24th week of 2019 patent applcation highlights part 65 |
Patent application number | Title | Published |
20190181080 | SEMICONDUCTOR PACKAGE HAVING AN IMPEDANCE-BOOSTING CHANNEL | 2019-06-13 |
20190181081 | THERMOSETTING RESIN COMPOSITION, METAL-CLAD LAMINATED PLATE, INSULATING SHEET, PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PACKAGE SUBSTRATE | 2019-06-13 |
20190181082 | SEMICONDUCTOR DEVICE PACKAGE | 2019-06-13 |
20190181083 | VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES | 2019-06-13 |
20190181084 | WIRING BOARD | 2019-06-13 |
20190181085 | FAN-OUT SEMICONDUCTOR PACKAGING STRUCTURE WITH ANTENNA MODULE AND METHOD MAKING THE SAME | 2019-06-13 |
20190181086 | ISOLATION DEVICE | 2019-06-13 |
20190181087 | Land Pad Design for High Speed Terminals | 2019-06-13 |
20190181088 | SEMICONDUCTOR DEVICES | 2019-06-13 |
20190181089 | RESISTIVE ELEMENT AND METHOD OF MANUFACTURING THE RESISTIVE ELEMENT | 2019-06-13 |
20190181090 | FINFET FUSES FORMED AT TIGHT PITCH DIMENSIONS | 2019-06-13 |
20190181091 | BACK END OF LINE ELECTRICAL FUSE STRUCTURE AND METHOD OF FABRICATION | 2019-06-13 |
20190181092 | METHODS AND APPARATUS FOR WAFER-LEVEL DIE BRIDGE | 2019-06-13 |
20190181093 | ACTIVE PACKAGE SUBSTRATE HAVING EMBEDDED INTERPOSER | 2019-06-13 |
20190181094 | Method of Manufacturing a Semiconductor Device with Epitaxial Layers and an Alignment Mark | 2019-06-13 |
20190181095 | EMI SHIELDING FOR DISCRETE INTEGRATED CIRCUIT PACKAGES | 2019-06-13 |
20190181096 | EMI Shielding Structure in InFO Package | 2019-06-13 |
20190181097 | THROUGH-STIFFENER INERCONNECTS FOR PACKAGE-ON-PACKAGE APPARATUS AND METHODS OF ASSEMBLING SAME | 2019-06-13 |
20190181098 | SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI) COMPARTMENT SHIELDING FOR COMPONENTS DISPOSED INSIDE OF SYSTEM ELECTRONIC PACKAGES | 2019-06-13 |
20190181099 | GROUP III-N MATERIAL CONDUCTIVE SHIELD FOR HIGH FREQUENCY METAL INTERCONNECTS | 2019-06-13 |
20190181100 | CHIP PACKAGE STRUCTURE | 2019-06-13 |
20190181101 | CIRCUIT MODULE | 2019-06-13 |
20190181102 | DECODING INFORMATION EMBEDDED IN AN ELECTRONIC ELEMENT | 2019-06-13 |
20190181103 | TRIMMING METHOD, TRIMMING CIRCUITRY, AND TRIMMING SYSTEM FOR INTEGRATED CIRCUIT WITH MEMORY USAGE REDUCTION | 2019-06-13 |
20190181104 | DOUBLE-SIDED PLASTIC FAN-OUT PACKAGE STRUCTURE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF | 2019-06-13 |
20190181105 | SEMICONDUCTOR PACKAGING STRUCTURE HAVING ANTENNA MODULE | 2019-06-13 |
20190181106 | Packaged RF Power Amplifier | 2019-06-13 |
20190181107 | SELECTIVE RECESS | 2019-06-13 |
20190181108 | Semiconductor Package Structure and Semiconductor Package Structure Fabricating Method | 2019-06-13 |
20190181109 | SEMICONDUCTOR MEMORY INCLUDING PADS ARRANGED IN PARALLEL | 2019-06-13 |
20190181110 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-06-13 |
20190181111 | DRIVING INTEGRATED CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME | 2019-06-13 |
20190181112 | SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE | 2019-06-13 |
20190181113 | FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE | 2019-06-13 |
20190181114 | METHOD FOR BONDING BY DIRECT ADHESION A FIRST SUBSTRATE TO A SECOND SUBSTRATE | 2019-06-13 |
20190181115 | Wafer Level Molded PPGA (Pad Post Grid Array) for Low Cost Package | 2019-06-13 |
20190181116 | FAN-OUT STRUCTURE FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS | 2019-06-13 |
20190181117 | SEMICONDUCTOR DEVICE HAVING AN ULTRA-THIN SUBSTRATE AND MANUFACTURING METHOD THEREOF | 2019-06-13 |
20190181118 | STAGGERED DIE STACKING ACROSS HETEROGENEOUS MODULES | 2019-06-13 |
20190181119 | STACKED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | 2019-06-13 |
20190181120 | Semiconductor Package with Air Cavity | 2019-06-13 |
20190181121 | METHOD AND SYSTEM FOR ELECTRONIC DEVICES WITH POLYCRYSTALLINE SUBSTRATE STRUCTURE INTERPOSER | 2019-06-13 |
20190181122 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-13 |
20190181123 | IN-VEHICLE DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING DEVICE | 2019-06-13 |
20190181124 | IN-VEHICLE DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING DEVICE | 2019-06-13 |
20190181125 | POWER CHIP INTEGRATION MODULE, MANUFACTURING METHOD THEREOF, AND DOUBLE-SIDED COOLING POWER MODULE PACKAGE | 2019-06-13 |
20190181126 | SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND METHODS OF ASSEMBLING SAME | 2019-06-13 |
20190181127 | MODULE AND ELECTRONIC DEVICE | 2019-06-13 |
20190181128 | POWER MODULE | 2019-06-13 |
20190181129 | CONTINUOUS POWER RAILS ALIGNED ON DIFFERENT AXES | 2019-06-13 |
20190181130 | INTEGRATED CIRCUITS INCLUDING STANDARD CELLS AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUITS | 2019-06-13 |
20190181131 | ELECTRONIC DEVICE OF PROTECTION AGAINST ELECTROSTATIC DISCHARGES | 2019-06-13 |
20190181132 | SEMICONDUCTOR DEVICE | 2019-06-13 |
20190181133 | SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURED USING A PLASMA-PROCESSING STEP | 2019-06-13 |
20190181134 | BACK BALLASTED VERTICAL NPN TRANSISTOR | 2019-06-13 |
20190181135 | CONTROL CIRCUIT AND OPERATING CIRCUIT UTILIZING THE SAME | 2019-06-13 |
20190181136 | SEMICONDUCTOR DEVICE | 2019-06-13 |
20190181137 | INTEGRATED CIRCUIT WITH METAL GATE HAVING DIELECTRIC PORTION OVER ISOLATION AREA | 2019-06-13 |
20190181138 | SEMICONDUCTOR DEVICE | 2019-06-13 |
20190181139 | VERTICAL FET WITH REDUCED PARASITIC CAPACITANCE | 2019-06-13 |
20190181140 | DIELECTRIC SEPARATION OF PARTIAL GAA FETS | 2019-06-13 |
20190181141 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | 2019-06-13 |
20190181142 | Devices Having a Transistor and a Capacitor Along a Common Horizontal Level, and Methods of Forming Devices | 2019-06-13 |
20190181143 | Apparatuses Having Body Connection Lines Coupled with Access Devices | 2019-06-13 |
20190181144 | DEVICE STRUCTURE FOR FORMING SEMICONDUCTOR DEVICE HAVING ANGLED CONTACTS | 2019-06-13 |
20190181145 | METHOD AND DEVICE TO REDUCE FINFET SRAM CONTACT RESISTANCE | 2019-06-13 |
20190181146 | SEMICONDUCTOR STRUCTURE AND STATIC RANDOM ACCESS MEMORY | 2019-06-13 |
20190181147 | VERTICAL FERROELECTRIC THIN FILM STORAGE TRANSISTOR AND DATA WRITE AND READ METHODS THEREOF | 2019-06-13 |
20190181148 | FLASH MEMORIES AND METHODS FOR MANUFACTURING THE SAME | 2019-06-13 |
20190181149 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING MULTI-HEIGHT STRUCTURE | 2019-06-13 |
20190181150 | SEMICONDUCTOR MEMORY DEVICE | 2019-06-13 |
20190181151 | STACKED TYPE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-06-13 |
20190181152 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-13 |
20190181153 | DIGITAL BLOCKS WITH ELECTRICALLY INSULATED AND ORTHOGONAL POLYSILICON LAYERS | 2019-06-13 |
20190181154 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | 2019-06-13 |
20190181155 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | 2019-06-13 |
20190181156 | CONTACT STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME | 2019-06-13 |
20190181157 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-13 |
20190181158 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | 2019-06-13 |
20190181159 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-06-13 |
20190181160 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-06-13 |
20190181161 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | 2019-06-13 |
20190181162 | DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME | 2019-06-13 |
20190181163 | THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME | 2019-06-13 |
20190181164 | IMAGE SENSOR DEVICES | 2019-06-13 |
20190181165 | SOLID-STATE IMAGE SENSING DEVICE, DRIVE METHOD, AND ELECTRONIC APPARATUS | 2019-06-13 |
20190181166 | IMAGE SENSORS | 2019-06-13 |
20190181167 | BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | 2019-06-13 |
20190181168 | SEMICONDUCTOR DEVICE, IMAGE PICKUP DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-06-13 |
20190181169 | DIFFERENTIAL PIXEL CIRCUIT AND METHOD OF COMPUTER VISION APPLICATIONS | 2019-06-13 |
20190181170 | SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | 2019-06-13 |
20190181171 | GLOBAL SHUTTER PIXEL CIRCUIT AND METHOD FOR COMPUTER VISION APPLICATIONS | 2019-06-13 |
20190181172 | FAN-OUT SENSOR PACKAGE | 2019-06-13 |
20190181173 | RESONANT-FILTER IMAGE SENSOR AND ASSOCIATED FABRICATION METHOD | 2019-06-13 |
20190181174 | METHOD FOR FORMING IMAGE SENSOR DEVICE | 2019-06-13 |
20190181175 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-13 |
20190181176 | ELECTRONIC DEVICE IMAGE SENSOR | 2019-06-13 |
20190181177 | SOLID-STATE IMAGING DEVICE | 2019-06-13 |
20190181178 | IMAGE CAPTURE DEVICE INCLUDING PHOTOELECTRIC CONVERTER SUPPORTED BY SEMICONDUCTOR SUBSTRATE | 2019-06-13 |
20190181179 | Interposer And Chip-Scale Packaging For Wafer-Level Camera | 2019-06-13 |