a first molded article; a second compression step of bringing the first molded article into contact with a thermosetting resin having a viscosity of 200 mPa·s or less, followed by compression to obtain a second molded article; and a heat treatment step of heat treating the second molded article. | 2020-07-02 |
20200211743 | SINTERED FERRITE MAGNET - A sintered ferrite magnet represented by the general formula of Ca | 2020-07-02 |
20200211744 | Spiral-Grooved, Stacked-Plate Superconducting Magnets And Related Construction Techniques - Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions. | 2020-07-02 |
20200211745 | Electronic Control Unit - An object is to provide a new electronic control unit that can improve detection accuracy of a sense current even in a region where the current value of the sense current is small. Provided is a sense current detection unit including a plurality of sense transistors that have different current flow rates and that are connected to current output transistors controlling a current flowing in a coil load. The current in the sense current detection unit is input to an analog/digital converter, and the current value of the current flowing in the sense current detection unit is converted into a digital value. The current value of the current flowing in the sense current detection unit is increased through a combination or a selection of the plurality of sense transistors of the sense current detection unit in a region where the current value of the main current of the current output transistors is small compared to a region where the current value of the main current is large. | 2020-07-02 |
20200211746 | EXCHANGE COUPLING FILM, AND MAGNETORESISTIVE SENSOR AND MAGNETIC DETECTOR INCLUDING THE SAME - In an exchange coupling film that has a large magnetic field (Hex) in which the direction of magnetization of a fixed magnetic layer is reversed, high stability under high temperature conditions, and excellent strong-magnetic field resistance, an antiferromagnetic layer, a fixed magnetic layer, and a free magnetic layer are stacked, the antiferromagnetic layer is composed of a PtCr layer and an XMn layer (where X is Pt or Ir), the XMn layer is in contact with the fixed magnetic layer, and the fixed magnetic layer is made of iron, cobalt, an iron-cobalt alloy, or an iron-nickel alloy. | 2020-07-02 |
20200211747 | METHOD FOR MAGNETISING AT LEAST TWO MAGNETS HAVING DIFFERENT MAGNETIC COERCIVITY - A method for magnetizing at least two magnets having different magnetic coercivities, includes the steps of:
| 2020-07-02 |
20200211748 | DEGAUSSING A MAGNETIZED STRUCTURE - A system for degaussing a magnetized structure can include a given circuit that provides a differential alternating current (AC) signal that decays from an upper level to a lower level over a predetermined amount of time. The system also includes a given electrical coil coupled to the given circuit. The electrical coil circumscribes the magnetized structure. The electrical coil induces a decaying magnetic field on the magnetized structure in response to the differential AC signal to convert the magnetized structure into a degaussed structure. | 2020-07-02 |
20200211749 | LC COMPOSITE COMPONENT - An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer. | 2020-07-02 |
20200211750 | COIL COMPONENT - Terminal electrodes are disposed on mounting surfaces of flanges of a substantially drum-shaped core that are directed to a mounting substrate. A rounded surface is formed on the mounting surface. An end portion of the wire extends along the rounded surface from a side on which the inner end surface is present toward a side on which the outer end surface is present. | 2020-07-02 |
20200211751 | COIL COMPONENT AND METHOD OF MANUFACTURING COIL COMPONENT - A coil component includes a drum-shaped core including a core part having a circumferential surface including a first side surface and a second side surface parallel to each other; and a coil including two wires wound around the core part in the same direction. The coil has a first twisted wire part having the two wires twisted together on the first side surface, and a second twisted wire part having the two wires twisted together on the second side surface. The first twisted wire part and the second twisted wire part are identical in shape. | 2020-07-02 |
20200211752 | METHOD FOR MANUFACTURING COIL COMPONENT - A method for manufacturing a coil component includes: a first winding step to wind a first conductive wire around a winding core in a single layer from a first flange part toward a second flange part; and a second winding step to wind a second conductive wire around the winding core on the first conductive wire by the same number of turns and in the same direction as in the first winding step in a single layer in a manner that center B of the cross-section of the second conductive wire closest to the first flange part is positioned closer to the first flange part than is center A of the cross-section of the first conductive wire closest to the first flange part, and that the distance in the axial direction, between centers A and B is smaller than the radius of the wire. | 2020-07-02 |
20200211753 | WIRE-WOUND COIL COMPONENT AND DRUM CORE - One object of the present invention is to provide a wire-wound coil component and a drum core that can be manufactured easily and less affected by an inter-wire capacitance. A coil component includes: a drum core having a winding core extending along a front-rear direction and a first flange provided on a front end of the winding core; a first conductor wire wound around the winding core of the drum core; and a second conductor wire wound on an outer side of the first conductor wire in a direction orthogonal to the front-rear direction, wherein turns of a same number of the first conductor wire and the second conductor wire contact with each other, while turns of different numbers of the first conductor wire and the second conductor wire are separated from each other. | 2020-07-02 |
20200211754 | GALVANIC ISOLATION OF INTEGRATED CLOSED MAGNETIC PATH TRANSFORMER WITH BT LAMINATE - A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion. The at least one lateral magnetic portion is disposed laterally from the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. | 2020-07-02 |
20200211755 | ADJUSTABLE LEAKAGE INDUCTANCE TRANSFORMER - An adjustable leakage inductance transformer includes a magnetic core, a primary side coil and a secondary side coil. The magnetic core includes a magnetic core column structure, which has a central column, a first outer column and a second outer column. The primary side coil is wound on the first outer column and the second outer column by a first primary side coil loop number and a second primary side coil loop number, respectively. The secondary side coil is wound on the first outer column and the second outer column by a first secondary side coil loop number and a second secondary side coil loop number, respectively, the first primary side coil loop number is not equal to the first secondary side coil loop number, and the second primary side coil loop number is not equal to the second secondary side coil loop number. | 2020-07-02 |
20200211756 | MAGNETIC UNIT - The present disclosure relates to the field of power electronic technology, provides a magnetic unit, including: a magnetic core and a winding, the magnetic core includes Q magnetic legs arranged in a row, where Q is a natural number and Q≥2, and the winding includes a first winding and a second winding, where the first winding is magnetically coupled with the second winding, and the first winding is wound around the Q magnetic legs while the second winding is wound around the Q magnetic legs. The first winding between any two adjacent magnetic legs is generally symmetrically disposed at both sides of the symmetric plane between the any two adjacent magnetic legs, thereby the magnetomotive force (MMF) distribution between any two adjacent magnetic legs is uniform. | 2020-07-02 |
20200211757 | REACTOR FOR VEHICLE - A coil includes unit coils wound around a central axis and adjacent to each other with a space therebetween in a central axis direction. A reactor includes a pair of support frames and one or more spacers, the support frames facing each other in the central axis direction across the coil. The spacers are disposed between adjacent unit coils or between the support frame and the coil. At least one of the spacers is a variable spacer that includes a first member and a second member, the first member having one end face which has a recess, and the second member including a fitting portion to be fitted into the recess of the first member in the central axis direction. The linear expansion coefficient of the second member is less than the linear expansion coefficient of the first member. | 2020-07-02 |
20200211758 | COIL COMPONENT - A coil component includes an element body including a magnetic portion containing metal particles and a coil conductor embedded in the magnetic portion, and at least a pair of outer electrodes disposed on the element body and electrically connected to the coil conductor. The magnetic portion includes a region A containing metal particles having a relatively small average particle size and a region B containing metal particles having a relatively large average particle size. The region A is present between outer electrodes of the pair of outer electrodes and the coil conductor. | 2020-07-02 |
20200211759 | LAMINATED TRANSFORMER AND MANUFACTURING METHOD THEREOF - A laminated transformer can include: a plurality of magnetic layers; a plurality of coil layers including a primary coil having a first type of coil layer, and a secondary coil having a second type of coil layer, where each coil layer is laminated between a pair of the plurality of magnetic layers; and a plurality of non-magnetic layers, where a first of the plurality of non-magnetic layers is disposed between an adjacent pair of the coil layers in order to increase a coupling coefficient between the primary and secondary coils. | 2020-07-02 |
20200211760 | MOLDED INDUCTOR WITH MAGNETIC CORE HAVING MOLD FLOW ENHANCING CHANNELS - A molded inductor includes a winding having leads configured for attaching leads of the winding to pads on a package substrate, having a magnetic core with a body disposed within the winding, wherein the magnetic core has at least one mold flow enhancing feature that enhances a filling of a magnetic mold material as compared to a filling provided by a uniform cylindrical body. The magnetic mold material encases the winding and the magnetic core to form either a standalone discrete inductor component, or the magnetic component of an output filter of an integrated switching power converter module. | 2020-07-02 |
20200211761 | DISSOLVED GAS ANALYSIS DEVICES, SYSTEMS, AND METHODS - Devices, systems, and methods for determining gas characteristics to monitor transformer operation include extracting gas from transformer fluid for analysis. | 2020-07-02 |
20200211762 | Power Transformer For Minimum Noise Injection In Between Primary And Secondary Winding "Rompower Active Shield" - A system for reducing common-mode noise includes a switch mode power supply having primary and secondary sides, primary and secondary side grounds, an input voltage source, a primary switch, a transformer, a core, and a power output. The primary and secondary sides each have a quiet termination. The transformer includes a primary winding, a secondary winding, and an active shield winding between the primary and secondary windings. The active shield winding has two terminations, is wound in a same direction as the secondary winding, and occupies a same axial position on the core as the secondary winding. One of the terminations of the active shield winding is connected to the quiet termination of the primary side, so that the terminations of the secondary winding and the active shield winding that are adjacent each other carry alternating voltages of a same polarity and a same amplitude. | 2020-07-02 |
20200211763 | INDUCTOR COMPONENT - An inductor component includes a package, a coil embedded in the package, a first external electrode extending from a first end of the coil, and a second external electrode extending from a second end of the coil. The package has a bottom surface, a top surface, first and second side surfaces opposite to each other, and third and fourth side surfaces opposite to each other. The bottom surface of the package has a first step recess therein sinking toward the top surface, opening to the third side surface, and contacting the first external electrode. The bottom surface of the package further has a second step recess therein sinking toward the top surface, opening to the fourth side surface, and contacting the second external electrode. The bottom surface has a third step recess therein connected to the first step recess and sinking toward the top surface. The bottom surface has a fourth step recess therein connected to the second step recess and sinking toward the top surface. Upon being subjected to reflow-soldering, the inductor component enhances wettability to solder. | 2020-07-02 |
20200211764 | MAGNETIC COIL SUPPORT IN MAGNETIC RESONANCE IMAGING METHOD AND APPARATUS - An imaging device may include multiple magnetic coils to generate a magnetic field. Additionally, the imaging device may include an outer support affixed to at least one coil of the plurality of magnetic coils and an axial support between at least two coils of the plurality of magnetic coils, wherein the outer support and the axial support operatively share a load corresponding to the generated magnetic fields. | 2020-07-02 |
20200211765 | Planar Transformer and DC-DC Converter - A planar transformer includes: a primary side planar air core coil; a secondary side planar air core coil; a primary side planar core; and a secondary side planar core. The secondary side planar air core coil is arranged so as to be spaced from the primary side planar air core coil in the winding center axis direction of the primary side planar air core coil, the secondary side planar air core coil having a non-facing portion configured not to face the primary side planar air core coil in the winding center axis direction. The primary side planar core and the secondary side planar core are stacked on outer sides of the primary side planar air core coil and the secondary side planar air core coil in the directions of the winding center axes, respectively. | 2020-07-02 |
20200211766 | INDUCTOR COMPONENT - When a winding density represents the number of turns of a wire per unit length in a longitudinal direction of a core portion, a plurality of inductor regions having mutually different winding densities of the wire are arrayed in the longitudinal direction of the core portion, and a low-density inductor region with the winding density being relatively low is located between first and second high-density inductor regions with the winding densities being relatively high. | 2020-07-02 |
20200211767 | MODULE WITH REVERSELY COUPLED INDUCTORS AND MAGNETIC MOLDED COMPOUND (MMC) - A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound. | 2020-07-02 |
20200211768 | WINDING APPARATUS AND WINDING METHOD USING SAME - A winding apparatus, includes a winding core, a wire rod being wound on the winding core; a pair of flyers arranged across the winding core in an axial direction; flyer rotation means for rotating either one or both of the pair of flyers; wire storage tools respectively detachably provided on the pair of flyers, the wire rod to be wound on the winding core being stored on the wire storage tools; and tension devices respectively provided on the pair of flyers, the tension devices applying a tension to the wire rod fed from the wire storage tools and introduced to the winding core. | 2020-07-02 |
20200211769 | MAGNETIZED SUBSTRATE CARRIER APPARATUS WITH SHADOW MASK FOR DEPOSITION - Methods and apparatus for a magnetized substrate carrier apparatus are described herein. In some embodiments, a substrate carrier apparatus includes: a carrier plate having a support surface to support a substrate, a mask assembly disposed above the support surface, wherein the mask assembly includes an annular frame and a shadow mask disposed within the annular frame, and wherein the shadow mask includes one or more openings arranged in a predetermined pattern and disposed through the shadow mask, and one or more magnets disposed on or embedded within at least one of the carrier plate and the shadow mask to create a magnetic field above the support surface. | 2020-07-02 |
20200211770 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body. | 2020-07-02 |
20200211771 | CAPACITOR - A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin. | 2020-07-02 |
20200211772 | FILM CAPACITOR AND FILM FOR FILM CAPACITOR - A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225° C. of 2700 mol/m | 2020-07-02 |
20200211773 | CAPACITOR COMPONENT - A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa. | 2020-07-02 |
20200211774 | ELECTRONIC COMPONENT - An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer. | 2020-07-02 |
20200211775 | ELECTRONIC COMPONENT - An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening. | 2020-07-02 |
20200211776 | MULTILAYER CAPACITOR - A multilayer capacitor includes a body in which a plurality of internal electrodes are stacked, including a ceramic sintered body; and external electrodes disposed on an external surface of the body and electrically connected to the internal electrodes. The ceramic sintered body includes a liquid pocket. | 2020-07-02 |
20200211777 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≤(B+C)/A≤1.745. | 2020-07-02 |
20200211778 | FILM CAPACITOR AND METALLIZED FILM - A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is α | 2020-07-02 |
20200211779 | FILM CAPACITOR, FILM FOR FILM CAPACITOR, METHOD OF PRODUCING FILM FOR FILM CAPACITOR, AND METHOD OF PRODUCING FILM CAPACITOR - A film capacitor that includes a resin layer having a linear protrusion on a first surface thereof and a linear recess on a second surface thereof opposite the first surface, and a metal layer on the first surface of the resin layer. A total length of the linear recess per 1 cm | 2020-07-02 |
20200211780 | CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS - An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals. The apparatus also includes a first conductor capable of electrically connecting the first capacitor terminal of a capacitor provided by one of the plurality of capacitive elements to one of the at least three capacitor cover terminals and a second conductor capable of electrically connecting the second capacitor terminal of the capacitor provided by one of the plurality of capacitive elements to the common cover terminal. | 2020-07-02 |
20200211781 | STACKED ELEMENT AND ELECTRONIC DEVICE HAVING SAME - The present disclosure provides a stacked element including: a stacked body in which a plurality of sheets are stacked; a capacitor part comprising a plurality of internal electrodes formed inside the stacked body; and an external electrode provided outside the stacked body and connected to the internal electrode, wherein at least one sheet among the plurality of sheets has a different temperature coefficient of capacitance (TCC) from the remaining sheets. | 2020-07-02 |
20200211782 | LC COMPOSITE COMPONENT - An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin. | 2020-07-02 |
20200211783 | System and Method for Controlling a Voltage Tunable Multilayer Capacitor - A controller and system for tuning a voltage tunable capacitor is provided. The controller may include at least one analog-to-digital converter configured to receive at least one input signal and convert the at least one input signal into at least one digital signal. The controller may include a processor configured to process the at least one digital signal using logic to generate an output signal. The controller may include a charge pump configured to boost the output signal to generate a boosted output signal. The controller may be configured to provide the boosted output signal to the voltage tunable capacitor to adjust a bias voltage of the voltage tunable capacitor. | 2020-07-02 |
20200211784 | ELECTROLYTIC CAPACITOR - An electrolytic capacitor that includes a resin molded body having opposed first and second end surfaces, the body including a stack that includes a capacitor element with an anode exposed at the first end surface, a dielectric layer on a surface of the anode, and a cathode opposite to the anode and exposed at the second end surface, and a sealing resin that encloses the stack; a first external electrode on the first end surface of the resin molded body and electrically connected to the anode; and a second external electrode on a second end surface of the resin molded body and electrically connected to the cathode, wherein the first external electrode and the second external electrode each include a resin electrode layer containing a conductive component and a resin component. | 2020-07-02 |
20200211785 | ELECTROLYTIC CAPACITOR - An electrolytic capacitor includes an anode body, a cathode body, and a conductive polymer and a liquid component that are disposed between the anode body and the cathode body. The liquid component contains an acid component, a base component, and an aromatic additive. The acid component includes at least one of an aromatic carboxylic acid and an aromatic carboxylic acid derivative. The at least one of the aromatic carboxylic acid and the aromatic carboxylic acid derivative includes at least two carboxy groups and at least one aromatic ring. A content proportion of the base component in the liquid component is more than or equal to 1% by mass. The aromatic additive includes an electron withdrawing group and an electron donating group. A content ratio of the aromatic additive contained in the liquid component is more than or equal to 50 parts by mass with respect to 100 parts by mass of the conductive polymer. | 2020-07-02 |
20200211786 | SOLAR CELL MATERIALS FOR INCREASED EFFICIENCY - A semiconductor-absorber composite comprises a mesoporous titania particle, halogen atoms disposed on a surface of the mesoporous titania particle, and photoactive perovskite in physical contact with at least a portion of the surface of the mesoporous titania particle. | 2020-07-02 |
20200211787 | DYE-SENSITIZED PHOTOELECTRIC CONVERSION ELEMENT - The dye-sensitized photoelectric conversion element of the present invention has an electrolyte layer in which an ammonium ion, an inorganic salt and an iodide ion are dissolved in an organic solvent and in which the ratio of the molar amount of triiodide ions to the molar amount of iodide ions is less than 1%. High photoelectric conversion efficiency is obtained regardless of the kind of the sensitizing dye, and the design is also excellent. | 2020-07-02 |
20200211788 | ENERGY STORAGE - The invention relates to an energy storage device ( | 2020-07-02 |
20200211789 | ELECTRICAL SWITCH - The electrical switch includes two fixed contacts and a rotatable knife contact having a rotational axis and including at least one longitudinal pair of blades flexibly connected to each other. The two fixed contacts as well as the blades in the rotatable knife contact are of a first electrically conductive material composition. The first and the second fixed contact includes a first contact pin and outer ends in the blades in the rotatable knife contact includes a second contact pin. The first contact pin and the second contact pin are of a second electrically material composition, which is different from the first material composition. The first contact pin and the second contact pin pass over each other during a switching event. | 2020-07-02 |
20200211790 | BRACKET, FUNCTIONAL MODULE, MOUNTING METHOD OF ELECTRICAL DEVICE AND THE ELECTRICAL DEVICE - Embodiments of the present disclosure provide a bracket, a functional module and a mounting method of an electrical device. The bracket described herein includes a body comprising a supporting portion adapted to support a functional component of the electrical device, a first coupling portion and a second coupling portion symmetrically arranged on the body with respect to a longitudinal axis of the supporting portion, and the second coupling portion is adapted to be coupled with the first coupling portion of a further bracket of the same specification to form a bracket set. The bracket described herein can be interlocked together, and the mounting component and the bracket are integrally formed. As a result, the appearance of the electrical device is improved, more mounting screws are saved, the mounting steps of the electrical device are reduced, and the mounting efficiency of the electrical device is improved. | 2020-07-02 |
20200211791 | CIRCUIT PROTECTION DEVICES, SYSTEMS AND METHODS FOR EXPLOSIVE ENVIRONMENT COMPLIANCE - Solid state and hybrid circuit protection devices include improved chemical, static discharge and impact resistant housing construction, arc-free switching operation, secure terminal assemblies and thermal management features. The solid state and hybrid circuit protection devices are ignition protected and avoid possible explosions and therefore obviate a need for conventional explosion-proof enclosures to ensure safe operation of an electrical power system in a potentially explosive environment. | 2020-07-02 |
20200211792 | HAZARDOUS LOCATION COMPLIANT CIRCUIT PROTECTION DEVICES HAVING ENHANCED SAFETY INTELLIGENCE, SYSTEMS AND METHODS - Compliant electrical circuit protection devices are described for use in hazardous environments without presenting ignition risks for potentially explosive environmental conditions. Sensing features and systems may evaluate wiring limits and user selected settings for compatibility, detect loose connections and operating parameters to ensure safe operation of the device, and to intelligently diagnose and manage issues of concern for the circuit protection devices as well as the larger electrical power system. | 2020-07-02 |
20200211793 | INTERLOCK SYSTEM FOR A CIRCUIT BREAKER SYSTEM - An interlock system including an actuatable motor control assembly, a movable access door and an interlock assembly. The actuatable motor control assembly is structured to energize and de-energize a racking assembly motor. The movable access door is structured to move between an open, first position wherein the access door does not block access to a manual racking assembly socket, and, a closed, second position wherein the access door blocks access to the manual racking assembly socket. The interlock assembly is structured to detect the configuration of the separable contact assembly and the position of the access door, and, to actuate the motor control assembly so as to energize the motor only when the separable contact assembly is in an open, first configuration and when the access door is in a closed, second position. | 2020-07-02 |
20200211794 | NOISE REDUCTION STRUCTURE OF BUTTON ASSEMBLY - A noise reduction structure of a button assembly including a keycap, a trigger portion, a circuit board, and an elastic piece includes an extension portion, a buffer portion, and an abutting portion. The extension portion extends from the keycap toward the abutting portion. The buffer portion is mounted to at least one of the extension portion or the abutting portion and is located between the extension portion and the abutting portion. When the keycap is pressed, the extension portion is moved away from the abutting portion, the trigger portion presses the elastic piece to deform the elastic piece, and the elastic piece contacts the circuit board. When the keycap is released, a restoring force of the elastic piece drives the extension portion to move toward the abutting portion, and the buffer portion buffers contact between the abutting portion and the extension portion. | 2020-07-02 |
20200211795 | TRANSPARENT KEYCAPS - Keycaps for keyboards that have transparent top portions have a set of layered components to define a top surface that provides key definition by curvature, texture, ridges, or other external structural features. Other portions of the keycaps define a glyph or support structure for the top layer. Features such as angle filters and partially reflective materials are implemented to improve the visibility, contrast, and reflectivity of the keycaps. Multiple methods are used to bend or otherwise modify rigid transparent materials such as glass in order to add surface features and to improve aesthetics of the keycaps of a keyboard. | 2020-07-02 |
20200211796 | SINKABLE KEYBOARD DEVICE - A sinkable keyboard device includes a substrate, a first keycap, a second keycap, and a sliding plate. The substrate has an upper surface. The first keycap is liftably disposed on the upper surface and includes a first abutting portion. The second keycap is liftably disposed on the upper surface and includes a second abutting portion. The sliding plate is parallel to the substrate and movable relative to the upper surface along a sliding direction. The sliding plate includes a first guiding member and a second guiding member arranged along the sliding direction. The first guiding member has a first inclined guiding surface, and a first inclined angle is between the first inclined guiding surface and the upper surface. The second guiding member has a second inclined guiding surface, and a second inclined angle different from the first inclined angle is between the second inclined guiding surface and the upper surface. | 2020-07-02 |
20200211797 | REMOTE CONTROLLED LIGHT SWITCH COVER - A light switch cover for converting a standard toggle switch into a remote-controlled toggle switch. In one embodiment, the light switch cover comprises a switch toggle member for acting upon a toggle light switch member to place the toggle light switch member into either an on position or an off position, a gear train coupled to the switch toggle member that causes the switch toggle member to act upon the toggle light switch member, an electric motor, coupled to the gear train, for driving the gear train in a first direction to cause the switch toggle member to place the toggle light switch member into the on position, and for driving the gear train in a second direction to cause the switch toggle member to place the toggle light switch member into the off position, motor driving circuitry coupled to the electric motor, a receiver for receiving signals that cause actuation of the standard toggle switch, and processing circuitry coupled to the receiver and the motor driving circuitry that causes the light switch cover to receive a signal to turn the toggle switch into the on position and, in response, causing the electric motor to rotate in a direction to cause the switch toggle member to place the toggle light switch member into the on position. | 2020-07-02 |
20200211798 | LIQUID METAL MEMS SWITCH - A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency the droplet can spread allowing at least two conductors to be coupled. | 2020-07-02 |
20200211799 | CIRCUIT BREAKER FOR GAS INSULATED SWITCHGEAR - The invention refers to a circuit breaker ( | 2020-07-02 |
20200211800 | MULTI-MODE AIR COMPRESSOR PRESSURE POWER SWITCH - A multi-mode air compressor pressure switch is disclosed. A first mode of operation of the switch has a first range that includes a first cut-out pressure and a first cut-in pressure. A second mode of operation of the switch has a second range that includes a second cut-out pressure and a second cut-in pressure. The second range is smaller than the first range. The second mode of operation adds compressor output over the first mode of operation to extend operable time of a tool that is connected to a compressor that is controlled by the first mode and the second mode. | 2020-07-02 |
20200211801 | ELECTRICAL INTERRUPTION SWITCH, IN PARTICULAR FOR INTERRUPTING HIGH CURRENTS AT HIGH VOLTAGES - An electrical interruption switch for interrupting high currents at high voltages includes a casing, surrounding a contact unit defining a current path through the switch, and a pyrotechnic material, comprising a gas and/or shock wave-generating, activatable material. The contact unit has first and second connection contacts and a separation region. The pyrotechnic material and contact unit are formed such that a current to be interrupted is supplied to the contact unit via the first connection contact and discharged therefrom via the second connection contact, or vice versa. When the pyrotechnic material is ignited, the separation region is exposed to a gas pressure and/or shock wave, such that the separation region is tom open, caved in or separated. At least one chamber in the switch, at least partially delimited by the separation region, is filled with a filling material. | 2020-07-02 |
20200211802 | ELECTRIC-POWER CONVERSION APPARATUS - There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting between a melted material and a peripheral member can be suppressed even when a fuse portion is melted by an excessive current. An electric-power conversion apparatus ( | 2020-07-02 |
20200211803 | HAZARDOUS LOCATION COMPLIANT CIRCUIT PROTECTION DEVICES, SYSTEMS AND METHODS WITH SAFETY LOCKOUT/TAGOUT COMPONENTS - Hazardous location compliant solid state circuit protection devices include safety lockout components ensuring disconnection as a safeguard in the completion of power system maintenance and service tasks by responsible personnel. The safety lockout components may include a mechanical lockout interfacing with a physical lock element, an electrical lockout implemented through the controls of the solid state circuit breaker device, and combinations thereof. Visual device feedback and confirmation may be provided to personnel that the lockouts have been successfully activated, as well as successfully deactivated to reconnect and restore operation of the load side circuitry. | 2020-07-02 |
20200211804 | CIRCUIT BREAKER - A circuit breaker includes a main protection circuit connected in series with a protected circuit, an auxiliary protection circuit connected in series with the protected circuit, where the main protection circuit is connected in parallel with the auxiliary protection circuit, a mechanical disconnecting device, where the mechanical disconnecting device disconnects the main protection circuit when an over-current occurs in the protected circuit, and a fusing device, where the fusing device is fused after the main protection circuit is disconnected, to disconnect the protected circuit. | 2020-07-02 |
20200211805 | LEVER SWITCH DEVICE - A lever switch device includes a shaft member, a rotary operation member, a push switch, and a flexible board. The flexible board has a first board part, a first wiring part connected to the first board part, a second board part, a second wiring part connected to the second board part, and an integrated wiring part. The first board part has a fixed contact. A movable contact of the rotary operation member comes into contact with and separates from the fixed contact in response to a positional shift of the rotary operation member. The second board part receives a signal output from the push switch. The integrated wiring part is at a position away from the first board part and the second board part, and a part of the first wiring part and a part of the second wiring part are integrated in the integrated wiring part. | 2020-07-02 |
20200211806 | EXTERNAL GRID-CONTROLLED HOT CATHODE ARRAY ELECTRON GUN - An external grid-controlled hot cathode array electron gun, including an insulated cathode base, a filament, a plurality of hot cathode emission elements, and a grid-controlled structure is disclosed. In one aspect, the grid-controlled structure includes an insulated grid-controlled structure body and a plurality of through holes. One side of the grid-controlled structure body abuts against the cathode base to clamp the filament between the grid-controlled structure body and the cathode base and the plurality of hot cathode emission elements are inserted into the plurality of through holes respectively. | 2020-07-02 |
20200211807 | X-ray Tube - The present invention relates to an X-ray tube for X-ray analysis. The X-ray tube comprises an anode having a target surface and a cathode. The cathode comprises an emission loop. The emission loop extends around an axis that passes through the anode, and the cathode and the anode are spaced apart from one another along the axis. Electrons emitted from the cathode irradiate the target surface of the anode to produce X-rays. The X-ray tube further comprises an electron beam guide. The electron beam guide is configured to guide electrons emitted by the cathode, so as to irradiate an area of the anode. The irradiated area is enclosed by a single boundary. | 2020-07-02 |
20200211808 | X-RAY GENERATING TUBE, X-RAY GENERATING APPARATUS, AND X-RAY IMAGING APPARATUS - An X-ray generating tube includes an insulating tube having a first open end and a second open end, a cathode including an electron emission source and arranged to close the first open end of the insulating tube, an anode including a target that generates an X-ray upon collision with electron from the electron emission source and arranged to close the second open end of the insulating tube, and a tubular electrical conductive member extending from the anode in an inner space of the insulating tube. The insulating tube includes a tubular rib at a position spaced apart from the first open end and spaced apart from the second open end, and the tubular rib is arranged in a radial direction when viewed from an end of the tubular electrical conductive member on a side of the cathode. | 2020-07-02 |
20200211809 | REPELLENT ELECTRODE FOR ELECTRON REPELLING - The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber. | 2020-07-02 |
20200211810 | APPARATUS FOR GENERATING A MULTIPLICITY OF PARTICLE BEAMS, AND MULTI-BEAM PARTICLE BEAM SYSTEMS - An apparatus for generating a multiplicity of particle beams includes a particle source, a first multi-aperture plate with a multiplicity of openings, a second multi-aperture plate with a multiplicity of openings, a first particle lens, a second particle lens, a third particle lens | 2020-07-02 |
20200211811 | MULTI-BEAM INSPECTION APPARATUS - A multi-beam inspection apparatus including an improved source conversion unit is disclosed. The improved source conversion unit may comprise a micro-structure deflector array including a plurality of multipole structures. The micro-deflector deflector array may comprise a first multipole structure having a first radial shift from a central axis of the array and a second multipole structure having a second radial shift from the central axis of the array. The first radial shift is larger than the second radial shift, and the first multipole structure comprises a greater number of pole electrodes than the second multipole structure to reduce deflection aberrations when the plurality of multipole structures deflects a plurality of charged particle beams. | 2020-07-02 |
20200211812 | MULTIPLE ELECTRON BEAMS IRRADIATION APPARATUS - A multiple electron beam irradiation apparatus includes a shaping aperture array substrate to form multiple primary electron beams, a plurality of electrode array substrates stacked each to dispose thereon a plurality of electrodes each arranged at a passage position of each of the multiple primary electron beams, each of the multiple primary electron beams surrounded by an electrode of the plurality of electrodes when each of the multiple primary electron beams passes through the passage position, the first wiring and the second wiring applied with one of different electric potentials, and a stage to mount thereon a target object to be irradiated with the multiple primary electron beams having passed through the plurality of electrode array substrates, wherein, in each of the plurality of electrode array substrates, each of the plurality of electrodes is electrically connected to either one of the first wiring and the second wiring. | 2020-07-02 |
20200211813 | SYSTEM AND METHOD FOR GENERATING AND ANALYZING ROUGHNESS MEASUREMENTS - Systems and methods are disclosed that remove noise from roughness measurements to determine roughness of a feature in a pattern structure. In one embodiment, a method for determining roughness of a feature in a pattern structure includes generating, using an imaging device, a set of one or more images, each including measured linescan information that includes noise. The method also includes detecting edges of the features within the pattern structure of each image without filtering the images, generating a biased power spectral density (PSD) dataset representing feature geometry information corresponding to the edge detection measurements, evaluating a high-frequency portion of the biased PSD dataset to determine a noise model for predicting noise over all frequencies of the biased PSD dataset, and subtracting the noise predicted by the determined noise model from a biased roughness measure to obtain an unbiased roughness measure. | 2020-07-02 |
20200211814 | SCANNING EFFICIENCY BY INDIVIDUAL BEAM STEERING OF MULTI-BEAM APPARATUS - Systems and methods of observing a sample in a multi-beam apparatus are disclosed. A multi-beam apparatus may comprise an array of deflectors configured to steer individual beamlets of multiple beamlets, each deflector of the array of deflectors having a corresponding driver configured to receive a signal for steering a corresponding individual beamlet. The apparatus may further include a controller having circuitry to acquire profile data of a sample and to control each deflector by providing the signal to the corresponding driver based on the acquired profile data, and a steering circuitry comprising the corresponding driver configured to generate a driving signal, a corresponding compensator configured to receive the driving signal and a set of driving signals from other adjacent drivers associated with adjacent deflectors and to generate a compensation signal to compensate a corresponding deflector based on the driving signal and the set of driving signals. | 2020-07-02 |
20200211815 | Charged Particle Beam Device - Signal electrons with high energy that pass near an optical axis, for example, backscattered electrons or secondary electrons in a booster optical system, can be detected. Therefore, there is provided a charged particle beam device including: a charged particle beam source configured to generate a charged particle beam; an objective lens configured to focus the charged particle beam to a sample; and a first charged particle detecting element disposed between the charged particle beam source and the objective lens and configured to detect charged particles generated by an interaction between the charged particle beam and the sample, in which a detection surface of the first charged particle detecting element is disposed on a center axis of the objective lens. | 2020-07-02 |
20200211816 | ION IMPLANTER AND MEASURING DEVICE - An ion implanter includes a measuring device that measures an angle distribution of an ion beam with which a wafer is irradiated. The measuring device includes: a slit into which the ion beam is incident; a central electrode body having a beam measurement surface disposed on a central plane extending from the slit to a beam traveling direction; a plurality of side electrode bodies disposed between the slit and the central electrode body and disposed away from the central plane in a slit width direction, in which each of the plurality of side electrode bodies has a beam measurement surface; and a magnet device that applies a magnetic field bending around an axis extending along a slit length direction to at least one of the beam measurement surfaces of the plurality of side electrode bodies. | 2020-07-02 |
20200211817 | SYSTEMS AND METHODS FOR ETCHING A SUBSTRATE - A method of processing a workpiece may include forming a first layer on a first side of a base layer. The base layer may be part of a substrate including a plurality of layers. The method may also include forming a second layer on the first layer. A material of the second layer may include metal. The method may also include forming an opening in the second layer, forming an opening in the first layer by etching, and removing the second layer. The method may include dry etching of the first layer. | 2020-07-02 |
20200211818 | IN-LENS WAFER PRE-CHARGING AND INSPECTION WITH MULTIPLE BEAMS - A charged particle system may include a first charged particle beam source provided on a first axis, and a second charged particle beam source provided on a second axis. There may also be provided a deflector arranged on the first axis. The deflector may be configured to deflect a beam generated from the second charged particle beam source toward a sample. A method of operating a charged particle beam system may include switching between a first state and a second state of operating a deflector. In the first state, a first charged particle beam generated from a first charged particle beam source may be blanked and a second charged particle beam generated from a second charged particle beam source may be directed toward a sample. In the second state, the second charged particle beam may be blanked and the first charged particle beam may be directed toward the sample. | 2020-07-02 |
20200211819 | METHOD FOR CALIBRATING A SCANNING CHARGED PARTICLE MICROSCOPE - A method for calibrating a scanning charged particle microscope, such as a scanning electron microscope (SEM), is provided. The method includes dividing a wafer into a plurality of regions; preparing, on each of the plurality of regions, a pattern including a first periodic structure interleaved with a second periodic structure, the first and second periodic structures having an induced offset; determining an actual pitch the first and second periodic structures and thereby determining actual induced offset on each of the plurality of regions; selecting a plurality of regions from among the plurality of regions; measuring, by the SEM, a pitch of first and second periodic structures on each of the plurality of regions; and performing linearity calibration on the SEM based on the determining and the measuring. | 2020-07-02 |
20200211820 | METHOD FOR SCANNING A SAMPLE BY A CHARGED PARTICLE BEAM SYSTEM - A method for scanning a sample by a charged particle beam tool is provided. The method includes providing the sample having a scanning area including a plurality of unit areas, scanning a unit area of the plurality of unit areas, blanking a next unit area of the plurality of unit areas adjacent to the scanned unit area, and performing the scanning and the blanking the plurality of unit areas until all of the unit areas are scanned. | 2020-07-02 |
20200211821 | ELECTRON BEAM IRRADIATION DEVICE - An electron beam irradiation device that can irradiate an object in water with an electron beam is provided. An acceleration tube | 2020-07-02 |
20200211822 | AN IONIZATION CHAMBER CHIP FOR A NANO-APERTURE ION SOURCE, METHOD OF FABRICATION THEREOF, AND A PROTON BEAM WRITING SYSTEM - An ionization chamber chip, a nano-aperture ion source, a proton beam writing system, and a method of fabricating an ionization chamber chip. The method comprises the step of providing a first substrate comprising a first depression formed in a back surface thereof; providing a backing element attached at the back surface of the first substrate such that a chamber is formed comprising at least the first depression; forming a gas inlet in the first substrate in fluid communication with the chamber; and forming a first aperture structure in the first substrate in fluid communication with the chamber. | 2020-07-02 |
20200211823 | PLASMA PROCESSING APPARATUS AND CONTROL METHOD - A plasma processing apparatus includes: a processing container; an electrode that places a substrate thereon within the processing container; a plasma generation source that supplies plasma into the processing container; a bias power supply that supplies bias power to the electrode; a part exposed to the plasma in the processing container; a DC power supply that supplies a DC voltage to the part; a controller that executes a process including a first control procedure in which a first state in which the DC voltage has a first voltage value and a second state in which the DC voltage has a second voltage value higher than the first voltage value are periodically repeated, and the first voltage value is applied in a partial period in each cycle of a potential of the electrode, and the second voltage value is applied such that the first state and the second state are continuous. | 2020-07-02 |
20200211824 | Impedance Matching Device and Impedance Matching Method - An impedance matching device includes: a variable capacitor in which a plurality of first capacitance elements or a plurality of second capacitance elements are connected in parallel; a calculation unit that calculates an impedance or a reflection coefficient on the load side using information regarding the impedance acquired from the outside; and a control unit that determines an ON/OFF state to be taken by each of semiconductor switches included in the variable capacitor using the impedance or the reflection coefficient calculated by the calculation unit and turns on or off the semiconductor switches included in the first or second capacitance element based on the determined state. The control unit cyclically switches semiconductor switches to be turned on or off in a predetermined order. | 2020-07-02 |
20200211825 | FOCALIZED MICROWAVE PLASMA REACTOR - Provided is a focalized microwave plasma reactor. The reactor utilizes a cylindrical microwave resonant cavity of the quasi-TM | 2020-07-02 |
20200211826 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - A plasma processing apparatus includes a processing vessel; a placing table, serving as a lower electrode, disposed within the processing vessel; an upper electrode serving as a facing electrode of the placing table; a plasma processor configured to form a gas within the processing vessel into plasma by supplying a high frequency power and to process a processing target object on the placing table with the plasma; a cover member configured to cover the upper electrode from thereabove; a cooler provided within the cover member and configured to cool the upper electrode with a coolant having a temperature lower than a dew point temperature of exterior air outside the processing vessel; and a gas supply configured to supply a low-dew point gas having a dew point temperature lower than the dew point temperature of the exterior air into a space surrounded by the cover member and the upper electrode. | 2020-07-02 |
20200211827 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a chamber, a susceptor provided in the chamber, a shower plate having a plate part provided with a plurality of through holes and formed of a conductor, a ring-shaped part connected to an outer edge of the plate part, surrounding the plate part and formed of a conductor and a lead wire embedded in the ring-shaped part and surrounding the plate part and the susceptor in plan view, the shower plate being provided so as to face the susceptor in the chamber, and a DC power supply that supplies a direct current to the lead wire. | 2020-07-02 |
20200211828 | PLASMA PROCESSING APPARATUS - A plasma processing apparatus for processing a substrate using a plasma, comprising: a process chamber in which the processing takes place; a plasma source for providing a plasma to the process chamber; a substrate mount within the process chamber for holding the substrate, the substrate mount comprising a surface having a plurality of apertures. | 2020-07-02 |
20200211829 | IMAGING MASS SPECTROMETRY DEVICE, MASS SPECTROMETRIC METHOD, AND COMPUTER PROGRAM PRODUCT - An imaging mass spectrometry device includes: an ionization unit that ionizes a sample at a plurality of positions on the sample; a mass spectrometry unit that performs mass spectrometry on the ionized sample and detects fragment ions generated by dissociation of a precursor ion derived from the sample; a data acquisition unit that acquires intensity data in which intensities of a fragment ion are correlated with the plurality of positions on the sample; an image creation unit that creates image data in which a value obtained by integrating the intensity data corresponding to a plurality of different fragment ions generated from the same precursor ion is expressed by a pixel value or a pixel color at positions on an image respectively corresponding to the plurality of positions; and a display unit that displays an image corresponding to the image data. | 2020-07-02 |
20200211830 | METHOD FOR SIMULTANEOUS MULTICOMPONENT ANALYSIS USING MASS SPECTROMETRY AND MASS SPECTROMETER - In a simultaneous multicomponent analysis for a number of target compounds, an MRM transition which does not give the highest signal intensity but gives a lower signal intensity is selected for a compound having a high measurement sensitivity or a compound having a high measurement target concentration. If the signal intensity is still high, the level of collision energy (CE) is changed from an optimum level. The MRM transition, CE level and other measurement conditions determined for each compound in this manner are stored in a compound-related information storage | 2020-07-02 |
20200211831 | Method for Identification of the Monoisotopic Mass of Species of Molecules - A method for identification of the monoisotopic mass or a parameter correlated to the mass of the isotopes of the isotope distribution of at least one species of molecules contained in a sample and/or originated from a sample by at least an ionization process includes measuring a mass spectrum of the sample with a mass spectrometer, dividing at least one range of measured m/z values of the mass spectrum into fractions, assigning at least some of the fractions to one processor of several provided processors, deducing for each of the at least one species of molecules an isotope distribution of their ions having a specific charge z, deducing from at least one deduced isotope distribution the monoisotopic mass or a parameter correlated to the mass of the isotopes of the isotope distribution of the species of molecules. | 2020-07-02 |
20200211832 | Multipole Ion Optic Assembly - An ion optic assembly includes a set of conductive rods, a first insulator, and a second insulator. The rods are inserted into through-holes of the first insulator, which are arranged about an axis along which the rods are elongated. The rods are then inserted through a bore of the second insulator and become located in notches of the bore, which are arranged about the axis. Accordingly, the first insulator positions one end of the rods at a first distance from the axis, and the second insulator positions the other end of the rods at a second distance from the axis, which may equal to or different from the first distance. The rods contact, and may be spring-biased against, the notches. The assembly may include an electrical contact with fingers spring-biased into contact with the rods. Each insulator may include both through-holes and notches for additional rods. | 2020-07-02 |
20200211833 | SEAM-FREE SILICON NITRIDE GAP-FILL TECHNIQUES FOR HIGH ASPECT RATIO TRENCHES - An integrated circuit device includes: a semiconductor structure having a high aspect ratio (HAR) feature, the HAR feature having a depth of between 25 nanometers (nm) and 250 nm, a width of between 5 nm and 50 nm, and a depth-to-width aspect ratio of 5:1 or more; and a gap-fill material at least partially filling the HAR feature, the gap-fill material including silicon and nitrogen and being substantially free of a seam located between opposing sides of the HAR feature. A semiconductor process platform includes a nitrogen radical generator to generate nitrogen radicals for delivery to one of the zones, each zone being configured to deliver a separate precursor of a deposition cycle. A method of semiconductor device fabrication includes reacting surfaces of the HAR feature with a silicon precursor, and reacting the silicon-precursed surfaces with nitrogen plasma to form a monolayer of silicon nitride. | 2020-07-02 |
20200211834 | METHODS FOR FORMING FILMS CONTAINING SILICON BORON WITH LOW LEAKAGE CURRENT - Methods for forming the silicon boron nitride layer are provided. The method includes positioning a substrate on a pedestal in a process region within a process chamber, heating a pedestal retaining the substrate, and introducing a first flow of a first process gas and a second flow of a second process gas to the process region. The first flow of the first process gas contains silane, ammonia, helium, nitrogen, argon, and hydrogen. The second flow of the second process gas contains diborane and hydrogen. The method also includes forming a plasma concurrently with the first flow of the first process gas and the second flow of the second process gas to the process region and exposing the substrate to the first process gas, the second process gas, and the plasma to deposit the silicon boron nitride layer on the substrate. | 2020-07-02 |
20200211835 | ETCHING METHOD - The present disclosure relates to a method for forming a cavity that traverses a stack of layers including a bottom layer, a first portion of which locally presents an excess thickness, the method comprising a first step of non-selective etching and a second step of selective etching vertically in line with the first portion. | 2020-07-02 |
20200211836 | METHOD (AND RELATED APPARATUS) THAT REDUCES CYCLE TIME FOR FORMING LARGE FIELD INTEGRATED CIRCUITS - In some embodiments, a method for forming an integrated circuit is provided. The method includes forming a first layer over a semiconductor wafer, the first layer having a first portion and a second portion. The first portion is patterned by projecting a first image field over the first portion of the first layer, where the first portion of the first layer corresponds to the first image field. The second portion is patterned by projecting a second image field over the second portion of the first layer, where the second portion of the first layer corresponds to the second image field. A second layer is formed over the first layer. The second layer is patterned by projecting a third image field over the second layer, where the third image field covers a majority of the first portion and a majority of the second portion of the first layer. | 2020-07-02 |
20200211837 | SILICON DOPING FOR LASER SPLASH BLOCKAGE - Semiconductor devices having silicon doping for laser splash protection, along with associated methods and systems, are disclosed herein. In one embodiment, a semiconductor device includes a silicon layer and a circuitry layer with a plurality of semiconductor devices. A doped silicon region is formed on a front side of the silicon layer upon which the circuitry layer is deposited. The doped silicon region is positioned under the circuitry layer. The doped silicon region has a dopant concentration of at least 10 | 2020-07-02 |
20200211838 | Insulating Film Forming Method, Insulating Film Forming Device, and Substrate Processing System - A technique for obtaining good film quality in forming a silicon-oxide-containing insulating film as a coating film on a substrate. A coating liquid containing polysilazane is applied to a wafer, a solvent in the coating liquid is volatilized, and then the coating film is irradiated with ultraviolet rays under a nitrogen atmosphere before performing a curing process. Thus, dangling bonds are likely to be formed at hydrolyzed portions in polysilazane. Since dangling bonds are formed in advance at portions in silicon to be hydrolyzed, productivity of hydroxyl groups is enhanced. That is, since an energy required for hydrolysis is reduced, the number of the portions remaining without being hydrolyzed is reduced even when the curing process is performed at a low temperature. Therefore, dehydration synthesis occurs efficiently, which increases a crosslinking rate and makes it possible to form a dense (good film quality) insulating film. | 2020-07-02 |
20200211839 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES - The disclosed technology generally relates to semiconductor devices and methods of manufacturing semiconductor devices such as both logic and memory semiconductor devices. In one aspect, a semiconductor device includes a semiconductor substrate having a channel region between a source and a drain region, a gate structure arranged to control the channel region and a dielectric structure arranged between the channel region and the gate structure. The dielectric structure includes a high-k dielectric layer or a high-k ferroelectric layer and at least one two dimensional (2D) hexagonal boron-nitride (h-BN) layer in direct contact with the high-k dielectric layer or the high-k ferroelectric layer. | 2020-07-02 |
20200211840 | METHOD FOR PRODUCING THREE-DIMENSIONAL STRUCTURE, METHOD FOR PRODUCING VERTICAL TRANSISTOR, VERTICAL TRANSISTOR WAFER, AND VERTICAL TRANSISTOR SUBSTRATE - A method for producing a three-dimensional structure, a method for producing a vertical transistor, a vertical transistor wafer, and a vertical transistor substrate, capable of suppressing the emission of Si due to a heat treatment and making an interface between an oxide film and a core mainly consisting of Si relatively smooth include: forming a three-dimensional shape by processing (for example, by etching) a surface layer of a monocrystalline silicon substrate, the surface layer having an oxygen concentration of 1×10 | 2020-07-02 |