27th week of 2009 patent applcation highlights part 32 |
Patent application number | Title | Published |
20090168287 | STATIC ELIMINATOR AND DISCHARGE ELECTRODE UNIT BUILT THEREIN - There is provided a static eliminator capable of weakening an electric field between a discharge electrode and a ground electrode, to generate a strong electric field between the discharge electrode and a workpiece, in which a first-stage circumferential chamber, a second-stage circumferential chamber and a first gas pool are arrayed in series along the longitudinal direction of a discharge electrode, the first gas pool is disposed in the mode of diametrically overlapping a gas outflow channel for shielding located on the inner circumferential side of the first gas pool, a gas is supplied to the first gas pool through the chambers disposed at multi-stages by means of the circumferentially spaced multi-stage orifices (the first and second chases), a ground electrode plate member in plate shape is buried in an insulating resin member on the bottom surface side of the half base in a position as high as where the first gas pool is located, and the ground electrode plate member includes a circular ring section concentric with the discharge electrode. | 2009-07-02 |
20090168288 | STATIC ELIMINATOR - There is provided a static eliminator for accurately detecting a contamination condition of a discharge electrode, in which a target value as a target frame ground current value is changed from, for example, zero as a reference alternately to the plus side and the minus side to such a degree as not to affect the ion balance of a workpiece, and the follow-up time, namely a phase delay, with respect to the change in target value differs depending on the contamination condition of the discharge electrode, and becomes longer with the progress of the contamination, and by use of this characteristic, a plurality of thresholds are prepared and compared with a detected frame ground current value, so as to detect the contamination condition of the discharge electrode. | 2009-07-02 |
20090168289 | STATIC ELIMINATOR AND DISCHARGE ELECTRODE UNIT BUILT THEREIN - There is provided a static eliminator capable of improving a sheath effect exerted by shielding a leading end of a discharge electrode by a clean gas so as to prevent the leading end of the discharge electrode from being contaminated, in which a first-stage circumferential chamber, a second-stage circumferential chamber and a first gas pool are arrayed in series along the longitudinal direction of a discharge electrode, the first gas pool is disposed in the mode of diametrically overlapping a gas outflow channel for shielding located on the inner circumferential side of the first gas pool, and a clean gas is supplied to the first gas pool through the chambers disposed at multi-stages by means of the circumferentially spaced multi-stage orifices (the first and second chases). | 2009-07-02 |
20090168290 | BATTERY CLIP WTIH INTEGRATED MICROPROCESSOR RESET SWITCH AND METHOD OF OPERATING - Disclosed is a battery clip for resetting an electronic device when one or more batteries are removed from a battery compartment. The battery compartment may be included in, or coupled with, the electronic device. A method of operating the battery clip is also described. | 2009-07-02 |
20090168291 | ELECTROSTATIC CHUCK AND SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICE - There is provided an electrostatic chuck for placing an adsorption object or a base body having an electrostatic electrode embedded therein and generating a coulombic force between the adsorption object and the electrostatic electrode by applying a voltage to the electrostatic electrode so as to hold the adsorption object in an adsorption state, wherein the base body includes a upper surface of the base body opposed to the adsorption object and a protrusion portion provided in the upper surface of the base body so as to come into contact with the adsorption object, and wherein the protrusion portion is provided in a region except for an outer edge portion of the upper surface of the base body, and the outer edge portion is substantially formed in the same plane as that of the upper surface of the base body. | 2009-07-02 |
20090168292 | ELECTROSTATIC CHUCK AND SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICE - There is provided an electrostatic chuck for adsorbing and holding an adsorption object placed on an upper surface of a base body having an electrostatic electrode embedded therein and for filling inert gas of which a pressure is adjusted into a space formed between the upper surface of the base body and a lower surface of the adsorption object, wherein the base body includes a gas discharge portion embedded therein so as to discharge the inert gas to the space and a gas path embedded therein so as to introduce the inert gas into the gas discharge portion while communicating with the gas discharge portion. | 2009-07-02 |
20090168293 | Pad in Semicondcutor Device and Fabricating Method Thereof - A pad in a semiconductor device and fabricating method thereof are disclosed. The pad includes an uppermost metal layer first to N | 2009-07-02 |
20090168294 | CAPACITOR - A capacitor according to an embodiment can include a first dielectric layer; a first metal layer disposed below the first dielectric layer; a second dielectric layer disposed below the first metal layer; a second metal layer disposed below the second dielectric layer; a third dielectric layer disposed below the second metal layer; and a third metal layer disposed below the third dielectric layer and electrically connected to the first metal layer. | 2009-07-02 |
20090168295 | MULTILAYER CAPACITOR HAVING HIGH ESR - A first inner electrode has a first main electrode, a first lead conductor, a first coupling conductor, and a second lead conductor A second inner electrode has a second main electrode, a third lead conductor, and a second coupling conductor. A third inner electrode has a third main electrode, and a fourth lead conductor. The third inner electrode is connected to only a first connection conductor. In the extending direction of the first and third lead conductors, the first and second coupling conductors have a length shorter than the lengths of the first and third lead conductors and of the first and second main electrodes, respectively. The second inner electrode is adjacent to at least one of the first and third inner electrodes so as to sandwich the insulating layer | 2009-07-02 |
20090168296 | THROUGH-TYPE MULTILAYER CAPACITOR ARRAY - A multilayer capacitor array comprises a capacitor body, and two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, one first outer connecting conductor, and one second outer connecting conductor. The capacitor body includes first and, second signal inner electrodes, and first to third grounding inner electrodes. The first signal inner electrode is arranged to oppose the first or third grounding inner electrode with at least one insulator layer therebetween, while the second signal inner electrode is arranged to oppose the second or third grounding inner electrode with at least one insulator layer therebetween. The first and second signal inner electrodes, and first and second grounding inner electrodes are connected to the first and second signal terminal electrodes, and first and second outer connecting conductors, respectively. The third grounding inner electrode is connected to the grounding terminal electrodes and the first and second outer connecting conductors. | 2009-07-02 |
20090168297 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - Embodiments relate to a semiconductor device and a method for manufacturing the same. According to embodiments, a method may include forming a multilayer dielectric film on and/or over a lower metal line and forming an upper metal layer on and/or over the multilayer dielectric film. A semiconductor device fabricated by the method may include a lower metal line, a multilayer dielectric film including a plurality of layers laminated in this order on and/or over the lower metal line, and an upper metal layer arranged on and/or over the multilayer dielectric film. Accordingly, a semiconductor device may achieve a high-capacitance (i.e. not less than 6 fF/um | 2009-07-02 |
20090168298 | THROUGH-TYPE MULTILAYER CAPACITOR ARRAY - A through-type multilayer capacitor array comprises a capacitor body, and two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, a first outer connecting conductor, and a second outer connecting conductor. The capacitor body includes a grounding inner electrode, and first to fourth signal inner electrodes. The grounding inner electrode is arranged to oppose the first or second signal inner electrode with an insulator layer in between and oppose the third or fourth signal inner electrode with an insulator layer in between while being connected to the grounding terminal electrodes. The first signal inner electrode is connected to the first signal terminal electrodes and first outer connecting conductor. The third signal inner electrode is connected to the second signal terminal electrodes and the second outer connecting conductor. The second and fourth signal inner electrodes are respectively connected to the first and second outer connecting conductor. | 2009-07-02 |
20090168299 | METHOD FOR THE PRODUCTION OF A COATING OF A POROUS, ELECTRICALLY CONDUCTIVE SUPPORT MATERIAL WITH A DIELECTRIC, AND PRODUCTION OF CAPACITORS HAVING HIGH CAPACITY DENSITY WITH THE AID OF SAID METHOD - The present invention relates to a method for producing a coating of a porous, electrically conductive substrate material with a dielectric by using a solution of precursor compounds of the dielectric with a concentration of less than 10 wt. %, expressed in terms of the contribution of the dielectric to the total weight of the solution, and to the production of capacitors using this method. | 2009-07-02 |
20090168300 | High-voltage capacitor - A high-voltage capacitor is used to transmit energy and has an insulator housing, wherein at least two serially connected capacitors, which are mounted in parallel, are arranged. Said capacitors are made of, respectively, a serial connection of individual capacitors which are embodied as stackable capacitor elements. The resulting high-voltage capacitor is compact and economical. Each capacitor element comprises several individual capacitors which are maintained in an isolated manner, whereby the number corresponds to the number of serially connected capacitors, such that said serially connected capacitors are formed by one stack of capacitor elements. | 2009-07-02 |
20090168301 | Functionalized Nanotube Material for Supercapacitor Electrodes - The present teachings are directed towards supercapacitors including an electrode composed of a functionalized carbon nanotube-containing material, and also an organic electrolyte solution. The organic electrolyte solution can contain a non-aqueous solvent and an ionic salt, examples of non-aqueous solvent include propylene carbonate, ethylene carbonate, sulfolane and acetonitrile. The functional groups present on the carbon nanotubes can include hydroxyl groups, carboxyl groups, alkoxyl groups and mixtures thereof. | 2009-07-02 |
20090168302 | Electrochemical capacitor with carbon nanotubes - An electrolytic capacitor includes a first electrode, a second electrode opposite to the first electrode, a separator sandwiched between the first electrode and the second electrode, a cell accommodating the first electrode, the second electrode and the separator, and an electrolytic solution filled into the inner space of the cell, with the first electrode, the second electrode and the separator immersed into the electrolytic solution. The first electrode and second electrode are in a CNT film structure, and the CNT film structure includes a number of CNT films stacked and packed closely by van der Waals attractive force. Each CNT film includes a number of aligned CNTs, and an angle between the aligned directions of CNTs of any two adjacent CNT film is in an approximate range from 0 to 90 degrees. The electrolytic capacitor is a high-performance capacitor. | 2009-07-02 |
20090168303 | CAPACITOR DEVICE WITH THIN INTERPOSER - A capacitor device comprises a capacitor element and an interposer. The capacitor element has a connection surface and comprises an anode electrode and a cathode electrode. The anode electrode and the cathode electrode are formed, at least in part, on the connection surface. The interposer comprises an insulator substrate, a plurality of first anode terminals, a plurality of first cathode terminals, a second anode terminal, a second cathode terminal, an anode through-hole and a cathode through-hole. The insulator substrate has first and second surfaces and has no inner conductive layer. The first anode terminals and the first cathode terminals are formed on the first surface. The first anode terminals are more in number than the anode electrode of the capacitor element. The first cathode terminals are more in number than the cathode electrode of the capacitor element The second anode terminal and the second cathode terminal are formed on the second surface. The second anode terminal is connected to the anode electrode. The second cathode terminal is connected to the cathode electrode. The anode through-hole and the cathode through-hole are formed in the insulator substrate. The anode through-hole connects between the first anode terminals and the second anode terminal. The cathode through-hole connects between the first cathode terminals and the second cathode terminal. | 2009-07-02 |
20090168304 | Stacked solid electrolytic capacitor - The present invention provides a stacked solid electrolytic capacitor that allows further reducing ESR by increasing the number of stacked layers. The stacked solid electrolytic capacitor according to the present invention is a stacked solid electrolytic capacitor having a plurality of stacked solid electrolytic capacitor elements, and each solid electrolytic capacitor element comprises an anode formed of a valve action metal, an anode section formed on an end of the anode, a dielectric formed on the surface of the valve action metal and comprising an oxide of the valve action metal, and a cathode layer formed on the dielectric. The cathode layers and the anode sections of the solid electrolytic capacitor elements are respectively connected to each other across the plurality of stacked solid electrolytic capacitor elements. A conductive layer extending in the stacking direction is formed on at least part of a side face of an area where the cathode layers of the solid electrolytic capacitor elements are formed. | 2009-07-02 |
20090168305 | Capacitors with Low Equivalent Series Resistance - An electric double layer capacitor (EDLC) in a coin or button cell configuration having low equivalent series resistance (ESR). The capacitor comprises mesh or other porous metal that is attached via conducting adhesive to one or both the current collectors. The mesh is embedded into the surface of the adjacent electrode, thereby reducing the interfacial resistance between the electrode and the current collector, thus reducing the ESR of the capacitor. | 2009-07-02 |
20090168306 | Load center with displaceable wiring plates - A load center enclosure with displaceable end wall plates for easily accessing the wall cavity above and below the load center and adding additional electrical conductors in post installation applications. | 2009-07-02 |
20090168307 | MECHANICAL PACKAGING APPARATUS AND METHODS FOR AN ELECTRICAL ENERGY METER - An electric meter comprises an electronics housing and a meter base. The electronics housing defines a front panel and includes a first plurality of option board guides. A main meter board is disposed substantially parallel to the front panel. The meter base defines a rear panel of the electric meter. The meter base includes a plurality of housing guides for receiving the electronics housing and a second plurality of option board guides disposed substantially perpendicularly to the rear panel. The second plurality of option board guides are adapted to receive an option board and to position the option board substantially perpendicularly to the main meter board of the electronics housing during assembly of the electronics housing to the meter base. The housing guides in combination with the first and second pluralities of option board guides enable blind assembly of the electronics housing to the meter base. | 2009-07-02 |
20090168308 | PORTABLE ELECTRONIC DEVICE MOUNT - A portable electronic device mount provides a secure attachment point for a personal navigation device, or other electronic device. The mount provides access to the device electronics through interface ports and feature connectors. The mount connects to an attachment mechanism that firmly and reliably attaches the mount to a windshield or other surface. The mount also includes a flexible linkage through which the mounted device may be securely oriented over a wide range of positions. In addition, extendible and retractable extension arms help achieve a compact form factor for convenient carrying and storage of the mount. | 2009-07-02 |
20090168309 | SEALING A CONTROL DEVICE - A housing comprising at least one electrical connection through a housing wall that is particularly inexpensive to produce and allows the electronic components located on the internal face and the external face of the housing to be attached in a particularly variable manner. The electrical connection is directly surrounded by housing material while being additionally sealed by means of sealing material. The inventive housing seal is provided with a profiled seal encompassing at least two sealing lips. The sealing material is additionally used for sealing the cover and/or the bottom relative to the housing wall. The arrangement is also particularly well protected against oil and other aggressive media as a combination of housing material and sealing material is used for surrounding the electrical connection. | 2009-07-02 |
20090168310 | DISPLAY APPARATUS - In a display apparatus ( | 2009-07-02 |
20090168311 | Housing for an electronic apparatus - A housing for an electronic apparatus includes a first cover having at least one wedging hook, a second cover having at least one wedging structure that matches at the least one wedging hook, and a third cover having at least one convex block. The convex block of the third cover extends into the wedging structure of the second cover to lock with the wedging hook of the first cover with the wedging structure. The housing can be applied to a cell phone, PDA and other electronic apparatus. | 2009-07-02 |
20090168312 | SUPPORT DEVICE AND ELECTRONIC EQUIPMENT SYSTEM - According to one embodiment, a support device includes: an electronic equipment guide section that guides an electronic equipment to be attached; a connector connectable to the electronic equipment guided by the electronic equipment guide section; a board on which the connector is mounted; a horizontal support section that supports the board movably in an in-plane direction of a side of the board, the side of the board on which the connector is mounted; a horizontal movement regulation section that regulates a movement of the board in the in-plane direction, being provided in a peripheral area of the board distant from the connector; and a vertical support section that supports the board movably in a direction perpendicular to the in-plane direction. | 2009-07-02 |
20090168313 | HOUSING OF ELECTRONIC DEVICES AND METHOD - A method for making a housing ( | 2009-07-02 |
20090168314 | GASKET, SCREEN SPACER, AND DISPLAY DEVICE WITH GASKET AND SCREEN SPACER - A gasket includes an elastic member absorbing an external shock, a conductive member surrounding the elastic member, and a reinforcing member disposed within the conductive member and extending along a bottom surface and a side surface of the conductive member. A screen spacer includes an elastic member absorbing an external shock, and a reinforcing member disposed on one side of the elastic member. A display device includes a driving circuit substrate supplying a driving signal to a display panel, a chassis receiving the display panel and the gasket attached to the driving circuit substrate and contacting the chassis, the gasket grounding the driving circuit and the chassis. | 2009-07-02 |
20090168315 | KEYBOARD - A keyboard includes a main body including a plurality of input keys and a hanger mounted on the main body including a hook for hanging the keyboard. | 2009-07-02 |
20090168316 | ELECTRONIC APPARATUS - An electronic apparatus has a first electronic component, a housing frame, a housing cover and a flexible printed circuit. The first electronic component has a connector. The housing frame has a wall to define a position in which the first electronic component is mounted. The housing cover contains the first electronic component in cooperation with the housing frame. The flexible printed circuit has a first end connected to the connector of the first electronic component, and the flexible printed circuit is interposed in a folded state between the first electronic component and the housing cover. | 2009-07-02 |
20090168317 | PORTABLE ELECTRONIC DEVICE HAVING AUXILIARY INPUT UNIT - A moving element having secondary keyboard for a portable electronic device is placed between a first member and a second member of the device for providing different keyboard sets to improve readability of text when in different operating configurations. When the second member slides out laterally relative to the first member, the moving element remains stayed in the first member, not moving with the second member. When the second member slides out vertically relative to the first member, the moving element slides with the second member along the sliding groove on the first member, and the moving element is exposed on top of the second member to present a concise dialing keyboard. The secondary keyboard contacts corresponding buttons of a primary keyboard directly. Thus, there is no need to provide additional circuit module exclusively for the secondary keyboard such that the cost and volume can be reduced. | 2009-07-02 |
20090168318 | Organic light emitting diode display - An organic light emitting diode (OLED) display has an increased mechanical strength by improving the shape of a bezel combined to a panel assembly. The OLED display includes a panel assembly having a display area and a pad area, and a bezel accommodating the panel assembly. The bezel includes a bottom part on which the panel assembly is mounted, a side wall provided on a side of the bezel, and a hemming flange provided at another side of the bezel on which the side wall is not provided. The panel assembly is mounted in a manner that the pad area is turned towards the another side. | 2009-07-02 |
20090168319 | DISPLAY, FRONT COVER THEREOF, MOLD OF FRONT COVER, AND MANUFACTURING METHOD FOR FRONT COVER - The present invention provides a display improved in an exterior appearance by a front cover, and a manufacturing method thereof, wherein the front cover covers a display panel and includes a translucent layer which transmits colored light, and a transparent layer to receive and transmit the colored light, wherein the translucent layer and the transparent layer are integrally formed. The front cover may be capable of implementing a natural tone variation thereon. | 2009-07-02 |
20090168320 | DISPLAY DEVICE - A display panel stand holding portion for supporting the display panel in the standing position is formed at the upper end portion of the back cabinet as a part of the casing of the display device. The display panel stand holding portion includes the display panel stand mount portion, and the display panel support members. This makes it possible to support the display panel vertically when it is mounted on the display panel stand mount portion. The connector cables extending from the power supply circuit board is clamped to the temporary holding portion to be formed on the back cabinet before assembly of the display panel to be inclined at the predetermined position. The deterioration in the working efficiency caused by entanglement of the connector cables may be prevented. | 2009-07-02 |
20090168321 | DISPLAY DEVICE - The present invention provides a display device that facilitates product inspection and maintenance. A button section is mounted to a back cabinet, and a power-source circuit board is fitted into a circuit-board fitting slit. Furthermore, the power-source circuit board is locked and fixed by a first circuit-board locking claw, and a main circuit board is locked and fixed by a second circuit-board locking claw. A speaker integrally assembled in a speaker holder is locked and fixed by a speaker locking claw, and thereafter a display panel is caused to be held by a display panel standing holding portion in a standing manner. The wire connection work of a display panel, each of the circuit boards, and the like is performed, the display panel is brought down and placed on a display panel placement portion, a front cabinet is mounted, and a leg portion is mounted to a leg-portion mounting portion. | 2009-07-02 |
20090168322 | SEMICONDUCTOR MEMORY CARD - The semiconductor memory card related to the present invention is arranged with a plurality of semiconductor memory packages, a controller chip which controls the plurality of semiconductor memory packages, and a substrate mounted with the plurality of semiconductor chips on one surface and the controller chip mounted on the other surface corresponding to a position in which the external force of the first surface is concentrated. | 2009-07-02 |
20090168323 | MOUNTING APPARATUS FOR STORAGE DEVICE - A mounting apparatus for mounting a data storage device with a sliding member attached thereon, includes a bracket and a latch member slidably mounted on the side plate. The bracket includes a side plate. The side plate defines a slideway for slidably receiving the sliding member of the data storage device. The latch member includes a resilient tab. The latch member is slidable on the side plate between a first position wherein the resilient tab is located at a halfway of the slideway so as to block the sliding member from passing therethrough, and a second position wherein the resilient tab is located outside the slideway so as to allow the sliding member to pass therethrough. | 2009-07-02 |
20090168324 | DATA STORAGE SYSTEM WITH HEAT DISSIPATING MODULE - A data storage system includes a data storage device, a control panel, and a heat dissipating module. The data storage device includes a cage and a plurality of disk drives, wherein the disk drives are accommodated in the cage. The control panel includes a plurality of ventilation holes and a control circuit. The control panel is located at a side of the cage. The control panel is connected to the dissipating module. The control circuit of the control panel is configured to sense the temperature of the data storage device and control power to the heat dissipating module accordingly to dissipate heat of the disk drives. | 2009-07-02 |
20090168325 | Disk fixing structure - A disk fixing structure containing a disk having at least one hole in a bottom thereof is provided. The disk fixing structure includes a first fixing device and a second fixing device. The first fixing device has a surface disposing thereon the disk, at least one protrusion mounted on the surface for being lodged in the at least one hole, and a plurality of first engaging elements arranged on each of two opposite edges of the surface which correspond to two sides of the disk. The second fixing device has two lateral plates opposite to each other, and a plurality of second engaging elements disposed on each of the two lateral plates, and engaging with the plurality of first engaging elements. | 2009-07-02 |
20090168326 | DISK DRIVE MOUNTING APPARATUS - A mounting apparatus is used to secure a disk drive, which defines a mounting hole therein. The mounting apparatus includes a bracket and a mounting member. The bracket is configured for receiving the disk drive therein. A through hole is defined in the bracket. A locking tab is formed on the bracket. The mounting member includes two arms and an operating portion. One end of each of the arms is pivotably secured on the bracket so that the mounting member is pivotable relative to the bracket, and the other end thereof connects with the operating portion. A positioning portion is formed on the operating member. The operating portion is capable of engaging with the locking tab of the bracket for inserting the positioning portion into the mounting hole of the disk drive via the through hole of the bracket. | 2009-07-02 |
20090168327 | Security mechanism of a base - The present invention relates to a security mechanism of a base, which is substantially a base. One side surface of the base is provided with a plurality of connecting ports for peripheral devices. The base is provided thereon with a trough and a retaining strip. The trough is provided therein with a connecting port. The retaining strip is disposed above one side of the trough so as to form a guard, thereby increasing the safety of the base and the performance of the computer host. | 2009-07-02 |
20090168328 | SERVER CHASSIS WITH ACCESS FLAP - The invention relates to an access flap for shielding an opening defined in a server chassis. that the access flap includes a rotating plate, a sliding plate, and a resilient member. The rotating plate is pivotably mounted to a side of the opening of the server chassis. The rotating plate defines a plurality of first air holes therein. The sliding plate is slidably attached to the rotating plate. The sliding plate defines a plurality of second air holes therein. The resilient member includes two ends connected to the rotating plate and the sliding plate. The rotating plate can rotate and the sliding plate can slide when a functional module passes through the opening to enter into the server chassis. Thereby, he second air holes of the sliding plate are aligning with the first air holes of the rotating plate. | 2009-07-02 |
20090168329 | Devices with faraday cages and internal flexibility sipes - A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising a semiconductor wafer having a multitude of microchips. The multitude of microchips forming a plurality of independently functioning computers, each computer having independent communication capabilities. | 2009-07-02 |
20090168330 | ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT - An electronic device includes an enclosure ( | 2009-07-02 |
20090168331 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first surface, a first heat generating component mounted on the first surface, a second heat generating component mounted on the second surface, a radiator section located off the circuit board, a first heat transfer member extending along the first surface and provided between the first heat generating component and the radiator section, and a second heat transfer member extending along the second surface and provided between the second heat generating component and the radiator section. | 2009-07-02 |
20090168332 | AIR MOVER FOR DEVICE SURFACE COOLING - Embodiments disclosed herein include an apparatus that includes an component capable of generating heat, an external wall with an interior surface, an air mover to be positioned to generate airflow between the interior surface of the external wall and the component. A vent may then be formed within the external wall to provide for a volume of air for the air mover to create airflow between the interior surface and the component. In some embodiments, the vent may be positioned in relation to the air mover to deflect at least a portion of the heat from the component from reaching the external wall. In some embodiments, a louvered portion may be included; and may be formed on the air mover or at the vent in the external wall. Other embodiments are described. | 2009-07-02 |
20090168333 | INFORMATION PROCESSING APPARATUS AND FAN CONTROL METHOD - According to one embodiment, an information processing apparatus includes: a case; a device that is housed in the case; a cooling fan that cools the device; a temperature detecting device that detects a temperature of the device; and a controller that is operable in a first mode and second mode, the first mode controlling the cooling fan in a range from a stopped state to a given rotation speed in accordance with the temperature detected by the temperature detecting device, and a second mode controlling the cooling fan to rotate at a predetermined rotation speed that is lower than the given rotation speed. | 2009-07-02 |
20090168334 | SLIDING MECHANISM FOR PORTABLE ELECTRONIC DEVICE - An exemplary sliding mechanism ( | 2009-07-02 |
20090168335 | HOUSING OF FOLDABLE ELECTRONIC DEVICE - An exemplary housing of a foldable electronic device includes a first cover, a second cover, a latching member, a contact member, and a resilient member. The first cover includes a lock receiving portion. The second cover includes a fixing portion. The latching member includes a pivot hole, a first transmission portion, and a lock portion configured for engaging with the lock receiving portion. The pivot hole engages with the fixing portion such that the latching member is rotatable relative to the fixing portion. The contact member includes a second transmission portion. The second transmission portion engages with the first transmission portion and is able to drive the latching member to rotate. The resilient member drives the latching member to rotate to its original position. | 2009-07-02 |
20090168336 | Support Device, Electronic Equipment System, and Electronic Equipment - According to one embodiment, a support device includes: a casing having one end, the other end opposite to the one end, and a placement plane for mounting an electronic equipment having a certain width; an external connection terminal for connecting to the electronic equipment, the external connection terminal being provided on the placement plane at a position at a first distance from a center of the placement plane to the one end; and an engagement piece having a claw part and being provided on the placement plane at a position at a second distance from the center of the placement plane to the other end. | 2009-07-02 |
20090168337 | PORTABLE DATA TERMINAL INTERNAL SUPPORT STRUCTURE - A portable device assembly comprising a first housing portion defining a plurality of a snap retention features, a frame that supports electrical components, and a second housing portion secured to the frame with fasteners. The frame has a plurality of snap features that mate with the plurality of snap retention features so as to secure the frame to the first housing portion. | 2009-07-02 |
20090168338 | MOBILE ELECTRONIC DEVICE - A mobile electronic device includes a main body, a support frame, and a switch. When the support frame is in the first mode and used to support the main body, the main body is required to execute the first function by the support frame and the switch. For example, the first function is used to control the display and includes related functions of multimedia reproducing. In addition, when the support frame is in the second mode and used to support the main body, the main body is required to execute the second function by the support frame and the switch. For example, the second function is used to control the speaker and includes related functions. Whereby, the mobile electronic device includes different two modes to instinctively and automatically switch between video and audio files reproducing. | 2009-07-02 |
20090168339 | SLIDER ASSEMBLY HAVING GROOVED RAIL - Disclosed is a sliding mechanism for a handheld electronic device. The mechanism includes a first slider in a single piece metallic body, two elongated plastic rails, and a second slider. The single piece metallic body includes two opposite side portions that are bent toward each other and define two elongated spaces, each of which is partially surrounded by each bent side portion. Each elongated plastic rail includes a groove on a surface of the elongated plastic rail and is fitted into each elongated space such that the groove of one elongated plastic rail opposes the groove of the other elongated plastic rail. The second slider includes two edges slidably engaged with the grooves such that the second slider is slidable relative to the first slider. | 2009-07-02 |
20090168340 | HOUSING OF FOLDABLE ELECTRONIC DEVICE - An exemplary housing of a foldable electronic device includes a first cover, a second cover, and a button disposed on the second cover. The first cover includes a lock receiving portion. The button includes a main body, a lock portion, and a resilient portion. The lock portion is configured for engaging with the lock receiving portion. The lock portion and the resilient portion connect with the main body. The main body includes a contact portion and a pivot portion. The contact portion and the pivot portion are separated from each other at a predetermined distance. The main body is rotatably disposed on the second cover by the pivot portion. The resilient portion is located on another end opposite to the pivot portion. | 2009-07-02 |
20090168341 | MOUNTING APPARATUS FOR EXPANSION CARD - A mounting apparatus for mounted an expansion card to a computer case, includes an expansion card mount, and a locking device mounted in the computer. The expansion card mount includes a fixing board, the fixing board including a locking post extending. The computer includes a PCB having a female connector, and a rear plate defining an opening. The expansion card includes a male connector and is fixed to the fixing board. The expansion card together with the expansion card mount can be inserted through the opening of the rear plate in order to make the male connector of the expansion card to be plugged in the female connector of the PCB. At the same time, the locking post of the expansion card mount is locked by the locking device and the expansion card mount is mounted in the opening of the rear plate. | 2009-07-02 |
20090168342 | HOUSING OF FOLDABLE ELECTRONIC DEVICE - An exemplary housing of a foldable electronic device includes a first cover, a second cover, a handle, latching members, and resilient members. The first cover includes lock portions. The handle includes two pivot portions and two first transmission portions. Each latching member includes a second transmission portion and a lock receiving portion. Each lock receiving portion is configured for engaging with one lock portion. Each second transmission portion is configured for engaging with one first transmission portion. The pivot portions are engaging with the retaining portions such that the handle is rotatable around the pivot portion. When the handle rotates, it releases the lock portions from the latching members thus opens the housing. | 2009-07-02 |
20090168343 | COOLING DEVICE AND ELECTRONIC DEVICE COMPRISING SUCH A COOLING DEVICE - A cooling device using pulsating fluid for cooling of an object ( | 2009-07-02 |
20090168344 | THERMAL DEVICE WITH ELECTROKINETIC AIR FLOW - In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed. | 2009-07-02 |
20090168345 | ENERGY SAVING SYSTEM AND METHOD FOR COOLING COMPUTER DATA CENTER AND TELECOM EQUIPMENT - A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to racks containing the electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment. | 2009-07-02 |
20090168346 | Device for air-cooling electronic apparatus - A device for air-cooling an electronic apparatus, where a suction opening ( | 2009-07-02 |
20090168347 | PROGRAMMABLE CONTROLLED HEAT DISSIPATING FAN - The invention is related to a programmable controlled heat dissipating fan which is comprised of a base, a stator assembly, a magnet frame assembly, a fan blade assembly, an inductor set, a first circuit board and a second circuit board, whereof the said stator assembly is firmly installed in the base, while the said magnet assembly is sleeved into the periphery of the said stator assembly, whereof the fan blade assembly is rotated through the alternatively changing magnetic field produced by the stator winding and magnet frame, while the said second circuit board is rotated along accordingly and powered by electromagnetic coupling, whereby the data content stored in the data repository is loaded by the microprocessor to drive the light emitting unit to display, thereby to achieve a decoration effect of dynamic flashing and display along with the rotating process of fan blade assembly. | 2009-07-02 |
20090168348 | HIGH DENSITY COMPONENT ASSEMBLY METHOD AND APPARATUS - Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies. | 2009-07-02 |
20090168349 | HEAT SINK ASSEMBLY HAVING SUPPORTING CLIP - A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a supporting clip mounted on the bolt and located at a bottom of the heat sink. The supporting clip comprises a body and a support extending from the body. When the bolt of each fastener extends through the unit and the body of the supporting clip, a distance between the bottom of the unit and the heat-generating electronic component remains unchanged with the help of the support of the supporting clip. | 2009-07-02 |
20090168350 | HEAT DISSIPATION DEVICE WITH A FAN HOLDER - A heat dissipation device includes a heat sink assembly, a fan holder and two fans mounted on the two sides of the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and a fin assembly thermally connecting with the heat spreader. The fin assembly has a plurality of channels therein. The fan holder includes a top plate mounted on a top of the fin assembly and a pair of vertical baffle walls extending from two opposite ends of the top plate. The baffle walls of the fan holder are located at two lateral ends of the fin assembly and sandwich the fin assembly therebetween. The two fans respectively abut against inlets and outlets of the channels of the fin assembly. An airflow generated by one fan flows through the fin assembly and is sucked by the other fan. | 2009-07-02 |
20090168351 | HEAT DISSIPATION MODULE AND FAN THEREOF - The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member. | 2009-07-02 |
20090168352 | Heat sink device for a display card - A heat sink device for a display card includes a heat sink, the heat sink having a base and a plurality of heat-dissipating fins on the base, the base having two hooks respectively beside two lateral sides of the groove; a heat-dissipating fan, having a blade wheel and a power wire for the blade wheel, the blade wheel being on the base and the power wire being inside the groove of the base; and a fastener, having two engagement parts respectively corresponding to the hooks, wherein the fastener covers the groove so as to position the power wire by means of engagement of the hooks with the engagement parts. Therefore, the power wire of the heat-dissipating fan can be properly arranged on the heat sink. | 2009-07-02 |
20090168353 | Electronic apparatus - An electronic apparatus includes a housing, first and second circuit boards disposed in the housing in such a way that the first and second circuit boards are stacked on each other, and a pump block disposed between the first and second circuit boards, the pump block abutting a first electronic part mounted on the first circuit board and a second electronic part mounted on the second circuit board, the pump block sucking air outside the housing and discharging the air out of the housing. | 2009-07-02 |
20090168354 | Thermally and electrically conductive interconnect structures - An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi. | 2009-07-02 |
20090168355 | HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS - A heat sink assembly for removing heat from two heat generating-components mounted on a printed circuit board, includes a first heat sink, a second heat sink, a plurality of poles each having a head at a top end and a double-layer spring. The first heat sink includes a base and a plurality of fins arranged on the base. The second heat sink has a first shoulder extending from a lateral side thereof. The first shoulder is disposed on the base. The double-layer spring includes an outer spring and an inner spring having a top end connected to a top end of the outer spring. One of the poles wearing the double-layer spring extends through the first shoulder and the base. The outer spring is compressed between the head of the pole and the first shoulder. The inner spring is compressed between the head of the pole and the base. | 2009-07-02 |
20090168356 | MEMORY MODULE ASSEMBLY WITH HEAT DISSIPATION DEVICE - A memory module assembly ( | 2009-07-02 |
20090168357 | PLASMA DISPLAY APPARATUS - A plasma display apparatus includes a plasma display panel, a chassis having the plasma display panel fixedly mounted on one face thereof, and having reinforcing members disposed as bulges on another face thereof to extend alongside each other, a heat sink fixedly mounted on the reinforcing members extending alongside each other to bridge between the reinforcing members, and a circuit board fixedly mounted on the heat sink to drive the plasma display panel. | 2009-07-02 |
20090168358 | Power drive unit - A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular shape and is installed between the power module and the press member. With this, the power module can be fastened to the heat sink without incurring layout limitation, degradation of heat release performance and the like. Also, since the power drive unit further includes a projection that protrudes from the press member to be engaged with an engagement hole bored at the center of the spring member, engagement of the projection of the press member with the engagement hole of the spring member functions to prevent displacement of the press member relative to the spring member, thereby making loads acting on the power modules uniform. | 2009-07-02 |
20090168359 | HEAT SINK - A heat sink includes a plurality of parallel fins ( | 2009-07-02 |
20090168360 | CLAMP FOR ELECTRICAL DEVICES - An assembly for clamping electrical components against a heat-dissipating surface of a heat sink may include the heat sink, one or more electrical components, two or more springs, and a fastener. Each of the springs may include a first surface, and a second surface opposite the first surface. The second surface of each of the springs may include an attachment region and two contact regions. The attachment region may be between the two contact regions. The second surface of one of the springs may overlap the first surface of another one of the springs. Each of the springs may be positioned to hold the electrical components against the heat dissipating surface of the heat sink. Each of the two contact regions of each of the springs may be positioned to hold the electronic components against the heat-dissipating surface. The fastener may couple the springs together in the attachment region of each of the springs and may further couple the springs to the heat sink. | 2009-07-02 |
20090168361 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base. | 2009-07-02 |
20090168362 | Thin multi-chip flex module - A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board. | 2009-07-02 |
20090168363 | Thin multi-chip flex module - A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers. | 2009-07-02 |
20090168364 | HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR PACKAGE MODULE, AND SEMICONDUCTOR PACKAGE MODULE HAVING THE SAME - A semiconductor package module having a heat dissipation device includes one or more semiconductor packages with each semiconductor package having semiconductor chips and solder balls connected to the semiconductor chips. A printed circuit board is electrically connected to each of the semiconductor packages. The heat dissipation device dissipates heat generated within the semiconductor package module and includes a fastening member having a fastening body. The fastening member is placed in the space between the semiconductor chips and the printed circuit board, which occurs due to the presence of the solder balls. A coupling groove is defined in an upper surface of the fastening body, and a heat dissipation member covers the semiconductor packages. A through-hole is defined in the heat dissipation member at a position corresponding to the coupling groove, and a coupling member is disposed within the through-hole and is coupled to the coupling groove. | 2009-07-02 |
20090168365 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a circuit board ( | 2009-07-02 |
20090168366 | Thin multi-chip flex module - A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board. | 2009-07-02 |
20090168367 | ELECTRONIC APPARATUS - An electronic apparatus includes an electronic element | 2009-07-02 |
20090168368 | DISCRETE ELECTRONIC COMPONENT AND RELATED ASSEMBLING METHOD - The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die. | 2009-07-02 |
20090168369 | Electronic device slide and tilt mechanism - Disclosed herein is an apparatus. The apparatus includes a housing, electronic circuitry, a first arm member, and a spring. The housing includes a first housing section and a second housing section. The electronic circuitry is mounted in the housing. The first arm member is connected between the first housing section and the second housing section. The first arm member is configured to move a portion of the second housing section away from the first housing section. The spring is connected between the second housing section and the first arm member. The spring is configured to exert a torque between the second housing section and the first arm member. | 2009-07-02 |
20090168370 | INTEGRATED POWER SUPPLY AND PLATFORM FOR MILITARY RADIO - An improved power supply and platform for a military radio has been developed. The apparatus includes a base that is adapted and arranged for supporting a HARRIS 117 radio and a power amplifier adapted to amplify radio frequency output of the radio. The connectors include an electrical connector for the radio and a connector for the amplifier. A power supply is housed within the assembly. A power supply for the connector to the amplifier is also housed within the assembly, Also included is a wiring harness for a SINCGARS LS/671 device and a LED indicator to identify which radio is in operation for multiple radio configurations. | 2009-07-02 |
20090168371 | EXPANSION CARD RETENTION ASSEMBLY - An exemplary retention assembly ( | 2009-07-02 |
20090168372 | EXPANSION CARD RETENTION ASSEMBLY - An exemplary retention assembly ( | 2009-07-02 |
20090168373 | PORTABLE ELECTRONIC DEVICE AND METHOD FOR ASSEMBLING THE SAME - A portable electronic device ( | 2009-07-02 |
20090168374 | Thin multi-chip flex module - A flexible circuit comprises two flexible dielectric sheets having conductive patterns on their surface(s) to which microelectronic device(s) are attached. A bond layer joins the two sheets over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. | 2009-07-02 |
20090168375 | EXPANSION CARD RETENTION ASSEMBLY - An exemplary retention assembly ( | 2009-07-02 |
20090168376 | EXPANSION CARD RETENTION ASSEMBLY - An exemplary retention assembly ( | 2009-07-02 |
20090168377 | EXPANSION CARD RETENTION ASSEMBLY - An exemplary retention assembly ( | 2009-07-02 |
20090168378 | ELECTRONIC APPARATUS - According to an aspect of the present invention, there is provided an electronic apparatus including: a wiring that is formed on a mounting surface; a terminal that is electrically connected with the wiring; a terminal holder that is disposed above the mounting surface to face the wiring and that holds the terminal in a space between the terminal; and a blocking member that is disposed on the terminal holder at a side facing the mounting surface, that surrounds the terminal and that is separated from the mounting surface to regulate a gap between blocking member and the mounting surface so that the terminal is prevented from passing therethrough when the terminal is broken off from the terminal holder. | 2009-07-02 |
20090168379 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes: a polygonal printed circuit board provided with a cutout portion at least in a part, the cutout portion defined by at least a first edge and a second edge; and a first electronic component mounted on the printed circuit board; wherein the first electronic component is mounted at a position crossing a line defined by the first edge on the printed circuit board. | 2009-07-02 |
20090168380 | PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT - A package substrate embedded with a semiconductor component is provided. A semiconductor chip is received in a cavity of a substrate body, and has electrode pads on an active surface thereof. A passivation layer is disposed on the active surface and has openings for exposing the electrode pads. An electroless plating metal layer, a first sputtering metal layer and a second sputtering metal layer are sequentially formed on the electrode pads, the openings of the passivation layer and the passivation layer surface around the openings. Contact pads are formed on the second sputtering metal layer. A first dielectric layer is disposed on the substrate body and the passivation layer. A first circuit layer is formed on the first dielectric layer. First conductive vias are formed in the first dielectric layer and electrically connected to the contact pads. The first circuit layer is electrically connected to the first conductive vias. | 2009-07-02 |
20090168381 | PRINTED WIRING BOARD UNIT AND METHOD OF MAKING THE SAME - An electrically-conductive pin is inserted into a through hole penetrating through a substrate between a first surface and a second surface defined at the reverse side of the first surface so that the electrically-conductive pin stands upright from the first surface of the substrate. An electronic component is then mounted on the tip end of the electrically-conductive pin standing upright from the first surface. The electrically-conductive pin is inserted into the through hole before an electronic component is mounted on the tip end of the electrically-conductive pin. It is thus extremely easy to insert the electrically-conductive pin into the through hole. As compared with the case where the electrically-conductive pins are first bonded to an electronic component, an operator is released from a troublesome operation of inserting the electrically-conductive pin. The electronic component can be mounted in an efficient manner. | 2009-07-02 |
20090168382 | SEMICONDUCTOR MODULE - A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals. | 2009-07-02 |
20090168383 | ELECTRONIC APPARATUS AND SYSTEM - An electronic apparatus has a first circuit board and a second circuit board. The first circuit board has a first connector mounted thereto. The second circuit board has a second connector which is mounted to a first surface and is mechanically coupled to the first connector, and a third connector which is mounted to a second surface positioned on a backside of the first surface in an overlapping relation to the second connector with the second circuit board interposed between the second and third connectors, and which is mechanically coupled to a connector of an external device. | 2009-07-02 |
20090168384 | Electronic apparatus - An electronic apparatus has a board; a first connection section which is mounted on the board; a component which is selectively mounted on the board; a flexible board which includes a second connection section and a reinforcing plate attached at a position of the second connection section; and a housing cover which includes a projection section which abuts the reinforcing plate in a state in which the second connection section of the flexible board is connected to the first connection section. The reinforcing plate has a length that allows the reinforcing plate to extend on the selectively mounted component in a state in which the second connection section of the flexible board is connected to the first connection section. | 2009-07-02 |
20090168385 | FLEX CIRCUIT SNAP TRACK FOR A BIOMETRIC SENSOR - The present disclosure relates to a sensor assembly, comprising a frame comprising structural supports, and housings configured to house an optical component; and a strut disposed between one of the structural supports and housings; wherein the struts are adapted to house conductors connecting the optical component to a circuit. | 2009-07-02 |
20090168386 | ELECTRONIC APPARATUS AND SUBSTRATE MOUNTING METHOD - According to one embodiment, an electronic apparatus comprises a frame with a hollow portion formed inside thereof, a shield coating applied to the inner surface of the frame, a plurality of connection terminals having lead portions provided on the outside surface of the frame, and a module substrate which mounts circuit components on the front and rear surfaces thereof and which is placed on the frame in a state where at least the rear side circuit components are housed in the hollow portion with the circuit components on the front and rear surfaces connected to the connection terminals. | 2009-07-02 |