23rd week of 2019 patent applcation highlights part 61 |
Patent application number | Title | Published |
20190172771 | LDMOS Transistor | 2019-06-06 |
20190172772 | POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD | 2019-06-06 |
20190172773 | SEMICONDUCTOR APPARATUS | 2019-06-06 |
20190172774 | RECESSED LEAD LEADFRAME PACKAGES | 2019-06-06 |
20190172775 | FLEXIBLE SUBSTRATE AND ELECTRONIC DEVICE | 2019-06-06 |
20190172776 | Method Of Making A Wire Support Leadframe For A Semiconductor Device | 2019-06-06 |
20190172777 | LEAD-FRAME STRUCTURE, LEAD-FRAME, SURFACE MOUNT ELECTRONIC DEVICE AND METHODS OF PRODUCING SAME | 2019-06-06 |
20190172778 | HIGH DENSITY PACKAGE INTERCONNECTS | 2019-06-06 |
20190172779 | Semiconductor Chip Comprising a Multiplicity of External Contacts, Chip Arrangement and Method for Checking an Alignment of a Position of a Semiconductor Chip | 2019-06-06 |
20190172780 | THROUGH-HOLE ELECTRODE SUBSTRATE | 2019-06-06 |
20190172781 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-06-06 |
20190172782 | PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD | 2019-06-06 |
20190172783 | CAPACITANCE REDUCTION IN SEA OF LINES BEOL METALLIZATION | 2019-06-06 |
20190172784 | MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR PACKAGE INTERCONNECT | 2019-06-06 |
20190172785 | Integrated Circuit Comprising an Antifuse Structure and Method of Realizing | 2019-06-06 |
20190172786 | STACK OF LAYERS FOR PROTECTING AGAINST A PREMATURE BREAKDOWN OF INTERLINE POROUS DIELECTRICS WITHIN AN INTEGRATED CIRCUIT | 2019-06-06 |
20190172787 | HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE | 2019-06-06 |
20190172788 | SEMICONDUCTOR MODULE | 2019-06-06 |
20190172789 | SOI WAFERS WITH BURIED DIELECTRIC LAYERS TO PREVENT CU DIFFUSION | 2019-06-06 |
20190172790 | DISPLAY DEVICE | 2019-06-06 |
20190172791 | ELECTRONIC CIRCUIT PACKAGE USING CONDUCTIVE SEALING MATERIAL | 2019-06-06 |
20190172792 | SEMICONDUCTOR PACKAGES | 2019-06-06 |
20190172793 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-06-06 |
20190172794 | SEMICONDUCTOR DEVICE | 2019-06-06 |
20190172795 | CRACK SENSOR FOR SENSING CRACKS IN A SOLDER PAD, AND METHOD FOR PRODUCTION QUALITY CONTROL | 2019-06-06 |
20190172796 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2019-06-06 |
20190172797 | DISPLAY SUBSTRATE, METHOD OF MANUFACTURING DISPLAY SUBSTRATE, AND DISPLAY DEVICE | 2019-06-06 |
20190172798 | INTEGRATED CIRCUIT SECURITY | 2019-06-06 |
20190172799 | DEVICE AND METHOD FOR GENERATING IDENTIFICATION KEY | 2019-06-06 |
20190172800 | SENSOR AND HEATER FOR STIMULUS-INITIATED FRACTURE OF A SUBSTRATE | 2019-06-06 |
20190172801 | DEVICE AND METHOD FOR GENERATING IDENTIFICATION KEY | 2019-06-06 |
20190172802 | FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION THEREOF | 2019-06-06 |
20190172803 | FAN-OUT ANTENNA PACKAGING STRUCTURE AND METHOD MAKING THE SAME | 2019-06-06 |
20190172804 | Integrated Passive Device for RF Power Amplifier Package | 2019-06-06 |
20190172805 | CHIP PACKAGES AND METHODS FOR FORMING THE SAME | 2019-06-06 |
20190172806 | SEMICONDUCTOR ELEMENT | 2019-06-06 |
20190172807 | SEMICONDUCTOR APPARATUS | 2019-06-06 |
20190172808 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | 2019-06-06 |
20190172809 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-06-06 |
20190172810 | JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL | 2019-06-06 |
20190172811 | Line-integrated switch and method for producing a line-integrated switch | 2019-06-06 |
20190172812 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-06-06 |
20190172813 | SUBSTRATE JOINING METHOD | 2019-06-06 |
20190172814 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING SIDE MOLDING | 2019-06-06 |
20190172815 | Package-in-Package Structure for Semiconductor Devices and Methods of Manufacture | 2019-06-06 |
20190172816 | SEMICONDUCTOR PACKAGE INCLUDING HEAT SINK | 2019-06-06 |
20190172817 | APPARATUSES AND METHODS FOR SEMICONDUCTOR DIE HEAT DISSIPATION | 2019-06-06 |
20190172818 | METHOD OF FORMING PACKAGE STRUCTURE | 2019-06-06 |
20190172819 | LIGHT EMITTING DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-06 |
20190172820 | DATA STORAGE SYSTEM USING WAFER-LEVEL PACKAGING | 2019-06-06 |
20190172821 | IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE | 2019-06-06 |
20190172822 | LOGIC LAYOUT WITH REDUCED AREA AND METHOD OF MAKING THE SAME | 2019-06-06 |
20190172823 | PLACEMENT METHODOLOGY TO REMOVE FILLER | 2019-06-06 |
20190172824 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-06 |
20190172825 | Strapping Structure of Memory Circuit | 2019-06-06 |
20190172826 | A 3D SEMICONDUCTOR WAFER, DEVICES, AND STRUCTURE | 2019-06-06 |
20190172827 | EPITAXIAL OXIDE FIN SEGMENTS TO PREVENT STRAINED SEMICONDUCTOR FIN END RELAXATION | 2019-06-06 |
20190172828 | SEMICONDUCTOR APPARATUS HAVING STACKED GATES AND METHOD OF MANUFACTURE THEREOF | 2019-06-06 |
20190172829 | SEMICONDUCTOR DEVICE FOR TESTING CHARACTERISTICS OF TRANSISTORS AND METHOD FOR TESTING SEMICONDUCTOR DEVICE | 2019-06-06 |
20190172830 | Techniques for Enhancing Vertical Gate-All-Around FET Performance | 2019-06-06 |
20190172831 | LAYOUT OF SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | 2019-06-06 |
20190172832 | FINFET SRAM LAYOUT AND METHOD OF MAKING THE SAME | 2019-06-06 |
20190172833 | Integrated Circuitry And 3D Memory | 2019-06-06 |
20190172834 | SINGLE POLY NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME AND SINGLE POLY NON-VOLATILE MEMORY DEVICE ARRAY | 2019-06-06 |
20190172835 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-06-06 |
20190172836 | STORAGE DEVICE | 2019-06-06 |
20190172837 | SEMICONDUCTOR DEVICE | 2019-06-06 |
20190172838 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES | 2019-06-06 |
20190172839 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-06-06 |
20190172840 | SEMICONDUCTOR DEVICE | 2019-06-06 |
20190172841 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2019-06-06 |
20190172842 | TRANSISTOR FINGER SPACING AND DIMENSION VARIATION IN ELECTRONIC DEVICES | 2019-06-06 |
20190172843 | ACTIVE MATRIX SUBSTRATE, AND LIQUID CRYSTAL DISPLAY DEVICE PROVIDED WITH ACTIVE MATRIX SUBSTRATE | 2019-06-06 |
20190172844 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | 2019-06-06 |
20190172845 | Array Structure, Manufacturing Method Thereof, Array Substrate and Display Device | 2019-06-06 |
20190172846 | METHOD OF FORMING AN INTEGRATED CIRCUIT (IC) WITH SHALLOW TRENCH ISOLATION (STI) REGIONS AND THE RESULTING IC STRUCTURE | 2019-06-06 |
20190172847 | DISPLAY DEVICE | 2019-06-06 |
20190172848 | THIN-FILM TRANSISTOR SUBSTRATE | 2019-06-06 |
20190172849 | DISPLAY DEVICE INCLUDING TRANSISTOR AND MANUFACTURING METHOD THEREOF | 2019-06-06 |
20190172850 | OLED ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND OLED DISPLAY DEVICE | 2019-06-06 |
20190172851 | LIQUID CRYSTAL DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | 2019-06-06 |
20190172852 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | 2019-06-06 |
20190172853 | Display device | 2019-06-06 |
20190172854 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE | 2019-06-06 |
20190172855 | DISPLAY APPARATUS | 2019-06-06 |
20190172856 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL AND DISPLAY APPARATUS | 2019-06-06 |
20190172857 | IMAGE SENSOR INCLUDING DUAL ISOLATION AND METHOD OF MAKING THE SAME | 2019-06-06 |
20190172858 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS | 2019-06-06 |
20190172859 | DISPLAY DEVICE WITH SEPARATION MEMBER INCLUDING STEPS | 2019-06-06 |
20190172860 | ELECTROMAGNETIC RADIATION DETECTOR COMPRISING CHARGE TRANSPORT ACROSS A BONDED INTERFACE | 2019-06-06 |
20190172861 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | 2019-06-06 |
20190172862 | IMAGE SENSOR PACKAGE AND IMAGE SENSING MODULE | 2019-06-06 |
20190172863 | IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS | 2019-06-06 |
20190172864 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | 2019-06-06 |
20190172865 | METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME | 2019-06-06 |
20190172866 | DUAL-DEVICE PHOTOSENSITIVE DETECTION UNIT BASED ON COMPOSITE DIELECTRIC GATE, DETECTOR AND METHOD THEREOF | 2019-06-06 |
20190172867 | IMAGING DEVICE AND IMAGING UNIT | 2019-06-06 |
20190172868 | MULTI-PHOTODIODE PIXEL CELL | 2019-06-06 |
20190172869 | SOLID-STATE IMAGING APPARATUS, AND ELECTRONIC APPARATUS | 2019-06-06 |
20190172870 | IMAGE SENSOR | 2019-06-06 |