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25th week of 2016 patent applcation highlights part 67
Patent application number
Title
Published
20160181072
PLASMA GENERATING DEVICE WITH MOVING CAROUSEL AND METHOD OF USE
2016-06-23
20160181073
Low Contamination Chamber for Surface Activation
2016-06-23
20160181074
CHARGE REMOVAL FROM ELECTRODES IN UNIPOLAR SPUTTERING SYSTEM
2016-06-23
20160181075
Two-Dimensional Separation and Imaging Technique for the Rapid Analysis of Biological Samples
2016-06-23
20160181076
Tuning a Mass Spectrometer Using Optimization
2016-06-23
20160181077
SAMPLE QUANTITATION WITH A MINIATURE MASS SPECTROMETER
2016-06-23
20160181078
Bubble Removal from Liquid Flow into a Mass Spectrometer Source
2016-06-23
20160181079
MASS SPECTROMETER INLET WITH REDUCED AVERAGE FLOW
2016-06-23
20160181080
MULTIPOLE ION GUIDES UTILIZING SEGMENTED AND HELICAL ELECTRODES, AND RELATED SYSTEMS AND METHODS
2016-06-23
20160181081
MULTI-ELEMENT ISOTOPIC MEASUREMENT BY DIRECT COUPLING OF A MULTI-CYCLE ISOTACHOPHORESIS TECHNIQUE AND A MASS SPECTROMETRY TECHNIQUE
2016-06-23
20160181082
Enhanced Spray Formation for Liquid Samples
2016-06-23
20160181083
ICR Cell Operating with a Duplexer
2016-06-23
20160181084
Varying Frequency during a Quadrupole Scan for Improved Resolution and Mass Range
2016-06-23
20160181085
INTEGRATION OF III-V DEVICES ON SI WAFERS
2016-06-23
20160181086
SYSTEMS AND METHODS FOR RINSING AND DRYING SUBSTRATES
2016-06-23
20160181087
Particle removal with minimal etching of silicon-germanium
2016-06-23
20160181088
PROCESS KIT FOR A HIGH THROUGHPUT PROCESSING CHAMBER
2016-06-23
20160181089
FCVD LINE BENDING RESOLUTION BY DEPOSITION MODULATION
2016-06-23
20160181090
Decreasing the Critical Dimensions in Integrated Circuits
2016-06-23
20160181091
Methods for Forming Ferroelectric Phases in Materials and Devices Utilizing the Same
2016-06-23
20160181092
NITRIDE SPACER FOR PROTECTING A FIN-SHAPED FIELD EFFECT TRANSISTOR (FINFET) DEVICE
2016-06-23
20160181093
III-N EPITAXY ON MULTILAYER BUFFER WITH PROTECTIVE TOP LAYER
2016-06-23
20160181094
Focused Radiation Beam Induced Thin Film Deposition
2016-06-23
20160181095
SILICON-GERMANIUM FIN OF HEIGHT ABOVE CRITICAL THICKNESS
2016-06-23
20160181096
Method For Growing Germanium Epitaxial Films
2016-06-23
20160181097
Epitaxial Growth Techniques for Reducing Nanowire Dimension and Pitch
2016-06-23
20160181098
OXIDE SEMICONDUCTOR LAYER AND PRODUCTION METHOD THEREFOR, OXIDE SEMICONDUCTOR PRECURSOR, OXIDE SEMICONDUCTOR LAYER, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE
2016-06-23
20160181099
METHODS AND STRUCTURES TO PREVENT SIDEWALL DEFECTS DURING SELECTIVE EPITAXY
2016-06-23
20160181100
Patterning a Substrate Using Grafting Polymer Material
2016-06-23
20160181101
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2016-06-23
20160181102
HARD-MASK DEFINED BIT PATTERN SUBSTRATE
2016-06-23
20160181103
SEMICONDUCTOR DEVICE INCLUDING SMALL PITCH PATTERNS
2016-06-23
20160181104
Method for Forming a Semiconductor Device and a Semiconductor Substrate
2016-06-23
20160181105
SILICON-GERMANIUM (SiGe) FIN FORMATION
2016-06-23
20160181106
Phase Change Memory with Diodes Embedded in Substrate
2016-06-23
20160181107
METHOD FOR ETCHING HIGH-K METAL GATE STACK
2016-06-23
20160181108
Doping of High-K Dielectric Oxide by Wet Chemical Treatment
2016-06-23
20160181109
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
2016-06-23
20160181110
Lithographic Technique for Feature Cut by Line-End Shrink
2016-06-23
20160181111
SILICON ETCH AND CLEAN
2016-06-23
20160181112
ANISOTROPIC GAP ETCH
2016-06-23
20160181113
METHOD FOR FORMING STAIR-STEP STRUCTURES
2016-06-23
20160181114
Method for Fabricating Multiple Layers of Ultra Narrow Silicon Wires
2016-06-23
20160181115
Method of Forming a Mask for Substrate Patterning
2016-06-23
20160181116
SELECTIVE NITRIDE ETCH
2016-06-23
20160181117
INTEGRATED ETCH/CLEAN FOR DIELECTRIC ETCH APPLICATIONS
2016-06-23
20160181118
PLASMA PROCESSING METHOD
2016-06-23
20160181119
PLASMA ETCHING METHOD
2016-06-23
20160181120
Laser annealing systems and methods with ultra-short dwell times
2016-06-23
20160181121
ELECTRO-ASSISTED TRANSFER AND FABRICATION OF WIRE ARRAYS
2016-06-23
20160181122
MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD SURFACES
2016-06-23
20160181123
METHOD OF PRODUCING BONDED BODY AND METHOD OF PRODUCING POWER MODULE SUBSTRATE
2016-06-23
20160181124
3D Packages and Methods for Forming the Same
2016-06-23
20160181125
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOCIATED SYSTEMS AND METHODS
2016-06-23
20160181126
METHOD FOR MANUFACTURING MULTI-CHIP PACKAGE
2016-06-23
20160181127
METHOD FOR COUPLING CIRCUIT ELEMENT AND PACKAGE STRUCTURE
2016-06-23
20160181128
HIGH-THROUGHPUT SEMICONDUCTOR-PROCESSING APPARATUS EQUIPPED WITH MULTIPLE DUAL-CHAMBER MODULES
2016-06-23
20160181129
DEVICE FOR MEASURING THE DISTRIBUTION OR IMPULSE OF A SERIES OF DROPLETS
2016-06-23
20160181130
INTERNAL PLASMA GRID FOR SEMICONDUCTOR FABRICATION
2016-06-23
20160181131
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
2016-06-23
20160181132
Apparatus For Improving Temperature Uniformity Of A Workpiece
2016-06-23
20160181133
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
2016-06-23
20160181134
MONITORING SYSTEM FOR DEPOSITION AND METHOD OF OPERATION THEREOF
2016-06-23
20160181135
SYSTEM AND METHOD FOR MOVING WORKPIECES BETWEEN MULTIPLE VACUUM ENVIRONMENTS
2016-06-23
20160181136
PACKAGING APPARATUS AND PACKAGING DEVICE
2016-06-23
20160181137
SUPPORTING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
2016-06-23
20160181138
Method of manufacturing a semiconductor component and semiconductor component
2016-06-23
20160181139
METHOD OF TRANSFORMING AN ELECTRONIC DEVICE
2016-06-23
20160181140
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
2016-06-23
20160181141
WAFER PROCESSING METHOD
2016-06-23
20160181142
EDGE RING FOR A SUBSTRATE PROCESSING CHAMBER
2016-06-23
20160181143
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
2016-06-23
20160181144
METHOD FOR MANUFACTURING INTERCONNECT STRUCTURES INCORPORATING AIR GAP SPACERS
2016-06-23
20160181145
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
2016-06-23
20160181146
SHALLOW TRENCH ISOLATIONS AND METHOD OF MANUFACTURING THE SAME
2016-06-23
20160181147
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2016-06-23
20160181148
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2016-06-23
20160181149
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
2016-06-23
20160181150
Precursors Of Manganese And Manganese-Based Compounds For Copper Diffusion Barrier Layers And Methods Of Use
2016-06-23
20160181151
TITANIUM TUNGSTEN LINER USED WITH COPPER INTERCONNECTS
2016-06-23
20160181152
Semiconductor Device Metallization Systems and Methods
2016-06-23
20160181153
INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL
2016-06-23
20160181154
SEMICONDUCTOR DEVICE WITH MULTI-LAYER METALLIZATION
2016-06-23
20160181155
METHOD FOR MAKING AN INTEGRATED CIRCUIT IN THREE DIMENSIONS
2016-06-23
20160181156
SELF-ALIGNED INTERCONNECTION FOR INTEGRATED CIRCUITS
2016-06-23
20160181157
Through Silicon Via Structure and Method
2016-06-23
20160181158
METHOD AND STRUCTURE FOR A LARGE-GRAIN HIGH-K DIELECTRIC
2016-06-23
20160181159
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
2016-06-23
20160181160
METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
2016-06-23
20160181161
SUB-FIN DEVICE ISOLATION
2016-06-23
20160181162
GATE-ALL-AROUND FIN DEVICE
2016-06-23
20160181163
Method and Structure for Metal Gates
2016-06-23
20160181164
FIN FORMATION ON AN INSULATING LAYER
2016-06-23
20160181165
METHOD AND APPARATUS FOR REAL-TIME MONITORING OF PLASMA ETCH UNIFORMITY
2016-06-23
20160181166
METHOD OF FINE-TUNING PROCESS CONTROLS DURING INTEGRATED CIRCUIT CHIP MANUFACTURING BASED ON SUBSTRATE BACKSIDE ROUGHNESS
2016-06-23
20160181167
APPARATUS FOR FORMING A THIN LAYER AND METHOD OF FORMING A THIN LAYER ON A SUBSTRATE USNIG THE SAME
2016-06-23
20160181168
Environmental hardened packaged integrated circuit
2016-06-23
20160181169
ORGANIC-INORGANIC HYBRID STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
2016-06-23
20160181170
CRIMPING POWER MODULE
2016-06-23
20160181171
Integrated circuit with printed bond connections
2016-06-23