27th week of 2015 patent applcation highlights part 80 |
Patent application number | Title | Published |
20150189710 | LED DRIVING CIRCUIT, CONTROL CIRCUIT AND ASSOCIATED CURRENT SENSING CIRCUIT - A LED driving circuit, a control circuit and associated current sensing circuit. The control circuit has a sensing circuit, an estimation circuit, an amplifying circuit, a comparing circuit, a zero-cross detection circuit and a logic circuit. The sensing circuit is configured to sense a switching current flowing through at least one switch of a switching circuit to provide a first sensing signal. The estimation circuit is configured to process the first sensing signal to provide a feedback signal, wherein the feedback signal is indicative of a average current signal flowing through a LED. An average current flowing through the LED is regulated by sensing a switching current flowing through at least one switch. | 2015-07-02 |
20150189711 | LED CONTROLLER AND METHOD THEREFOR - In an embodiment, an LED controller is configured to form a charge transfer sequence to selectively enable LED transistors of a plurality of LED transistors that are configured for coupling in parallel with a plurality of LEDs. An embodiment may include that the LED controller is configured to sequentially couple a charge capacitor to a gate-to-source capacitor of each LED transistor of the plurality of LED transistors to one of charge or to refresh the gate-to-source capacitor of a respective LED transistor and to one of enable or re-enable the respective LED transistor wherein the gate-to-source capacitor is a parasitic gate-to-source capacitor of the LED transistor wherein the charge capacitor is sequentially coupled to the gate-to-source capacitor of each LED transistor. | 2015-07-02 |
20150189712 | LED LIGHTING ARRANGEMENT AND METHOD OF CONTROLLING A LED LIGHTING ARRANGEMENT - A lighting arrangement ( | 2015-07-02 |
20150189713 | LIGHT SOURCE MODULE AND LIGHT-EMITTING CONTROL METHOD - A light source module and a light-emitting control method are disclosed. The light source module includes light-emitting devices which periodically emit light by a period. The period includes time intervals corresponding to the light-emitting devices, respectively. The light-emitting control method includes driving each light-emitting device to emit light by an individual main power during its corresponding time interval, and driving each light-emitting device to emit light by a corresponding auxiliary power during each of the time intervals other than its corresponding time interval. Therein, for each time interval, the corresponding auxiliary power corresponding to the time interval is less than the individual main power of the light-emitting device corresponding to the time interval, and a value of the corresponding auxiliary power corresponding to the time interval divided by the individual main power of the light-emitting device corresponding to the time interval is not more than a corresponding limitation value. | 2015-07-02 |
20150189714 | Sensors with LED Light Sources - An apparatus includes a light emitting diode, a reference detector, and a control unit. The light emitting diode (LED) is configured to emit light along a beam path. The reference detector is configured to generate a signal characterizing an intensity of light emitted from the LED. The control unit coupled to the LED and is configured to selectively vary a driving current applied to the LED in response to the light detected by the reference detector and to maintain a substantially constant intensity of light emitted by the LED. Related apparatus, systems, techniques and articles are also described. | 2015-07-02 |
20150189715 | METHOD FOR CONTROLLING A MULTI-COLOR SIGNAL ASSEMPLY, AND MULTI-COLOR SIGNAL ASSEMBLY - A method for controlling a multi-color signal assembly with a multi-color LED, a connection for voltage supply, and a control input. The control input is connected to a control output of a first control unit for controlling the signal assembly by pulse-width modulation signals (PWM signals) or to a signal assembly control output by the bus communication. After a supply voltage U | 2015-07-02 |
20150189716 | LED BACKLIGHT DRIVING CIRCUIT AND LIQUID CRYSTAL DEVICE - A LED backlight driving circuit is disclosed. The LED backlight driving circuit includes a boost circuit for converting an input voltage to an output voltage for a LED unit, a driving IC for controlling the boost circuit such that the boost circuit converts the input voltage to the output voltage for the LED unit, a discharging module for releasing charges stored within the boost circuit after the driving circuit is turned off, and a detecting module for detecting a voltage at an output end of the boost circuit and then for generating enable signals for controlling the operations of the driving IC. The LED backlight driving circuit is capable of detecting a discharging state of the boost circuit after being quickly rebooted. The driving circuit can be rebooted only if the output voltage is smaller than a reference voltage as the charges stored within the boost circuit is released. As such, the flashing issue is avoided. In addition, the liquid crystal device including the above LED backlight driving circuit is also disclosed. | 2015-07-02 |
20150189717 | DISPLAY DEVICE - A display device includes a first substrate having flexibility, a second substrate having flexibility arranged facing the first substrate, a light emitting element arranged in a display region of the first substrate, and a filling material covering the light emitting element and extending from the display region to an end part of the first substrate and the second substrate. The filling material is a solid and is provided on the inner side from the first substrate and second substrate. | 2015-07-02 |
20150189718 | TRANSPARENT INORGANIC THIN-FILM ELECTROLUMINESCENT DISPLAY ELEMENT AND METHOD FOR MANUFACTURING IT - An inorganic, transparent thin film electroluminescent display element with a display area having at least one emissive area and at least one non-emissive area, improved in terms of transparency and inconspicuousness is provided, as well as a method for its preparation. The structure according to the invention comprises a substrate ( | 2015-07-02 |
20150189719 | LUMINAIRE EXECUTING SCRIPTS FOR DYNAMIC ILLUMINATION - A luminaire produces lighting as a series of frames of constant spectral content. The luminaire includes an interpreter for executing scripts that describe the spectral contents of respective frames. The scripts may include spectral data and executable code for altering the spectral data. In particular, a frame descriptor may include data for a frame, a repeat count indicating a number of frames, and an identifier for a subroutine to be called for each frame described by the frame descriptor. One or more luminaires can be network connected to one or more computers running applications providing user interfaces for script generation. A standardized interface can control communications with the luminaires and convert scripts from applications to a format that luminaires can interpret. | 2015-07-02 |
20150189720 | HOLIDAY LIGHTS DOCKING STATION - The present invention pertains to a customizable electronic, mobile or other device connection having a dock, plug in, or other communication (including wireless) that communicates between devices which generate music or other type of communication, or that has its own storage capacity for such music or other communication; such device thereafter signaling to a light source, such as a holiday light strand, certain phases, impulses, signals to such lights to create a visual effect having causal connection to light patterns with the music or other audible or sub-audible communication. | 2015-07-02 |
20150189721 | CONTROL DEVICE FOR USE WITH A THREE-WAY LAMP SOCKET - A control device may be configured to be installed in a three-way screw-in socket that includes multi-position switches. The control device may be configured to control one or more lighting loads in response to the respective positions of the multi-position switches of the three-way screw-in socket. The lighting loads may include a lighting load that is integral with the control device, a lighting load that is installed in a threaded receptacle of the control device, and/or one or more lighting loads controlled by respective devices that are associated with the control device. The control device may include a wireless communication circuit that is configured to transmit messages in response to operation of the multi-position switches into respective positions. The control device may be configured to control the lighting loads in response to messages received at the wireless communication circuit. | 2015-07-02 |
20150189722 | LIGHTING MODULE HAVING SURFACE LIGHT SOURCE AND LIGHTING SYSTEM - A lighting module includes: a surface light source; a drive control section receiving a light emission control command transmitted from a master device via a communication line, and driving and controlling the surface light source in accordance with control data for its own, the control data being included in the received light emission control command; and an ON-OFF switch to be connected to the communication line, wherein the ON-OFF switch is joined integrally with the surface light source and the drive control section. | 2015-07-02 |
20150189723 | METHOD FOR CONTROLLING MOBILE TERMINAL AND PROGRAM FOR CONTROLLING MOBILE TERMINAL - A method for controlling a mobile terminal that includes a display and a memory, and that controls one or more lighting devices that illuminate one or more spaces. The method causes a computer of the mobile terminal and includes obtaining terminal location information indicating a location of the mobile terminal, rearranging one or more scene icons corresponding to the one or more scenes on the basis of the terminal location information and the one or more pieces of scene location information, displaying the rearranged one or more scene icons on the display, and transmitting, if one of the one or more scene icons is selected by a user, a control signal for controlling the one or more lighting devices to the one or more lighting devices, so that the one or more spaces are illuminated in an illumination state indicated by a scene corresponding to the selected scene icon. | 2015-07-02 |
20150189724 | CONTROLLING LIGHT INTENSITY AT A LOCATION - A mobile device that is configured for wireless communication may be configured to operate as a remote control device in a lighting control system, controlling one or more lighting control devices of the lighting control system. The remote control device may control the light intensity in a space, for instance at a location of the remote control device, in response to an ambient light intensity measured at the remote control device. The remote control device may define a user interface for receiving an input that indicates a desired light intensity at the location. The remote control device may measure the ambient light intensity at the location via a light detector, compare the measured ambient light intensity to the desired light intensity, and cause the one or more lighting control devices to adjust the ambient light intensity at the remote control device until it agrees with the desired light intensity. | 2015-07-02 |
20150189725 | FACEPLATE REMOTE CONTROL DEVICE FOR USE IN A LOAD CONTROL SYSTEM - A faceplate remote control device may be attached to a wall-mounted mechanical light switch that has a toggle actuator. The faceplate remote control device may include a toggle indicator that detects operation of the toggle actuator of the mechanical switch. The toggle indicator may cause the generation of an indication of detected operation of the toggle actuator. The toggle indicator may comprise a sliding member that is configured to move with the toggle actuator. The toggle indicator may comprise an obstruction detection device that includes an infrared (IR) transmitter and an IR receiver. The faceplate remote control device may include a control circuit and a wireless communication circuit. The control circuit may be configured to cause the wireless communication circuit to transmit one or more messages in response to detecting operation of the toggle actuator of the mechanical switch. | 2015-07-02 |
20150189726 | Wall-Mountable Wireless Remote Control Device - A wall-mountable remote control device may be installed in place of an existing light switch and may be configured to transmit wireless signals to an electrical load device, such as a screw-in light-emitting diode (LED) lamp, to provide control of the electrical load device. The remote control device may comprise an air-gap switch adapted to be electrically coupled in series between a power source and the controllable light source, but may not comprise a bidirectional semiconductor switch for controlling the amount of power delivered to the electrical load device using a phase-control dimming technique. The remote control device may have a low-profile enclosure that is smaller than an enclosure of a standard dimmer switch, and thus may be easier to install in an electrical wallbox. The remote control device may comprise two parts including an air-gap switch device and a wireless communication device mounted to the air-gap switch device. | 2015-07-02 |
20150189727 | ESD PROTECTION COMPONENT - An ESD (ElectroStatic Discharge) protection component has: first and second discharge electrodes arranged so as to be opposed to each other through a gap; and a discharge inducing portion kept in contact with the first and second discharge electrodes and configured to connect the first and second discharge electrodes to each other. The discharge inducing portion has metal particles, a ceramic material containing glass, and a dielectric material having a dielectric constant higher than that of the ceramic material. A content of the dielectric material is in the range of 7.5 to 40% by volume, with respect to a total volume of the ceramic material and the dielectric material. | 2015-07-02 |
20150189728 | Extreme Ultraviolet Light Source - A first remaining plasma that at least partially coincides with a target region is formed; a target including target material in a first spatial distribution to the target region is provided, the target material including material that emits EUV light when converted to plasma; the first remaining plasma and the initial target interact, the interaction rearranging the target material from the first spatial distribution to a shaped target distribution to form a shaped target in the target region, the shaped target including the target material arranged in the shaped spatial distribution; an amplified light beam is directed toward the target region to convert at least some of the target material in the shaped target to a plasma that emits EUV light; and a second remaining plasma is formed in the target region. | 2015-07-02 |
20150189729 | TARGET FOR LASER PRODUCED PLASMA EXTREME ULTRAVIOLET LIGHT SOURCE - Techniques for generating EUV light include directing a first pulse of radiation toward a target material droplet to form a modified droplet, the first pulse of radiation having an energy sufficient to alter a shape of the target material droplet; directing a second pulse of radiation toward the modified droplet to form an absorption material, the second pulse of radiation having an energy sufficient to change a property of the modified droplet, the property being related to absorption of radiation; and directing an amplified light beam toward the absorption material, the amplified light beam having an energy sufficient to convert at least a portion of the absorption material into extreme ultraviolet (EUV) light. | 2015-07-02 |
20150189730 | METHOD FOR GENERATING EXTREME ULTRAVIOLET LIGHT AND DEVICE FOR GENERATING EXTREME ULTRAVIOLET LIGHT - An extreme ultraviolet light generation device may comprise: a chamber provided with a through-hole; an introduction optical system configured to introduce the pulse laser beam into a first predetermined region inside the chamber through the through-hole; a target supply device configured to output the target toward the first predetermined region; a light source configured to irradiate a second predetermined region with light whose optical path in the second predetermined region has a transverse section that is longer along a direction perpendicular to a direction of movement of the target than along the direction of movement of the target, the second predetermined region including part of a trajectory of the target between the target supply device and the first predetermined region; and an optical sensor configured to detect light incident on the optical sensor from the second predetermined region to detect the target passing through the second predetermined region. | 2015-07-02 |
20150189731 | Neutron Generator - A neutron generator includes an ion source disposed in a pressurized environment containing an ionizable gas. The ion source includes a substrate with a bundle of carbon nanotubes extending therefrom. The ends of the nanotubes are spaced from a grid. Ion source voltage supply circuitry supplies a positive voltage potential between the substrate and the grid of the ion source to cause ionization of the ionizable gas and emission of ions through the grid. An ion accelerator section is disposed between the ion source and a target. The ion accelerator section accelerates ions that pass through the grid towards the target such that collisions of the ions with the target cause the target to generate and emit neutrons therefrom. The ion source, accelerator section and target are housed in a sealed tube and preferably the carbon nanotubes of the bundle are highly ordered with at least 10 | 2015-07-02 |
20150189732 | TRANSPARENT ELECTRODE AND ORGANIC ELECTRONIC ELEMENT USING SAME - Disclosed is a transparent electrode which is configured of: a first conductive layer that is composed of a metal or metal oxide fine wire that is formed in a pattern on a substrate; and a second conductive layer that covers the first conductive layer and contains a conductive polymer. The transparent electrode is characterized in that the fine wire of the first conductive layer satisfies the conditions mentioned below. Also disclosed is an organic electronic element. Line width (W): 20-200 μm Height (H): 0.2-2.0 μm Aspect ratio: 0.0012015-07-02 | |
20150189733 | ELECTRONIC CONTROL UNIT AND ELECTRIC POWER STEERING APPARATUS HAVING THE SAME - An electronic control unit includes a board, a high-heat-generating device, a controller, a heat-dissipating member, and a heat-conducting member. The high-heat-generating device is mounted on a surface of the board. The heat-dissipating member has a surface located facing the surface of the board. The surface of the heat-dissipating member is recessed to form a recess capable of holding the high-heat-generating device. The heat-conducting member is located between the board and the heat-dissipating member and in contact with both the high-heat-generating device and the recess to transfer the heat of the high-heat-generating device to the heat-dissipating member. The recess is shaped to match a shape of the high-heat-generating device. | 2015-07-02 |
20150189734 | ELECTRONIC CONTROL UNIT AND ELECTRIC POWER STEERING APPARATUS HAVING THE SAME - An electronic control unit includes a board, a heat-generating device, a connector, and a heatsink. The board has an insulating layer and a wiring pattern partially exposed outside the insulating layer. The heat-generating device is mounted on the board and electrically connected to the wiring pattern. The connector is located adjacent to the heat-generating device and has a connection terminal connected to the wiring pattern. The heatsink is located opposite to the board across the heat-generating device and in contact with the heat-generating device to dissipate heat of the heat-generating device. The wiring pattern has a land pattern including a mount portion and a connection portion. The heat-generating device is mounted on the mount portion. The connection terminal of the connector is connected to the connection portion. | 2015-07-02 |
20150189735 | RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board includes: a flexible substrate having a flexible region and a plurality of rigid regions; a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region; and a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern, wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers. | 2015-07-02 |
20150189736 | FLEXIBLE ELECTRONIC MODULE - A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component. | 2015-07-02 |
20150189737 | METHOD FOR MANUFACTURING CONDUCTIVE PATTERN AND DEVICE HAVING CONDUCTIVE PATTERN - A conductive pattern forming method includes forming a conductive layer on a substrate. An organic pattern including a plurality of fillers condensed in a network shape is formed on the conductive layer. A conductive pattern to which the shapes of the plurality of fillers condensed in the network shape are transferred is formed by dry-etching the conductive layer using the organic pattern as a mask. The organic pattern is eliminated. | 2015-07-02 |
20150189738 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole. | 2015-07-02 |
20150189739 | PCB AND DISPLAY DEVICE HAVING THE PCB - A printed circuit board (PCB) and a display device having the PCB include a substrate including a first surface that packages electronic components and a second surface opposite to the first surface, and a conductive foil that attaches to the second surface of the substrate. The conductive foil is divided into a plurality of blocks, and spacer regions are arranged between the blocks, where the spacer regions are configured with wires for electrical connection. | 2015-07-02 |
20150189740 | REINFORCING-PLATE-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD - The present invention provides a stiffener-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the stiffener from being detached during a reflow process. The stiffener-integrated flexible printed circuit board including: (A) a stiffener, (B) a thermosetting adhesive, (C) an insulator film, and (D) a wiring-pattern-equipped film, (A) the stiffener, (B) the thermosetting adhesive, (C) the insulator film, and (D) the wiring-pattern-equipped film being laminated in this order, (C) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range. | 2015-07-02 |
20150189741 | FORMING METHOD OF STRETCHABLE SUBSTRATE, STRETCHABLE SUBSTRATE AND ELECTRONIC DEVICE HAVING STRETCHABLE SUBSTRATE - There is provided a stretchable substrate including: a substrate having first Young's modulus and stretchability; and plurality of strain control patterns having second Young's modulus and arranged on the substrate, in which strain due to an external force depends on arrangement of the plurality of strain control patterns. | 2015-07-02 |
20150189742 | SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF - A suspension board with circuit includes a metal supporting layer and an insulating layer formed on the metal supporting layer. The insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion. | 2015-07-02 |
20150189743 | PHOTO-PATTERNABLE DIELECTRIC MATERIALS AND FORMULATIONS AND METHODS OF USE - Silsesquioxane polymers, silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers, and structures made from silsesquioxane polymers. | 2015-07-02 |
20150189744 | THERMOSETTING RESIN COMPOSITION AND USAGE THEREOF - The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level. | 2015-07-02 |
20150189745 | EPOXY RESIN COMPOSITION, AND, PREPREG AND COPPER CLAD LAMINATE MANUFACTURED USING THE COMPOSITION - The present invention relates to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition comprises components as follows: an epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain, a phosphorus-containing halogen-free flame retardant compound and an active ester hardener; the amount of the epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain is 100 parts by weight, the amount of the phosphorus-containing halogen-free flame retardant compound is 10-150 parts by weight. The equivalent ratio of the amount of the active ester hardener, based on the ratio between epoxy equivalent and active ester equivalent, is 0.85-1.2. The prepreg and the copper-clad laminate made by using the epoxy resin composition have excellent dielectric performance, moisture-heat resistant performance, simultaneously have a high glass transition temperature and a lower water absorption rate and simultaneously realize halogen-free flame retardancy, achieving UL-94V-0. | 2015-07-02 |
20150189746 | PREPREG AND USES OF THE SAME - A prepreg is provided. The prepreg is prepared by immersing a reinforcing material into a resin composition and drying the immersed reinforcing material, wherein the resin composition has a first dielectric constant and comprises a thermosetting resin component, a hardener and a filler. The reinforcing material has a second dielectric constant, and the ratio of the first dielectric constant to the second dielectric constant ranges from 0.8 to 1.05. | 2015-07-02 |
20150189747 | THERMOSETTING RESIN COMPOSITION AND USE THEREOF - The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability. | 2015-07-02 |
20150189748 | COPPER FILM-FORMING AGENT AND METHOD FOR FORMING COPPER FILM - The present invention is a copper film-forming agent containing a copper complex composed of a copper formate and a 5-membered or 6-membered nitrogen-containing heterocyclic compound having from 1 to 3 nitrogen atoms, in which the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in a substituent is from 1 to 5, and an element other than a carbon atom in the compound is not bonded to a hydrogen atom. | 2015-07-02 |
20150189749 | PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF - A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud. | 2015-07-02 |
20150189750 | PACKAGE SUBSTRATES AND INTEGRATED CIRCUIT PACKAGES INCLUDING THE SAME - Packages substrates are provided. The package substrates may include a substrate and a set of leads disposed on the substrate. The set of lead may include a first lead, a second lead and a third lead, which are sequentially disposed along a first direction. Each of the first lead, the second lead and the third lead may extend along a second direction that is different from the first direction. The first lead and the second lead may be spaced apart at a first distance, and the second lead and the third lead may be spaced apart at a second distance that is less than the first distance. | 2015-07-02 |
20150189751 | WIRING BOARD, METHOD FOR FABRICATING THE SAME, AND ELECTRONIC APPARATUS - A wiring board includes a conductor formed on an inner wall of a through hole made in a core board, resin formed inside the conductor in the through hole, and, for example, a land formed over the conductor and the resin. Vias are formed over the land. The vias are connected to a plurality of connection regions of the land extending over the conductor and the resin in the through hole. The land is held by the vias connected to the plurality of connection regions. This controls the thermal expansion of the resin to a land side and therefore prevents a fracture of the land. | 2015-07-02 |
20150189752 | WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR - A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion. | 2015-07-02 |
20150189753 | STRESS-TOLERANT INTERCONNECTIONS FOR CONNECTIVITY IN WEARABLE ELECTRONICS PLATFORMS - Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices configured to facilitate communication among electronic devices, including mobile phones and media devices that present audio and/or video content. More specifically, disclosed are wearable systems, platforms and methods for providing stress-tolerant interconnections to enhance signal connectivity reliability in a wearable device. In various embodiments, a wearable electronics platform can include circuit substrates and interconnect portions disposed coextensive with a longitudinal surface between the circuit substrates. An interconnection portion can include conductors having one or more stress-relief features, and an elastic material encapsulating the conductors. In some examples, the longitudinal surface including the interconnects and the circuit substrates can be configured to substantially encircle an axis. The axis can coincide with a body part or an appendage, such as a wrist. | 2015-07-02 |
20150189754 | PRINTED CIRCUIT BOARD COPPER PLANE REPAIR - A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board. | 2015-07-02 |
20150189755 | DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME - Disclosed herein is a flexible printed circuit board configured to extend from a display panel to a source printed circuit board, and connect the display panel and the source printed circuit board. The flexible printed circuit board is provided with a slit extending longitudinally in an extension direction thereof, to reduce damage to the flexible printed circuit board that may occur by a force acting on the flexible printed circuit board when the display panel is bent. | 2015-07-02 |
20150189756 | MODULE, MODULE COMBINED BODY AND MODULE PRODUCTION METHOD - A module comprises a first insulating-substrate-side member that has a first insulating substrate, a first conductor layer provided on the first insulating substrate, and a first electronic element provided on the first conductor layer; a second insulating-substrate-side member that has a second insulating substrate, a second conductor layer provided on a lower side of the second insulating substrate, and a second electronic element provided on a lower side of the second conductor layer; and a sealing member that is provided between the first insulating substrate and the second insulating substrate. The first electronic element and the second electronic element are opposingly disposed. The first electronic element and the second electronic element are connected by an element connecting conductor post that has electric conductivity. | 2015-07-02 |
20150189757 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity. | 2015-07-02 |
20150189758 | METHOD FOR MANUFACTURING TOUCH DEVICE AND RESIN COMPOSITION THEREOF - A touch device, a method for manufacturing a touch device and a resin composition used in the method are discussed. The touch device includes a substrate including a surface roughness of less than 1.2 nm, a touch sensor formed on a surface of the substrate, and a flexible printed circuit board attached to the substrate. | 2015-07-02 |
20150189759 | MICROVIA PAD REPAIR - A method of repairing a microvia assembly comprising a pad disposed on and in electrical conductive contact with a microvia where at least a portion of the pad is missing from the assembly 10. Conductive material comprising nanocopper is provided on the microvia in at least a portion of a region where the missing portion of the pad was located. A prefabricated replacement pad may be provided on the microvia in a region where a missing pad of the microvia assembly 10 was located, and the replacement pad attached to the microvia by providing a conductive material between the microvia and the replacement pad. | 2015-07-02 |
20150189760 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A flexible printed circuit board (PCB) used for near field communication and a method for manufacturing the flexible PCB are provided. The flexible PCB includes an insulating layer; a first conductive circuit layer adhered on a surface of the insulating layer, the first conductive circuit layer includes at least one first conductive circuit arranged as spiral-shaped and defines a plurality of first spaces; a first resin layer is adhered on a surface of the insulating layer and fills the first spaces; and a first cover layer adhered on a surface of the first resin layer and a surface of the first conductive circuit layer away from the insulating layer. | 2015-07-02 |
20150189761 | METHOD FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK - A method for forming a conductive pattern on a substrate deposits, onto a surface of the substrate, a nanoparticle ink that comprises nanoparticles of a conductive or semiconductor material, at least one low boiling point solvent, and from 0.1 weight % to 50 weight % of a high boiling point solvent. The method forms a partially wet patterned substrate by drying the deposited nanoparticle ink to a wetness range between about 3 weight % and 8 weight % solvent. The method directs a patterned illumination of laser light to cure the deposited ink pattern on the partially wet patterned substrate. | 2015-07-02 |
20150189762 | COATING COMPOSITION, COMPOSITE PREPARED BY USING THE COATING COMPOSITION AND METHOD FOR PREPARING THE SAME - A coating composition, a composite prepared by using the coating composition, and a method for preparing the composite are provided. The coating composition includes a solvent, an adhesive, and a catalyst precursor including at least one chosen from SnO | 2015-07-02 |
20150189763 | Method for Embedding at Least One Component in a Printed Circuit Board - The invention relates to a method for embedding at least one component in a printed circuit board, comprising the steps of providing a lower metal conductor foil applied to a first metal supporting layer, forming recessed alignment marks in the conductor foil, applying an adhesive layer in a registered manner in relation to the alignment marks and fitting a component via the rear face thereof on the adhesive layer with upwardly pointing connection areas, curing the adhesive layer, embedding the component in an insulting layer, applying a metal upper conductor foil and an upper metal supporting layer, consolidating the structure, removing the supporting layers, exposing the alignment marks of the lower conductor foil by removing the insulating layer, producing cutouts ending at the lower conductor foil, producing bores to the connection areas of the component in a registered manner in relation to the alignment marks, and applying a conductor layer to the upper face of the structure, producing contact connections in the bores to the connection areas of the component, and structuring the conductor layer in order to produce conductive tracks. | 2015-07-02 |
20150189764 | PREPARATION METHOD OF A THIN POWER DEVICE - A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the through opening with a back metal layer at a back surface of the semiconductor chip attached on the third contact pad, and a plurality of conductive structures electrically connecting electrodes at a front surface of the semiconductor chip with the corresponding first contact pads in the first sets of first contact pads. | 2015-07-02 |
20150189765 | FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS - Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein. | 2015-07-02 |
20150189766 | MOUNTING STRUCTURE FOR CIRCUIT BOARD - A mounting structure in a power supply chassis includes a mounting portion and a securing portion. The mounting portion is located on a first sidewall of the power supply chassis. The mounting portion includes a first protruding plate for supporting a circuit board, a second protruding plate parallel to the first protruding plate, and a positioning portion to receive the circuit board. The positioning portion is located between the first protruding plate and the second protruding plate. The securing portion includes a resilient portion extending into the positioning portion. When the circuit board is installed in the power supply chassis, the circuit board is received in the positioning portion and supported by the first protruding plate, with the resilient portion engaged in a securing hole defined in the circuit board. | 2015-07-02 |
20150189767 | Metal Mosaic Housing - A housing for an electronic device and a method for manufacturing the housing are provided that combine metal and plastic in an aesthetically pleasing manner while meeting physical and technical requirements and specifications for the electronic device. Metal islands may be engaged with a plastic member so that projections of the plastic member are interlocked with corresponding recesses of formed between each of the metal islands. An exterior of the housing includes a surface of each of the metal islands and at least a portion of a surface of the plastic member. The interior of the housing includes another surface of the plastic member. | 2015-07-02 |
20150189768 | Curved Display - Embodiment related to a curved display including a curved panel, a printed circuit board separated from the curved panel, and a plurality of flexible films electrically connecting the curved panel and the printed circuit board. The lengths of the flexible films is increased as the flexible films approach an edge of the curved panel. | 2015-07-02 |
20150189769 | HOUSING FOR PORTABLE ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A housing of portable electronic device includes a glass member and a plastic member formed in the glass member. The glass member includes a base plate, a plurality of sidewalls substantially vertically extending from the base plate. Each two neighboring sidewalls form a gap portion. The base plate includes a first inner surface, and each sidewall includes a second inner surface and an outer surface opposite the second inner surface. The plastic member fit closely against the first inner surface and the second inner surface. The plastic member further includes at least one protrusion portion positioned at the outer surface of the sidewalls and covered above at least one of the gap portions. A method of manufacturing the housing is also provided. | 2015-07-02 |
20150189770 | System for Attaching RFIDs on Tires - A system for attaching RFIDs on tires is herein disclosed. In this embodiment, the system for attaching RFIDs on a tire comprises a base, and an RFID housing. The base comprising an orifice. The base capable of affixing to a tire. The RFID housing capable of substantially fitting within the orifice. | 2015-07-02 |
20150189771 | STAND ASSEMBLIES FOR PORTABLE ELECTRONIC DEVICES - Adjustable stand assemblies for portable electronic devices are provided, which allow portable electronic devices to stand-alone in multiple incline positions in both portrait and landscape orientations. | 2015-07-02 |
20150189772 | SEMICONDUCTOR PACKAGE AND METHOD THEREFOR - In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package. | 2015-07-02 |
20150189773 | COVER OPENING STRUCTURE - A cover opening structure including a case, a cover, a pushing button, a pushing unit and an axle is provided. The cover has a first portion having a first side, a second portion having a second side connected to the case, and a connecting portion connected therebetween, wherein the connecting portion is softer than the first and second portions. The pushing button disposed on the case has a body and an inserting portion extended from the body. The pushing unit has a first end, a second end and a leaning portion connected therebetween and is inserted between the body and the first end. The axle is disposed at the case while the leaning portion leans against the axle. The pushing unit rotates about the axle while the first end moves downward and the second end moves upward to push up the first portion when the pushing button is moved. | 2015-07-02 |
20150189774 | METHOD AND APPARATUS FOR OPERATING A TRAY MECHANISM - A tray mechanism for a device housing includes a tray bed having a planar surface with first and second opposing sides that form a boundary around the planar surface, wherein the first opposing sides include a front side and a back side, wherein the front side is configured with dimensions for closing an opening of a cavity within the device housing, and wherein the second opposing sides are configured for a slideable attachment within the cavity of the device housing. The tray mechanism further includes a lever positioned on the planar surface of the tray bed and a hinge mechanism that pivotally connects the lever to the planar surface of the tray bed. A method for operating the tray mechanism includes a convex side of the lever rolling against the device housing as the lever rotates to eject the tray bed pivotally connected to lever from the device housing. | 2015-07-02 |
20150189775 | ELECTRONIC COMPONENT HOUSING CONTAINER AND ELECTRONIC DEVICE - An electronic component housing container includes a container body housing an electronic component inside a cavity constituted by a bottom plate and a side wall which surrounds a center region of the bottom plate, and an input-output terminal. The input-output terminal includes an insulation member, a pin terminal, and a ring-like member. The insulation member is bonded to a periphery of an opening of a through hole provided in the side wall so as to close the through hole. The pin terminal has a flange portion protruding from an outer peripheral surface thereof, and is pierced through the insulation member. The flange portion is bonded to the insulation member. The ring-like member is bonded to the outer peripheral surface of the pin terminal and to the insulation member, on an opposite side to a surface of the insulation member to which the flange portion is bonded. | 2015-07-02 |
20150189776 | ELECTRONIC APPARATUS AND COVER MECHANISM THEREFOR - An electronic apparatus includes an apparatus casing, using a cover mechanism, and a device unit, disposed inside the apparatus casing. The apparatus casing includes a casing body, a pivotal device, a pivot locking mechanism, and a door. The casing body structurally constrains the door to move in a direction at a side of the casing body. After sliding, the door is engaged with the pivotal device and drives the pivot locking mechanism to unlock the pivotal device so that the door can rotate to another side of the casing body by the pivotal device relative to the casing body. A manipulation area of the casing body is therefore exposed. Thereby, a user can manipulate the device unit through the manipulation area; the inner surface of the door keeps facing toward the casing body so that the apparatus casing can keep its aesthetic appearance. | 2015-07-02 |
20150189777 | TRANSMISSION STABILIZATION DEVICE APPLIED TO DUAL-SHAFT SYSTEM - A transmission stabilization device applied to dual-shaft system for stabilizing and smoothening the transmission and reducing wear of the components. The transmission stabilization device includes a first rotary shaft, a second rotary shaft and a transmission unit, which are assembled with each other. Each of the first and second rotary shafts has a fixed section mounted on an electronic apparatus, a pivoted section assembled with a torque module and a connection section. The transmission unit is drivingly engaged with the connection sections. The transmission unit is mounted on a fixing shaft. When the first or second rotary shaft rotates, the transmission unit is moved along the fixing shaft with the rotation of the first or second rotary shaft. The transmission stabilization device can prevent the transmission unit from swinging so as to overcome the problem of retardation of transmission of the conventional device. | 2015-07-02 |
20150189778 | SHEET PROCESSING APPARATUS - A sheet processing apparatus includes: a main body accommodating a controller; an opening and closing member including an electrical part and pivotable about a pivot axis with respect to the main body between a closed position and an open position is exposed; a hinge disposed between the main body and the opening and closing member and at least partly constituting the pivot axis; and a flexible cable connecting between the electrical part and the controller. The opening and closing member includes a side wall for covering the electrical part from a hinge side of the electrical part. The side wall has an opening formed at a position opposite the flexible cable extending from the opening and closing member to the main body. The hinge includes a cover portion configured to cover a portion of the flexible cable which is exposed through the opening. | 2015-07-02 |
20150189779 | ELECTRONIC DEVICE - When the lid is rotated in the closing direction toward the first predetermined state from a second predetermined state where the lid is in an open state and the outer lid at a locked position, the projection of the outer lid and a wall portion of the case are brought into contact with each other in the gap, an inclined surface is formed on at least one of a portion, which is brought into contact with the wall portion of the case, of the projection of the outer lid and a portion, which is brought into contact with the projection of the outer lid, of the wall portion of the case, wherein the inclined surface is formed in an inclined manner such that as the inclined surface is farther from the axis of rotation, the inclined surface becomes farther from the predetermined surface. | 2015-07-02 |
20150189780 | CASE FOR A PORTABLE ELECTRONIC DEVICE HAVING AN INTERFACE TO PROVIDE FOR TRANSMISSION OF DATA BEWTEEN THE PORTABLE ELECTRONIC DEVICE AND AN EXTERNAL DEVICE - Provided is a case for a portable electronic device including a first surface, a second surface, and sides between the first surface and the second surface, wherein the portable electronic device has an input socket and is adapted to electrically connect to an external electronic device. The case includes a cover portion adapted to couple to the first surface of the portable electronic device; a first interface at a first location on the cover portion to electrically couple to the input socket of the portable electronic device; a second interface at a second location on the cover portion adapted to electrically couple to the external electronic device; and a cable coupled to the first and second interfaces adapted to transmit data between the first interface and the second interface. | 2015-07-02 |
20150189781 | MULTI-POSITION STAND FOR ELECTRONIC DISPLAY DEVICES - The present invention is a multi-position stand for supporting an electronic display device in one or more usage configurations and comprises: a first receiving panel configured to support the electronic display; a second receiving panel attached to the first receiving panel, the second receiving panel configured to support a second electronic display; and a base panel attached to the first receiving panel and to the second receiving panel to form a substantially triangular cylinder with a hand access opening within the multi-position stand. | 2015-07-02 |
20150189782 | ELECTRICAL DEVICE HAVING A FINGERPRINT/SCRATCH PREVENTING STRUCTURE AND A METHOD OF MANUFACTURING THE SAME - An electrical device having a fingerprint/scratching prevention structure in order to prevent the occurrence of fingerprints and scratching on the surface of metal parts of electrical devices such as card sockets or connectors, etc., is disclosed. The electric device has the property of forming concavo-convex irregularities on all or part of the surface of a metal part by embossing, so that fingerprints are not left and scratches do not occur on the surface of the metal part. | 2015-07-02 |
20150189783 | WIRING DEVICE FOR WIRING AN ELECTRONIC APPARATUS - A wiring device for wiring an electronic apparatus including an interface, a conductor track and a component fitting island that is connected to the interface via the conductor track that is set up to carry an electronic component and to make electrical contact with the interface via the electrical conductor track, wherein the component fitting island is free of a web element that is set up to hold the component fitting island on a support element during a housing process housing the component fitting island. | 2015-07-02 |
20150189784 | Electric Circuit Apparatus and Method for Producing Electric Circuit Apparatus - An electric circuit apparatus includes a power module ( | 2015-07-02 |
20150189785 | CASING AND SERVER HAVING THE CASING - A casing for fixing a plate member includes a casing body having opposite first and second side plates, and a clamping member having a resilient plate disposed on an inner side of the second side plate, at least one abutment arm protruding inwardly from the resilient plate and adapted to abut against a first surface of the plate member, and an engaging piece proximate to the abutment arm and adapted to releasably engage a second surface of the plate member. The first side plate and the resilient plate are respectively adapted to abut against first and second ends of the plate member for clamping therebetween the plate member. The resilient plate is pullable to move the engaging piece away from the second surface of the plate member. | 2015-07-02 |
20150189786 | RACKLESS COMPUTING EQUIPMENT CONSTRUCTION - A self-supporting server chassis accepts blade server computing devices, and other like computing devices and associated infrastructure hardware, and also provides structural support for vertical stacking of such self-supporting server chassis, thereby eliminating the need for conventional racks. Internal support structures, such as rails, holes and standoffs, accept and provide physical support for the computing devices and other infrastructure hardware. Vertical stacking support structures provide physical stability and rigidity for stacking multiple self-supporting server chassis in a vertical direction, and allow interconnection among self-supporting server chassis. Stacks of self-supporting server chassis can comprise a base member with casters or other like transportation hardware, as well as a top member that provides further structural stability and rigidity, as well as providing cooling and airflow benefits, such as airflow containment. Ranking hardware in the self-supporting server chassis accommodates computing devices and infrastructure hardware that were designed for installation into a traditional rack. | 2015-07-02 |
20150189787 | MODULAR, SCALABLE, EXPANDABLE, RACK-BASED INFORMATION HANDLING SYSTEM - A modular, scalable and expandable (MSE) rack-based information handling system (RIHS) includes: a rack assembly having a frame that defines: a front bay chassis with height, depth and width dimensions that enable insertion of a plurality of different sizes of IT gear; and a rear bay that accommodates power and cooling components to support operation of the different sizes of IT gear. The power and cooling for the IT gear are provided from the rear bay and are separate from and independent of the IT gear installed within the front bay chassis. The rack assembly further includes a power and management chassis in which is inserted a power and management module having power and management components located thereon to provide rack-level power and management. A modular configuration of fan modules are inserted within fan receptacles within the rear bay to provide block level cooling of adjacent blocks of IT gear. | 2015-07-02 |
20150189788 | TRANSMISSION-BASED TEMPERATURE CONTROL FOR AN ELECTRICAL DEVICE - A method includes estimating a temperature change to an integrated circuit, which is associated with a pending transmission from the integrated circuit. The method includes, based on the estimated temperature change, regulating at least one parameter that is associated with the pending transmission to maintain a temperature of the integrated circuit below a temperature threshold | 2015-07-02 |
20150189789 | HEAT RADIATION MEMBER FOR ELECTRONIC DEVICE - A heat radiation member for an electronic device includes: a housing comprising an internal cavity; graphite in the internal cavity; and one or more spring members in the internal cavity and overlapping the graphite. | 2015-07-02 |
20150189790 | ELECTRIC POWER CONVERTOR - An electric power converter includes a stacked semiconductor unit formed by stacking semiconductor modules and cooling tubes, and a case. The case has a rear wall portion, a front wall portion, and a pair of side wall portions. The rear wall portion has an opening hole formed in a shape that an outer profile of the cooler fits inside. The stacked semiconductor unit has a closing member joined to a rear-most cooling pipe that is disposed on a rear side to close the opening hole, a refrigerant introducing pipe extended rearward from the closing member, and a refrigerant discharging pipe extended rearward from the closing member. The refrigerant introducing pipe and the refrigerant discharging pipe, and the closing member are connected in close contact with each other, and the closing member and the case are in close contact by a seal section. | 2015-07-02 |
20150189791 | RADIATOR FOR LIQUID-COOLED-TYPE COOLING DEVICE AND METHOD OF MANUFACTURING THE SAME - A radiator for a liquid-cooled-type cooling device includes a plurality of elongated rectangular fin plates and rod-shaped connection members. The fin plates are disposed, while being separated from one another in the thickness direction, such that their width direction coincides with the vertical direction. The connection members extend in a direction intersecting with the longitudinal direction of the fin plate, and connect and unite all the fin plates together. A first cutout is formed in an upper side edge portion of each fin plate, and a second cutout is formed in a lower side edge portion thereof at a position shifted from the first cutout in the longitudinal direction of the fin plate. The connection members are press-fitted into the first and second cutouts such that they do not project from the cutouts, whereby all the fin plates are connected and united together by the connection members. | 2015-07-02 |
20150189792 | Apparatus and Methods for Processing Exfoliated Graphite Materials - Methods and apparatus for processing flexible graphite sheet material involve patterning the material, on at least one major surface, prior to further processing of the material such as densification, lamination, folding or shaping into three-dimensional structures. For densification and lamination, the patterning is selected to facilitate the removal of air from the flexible graphite sheet material during the densification and lamination process. For folding or shaping, the patterning is selected to render the graphite sheet material more flexible. In some embodiments, methods for increasing the through-plane conductivity of flexible graphite sheet material are employed. Integrated heat removal devices include sheets of graphite material that have been selectively patterned in different regions to impart desirable localized properties to the material prior to it being shaped or formed into an integrated heat removal device. Coatings and/or resin impregnation can also be used to impart desirable properties to the material or device. | 2015-07-02 |
20150189793 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a housing, a heat transfer member, a heat absorption member and a fin group. The housing includes a top plate. The heat transfer member is spaced from the top plate. The heat transfer member and the housing together define a cavity. The heat transfer member defines a receiving space. The receiving space is configured to receive liquid. The heat absorption member is attached to the heat transfer member. The heat absorption member is in heat transferable contact with the electronic element to absorb heat generated by the electronic element and transfer the heat to the heat transfer member. The fin group is received in the cavity and touches the heat transfer member. The fin group dissipates the heat on the heat transfer member. | 2015-07-02 |
20150189794 | ELECTRONIC CONTROL UNIT AND ELECTRIC POWER STEERING APPARATUS HAVING THE SAME - In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region. | 2015-07-02 |
20150189795 | SERVER ASSEMBLY - A server assembly includes a first server and a second server sharing the cooling provided by one or more fans. The first server is stacked on the second server. The first server includes a first bottom plate having vents, a first side plate having first air inlets, and a first back plate having air outlets. The fans are mounted to the first server. The second server includes a second bottom plate, a second side plate having second air inlets, and a second back plate. The servers are configured to dissipate heat from the first server by air that enters the first server and is expelled out of the air outlets by the fans, and to dissipate heat from the second server by air that enters the second server, enters the first server from the vents, and is expelled out of the air outlets by the fans. | 2015-07-02 |
20150189796 | METHOD OF OPERATING A COOLING APPARATUS TO PROVIDE STABLE TWO-PHASE FLOW - A method of operating a cooling apparatus is described that allows flexible cooling lines connecting an inlet manifold to an outlet manifold to be safely added or removed during operation of the cooling apparatus without causing unstable two-phase flow. The method can include providing a cooling apparatus having an inlet manifold, an outlet manifold, and a bypass extending from the inlet manifold to the outlet manifold. Each manifold can include a plurality of connection ports, such as quick-connect couplers, to accommodate adding and removing cooling lines between the inlet manifold and the outlet manifold. The method can include providing a flow rate of single-phase liquid coolant to the inlet manifold and setting a pressure regulator in the bypass to provide a certain flow rate through the bypass. The flow rate through the bypass can be determined as a function of an average flow rate through each of the cooling lines. | 2015-07-02 |
20150189797 | MAGNETIC FIELD SHIELDING FOR PACKAGING BUILD-UP ARCHITECTURES - Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated with the build-up to a target device configured to operate in the field. In embodiments, a first device is physically coupled to the build-up. In embodiments, a magnetic field shielding material is disposed in contact with the build-up and in proximity to the first device to restrict a magnetic field either to a region occupied by the first device or to a region exclusive of the first device. A field shielding material may be disposed within build-up near a permanent magnet also within the build-up to reduce exposure of another device, such as an IC, to the magnetic field without reducing MEMS device exposure. | 2015-07-02 |
20150189798 | ESD PROTECTION COMPONENT - An ESD protection component includes opposite electrodes and a ground electrode. The opposite electrodes and the ground electrode each have an extraction portion and an opposite portion. The respective opposite portions of the opposite electrodes and the ground electrode are placed on the same layer. At least one of the opposite electrodes and the ground electrode, the extraction portion and the opposite portion are placed on respective different layers and, also, are electrically connected to each other via a through hole conductor. | 2015-07-02 |
20150189799 | ELECTROMAGNETIC SHIELDING - An apparatus and a method of manufacturing the apparatus is provided. The apparatus comprises: a first electromagnetic shielding layer; a second electromagnetic shielding layer; at least one sensing layer, positioned between the first electromagnetic shielding layer and the second electromagnetic shielding layer, comprising an array of touch sensors and multiple traces for connecting the touch sensors to touch sensing circuitry; and at least one electromagnetic shielding wall, extending from the first electromagnetic shielding layer to the second electromagnetic shielding layer, for shielding one or more of the multiple traces from conductive user input objects. | 2015-07-02 |
20150189800 | ASSEMBLING APPARATUS FOR WORKPIECES - A assembling apparatus includes an electric cabinet, a manipulator, a conveying assembly, and a distribution assembly. The manipulator is controlled by the electric cabinet. The conveying assembly includes a vibration plate and a guide rail, the vibration plate is controlled by the electric cabinet. The distribution assembly includes a driving apparatus, a distribution board, and a connection board, the driving apparatus is directed by the electric cabinet, the guide rail is connected between the vibration plate and the connection board, and the distribution board is connected to the driving apparatus. The vibration plate conveys workpieces to the guide rail, the driving apparatus drives the distribution board to communicate with the connection board, the workpieces pass through the connection board and the distribution board, and the manipulator lifts the workpieces from the distribution board. | 2015-07-02 |
20150189801 | COMPONENT SUPPLY UNIT - To provide a component supply unit capable of reliably cutting a cover tape and reliably exposing an electronic component when using a new storage tape and supplying the electronic component. A tape processing unit includes a cutter successively cutting a cover tape of a storage tape along a traveling direction following traveling of this storage tape. The cutter includes a blade portion having an angular blade portion so inclined frontwardly downward that a blade is angularly formed, and an upper C-chamfered surface (upper worked surface) which is a flat portion whose width in the horizontal direction gradually narrows from a lower end upwardly to reach the angular blade portion on an upper end formed on a forward end portion of this blade portion. | 2015-07-02 |
20150189802 | CONDUCTING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface. | 2015-07-02 |
20150189803 | Peach Tree Named 'Burpeachthirtythree' - A new and distinct variety of peach tree ( | 2015-07-02 |
20150189804 | Peach Tree Named 'Burpeachthirtyfour' - A new and distinct variety of peach tree ( | 2015-07-02 |
20150189805 | BLACKBERRY PLANT NAMED 'DRISBLACKEIGHT' - This invention relates to a new and distinct variety of blackberry plant named ‘DrisBlackEight’, particularly characterized by medium to high yields, long production season and self-fruitful plants, is disclosed. | 2015-07-02 |
20150189806 | Lantana Plant Named 'MANUEL'S RED' - A new and distinct | 2015-07-02 |
20150189807 | Lantana Plant Named 'Lady Brooks' - A new and distinct | 2015-07-02 |
20150189808 | LANTANA PLANT NAMED 'LORD BROOKS' - A new and distinct | 2015-07-02 |
20150189809 | Pittosporum plant named 'SEASIDE' - A new and distinct | 2015-07-02 |