25th week of 2017 patent applcation highlights part 93 |
Patent application number | Title | Published |
20170181271 | WARPAGE MITIGATION IN PRINTED CIRCUIT BOARD ASSEMBLIES - Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace. | 2017-06-22 |
20170181272 | CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME - [Problem] To obtain a ceramic circuit board having superior crack-resistance with respect to ultrasonic bonding. | 2017-06-22 |
20170181273 | ASSEMBLY AND ELECTRONIC DEVICE - An assembly includes a carrier and an electrically conductive mesh, wherein the carrier includes a side surface with an edge, the electrically conductive mesh is attached to the side surface and extends over the edge of the side surface, and the edge has a radius at least as big as a minimal bending radius of electric lines of the electrically conductive mesh. | 2017-06-22 |
20170181274 | TAMPER-RESPONDENT ASSEMBLIES WITH ENCLOSURE-TO-BOARD PROTECTION - Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure. | 2017-06-22 |
20170181275 | GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS - In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for gradient encapsulant protection of devices in stretchable electronic. For instance, in accordance with one embodiment, there is an apparatus with an electrical device on a stretchable substrate; one or more stretchable electrical interconnects coupled with the electrical device; one or more electrical components electrically coupled with the electrical device via the one or more stretchable electrical interconnects; and a gradient encapsulating material layered over and fully surrounding the electrical device and at least a portion of the one or more stretchable electrical interconnects coupled thereto, in which the gradient encapsulating material has an elastic modulus greater than the stretchable substrate and in which the elastic modulus of the gradient encapsulating material is less than the electrical device. Other related embodiments are disclosed. | 2017-06-22 |
20170181276 | SUBSTRATE INCLUDING STRETCHABLE SHEET - A substrate is provided with: a stretchable sheet; a plurality of members located on the sheet; a plurality of strips that are stretchable, and that connect the plurality of members; and a plurality of fiber threads that sew the plurality of members and the sheet together. | 2017-06-22 |
20170181277 | FLEXIBLE SUBSTRATE INCLUDING STRETCHABLE SHEET - A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip. | 2017-06-22 |
20170181278 | Cellulose and Cellulosic Substrate-Based Device - A cellulosic substrate-based device is described, including a cellulosic substrate comprising a functionalized surface covalently functionalized by a chemical moiety in an amount sufficient to provide an omniphobic or hydrophobic surface; and a material printed on the functionalized surface, wherein the printed material has a line edge roughness of less than about 15 μm and/or a line lateral resolution of less than about 50 μm. | 2017-06-22 |
20170181279 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME - To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer. | 2017-06-22 |
20170181280 | STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME - The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode. | 2017-06-22 |
20170181281 | FPC CONNECTOR FOR BETTER SIGNAL INTEGRITY AND DESIGN COMPACTION - A computer system assembly that includes a substrate and a first board mounted on the substrate. A flexible cable is secured to the first board. The computer system assembly further includes a second board mounted on the substrate. The second board includes a FPC connector. The FPC connector includes a body having a channel extending through the body such that the flexible cable may be positioned in the channel and pulled entirely through the body of the FPC connector. The FPC connector further includes a latching mechanism that secures the flexible cable within the channel once the flexible cable is pulled through the FPC connector. The first board and the second board are moved closer together as the flex cable is pulled through the FPC connector before at least one of the first board and the second board is mounted on the substrate. | 2017-06-22 |
20170181282 | PRINTED WIRING BOARD - A printed wiring board including: a first substrate on which a plurality of pads to be connected to a connector is arranged to form a front array and a rear array in two rows; a second substrate that is laminated on the first substrate and formed with first wirings connected to first pads of the front array and second wirings connected through vias to second pads of the rear array; engageable parts that are to be engaged with engagement parts of the connector; and one or more reinforcement layers that are provided at the frontward side in the connecting direction than the engageable parts of the first substrate and/or the second substrate. The wirings each have a part formed to have a constant width along the inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width in the inserting direction of the connector. | 2017-06-22 |
20170181283 | PRINTED CIRCUIT BOARD AND OPTICAL MODULE - The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group. | 2017-06-22 |
20170181284 | COMPACT PACKAGE ASSEMBLY AND METHODS FOR THE SAME - A package assembly includes a device package having a package perimeter footprint. A package riser is coupled with the device package. The package riser includes a riser body having a riser perimeter footprint corresponding to the package perimeter footprint. The riser body includes a package face coupled with the device package and an opposed platform face. A riser flange is proximate to the package face. The riser flange extends from the riser body. A package clamp is coupled with the device package and the package riser. The package clamp includes a clamp face coupled with the device package, and one or more clamp legs clamped to the riser flange. The device package is clamped between the clamp face and the package face. | 2017-06-22 |
20170181285 | CABLE TERMINATION SYSTEM - A cable termination is disclosed that includes a cable with a first and a second insulated conductor positioned in a shield, the cable further including a drain wire. The cable is mounted on a circuit board that includes a first pad and a second pad that are respectively soldered to the first and second conductors. A ground via is positioned in front and between the first and second pads and the drain wire is inserted into and soldered to the ground via. | 2017-06-22 |
20170181286 | DEVELOPMENT OF THE ADVANCED COMPONENT IN CAVITY TECHNOLOGY - Embodiments of the invention include a printed circuit board (PCB) assembly that includes advanced component in cavity (ACC) technology and methods of forming such PCB assemblies. In one embodiment, the PCB assembly may include a PCB that has a cavity formed on a first surface of the PCB. A plurality of contacts may be formed in the cavity. The cavity provides a location where components may be electrically coupled to the PCB. Additionally, a package that is mounted to the PCB may extend over the cavity. Since the package passes directly over the component, the components may be used to electrically couple the package to one or more of the contacts formed in the cavity. Accordingly, embodiments of the invention allow for the surface area used for components to be reduced, and also improves electrical performance of the PCB assembly by positioning the components proximate to the package. | 2017-06-22 |
20170181287 | ELECTRONIC PACKAGE - An electronic package is provided, which includes a substrate and an antenna board structure disposed on the substrate. The antenna board structure has a first portion, a second portion and a partition portion between the first portion and the second portion. As such, current can be split into two paths so as to spread electromagnetic radiation, and thus produce electromagnetic radiation with a high bandwidth. | 2017-06-22 |
20170181288 | CAPACITOR AND CAPACITOR-CONTAINING BOARD - In a capacitor, a width in a length direction of a first portion of a third outer electrode, which is a portion located on a first side surface, is greater than a width in a length direction of a second portion of the third outer electrode, which is a portion located on a first main surface. The first portion of the third outer electrode does not extend to first and second end surfaces. | 2017-06-22 |
20170181289 | FLEXIBLE INTEGRATED CIRCUIT THAT INCLUDES AN ANTENNA - A flexible integrated circuit that includes a first dielectric layer having a first section at one polarity and a second section at an opposing polarity, wherein the first section and the second section are separated by dielectric material within first dielectric layer; a second dielectric layer having a first side wall that is electrically connected to the first section and a second side wall that is electrically connected to the second section; and a third dielectric layer having a base that is electrically connected to the first side wall and the second side wall, wherein the second dielectric layer is between the first dielectric layer and the third dielectric layer, wherein the base, the first and second side walls and the first and second sections form an antenna that is configured to send or receive wireless signals. | 2017-06-22 |
20170181290 | SUBSTRATE OR PANEL WITH RELEASABLE CORE - Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil. | 2017-06-22 |
20170181291 | Multi-component nanoinks for direct write applications - The present invention is directed to printing mixed ink systems, such as silver-copper or silver-copper-ceramic nanoparticle inks. | 2017-06-22 |
20170181292 | METHOD FOR FORMING ORGANIC COATING ON NICKEL SURFACE - A method for forming an organic coating on a surface of nickel or nickel alloy is disclosed. The method includes contacting the nickel surface with a composition comprising a specific pyrazine derived compound to prevent corrosion of nickel without forming known gold emersion film on the surface of the nickel. | 2017-06-22 |
20170181293 | Placement of Component in Circuit Board Intermediate Product by Flowable Adhesive Layer on Carrier Substrate - A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive. | 2017-06-22 |
20170181294 | PREPREG, LAMINATE, AND METHOD OF PRODUCTION OF PREPREG - A prepreg provided with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer is a layer which comprises a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer which contains the fiber base material, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness which is smaller than the thickness of the first resin layer, is provided. | 2017-06-22 |
20170181295 | DISPLAY DEVICE - A display device includes a first display panel, a second display panel opposite the first display panel, a frame positioned between the first display panel and the second display panel, a first opening formed on the frame and positioned on a lower back side of the first display panel, a second opening formed on the frame and positioned on an upper back side of the second display panel, a first printed circuit board (PCB) electrically connected to the first display panel and positioned in the first opening, and a second PCB electrically connected to the second display panel and positioned in the second opening. | 2017-06-22 |
20170181296 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND SUBSTRATE ADJUSTING METHOD - There is provided a display device including a jig that is provided with an insertion port into which a tip portion of an eccentric driver having the tip portion on an axis different from a central axis of a grip is inserted, a substrate that is provided with a long hole into which the grip is inserted, the long hole being long and narrow, a position of the substrate relative to the jig being movable within a predetermined movable range by rotation of the eccentric driver, the tip portion and the grip of the eccentric driver being inserted, and a base position fixing unit that fixes the substrate to a predetermined base position within the movable range. | 2017-06-22 |
20170181297 | Electronic Devices with Clips - A portable electronic device may have a clip. The clip may be mounted to a housing using hinge structures. The hinge structures may bias the clip towards a closed position. The clip may be opened to attach the portable electronic device to an object. When in the closed position, the clip may lie flush with the exterior of the device housing. Clip biasing may be provided using a torsion spring, a coil spring, a ribbon spring, a clip with built-in biasing, a tension spring, or a compression spring. A coupling mechanism may be used to attach the clip to the housing. The coupling mechanism may include a ratcheting rotatable mechanism, a fixed attachment structure, a flexible attachment structure, a removable structure, or a structure that includes a spring bias adjustment mechanism. The device may have a button with a touch sensor array. | 2017-06-22 |
20170181298 | HOUSING FOR RECEIVING ELECTRONIC COMPONENTS - A housing for receiving electronic components includes a housing body and a housing cover. The housing body and the housing cover are connected to one another at multiple fastening points. At least one of the fastening points is surrounded by recesses at least in part on the housing body or on the housing cover so that in the event of an internal pressure p | 2017-06-22 |
20170181299 | BATTERY COVER LOCKING MECHANISM OF A MOBILE TERMINAL AND METHOD OF MANUFACTURING THE SAME - The present invention provides a locking mechanism in a mobile terminal and method of manufacturing the same. The locking mechanism comprises a lock button, a slide latch, and spring member. The slide latch may slide between a first position and a second position and comprises a hole and snaps, the hole is on the top of the slide latch and extends through the slide latch, the snaps are at the front side of the slide latch. The lock button is in the hole and comprises a press part and a support part, the support part being connected to the press part and extending downward from the press part through the hole to be in contact with the contact part on the spring member; the spring member is fixed with the slide latch and comprises an spring reaction part, a contact part and a protrusion part, the contact part being in contact with the support part of the lock button and a force from the support part causing a spring deformation in the spring reaction part. | 2017-06-22 |
20170181300 | SEMICONDUCTOR MODULE - A semiconductor module includes sealing resin from which a main terminal protrudes, which seals an insulating substrate. The module includes a semiconductor element and a wiring substrate. The sealing resin has a nut housing portion in which a nut is disposed. The semiconductor module also has a busbar terminal to which a main terminal that protrudes from the sealing resin is electrically connected and which has an insertion hole facing the nut. | 2017-06-22 |
20170181301 | ELECTRONIC STORAGE AND TRANSMISSION DEVICE - A holding structure of an electronic storage and transmission device of the present invention has a storage and transmission body and a holding base. The storage and transmission body connects to a transmission connector through a connecting wire. The holding base has a receiving slot formed on a top surface of the storage and transmission body, and the transmission connector can be fixed in the receiving slot. Due to only an end portion of the connecting wire fixed on the holding base, the connecting wire can be fully expanded, operation freedom and connection angle are thereby increased; and by disposing the holding base, the transmission connector can be directly fixed in the holding base, so that a folded volume of the electronic storage and transmission device is reduced. Additionally, the electronic storage and transmission device can have functions of storing data and charging electronic devices at the same time. | 2017-06-22 |
20170181302 | CARD TRAY FOR ELECTRONIC DEVICE AND TRAY CARRIER ASSEMBLY USING THE SAME - A card tray for use in electronic devices is disclosed that can improve tray durability, eliminate the occurrence of resin flash during insert molding, and simplify the tray mold structure. The card tray for electronic devices according to a preferred embodiment may be a card tray for electronic device use for insertion into and withdrawal from a card socket of an electronic device with a card loaded thereon, comprising a tray body made of a nonmetallic material whereon is formed a card mounting hole or mounting recess for mounting the card, and a metal frame part that is coupled to the tray body so that the cross section protrudes from the front of the tray body. | 2017-06-22 |
20170181303 | MEMBRANE FOR LIQUID-RESISTANT DEVICES AND METHODS OF MAKING A MEMBRANE - A bracket assembly suitable for use with an electronic device is described. The bracket assembly may include a bracket body having a channel. The bracket assembly may further include a membrane embedded in the bracket body and designed to allow air, but not liquid (such as water), to pass through the membrane. The membrane may be at least partially surrounded by a membrane support molded to the membrane. The membrane and the membrane support may be disposed in a molding tool to receive a material used to mold the bracket body over the membrane and the membrane support. During the molding operation, the membrane support may act as a buffer to shield the membrane from temperature and pressure increases associated with the molding operation of the bracket body. The bracket assembly may improve the ability of the electronic device to prevent liquid ingress. | 2017-06-22 |
20170181304 | DISPLAY DEVICE AND CONTROLLING METHOD THEREOF - A display device may include a display panel, and first member, and a second member. The display panel has a first section and a second section. The first member includes an electromagnet, extends parallel to the first section and has a first side and a second side. The first side is oriented a first obtuse angle with respect to the second side. The second member directly contacts the first member, extends parallel to the second section, and has a third side and a fourth side. The third side is oriented a second obtuse angle with respect to the fourth side. The first member is connected through the second member to the second section. The second member is connected through the first member to the first section. | 2017-06-22 |
20170181305 | ELECTROMECHANICAL ASSEMBLY WITH FLOATING TERMINAL HOLDING FEATURES - An electromechanical assembly includes a generally planar printed circuit board (PCB), an electrical terminal electrically and mechanically connected to the PCB and projecting from a major surface of the PCB, and a housing formed of a dielectric material having a base portion and a terminal portion. The terminal portion defines a cavity and the electrical terminal is disposed within this cavity. The terminal portion is disposed within a aperture that is defined by the base portion. The electromechanical assembly defines a gap between the base portion and the terminal portion. The terminal portion is connected to the base portion by a pair of flexible beams which may have a serpentine or ogee curve shape, each of which is attached between one of two opposed sides of the base portion and the terminal portion. | 2017-06-22 |
20170181306 | SIDEWALL-ACCESSIBLE DENSE STORAGE RACK - Rack configurations provide increased storage device density without compromising cooling or immediate device availability. A device rack has a frame including posts which define an interior containing system board(s) with electronic device connectors. The system board is fixed relative to the frame, and the rack is devoid of sliding rails and cable management arms for the devices, thereby reducing rack weight and mechanical complexity. A vertical plenum within the rack between loaded system boards carries cooling air for the devices and may also permit use of a service robot to install or replace hot-pluggable hard disk drives or other devices, which can be arranged in columns. As one objective measure of the increased density provided, a connector density is at least a specified number of hundreds of mechanically and electronically releasably connectable electronic device connectors per cubic meter within the rack. | 2017-06-22 |
20170181307 | MULTI-RECEPTACLE HOUSING ASSEMBLY - A multi-receptacle housing assembly that includes a clamping assembly and a cover. The clamping assembly defines a first clamping section, a second clamping section and a cover support section. The first clamping section is located along a first side of the clamping assembly and is configured to clamp to a projection of an electronic device housing. The second clamping section is located along a second side of the clamping assembly opposite the first side and is configured to receive and support a plurality of electric receptacles. The cover removably is connected to the cover support section of the clamping assembly at least partially covering the first clamping section and the cover support section. The cover defines an opening dimensioned to expose at least a portion of the second clamping section and the plurality of electric receptacles. | 2017-06-22 |
20170181308 | ELECTRONIC UNIT HOLD DOWN ASSEMBLY - A hold down assembly for an electronic unit includes a locking washer having a cone at a front end thereof. The locking washer has a tang provided in the cone and extending forward from the cone. The cone is configured to receive a mounting hook of the electronic unit with a first side of the tang bearing against the mounting hook to lock the position of the locking washer relative to the mounting hook. An actuator knob is rotatably coupled to the locking washer. The actuator knob is configured to be tightened to a threaded shaft to tighten the hold down assembly to the electronic unit and drive the locking washer toward the mounting hook. | 2017-06-22 |
20170181309 | ELECTRONIC ASSEMBLY - An electronic assembly includes a supporting structure, a circuit board and at least one elastic component. The circuit board has at least one assembling hole and a first electrical connector, the circuit board is assembled to the supporting structure through the assembling hole, and the first electrical connector is adapted to connect to a second electrical connector. The elastic component is disposed at the assembling hole and includes at least one first compressible portion and a second compressible portion connected to each other. The first compressible portion is located outside the assembling hole and adapted to be compressed between the supporting structure and the circuit board along a first direction. The second compressible portion is located inside the assembling hole and adapted to be compressed between the supporting structure and the circuit board along a second direction and a third direction. The first, second and third directions are mutually perpendicular. | 2017-06-22 |
20170181310 | ELECTRICAL DISTRIBUTION BOX COMPRISING AN INPUT POWER BUSBAR - An electrical distribution box for an aircraft includes first housings configured to receive power modules, second housings configured to receive electronic control modules, and an interface configured for connection of the power and control modules and external electrical members. The interface includes at least one input power busbar extending into at least one of the first housings for connection to at least one of the power modules. The at least one input power busbar is adapted to be connected to a cable of a wiring harness for connection of the at least one power module to the wiring harness. | 2017-06-22 |
20170181311 | MICROSERVER SYSTEM - Microserver system includes blade servers, a middle-plane board, a network-management board, and a main control module. Each of the blade servers includes a CPU board electrically connected to the middle-plane board. The network management board is electrically connected to the CPU boards through the middle-plane board, and the CPU boards can communicate with each others through the network management board. The main control module electrically connected to the middle-plane board includes a power-supply module and a system-management module. The power-supply module is electrically connected to the CPU boards and the network-management board through the middle-plane board. The system-management module respectively receives system-statue signals from the CPU boards through the middle-plane board, and the system-management module is configured to generate a power-supply controlling signal and a network-managing-board controlling signal, and transmit to the power-supply module and the network-management board respectively. | 2017-06-22 |
20170181312 | REVERSE MOUNT APPARATUS FOR A RACK-MOUNTED SYSTEMS - An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket. | 2017-06-22 |
20170181313 | ADJUSTABLE SNAP-IN RAIL ASSEMBLY FOR STORAGE RACK - A rail assembly for a storage rack that includes, in one aspect, a first rail member, a second rail member, and a nut assembly slidably mounted to the second rail member. The first rail member may include a first mounting aperture extending through a body of the first rail member and the second rail member may include a first mounting slot extending through a body of the second rail member for a predefined dimension along a longitudinal axis. The sliding nut assembly may be slidably mounted adjacent the first mounting slot to a longitudinal position aligned with the first mounting aperture such that a fastener may be received through the first mounting aperture and first mounting slot and threaded into the first nut assembly to lock the first and second rack members against relative movement and fix the rail assembly to the front and rear pillars. | 2017-06-22 |
20170181314 | BAY FOR REMOVABLE DEVICE - According to some examples, a bay is provided to receive at least a portion of a housing of a removable device, where the bay includes a management controller to communicate a management signal to the removable device received by the bay, and a cooling mechanism to provide airflow to the removable device received by the bay. The removable device may be one that receives an optical cable, receives an electrical cable, converts a first optical signal received through the optical cable to a first electrical signal transmitted through the electrical cable, and converts a second electrical signal received through the electrical cable to a second optical signal transmitted through the optical cable. | 2017-06-22 |
20170181315 | Switch chassis with flexible topology - A method for communication includes providing multiple chassis. Each chassis includes a plurality of slots, which are arranged in at least an outer tier and a middle tier, and which are configured for insertion therein of respective switches. In at least a first chassis among the multiple chassis, first internal interconnects are connected between the slots in the middle tier and the slots in the outer tier, so as to connect each of the slots in the middle tier to multiple slots in the outer tier. In at least a second chassis among the multiple chassis, second internal interconnects are connected directly between the slots in the outer tier. External interconnects are connected between at least some of the slots in the outer tier of the first chassis and at least some of the slots in the outer tier of the second chassis in order to define a network. | 2017-06-22 |
20170181316 | HEAT DISSIPATING DEVICE AND SWING STRUCTURE THEREOF - A swing structure of a heat dissipating device includes an elongated blade and a magnetic actuation disposed on the blade. The blade has a loading segment and a heat dissipating segment, two opposite end portions of the loading segment are respectively defined as a mounting end portion and a connecting end portion, and two opposite end portions of the heat dissipating segment are respectively defined as a positioning end portion and a free end portion. The connecting end portion is connected to the positioning end portion. A thickness of the loading segment is greater than that of the heat dissipating segment. When the magnetic actuation is driven by a magnetic field to swing the blade, a swing angle of the free end portion of the heat dissipating segment is greater than that of the connecting end portion of the loading segment. | 2017-06-22 |
20170181317 | LIQUID-COOLING HEAT SINK - A liquid-cooling heat sink has a heat-conductive tube and multiple heat-conductive units arranged adjacent to the heat-conductive tube. The heat-conductive tube has a first tube and a second tube. An isolation member having an isolation channel is located between the first tube and the second tube. The isolation member obstructs the heat exchange between the first tube and the second tube. A first delivery tube and a second delivery tube of each one of the heat-conductive bodies respectively connect to the first tube and the second tube of the heat-conductive tube, thereby integrating the first tube and the second tube and obstructing the heat exchange between the cooling liquids with different temperatures. Each of the heat-conductive units distributes the cooling liquids with different temperatures by the heat-conductive tube, thereby simplifying the pipeline setting and reducing the volume of the liquid-cooling heat sink. | 2017-06-22 |
20170181318 | COMPOSITE HEAT ABSORPTION DEVICE AND METHOD FOR OBTAINING SAME - Production of a heat absorption device comprising a first face intended to be in contact with a hot source and a second face opposite to the first face, a network of cells filled with a first phase change material being arranged between the first face, a passage between cells being filled with at least one second phase change material different from the first phase change material. | 2017-06-22 |
20170181319 | COOLING APPARATUS - The invention relates to a cooling apparatus, comprising a first evaporator section with first channels, and a first condenser section with second channels. In order to provide adequate cooling for electric components the cooling apparatus further comprises a second evaporator section with third channels, and a base plate with a first surface for receiving a heat load from electric components. The first condenser section is in fluid communication with the second evaporator section for receiving fluid from the second evaporator section, for passing heat from the fluid to surroundings and for returning fluid to the second evaporator section. | 2017-06-22 |
20170181320 | HEAT RECEIVER, COOLING UNIT, AND ELECTRONIC DEVICE - A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency. | 2017-06-22 |
20170181321 | LIQUID COOLED RACK INFORMATION HANDLING SYSTEM HAVING STORAGE DRIVE CARRIER FOR LEAK CONTAINMENT AND VIBRATION MITIGATION - A direct-contact liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes having a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components. The LC node configured with a system of conduits to receive direct contact of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. The chassis has a leak containment barrier configured with a trough that underlays a portion of the system of conduits of the LC node and that forms a drain path to a drain port of the chassis. In one or more embodiments, the storage drive carrier has vibration absorbing material that mitigates vibrations of a storage drive placed in the storage drive carrier. | 2017-06-22 |
20170181322 | SCALABLE RACK-MOUNT AIR-TO-LIQUID HEAT EXCHANGER - An Information Handling System (IHS) includes at least one node provisioned with heat-generating components and an air passage that enables air to pass through the node and exit the node as exhaust air. An air-to-liquid heat exchanger (ATLHE) block is placed in a path of the exhaust air. The ATLHE block has an air directing structure, one or more air movers to move the exhaust air through the air directing structure, and an ATLHE. The ATLHE includes a liquid transfer conduit having at least one liquid supply port extending into a heat transfer section, which terminates into at least one liquid return port, the liquid transfer conduit enabling cooling liquid transfer through the ATLHE. A liquid cooling subsystem includes supply and return conduits. The supply conduit is sealably mated to the at least one supply port and the return conduit is sealably mated to the at least one return port. | 2017-06-22 |
20170181323 | RACK INFORMATION HANDLING SYSTEM HAVING MODULAR LIQUID DISTRIBUTION (MLD) CONDUITS - A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node. | 2017-06-22 |
20170181324 | INTEGRATED AIR-SPRING FOR HYDRAULIC FORCE DAMPING OF A RIGID LIQUID COOLING SUBSYSTEM - A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively. | 2017-06-22 |
20170181325 | INFORMATION HANDLING SYSTEM HAVING FLEXIBLE CHASSIS BLOCK RADIATORS - A liquid handling (LH) block of an Information Handling System (IHS) having a first transfer conduit having node-receiving intake port/s sealably engaged for fluid transfer to node intake port/s of Liquid Cooled (LC) node/s and having supply connection/s. A second transfer conduit has node-receiving outlet port/s sealably engaged for fluid transfer to LC node output port/s of the LC node/s and having return connection/s. A radiator includes a portion of the second transfer conduit. A cooling liquid distribution subsystem has a user selectable first and second sets of liquid conduits connectable to the module in one of an open-loop configuration utilizing facility supplied cooling liquid and a closed-loop configuration to recirculate cooling liquid between the block radiator and the node-level system of conduits. | 2017-06-22 |
20170181326 | LIQUID FLOW CONTROL BASED UPON ENERGY BALANCE AND FAN SPEED FOR CONTROLLING EXHAUST AIR TEMPERATURE - A computer-implemented method regulates exhaust air temperature from direct interface liquid-cooled (DL) nodes in a rack information handling system (RIHS). The method includes receiving a first input corresponding to a desired ambient temperature of an exterior space and a second input is corresponding to an amount of heat being dissipated from functional components operating within an interior space of at least one LC node. An ambient temperature reading of the exterior space is received. A flow rate is calculated for liquid flowing through an air-to-liquid heat exchange (ATLHE) subsystem that results in an amount of heat exchange in the ATLHE subsystem, which generates exhaust air at a temperature that causes a change in the ambient temperature towards the desired ambient temperature. The flow rate is dynamically adjusted of the liquid flowing through the ATLHE subsystem to the calculated flow rate. | 2017-06-22 |
20170181327 | RUNTIME SERVICE OF LIQUID COOLED SERVERS OPERATING UNDER POSITIVE HYDRAULIC PRESSURE WITHOUT IMPACTING COMPONENT PERFORMANCE - A method provides a service mode within a direct-injection liquid-cooled (DL) Rack Information Handling System (RIHS) having at least one liquid-cooled (LC) node. The method includes: in response to detecting selection of the service mode trigger, transmitting a first control signal to cause a proportional valve to move to an open position for enhanced cooling of the node; monitoring a temperature being sensed in the node; and in response to the temperature reaching a pre-established service mode temperature: forwarding a second control signal, to cause the proportional valve to move to a fully closed position; and generating a notification of an entry of the RIHS into a service mode during which an LC node can be re-engaged with the supply and return port, without affecting an operational on-state of the RIHS and without incurring significant hydraulic pressure when re-engaging the LC node with the liquid cooling system. | 2017-06-22 |
20170181328 | RACKMOUNT APPLIANCE FOR SERVER AND RACK LIQUID MANAGEMENT AND WATER CONTROL POLICY EXECUTION - A Rack Information Handling System (RIHS) has more than one liquid cooled (LC) node containing heat-generating functional components, each LC node configured with a system of conduits to receive cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A liquid control subsystem includes electrically-actuated control valves that selectively distribute cooling liquid to LC nodes each comprising a chassis received in a respective chassis-receiving bay of a rack. Liquid sensors detect a parameter of the liquid control subsystem. A liquid controller communicatively coupled to the electrically-actuated control valves and the liquid sensors detect a rack-level liquid event based at least in part on the parameter and communicates to any LC node that is affected by the rack-level liquid event. | 2017-06-22 |
20170181329 | LIQUID COOLED RACK INFORMATION HANDLING SYSTEM HAVING LEAK MANAGEMENT SYSTEM - A Rack Information Handling System (RIHS) has a liquid cooling subsystem that provides cooling liquid to liquid cooled (LC) nodes received in chassis-receiving bays of a rack. Leak collection structures are positioned to receive cooling liquid that leaks from the liquid cooling subsystem. Liquid sensors detect a presence of leaked cooling liquid in the leak collection structures. A leak detection subsystem responds to a detected presence of liquid by providing a leak indication. In one or more embodiments, the liquid cooling subsystem has a liquid rail formed by more than one rack interconnections vertically aligned in a rear section of the rack that are connected by modular rail conduits for node-to-node fluid transfer. The leak collection structures include a pipe cover received over at least one modular rail conduit. A liquid cavity of each pipe cover spills over into another lower pipe cover at a rate that can be correlated to severity of the leak. | 2017-06-22 |
20170181330 | HEAT DISSIPATION DEVICE AND UAV USING THE SAME - A heat dissipation device includes an air guiding cover and a heat conduction plate. The air guiding cover includes an air duct configured to guide an airflow and including a mounting window formed on a sidewall of the air duct, an air inlet formed at a first end of the air duct, and an air outlet formed at a second end of the air duct. The heat conduction plate is disposed at the mounting window and covers the mounting window. | 2017-06-22 |
20170181331 | POWER POLE ISOLATED HEAT PIPE INVERTER ASSEMBLY - A power pole inverter ( | 2017-06-22 |
20170181332 | LIQUID-COOLED ELECTRIC DRIVE COMPONENT, POWERTRAIN, VEHICLE AND METHOD - A liquid-cooled electric drive component for a powertrain of a vehicle includes a first housing part and a second housing part. The first and second housing parts are joined to one another by a fluid-tight welded joint and configured such as to form at least a segment of a cooling duct. The vehicle can be a hybrid vehicle or an electric vehicle. | 2017-06-22 |
20170181333 | POWER CONVERSION APPARATUS - A power conversion apparatus includes a first power converter, second power converter, a case, and partitioning portion. The first power converter performs power conversion. The second power converter performs power conversion. The case houses the first power converter and the second power converter. The partitioning portion partitions the first power converter and the second power converter housed in the case, and forms a coolant flow passage through which a coolant flows. The first power converter includes a first heat-generating component. The second power converter includes a second heat-generating component. The first heat-generating component and the second heat-generating component are each joined to the partitioning portion at a position at which the first heat-generating component and the second heat-generating component do not overlap each other in a perpendicular direction perpendicular to a coolant flow direction of the coolant flow passage. | 2017-06-22 |
20170181334 | ELECTROMAGNETIC INTERFERENCE SHIELDS FOR ELECTRONIC PACKAGES AND RELATED METHODS - Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate. | 2017-06-22 |
20170181335 | SHIELD COVER AND ELECTRONIC APPARATUS - A shield cover includes a cover body that is formed of a metal plate and for covering an electronic component, a leaf spring formed by cutting a part of the cover body, and a projection that is disposed on the leaf spring and projects in the thickness direction of the leaf spring. | 2017-06-22 |
20170181336 | SOLDERABLE TWO PIECE BOARD LEVEL SHIELDS - According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (BLS). In an exemplary embodiment, the BLS is solderable to a printed circuit board (PCB). The BLS includes a lid or cover and a fence or frame. The lid and fence are complementary in shape. The lid may be mounted onto the fence via a locking mechanism in a first position and a compressed second position, where the locking mechanism provides resistance against internal upward forces when the BLS has been compressed into a second position. The BLS may be soldered to the PCB while in the first position, and subsequently compressed into the second position after the solder has hardened. | 2017-06-22 |
20170181337 | ELECTROMAGNETIC SHIELDING COMPONENT AND ELECTRIC WIRE ASSEMBLY WITH ELECTROMAGNETIC SHIELDING COMPONENT - An object is to prevent electric wires from being brought into contact with, and being damaged by, an edge of a rigid pipe of an electromagnetic shielding component, without need for an additional component such as a cover for an end portion of the pipe, despite the increased density of the electric wires within a hollow space in the pipe. A shielding pipe includes an expanded-diameter portion that is an end portion whose inner and outer circumferential surfaces each have a diameter that is greater than diameters of inner and outer circumferential surfaces of a portion that is contiguous with the expanded-diameter portion. A ring-shaped coupling member holds an overlapping portion of a flexible shielding member, the overlapping portion being sandwiched between the coupling member and the inner circumferential surface of the shielding pipe. The overlapping portion overlaps the inner circumferential surface of the expanded-diameter portion. | 2017-06-22 |
20170181338 | FLEXIBLE SUBSTRATE RETENTION ON A REUSABLE CARRIER - The present disclosure is directed to a system to manufacture an electronic circuit assembly. In one embodiment, the system includes a flexible substrate with a substrate registration feature and a carrier with a carrier registration feature. A removable fastener removably fixes the flexible substrate to the carrier by being received into the substrate registration feature and the carrier registration feature. Once the flexible substrate is removably affixed to the carrier, the carrier provides the flexible substrate with rigidity to receive at least one electronic device of the electronic circuit assembly. Other embodiments may be described and/or claimed. | 2017-06-22 |
20170181339 | ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS AND METHODS OF USE THEREOF - A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate. | 2017-06-22 |
20170181340 | METHODS OF POSITIONING A COMPONENT IN A DESIRED POSITION ON A BOARD, PICK AND PLACE MACHINES, AND SENSORS FOR SUCH PICK AND PLACE MACHINES - A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer. | 2017-06-22 |
20170181341 | WORKING APPARATUS AND WORKING METHOD - A working apparatus includes a component holder that holds a component and mounts the component at a predetermined position of a work. In the working apparatus, the component holder that holds a component is configured to include a pair of grip members that pinch and grip the component, a grip member opening/closing portion that opens and closes the pair of grip members with an opening/closing motor as a drive source, a pair of contact portions that are disposed on the pair of grip members and freely rotate around a rotary shaft provided in an opening/closing direction of the grip member, and a contact portion driving portion that causes a roller, which is provided to be in contact with a side of a nozzle shaft, to convert a lifting and lowering motion of a nozzle shaft into a rotational motion of a spline shaft, and that causes the rotational motion to be transmitted to the contact portion via a plurality of rollers such that the contact portion rotates around the rotary shaft. | 2017-06-22 |
20170181342 | APPARATUS AND METHOD FOR FEEDING ELECTRONIC COMPONENTS FOR INSERTION ONTO CIRCUIT BOARDS - An apparatus and method for feeding electronic components for insertion onto circuit boards, the apparatus comprising; a vibratory bowl configured for receiving electronic components and for lining up the electronic components onto a moveable conveyor, the vibratory bowl is configured for vibrating and guiding each of the electronic components towards an opening in the vibratory bowl where each of the electronic components is transferred to the conveyor; a component processing unit configured for checking operation of each of the electronic components lined up along the conveyor and for removing any defective electronic component failing the operation check; and a component feeder configured for transferring each of the electronic components that are non-defective to a machine for handling insertion of the electronic components onto circuit boards. | 2017-06-22 |
20170181343 | Interspecific tree named 'CARLSBAD' - A new and distinct variety of interspecific tree. The following features of the tree and its fruit are characterized with the tree budded on ‘Nemaguard’ Rootstock (non-patented), grown on Handford sandy loam soil with Storie Index rating 95, in USDA Hardiness Zone 9, near Modesto, Calif., with standard commercial fruit growing practices, such as pruning, thinning, spraying, irrigation and fertilization. Its novelty consist of the following combination of desirable features:
| 2017-06-22 |
20170181344 | Interspecific tree named 'DAPPLE DELIGHT' - A new and distinct variety of interspecific tree. The following features of the tree and its fruit are characterized with the tree budded on ‘Nemaguard’ Rootstock (non-patented), grown on Handford sandy loam soil with Storie Index rating 95, in USDA Hardiness Zone 9, near Modesto, Calif., with standard commercial fruit growing practices, such as pruning, thinning, spraying, irrigation and fertilization. Its novelty consist of the following combination of desirable features:
| 2017-06-22 |
20170181345 | Cherry tree named 'JFS-KW14' - A variety of ornamental cherry that combines a strongly upright branch habit, a narrow form, bright pink double flowers, and an early flowering date. | 2017-06-22 |
20170181346 | Daphne 'MonMkie' - A new and distinct | 2017-06-22 |
20170181347 | Mahonia plant named 'sPg-15-1' - A new and distinct | 2017-06-22 |
20170181348 | Physocarpus plant named 'Minall2' - A new and distinct cultivar of | 2017-06-22 |
20170181349 | Lobularia plant named 'DLOBRASTRM' - A new and distinct | 2017-06-22 |
20170181350 | Phalaenopsis orchid plant named 'PHALBUKALO' - A new and distinct variety of | 2017-06-22 |
20170181351 | Phalaenopsis orchid plant named 'Phalfoyx' - A new and distinct variety of | 2017-06-22 |
20170181352 | Phalaenopsis orchid plant named 'PHALDUEL' - A new and distinct variety of | 2017-06-22 |
20170181353 | Lomandra Plant Named 'Muru' - ‘Muru’ is a distinctive cultivar of | 2017-06-22 |
20170181354 | Salvia plant named 'Novasalpur' - A new and distinct | 2017-06-22 |
20170181355 | Salvia plant named 'NOVASALFUC' - A new and distinct | 2017-06-22 |
20170181356 | Salvia plant named 'Novasalred' - A new and distinct | 2017-06-22 |
20170181357 | Variety of Calla Lily Plant Named 'Halifax' - ‘Halifax’ is a new variety of calla lily plant having inflorescences with a white/purple-colored spathe that produces 3-10 inflorescences per tuber. The height of the top of an inflorescence above the soil can reach up to 47 cm, and the leaves are dark green with whitish spots and have a leathery texture. | 2017-06-22 |
20170181358 | Variety of Calla Lily Plant Named 'Copacabana' - ‘Copacabana’ is a new variety of calla lily having inflorescences with a yellow-colored spathe that produces 4-10 inflorescences per tuber. The inflorescence stems are about 60-80 cm in height, and the leaves are green with whitish spots and have a leathery texture. | 2017-06-22 |
20170181359 | Variety of calla lily plant named 'Monte Carlo' - ‘Monte Carlo’ is a new variety of calla lily having inflorescences with a yellow-colored spathe that produces 5-20 inflorescences per tuber. The inflorescence stems are about 22-50 cm in height, and the leaves are green with whitish spots and have a leathery texture. | 2017-06-22 |
20170181360 | Variety of Calla Lily plant named 'Airbrush' - ‘Airbrush’ is a new variety of calla lily having inflorescences with a white/purple-colored spathe that produces 4-28 inflorescences per tuber. The inflorescence stems are about 28-57 cm in height, and the leaves are green and have a leathery texture. | 2017-06-22 |
20170181361 | Variety of calla lily plant named 'Cancun' - ‘Cancun’ is a new variety of calla lily having inflorescences with an orange-colored spathe that produces 4-18 inflorescences per tuber. The inflorescence stems are about 24-50 cm in height, and the leaves are green and have a leathery texture. | 2017-06-22 |
20170181362 | Variety of Calla Lily plant named 'SANTIAGO' - ‘Santiago’ is a new variety of calla lily having inflorescences with a purple/red-colored spathe that produces 5-25 inflorescences per tuber. The inflorescence stems are about 19-40 cm in height, and the leaves are green with whitish spots and have a leathery texture. | 2017-06-22 |
20170181363 | Variety of calla lily plant named 'New York' - ‘New York’ is a new variety of calla lily having inflorescences with a pink-colored spathe that produces 5-25 inflorescences per tuber. The inflorescence stems are about 27-47 cm in height, and the leaves are green with whitish spots and have a leathery texture. | 2017-06-22 |
20170181364 | Variety of Calla Lily plant named 'Purple Spirit' - ‘Purple Spirit’ is a new variety of calla lily having inflorescences with a purple-colored spathe that produces 5-30 inflorescences per tuber. The inflorescence stems are about 20-49 cm in height, and the leaves are green with whitish spots and have a leathery texture. | 2017-06-22 |