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25th week of 2015 patent applcation highlights part 71
Patent application number
Title
Published
20150171000
SEMICONDUCTOR DEVICE FOR RESTRAINING CREEP-AGE PHENOMENON AND FABRICATING METHOD THEREOF
2015-06-18
20150171001
METHODS OF PROTECTING A DIELECTRIC MASK LAYER AND RELATED SEMICONDUCTOR DEVICES
2015-06-18
20150171002
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED COMPONENT AND METHOD OF MANUFACTURE THEREOF
2015-06-18
20150171003
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2015-06-18
20150171004
FINGER METAL OXIDE METAL CAPACITOR FORMED IN A PLURALITY OF METAL LAYERS
2015-06-18
20150171005
Method and Layout of an Integrated Circuit
2015-06-18
20150171006
3DIC Package and Methods of Forming the Same
2015-06-18
20150171007
Semiconductor Structure and Method Making the Same
2015-06-18
20150171008
INTEGRATED CIRCUITS WITH DUMMY CONTACTS AND METHODS FOR PRODUCING SUCH INTEGRATED CIRCUITS
2015-06-18
20150171009
SELF-ALIGNED VIA PATTERNING WITH MULTI-COLORED PHOTOBUCKETS FOR BACK END OF LINE (BEOL) INTERCONNECTS
2015-06-18
20150171010
SELF-ALIGNED VIA AND PLUG PATTERNING WITH PHOTOBUCKETS FOR BACK END OF LINE (BEOL) INTERCONNECTS
2015-06-18
20150171011
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2015-06-18
20150171012
METHOD OF CREATING A MASKLESS AIR GAP IN BACK END INTERCONNECTIONS WITH DOUBLE SELF-ALIGNED VIAS
2015-06-18
20150171013
CHIP PACKAGE STRUCTURE
2015-06-18
20150171014
SEMICONDUCTOR DEVICE WITH AIR GAP
2015-06-18
20150171015
INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED BRIDGE
2015-06-18
20150171016
AL ALLOY FILM FOR SEMICONDUCTOR DEVICE
2015-06-18
20150171017
DIE OR SUBSTRATE MARKING USING A LASER
2015-06-18
20150171018
ION SENSITIVE FIELD EFFECT TRANSISTORS WITH PROTECTION DIODES AND METHODS OF THEIR FABRICATION
2015-06-18
20150171019
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2015-06-18
20150171020
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2015-06-18
20150171021
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
2015-06-18
20150171022
CONDUCTIVE SHIELD FOR SEMICONDUCTOR PACKAGE
2015-06-18
20150171023
FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING
2015-06-18
20150171024
Semiconductor Device and Method of Reducing Warpage Using a Silicon to Encapsulant Ratio
2015-06-18
20150171025
INTEGRATED CIRCUITS HAVING CRACK-STOP STRUCTURES AND METHODS FOR FABRICATING THE SAME
2015-06-18
20150171026
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
2015-06-18
20150171027
HIGH YIELD SUBSTRATE ASSEMBLY
2015-06-18
20150171028
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
2015-06-18
20150171029
INVERSE NANOSTRUCTURE DIELECTRIC LAYERS
2015-06-18
20150171030
FLEXIBLE DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF
2015-06-18
20150171031
THREE-DIMENSION (3D) INTEGRATED CIRCUIT (IC) PACKAGE
2015-06-18
20150171032
VERTICAL NANOWIRE TRANSISTOR FOR INPUT/OUTPUT STRUCTURE
2015-06-18
20150171033
Semiconductor Package with Integrated Microwave Component
2015-06-18
20150171034
Chip-on-Substrate Packaging on Carrier
2015-06-18
20150171035
METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH STEPPED BOND PADS
2015-06-18
20150171036
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
2015-06-18
20150171037
Formation of Connectors without UBM
2015-06-18
20150171038
Bump Structures for Semiconductor Package
2015-06-18
20150171039
REDISTRIBUTION LAYER ALLOY STRUCTURE AND MANUFACTURING METHOD THEREOF
2015-06-18
20150171040
ELECTROPLATED SOLDER FOR HIGH-TEMPERATURE INTERCONNECT
2015-06-18
20150171041
CHIP ELEMENT AND CHIP PACKAGE
2015-06-18
20150171042
SENSOR PACKAGE AND MANUFACTURING METHOD
2015-06-18
20150171043
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
2015-06-18
20150171044
BBUL TOP SIDE SUBSTRATE LAYER ENABLING DUAL SIDED SILICON INTERCONNECT AND STACKING FLEXIBILITY
2015-06-18
20150171045
Compound Structure and Method for Forming a Compound Structure
2015-06-18
20150171046
SELF-ADHESIVE DIE
2015-06-18
20150171047
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
2015-06-18
20150171048
BONDING DEVICE
2015-06-18
20150171049
METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES
2015-06-18
20150171050
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
2015-06-18
20150171051
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
2015-06-18
20150171052
SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
2015-06-18
20150171053
SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELECTRIC DEVICE
2015-06-18
20150171054
SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT
2015-06-18
20150171055
Molding Structure for Wafer Level Package
2015-06-18
20150171056
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
2015-06-18
20150171057
METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE
2015-06-18
20150171058
LOW COST HYBRID HIGH DENSITY PACKAGE
2015-06-18
20150171059
SUBMOUNT FOR LED DEVICE PACKAGE
2015-06-18
20150171060
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
2015-06-18
20150171061
STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME
2015-06-18
20150171062
THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH INTER-LAYER VIAS AND INTRA-LAYER COUPLED TRANSISTORS
2015-06-18
20150171063
Thermally Enhanced Wafer Level Fan-Out POP Package
2015-06-18
20150171064
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
2015-06-18
20150171065
EMBEDDED MEMORY AND POWER MANAGEMENT SUBPACKAGE
2015-06-18
20150171066
SEMICONDUCTOR DEVICE
2015-06-18
20150171067
MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED IN PACKAGE
2015-06-18
20150171068
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
2015-06-18
20150171069
INTEGRATED CIRCUIT AND FABRICATING METHOD THEREOF
2015-06-18
20150171070
Semiconductor Device and Switching Circuit
2015-06-18
20150171071
INSULATED GATE SEMICONDUCTOR DEVICE AND METHOD
2015-06-18
20150171072
ELECTROSTATIC DISCHARGE PROTECTION DEVICE
2015-06-18
20150171073
SEMICONDUCTOR DEVICES
2015-06-18
20150171074
FINFET AND TRANSISTORS WITH RESISTORS AND PROTECTION AGAINST ELECTROSTATIC DISCHARGE (ESD)
2015-06-18
20150171075
Method and Layer Structure for Preventing Intermixing of Semiconductor Layers
2015-06-18
20150171076
RADIAL NANOWIRE ESAKI DIODE DEVICES AND METHODS
2015-06-18
20150171077
POLY RESISTOR FOR METAL GATE INTEGRATED CIRCUITS
2015-06-18
20150171078
SEMICONDUCTOR DEVICE
2015-06-18
20150171079
SEMICONDUCTOR DEVICE AND STRUCTURE
2015-06-18
20150171080
Radio Frequency and Microwave Devices and Methods of Use
2015-06-18
20150171081
Self-Alignment for Two or More Layers and Methods of Forming Same
2015-06-18
20150171082
INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME HAVING A REPLACEMENT GATE STRUCTURE
2015-06-18
20150171083
METHOD FOR ADJUSTING FIN WIDTH IN INTEGRATED CIRCUITRY
2015-06-18
20150171084
Semiconductor Devices and Methods of Manufacture Thereof
2015-06-18
20150171085
FIN FIELD EFFECT TRANSISTOR AND METHOD FOR FORMING THE SAME
2015-06-18
20150171086
Selective Growth of a Work-Function Metal in a Replacement Metal Gate of a Semiconductor Device
2015-06-18
20150171087
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
2015-06-18
20150171088
METHOD FOR MANUFACTURING HIGH-STRENGTH STRUCTURAL STACKED CAACITOR
2015-06-18
20150171089
SEMICONDUCTOR DEVICE
2015-06-18
20150171090
METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES
2015-06-18
20150171091
SELF ALIGNED ACTIVE TRENCH CONTACT
2015-06-18
20150171092
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2015-06-18
20150171093
STRUCTURE AND METHOD FOR A SRAM CIRCUIT
2015-06-18
20150171094
ANTIFUSE
2015-06-18
20150171095
Memory Arrays for Both Good Data Retention and Low Power Operation
2015-06-18
20150171096
FLASH DEVICES AND METHODS OF MANUFACTURING THE SAME
2015-06-18
20150171097
NONVOLATILE MEMORY DEVICES AND METHODS OF FORMING THE SAME
2015-06-18
20150171098
METAL FLOATING GATE COMPOSITE 3D NAND MEMORY DEVICES AND ASSOCIATED METHODS
2015-06-18
20150171099
ULTRAHIGH DENSITY VERTICAL NAND MEMORY DEVICE AND METHOD OF MAKING THEREOF
2015-06-18