| 23rd week of 2011 patent applcation highlights part 17 |
| Patent application number | Title | Published |
|---|
| 20110133295 | REGION DIVIDED SUBSTRATE AND SEMICONDUCTOR DEVICE - A region divided substrate includes a substrate, a plurality of trenches, a conductive layer, and an insulating member. The substrate has a first surface and a second surface opposed to each other. The trenches penetrate the substrate from the first surface to the second surface and divide the substrate into a plurality of partial regions. The conductive layer is disposed on a sidewall of each of the trenches from a portion adjacent to the first surface to a portion adjacent to the second surface. The conductive layer has an electric conductivity higher than an electric conductivity of the substrate. The insulating member fills each of the trenches through the conductive layer. | 2011-06-09 |
| 20110133296 | SEMICONDUCTOR DEVICE, AND COMMUNICATION APPARATUS AND ELECTRONIC APPARATUS HAVING THE SAME - Provided is a package structure of a semiconductor device, capable of further reducing a planar size. The semiconductor device comprises a first package | 2011-06-09 |
| 20110133297 | SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS - A semiconductor is disclosed. In one embodiment, the semiconductor includes a semiconductor substrate having an active area region, a covering configured to protect the active area region, and a carrier. An interspace is located between the carrier and the covering. The interspace is filled with an underfiller material is disclosed. | 2011-06-09 |
| 20110133298 | Spin-Transfer Switching Magnetic Element Utilizing a Composite Free Layer Comprising a Superparamagnetic Layer - A system and method for forming a magnetic tunnel junction (MTJ) storage element utilizes a composite free layer structure. The MTJ element includes a stack comprising a pinned layer, a barrier layer, and a composite free layer. The composite free layer includes a first free layer, a superparamagnetic layer and a nonmagnetic spacer layer interspersed between the first free layer and the superparamagnetic layer. A thickness of the spacer layer controls a manner of magnetic coupling between the first free layer and the superparamagnetic layer. | 2011-06-09 |
| 20110133299 | Magnetic Tunnel Junction Device - A system and method of manufacturing and using a magnetic tunnel junction device is disclosed. In a particular embodiment, a magnetic tunnel junction device includes a first free layer and second free layer. The magnetic tunnel junction also includes a spin torque enhancement layer. The magnetic tunnel junction device further includes a spacer layer between the first and second free layers that includes a material and has a thickness that substantially inhibits exchange coupling between the first and second free layers. The first and second free layers are magneto-statically coupled. | 2011-06-09 |
| 20110133300 | Bottom electrode for MRAM device - A multi-layered bottom electrode for an MTJ device on a silicon nitride substrate is described. It comprises a bilayer of alpha tantalum on ruthenium which in turn lies on a nickel chrome layer over a second tantalum layer. | 2011-06-09 |
| 20110133301 | WAFER LEVEL OPTICAL IMAGING APPARATUS - A wafer level optical imaging apparatus includes a covering substrate that covers an imaging unit. A top shading layer is formed on a top surface of the covering substrate, and a bottom shading layer is formed on a bottom surface of the covering substrate. | 2011-06-09 |
| 20110133302 | METHODS FOR FORMING INTERCONNECTS IN MICROELECTRONIC WORKPIECES AND MICROELECTRONIC WORKPIECES FORMED USING SUCH METHODS - Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods are disclosed herein. One embodiment, for example, is directed to a method of processing a microelectronic workpiece including a semiconductor substrate having a plurality of microelectronic dies. The individual dies include integrated circuitry and a terminal electrically coupled to the integrated circuitry. The method can include forming a first opening in the substrate from a back side of the substrate toward a front side and in alignment with the terminal. The first opening has a generally annular cross-sectional profile and separates an island of substrate material from the substrate. The method can also include depositing an insulating material into at least a portion of the first opening, and then removing the island of substrate material to form a second opening aligned with at least a portion of the terminal. In several embodiments, the method may include constructing an electrically conductive interconnect in at least a portion of the second opening and in electrical contact with the terminal. | 2011-06-09 |
| 20110133303 | MIM/MIS structure with praseodymium titanate or praseodymium oxide as insulator material - A semiconductor component including a first integrated circuit in a substrate which is adapted to produce electrical signals with a high-frequency signal component, wherein the substrate is such that the high-frequency signal component can propagate on a substrate surface and/or in the substrate interior, a second integrated circuit in the same substrate which is such that its function can be compromised by high-frequency signals, and a countersignal circuit in the same substrate which is adapted to deliver an electrical countersignal which at least at a selected location of the substrate surface and/or the substrate interior attenuates or eliminates the high-frequency electrical signal component emanating from the first integrated circuit, wherein the countersignal circuit includes a receiver which is adapted to produce an electrical signal dependent on the instantaneous field strength of the high-frequency signal component, and a shielding transistor provided in the substrate and having a control electrode and a first field electrode and a second field electrode, whose control electrode is connected on the input side to the receiver and whose first and second field electrodes are acted upon with a predeterminable first and second electrical potential. | 2011-06-09 |
| 20110133304 | Structure and Method for Placement, Sizing and Shaping of Dummy Structures - A chip includes a number a plurality of functional areas of a layer and a number of dummy structures within the layer. The dummy structures are spaced from the functional areas. Each dummy structure has a size that is a function of the size and density of the functional areas. | 2011-06-09 |
| 20110133305 | SEMICONDUCTOR CHIP FOR SUPPRESSING ELECTROMAGNETIC WAVE - A semiconductor chip includes: a semiconductor substrate having a plurality of electronic elements therein; a metal circuit pattern formed on the semiconductor substrate and allowing the plurality of electronic elements to be electrically connected to one another; and dummy metal patterns formed on the semiconductor substrate and the metal circuit pattern to suppress a predetermined specific frequency ranges. | 2011-06-09 |
| 20110133306 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME - Provided are a semiconductor device and a method of forming the same. According to the method, a first buried oxide layer is locally formed in a semiconductor substrate and a core semiconductor pattern of a line form, a pair of anchor-semiconductor patterns and a support-semiconductor pattern are formed by patterning a semiconductor layer on the first buried oxide layer to expose the first buried oxide layer. The pair of anchor-semiconductor patterns contact both ends of the core semiconductor pattern, respectively, and the support-semiconductor pattern contacts one sidewall of the core semiconductor pattern, the first buried oxide layer below the core semiconductor pattern is removed. At this time, a portion of the first buried oxide layer below each of the anchor-semiconductor patterns and a portion of the first buried oxide layer below the support-semiconductor pattern remain. A second buried oxide layer is formed to fill a region where the first buried oxide layer below the core semiconductor pattern. | 2011-06-09 |
| 20110133307 | DAMAGE PROPAGATION BARRIER - A conductor-filled damage propagation barrier is formed extending into a low-k dielectric layer between a fuse and an adjacent circuit element for preventing propagation of damage during a fuse blow operation. Conductor material filling the damage propagation barrier is formed from the same conductor layer as that used to form an interconnect structure. | 2011-06-09 |
| 20110133308 | SEMICONDUCTOR DEVICE WITH OXIDE DEFINE PATTERN - A semiconductor device includes a substrate; an inductor wiring pattern overlying the substrate, wherein the inductor wiring pattern is formed in an inductor-forming region; a plurality of shielding patterns between the inductor wiring pattern and the substrate within the inductor-forming region; and at least one first oxide define (OD) pattern disposed in the substrate or between the inductor wiring pattern and the substrate. | 2011-06-09 |
| 20110133309 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - The invention relates to a semiconductor device and a manufacturing method for the same, and makes the rejection rate of the product after chips are stacked and mounted sufficiently low, even when the chips are selected in a conventional, simple and inexpensive wafer test. | 2011-06-09 |
| 20110133310 | INTEGRATED CIRCUIT AND A METHOD USING INTEGRATED PROCESS STEPS TO FORM DEEP TRENCH ISOLATION STRUCTURES AND DEEP TRENCH CAPACITOR STRUCTURES FOR THE INTEGRATED CIRCUIT - Disclosed is an integrated circuit having at least one deep trench isolation structure and a deep trench capacitor. A method of forming the integrated circuit incorporates a single etch process to simultaneously form first trench(s) and a second trenches for the deep trench isolation structure(s) and a deep trench capacitor, respectively. Following formation of a buried capacitor plate adjacent to the lower portion of the second trench, the trenches are lined with a conformal insulator layer and filled with a conductive material. Thus, for the deep trench capacitor, the conformal insulator layer functions as the capacitor dielectric and the conductive material as a capacitor plate in addition to the buried capacitor plate. A shallow trench isolation (STI) structure formed in the substrate extending across the top of the first trench(es) encapsulates the conductive material therein, thereby creating the deep trench isolation structure(s). | 2011-06-09 |
| 20110133311 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The semiconductor device includes a capacitor including a plurality of interconnection layers stacked over each other, the plurality of interconnection layers each including a plurality of electrode patterns extended in a first direction, a plurality of via parts provided between the plurality of interconnection layers and electrically interconnecting the plurality of the electrode patterns between the interconnection layers adjacent to each other, and an insulating films formed between the plurality of interconnection layers and the plurality of via parts. Each of the plurality of via parts is laid out, offset from a center of the electrode pattern in a second direction intersecting the first direction, and the plurality of electrode patterns has a larger line width at parts where the via parts are connected to, and a distance between the electrode patterns and the adjacent electrode patterns is reduced at the parts. | 2011-06-09 |
| 20110133312 | POWER DEVICE - The present invention is a power device includes, a first conductive type semiconductor substrate, a second conductive type base region formed on a surface of the semiconductor substrate, a second conductive type collector region formed on a rear surface of the semiconductor substrate, a first conductive type emitter region formed on a surface of the base region, a trench gate formed via a gate insulating film in a first trench groove formed in the base region so as to penetrate the emitter region, a dent formed in the base region in proximity to the emitter region, a second conductive type contact layer formed on an inner wall of the dent, having a higher dopant density than that of the base region, a dummy trench formed via a dummy trench insulating film in a second trench groove formed at a bottom of the dent, and an emitter electrode electrically connected to the emitter region, the contact layer and the dummy trench, wherein the trench gate and the dummy trench reach the semiconductor substrate. | 2011-06-09 |
| 20110133313 | HARDMASK MATERIALS - Hardmask films having high hardness and low stress are provided. In some embodiments a film has a stress of between about −600 MPa and 600 MPa and hardness of at least about 12 GPa. In some embodiments, a hardmask film is prepared by depositing multiple sub-layers of doped or undoped silicon carbide using multiple densifying plasma post-treatments in a PECVD process chamber. In some embodiments, a hardmask film includes a high-hardness boron-containing film selected from the group consisting of Si | 2011-06-09 |
| 20110133314 | METHOD FOR PRODUCING A SEMICONDUCTOR WAFER - A method for producing a semiconductor wafer includes pulling a single crystal of semiconductor material, slicing a semiconductor wafer from the single crystal and polishing the semiconductor wafer with the polishing pad and polishing agent. The polishing agent is free of solid materials having abrasive action and the polishing pad contains fixedly bonded solid materials with abrasive action. During polishing the polishing agent is supplied in a gap between the semiconductor wafer and polishing pad. The polishing agent has a pH value in a range of 9.5 to 12.5. | 2011-06-09 |
| 20110133315 | SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION THEREOF | 2011-06-09 |
| 20110133316 | INTEGRATED CIRCUIT PACKAGE SYSTEM FOR ELECTROMAGNETIC ISOLATION AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area. | 2011-06-09 |
| 20110133317 | SEMICONDUCTOR DEVICE - A semiconductor device ( | 2011-06-09 |
| 20110133318 | SiP SUBSTRATE - Disclosed in this specification is a system-in-a-package substrate that includes an interconnect substrate for permitting finely pitched connections to be made to an integrated circuit. The interconnect substrate includes a central region on its upper surface for receiving the integrated circuit. The interconnect substrate also has interconnections that electrically connect the finely pitched contacts on the upper surface to larger pitched contacts on the lower surface. The larger pitched contacts connect to a conductive trace frame. The resulting assembly is encased in a molding compound along with a plurality of other devices which are configured to interact with one other through the conductive trace. | 2011-06-09 |
| 20110133319 | AUXILIARY LEADFRAME MEMBER FOR STABILIZING THE BOND WIRE PROCESS - A semiconductor package comprises a die attach pad and an auxiliary support member at least partially circumscribing the die attach pad. A set of contact leads is formed extending outward from the die attach pad. A first set of contact pads is formed on the bottom surface of the distal ends of the contact leads. An optional second set of contact pads is formed at the bottom surface of the proximal end. The auxiliary support member prevents damage to the contact leads and prevents the leads from bending during the manufacturing process. | 2011-06-09 |
| 20110133320 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package includes a metal plate, a power element, a lead frame having a die pad, a resin sheet having insulation properties, a control circuit that controls the power element, and a mold resin. The power element is mounted on the die pad, and the die pad is mounted on the metal plate via the resin sheet. The resin sheet is expanded including at least a lower surface of the die pad while the lower surface of the resin sheet is smaller than an surface of the metal plate, and the control circuit is arranged in a region on the metal plate, which region is other than the region where the power element is arranged. | 2011-06-09 |
| 20110133321 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A disclosed semiconductor device includes a wiring board, a semiconductor element mounted on a principal surface of the wiring board with flip chip mounting, a first conductive pattern formed on the principal surface along at least an edge portion of the semiconductor element, a second conductive pattern formed on the principal surface along the first conductive pattern and away from the first conductive pattern, a passive element bridging between the first conductive pattern and the second conductive pattern on the principal surface of the wiring board, and a resin layer filling a space between the wiring board and the semiconductor chip, wherein the resin layer extends between the semiconductor element and the first conductive pattern on the principal surface of the wiring board. | 2011-06-09 |
| 20110133322 | LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME - A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins. | 2011-06-09 |
| 20110133323 | SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP - A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding wires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires. | 2011-06-09 |
| 20110133324 | MULTI-CHIP STACKED PACKAGE AND ITS MOTHER CHIP TO SAVE INTERPOSER - A multi-chip stacked package and its mother chip to save an interposer are revealed. The mother chip is a two-layer structure consisting of a semiconductor layer and an organic layer where a redistribution layer is embedded into the organic layer with a plurality of first terminals and a plurality of second terminals disposed on the redistribution layer and exposed from the organic layer. The mother chip is flip-chip mounted on the substrate. The active surface of the daughter chip is in contact with the organic layer with the bonding pads of the daughter chip bonded to the first terminals. Furthermore, a plurality of electrically connecting components electrically connect the second terminals to the substrate. In the multi-chip stacked package, the interposer can be eliminated with a thinner overall package thickness as well as controlled package warpage. | 2011-06-09 |
| 20110133325 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad. | 2011-06-09 |
| 20110133326 | Reducing Plating Stub Reflections in a Chip Package Using Resistive Coupling - Improving signal quality in a high-frequency chip package by resistively connecting an open-ended plating stub to ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A conductive first layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A resistor is used to resistively couple the plating stub to a ground layer. | 2011-06-09 |
| 20110133327 | SEMICONDUCTOR PACKAGE OF METAL POST SOLDER-CHIP CONNECTION - A semiconductor package with MPS-C2 configuration is revealed, primarily comprising a substrate and a chip. A plurality of leads covered by a solder mask having a rectangular slot disposed on the top surface of the substrate to expose parts of the leads. A plurality of metal pillars are disposed on the active surface of the chip. A patterned plating layer is partially formed on the exposed portions of the leads located inside the slot to form a plurality of plating-defined fingers. Therefore, the soldering area of the solder on the leads can be constrained without exceeding the patterned plating layer to avoid issue of excessive solder ability. | 2011-06-09 |
| 20110133328 | SEMICONDUCTOR DEVICE HAVING HEAT RADIATING CONFIGURATION - A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes: a casing, a board and a semiconductor chip. The chip includes: an element part; a heat sink bonded to the element part; an insulting layer located on the heat sink so that the heat sink is located between the element part and the insulating layer; and a side wall insulating layer covering all of end faces of the heat sink. The semiconductor chip is located between the casing and the board, so that the insulating layer is directed to the casing to enable heat radiation from the heat sink toward the casing via the insulating layer. | 2011-06-09 |
| 20110133329 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The heat-release properties of semiconductor device are to be improved and the reliability thereof is to be improved. | 2011-06-09 |
| 20110133330 | LOW TEMPERATURE CURING COMPOSITIONS - The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal/carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100° C., for instance 55-70° C., over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry. | 2011-06-09 |
| 20110133331 | INTERFACE STRUCTURE FOR COPPER-COPPER PEELING INTEGRITY - An integrated circuit device is disclosed. An exemplary integrated circuit device includes a first copper layer, a second copper layer, and an interface between the first and second copper layers. The interface includes a flat zone interface region and an intergrowth interface region, wherein the flat zone interface region is less than or equal to 50% of the interface. | 2011-06-09 |
| 20110133332 | Package substrate and method of fabricating the same - There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°. | 2011-06-09 |
| 20110133333 | MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE VIAS, CONDUCTIVE CAPS AND VARIABLE THICKNESS INSULATING LAYERS, AND METHODS OF FABRICATING SAME - Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described. | 2011-06-09 |
| 20110133334 | Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch - A semiconductor device has a semiconductor die having a plurality of die bump pad and substrate having a plurality of conductive trace with an interconnect site. A solder mask patch is formed interstitially between the die bump pads or interconnect sites. A conductive bump material is deposited on the interconnect sites or die bump pads. The semiconductor die is mounted to the substrate so that the conductive bump material is disposed between the die bump pads and interconnect sites. The conductive bump material is reflowed without a solder mask around the die bump pad or interconnect site to form an interconnect structure between the semiconductor die and substrate. The solder mask patch confines the conductive bump material within the die bump pad or interconnect site. The interconnect structure can include a fusible portion and non-fusible portion. An encapsulant is deposited between the semiconductor die and substrate. | 2011-06-09 |
| 20110133335 | Through-Silicon Via With Air Gap - A semiconductor substrate having a through-silicon via with an air gap interposed between the through-silicon via and the semiconductor substrate is provided. An opening is formed partially through the semiconductor substrate. The opening is first lined with a liner and then the opening is filled with a conductive material. A backside of the semiconductor substrate is thinned to expose the liner, which is subsequently removed to form an air gap around the conductive material of the through-silicon via. A dielectric layer is formed of the backside of the semiconductor substrate to seal the air gap. | 2011-06-09 |
| 20110133336 | Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device - A semiconductor wafer comprising: a tubular trench formed at a position to form a through-hole electrode of a wafer; an insulating member buried inside the trench and on an upper surface of the trench; a gate electrode film and a metal film formed on an upper surface of the insulating member; a multilevel columnar wiring via formed on an upper surface of the metal film; and an external connection electrode formed electrically connected to the metal film via the multilevel columnar wiring via. In this manner, it is unnecessary to have a new process of dry etching to form a through-hole electrode after thinning the wafer and equipment development. Moreover, introduction of a specific design enables formation of through-hole electrodes with significantly reduced difficulties of respective processes. | 2011-06-09 |
| 20110133337 | AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS - Using side-wall conductor leads deposited on the side-walls of a base substrate to form package level conductor leads for active circuits manufactured on silicon substrate(s) stacked on the base substrate, the preferred embodiments of the present invention significantly reduces the areas of surface mount package chips. Besides area reduction, these methods also provide significant cost saving and reduction in parasitic impedance. | 2011-06-09 |
| 20110133338 | CONDUCTOR BUMP METHOD AND APPARATUS - Various semiconductor die conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a conductor pad of a semiconductor die. The conductor layer has a surface. A polymeric layer is formed on the surface of the conductor layer while a portion of the surface is left exposed. A solder structure is formed on the exposed portion of the surface and a portion of the polymeric layer. | 2011-06-09 |
| 20110133339 | Semiconductor Structure and Method for Making the Same - The present invention relates to a semiconductor structure and a method for making the same. The method includes the following steps: (a) providing a first wafer and a second wafer; (b) disposing the first wafer on the second wafer; (c) removing part of the first wafer, so as to form a groove; (d) forming a through via in the groove; and (e) forming at least one electrical connecting element on the first wafer. Therefore, the wafers are penetrated and electrically connected by forming only one conductive via, which leads to a simplified process and a low manufacturing cost. | 2011-06-09 |
| 20110133340 | Package substrate and semiconductor apparatus - A package substrate includes: a plurality of electrodes configured to be electrically connected to a semiconductor chip; a plurality of wiring layers configured to be stacked; and a plurality of vias configured to electrically connect a plurality of planes formed in the plurality of wiring layers. A power supply via included in the plurality of vias electrically connects a power supply plane included in the plurality of planes to a power supply electrode included in the plurality of electrodes. The power supply plane is supplied with a power supply voltage. A passing wiring layer included in the plurality of wiring layers, through which the power supply via passes, includes: grid ground planes configured to surround the power supply via. The grid ground planes are electrically connected to a ground plane included in the plurality of planes through a ground via included in the plurality of vias. The ground plane is grounded. | 2011-06-09 |
| 20110133341 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein a pad is formed on the first surface; (b) disposing the semiconductor chip on a supporting substrate such that the first surface is directed upward; (c) forming an encapsulation resin layer on the supporting substrate so as to cover the semiconductor chip; and (d) polishing the encapsulation resin layer to expose a top surface of the pad. | 2011-06-09 |
| 20110133342 | WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICONDUCTOR PACKAGE - A wiring board includes a ceramic substrate including a plurality of stacked ceramic layers, an internal wiring, and an electrode, the internal wiring being electrically connected to the electrode, the electrode being exposed from a first surface of the ceramic substrate; and a silicon substrate including a wiring layer, the wiring layer including a wiring pattern and a via-fill, the wiring pattern being formed on a main surface of the silicon substrate, an end of the via-fill being electrically connected to the wiring pattern, another end of the via-fill being exposed from a rear surface of the silicon substrate positioned opposite to the main surface, wherein the rear surface of the silicon substrate is anodically bonded to the first surface of the ceramic substrate; and the via-fill of the silicon substrate is directly connected to the electrode of the ceramic substrate. | 2011-06-09 |
| 20110133343 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device including: a semiconductor substrate having a through hole formed towards one surface side from the other surface side; an electrode pad arranged on the one surface side of the semiconductor substrate and partially exposed to the through hole; and a through electrode arranged at an inner side of the through hole and electrically connected to the electrode pad, wherein a connection portion between the electrode pad and the through electrode is arranged in a region within a plane of the electrode pad which is close to the center of the semiconductor substrate rather than to a center of the electrode pad. | 2011-06-09 |
| 20110133344 | CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WITH LOW-K DIELECTRIC-CONTAINING SEMICONDUCTOR DEVICES - This invention relates to thermosetting resin compositions useful for flip chip (“FC”) underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. | 2011-06-09 |
| 20110133345 | MANUFACTURING METHOD FOR ELECTRONIC DEVICE - There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips | 2011-06-09 |
| 20110133346 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 2011-06-09 |
| 20110133347 | METHOD AND APPARATUS OF PROVIDING OVERLAY - Provided is an apparatus that includes an overlay mark. The overlay mark includes a first portion that includes a plurality of first features. Each of the first features have a first dimension measured in a first direction and a second dimension measured in a second direction that is approximately perpendicular to the first direction. The second dimension is greater than the first dimension. The overlay mark also includes a second portion that includes a plurality of second features. Each of the second features have a third dimension measured in the first direction and a fourth dimension measured in the second direction. The fourth dimension is less than the third dimension. At least one of the second features is partially surrounded by the plurality of first features in both the first and second directions. | 2011-06-09 |
| 20110133348 | DIFFUSER FOR AERATION - Disclosed is a diffuser installation structure capable of improving uniformity of air bubbles discharged from air bubble discharge holes, restricting the formation of dead zone air bubble discharge holes, and having the tolerance against design deviation. In the installation structure for a diffuser comprising at least one air feeding port and an air bubble discharge wall having a plurality of air bubble discharge holes, the air bubble discharge wall is inclined upward in the direction of increasing distance relative to the air feeding port. | 2011-06-09 |
| 20110133349 | DEVICE AND METHOD FOR DRYING AN AIR STREAM - A device for dehumidifying an air stream includes at least one first module including at least one Peltier element and at least one second module including at least one Peltier element. The entirety of the first module forms a first zone for cooling the air stream. The entirety of the second module forms a second zone for dehumidifying the air stream. The entirety of the first and the second modules forms an air channel for the air stream. A water discharge channel is disposed below the entirety of the second module and receives water accumulating during the dehumidifying of the air stream in the second zone. At least one sensor for measuring a temperature and/or a moisture of the air stream provides at least one output signal. A control unit including at least one controller controls the Peltier elements based on the at least one output signal of the at least one sensor. | 2011-06-09 |
| 20110133350 | METHODS FOR INCREASING THE ION PERMEABILITY OF CONTACT LENSES - Described herein are methods for increasing the ion permeability of a silicone hydrogel contact lens by adding a small amount of an ion-permeability-enhancing (“IP-enhancing”) hydrophilic vinylic monomer or macromer into a lens-forming material for cast-molding silicone hydrogel contact lenses, while not altering significantly the water content and/or the oxygen permeability of resultant lenses from the lens-forming material. | 2011-06-09 |
| 20110133351 | METHODS AND APPARATUS FOR INK JET PROVIDED ENERGY RECEPTOR - This invention discloses methods and apparatus for providing a biomedical device, such as an ophthalmic lens with an energy receptor capable of powering a processing device. The energy receptor can include a conductive material deposited onto a media and placed within a mold used to form the biomedical device. In some embodiments, the conductive material is ink jetted onto the media. | 2011-06-09 |
| 20110133352 | METHOD OF MANUFACTURING LENS CASTING MOLD - The present invention relates to a method of manufacturing a lens casting mold by introducing a forming mold, with a forming surface on which a glass material being formed is positioned, into a continuous heating furnace and conducting thermal treatment while conveying the forming mold in the furnace to form an upper surface of the glass material being formed into a shape of a molding surface for forming a lens optical surface. The method of manufacturing a lens casting mold of the present invention comprises rotating the forming mold to a right and/or to a left relative to a direction of conveyance of the forming mold in a region within the continuous heating furnace where a temperature of the upper surface of the glass material being formed is equal to or greater than a glass transition temperature of the glass. | 2011-06-09 |
| 20110133353 | METHOD FOR MANUFACTURING INORGANIC SPHEROIDIZED PARTICLES - A method for producing inorganic spheroidized particles according to the present invention includes a step of producing the inorganic spheroidized particles by means of a diffusion type burner ( | 2011-06-09 |
| 20110133354 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - The present invention provides an imprint apparatus which transfers a pattern of a mold onto a resin applied on a substrate, including a structure including a mold chuck which holds the mold, a first measurement unit configured to measure a position of a reference portion of the structure, a second measurement unit configured to measure a position of the mold with respect to the reference portion, and a controller configured to control a relative positional relationship between the mold and the substrate, based on the measurement result obtained by the first measurement unit and the measurement result obtained by the second measurement unit, the second measurement unit including a head formed on the mold chuck, and measuring the position of the mold with respect to the reference portion by reading a scale formed on the mold by the head. | 2011-06-09 |
| 20110133355 | Extruder Having Dual Mixing Stages And Process For Preparing A Mixture Of Polymer And Diluent - An extruder for preparing a polymer-diluent mixture. The extruder includes an elongated housing having an inlet end, an outlet end and a bore disposed within the housing, an elongated extruder shaft having an axis of rotation, the elongated extruder shaft disposed within the bore and drivable in at least one direction of rotation, a plurality of extruder screw segments positioned along the elongated extruder shaft in a fixed angular relationship therewith, the plurality of extruder screw segments selected to form multiple extruder stages, the multiple extruder stages comprising an inlet stage, a dispersion stage, and at least one mixing stage, the plurality of extruder screw segments forming the at least one mixing stage comprising a reverse mixing screw segment having a helical flight that traverses and forms an outer periphery thereof, the helical flight having a plurality of notches positioned therealong, a material inlet adjacent the inlet end of the elongated barrel and a first fluid inlet located within the dispersion stage for introducing a diluent. A process for extruding a polymer-diluent mixture is also provided. | 2011-06-09 |
| 20110133356 | METHOD FOR MANUFACTURING MOLDED BODIES FROM SILICONE RUBBER - Silicone moldings are conditioned in a conditioning oven at a pressure less than 150 hPa, and exhaust gas from the oven is scrubbed with cold water from which an organic phase is separated. The cold water is recirculated, and the scrubbed exhaust gas may be recirculated. Emissions of volatiles by this method are sharply reduced. | 2011-06-09 |
| 20110133357 | MASONRY BLOCKS AND MASONRY BLOCK ASSEMBLIES HAVING MOLDED UTILITY OPENINGS - A masonry block molded by a masonry block machine employing a mold assembly having a plurality of liner plates, at least one of which is moveable. The masonry block includes a first transverse face, a second transverse face opposing the first transverse face, at least one aperture extending through the masonry block between the first and second transverse faces, a first end face joining the first and second transverse faces, a second end face opposite the first end face and joining the first and second transverse faces, a first major face joining the first end and second end faces, and a second major face opposing the first major face and joining the first and second end faces. A molded utility opening extends through the first major face to the at least one aperture and adapted to receive a utility device, wherein the first major face and molded utility opening are formed during a molding process by action of a moveable liner plate having a mold element which is a negative of the molded utility opening. | 2011-06-09 |
| 20110133358 | METHOD AND DEVICE FOR TREATING A SURFACE OF A FIBRE COMPOSITE MATERIAL - The present invention provides a method and a device for treating a surface of a fibre composite material which contains fibres of a specific hardness, the surface of the fibre composite material being removed abrasively by an abrasion means, the hardness of which is less than the hardness of the fibres contained in the fibre composite material and is greater than the hardness of a plastics material in which the fibres of the fibre composite material are embedded. | 2011-06-09 |
| 20110133359 | NON-TRANSPARENT MICROVOIDED AXIALLY STRETCHED FILM, PRODUCTION PROCESS THEREFOR AND PROCESS FOR OBTAINING A TRANSPARENT PATTERN THEREWITH - Disclosed is a process for preparing a non-transparent microvoided axially stretched film including i) mixing a linear polyester having monomer components consisting essentially of an aromatic dicarboxylic acid, an aliphatic diol and optionally an aliphatic dicarboxylic acid, a non-crosslinked random SAN-polymer and one or more additional ingredients to produce a mixture, ii) forming the mixture produced in step i) in a thick film followed by quenching; iii) stretching the thick film at a temperature between the glass transition temperature of the SAN-polymer and the glass transition temperature of said linear polyester to at least twice the initial length, and (iv) further stretching the film at an angle substantially 90° to the previous stretching process to at least twice the initial length and at 90° C. or below. | 2011-06-09 |
| 20110133360 | MOLDING METHOD - A molding method may include forming a pattern on a surface of a substrate, the pattern and the surface of the substrate having an opposite polarity to each other, providing the substrate on which the pattern is formed with a liquid to form a liquid mold on either the surface of the substrate or the pattern, the liquid having a polarity identical to the polarity of the surface of the substrate or the polarity of the pattern and cooling the liquid mold at a temperature below a freezing point of the liquid to form a solid mold. | 2011-06-09 |
| 20110133361 | PIPE COATING - Apparatus ( | 2011-06-09 |
| 20110133362 | MOLD RELEASE FILM FOR MANUFACTURING SEMICONDUCTOR RESIN PACKAGE AND SEMICONDUCTOR RESIN PACKAGE MANUFACTURING METHOD USING SAME - Provided are: a mold release film, which has excellent mold releasability to a semiconductor resin package and does not easily generate warpage, wrinkles and the like; and a method for obtaining a semiconductor resin package having excellent dimensional accuracy by using such mold release film. The mold release film for manufacturing a semiconductor resin package has one or more base material layers (C), a pair of outermost layers (A) which sandwich the base material layers (C) and contain a 4-methyl-1-pentene polymer as a main component, and a pair of adhesive layers (B) which adhere together the base material layers (C) and the outermost layers (A). | 2011-06-09 |
| 20110133363 | PROCESS AND APPARATUS FOR MOULDING AND CURING TYRES - A process for moulding and curing tyres, includes introducing a green tyre into a curing mould, the mould including a first sidewall plate and a second sidewall plate, a ring of circumferential sectors circumscribing a mould cavity, an expandable bladder delimited by a membrane, and at least one bead moulding ring which is movable between a first contracted operating position and a second extended operating position; and moulding and curing the green tyre in the curing mould; and between introducing the green tyre and moulding and curing it, the process includes extending the at least one bead moulding ring from the first contracted operating position to the second extended operating position; forming a circumferential bearing surface which bears against a first axially inner surface portion of a first annular fixing structure of the green tyre; pressing a second axially inner surface portion of the first annular fixing structure by expanding the membrane at a pre-moulding pressure which is lower than a moulding pressure, so as to bring the first annular fixing structure into contact with the first sidewall plate thus shaping an axially outer surface portion of the first annular fixing structure by means of the first sidewall plate and shaping the first axially inner surface portion of the first annular fixing structure by means of the circumferential surface of the at least one bead moulding ring. | 2011-06-09 |
| 20110133364 | Method for Manufacturing Micro-Channel, Die for Molding Micro-Channel Chip, and Micro-Channel Chip | 2011-06-09 |
| 20110133365 | Film substrate processing method and film substrate processing aparatus - A method of processing a film substrate includes removing a portion of the film substrate; and fusing a part of the film substrate around the removed portion to seal scraps of the film substrate, which are generated when removing the portion of the film substrate, in the fused part of the film substrate. | 2011-06-09 |
| 20110133366 | INJECTION MOLDING PROCESS, APPARATUS AND MATERIAL FOR FORMING CURED-IN-PLACE GASKETS - The present disclosure relates to liquid injection molding of gaskets. More particularly, the present disclosure relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding and to equipment useful with this process. | 2011-06-09 |
| 20110133367 | Device and Method for a Layerwise Manufacturing of a Three-Dimensional Object from a Building Material in Powder Form - A method is provided, by which a three-dimensional object is manufactured by a subsequent solidification of layers of a building material in powder form at the positions in the respective layer that corresponds to the cross-section of the object by means of the action of a laser or another energy source, | 2011-06-09 |
| 20110133368 | HIGH DENSITY FIBROUS POLYMERS SUITABLE FOR IMPLANT - This invention includes malleable, biodegradable, fibrous compositions for application to a tissue site in order to promote or facilitate new tissue growth. One aspect of this invention is a fibrous component that provides unique mechanical and physical properties. The invention may be created by providing a vessel containing a slurry, said slurry comprising a plurality of natural or synthetic polymer fibers and at least one suspension fluid, wherein the polymer fibers are substantially evenly dispersed and randomly oriented throughout the volume of the suspension fluid; applying a force, e.g., centrifugal, to said vessel containing said slurry, whereupon said force serves to cause said polymer fibers to migrate through the suspension fluid and amass at a furthest extent of the vessel, forming a polymer material, with said polymer material comprising polymer fibers of sufficient length and sufficiently viscous, interlaced, or interlocked to retard dissociation of said polymer fibers. | 2011-06-09 |
| 20110133369 | APPARATUS FOR SHAPING PLASTIC PREFORMS, COMPRISING A STERILE CHAMBER - An apparatus ( | 2011-06-09 |
| 20110133370 | DEVICE AND METHOD FOR STERILISING PLASTIC PARISONS - A device for producing plastic containers may include a heating element for heating plastic parisons, a transport system for transporting the plastic parisons along a pre-defined transport path, and a shaping element arranged along the transport path, downstream of the heating device. The shaping element shapes the plastic parisons to form plastic containers. The device has a sterilisation element that applies a free-flowing medium to a wall of the plastic parisons in order to sterilise said wall, the sterilisation device being arranged along the transport path of the containers such that the sterilisation takes place after the heating process applied to the containers in the heating device and before the end of the shaping process in the shaping element. | 2011-06-09 |
| 20110133371 | ANTIOXIDANT STABILIZED CROSSLINKED ULTRA-HIGH MOLECULAR WEIGHT POLYETHYLENE FOR MEDICAL DEVICE APPLICATIONS - An antioxidant combined with UHMWPE prior to subjecting the UHMWPE to crosslinking irradiation. In one exemplary embodiment, the antioxidant is tocopherol. After the antioxidant is combined with the UHMWPE, the resulting blend may be formed into slabs, bar stock, and/or incorporated into a substrate, such as a metal, for example. The resulting product may then be subjected to crosslinking irradiation. In one exemplary embodiment, the UHMWPE blend is preheated prior to subjecting the same to crosslinking irradiation. Once irradiated, the UHMWPE blended product may be machined, packaged, and sterilized in accordance with conventional techniques. | 2011-06-09 |
| 20110133372 | SELECTIVE SOLDERING APPARATUS AND A METHOD OF PUMPING SOLDER IN A SELECTIVE SOLDERING APPARATUS - An impeller type pump ( | 2011-06-09 |
| 20110133373 | APPARATUS FOR REMOVAL AND REPLACEMENT OF A HINGED LID ON A METALLURGICAL TRANSPORT VESSEL - An apparatus for the removal and replacement of a lid on a metallurgical transport vessel such as a ladle or a torpedo car. The apparatus comprises a frame, means for supporting the frame such that the vessel may be moved into position thereunder, a linkage including at least one lifting member pivotally connected to the frame, and at least one actuator connected to the linkage. The actuator is operable to move the lifting member such that when the vessel is moved to a designated position below the apparatus, the lifting member can be moved by the actuator and linkage from a first position providing clearance above the vessel, through a curved path to an intermediate position where it engages the lid, providing a vertical lifting force and a horizontal hinge releasing force to the lid, and to a second position where the lid is raised to a sufficient height to clear the vessel. The lifting member may subsequently be moved back by means of the actuator and linkage through a reverse curved path to the first position, and thereby lower the lid back on to the vessel. | 2011-06-09 |
| 20110133374 | SYSTEMS AND METHODS FOR MELTING SCRAP METAL - A scrap submergence vessel for melting scrap metal is disclosed. The vessel comprises a front wall comprising an inlet, a back wall (opposite the front wall) comprising an outlet, and a flow direction member that causes molten metal flowing into the inlet to be directed at least partially upward against a portion of the back wall. The movement of molten metal through the vessel creates a downward pull that draws metal scrap placed above or within the vessel downward into the molten metal bath where it melts. | 2011-06-09 |
| 20110133375 | ENGINE MOUNT OF VEHICLE - An engine mount of a vehicle may include a main rubber body defining a main liquid chamber, wherein a fastening bolt for assembling a vehicle engine is coupled to the main rubber body, an inner case supporting the main rubber body, and a housing enclosing the main rubber and the inner case, wherein at least a protrusion is formed on an outer circumference of the inner case, and wherein at least a groove is formed in the housing and the at least a protrusion of the inner case is coupled to the corresponding at least a groove of the housing. | 2011-06-09 |
| 20110133376 | INJECTION MOULDING SOFT ELASTOMERS - A fabric web is led between mould parts which are subsequently closed. A liquid elastomer is injected into the mould for forming a soft elastomeric product bonded to the fabric web. As the mould is opened ejector pins on one mould part clamp the web against the other mould part for stripping the soft elastomeric product from the mould. After disengagement of the ejector pins the web is advanced to discharge the soft elastomeric product from the mould. | 2011-06-09 |
| 20110133377 | Plate spring - The invention relates to mechanical engineering, in particular to spring elements for compliant foil hydrodynamic bearings used in small-size high speed machines. The inventive spring is cut out from a single sheet and comprises a plurality of elementary arc-shaped springs ( | 2011-06-09 |
| 20110133378 | HELICOPTER LANDING GEAR DAMPER - A damper for a landing gear of a helicopter having a barrel, a piston defining a first hydraulic cavity between the piston and a bottom end of the barrel and a second hydraulic cavity between the piston and a top of the barrel, a stack of disc springs disposed within the first hydraulic cavity in a compressed state between the bottom end of the barrel and the piston. Each of the disc springs having a substantially concave side and an opposing substantially convex side, the disc springs stacked in an alternating pattern such that any two adjacent washers have their like sides positioned adjacent to each other. A spring disposed within the second hydraulic cavity such that the spring is compressed between the compression member and the top of the barrel when the piston is in an extended position. A hydraulic fluid is disposed inside at least a portion of the first hydraulic cavity and at least a portion of the second hydraulic cavity. At least one valve is disposed in the piston so as to establish fluid communication between the first hydraulic cavity and the second hydraulic cavity so as to allow bilateral fluid communication between the first hydraulic cavity and the second hydraulic cavity. | 2011-06-09 |
| 20110133379 | Suspension Bump Stop and Strut Device - The suspension bump stop device comprises a rolling bearing ( | 2011-06-09 |
| 20110133380 | MICRO CELLULAR URETHANE (MCU) PROGRESSIVE RATE BUMP STOP/SPRING AID - The present invention provides an improved Micro Cellular Urethane (hereinafter ‘MCU’) bump stop/spring aid having a plurality of struts adapted to level the rate transition as sections are folded onto one another. MCU bump stops/spring aids are well known in the art to assist vehicle suspension systems. More particularly, bump stops/spring aids are frequently used with vehicle suspension systems in connection with shocks and strut assemblies. These assemblies provide a comfortable ride in addition to influencing the control and handling of the vehicle. The struts are positioned around the circumference of the MCU bump stop/spring aid. The added struts between the undercuts partially support the outer surfaces of the MCU bump stop/spring aid. Struts are generally molded between the outer surfaces. Struts may also be molded on an inner surface. The plurality of struts improves upon existing technology by improving performance characteristics. | 2011-06-09 |
| 20110133381 | CLAMP DEVICE - A clamp device has a grip member for gripping the inner peripheral surface of a hole in a workpiece, a clamp rod having a tapered shaft portion that is fitted into and engaged with the grip member, a hydraulic cylinder for driving the grip member and the clamp rod forwards and backwards in the axial direction, and a main body member to which the above elements are mounted. A tubular cylindrical main body portion projecting upwards is provided at the center portion of an upper half portion of the main body member. The outer diameter of this tubular main body portion is set less than or equal to three times the outer diameter of the grip member in the unclamped state, and, in the unclamped state, the upper half portions of the grip member and the tapered shaft portion are made to project outward from the upper end of the tubular main body portion. | 2011-06-09 |
| 20110133382 | WAVE TYPE LINEAR MOTION MECHANISM AND HOLDING MECHANISM - In a wave linear motion mechanism ( | 2011-06-09 |
| 20110133383 | Leverage Based Cutting Board Systems - A leverage based cutting board system having a rotatable tower and sliding knife holster is disclosed. Control of the height of the sliding knife holster and unique locking system facilitates cutting of foodstuffs of a variety of shapes and consistencies. The system further provides an advantage of using any traditional knife. It allows rapid switching between traditional cutting and leverage cutting. The system decreases the total scale of force required to cut foodstuffs and constrains the number of untoward knife motions. The tower with its unique property of rotating 180 degree makes it apt to use both the surfaces in a single preparation. The unique texture of the board helps it to grip slippery food items. The sleek and compact design helps keeping the tower intact as it lies horizontally adjacent to the board when not in use. | 2011-06-09 |
| 20110133384 | Sheet Transporting Device, Cutting Device, Printing Press and corresponding Method - The sheet transporting device of the invention includes: a transferring device ( | 2011-06-09 |
| 20110133385 | BUFFERING APPARATUS FOR COLLATIONS - A document handling apparatus includes a document transport buffering apparatus including drive belts and aligner belts. Each of the drive belts has a general continuous loop shape. The aligner belts are intermixed with the drive belts. Each of the aligner belts has a general continuous loop shape and a projection extending in a general cantilever fashion from the aligner belt. A first drive system is adapted to rotate the drive belts. A second drive system is adapted to rotate the aligner belts individually. The first and second drive systems are adapted to rotate the drive belts and the aligner belts such that a plurality of spaced stacks of documents are transported by the drive belts with one of the projections at a leading edge of each of the stacks and another one of the projections at a trailing edge of each of the stacks. | 2011-06-09 |
| 20110133386 | SHEET CONVEYING SYSTEM, CONTROL METHOD THEREFOR, CONTROL PROGRAM FOR IMPLEMENTING THE METHOD, AND STORAGE MEDIUM STORING THE PROGRAM - A sheet conveying system which is capable of preventing a jammed sheet from being mixed with processed sheets, reducing waste in sheets and toners, and further alleviating the user's operations, when jamming has occurred during passing of a sheet between respective sheet conveying devices of upstream and downstream apparatuses. A puncher control section of a puncher as an upstream apparatus of the system issues a passing completion notification as to the passing of a sheet to a staple stacker control section of a staple stacker as a downstream apparatus of the system. Upon reception of the notification, when the staple stacker control section determines that the parameter of auxiliary information of the notification indicates an abnormal discharge of the sheet from the puncher, the staple stacker stops the conveyance of the sheet. | 2011-06-09 |
| 20110133387 | SHEET PROCESSING APPARATUS AND METHOD OF ADJUSTING A VERTICAL POSITION OF A SHEET INPUT OF A SHEET PROCESSING APPARATUS - A sheet processing apparatus and method of adjusting a vertical position of a sheet input of a sheet processing apparatus includes a support of the apparatus having first vertically elongated guiding members and second vertically elongated guiding members. The second guiding members are slideably arranged at the first guiding members. The first guiding members are connected to at least one base member, and the second guiding members are connected to a support frame. A vertical position of at least one of the second guide members is adjustable relative to a corresponding one of the first guide members in order to adjust a vertical position of the sheet input. | 2011-06-09 |
| 20110133388 | MEDIUM CONVEYANCE MECHANISM (DEVICE) - Aligning of banknotes is carried out without using an aligning device. A medium conveyance mechanism includes an upper belt ( | 2011-06-09 |
| 20110133389 | MEDIA PROCESSOR - A media processor is provided with includes a conveyance channel over which a paper sheet-like medium is conveyed, and an accumulation mechanism which accumulates the medium sent from the conveyance channel, the accumulation mechanism including a guide member for guiding and accumulating the medium sent from the conveyance channel and a conveyor for catching the medium guided by the guide member against the guide member to draw the medium onto the guide member. It is thus possible to shorten times required for the preparing operation to accumulate bills and for the bill accumulating operation, and further to prevent mechanical malfunction such as bill jamming from occurring. | 2011-06-09 |
| 20110133390 | Sheet conveying device and image forming apparatus incorporating same - A sheet conveying device includes a controller having a processing unit to cause a first detector to detect an uppermost sheet, an elevator to lift and stop a sheet stack at a reference position, and a second detector to detect and store the position. In a primary operation of the controller, the uppermost sheet is attracted and conveyed for a given number of times while the second detector contacting it, a variation amount of angle is calculated and converted to a thickness of M sheets. With a driven contact roller retracted in a secondary operation, the sheet stack is lifted each time the uppermost sheets by a thickness of N sheets are attracted and conveyed based on the stored thickness of M sheets under N=XM (“M” represents a positive number, “N” represents a positive integer, and “X” represents a positive number of 1 or greater). | 2011-06-09 |
| 20110133391 | PAPER FEEDING APPARATUS, IMAGE FORMING APPARATUS AND PAPER FEEDING METHOD - A paper feeding apparatus which can certainly detect the position of a pickup roller, and an image forming apparatus including the paper feeding apparatus are provided. The paper feeding apparatus feeds a sheet stacked on a paper feed cassette by the pickup roller, and includes a sensor and the pickup roller rotatably supported by a support shaft and including a detection object part in which a first detection object part having a first length in a movement direction of movement around the support shaft and detected as a first detection state by the sensor, a second detection object part having a second length different from the first length in the movement direction and detected as the first detection state by the sensor, and a third detection object part formed between the first detection object part and the second detection object part and detected as a second detection state different from the first detection state by the sensor are arranged in the movement direction. | 2011-06-09 |
| 20110133392 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS INCLUDING SAME - A sheet processing apparatus capable of improving sheet processing performance and productivity is provided. While sheets are conveyed in a piled state toward a rear-end stopper, displacement is produced between the sheets by a pair of discharge rollers. Even if adhesion occurs between the sheets during conveyance thereof, the adhesion between the sheets can be removed before the sheets come into contact with the rear-end stopper. | 2011-06-09 |
| 20110133393 | SHEET MATERIAL FEEDING APPARATUS AND IMAGE FORMING APPARATUS - The sheet material feeding apparatus according to this invention comprises a sheet material stacking unit selectively located at a feeding position for feeding a sheet material and at a standby position for non-feeding a sheet material; a first holding force applying unit configured to apply a first holding force and a second holding force applying unit configured to apply a second holding force for holding the guide member to the sheet material stacking unit; and a restraining unit configured to restrain the second holding force applying unit from applying the second holding force when the sheet material stacking unit is in the standby position. | 2011-06-09 |
| 20110133394 | FEEDING DEVICE - A feeding device includes a tray for stacking sheet-like conveyance-target media, a first pressing unit, and a second pressing unit. The first and second pressing units face and apply a first and second pressing force, respectively, on a circumferential surface of a pick roller so that a first contact area and a second contact area overlap each other. The first pressing unit includes a first pressing unit separation roller, and the first contact area is defined wherein the first pressing unit and the pick roller make contact with each other. The second contact area is defined wherein the second pressing unit and the pick roller make contact with each other such that the first contact area and the second contact appear to partly overlap each other when viewed from an axial direction of the pick roller. | 2011-06-09 |
