24th week of 2009 patent applcation highlights part 15 |
Patent application number | Title | Published |
20090146273 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can avoid occurrences of short-circuiting of wires, an increase in chip size due to avoidance of short-circuiting, propagation of power supply or GND noise due to reduction in IO cell interval, and signal transmission delay difference due to displacement of pad positions. | 2009-06-11 |
20090146274 | INTEGRATED CIRCUIT PACKAGES INCLUDNG SINUOUS LEAD FRAMES - Integrated circuit packages include an integrated circuit mounting substrate having a hole that defines an inner wall of the integrated circuit mounting substrate. An integrated circuit is provided in the hole. A sinuous lead frame extends from the integrated circuit and is connected to the inner wall. The sinuous lead frame extends back and forth along a given direction, and may include a U- and/or V-shape, and round and/or jagged portions. Related packaging methods are also disclosed. | 2009-06-11 |
20090146275 | LEAD FRAME AND SEMICONDUCTOR DEVICE PROVIDED WITH LEAD FRAME - A lead frame and a semiconductor device having a lead frame are disclosed. The lead frame is provided with a mount bed to mount a semiconductor chip, first and second lead terminals and first and second extension portions of band-shapes. The first and the second extension portions extend from sides of the first and second lead terminals and are bent. An electronic component is attached to Tip portions of the first and the second extension portions with connection conductors interposed in between. | 2009-06-11 |
20090146276 | FLIP-CHIP LEADFRAME SEMICONDUCTOR PACKAGE - A flip-chip leadframe semiconductor package designed to improve mold flow around the leadframe and semiconductor die. An embodiment of the semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and an encapsulant covering the leadframe and semiconductor die, wherein a portion of the leadframe that is attached to the semiconductor die is below a portion of the leadframe that enters the encapsulant. | 2009-06-11 |
20090146277 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a semiconductor module case; a metal terminal externally extending from within the case; a semiconductor element disposed within the case and electrically connected to the metal terminal; and a printed wiring board having a wiring pattern formed on a surface thereof, the printed wiring board being connected to the semiconductor element through the metal terminal; wherein the external portion of the metal terminal includes a joining portion and a resilient portion, the joining portion being in surface contact with an external surface of the case, the resilient portion facing and being spaced from the joining portion; wherein the printed wiring board is inserted between the joining portion and the resilient portion; and wherein the wiring pattern on the printed wiring board is pressure-welded to the joining portion. | 2009-06-11 |
20090146278 | Chip-stacked package structure with asymmetrical leadframe - The present invention provides a chip-stacked package structure, comprising: a lead-frame, composed of a plurality of inner leads and a plurality of outer leads, wherein the inner leads comprise a plurality of first inner leads in parallel and a plurality of second inner leads in parallel, and the ends of the first inner leads and the second inner leads are arranged opposite each other at a distance. The first inner leads is provided with a down-set structure, which results in different vertical heights of the position of the end of first inner leads and the position of the end of second inner leads. A chip-stacked package structure is then fixedly connected to the first inner leads, and the metallic bonding pads on the same side edge are electrically connected to the first inner leads and the second inner leads through a plurality of metal wires; and an encapsulant with a top surface and a bottom surface is provided to cover the chip-stacked package structure and the inner leads. | 2009-06-11 |
20090146279 | Method for attaching a semiconductor die to a leadframe, and a semiconductor device - A semiconductor device comprising a leadframe ( | 2009-06-11 |
20090146280 | CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER - A circuit member | 2009-06-11 |
20090146281 | SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF - There is provided a system-in-package including: a substrate of a sawed base wafer on which a semiconductor circuit is formed; a conductive post formed on a top surface of the substrate; at least one semiconductor chip stacked on the top surface of the substrate; a buried layer formed on the top surface of the substrate so as to cover at least partially the conductive post and the semiconductor chip; and an external connection bump electrically connected to the conductive post. The system-in-package is fabricated by stacking a plurality of semiconductor chips on a top surface of a base wafer, forming a buried layer, realizing an electrical path by a conductive post, and polishing top and bottom surfaces of the package, thereby thinning the thickness of the package. Further, the system-in-package greatly improves electrical operation characteristics and increases productivity. | 2009-06-11 |
20090146282 | Semiconductor Package and Method of Forming Similar Structure for Top and Bottom Bonding Pads - A semiconductor package has a first semiconductor die mounted on a substrate. A conductive via is formed through the substrate. A first RDL is formed on a first surface of the substrate in electrical contact with the conductive via and the first semiconductor die. A second RDL is formed on a second surface of the substrate opposite the first surface of the substrate die in electrical contact with the conductive via. A second semiconductor die can be mounted on the substrate and electrically connected to the second RDL. Bonding pads are formed over the first and second surfaces of the substrate in electrical contact with the first and second RDLs, respectively. The bonding pads on opposite surfaces of the substrate are aligned. Solder bumps or bond wires can be formed on the bonding pads. The semiconductor packages can be stacked and electrically connected through the aligned bonding pads. | 2009-06-11 |
20090146283 | STACKED-TYPE CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A stacked-type chip package structure in which stacked chips and stacked flexible circuit boards are disposed on a substrate. A plurality of spacer layers is respectively sandwiched between two adjacent chips and stacked on top of each other. In addition, conductive bumps are disposed on the substrate and between the stacked flexible circuit boards, such that the stacked flexible circuit boards are electrically connected to the substrate. Besides, conductive wires are electrically connected between the flexible circuit boards and the chips, so as to form a package structure with multi-layer chips on the substrate. Thereby, electrical performance and reliability of the chips are improved. | 2009-06-11 |
20090146284 | Molded Leadless Packages and Assemblies Having Stacked Molded Leadless Packages - Molded leadless packages having improved stacked structures are disclosed. An exemplary molded leadless package includes a die attaching pad, a plurality of leads spaced apart from the die attaching pad at a periphery region of the die attaching pad, a semiconductor chip on the die attaching pad, a plurality of bonding wires electrically connecting the leads to the semiconductor chip, and a sealing member fixedly enclosing the semiconductor chip and the bonding wires while partly exposing an outer surface of each of the leads. The sealing member fills gaps between the die attaching pad and the leads and includes at least one protrusion protruding downward from the die attaching pad and the leads. | 2009-06-11 |
20090146285 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - The present invention provides a semiconductor package and a fabrication method thereof. The method includes the steps of: providing a chip carrier module having a plurality of chip carriers, disposing a plurality of electrical connecting points on the chip carriers, performing chip mounting and molding on the chip carrier module to form an encapsulant encapsulating the semiconductor chip, exposing the electrical connecting points from the encapsulant; forming a patterned circuit layer on the encapsulant, electrically connecting the patterned circuit layer to the electrical connecting points, cutting and separating the chip carriers to form a plurality of semiconductor packages each having a circuit layer formed on the encapsulant such that the circuit layer provides extra electrical connecting points and thereby enhances electrical performance of electrical products. During a package stacking process, no package is limited by the design of another package below. | 2009-06-11 |
20090146286 | DIRECT ATTACH INTERCONNECT FOR CONNECTING PACKAGE AND PRINTED CIRCUIT BOARD - A direct attach interconnect includes a housing and spring contacts. The housing has top and bottom sides lying in parallel planes defined by x and y axes. Passages extend along the z axis between the top and bottom housing sides. Each spring contact has a middle portion and top and bottom ends. The spring contacts are individually disposed within respective passages such that the top ends of the spring contacts extend out through the top housing side and the bottom ends of the spring contacts extend out through the bottom housing side. The middle portion of each spring contact includes a connector which movably connects the middle portion of the spring contact to the passage for the spring contact such that the spring contact is movable along the x, y, and z axes. The top and bottom ends of each spring contact include one of a solder sphere and a solder pad. | 2009-06-11 |
20090146287 | Semiconductor device having a chip-size package - Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided into a device-mounting film portion having a device hole forming therein, an external-connection film portion, and a bent portion located between the device-mounting film portion and the external-connection film portion, an external electrode pad being formed on the external-connection film portion on a first surface side of the package film, an inner lead being formed in such a manner as to lead from the device hole to the external electrode pad via the bending portion; mounting a semiconductor chip on the device-mounting film portion on the first surface side by bonding the inner lead to an electrode pad of the semiconductor chip in a region where the device hole is formed; and bending the external-connection film portion at the bending portion 180° toward a second surface side of the package film and fixing the same. The method for mounting a semiconductor device on a mother board in close contact therewith includes the steps of: depositing solder balls on electrode pads of the mother board; and placing the semiconductor device on the mother board and melting the solder balls so as to electrically connect the electrode pads of the mother board and the external electrode pads of the semiconductor device. | 2009-06-11 |
20090146288 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor element | 2009-06-11 |
20090146289 | THERMOSET POLYIMIDES FOR MICROELECTRONIC APPLICATIONS - Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications. | 2009-06-11 |
20090146290 | Interconnect Structure and Method for Semiconductor Device - An interconnect method in a semiconductor device may include a step of examining various regions of an inter layer dielectric to identify regions having high densities or concentrations of trench features. A cap insulator layer may be added to the dielectric to assist in outgassing of absorbed impurities from the dielectric, but may be removed from the high density areas to allow the lower density areas to increase outgassing. The lower density areas may then compensate for increased outgassing on the high density areas due to the trench features, and may result in an overall device with a more stable dielectric constant across the device. | 2009-06-11 |
20090146291 | SEMICONDUCTOR PACKAGES - A semiconductor package includes a semiconductor chip including a semiconductor substrate and a plurality of cell transistors arranged on the semiconductor substrate. Channel regions of the cell transistors have channel lengths that extend in a first direction, and the package further includes a supporting substrate having an upper surface on which the semiconductor chip is affixed. The supporting substrate is configured to bend in response to a temperature increase in a manner that applies a tensile stress to the channel regions of the semiconductor chip in the first direction. Related methods are also disclosed. | 2009-06-11 |
20090146292 | SEMICONDUCTOR DEVICE THERMAL CONNECTION - A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device. | 2009-06-11 |
20090146293 | FLOW DISTRIBUTION MODULE AND A STACK OF FLOW DISTRIBUTION MODULES - A flow distribution module ( | 2009-06-11 |
20090146294 | GASKET SYSTEM FOR LIQUID-METAL THERMAL INTERFACE - Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer. | 2009-06-11 |
20090146295 | Ceramic substrate having thermal via - The present invention relates to a ceramic substrate having a thermal via passing through the substrate for purposes of radiating heat to the outside, wherein the ceramic substrate has a reinforcing structure that divides the opening of the thermal via into two or more parts, and the height of the reinforcing structure is less than the height of the thermal via. | 2009-06-11 |
20090146296 | Method of forming high-k dielectric stop layer for contact hole opening - A composite etch stop layer which comprises primary and secondary stop layers is used to form contacts in a dielectric layer to contact regions in a substrate. The secondary etch stop layer includes a high-k dielectric material to achieve high etch selectivity with the dielectric layer during contact formation. The secondary stop layer is removed to expose the contact regions. Removal of the secondary stop layer is achieved with high selectivity to the materials therebelow. | 2009-06-11 |
20090146297 | Semiconductor Device and Method of Forming Wafer Level Ground Plane and Power Ring - A semiconductor die has active circuits formed on its active surface. Contact pads are formed on the active surface of the semiconductor die and coupled to the active circuits. A die extension region is formed around a periphery of the semiconductor die. Through hole vias (THV) are formed in the die extension region. A conductive plane or ring is formed in a center area on the active surface of the semiconductor die. The conductive plane or ring is coupled to a first contact pad for providing a first power supply potential to the active circuits. The conductive plane or ring is electrically connected to a first THV. A conductive ring is formed partially around a perimeter of the conduction plane or ring. The conductive ring is coupled to a second contact pad for providing a second power supply potential to the active circuits. The conductive ring is electrically connected to a second THV. | 2009-06-11 |
20090146298 | SEMICONDUCTOR DEVICE HAVING SOLDER-FREE GOLD BUMP CONTACTS FOR STABILITY IN REPEATED TEMPERATURE CYCLES - A semiconductor device has a chip ( | 2009-06-11 |
20090146299 | SEMICONDUCTOR PACKAGE AND METHOD THEREOF - A ball grid array (BGA) structure package includes: a circuit board including a top surface and a bottom surface, and the top surface includes a patterned metal point disposed thereon and the bottom surface includes a metal point corresponding to the patterned conductive point; a semiconductor die includes an active surface, and the active surface includes a plurality of pads disposed thereon and the pads is electrically connected to the patterned metal point; a package body used to encapsulate the semiconductor die and the top surface of the circuit board; and a plurality of conductive elements electrically connected to the bottom surface of the circuit board. | 2009-06-11 |
20090146300 | Semiconductor packages and electronic products employing the same - Example embodiments of a semiconductor package are provided. In accordance with an example embodiment, a semiconductor package may include an external terminal connected to a concave surface of a bottom pad, wherein the bottom pad is recessed into a substrate. In accordance with another example embodiment, a semiconductor package may include at least one external terminal, a flexible substrate having a first surface with a plurality of convex portions and a second surface opposite the first surface having a plurality of concave portions, wherein the at least one terminal is recessed into the substrate and at least one of the concave portions surrounds a portion of the at least one external terminal. | 2009-06-11 |
20090146301 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrode | 2009-06-11 |
20090146302 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Embodiments relate to a method for manufacturing a semiconductor device, and in particular to a method for manufacturing a semiconductor device capable of simplifying a silicide manufacturing process using a photo resist overhang structure. According to embodiments, a surface is subjected to a monochlorobenzene coating processing to cure the surface of the exposed photo resist so as not to react with developing solution and such a processed photo resist is developed to make the lower of the photo resist in the overhang structure so as to form an accurate pattern according to the clear removal of the oxide film, making it possible to simply manufacture the silicide and the non-silicide without performing an etching process by a subsequent cobalt deposition process. | 2009-06-11 |
20090146303 | Flip Chip Interconnection with double post - A packaged microelectronic assembly includes a microelectronic element having a front surface and a plurality of first solid metal posts extending away from the front surface. Each of the first posts has a width in a direction of the front surface and a height extending from the front surface, wherein the height is at least half of the width. There is also a substrate having a top surface and a plurality of second solid metal posts extending from the top surface and joined to the first solid metal posts. | 2009-06-11 |
20090146304 | CARBON NANOTUBE INTEGRATED CIRCUIT DEVICES AND METHODS OF FABRICATION THEREFOR USING PROTECTED CATALYST LAYERS - A method of fabricating an integrated circuit device is provided. The method includes sequentially forming a lower interconnection layer, a catalyst layer, and a buffer layer on a semiconductor substrate, forming an interlayer dielectric layer to cover the buffer layer, forming a contact hole through the interlayer dielectric layer so that a top surface of the buffer layer may be partially exposed, removing a portion of the buffer layer exposed by the contact hole so that a top surface of the catalyst layer may be exposed, and growing carbon nanotubes from a portion of the catalyst layer exposed by the contact hole so that the contact hole may be filled with the carbon nanotubes. | 2009-06-11 |
20090146305 | POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS - A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over the layer of dielectric and a thick second layer of dielectric is created over the surface of the layer of passivation. Thick and wide post-passivation interconnect lines are created in the thick second layer of dielectric. The first layer of dielectric may also be eliminated, creating the wide thick passivation interconnect network on the surface of the layer of passivation that has been deposited over the surface of a substrate. | 2009-06-11 |
20090146306 | Semiconductor device with epitaxial C49-titanium silicide (TiSi2) layer and method for fabricating the same - The present invention relates to a semiconductor device with an epitaxially grown titanium silicide layer having a phase of C49 and a method for fabricating the same. This titanium silicide layer has a predetermined interfacial energy that does not transform the phase of the titanium layer, and thus, occurrences of agglomeration of the titanium layer and a grooving phenomenon can be prevented. The semiconductor device includes: a silicon layer; an insulation layer formed on the silicon layer, wherein a partial portion of the insulation layer is opened to form a contact hole exposing a partial portion of the silicon layer; an epitaxially grown titanium silicide layer having a phase of C49 and formed on the exposed silicon substrate disposed within the contact hole; and a metal layer formed on an upper surface of the titanium silicide layer. | 2009-06-11 |
20090146307 | Top layers of metal for high performance IC's - The present invention adds one or more thick layers of polymer dielectric and one or more layers of thick, wide metal lines on top of a finished semiconductor wafer, post-passivation. The thick, wide metal lines may be used for long signal paths and can also be used for power buses or power planes, clock distribution networks, critical signal, and re-distribution of I/O pads for flip chip applications. Photoresist defined electroplating, sputter/etch, or dual and triple damascene techniques are used for forming the metal lines and via fill. | 2009-06-11 |
20090146308 | NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A nitride semiconductor device with a p electrode having no resistance between itself and other electrodes, and a method of manufacturing the same are provided. A p electrode is formed of a first Pd film, a Ta film, and a second Pd film, and on a p-type contact layer of a nitride semiconductor. On the second Pd film, a pad electrode is formed. The second Pd film is formed on the entire upper surface of the Ta film which forms part of the p electrode, and serves as an antioxidant film that prevents oxidation of the Ta film. Preventing oxidation of the Ta film, the second Pd film can reduce the resistance that may exist between the p electrode and the pad electrode, thereby preventing a failure in contact between the p electrode and the pad electrode and providing the p electrode with low resistance. | 2009-06-11 |
20090146309 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a first insulating film formed over a semiconductor substrate, a first opening formed in the first insulating film, a first manganese oxide film formed along an inner wall of the first opening, a first copper wiring embedded in the first opening, and a second manganese oxide film formed on the first copper wiring including carbon. | 2009-06-11 |
20090146310 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device subjected to an optical annealing process by radiation light whose principal wavelength is 1.5 μm or less includes a circuit pattern region formed on a semiconductor substrate, and a dummy pattern region formed separately from the circuit pattern region on the semiconductor substrate. The circuit pattern region has an integrated circuit pattern containing a gate pattern related to a circuit operation. The dummy pattern region has dummy gate patterns that have the same structure as that of a gate pattern used in the integrated circuit pattern and the dummy gate patterns are repeatedly arranged with a pitch 0.4 times or less the principal wavelength. | 2009-06-11 |
20090146311 | INTERCONNECT STRUCTURE - An interconnect structure is disposed on a substrate with a conductive part thereon and includes a first porous low-k layer on the substrate, a damascene structure in the first porous low-k layer, a second porous low-k layer over the first porous low-k layer and the damascene structure, and a first UV cutting layer at least between the first porous low-k layer and the second porous low-k layer. The damascene structure is electrically connected with the conductive part. The UV cutting layer is a UV reflection layer or a UV reflection-absorption layer. | 2009-06-11 |
20090146312 | METHODS FOR FORMING INTERCONNECTS IN MICROELECTRONIC WORKPIECES AND MICROELECTRONIC WORKPIECES FORMED USING SUCH METHODS - Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods are disclosed herein. One embodiment, for example, is directed to a method of processing a microelectronic workpiece including a semiconductor substrate having a plurality of microelectronic dies. The individual dies include integrated circuitry and a terminal electrically coupled to the integrated circuitry. The method can include forming a first opening in the substrate from a back side of the substrate toward a front side and in alignment with the terminal. The first opening has a generally annular cross-sectional profile and separates an island of substrate material from the substrate. The method can also include depositing an insulating material into at least a portion of the first opening, and then removing the island of substrate material to form a second opening aligned with at least a portion of the terminal. In several embodiments, the method may include constructing an electrically conductive interconnect in at least a portion of the second opening and in electrical contact with the terminal. | 2009-06-11 |
20090146313 | SEMICONDUCTOR DEVICE - In a semiconductor device according to an aspect of the invention, a direction in which a fourth metal interconnection layer located on a semiconductor layer is extended is orthogonal to a direction in which third interconnection layers ML | 2009-06-11 |
20090146314 | Semiconductor Device - A semiconductor device includes a first wiring board having a semiconductor element connection pad; a semiconductor element connected to the semiconductor element connection pad; and a second wiring board facing the semiconductor element and the first wiring board, the second wiring board being electrically connect to the first wiring board. The semiconductor element includes an electrode configured to electrically connect a first surface of the semiconductor element and a second surface of the semiconductor element to each other. The first surface of the semiconductor element faces the first wiring board. The second surface of the semiconductor element faces the second wiring board. The first wiring board and the second wiring board are electrically connected to each other via the electrode. | 2009-06-11 |
20090146315 | INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM AND METHOD OF MANUFACTURE THEREOF - An integrated circuit package-on-package stacking system includes: providing a first integrated circuit package, mounting a metalized interposer substrate over the first integrated circuit package, attaching a stiffener integrated with the metalized interposer substrate and having dimensions within package extents, and attaching a second integrated circuit package on the metalized interposer substrate adjacent the stiffener. | 2009-06-11 |
20090146316 | FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING - Disclosed are embodiments of a flip-chip assembly and method using lead-free solder. This assembly incorporates mushroom-plated metal layers that fill and overflow solder resist openings on an organic laminate substrate. The lower portion of metal layer provides structural support to its corresponding solder resist opening. The upper portion (i.e., cap) of each metal layer provides a landing spot for a solder joint between an integrated circuit device and the substrate and, thereby, allows for enhanced solder volume control. The additional structural support, in combination with the enhanced solder volume control, minimizes strain on the resulting solder joints. Additionally, the cap further allows the minimum diameter of the solder joint on the substrate-side of the assembly to be larger than the diameter of the solder resist opening. Thus, the invention decouples C4 reliability concerns from laminate design concerns and, thereby, allows for greater design flexibility. | 2009-06-11 |
20090146317 | PACKAGE SUBSTRATE HAVING ELECTRICALLY CONNECTING STRUCTURE - A package substrate having an electrically connecting structure are provided. The package substrate include: a package substrate substance with at least a surface having a plurality of electrically connecting pads formed thereon, allowing an insulating protective layer to be formed on the surface of the package substrate substance and the electrically connecting pads and formed with a plurality of openings corresponding in position to the electrically connecting pads so as to expose a portion of the electrically connecting pads, respectively; and a metal layer provided on an exposed portion of the electrically connecting pads, walls of the openings of the insulating protective layer, and a circular portion of the insulating protective layer encircling each of the openings thereof, and provided with a slope corresponding in position to a bottom rim of each of the openings. Accordingly, solder bleeding and short circuits are prevented. | 2009-06-11 |
20090146318 | MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE - A multilayer wiring board includes: a substrate; connection pads arranged in a square grid fashion; and wiring patterns. Relationship between the connection pads and the wiring patterns satisfies: {(Ndl+1)P−d−s}/(w+s)>2Ndr+Ndl(a+1)+2a, wherein P is a pitch of the connection pads, d is a diameter of the connection pads, s is a minimum interval between the wiring patterns and is a minimum interval between the wiring pattern and the connection pad that are adjacent to each other, w is a minimum width of the wiring patterns, Ndl is the number of non-pad rows in each of the non-pad regions, Ndr is the number of non-pad columns in each of non-pad region, and a is an integer of (P−d−s)/(w+s). | 2009-06-11 |
20090146319 | SEMICONDUCTOR DEVICE - A semiconductor device which can prevent damage to an ESD protection device by pressure when bonding is carried out, while having a pad configuration that can ensure bonding reliability, with the semiconductor device being made as small as possible. A bonding area that is an area for wire bonding with respect to an external electrode pad and a probing area that is an area in which a probe needle is applied when probing, are provided, and the ESD protection device and a discharge path therefor are arranged below the probing area. Arranged below the bonding area are a support via that is a little smaller than the bonding pad, and a support pattern having a size corresponding to the bonding pad and joined to the bonding pad by the support via. | 2009-06-11 |
20090146320 | FABRICATED ADHESIVE MICROSTRUCTURES FOR MAKING AN ELECTRICAL CONNECTION - An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package. | 2009-06-11 |
20090146321 | WIRE BONDING PERSONALIZATION AND DISCRETE COMPONENT ATTACHMENT ON WIREBOND PADS - Inner wire bond pads are formed within a peripheral region of a semiconductor chip and at least one bonding wire is attached to the inner wire bond pads. The semiconductor chip may be customized for a specific configuration of choice by wiring inner wire bond pads. Alternately, the bonding wires may be employed to reinforce a power network or a ground network. Further, the bonding wire may serve as a passive radio frequency (RF) component. In addition, the bonding wire may be used a heat conduction path to transfer heat from the semiconductor chip to the upper package housing. | 2009-06-11 |
20090146322 | METHOD OF ELIMINATING A LITHOGRAPHY OPERATION - Methods of semiconductor device fabrication are disclosed. An exemplary method includes processes of depositing a first pattern on a semiconductor substrate, wherein the first pattern defines wide and narrow spaces; depositing spacer material over the first pattern on the substrate; etching the spacer material such that the spacer material is removed from horizontal surfaces of the substrate and the first pattern but remains adjacent to vertical surfaces of a wide space defined by the first pattern and remains within narrow a space defined by the first pattern; and removing the first pattern from the substrate. In one embodiment, the first pattern can comprise sacrificial material, which can include, for example, polysilicon material. The deposition can comprise physical vapor deposition, chemical vapor deposition, electrochemical deposition, molecular beam epitaxy, atomic layer deposition or other deposition techniques. According to another embodiment, features for lines and logic device components having a width greater than that of the lines are formed in the spacer material in the same mask layer. | 2009-06-11 |
20090146323 | RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYALUMINOSILOXANE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME - The present invention relates to a resin for optical-semiconductor-element encapsulation which comprises a polyaluminosiloxane obtained by reacting a silicon compound with an aluminum compound, and an optical semiconductor device obtained with the resin. The resin has satisfactory light-transmitting properties and low hygroscopicity and suffers no discoloration when used at a high temperature. | 2009-06-11 |
20090146324 | Phenoxyphenyl polysiloxane composition and method for making and using same - A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with cured phenoxyphenyl polysiloxane are further disclosed. | 2009-06-11 |
20090146325 | ALIGNMENT FOR BACKSIDE ILLUMINATION SENSOR - An apparatus and manufacturing method thereof, wherein an integrated circuit is located in a first region of a substrate having first and second opposing major surfaces, and wherein an alignment mark is located in a second region of the substrate and extends through the substrate between the first and second surfaces. The alignment mark may protrude from the first and/or second surfaces, and/or may comprise a plurality of substantially similar alignment marks. The second region may interpose the first region and a perimeter of the substrate. The second region may comprise a scribe region. | 2009-06-11 |
20090146326 | Method and Structures for Indexing Dice - A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer. | 2009-06-11 |
20090146327 | CARBURETOR AND AUTOMATIC CHOKE ASSEMBLY FOR AN ENGINE - A carburetor configured for use with an internal combustion engine includes a body defining a passageway therein, a throttle lever including a cam surface, and a throttle valve positioned in the passageway and responsive to movement of the throttle lever. The throttle valve is configured to rotate about a first axis from a wide-open first position to a second position at least 50 degrees from the first position. The carburetor also includes a choke lever including a follower surface configured to be engaged by the cam surface and a choke valve positioned in the passageway and responsive to movement of the choke lever. One of the cam surface and the follower surface includes an arcuate segment having a constant radius centered on a second axis. The arcuate segment is sufficiently long such that the throttle valve is configured to move at least 15 degrees while the other of the cam surface and the follower surface engages the arcuate segment. | 2009-06-11 |
20090146328 | Method for Providing Lens Blanks - A method provides a machineable silicon-containing lens blank by removal of diluent from the lens blank. The method involves casting a lens blank in a mold, wherein the lens blank is made of a polymerization product of a monomeric mixture comprising a silicone-containing monomer and an organic diluent; removing the lens blank from the mold; and removing organic diluent from the lens blank. | 2009-06-11 |
20090146329 | LENS RELEASE - This invention discloses improved mold parts for ophthalmic lenses fashioned from a first thermal plastic resin compounded with a second thermal plastic resin resulting in a thermal plastic compound with a deionized water contact angle that is greater than the deionized water contact angle of either the first thermal plastic resin or the second thermal plastic resin. The mold parts can be used in manufacturing processes, such as, for example: continuous, in-line or batched processes. | 2009-06-11 |
20090146330 | METHOD FOR MAKING SILICONE HYDROGEL CONTACT LENSES - The invention provide a method for making silicone hydrogel contact lenses. The method of the invention is characterized by using a solvent mixture including at least one organic solvent which dissolve the polymerizable material in a lens-forming composition and a small amount of water. By having a small amount of water in the lens-forming composition, the mechanical strength of lenses cast-molded from the lens-forming composition can be sufficiently high so that the lenses can survice during mold opening and demolding process, thereby increasing the production yield. | 2009-06-11 |
20090146331 | DEFORMABLE MOLDS AND METHODS FOR THEIR USE IN THE MANUFACTURE OF OPHTHALMIC LENSES - The present provides deformable molds and methods for manufacturing ophthalmic lenses using deformable molds. The molds of the invention may be used in the custom manufacture of ophthalmic lenses. | 2009-06-11 |
20090146332 | METHOD AND DEVICE FOR POSITIONING A COMPONENT - The invention relates to a method and device for positioning a component. A hydraulic drive displaces the component along a guide. A position marking for the component is read by at least one sensor. An output signal is transmitted to a controller and the controller regulates a position of the component by means of a variation in the supply of fluid depending on the output signal from the sensor. | 2009-06-11 |
20090146333 | APPARATUS AND METHOD FOR CONTROLLING MOLD TEMPERATURES - An apparatus for controlling temperatures of a mold includes a first heating system, a second heating system, and a cooling system. The first heating system is used for pre-heating medium therein. The second heating system is used for further heating the pre-heated medium provided by the first heating system, and providing the heated medium for the mold after draining out preexisting leftover medium in the mold, before injection molding. The cooling system is used for cooling down the mold after injection molding. A relative method for controlling temperatures of the mold is provided as well. | 2009-06-11 |
20090146334 | METHOD FOR PRODUCING MICROPOROUS POLYOLEFIN MEMBRANE AND MICROPOROUS MEMBRANE - A microporous polyolefin membrane having large pore diameters and excellent air permeability, mechanical strength and compression resistance can be obtained by (a) stretching a gel molding comprising a polyolefin and a membrane-forming solvent at least uniaxially at a temperature from the crystal dispersion temperature of the polyolefin +15° C. to the crystal dispersion temperature of the polyolefin +40° C., removing the membrane-forming solvent, and then stretching again the resultant membrane to 1.1 to 2.5 fold at least uniaxially, or by (b) stretching the gel molding at least uniaxially, bringing the stretched film into contact with a hot solvent before and/or after removing the membrane-forming solvent, and then stretching again the resultant membrane to 1.1 to 2.5 fold at least uniaxially. | 2009-06-11 |
20090146335 | Cassette Changing Device - A cassette changing device for a microtome has a housing having a loading opening, a transfer opening and an unloading opening. The openings are arranged with respect to each other linearly in the housing. A slide is disposed in the housing linearly movably between a first position and a second position and has a first receiving compartment and a second receiving compartment. The first and second compartments are aligned with respect to each other so that, in the first position of the slide, the first compartment and the second compartment are respectively aligned with a first two of the openings and, in the second position of the slide, the first compartment and the second compartment are respectively aligned with a second two of the openings. | 2009-06-11 |
20090146336 | Process for making shrink films with embossed optical or holographic devices - The present invention provides a process for manufacturing an embossed shrink film having one or more embossed devices such as optical devices, optical lenses, holographic images, holographic textures, static images, textured patterns, and graphical text. An embossing tool is provided having a raised image corresponding to the embossed device and a film is embossed by extruding the film across the embossing tool to form the embossed devices in the film. The embossed film is tentered, proportionally stretching the embossed devices along with the film. The tentered film is stored for subsequent forming into a sleeve of film that can be placed about a product and shrunk by heating to form a contoured shrink film on the product, the film retaining the embossed devices in proportion to the shrinkage of the film. | 2009-06-11 |
20090146337 | METHOD FOR PRODUCING EXTRUDED RESIN SHEET - Disclosed is a method for producing an extruded resin sheet comprising: heat-melting a thermoplastic resin and then extruding it into a sheet-form through a die; pressure-forming the extruded molten thermoplastic resin with a first roll and a second roll; and further pressure-forming the formed resin with the second roll and a third roll while wrapping the formed resin around the second roll, wherein the first roll is a roll having an outer circumferential surface of metal, the second roll is a highly rigid metal roll, and the third roll is an elastic roll having a metal thin film at its outer circumferential surface. The present invention provides a method for producing an extruded resin sheet with excellent appearance. | 2009-06-11 |
20090146338 | PROCESS FOR PREPARING POLYMER FIBERS - A process is provided for producing staple fibers that may be used in the formation of carpets from poly(trimethylene terephthalate). Poly(trimethylene terephthalate) may be melt spun to form filaments. The melt spun filaments may then be cooled with a liquid having a temperature of at most 20° C. The cooled filaments may then be drawn, and the drawn filaments may be cut into staple fibers. The resulting staple fibers have highly uniform physical characteristics such as denier, tenacity, and elongation at break that render the fibers particularly useful for forming carpets. | 2009-06-11 |
20090146339 | Extrusion Die and Process for Producing an Extruded Filled Polymer Composition - Prepare an extruded filled polymer composite having a highly disperse and uniformly distributed filler by extruding a filled polymer composite through a die with a Flow Restriction Zone, a Flow Redistribution Zone and a Land Zone. The Flow Restriction Zone is proximate to the extruder and increases polymer melt backpressure in the extruder sufficient to induce high dispersion of the filler but not enough to cause undesirable degradation of the polymer melt components. | 2009-06-11 |
20090146340 | METHOD AND APPARATUS FOR PRODUCING POLYMER FILM - A casting film is formed by casting a dope containing a polymer and a solvent onto a support. Thereafter, the casting film is peeled off from the support as a wet film ( | 2009-06-11 |
20090146341 | Systems and Methods Involving Pattern Molds - System and methods involving pattern molds are provided. In this regard, a representative system includes a mold assembly unit having a movable fixture holder operative to engage a portion of a pattern mold and position the pattern mold for assembly. | 2009-06-11 |
20090146342 | SPACER MOLD AND METHODS THEREFOR - A hip spacer mold forming a spacer with a spacer stem connected to a spacer head has a stem portion for forming a spacer stem. The hip spacer mold also has a plurality of interchangeable head modules configured for alternatively forming spacer heads of a plurality of different predetermined sizes. The head modules are configured to be disposed adjacent the stem portion. | 2009-06-11 |
20090146343 | Film Profile Forming Method - A film thermoforming method includes inserting a film prefabricated material need to be thermoformed into a lower die of a thermoforming device. The thermoforming device includes an upper die movable to-and-fro opposite to the lower die based on the shape of a film product. The upper die moves downwards gradually to press from a predetermined manufacturing height and then moves upwards to release the prefabricated material by a cycle mode, and the method decreases gradually the manufacturing height of the upper die for thermoforming the film product in a predetermined time. The present method can improve the precision and the quality of the film product, and can decrease largely the manufacturing time. | 2009-06-11 |
20090146344 | Process and freeform fabrication system for producing a three-dimensional object - The present invention provides a process for producing at least one three-dimensional object, comprising: providing a material to be solidified; delivering electromagnetic radiation and/or synergistic stimulation in a pattern or an image to a building region for solidifying said material; wherein said delivering of electromagnetic radiation and/or synergistic stimulation is performed selectively to a defined area or volume of said material to be solidified; and wherein an energy density of electromagnetic radiation and/or synergistic stimulation is controlled and/or adjusted in a border region of said pattern or image and/or is varied in border regions of patterns or images of different building regions of said material, to have an energy density different from the building region other than said border region(s), wherein the controlling and/or adjustment is dependent on, alone or in combination: (a) intensity of electromagnetic radiation and/or synergistic stimulation delivered to said defined area or volume of said material to be solidified; (b) total shape or contour shape of said defined area or volume of said material to be solidified; (c) size of said defined area or volume of said material to be solidified; and (d) material to be solidified. A device is provided likewise. | 2009-06-11 |
20090146345 | Preform design for injections stretch blow molding - Preforms for use in injection stretch blow molding processes and such processes are described herein. The preforms generally include a neck having an internal neck diameter and an external neck diameter and a body having an internal body diameter and an external body diameter, the internal body diameter and the external body diameter forming a sidewall, wherein the internal body diameter is at least 80% of the internal neck diameter. The preforms further include an end-cap positioned on the body at a transition point and having an end-cap depth and a transition point radius, wherein the end-cap depth is greater than the transition point radius. | 2009-06-11 |
20090146346 | APPARATUS FOR MANUFACTURING THERMOPLASTIC RESIN FILM, AND METHOD FOR MANUFACTURING THERMOPLASTIC RESIN FILM - An apparatus for manufacturing a thermoplastic resin film includes a die which discharges a molten thermoplastic resin as a film, a cooling roll which is arranged so as to oppose to the discharge port of the die, and cools and solidifies the discharged film, and a variation reduction mechanism which reduces a variation of a wind speed in the vicinity of the surface of the film. The apparatus enables to provide a thermoplastic resin film which is suitable for an optical application, by controlling the thickness nonuniformity of the thermoplastic resin film in manufacturing the thermoplastic resin film by using a melt film-forming method. | 2009-06-11 |
20090146347 | Imprint lithography - An imprint template cover for an imprint template having a pattern feature thereon. The cover is configured such that, in use, it extends around the pattern feature of the imprint template, and such that the cover does not contact the pattern feature. | 2009-06-11 |
20090146348 | Method of fabrication a stent from blow molded tubing - Methods to expand polymer tubing with desirable or optimum morphology and mechanical properties for stent manufacture and fabrication of a stent therefrom are disclosed. | 2009-06-11 |
20090146349 | METHOD FOR MANUFACTURING PLASMA TREATMENT DEVICE FOR EXHAUST GAS PURIFICATION - A plasma treatment device for exhaust gas purification includes a honeycomb body and metal electrodes. The honeycomb body is made of dielectric and has therein a plurality of holes which introduces exhaust gas thereinto. The metal electrodes extend along the holes, and are interposed between the holes. The plasma treatment device purifies exhaust gas by applying electric voltage between the metal electrodes to generate plasma inside the holes. A method for manufacturing the plasma treatment device includes steps of positioning the metal electrodes in an extrusion die, providing dielectric material for the honeycomb body into the extrusion die, and performing extrusion so as to form the honeycomb body thereby integrating the honeycomb body with the metal electrodes. | 2009-06-11 |
20090146350 | PROCESS FOR PRODUCING HONEYCOMB STRUCTURE - A process for producing a honeycomb structure includes: a mixing step where forming raw materials including a ceramic raw material are mixed to obtain a forming blended material, a kneading step where the forming blended material is kneaded to obtain kneaded clay, a forming step where the kneaded clay is formed into a honeycomb shape to obtain a honeycomb formed article, and a firing step where the honeycomb formed article is fired to obtain a honeycomb structure. The ceramic raw material is a cordierite forming raw material, and a magnetic powder contained in the kneaded clay is at a ratio of 400 ppm or less with respect to solid content conversion mass of the whole kneaded clay. There is provided a honeycomb structure capable of improving trapping efficiency, in particular, initial trapping efficiency by reducing the number of coarse pores in the partition walls. | 2009-06-11 |
20090146351 | LOAD COMPENSATING HYDRAULIC RATE CONTROL - A rate control device includes an outer cylinder defining an interior chamber having a longitudinal axis and containing a hydraulic fluid. A piston head mounted to a proximal end or a piston rod is slidably positionable within the interior chamber. A rate control valve is disposed within an interior cavity of the piston head coaxially with the longitudinal axis of the interior chamber of the cylinder. The rate control valve includes a variable flow rate orifice and a fixed flow rate orifice disposed in series relationship with respect to fluid flow through the rate control valve. | 2009-06-11 |
20090146352 | Vibration isolator for use in a vacuum - The invention relates to a vibration isolator for use in a vacuum in which mechanical and electrical modules are arranged within a fluid-tight chamber. | 2009-06-11 |
20090146353 | Carve smart - An improved cutting board that is capable of simultaneously providing a top cutting surface with perforated drain holes and a pan for containment of juices. The apparatus comprises a polymeric plastic cutting surface, with perforated and elongated drain holes spaced at intervals along the cutting surface with legs for support attached to a stainless steel pan for the containment of juices. A pour spout is oriented in one of the corners to pour out the juices with ease. | 2009-06-11 |
20090146354 | HOLDING TOOL FOR FRAMING - A tool for temporarily holding a second framing member to be fastened into a frame assembly parallel to a first framing member that is already fastened into the assembly. It has a track | 2009-06-11 |
20090146355 | FLEXIBLE SUBSTRATE TENSIONER - Apparatus and method to aid in the reproducible and reversible tensioning of flexible substrates, such as polyimide or other file, to ensure planarity before, during, and after processing while mounted in tensioning apparatus. | 2009-06-11 |
20090146356 | Swing Clamp Apparatus - A swing clamp apparatus is provided in which the clamp arm is positioned and attached to a clamp rod at a desired position in a simple and reliable manner and the clamp arm replacement workload is certainly reduced. The swing clamp apparatus comprises an attachment block fixed to the leading end of a clamp rod and to which a clamp arm is detachably attached and a pair of clamping force transmission pins inserted in the attachment block and clamp arm in the direction parallel to the orthogonal direction to the axis for coupling the positioned clamp arm to the attachment block in an integrated manner. | 2009-06-11 |
20090146357 | Welding clamp - This is a u-shaped clamp to be used to connect and align pieces to be welded. A cutout is located on at least one clamping jaw to provide easy viewing of the site to be welded. To ensure secure clamping action, the jaws of the clamp are spring loaded and connected to a base piece. Further securing to the pieces to be welded is provided by magnets in the clamp. | 2009-06-11 |
20090146358 | Clamp - A clamp includes a guiding rod, a stationary jaw secured to the guiding rod, a movable jaw movably provided on the guiding rod and a fastening unit. The movable jaw is formed with a ring and two helical grooves in an internal side of the ring. The fastening unit includes a knob, an axle and a latch. The axle is connected to the knob and inserted through the ring for abutment against the guiding rod. The latch is connected to the axle and formed with two ends for sliding in the helical grooves. | 2009-06-11 |
20090146359 | LOW PROFILE CLAMP FOR USE WITH APPARATUS FOR THERMAL CONTROL IN THE ANALYSIS OF ELECTRONIC DEVICES - A heat spreader comprising a sheet of transparent diamond with an aperture therein that accommodates a solid-immersion lens (SIL). The heat spreader may be mounted within a clamp which allows the heat spreader to move freely across the Device Under Test (DUT) whilst maintaining a very high degree of planarity and contact between the diamond and the silicon substrate of the DUT. The DUT is secured to its electrical interface with a low profile clamp, the DUT may be held within the clamp by a mechanism that applies a pressure to the sides of the DUT package. | 2009-06-11 |
20090146360 | UNDER-SHINGLED ARTICLE HANDLING AND STACKING SYSTEM AND METHOD - A device and process for processing flat articles such as pieces of paper by utilizing a stream of under-shingled flat articles and generating a gap at predetermined intervals. The under-shingling process incorporates an accelerating and decelerating portion wherein each flat article is accelerated and then decelerated while a tail portion of the article is lifted such that the next flat article can slide underneath to establish an under-shingled stream. | 2009-06-11 |
20090146361 | DOCUMENT FEEDER FLAG ASSEMBLY - An improved document feeder flag assembly is disclosed. The improved document feeder flag assembly allows single handed, on the fly loading of a document sorter. A method for loading a document sorting machine with a single hand, while the method of operating the machine is also disclosed. The document feeder flag assembly includes a baseplate and a pivot post attached to the baseplate. Further, the assembly includes a flag arm having a first side and a second side, the first side of the flag arm is attached to the pivot post. There is also a feeder flag having a first side and a second side, the first side of the feeder flag being attached to a second side of the flag arm. The document feeder flag assembly also includes a resistance device attached between the feeder flag and the flag arm. | 2009-06-11 |
20090146362 | TRANSPORTATION DEVICE AND IMAGE PROCESSING APPARATUS - A transportation device including first and second tray portions which are stacked relative to each other, first and second transportation openings included in the first and second tray portions, respectively, and a transportation path for a material which is formed between the first and second transportation openings. The first tray portion includes a first movable tray portion which can be displaced, the second tray portion includes a second movable tray portion which can be displaced. The first movable tray portion and the second movable tray portion are configured move between a tray position where the first and second movable tray portions form a tray member for transporting the material and a housing position where the tray portions form a housing configuring member by closing the first and second transportation openings which are exposed in the tray position. | 2009-06-11 |
20090146363 | IMAGE FORMING APPARATUS - Disclosed is an image forming apparatus including: a plurality of paper feed trays in which paper sheets are to be stacked; paper feed units each provided to each of the plurality of paper feed trays, the paper feed units sucking or discharging air in accordance with setting values corresponding to types of paper sheet to carry the paper sheets stacked in the respective paper feed trays toward a paper path; a storage unit to store the setting values for the paper feed units according to the types of paper sheet; an input unit to input a change instruction value for changing at least one of the setting values; and a control unit to change the at least one of the setting values stored in the storage unit into the change instruction value and to store the changed at least one of the setting values into the storage unit. | 2009-06-11 |
20090146364 | METHOD AND DEVICE FOR MERGING TWO FLOWS OF OBJECTS - A method for transporting and merging two flows of objects, in particular flat mail items, includes providing each of the two object flows with at least two respective objects. The two object flows follow one another in each respective transport path. One transport path merges into the other transport path. The two objects transported on the merging transport path are pushed over one another before reaching the merging point in such a manner that, when viewed in the transport direction, they overlap at least partially. The two objects are transported to a merging point in this overlapping state, infiltrated into the other transport path between the two objects transported on the other transport path and continue to be transported on the other transport path. | 2009-06-11 |
20090146365 | Paper feeder and image processing apparatus using the same - A paper feeder and an image processing apparatus using the same are provided. The paper feeder includes a feeding plate, a paper guide, a paper-feeding unit and a friction provider. The feeding plate is for supporting at least one sheet of paper. The paper guide is disposed on a side of the feeding plate for aligning the sheet of paper. The paper-feeding unit is disposed at a paper-feeding end of the feeding plate for conveying the sheet of paper. The friction provider is disposed on one lateral side of the paper-feeding unit, for increasing the friction between the sheet of paper and the surface of the feeding plate, and the paper guide is disposed on the other lateral side of the paper-feeding unit. | 2009-06-11 |
20090146366 | CASH HANDLING SYSTEM - The invention relates to a system for transporting a sheaf of notes from a storage location to a dispensing outlet. The system comprises a conveyor apparatus, a carrier within which the sheaf is transported through the conveyor apparatus, and an extractor for removing the sheaf from the carrier. The carrier comprises a resiliently biased gripper for gripping the sheaf with a first gripping force. The extractor comprises an extraction gripping device configured to grip the sheaf with a second gripping force, which is greater than the first gripping force. | 2009-06-11 |
20090146367 | SHEET FEEDER, IMAGE FORMING APPARATUS HAVING THE SAME, AND METHOD FOR SHEET FEEDING - A sheet feeder includes a sheet feed tray on which a first sheet bundle is stacked at a first position where sheet feeding to a conveyance path can be performed, and a conveyance tray on which a second sheet bundle is stacked at a second position adjacent to the sheet feed tray, and which conveys the second sheet bundle to the sheet feed tray and stacks the second sheet bundle on the sheet feed tray after the first sheet bundle is fed, presses the stacked second sheet bundle to a side plate provided in a direction perpendicular to a conveyance direction of the conveyance tray, and aligns an end of the second sheet bundle. | 2009-06-11 |
20090146368 | SHEET STACKING APPARATUS AND IMAGE FORMING SYSTEM - Operation of the sheet stacking apparatus | 2009-06-11 |
20090146369 | SHEET STACKING APPARATUS, SHEET PROCESSING APPARATUS, AND IMAGE FORMING APPARATUS - The present invention provides a sheet stacking apparatus, whose lifting and lowering mechanism having excellent assembly properties and maintenance properties. | 2009-06-11 |
20090146370 | Method for Sensing Paper Skew and Method for Correcting Paper Skew - A method for sensing a paper skew adapted for a device having a paper feeding mechanism is provided. The device has a feed sensor which is fixed at a start position of paper feeding; and, a position sensor which moves in a direction perpendicular to a direction of paper feeding and passes through a first and a second positions. The first position is the intersection of a moving path of the position sensor and a line. The feed sensor is on the line, and the line is parallel to the direction of paper feeding. The method includes the device having a first distance; moving the position sensor to the second position; feeding a work paper into the device; obtaining a second distance which is a moving distance of the work paper fed; and determining whether the work paper is skewed or not according to the difference between the first and the second distances. | 2009-06-11 |
20090146371 | PRINTING INTEGRATION SYSTEM - This disclosure relates to a printing integration system. Specifically, this disclosure provides a means to integrate one or more pairs of substantially vertically aligned marking engines using an intersection transport. The intersection transport includes a media sheet input intersection transport, a single horizontal transport, and a media sheet output intersection transport. | 2009-06-11 |
20090146373 | Token With Electronic Device, Method of Making Thereof, and Apparatus for Making Thereof - Token including a token body obtained by at least one injection of material around an insert including a contactless identification device attached to a rigid plate sandwiched between two layers of injected material, the rigid plate including at least one through-hole. The invention also concerns the method of manufacturing such a token, including placing the insert in a mold, injecting a plastic material around the insert to form at least a portion of the core of the token, and at least one injection of plastic material around the assembly formed by the insert and the portion of the core obtained after the first injection of plastic material. | 2009-06-11 |