25th week of 2019 patent applcation highlights part 86 |
Patent application number | Title | Published |
20190191561 | LOAD REDUCED MEMORY MODULE - The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel. | 2019-06-20 |
20190191562 | CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE - A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface. | 2019-06-20 |
20190191563 | PRINTED CIRCUIT BOARD, MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME - A printed circuit board (PCB) includes a first insulating layer, a pad disposed on the first insulating layer, and a first reference layer on which the first insulating layer is disposed, the first reference layer including a dielectric passage for forming a return path of a signal that is transmitted to the pad, and a conductive line disposed in the dielectric passage and disposed to form a transmission path of the signal. The PCB further includes a second insulating layer on which the first reference layer is disposed, and a second reference layer on which the second insulating layer is disposed, the second reference layer further forming the return path. A capacitance of the pad corresponds to a distance between the pad and the second reference layer. | 2019-06-20 |
20190191564 | PRINTED CIRCUIT BOARD - A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board has a signal conductor pattern and a resonance portion resonating with a plurality of resonance frequencies. The resonance portion has a plurality of conductor patterns aligned while separated each other to oppose to the ground conductor pattern through an insulating layer. The plurality of conductor patterns are arranged so as to oppose to the ground conductor pattern which is connected to a ground terminal of the semiconductor package. The resonance portion has a connecting conductor connecting the conductor patterns adjacent to each other. The resonance portion has a via conductor connecting the conductor pattern with the signal conductor pattern. The printed circuit board can reduce an exclusive region of the resonance portion interrupting a plurality of harmonic components, and can reduce EMI originating in a digital signal. | 2019-06-20 |
20190191565 | ELECTRONIC DEVICE AND MULTILAYER CERAMIC SUBSTRATE - An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal. | 2019-06-20 |
20190191566 | Electronic Assembly With A Component Arranged Between Two Circuit Carriers, and Method For Joining Such An Assembly - Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier. | 2019-06-20 |
20190191567 | METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND SUBSTRATE FOR FABRICATING THE SAME - A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface. | 2019-06-20 |
20190191568 | THINNED FLEXIBLE POLYIMIDE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a thinned flexible polyimide substrate and a method for manufacturing the same. The thinned flexible polyimide substrate comprises a polyimide resin, a conductor layer, and a polyimide insulating layer. The polyimide resin has a linear thermal expansion coefficient of less than 40 ppm/K. The conductor layer is formed of a plurality of stacked metal nanoparticles having pores therebetween, and each of the pores has a size between 0.1 μm and 1 μm. A portion of the polyimide resin fills into the pores. The polyimide insulating layer is formed of the polyimide resin coated on the conductor layer. | 2019-06-20 |
20190191569 | COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME - Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film. | 2019-06-20 |
20190191570 | MEMORY MODULE CARD STRUCTURE - A memory module card structure includes a main board, a plurality of adhesive layers and a plurality of conduction skirting boards. Two surfaces of the main board respectively are divided into a mounting section and an inserting section. The inserting section is formed with a binding region, and a soldering region having solder pads electrically connected to the mounting section. The conduction skirting boards are correspondingly fixed to the inserting section, and each has a rigid substrate and a plurality of conductive pads. The conductive pad has an outer contacting part disposed on an outer surface of the rigid substrate and an adapting part formed through the rigid substrate and connecting the outer contacting part. A part of the conductive pad correspondingly is soldered to the solder pad. A part of the rigid substrate is fixed connected to the binding region by the adhesive layer. | 2019-06-20 |
20190191571 | ELECTRONIC MODULE CARD WITH BYPASS CAPACITOR - An electronic module card with bypass capacitor includes a main board, an adhesive layer and a conduction skirting board. The main board has an inserting section and a plurality of solder pads disposed on a soldering region of the inserting section. At least one solder pad has a first extending part extending therefrom. The conduction skirting board is fixed to the inserting section, and has a rigid substrate and a plurality of conductive pads. Each conductive pad has an outer contacting part, and an adapting part. A gap is formed between the conduction skirting board and the main board. At least one conductive pad has a second extending part extended from the adapting part along an inner surface of the rigid substrate. A part of the second extending part is partially overlapped above a part of the first extending part so as to form a bypass capacitor. | 2019-06-20 |
20190191572 | WIRING BOARD - A wiring board includes an insulator layer, a wiring layer including a wiring pattern and formed on one surface of the insulator layer, an inorganic layer covering a region of the one surface of the insulator layer not formed with the wiring layer, and covering an upper surface and side surfaces of the wiring pattern along a concavo-convex of the wiring pattern, and a shield part covering the wiring pattern via the inorganic layer. | 2019-06-20 |
20190191573 | BOARD HOLDING APPARATUS - A board holding apparatus holds an electric circuit board between a first case and a second case. The board holding apparatus includes locking parts that lock the first case and the second case together in a thickness direction of the electric circuit board such that the first case and the second case are not separated from each other and a bearing surface formed on the second case, the electric circuit board coming into contact with the bearing surface in the thickness direction. The board holding apparatus includes a spring that generates an elastic force, with the locking parts locking the first case and the second case together, the spring being formed on the first case and the elastic force pressing the bearing surface through the electric circuit board. | 2019-06-20 |
20190191574 | TILED DISPLAY DEVICE AND TILING APPARATUS THEREFOR - A display includes a display panel having elements that allow attachment to a mounting structure therebehind and in alignment with adjacent display panels that collectively form a tiled display screen that has multiple display panels connected to each other with effectively seamless bezels. The elements are configured to allow the display panel to be attached to or detached from the tiled display screen in a particular direction other than a side direction that would only allow for engagement from the sides of the adjacent display panels. | 2019-06-20 |
20190191575 | FIRE AND WATER RESISTANT ANKLE MONITOR - A fire and water proof ankle monitor comprising a CPU operating the various components of the ankle monitor comprised of a communication module, a global positioning system module, a tamper sensor, a power system, and a strap lock. An encapsulating casing comprising a one-piece polycarbonate structure sealing the components so as to totally isolate the components. | 2019-06-20 |
20190191576 | UNIVERSAL COMPANION INTERFACE FOR GATEWAY - The technology described herein is generally directed towards a gateway device (e.g., a cable modem or telecommunications modem) that is coupled to a base component. The base component couples to an interchangeable lid that is coupled to an electronic device. This forms a sealed housing for outdoor use, e.g., between a provider head end and the subscriber(s). A universal interface provides power or a network connection, or both, to the electronic device. The base component and/or the sealed housing protect the internal components against environmental effects. The base component and/or the sealed housing protect against external RF signals from entering, and internally generated RF signals from exiting. | 2019-06-20 |
20190191577 | FRONT MAINTENANCE APPARATUS FOR TILED LED DISPLAY - A tiled display which allows removal of display tiles in a controlled manner as well as access to the back of a display tile of the tiled display without having necessarily an opening in the display tile through which a tool to trigger a release mechanism would have to be inserted. Some of the display tiles can have at least one cylindrical element fastened to the display tile by an intermediary of a fastener positioned at one end of the cylindrical element. The cylindrical element is fixed to such tiles with the fastener. An actuator is provided to pull in the display tile to fit within the plane of the tiled display by activating a non-contact sensor with a dedicated non-contact device in a vicinity of the display tile until the tile slides in. The non-contact device emits a control signal received by the non-contact sensor. | 2019-06-20 |
20190191578 | MAGNETIC BLOCK LOCKING OF AN ELECTRONIC DEVICE - An electronic device or electronic device assembly may comprise a first portion and a second portion, a first magnet disposed inside the first portion and rotatable about a pivot axis with respect to the first portion, and a second magnet disposed inside the second portion and rotatable about a pivot axis with respect to the second portion. The first and second magnet may be configured to rotate so that the first and second magnets magnetically engage each other when the distance between the first and second magnet is equal to or smaller than a first distance. | 2019-06-20 |
20190191579 | DEVICES AND ACCESSORIES EMPLOYING A LIVING HINGE - A device incorporating both a magnet and a living hinge may be employed to construct cases to protect electronic devices and to function as a closure for cases and lidded containers. Such cases often can be bent three 360° allowing the cases to be either closed protecting devices therein are closed upon themselves allowing the case to function to secure an electronic device to a substrate such as an article of clothing. The devices of the disclosure can also be used to organize and hold loose items together. | 2019-06-20 |
20190191580 | WEARABLE DEVICE - A wearable device is provided, including a shell, a body installed in the shell to implement a function of the wearable device, and a detachable part. The detachable part is detachably installed on the shell. An air hole is provided on the shell, a first end of the air hole is located on a surface of the shell that faces the body, and a second end of the air hole is located on a surface of the shell that faces away from the body. The detachable part and the shell jointly form a dirt collection groove and at least one air channel, the air hole communicates with the at least one air channel through the dirt collection groove, and an end of the air channel that faces away from the dirt collection groove communicates with an external environment of the shell. | 2019-06-20 |
20190191581 | Control Board Enclosure With Sliding Platform - A control board enclosure with a slideable platform configured for use within an air handler. The control board enclosure is configured such that the humidity within the enclosure is stabilized or more stable as compared to the more rapid changes in humidity that may be occurring externally. The control board enclosure is substantially sealed or air tight through the use of gaskets, sealant, and/or close fittings that the rapid changes in humidity of the external environment are less likely to affect objects within the enclosure. This humidity stabilization can improve the longevity of the control board stored therein. | 2019-06-20 |
20190191582 | CONFORMABLE DISPLAY WITH LINEAR ACTUATOR - This disclosure relates to conformable displays, including macro-fiber composite (MFC) actuators. The MFC actuators are configured to displace the conformable displays in a linear direction. The conformable displays can be thin, flexible and deformable. | 2019-06-20 |
20190191583 | ELECTRONICS ENCLOSURE SYSTEMS AND METHODS - An enclosure assembly for electronic equipment using a housing and a sled. The sled is a combination of a bracket with a skid, the skid preferably of a low friction material, where the sled slides into the housing in order to complete the assembly. | 2019-06-20 |
20190191584 | APPARATUS FOR MOUNTING A PROCESSOR FOR CLUSTER COMPUTING - A bracket for mounting a processor and a support structure for receiving bracket-supported processors for duster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures. | 2019-06-20 |
20190191585 | High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices - The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate. | 2019-06-20 |
20190191586 | MULTILEVEL HIERARCHICAL ARCHITECTURE FOR POWER DISTRIBUTION SYSTEMS - A power distribution assembly according to an example of the present disclosure includes, among other things, a housing at least partially receiving a plurality of hardware modules coupled to a backplane, the plurality of hardware modules including at least one output module and a communications module that communicates information between the plurality of hardware modules and a second power distribution assembly. At least one hardware module of the plurality of hardware modules includes a field programmable gate array that commands the at least one output module to selectively power at least one aircraft system. A method of operation of a power distribution system is also disclosed. | 2019-06-20 |
20190191587 | APPARATUS FOR MOUNTING PROCESSORS FOR CLUSTER COMPUTING - A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures. | 2019-06-20 |
20190191588 | Electronics Cabinet With Integrated Cooling System, Reconfigurable Mounting System, or Both - Systems and apparatus for housing electronics for industrial systems, such as industrial product marking systems, include a cabinet including: a frame defining an exterior channel; a side panel that attaches to the frame, and a handle located in the side panel and defining a vent hole within the handle, the vent hole being aligned with the channel, thereby allowing air to cool equipment when present within an interior portion of the frame. The systems and apparatus further include a cabinet including: a frame; and a panel configured to attach to a side of the frame separate from its two walls; wherein each of the two walls on opposite sides of the frame defines a shape that receives a structure to support the cabinet and receives fasteners on both sides of the wall to mount equipment on both an interior portion of the frame and an exterior portion of the frame. | 2019-06-20 |
20190191589 | Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling - This document describes techniques for implementing phase-change cooling in a three-dimensional structure. A three-dimensional structure having three-dimensional curvatures is fabricated to include a phase-change chamber with a fluid in a saturated thermodynamic state. As part of fabrication, specific mechanisms may be included that create a thermo-mechanical network that improves thermal performance of the phase-change chamber and also provides structural integrity to the three-dimensional structure. | 2019-06-20 |
20190191590 | SECURITY PANELS FOR USE IN DATA CENTERS - Disclosed is an integrated data center that provides for efficient cooling as well as efficient wire routing The data center houses electronic equipment stored in clusters of cabinets. The space inside the data center is shared, such as on a leased basis, between multiple different entities who operate their own electronic equipment. To achieve privacy, security, and cooling air flow, one or more layers of a security paneling surround one or more clusters of cabinets to create a secure interior space. This allows access to only authorized personal, prevents people from viewing into the secure interior space, and allows cooling air flow to pass into the secure interior space to cool the electronic equipment. The security paneling comprises sheets of metal with small apertures. Two or more security panels may be arranged with offset apertures to further prevent viewing of the electronic equipment in the secure interior space. | 2019-06-20 |
20190191591 | CONTROLLER WITH ENHANCED THERMAL PROPERTIES - An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow. | 2019-06-20 |
20190191592 | METHOD FOR STARTING HEAT DISSIPATION FAN - A method for starting a heat dissipation fan is disclosed, which includes: driving a fan with a first driving voltage and detecting a rotational speed of the fan; and in response to the rotational speed of the fan being zero, switching a driving voltage of the fan to a second driving voltage, where the second driving voltage is greater than the first driving voltage. The present disclosure can improve operating reliability of a fan for a device. | 2019-06-20 |
20190191593 | WATER-COOLING HEAT-DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE - A water-cooling heat-dissipating assembly includes a water-cooling device and a water-pressure monitoring switch. The water-cooling device includes an inlet pipe, an outlet pipe, and a heat-exchange chamber connecting the inlet pipe and the outlet pipe. The water-pressure monitoring switch is located at the inlet pipe. The water-pressure monitoring switch monitors a water pressure in the water-cooling device. In response to the water pressure in the water-cooling device meeting a first preset condition, the water-pressure monitoring switch controls the inlet pipe to be closed. | 2019-06-20 |
20190191594 | AVIONICS HEAT EXCHANGER - A heat exchanger for cooling an electronic component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant. | 2019-06-20 |
20190191595 | Air Conditioner Mister, Apparatus and Method - An apparatus includes a mister having an on state and an off state. A thermostat is coupled to an air conditioner compressor and to the mister. The thermostat informs the mister when the air conditioner compressor is running and the mister uses that information to determine whether to transition between the on state and the off state. | 2019-06-20 |
20190191596 | ELECTRICAL APPARATUS - An electrical apparatus configured to be mounted in a vehicle includes a case that accommodates an electrical component; a cooler accommodated in the case and configured to cool the electrical component with use of a liquid refrigerant; and a refrigerant pipe that extends through a wall of the case and is connected to the cooler. A notch is provided on an outer surface of the refrigerant pipe such that the notch is located outside the case. | 2019-06-20 |
20190191597 | ELECTRONIC DEVICE HAVING INTERFERENCE SHIELDING STRUCTURE - An electronic device including an electromagnetic shielding structure is provided. The electronic device includes a printed circuit board, an antenna module, and an electromagnetic wave shielding structure. The antenna module includes a radio frequency integrated circuit mounted on the printed circuit board, and an array antenna coupled to an upper portion of the radio frequency integrated circuit. The electromagnetic wave shielding structure surrounds a side portion of the antenna module. | 2019-06-20 |
20190191598 | ELECTRONIC DEVICE HOUSING, METHOD FOR MANUFACTURING ELECTRONIC DEVICE HOUSING, DEVELOPMENT PLAN-SHAPED METAL RESIN JOINT PLATE, AND ELECTRONIC APPARATUS - An electronic device housing of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate, and metal side plates folded and integrally connected to the bottom plate, in which, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member, and the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M). | 2019-06-20 |
20190191599 | ELECTROMAGNETIC WAVE SHIELDING MATERIAL, BUILDING MATERIAL WITH ELECTROMAGNETIC WAVE SHIELD, AND ARTICLE WITH ELECTROMAGNETIC WAVE SHIELDING MATERIAL - An electromagnetic wave shielding material is provided that is configured to prevent a usage environment from being limited. The electromagnetic wave shielding material shields an electromagnetic wave having a frequency, and includes a substrate and a plurality of resonance loops disposed on the substrate. Moreover, the plurality of resonance loops are positioned on the substrate to be magnetically coupled to each other. Each of the resonance loops forms an LC parallel resonance circuit that resonates at the frequency of the electromagnetic wave. | 2019-06-20 |
20190191600 | BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERENCE SHIELDING MATERIALS - An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents, and metal and carbon-based nano-powders or nanoparticles. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein. | 2019-06-20 |
20190191601 | SIGNAL TRANSMISSION CABLE - A signal transmission cable includes a signal line, an insulation layer covering the signal line, and a shield layer covering the insulation layer. A first oxygen amount A | 2019-06-20 |
20190191602 | COMPONENT SUPPLY DEVICE - A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that performs an exposing process for exposing the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component supply device further includes a cover member that covers at least a part of each component storage part of the component storage tape after the exposing process by the component exposing unit. | 2019-06-20 |
20190191603 | METHOD FOR OPTIMIZING COMPONENT TYPE ALLOCATION AND APPARATUS FOR OPTIMIZING COMPONENT TYPE ALLOCATION - A method for optimizing component type allocation in which multiple component types of components are optimally allocated to an automatic feeder device which automatically loads the component storage tape and a manual feeder device which does not automatically load when the automatic feeder device and the manual feeder device are installed installation positions on a common pallet, the method including: a workability evaluating step of evaluating a magnitude of labor in a splicing work for replenishing and connecting a new component storage tape in the manual feeder device for each of component types; and an automatic side allocating step of preferentially allocating component type having large labor in the splicing work to the automatic feeder device. Accordingly, the splicing work can be reduced by effectively using the automatic feeder device, and it can contribute to the improvement of the production efficiency of the board. | 2019-06-20 |
20190191604 | COMPONENT SUPPLY DEVICE - A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that exposes the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component exposing unit includes a cover tape raising unit that performs a raising process for a cover tape. In the travel path formed from the tape travel path forming unit, a first path part on which the cover tape raising unit is disposed is inclined to one direction side in a Z-axis direction from an upstream side toward a downstream side in a tape feeding direction. | 2019-06-20 |
20190191605 | SUBSTRATE WORKING MACHINE - Movable section of a cut and clinch unit includes exchange section in which is formed second insertion hole for cutting and bending a lead, and main body section to which exchange section is removably attached. An opening position of the second insertion hole is calculated as an attachment position of the exchange section on the main body section based on image data. It is determined whether a difference between the calculated opening position and a standard position of the second insertion hole that is set in advance exceeds a threshold value. If the difference between the calculated opening position and the standard position exceeds the threshold value, calibration is performed based on the assumption that the exchange section has been exchanged. | 2019-06-20 |
20190191606 | COMPONENT MOUNTING DEVICE AND POSITION RECOGNITION METHOD - A component mounting device capable of selectively performing a tolerance check mode that recognizes a position of a lead after determining whether the size of a lead region is within a tolerance range, and a non-tolerance check mode that recognizes a position of the lead without performing determination of whether the size of the lead region is within the tolerance range. Therefore, even in cases in which it is difficult to set a tolerance range due to the tip of the lead being covered with a viscous fluid such as solder or plating, the position of the lead is appropriately recognized. | 2019-06-20 |
20190191607 | FEEDER SYSTEM, PICK AND PLACE MACHINE, AND METHOD - A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components. | 2019-06-20 |
20190191608 | Blueberry plant, 'NS 13-6' - A new and distinct variety of blueberry plant, which is denominated varietally as ‘NS 13-6’ is described, and which produces a fruit having a medium to large fruit size, a high to very high fruit sweetness, a firm fruit, a low to medium fruit acidity, and displaying a small dry picking scar, and an extremely high yield, when grown under the ecological conditions prevailing near Yanchep Springs, Yanchep, Western Australia. | 2019-06-20 |
20190191609 | Apple Tree Named 'GS-66' - ‘GS 66’ is a new apple tree variety notable for its fruit. Apples of ‘GS 66’ exhibit a shiny red overcolor, crisp juicy non-browning flesh, and resistance to bruising. | 2019-06-20 |
20190191610 | Apple tree named 'RDS' - A new and distinct apple tree | 2019-06-20 |
20190191611 | Grapevine plant named 'Hongju' - A new and distinct grapevine variety ‘HONGJU’, is by characterized a late harvest date, the production of dense clusters of seedless, ovoid, grey red berries. | 2019-06-20 |
20190191612 | Grapevine named 'IFG Thirty-two' - This invention is a new and distinct grapevine variety denominated ‘IFG Thirty-two’. The new grapevine plant is characterized by producing medium size finger shaped berries having medium firm texture with a neutral flavor and which ripen in mid-season. Berries are borne on medium size clusters which are naturally loose and do not require gibberellin applications to thin clusters. | 2019-06-20 |