25th week of 2022 patent applcation highlights part 99 |
Patent application number | Title | Published |
20220201883 | CURVATURE VARIABLE DISPLAY DEVICE - Provided is a curvature variable display device including a panel assembly including a display panel, a back plate disposed on a rear surface of the panel assembly, a first side bracket and a second side bracket respectively coupled to two sides of a rear surface of the back plate, a bending plate having one end rotatably coupled to the first side bracket and another end rotatably coupled to the second side bracket and having a convex curvature toward a rear of the back plate, a stand post having an upper end coupled to a center area of the bending plate and a lower end coupled to a stand base, and a dial assembly provided on the stand base to wind or unwind a wire coupled to the rear surface of the back plate and change curvatures of the panel assembly and the back plate. | 2022-06-23 |
20220201884 | DATA STORAGE SYSTEM INCLUDING MOVABLE CARRIAGE AND PHYSICAL LOCKING MECHANISM - An apparatus with a housing which stores a plurality of data storage magazines where each data storage magazine includes a plurality of data storage devices. The housing includes a movable carriage configured to selectively couple a set of data storage devices held by a particular data storage magazine to a host device. The housing also includes a physical locking mechanism configured to selectively prevent data storage devices from coupling to the host device. | 2022-06-23 |
20220201885 | Electronic Devices With Folding Displays Having Flexible Area Support Structures - A foldable display may have a display cover layer and display panel that bend around a bend axis. The display panel may have an array of pixels configured to display an image through the display cover layer. The display cover layer may be formed from a layer of glass. A recess may be formed in the layer of glass that extends along and overlaps the bend axis. The recess forms a flexible locally thinned portion in the glass that allows the display cover layer to bend. Polymer may be formed in the recess. Stiffening structures such as glass strips and glass beads of one or more diameters may be embedded in the polymer to help resist inward compression of the surface of the display cover layer in the locally thinned region while allowing the display cover layer to bend about the bend axis. | 2022-06-23 |
20220201886 | COVER, COVER-ATTACHED PART, AND RADAR DEVICE | 2022-06-23 |
20220201887 | SENSOR DEVICE, SYSTEMS, AND METHODS FOR IDENTIFYING LEAKS IN A FLUID CONDUIT - Provided is a method, system, and sensor device for identifying and detecting presence of a leak in a fluid conduit. The sensor device freely flows with a fluid within the fluid conduit. The sensor device includes an outer capsule that is free flowing within the fluid and provides fluid-tight containment to an interior compartment, at least one acoustic sensor mounted within the interior compartment, wherein the at least one acoustic sensor senses acoustic properties of the fluid to detect the presence of the leak, and a conductor for activating the at least one acoustic sensor to sense the acoustic properties of the fluid and the fluid conduit, wherein the conductor passes from the interior compartment and through to the outer capsule. | 2022-06-23 |
20220201888 | PROCESS AND SYSTEM FOR MANAGING CARRIER SYSTEMS - A system may include a plurality of rack-mountable, ruggedized drawers, each comprising a main body, a set of fans, a power supply, and a card connector. Connections may be provided, via a backplane of each of the card connectors, to a set of plugin cards each installed in the respective main body. A processor of the card connector of one of the drawers may represent the drawers by communicating information with an external third party. | 2022-06-23 |
20220201889 | IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES - A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another. | 2022-06-23 |
20220201890 | Power Module - A power module includes a case defining an accommodation space, and a baseplate having a circuit pattern, the baseplate being coupled to the case such that the circuit pattern is within the accommodation space. The power module further includes a plurality of power elements on the circuit pattern and electrically connected to the circuit pattern, and a shielding member above the power elements to shield electromagnetic interference of the power elements, with the shielding member being grounded. Moreover, the power module includes an encapsulating material within the accommodation space, with the encapsulating material covering at least the circuit pattern and the power elements. Additionally, the power module includes a cooling member coupled to the baseplate on a side of the baseplate further from the case. | 2022-06-23 |
20220201891 | Power Module - A power module includes at least one power semiconductor element between first and second conductive layers, a first cooling member on the first conductive layer, a second cooling member under the second conductive layer, and at least one snubber capacitor between the first and second conductive layers. Each snubber capacitor has a capacitor core between first and second electrodes and first and second transition layers. The first transition layer is between the first conductive layer and the first electrode and the second transition layer is between the second electrode and the second conductive layer, or the first transition layer is between the first electrode and the capacitor core and the second transition layer is between the capacitor core and the second electrode. The first and second transition layers are conductive. A thermal expansion coefficient of the transition layers is between thermal expansion coefficients of adjacent elements of the snubber capacitor. | 2022-06-23 |
20220201892 | MINIMALISTIC POWER CONVERTER AND VEHICLE INCLUDING A POWER CONVERTER - A power Converter having power semiconductor components is disclosed herein, wherein a DC-link capacitor has a capacitance of less than 3 μF and is not designed as a separate electrical device of the power converter, and wherein the clock frequency is greater than 1 MHz. A vehicle, (e.g., an aircraft), including a power Converter of this kind is also described. | 2022-06-23 |
20220201893 | HEAT EXCHANGER, IN PARTICULAR FOR POWER ELECTRONICS - Heat exchanger, in particular for cooling power electronics, comprising an insulating element which separates a first fluid medium, which is in contact with a heat source, from a second fluid medium, which differs in at least one property from the first fluid medium and which is in fluid connection with a heat sink or is itself a heat sink, and a heat transfer element which has a higher thermal conductivity than the insulating element, wherein the insulating element comprises at least a first passage opening in which a first heat transfer element is arranged, wherein the heat transfer element is thermally connected both to the first fluid medium and/or the heat source, and to the second fluid medium and is fluidically sealed with respect to the insulating element by means of a sealing element. | 2022-06-23 |
20220201894 | METHOD AND APPARATUS FOR EXTENDED SERIAL TEMPERATURE CONTROL IN A COMPUTE DEVICE - A compute device includes a printed circuit board, at least three compute subassemblies disposed on the printed circuit board, and a liquid loop. The compute subassemblies disposed on the printed circuit board and each of the three compute subassemblies includes a thermal control plate defining a respective internal conduit therethrough. A temperature controlled liquid circuit circulates through the liquid loop through to control the temperature of each of compute subassemblies in series during operation, the liquid loop including each of the internal conduits in each of the thermal control plates in each of the compute subassemblies. | 2022-06-23 |
20220201895 | TEMPERATURE CONTROL UNIT - With an objective of obtaining a temperature control unit capable of highly uniform temperature control, provided is a temperature control unit ( | 2022-06-23 |
20220201896 | COOLING SYSTEM FOR ELECTRONIC MODULES - A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger. | 2022-06-23 |
20220201897 | COOLING MODULE FOR AN ELECTRICAL ASSEMBLY - A cooling unit for dissipating the heat generated by electronic components ( | 2022-06-23 |
20220201898 | COMPONENTS FOR A FLUID COOLING SYSTEM AND FLUID COOLING SYSTEM COMPRISING SAID COMPONENTS - A first module for a fluid cooling system may have a control unit, a first communication unit, a pump for a cooling fluid, and a first heat exchanger. The first communication unit may be configured to receive signals from at least one second module, the signals having an identification feature of the second module. The control unit, on the basis of the identification feature, is designed for identifying the second module, checking whether the second module is system-compatible or authorized, and switching on the pump and/or the first heat exchanger depending on the presence of the system-compatible or authorized second module. A cooling fluid system may have the first module and a second module. | 2022-06-23 |
20220201899 | ELECTRIC APPLIANCE HAVING A HOUSING PART - An electric appliance includes a housing part, and first, second, and third cooling fins are premolded or provided on the housing part. The housing part has a wall, e.g., a topside, and two side walls, and of the cooling fins extends along the wall and at least one of the side walls. | 2022-06-23 |
20220201900 | SYSTEM AND METHOD FOR LOUVER-INTEGRATED DIRECTIONAL AIRFLOW FANS - A cooling system for a plurality of heat-generating components in a chassis of an information handling system includes an array of fans, each fan operable to generate an airflow in a range of airflows, and a control system configured to monitor temperatures for the components and adjust a direction of one or more airflows based on the component temperatures. If a component temperature gets too high for a first fan associated with the component to cool the component, a portion of a second airflow generated by a second fan may be directed to provide additional airflow to the component such that the component is cooled without increasing the fan speed of the first fan. Adjacent fan speeds may also be adjusted to reduce losses due to differences between adjacent airflows. | 2022-06-23 |
20220201901 | RACK-MOUNTABLE HEAT-EXCHANGER FOR MODULAR ELECTRONIC SYSTEMS - A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path. | 2022-06-23 |
20220201902 | CONTROL SYSTEMS FOR AIR-ASSISTED AND LIQUID-COOLED ENCLOSURES - Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint. | 2022-06-23 |
20220201903 | POWER MODULE FOR OPERATING AN ELECTRIC VEHICLE DRIVE - A power module for operating an electric vehicle drive may include one or more of the following: a plurality of semiconductor components; an intermediate circuit capacitor connected in parallel to the semiconductor components; a heatsink for the removal of heat generated by the semiconductor components, where the heatsink is located between the semiconductor components and the intermediate circuit capacitor; and an intermediate circuit line that electrically connects the intermediate circuit capacitor to the semiconductor components. The intermediate circuit line may extend perpendicular to a direction of flow for the coolant in the heatsink on a side of the semiconductor components facing away from the heatsink. | 2022-06-23 |
20220201904 | HEAT DISSIPATION LAYER AND DISPLAY DEVICE INCLUDING THE SAME - A display device includes a display module including a display area and a non-display area which is adjacent to the display area, a printed circuit film attached to the display module at the non-display area thereof, and a first heat dissipation layer corresponding to the non-display area of the display module. The first heat dissipation layer extends from the non-display area of the display module to correspond to the printed circuit film. | 2022-06-23 |
20220201905 | HEAT DISSIPATION MODULE, DISPLAY ASSEMBLY AND DISPLAY DEVICE - A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 10 | 2022-06-23 |
20220201906 | EMP PROTECTION FOR STRUCTURES HAVING COAL COMBUSTION RESIDUAL COMPONENTS - An electromagnetic emission shield for protecting a facility having a volume comprised of coal combustion residue. The shield includes a carbon-based material positioned inside an interior space of the coal combustion residue proximate to and interposed between a potential source of electromagnetic emission and the facility. | 2022-06-23 |
20220201907 | PROGRAMMABLE WIRE FILAMENTS AND DEVICES - A switchable wire includes filaments, each of which includes a heat-activated material layer that may be indirectly heated to change its state between different states having different electrical conductivity. In an example embodiment the indirect heating may be electrically resistance heating by passing electrical current through an electrically-resistive core of the filament. The heat passing through an electrically-insulative coating around the core, and into a heat-activated material layer around the electrically-insulative coating. The heat-activated material may be a chalcogenide material that is shiftable between a crystalline electrically-conducting state and an amorphous electrically-insulating state. The state of the material may be controlled by controlling the heating profile through controlling heating in the core. Many such filaments may be twisted together to form a switchable wire. Such wires may be used in any of a variety of devices where switchable electrical conductivity is desired. | 2022-06-23 |
20220201908 | INTERCONNECTABLE ELECTRONIC EQUIPMENT RACK SYSTEM HAVING REDUCED RADIATED EMISSIONS AND SUSCEPTIBILITY - An equipment rack, including an electronic equipment enclosure defined by RF-shielded walls. Openings in the RF-shielded walls are provided for being aligned with complimentary-sized and shaped openings in one or more like data center equipment racks and adapted for permitting a shielded electromagnetic connection between two or more racks. At least one access door in the enclosure is provided for facilitating access to the electronic equipment in the rack. Panels are provided for covering the respective openings in the RF-shielded walls when the openings are not being used to permit an electromagnetic interconnection between two or more racks. Feedthroughs of the invention communicate signals and power into and out of adjacent enclosures while allowing the enclosures to each form a Faraday cage, protecting electrical and electronic systems within the enclosure from electromagnetic threats such as EMP, HEMP, lightning and geomagnetic storms. | 2022-06-23 |
20220201909 | TOOL FOR INSTALLATION OF OCP FORM FACTOR CARD - An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head. | 2022-06-23 |
20220201910 | BANANA PLANT NAMED 'RSV' - ‘RSV’ is a mutant of ‘Valery’ selected on the merits of being a shorter cultivar while simultaneously being a more productive cultivar for the grower. ‘RSV’ shows the following characteristics:
| 2022-06-23 |
20220201911 | MANDARIN TREE NAMED '12C009' - A new and distinct variety of mandarin tree named ‘12C009’, particularly selected for non-acidic flavour profiles and distinguished by the smooth skin texture, cleanness of peeling and high Brix levels, is disclosed. | 2022-06-23 |
20220201912 | Grapevine Plant named 'INIA-G3' - A new and distinct grapevine variety denominated ‘INIA-G3’. The new grapevine is characterized by producing muscat flavored berries, that are ovoid, red, with firm texture, small seed traces and midseason ripening. The clusters are abundant in the vine, large in size and naturally loose, with good keeping and shipping quality. | 2022-06-23 |
20220201913 | BUDDLEJA PLANT NAMED 'BOTEX 003' - A new cultivar of | 2022-06-23 |
20220201914 | Buddleja Plant Named 'Botex 004' - A new cultivar of | 2022-06-23 |
20220201915 | Buddleja Plant Named 'BotEx 005' - A new cultivar of | 2022-06-23 |
20220201916 | Buddleja Plant Named 'BotEx 006' - A new cultivar of | 2022-06-23 |