26th week of 2020 patent applcation highlights part 67 |
Patent application number | Title | Published |
20200203129 | PLASMA PROCESSING APPARATUS, IMPEDANCE MATCHING METHOD, AND PLASMA PROCESSING METHOD | 2020-06-25 |
20200203130 | IMPEDANCE MATCHING NETWORK AND METHOD | 2020-06-25 |
20200203131 | PLASMA ETCHING METHOD USING FARADAY CAGE | 2020-06-25 |
20200203132 | PLASMA PROCESSING USING MULTIPLE RADIO FREQUENCY POWER FEEDS FOR IMPROVED UNIFORMITY | 2020-06-25 |
20200203133 | PLASMA PROCESSING APPARATUS, DATA PROCESSING APPARATUS AND DATA PROCESSING METHOD | 2020-06-25 |
20200203134 | ROTATABLE SPUTTERING TARGET | 2020-06-25 |
20200203135 | MAGNETRON DRIVE MECHANISM, MAGNETRON ASSEMBLY AND REACTION CHAMBER | 2020-06-25 |
20200203136 | Usage and Temperature Compensation of Performance Parameters for Night Vision Device | 2020-06-25 |
20200203137 | DETECTION AND CONCENTRATION DETERMINATION OF 2,3,3,3-TETRAFLUORO-2-(1,1,2,2,3,3,3-HEPTAFLUOROPROPOXY) PROPANOIC ACID BY LC/MS/MS | 2020-06-25 |
20200203138 | AUTOMATED SYSTEM FOR REMOTE INLINE CONCENTRATION AND HOMOGENIZATION OF ULTRA-LOW CONCENTRATIONS IN PURE CHEMICALS | 2020-06-25 |
20200203139 | Mass Spectrometer Compensating Ion Beams Fluctuations | 2020-06-25 |
20200203140 | CHEMICALLY MODIFIED ION MOBILITY SEPARATION APPARATUS AND METHOD | 2020-06-25 |
20200203141 | Apparatus and System for Active Heat Transfer Management in Ion Sources | 2020-06-25 |
20200203142 | QUADRUPOLE DEVICES | 2020-06-25 |
20200203143 | METHOD FOR PREPARING MULTILAYER STRUCTURE | 2020-06-25 |
20200203144 | METHODS OF CLEANING AN OXIDE LAYER IN A FILM STACK TO ELIMINATE ARCING DURING DOWNSTREAM PROCESSING | 2020-06-25 |
20200203145 | Methods for forming silicon nitride thin films | 2020-06-25 |
20200203146 | MODULE AND SYSTEM FOR TRIMMING WAFER EDGE | 2020-06-25 |
20200203147 | ALD PROCESS AND HARDWARE WITH IMPROVED PURGE EFFICIENCY | 2020-06-25 |
20200203148 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2020-06-25 |
20200203149 | METHOD OF GROWING DOPED GROUP IV MATERIALS | 2020-06-25 |
20200203150 | COMPOSITION FOR FILM DEPOSITION AND FILM DEPOSITION APPARATUS | 2020-06-25 |
20200203151 | METHOD OF HEATING SOC FILM ON WAFER AND HEATING APPARATUS USING THE SAME | 2020-06-25 |
20200203152 | CLEANING DEVICE AND METHOD FOR DRIVING CLEANING DEVICE | 2020-06-25 |
20200203153 | ANTI-REFLECTION LAYER FOR SEMICONDUCTOR STRCUTURE | 2020-06-25 |
20200203154 | OXIDATION REDUCTION FOR SIOC FILM | 2020-06-25 |
20200203155 | Compositions And Methods Using Same For Carbon Doped Silicon Containing Films | 2020-06-25 |
20200203156 | STACK VIABAR STRUCTURES | 2020-06-25 |
20200203157 | METHOD FOR PREPARING MULTIPLAYER STRUCTURE | 2020-06-25 |
20200203158 | Methods For Using Remote Plasma Chemical Vapor Deposition (RP-CVD) And Sputtering Deposition To Grow Layers In Light Emitting Devices | 2020-06-25 |
20200203159 | PROTECTIVE-FILM FORMING METHOD FOR SEMICONDUCTOR SUBSTRATE | 2020-06-25 |
20200203160 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | 2020-06-25 |
20200203161 | METHOD FOR FABRICATING AN INTEGRATED CIRCUIT INCLUDING A NMOS TRANSISTOR AND A PMOS TRANSISTOR | 2020-06-25 |
20200203162 | METHOD FOR FABRICATING ULTRA-THIN GRAPHITE FILM ON SILICON CARBIDE SUBSTRATE | 2020-06-25 |
20200203163 | SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME | 2020-06-25 |
20200203164 | HARDMASK STRESS, GRAIN, AND STRUCTURE ENGINEERING FOR ADVANCED MEMORY APPLICATIONS | 2020-06-25 |
20200203165 | METHOD AND DEVICE FOR BONDING OF SUBSTRATES | 2020-06-25 |
20200203166 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | 2020-06-25 |
20200203167 | SEMICONDUCTOR DEVICE | 2020-06-25 |
20200203168 | Si-Passivated GE Gate Stack | 2020-06-25 |
20200203169 | GROUP III-V SEMICONDUCTOR DEVICES HAVING ASYMMETRIC SOURCE AND DRAIN STRUCTURES | 2020-06-25 |
20200203170 | PATTERNING SHEET AND ETCHED STRUCTURE PRODUCTION METHOD | 2020-06-25 |
20200203171 | Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same | 2020-06-25 |
20200203172 | POLISHING COMPOSITIONS AND METHODS OF USING SAME | 2020-06-25 |
20200203173 | Surface Smoothing of Workpieces | 2020-06-25 |
20200203174 | IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | 2020-06-25 |
20200203175 | Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid Thermal Activation Process | 2020-06-25 |
20200203176 | MANUFACTURING METHOD FOR SEMICONDUCTOR PATTERN | 2020-06-25 |
20200203177 | SEMICONDUCTOR CHIP GETTERING | 2020-06-25 |
20200203178 | METHOD OF EVALUATING IMPURITY GETTERING CAPABILITY OF EPITAXIAL SILICON WAFER AND EPITAXIAL SILICON WAFER | 2020-06-25 |
20200203179 | METHOD FOR FABRICATING SEMICONDUCTOR COMPONENT | 2020-06-25 |
20200203180 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-06-25 |
20200203181 | ETCHING USING AN ELECTROLYZED CHLORIDE SOLUTION | 2020-06-25 |
20200203182 | SILICON MANDREL ETCH AFTER NATIVE OXIDE PUNCH-THROUGH | 2020-06-25 |
20200203183 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-06-25 |
20200203184 | MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES | 2020-06-25 |
20200203185 | Component Carrier With Included Electrically Conductive Base Structure and Method of Manufacturing | 2020-06-25 |
20200203186 | STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH UNDERFILL | 2020-06-25 |
20200203187 | CHIP PACKAGING METHOD AND PACKAGE STRUCTURE | 2020-06-25 |
20200203188 | CHIP PACKAGING METHOD AND PACKAGE STRUCTURE | 2020-06-25 |
20200203189 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2020-06-25 |
20200203190 | DEVICE FOR COLLECTING CONTAMINANTS ON THE BORDER ET THE SIDE OF A CIRCULAR PLAQUE | 2020-06-25 |
20200203191 | ROLLER FOR CLEANING WAFER AND CLEANING APPARATUS HAVING THE SAME | 2020-06-25 |
20200203192 | BACKSIDE BRUSH FOR CLEANING WAFER AND CLEANING APPARATUS HAVING THE SAME | 2020-06-25 |
20200203193 | METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS | 2020-06-25 |
20200203194 | Inner Wall and substrate Processing Apparatus | 2020-06-25 |
20200203195 | OPERATING METHOD FOR WET ETCHING SYSTEM AND RELATED SYSTEM | 2020-06-25 |
20200203196 | METHOD FOR DECREASING COOL DOWN TIME WITH HEATED SYSTEM FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT | 2020-06-25 |
20200203197 | MULTI-STATION PROCESSING CHAMBER FOR SEMICONDUCTOR | 2020-06-25 |
20200203198 | TRANSFERRING DEVICE OF SEMICONDUCTOR MANUFACTURING AND METHOD OF CLEANING TRANSFERRING CHAMBER OF THE TRANSFERRING DEVICE | 2020-06-25 |
20200203199 | WAFER SOAK TEMPERATURE READBACK AND CONTROL VIA THERMOCOUPLE EMBEDDED END EFFECTOR FOR SEMICONDUCTOR PROCESSING EQUIPMENT | 2020-06-25 |
20200203200 | Encapsulated Instrumented Substrate Apparatus for Acquiring Measurement Parameters in High Temperature Process Applications | 2020-06-25 |
20200203201 | METHOD FOR INSPECTING A CONTAINER AND INSPECTION SYSTEM | 2020-06-25 |
20200203202 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM | 2020-06-25 |
20200203203 | STORING SYSTEM | 2020-06-25 |
20200203204 | CONVEYANCE APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE | 2020-06-25 |
20200203205 | ELECTROSTATIC CHUCK | 2020-06-25 |
20200203206 | ELECTROSTATIC CHUCK | 2020-06-25 |
20200203207 | ELECTROSTATIC CHUCK | 2020-06-25 |
20200203208 | SYSTEM COMPRISING A SINGLE WAFER, REDUCED VOLUME PROCESS CHAMBER | 2020-06-25 |
20200203209 | APPARATUS AND SYSTEM FOR WAFER SPIN PROCESS | 2020-06-25 |
20200203210 | METHOD FOR CONNECTING A BURIED INTERCONNECT RAIL AND A SEMICONDUCTOR FIN IN AN INTEGRATED CIRCUIT CHIP | 2020-06-25 |
20200203211 | MANUFACTURING OF CAVITIES | 2020-06-25 |
20200203212 | MASKLESS AIR GAP ENABLED BY A SINGLE DAMASCENE PROCESS | 2020-06-25 |
20200203213 | SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME | 2020-06-25 |
20200203214 | METHOD OF FIN OXIDATION BY FLOWABLE OXIDE FILL AND STEAM ANNEAL TO MITIGATE LOCAL LAYOUT EFFECTS | 2020-06-25 |
20200203215 | SEMICONDUCTOR DEVICES | 2020-06-25 |
20200203216 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | 2020-06-25 |
20200203217 | METHOD FOR MANUFACTURING BONDED WAFER | 2020-06-25 |
20200203218 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2020-06-25 |
20200203219 | FAN-OUT ELECTRONIC DEVICE | 2020-06-25 |
20200203220 | STAIR STEP STRUCTURES INCLUDING INSULATIVE MATERIALS, AND RELATED DEVICES | 2020-06-25 |
20200203221 | SEMICONDUCTOR STRUCTURE AND METHOD OF PROCESSING THE SAME | 2020-06-25 |
20200203222 | Contact Conductive Feature Formation and Structure | 2020-06-25 |
20200203223 | METHOD OF MANUFACTURING A DISPLAY DEVICE | 2020-06-25 |
20200203224 | METHOD FOR BONDING AND INTERCONNECTING SEMICONDUCTOR CHIPS | 2020-06-25 |
20200203225 | SUBSTRATE DIVIDING METHOD | 2020-06-25 |
20200203226 | JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS | 2020-06-25 |
20200203227 | Dicing A Wafer | 2020-06-25 |
20200203228 | METHOD OF REMOVING A SUBSTRATE WITH A CLEAVING TECHNIQUE | 2020-06-25 |