24th week of 2016 patent applcation highlights part 66 |
Patent application number | Title | Published |
20160172304 | SEMICONDUCTOR DEVICE INCLUDING AIR GAPS AND METHOD OF FABRICATING THE SAME | 2016-06-16 |
20160172305 | CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | 2016-06-16 |
20160172306 | METHOD OF MARKING A SEMICONDUCTOR PACKAGE | 2016-06-16 |
20160172307 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2016-06-16 |
20160172308 | OVERLAY MARK | 2016-06-16 |
20160172309 | EMI/RFI SHIELDING FOR SEMICONDUCTOR DEVICE PACKAGES | 2016-06-16 |
20160172310 | METHODS AND DEVICES OF LAMINATED INTEGRATIONS OF SEMICONDUCTOR CHIPS, MAGNETICS, AND CAPACITANCE | 2016-06-16 |
20160172311 | IC WITH INSULATING TRENCH AND RELATED METHODS | 2016-06-16 |
20160172312 | WAFER PROCESSING METHOD | 2016-06-16 |
20160172313 | SUBSTRATE WITH A SUPPORTING PLATE AND FABRICATION METHOD THEREOF | 2016-06-16 |
20160172314 | STRUCTURE TO PREVENT DEEP TRENCH MOAT CHARGING AND MOAT ISOLATION FAILS | 2016-06-16 |
20160172315 | PECVD PROTECTIVE LAYERS FOR SEMICONDUCTOR DEVICES | 2016-06-16 |
20160172316 | MOLD FOR RESIN SEALING, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE | 2016-06-16 |
20160172317 | INTEGRATED MILLIMETER-WAVE CHIP PACKAGE | 2016-06-16 |
20160172318 | SEMICONDUCTOR DEVICES WITH IMPEDANCE MATCHING-CIRCUITS | 2016-06-16 |
20160172319 | COMPACT SEMICONDUCTOR PACKAGE AND RELATED METHODS | 2016-06-16 |
20160172320 | MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT | 2016-06-16 |
20160172321 | METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING | 2016-06-16 |
20160172322 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2016-06-16 |
20160172323 | PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES | 2016-06-16 |
20160172324 | ALIGNMENT OF THREE DIMENSIONAL INTEGRATED CIRCUIT COMPONENTS | 2016-06-16 |
20160172325 | METHOD FOR MAKING AN ELECTRICAL CONNECTION IN A BLIND VIA AND ELECTRICAL CONNECTION OBTAINED | 2016-06-16 |
20160172326 | BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME | 2016-06-16 |
20160172327 | Low-Temperature Bonding and Sealing With Spaced Nanorods | 2016-06-16 |
20160172328 | BONDING MATERIAL AND BONDING METHOD USING THE SAME | 2016-06-16 |
20160172329 | Interconnect Structures for Wafer Level Package and Methods of Forming Same | 2016-06-16 |
20160172330 | Tunable OLED Lighting Source | 2016-06-16 |
20160172331 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS | 2016-06-16 |
20160172332 | MEMORY MODULE IN A PACKAGE | 2016-06-16 |
20160172333 | Integrated Circuit Package and Methods of Forming Same | 2016-06-16 |
20160172334 | STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE | 2016-06-16 |
20160172335 | SEMICONDUCTOR DEVICE | 2016-06-16 |
20160172336 | INDEPENDENT CONTROL OF STACKED ELECTRONIC MODULES | 2016-06-16 |
20160172337 | SEMICONDUCTOR PACKAGE DEVICES INCLUDING INTERPOSER OPENINGS FOR HEAT TRANSFER MEMBER | 2016-06-16 |
20160172338 | SILICON PACKAGE FOR EMBEDDED ELECTRONIC SYSTEM HAVING STACKED SEMICONDUCTOR CHIPS | 2016-06-16 |
20160172339 | LED LAMP USING ULTRA-SMALL LED ELECTRODE ASSEMBLY | 2016-06-16 |
20160172340 | LIGHT-EMITTING DIODE DISPLAY SCREEN | 2016-06-16 |
20160172341 | LIGHT EMITTING DEVICE | 2016-06-16 |
20160172342 | LIGHT-EMITTING DEVICE | 2016-06-16 |
20160172343 | Light-Emitting Diode Device | 2016-06-16 |
20160172344 | LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE | 2016-06-16 |
20160172345 | Multi-Chips in System level and Wafer level Package Structure | 2016-06-16 |
20160172346 | DISPLAY DEVICE HAVING FILM SUBSTRATE | 2016-06-16 |
20160172347 | ELECTRONIC DEVICE MOUNTED ON A SUBSTRATE | 2016-06-16 |
20160172348 | Pre-Applying Supporting Materials Between Bonded Package Components | 2016-06-16 |
20160172349 | MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PACKAGES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES | 2016-06-16 |
20160172350 | Electrostatic Discharge Protection Circuitry | 2016-06-16 |
20160172351 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2016-06-16 |
20160172352 | Power Semiconductor Device with Improved Stability and Method for Producing the Same | 2016-06-16 |
20160172353 | III-Nitride Switching Device with an Emulated Diode | 2016-06-16 |
20160172354 | SEMICONDUCTOR DEVICE WITH ELECTRO-STATIC DISCHARGE PROTECTION DEVICE ABOVE SEMICONDUCTOR DEVICE AREA | 2016-06-16 |
20160172355 | METHOD OF FORMING A GATE SHIELD IN AN ED-CMOS TRANSISTOR AND A BASEOF A BIPOLAR TRANSISTOR USING BICMOS TECHNOLOGIES | 2016-06-16 |
20160172356 | INTER-LEVEL DIELECTRIC LAYER IN REPLACEMENT METAL GATES AND RESISTOR FABRICATION | 2016-06-16 |
20160172357 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2016-06-16 |
20160172358 | INTEGRATED CIRCUIT DEVICES INCLUDING SOURCE/DRAIN EXTENSION REGIONS AND METHODS OF FORMING THE SAME | 2016-06-16 |
20160172359 | MOISTURE BLOCKING STRUCTURE AND/OR A GUARD RING, A SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND A METHOD OF MANUFACTURING THE SAME | 2016-06-16 |
20160172360 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2016-06-16 |
20160172361 | Methods of Forming Field Effect Transistors Having Silicon-Germanium Source/Drain Regions Therein | 2016-06-16 |
20160172362 | CMOS TRANSISTORS WITH IDENTICAL ACTIVE SEMICONDUCTOR REGION SHAPES | 2016-06-16 |
20160172363 | Method of Forming Contacts for a Memory Device | 2016-06-16 |
20160172364 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | 2016-06-16 |
20160172365 | Ferroelectric memory device and fabrication process thereof, and methods for operation thereof | 2016-06-16 |
20160172366 | THREE DIMENSIONAL MEMORY DEVICE WITH BLOCKING DIELECTRIC HAVING ENHANCED PROTECTION AGAINST FLUORINE ATTACK | 2016-06-16 |
20160172367 | MANUFACTURING METHOD OF NON-VOLATILE MEMORY | 2016-06-16 |
20160172368 | Contact For Vertical Memory With Dopant Diffusion Stopper And Associated Fabrication Method | 2016-06-16 |
20160172369 | FORMING MEMORY USING DOPED OXIDE | 2016-06-16 |
20160172370 | SELECTIVE BLOCKING DIELECTRIC FORMATION IN A THREE-DIMENSIONAL MEMORY STRUCTURE | 2016-06-16 |
20160172371 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-06-16 |
20160172372 | SEMICONDUCTOR DEVICES | 2016-06-16 |
20160172373 | Memory Arrays and Methods of Fabricating Integrated Structures | 2016-06-16 |
20160172374 | THREE-DIMENSIONAL NONVOLATILE MEMORY DEVICE | 2016-06-16 |
20160172375 | Methods for Cell Boundary Encroachment and Semiconductor Devices Implementing the Same | 2016-06-16 |
20160172376 | Array substrate and method for fabricating the same, liquid crystal display panel and reflective liquid crystal display | 2016-06-16 |
20160172377 | DISPLAY DEVICE | 2016-06-16 |
20160172378 | CMOS GATE CONTACT RESISTANCE REDUCTION | 2016-06-16 |
20160172379 | MODIFIED FIN CUT AFTER EPITAXIAL GROWTH | 2016-06-16 |
20160172380 | MODIFIED FIN CUT AFTER EPITAXIAL GROWTH | 2016-06-16 |
20160172381 | SHALLOW EXTENSION JUNCTION | 2016-06-16 |
20160172382 | Semiconductor Device and Method for Manufacturing the Same | 2016-06-16 |
20160172383 | Semiconductor Device and Driving Method Thereof | 2016-06-16 |
20160172384 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY | 2016-06-16 |
20160172385 | ARRAY SUBSTRATE AND DISPLAY DEVICE USING THE SAME | 2016-06-16 |
20160172386 | COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS | 2016-06-16 |
20160172387 | LTPS ARRAY SUBSTRATE | 2016-06-16 |
20160172388 | METHOD OF FABRICATING ARRAY SUBSTRATE | 2016-06-16 |
20160172389 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF | 2016-06-16 |
20160172390 | SOLID-STATE IMAGE SENSOR AND IMAGE CAPTURING APPARATUS USING THE SAME | 2016-06-16 |
20160172391 | Methods of Fabricating Image Sensors Having Deep Trenches Including Negative Charge Material | 2016-06-16 |
20160172392 | MECHANISMS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE STRUCTURE | 2016-06-16 |
20160172393 | CURVED IMAGE SENSOR, METHOD FOR FABRICATING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME | 2016-06-16 |
20160172394 | Image Sensors Including Non-Aligned Grid Patterns | 2016-06-16 |
20160172395 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | 2016-06-16 |
20160172396 | SEMICONDUCTOR DEVICE FOR RADIATION DETECTION | 2016-06-16 |
20160172397 | Solid State Image Sensor with Low Capacitance Floating Diffusion | 2016-06-16 |
20160172398 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME | 2016-06-16 |
20160172399 | SOLID STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE | 2016-06-16 |
20160172400 | PHOTO DETECTOR AND METHOD FOR FABRICATING THE SAME | 2016-06-16 |
20160172401 | SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | 2016-06-16 |
20160172402 | IMAGE SENSOR DEVICE | 2016-06-16 |
20160172403 | Backside Through Vias in a Bonded Structure | 2016-06-16 |