| 23rd week of 2013 patent applcation highlights part 15 |
| Patent application number | Title | Published |
|---|
| 20130140690 | TSV Structures and Methods for Forming the Same - A device includes a substrate having a front side and a backside, a through-via extending from the backside to the front side of the substrate, and a conductive pad on the backside of the substrate and over the through-via. The conductive pad has a substantially planar top surface. A conductive bump has a non-planar top surface over the substantially planar top surface and aligned to the through-via. The conductive bump and the conductive pad are formed of a same material. No interface is formed between the conductive bump and the conductive pad. | 2013-06-06 |
| 20130140691 | Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration - A semiconductor device has a semiconductor wafer with a first conductive layer formed over a surface of the semiconductor wafer. A first insulating layer is formed over the surface of the semiconductor wafer and first conductive layer. A second conductive layer is formed over the first insulating layer and first conductive layer. A second insulating layer is formed over the first insulating layer and second conductive layer. A plurality of openings is formed in the second insulating layer in a bump formation area of the semiconductor wafer to expose the second conductive layer and reduce adverse effects of electro-migration. The openings are separated by portions of the second insulating layer. A UBM layer is formed over the openings in the second insulating layer in the bump formation area electrically connected to the second conductive layer. A bump is formed over the UBM layer. | 2013-06-06 |
| 20130140692 | WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE - A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer. | 2013-06-06 |
| 20130140693 | METHOD FOR FORMING AN INTEGRATED CIRCUIT - A method for forming an integrated circuit including the steps of: a) forming openings in a front surface of a first semiconductor wafer, the depth of the openings being smaller than 10 μm, and filling them with a conductive material; b) forming doped areas of components in active areas of the front surface, forming interconnection levels on the front surface and leveling the surface supporting the interconnection levels; c) covering with an insulating layer a front surface of a second semiconductor wafer, and leveling the surface coated with an insulator; d) applying the front surface of the second wafer coated with insulator on the front surface of the first wafer supporting interconnection levels, to obtain a bonding between the two wafers; e) forming vias from the rear surface of the second wafer, to reach the interconnection levels of the first wafer; and f) thinning the first wafer to reach the openings filled with conductive material. | 2013-06-06 |
| 20130140694 | FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION - A flip chip package includes a substrate having a die attach surface; and a die mounted on the die attach surface with an active surface of the die facing the substrate, wherein the die is interconnected to the substrate via a plurality of copper pillar bumps on the active surface, wherein at least one of the plurality of copper pillar bumps has a bump width that is substantially equal to or smaller than a line width of a trace on the die attach surface of the substrate. | 2013-06-06 |
| 20130140695 | SOLDER BUMP CONNECTIONS - Solder bump connections and methods for fabricating solder bump connections. The method includes forming a layer stack containing first and second conductive layers, forming a dielectric passivation layer on a top surface of the second conductive layer, and forming a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer. The method further includes forming a conductive plug in the via opening. The solder bump connection includes first and second conductive layers comprised of different conductors, a dielectric passivation layer on a top surface of the second conductive layer, a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer, and a conductive plug in the via opening. | 2013-06-06 |
| 20130140696 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first substrate; a plurality of first electrodes formed on the first substrate; and a first insulating film formed on sidewalls of the plurality of first electrodes. The first insulating film is formed not to fill spaces between the plurality of first electrodes. | 2013-06-06 |
| 20130140697 | Electrode Connecting Structures Containing Copper - Provided are electrode-connecting structures or semiconductor devices, including a lower device including a lower substrate, a lower insulating layer formed on the lower substrate, and a lower electrode structure formed in the lower insulating layer, wherein the lower electrode structure includes a lower electrode barrier layer and a lower metal electrode formed on the lower electrode barrier layer, and an upper device including an upper substrate, an upper insulating layer formed under the upper substrate, and an upper electrode structure formed in the upper insulating layer, wherein the upper electrode structure includes an upper electrode barrier layer extending from the inside of the upper insulating layer under a bottom surface thereof and an upper metal electrode formed on the upper electrode barrier layer. The lower metal electrode is in direct contact with the upper metal electrode. | 2013-06-06 |
| 20130140698 | Doped Tantalum Nitride for Copper Barrier Applications - Described are doped TaN films, as well as methods for providing the doped TaN films. Doping TaN films with Ru, Cu, Co, Mn, Al, Mg, Cr, Nb, Ti and/or V allows for enhanced copper barrier properties of the TaN films. Also described are methods of providing films with a first layer comprising doped TaN and a second layer comprising one or more of Ru and Co, with optional doping of the second layer. | 2013-06-06 |
| 20130140699 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE - A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto. | 2013-06-06 |
| 20130140700 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - Provided is a method of manufacturing a TSV structure, which prevents a substrate from warping even if it is made thin. A method of manufacturing a semiconductor device comprises integrating semiconductor elements on a surface of a semiconductor substrate to form at least a part of a circuit, forming holes from the surface of the semiconductor substrate, forming an insulating film and a barrier film on an inner surface of each hole, forming a conductive metal on a surface of the barrier film to fill each hole, processing a back surface of the semiconductor substrate to reduce the thickness thereof to thereby protrude the conductive metal, and providing a SiCN film on the back surface of the semiconductor substrate. | 2013-06-06 |
| 20130140701 | Solderable Contact and Passivation for Semiconductor Dies - A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites. | 2013-06-06 |
| 20130140702 | FASTENING DEVICE - A fastening device is provided that includes a semiconductor body with an integrated circuit, and a dielectric passivation layer formed on the surface of the semiconductor body, and a trace formed underneath the passivation layer, and an oxide layer formed beneath the trace, and a connecting component that forms a frictional connection between a component formed above the passivation layer and the semiconductor body, wherein a formation passing through the passivation layer and the oxide layer and having a bottom surface is formed, and a conductive layer is formed on the bottom surface and the connecting component forms an electrical connection between the conductive layer and the component. | 2013-06-06 |
| 20130140703 | CONTACT STRUCTURE IN A MEMORY DEVICE - Annular, linear, and point contact structures are described which exhibit a greatly reduced susceptibility to process deviations caused by lithographic and deposition variations than does a conventional circular contact plug. In one embodiment, a standard conductive material such as carbon or titanium nitride is used to form the contact. In an alternative embodiment, a memory material itself is used to form the contact. These contact structures may be made by various processes, including chemical mechanical planarization and facet etching. | 2013-06-06 |
| 20130140704 | Low Frequency CMUT with Thick Oxide - A capacitive micromachined ultrasonic transducer (CMUT), which has a conductive structure that can vibrate over a cavity, utilizes a thick oxide layer to substantially increase the volume of the cavity which, in turn, allows the CMUT to receive and transmit low frequency ultrasonic waves. In addition, the CMUT can include a back side bond pad structure that eliminates the need for and cost of one patterned photoresist layer. | 2013-06-06 |
| 20130140705 | Circuit connector apparatus and method therefor - Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces. | 2013-06-06 |
| 20130140706 | UBM Structures for Wafer Level Chip Scale Packaging - A wafer level chip scale semiconductor device comprises a semiconductor die, a first under bump metal structure and a second under bump metal structure. The first under bump metal structure having a first enclosure is formed on a corner region or an edge region of the semiconductor die. A second under bump metal structure having a second enclosure is formed on an inner region of the semiconductor die. The first enclosure is greater than the second enclosure. | 2013-06-06 |
| 20130140707 | SEMICONDUCTOR DEVICE AND LAYOUT DESIGN METHOD FOR THE SAME - A semiconductor device includes: a plurality of line features including at least one real feature which includes a gate electrode portion, and at least one dummy feature. Two of multiple ones of the dummy feature, and at least one of the line features interposed between the two dummy features and including the at least one real feature form parallel running line features which are evenly spaced. The parallel running line features have an identical width, and line end portions of the parallel running line features are substantially flush. Line end portion uniformization dummy features are formed on extensions of the line end portions of the parallel running line features. The line end portion uniformization dummy features include a plurality of linear features each having a same width as each of the line features and spaced at intervals equal to an interval between each adjacent pair of the line features. | 2013-06-06 |
| 20130140708 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor device includes the following steps. A semiconductor substrate having a first side and a second side facing to the first side is provided. At least an opening is disposed in the semiconductor substrate of a protection region defined in the first side. A first material layer is formed on the first side and the second side, and the first material layer partially fills the opening. Subsequently, a part of the first material layer on the first side and outside the protection region is removed. A second material layer is formed on the first side and the second side, and the second material layer fills the opening. Then, a part of the second material layer on the first side and outside the protection region is removed. Finally, the remaining first material layer and the remaining second material layer on the first side are planarized. | 2013-06-06 |
| 20130140709 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - To provide a technique adopting a TSV technique, capable of improving manufacturing yield and reliability of semiconductor devices. By partitioning a connection pad-forming region into a plurality of regions and by forming, respectively, connection pads | 2013-06-06 |
| 20130140710 | SEMICONDUCTOR DEVICE INCLUDING A PROTECTIVE FILM - A semiconductor device includes a semiconductor chip having a wire and a passivation film formed on the outermost surface with an opening partially exposing the wire. A resin layer is stacked on the semiconductor chip and provided with a through-hole in a position opposed to a portion of the wire facing the opening. A pad is formed on a peripheral portion of the through-hole in the resin layer and in the through-hole so that an external connection terminal is arranged on the surface thereof. The peripheral portion of the resin layer is formed more thickly than the remaining portion of the resin layer other than the peripheral portion. | 2013-06-06 |
| 20130140711 | SEMICONDUCTOR DEVICE - A semiconductor device includes a stacked via structure including a plurality of first vias formed over a substrate, a first interconnect formed on the plurality of first vias, a plurality of second vias formed on the first interconnect, and a second interconnect formed on the plurality of second vias. One of the first vias closest to one end part of the first interconnect and one of the second vias closest to the one end part of the first interconnect at least partially overlap with each other as viewed in the plane, and the first interconnect has a first extension part extending from a position of an end of the first via toward the one end part of the first interconnect and having a length which is more than six times as long as a via width of the first via. | 2013-06-06 |
| 20130140712 | Array Substrate, LCD Device, and Method for Manufacturing Array Substrate - The invention discloses an array substrate, an LCD device, and a method for manufacturing the array substrate. The array substrate comprises scan line(s) and data line(s); the width of data line at the junction of the data line and the scan line is more than the width of the rest part of the data line. The invention can improve the final passed yield of LCD devices on the premise of not adding additional processes, and has the advantages of simple technology and low cost. | 2013-06-06 |
| 20130140713 | Interposer Wafer Bonding Method and Apparatus - The present disclosure relates to a method for fast and precise alignment and mounting of a top die onto an interposer wafer. The method is performed by applying a hydrophobic self assembled monolayer to a carrier wafer in a pattern defining a top die placement region correlating to an arrangement of a top die on an interposer wafer. A liquid is provided into the top die placement region and a top die is placed into contact with the liquid. The surface tension of the liquid automatically aligns the top die by generating a force causing the top die to overlap with the top die placement region. The liquid is then eliminated and the top die is affixed to the carrier wafer. The carrier wafer is bonded to the interposer wafer, bringing the top die into contact with an interposer. | 2013-06-06 |
| 20130140714 | SEMICONDUCTOR DEVICE - In a QFN that includes a die pad, a semiconductor chip mounted on the die pad, a plurality of leads arranged around the semiconductor chip, a plurality of wires that electrically connect the plurality of electrode pads of the semiconductor chip with the plurality of leads, respectively, and a sealing member sealing the semiconductor chip and the plurality of wires, first and second step portions are formed at shifted positions on the left and right sides of each of the leads to make the positions of the first and second step portions shifted between the adjacent leads. As a result, the gap between the leads is narrowed, thereby achieving the miniaturization or the increase in the number of pins of the QFN. | 2013-06-06 |
| 20130140715 | Integrated Circuit Having Stress Tuning Layer and Methods of Manufacturing Same - Warpage and breakage of integrated circuit substrates is reduced by compensating for the stress imposed on the substrate by thin films formed on a surface of the substrate. Particularly advantageous for substrates having a thickness substantially less than about 150 μm, a stress-tuning layer is formed on a surface of the substrate to substantially offset or balance stress in the substrate which would otherwise cause the substrate to bend. The substrate includes a plurality of bonding pads on a first surface for electrical connection to other component. | 2013-06-06 |
| 20130140716 | MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND REFERENCE WIREBOND - A microelectronic device, e.g., semiconductor chip, is connected with an interconnection element having signal contacts and reference contacts, the reference contacts being connectable to a reference potential such as ground or power. Signal conductors, e.g., signal wirebonds can be connected to device contacts of the microelectronic device, and at least one reference conductor, e.g., reference wirebond can be connected with two reference contacts. The reference wirebond can have a run extending at an at least substantially uniform spacing from an at least a substantial portion of a length of a signal conductor, e.g., signal wirebond. In such manner a desired impedance may be achieved for the signal conductor. | 2013-06-06 |
| 20130140717 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate, a multi-layer wiring layer formed on the substrate, and including a signal line and ground lines extending above the signal line, one of the ground lines extending toward a direction in a layer and another one of the ground lines extending from the one of the ground lines toward another direction in the layer, a first pad on the multi-layer wiring layer, and a redistribution layer formed on the multi-layer wiring layer, including a second pad, a redistribution line coupling the first pad and the second pad, and an insulation film covering the redistribution line. | 2013-06-06 |
| 20130140718 | CHIP IDENTIFICATION FOR ORGANIC LAMINATE PACKAGING AND METHODS OF MANUFACTURE - A chip identification for organic laminate packaging and methods of manufacture is provided. The method includes forming a material on a wafer which comprises a plurality of chips. The method further includes modifying the material to provide a unique identification for each of the plurality of chips on the wafer. The organic laminate structure includes a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip. | 2013-06-06 |
| 20130140719 | Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers - A semiconductor device has a semiconductor die and encapsulant deposited over the semiconductor die. A first insulating layer is formed over the die and encapsulant. The first insulating layer is cured with multiple dwell cycles to enhance adhesion to the die and encapsulant. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. The second insulating layer is cured with multiple dwell cycles to enhance adhesion to the first insulating layer and first conductive layer. A second conductive layer is formed over the second insulating layer and first conductive layer. A third insulating layer is formed over the second insulating layer and second conductive layer. The first, second, and third insulating layers have different CTE. The second insulating layer or third insulating layer is cured to a dense state to block moisture. | 2013-06-06 |
| 20130140720 | VOID FREE INTERLAYER DIELECTRIC - A method of manufacturing a non-volatile memory device includes forming a number of memory cells. The method also includes depositing a first dielectric layer over the memory cells, where the first dielectric layer is a conformal layer having a substantially uniform thickness. The method further includes depositing a second dielectric layer over the first dielectric layer. Together, the first and second dielectric layers form an interlayer dielectric without voids. | 2013-06-06 |
| 20130140721 | WINE AERATOR - A device for aerating a liquid, such as wine, includes a cup portion with a cavity that receives an amount of liquid therein, the cavity extending between a proximal opening and a distal opening. A neck portion of the device defines an aeration section in fluid communication with the cavity. Passages in the aeration section extend laterally to an outer surface of the neck portion through which air is drawn into the aeration section. A central passage through the neck portion is in fluid communication with the aeration section and extends to a distal opening of the device. A diffuser element between the cavity and the aeration section has arms that are configured to contact the liquid as it flows from the cavity to inhibit a swirling flow of the liquid so that the liquid passes into the aeration section in a generally vertical and linear manner. | 2013-06-06 |
| 20130140722 | DISTILLATION COLUMN HAVING ENLARGED DOWNCOMERS AND METHOD OF DOWNCOMER ENLARGEMENT - A distillation column is provided with a downcomer having an enlarged upper region to increase a processing rate for the removal of permanganate reducing compounds (PRCs) formed by the carbonylation of methanol in the presence of a catalyst to produce acetic acid. The distillation column includes a vertically extending distillation housing; and a plurality of tray assemblies, at least one of which includes a horizontally extending tray panel and a downcomer having, in a downward direction, an enlarged, funnel-shaped upper region defined by a top downcomer panel oriented at an angle to the vertical, and a lower region of substantially constant cross-sectional area defined by a vertically-oriented bottom downcomer panel. | 2013-06-06 |
| 20130140723 | METHOD OF FABRICATING AN OPTICAL GRATING - According to embodiments of the invention, the design and fabrication of a binary superimposed grating (BSG) results in better performing devices that may be fabricated using existing technology. The fabrication process includes forming grating features based upon repeating features of the desired superposition function. The design process also relaxes the processing requirement for equivalently performing devices. | 2013-06-06 |
| 20130140724 | METHOD OF DETERMINING MANUFACTURING CONDITION OF EYEGLASS LENS AND METHOD OF MANUFACTURING EYEGLASS LENS - An aspect of the present invention relates to a method of determining a manufacturing condition of a polythiourethane eyeglass lens obtained via a process of obtaining polythiourethane by polymerization reaction of an iso(thio)cyanate compound and a thiol compound, comprising determining a candidate composition for a starting material mixture and a candidate polymerization reaction condition employed in the polymerization reaction in actual manufacturing; polymerizing the starting material mixture of the candidate composition that has been determined under the candidate polymerization reaction condition to obtain a test sample; testing the obtained test sample by irradiation with a xenon lamp to determine whether or not change into red-like color is present following irradiation with the xenon lamp; and determining a starting material mixture composition and a polymerization reaction condition to be employed in the polymerization reaction in actual manufacturing with the use of a result of the determination as an indicator. | 2013-06-06 |
| 20130140725 | NOZZLE PLATE - The present invention provides a nozzle plate and the use of the nozzle plate for producing filaments, preferably silica gel fibers. | 2013-06-06 |
| 20130140726 | CABLE TERMINATION, JOINT AND REPAIR SYSTEM - A system for encapsulating a cable | 2013-06-06 |
| 20130140727 | VISUAL INDICATION OF IMPROPERLY PROCESSED PLASTIC PARTS - a method comprising injection molding a plastic part from a polymer formulation comprising an injection moldable thermoplastic and an additive, wherein the additive has a decomposition temperature that establishes a maximum processing temperature for the polymer formulation. The additive will thermally decompose to generate gaseous products causing visible bubble formation in the surface of the plastic part in response to exposure to a processing temperature that exceeds the decomposition temperature of the additive. A suitable additive may be, for example, selected from oxalates, carbamic acids, carbonic acids, diazocarbonyl compounds, and combinations thereof. | 2013-06-06 |
| 20130140728 | ELASTIC PARTICLE FOAM BASED ON POLYOLEFIN/STYRENE POLYMER MIXTURES - Thermoplastic particle foams which have cells having a mean cell size in the range from 20 to 500 μm and in which the cell membranes have a nanocellular or fibrous structure having pore or fiber diameters below 1500 nm, and also processes for producing them. | 2013-06-06 |
| 20130140729 | Method And Apparatus For Manufacturing A Crimped Compound Thread - The invention relates to a method and a device for producing a crimped composite thread, wherein the inventive method consists in extruding, cooling and in drawing several yarns in the form of a plurality of strand filaments and in jointly crimping them in order to obtain a crimped composite thread. The aim of said invention is to make it possible to pre-treat the threads in a manner adaptable to each treatment step. The aim is attained by that at least one multi-treaded yarn is whirl-tangled many times during several operations prior to crimping. For this purpose, a whirl-tangling device provided with a plurality of whirl-tangling units following each other in a direction of the yarn displacement is used. | 2013-06-06 |
| 20130140730 | PROCESS AND EQUIPMENT FOR MANUFACTURING A PLASTIC HOLLOW BODY FROM TWO SHEETS - A process for manufacturing a plastic hollow body by molding two sheets of molten plastic in a mold including two cavities, the process including: a) two molten plastic sheets are manufactured by extrusion of at least one stream of molten plastic and transverse cutting thereof; b) these sheets are introduced between the mold cavities; c) the mold is closed and the hollow body is manufactured by conforming the two sheets to the mold cavities; d) the hollow body thus obtained is removed from the mold; e) all of operations a) to d) are repeated to manufacture another hollow body from two new sheets; and before, during, or after the transverse cutting operation, the lower portion of the two new sheets is cooled using a specific device that makes possible a local cooling of the sheets in the lower portion. | 2013-06-06 |
| 20130140731 | OVERMOLDING EXTRUDED PROFILES - An exemplary method of, for instance, forming a baffle or reinforcer includes extruding an expandable material to have a particular cross-sectional profile, inserting the expandable material into a molding tool, cutting the expandable material to a predetermined length within the molding tool, and overmolding a carrier material onto a portion of the expandable material within the molding tool. | 2013-06-06 |
| 20130140732 | Die, System, and Method for Coextruding A Plurality Of Fluid Layers - A die for coextruding a plurality of fluid layers generally includes a primary forming stem, one or more distribution plates, and a microlayer assembly. The microlayer assembly includes a microlayer forming stem and a plurality of microlayer distribution plates. | 2013-06-06 |
| 20130140733 | METHOD FOR MOLDING THREE-DIMENSIONAL FOAM PRODUCTS USING A CONTINUOUS FORMING APPARATUS - A continuous forming apparatus for molding foam material into foam products that includes a first endless belt and a second endless belt that cooperates with the first endless belt to mold the foam material. The continuous forming apparatus may also include a first plurality of cleats and a second plurality of cleats opposed to the first plurality of cleats that support the first endless belt and the second endless belt respectively. The first plurality of cleats may include a three-dimensional abutment surface that provides transverse and lateral support to the first endless belt. Additionally, the continuous forming apparatus may include a first frame disposed to support the first plurality of cleats, a second frame disposed to support the second plurality of cleats, and a drive mechanism for imparting motion to the first endless belt, the second endless belt, the first plurality of cleats, and the second plurality of cleats. | 2013-06-06 |
| 20130140734 | Method For Compression Molding A Dual Core For A Golf Ball - A method and system for compression molding a dual core of a golf ball is disclosed. The method may include a first cycle in which a top mold plate, a middle mold plate, and a bottom mold plate may be used to compression mold concave shells. During the first cycle, the top mold plate and the bottom mold plate may be held at a first temperature T | 2013-06-06 |
| 20130140735 | Method of Molding Composite Molded Article and Mold System Used for Same - [PROBLEM] To provide a method of molding a composite molded article enabling compression molding without requiring a large sized injection molding machine and a mold system used for that. | 2013-06-06 |
| 20130140736 | MASK FOR SEALING HONEYCOMB STRUCTURE, AND SEALING METHOD FOR HONEYCOMB STRUCTURE USING SAME - The mask of the invention is used for plugging of the cells of a honeycomb structure, and it has a plurality of first through-holes running through a thickness direction of the mask, in a region that is to contact with an end face of the honeycomb structure when used. The first through-holes have an open area of 0.03 mm | 2013-06-06 |
| 20130140737 | STACKED SUBSTRATE MOLDING - A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame; and wherein the first and second mold chases define a transfer mold cavity and wherein the first and second lead frames are positioned in stacked relationship inside the transfer mold cavity. Also disclosed is a method of integrated circuit packaging. | 2013-06-06 |
| 20130140738 | METHOD OF PREPARING BENZOXAZINE-THIOL POLYMERS FILMS - A process for preparing benzoxazine-thiol polymer film is described comprising forming a rolling bank of a curable composition comprising a polybenzoxazine and a polythiol, wherein the rolling bank contacts first and second carrier substrates; passing the first and second substrates with the curable composition therebetween through a nip; and at least partially curing the curable composition to provide the corresponding polymeric layer. The compositions are useful in coating, sealants, adhesive and many other applications. | 2013-06-06 |
| 20130140739 | TOOL AND METHOD FOR EXPANDING A PIPE END - A pipe end is expanded by an expander tool ( | 2013-06-06 |
| 20130140740 | HOT PRESSING APPARATUS AND METHOD FOR SAME - An apparatus for parallel hot pressing includes a die assembly that defines multiple pockets, as well as a load transferring mechanism selectively providing a respective uniaxial compressive load at each of the pockets. Multiple heating mechanisms are arranged so that each of the pockets is aligned with a different respective one of the heating mechanisms, the load transferring mechanism and the heating mechanisms thereby providing both compressive loading and heating of multiple material samples in parallel when material samples are placed in the pockets. A method of hot pressing in parallel is also provided. | 2013-06-06 |
| 20130140741 | RESIN SOLIDIFICATION SUBSTRATE AND ASSEMBLY - A solidification substrate assembly for making a three-dimensional object from a solidifiable material includes a solidification substrate assembly. In certain examples, the solidifiable material solidifies in contact with the solidification substrate, and the tilting of the substrate and/or or the use of a peeling member facilitates separation of the substrate from the solidified material. In other examples, the solidification substrate assembly includes a film that is adjacent to a rigid or semi-rigid layer. The solidifiable material solidifies in contact with the film, and a peeling member peels the film away from the solidified material. Intelligent solidification substrate assemblies are also described in which a force sensor determines when to expose the solidifiable material to solidification energy and/or whether to use a peeling member to separate the solidification substrate from a solidified objection section. | 2013-06-06 |
| 20130140742 | PRODUCTION METHOD OF CERAMIC HONEYCOMB STRUCTURE - A method for producing a ceramic honeycomb structure having a large number of paths partitioned by porous cell walls, the cell walls having thickness of 0.17-0.45 mm and porosity of 40% or more, comprising the steps of preparing a moldable material comprising a ceramic material powder, a binder, a pore-forming material and water, extruding the moldable material to form a honeycomb-shaped green body, and drying and sintering the green body, the pore-forming material having a melting point of 40-110° C., being solid in the moldable material, and being melted in the drying step so that 25% or more thereof is removed from the green body in the drying step. | 2013-06-06 |
| 20130140743 | METHOD AND DEVICE FOR SPATIALLY PERIODIC MODIFICATION OF A SUBSTRATE SURFACE - The invention relates to a method and a device for modifying in a spatially periodic manner at least in some regions a surface of a substrate ( | 2013-06-06 |
| 20130140744 | METHOD FOR PRODUCING PRODUCT HAVING UNEVEN MICROSTRUCTURE ON SURFACE THEREOF - A method for producing a product having an uneven microstructure on a surface thereof includes: a step (I) which treats a surface of a roll mold ( | 2013-06-06 |
| 20130140745 | METHOD FOR PRODUCING AND TREATING CONTAINERS - A method for producing plastic containers by a production process, which is either drape forming and blow molding, using a preform in a drape forming or blow molding machine, and for subsequent treatment of the plastic containers in a treatment station of a container treatment line includes, prior to completion of the production process, determining first positional data associated with the container at a location, wherein the first positional data is selected from the group consisting of angular position of a container and angular position of a design feature on the container, and wherein the location is selected from the group consisting of the production machine, a conveying line that precedes the production machine, and a treatment line that precedes the production machine, and passing the first positional data to the treatment station for control thereof. | 2013-06-06 |
| 20130140746 | FOOD SERVICE ARTICLES BEARING DECORATIVE MARKINGS, IMAGES, AND/OR CUSTOM CONTENT AND METHOD THEREFOR - A plastic food service article bearing a decorative mark or image and method therefor is disclosed. The method includes providing an article made from a colored plastic such as polystyrene, polypropylene, polyethylene, PET, PLA, ABS, etc., that discolors when irradiated with a laser beam; applying a laser beam to cause localized surface discoloration; and controlling the deflection and amplitude of the beam to form a surface decoration and/or image. In embodiments, the laser is a YAG or Fiber laser, the markings emulate silver or gold or pewter without applying metals, inks, or coatings to the plastic articles. The markings are clearly visible against both light and dark backgrounds, and can be placed in food-contact areas of the articles. The technique can be used for marking customized and personalized designs, images, and photographs on food service articles. Embodiments can be used to decorate plates and/or cutlery. | 2013-06-06 |
| 20130140747 | METHOD FOR MANUFACTURING CERAMIC HONEYCOMB FIRED BODY - Manufacture of ceramic honeycomb fired body. Green molded body is placed on a firing base and fired. The firing base and green molded body are each a column containing a ceramic raw material and having a partition wall forming a plurality of flow paths, and patterns of end surfaces of the two partition walls are the same as each other as seen from an extending direction of the flow paths. The green molded body is placed on the firing base displaced in a horizontal direction by a predetermined distance, or rotated around a vertical axis V of the green molded body by a predetermined angle θ, so that only a part of the lower side end surface of the partition wall of the green molded body is in contact with the upper side end surface of the partition wall of the firing base. | 2013-06-06 |
| 20130140748 | SYSTEM AND METHOD FOR DEGASSING MOLTEN METAL - A system for adding gas to and transferring molten metal from a vessel and into one or more of a ladle, ingot mold, launder, feed die cast machine or other structure is disclosed. The system includes at least a vessel for containing molten metal, an overflow (or dividing) wall, a device or structure, such as a molten metal pump, for generating a stream of molten metal, and one or more gas-release devices. | 2013-06-06 |
| 20130140749 | SIDE POSITIONING DEVICE FOR A SYSTEM FOR ASSEMBLING VEHICLE BODY PANELS - A side home-position device for a vehicle body assembly system for various vehicle types is disclosed, which can be used to return a common use side jig that controls a side panel to a working position of a main buck process. The device includes a post frame that is disposed in a vertical direction corresponding to the working position, a moving member that is movably disposed at the post frame in a width direction of a vehicle body and substantially supports the common use side jig, a main control unit in connection with the moving member and which returns the common use side jig to an original position, a clamper disposed on the moving member which clamps a matching portion of the common use side jig for the moving member, and an operating portion disposed at the post frame and which moves the moving member in a width direction of the vehicle body. | 2013-06-06 |
| 20130140750 | Adjustable C-Clamp System - A c-shaped clamp tool system preferably includes slider arms, one or more slider arm supports, pads, one or more threaded rods, and turning knobs. The clamping system preferably includes multiple slider arms and slider arm supports of different lengths. In a preferred embodiment, the slider arms are made of unidirectional pultruded carbon fiber and the slider arm support is made of woven carbon fiber. | 2013-06-06 |
| 20130140751 | Portable Vise - A portable vise, particularly for use in supporting elongated member, provides a convenient design for safely cutting, drilling, welding, and painting. An elongated member is inserted through an aperture of a vise body. The vise rests upon the ground or other work surface such that one end of the elongated member is supported over the work surface while the other end of the elongated member rests upon the work surface. | 2013-06-06 |
| 20130140752 | METHOD AND JIG FOR HOLDING SILICON WAFER - Provided are a method and a jig for holding a silicon wafer, which are applied to the production of the silicon wafer having {110} or {100} plane as its principal surface, in which the silicon wafer is held while a silicon wafer holding positions are properly defined at wafer edge regions relative to the reference direction as being from the center of the silicon wafer toward <110> in crystal orientation in parallel to the wafer surface. In handling the silicon wafer, generation of contact scratches is suppressed as little as possible, and a fracture which is caused by development of the crack initiating from easily generated contact scratches can be prevented in the silicon wafer, particularly in the silicon wafer having {110} plane as its principal surface. | 2013-06-06 |
| 20130140753 | KITCHEN APPLIANCE AND PROCESSING CONTAINER HAVING A COUPLING DEVICE - A kitchen appliance includes a coupling plate having an edge enclosing an inner area and provided with coupling points of a coupling device for removable coupling of a processing container. The coupling plate is configured in the inner area in either of two ways, a first way in which the coupling plate has a pin which projects in a coupling direction for engagement in a groove in a base section of the processing container, a second way in which the coupling plate has a groove for engagement of a pin which projects in the coupling direction from the base section of the processing container. | 2013-06-06 |
| 20130140754 | PRINTING APPARATUS, CONTROL METHOD THEREOF AND STORAGE MEDIUM STORING PROGRAM - This invention relates to a printing apparatus and control method thereof. The standard size of an envelope to be stored in each of a plurality of paper storage units configured to store an envelope to be used in printing is set. An offset amount to be used to print an image on an envelope of the set standard size is set. A paper storage unit which stores an envelope to be used in printing is selected from the plurality of paper storage units based on a standard size of an envelope that is designated by a user. The position of an image is shifted in accordance with the set offset amount, and the image is printed on an envelope fed from the selected paper storage unit. | 2013-06-06 |
| 20130140755 | PASSING APPARATUS OF A WORKPIECE ASSOCIATED WITH AN ABSORBENT ARTICLE - A passing apparatus for a workpiece associated with an absorbent article receives a first sheet-like workpiece at a receiving position, changes a longitudinal direction of the first sheet-like workpiece to a direction that intersects the longitudinal direction at the time the first sheet-like workpiece is received, and discharges the first sheet-like workpiece with the changed longitudinal direction at a discharge position. The passing apparatus includes: a plurality of holding pads each having a plane section to be in contact with and for holding the first sheet-like workpiece, a revolution mechanism for causing the holding pads to revolve about a revolution axis normal to the plane section, and a spin mechanism for causing the holding pad to spin about a spin axis normal to the plane section. On an orbit of the holding pad determined by the revolution mechanism, the receiving position and the discharge position are set. | 2013-06-06 |
| 20130140756 | Medium Storage Box, Medium Handling Apparatus and Financial Device - A medium storage box is provided. The medium storage box includes a first supporting plate for storing first medium, a second supporting plate spaced apart from the first supporting plate, for storing second medium, and a pickup roller, disposed between the first supporting plate and the second supporting plate, for selectively picking up one of the first medium and the second medium. | 2013-06-06 |
| 20130140757 | SOUND-BASED DAMAGE DETECTION - A document handling apparatus having a document transport path for moving a document therethrough. A single detector proximate the transport detects a misfeed indication in the transport path. A processing system processes the indication and issues a termination signal if a misfeed is determined. | 2013-06-06 |
| 20130140758 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS - Provided are a sheet feeding device with improved separating/feeding performance. The sheet feeding device includes a sheet storage portion, a pickup roller which feeds the sheet, a driving motor which rotates the pickup roller, a feed roller and a separating roller which separate and feed the sheet, and a drive transmission mechanism which when the pickup roller abuts on the surface of the sheet accommodated in the sheet storage portion to feed the sheet, allows the pickup roller to perform intermittent rotation that alternately perform rotation and stop twice or more while one sheet is fed. The drive transmission mechanism is connected to the driving motor and includes an input gear having a plurality of protrusions and a regulating portion which is engaged with the protrusions of the input gear to regulate the rotation of the input gear. | 2013-06-06 |
| 20130140759 | AUTOMATIC DOCUMENT FEEDER - An automatic document feeder includes a paper pick-up device, a transfer roller assembly, and a duplex feeding channel. The transfer roller assembly includes a shaft, a first roller, a second roller, a first idler, a second idler, and a power-coupling device. When the power-coupling device is connected with the shaft and the first roller for transmitting a paper, the first roller is driven to be rotated by the shaft. When the front edge of the paper is moved to the second roller, the first roller is driven to be rotated at a higher speed by the paper. Consequently, a power connection between the first roller and the shaft is released by the power-coupling device. Then, the first roller reaches a static status in order to correct the skew phenomenon of a next paper. | 2013-06-06 |
| 20130140760 | Combined Ultrasonic-Based Multifeed Detection System And Sound-Based Damage Detection System - A document handling apparatus having a document transport path for moving a document therethrough. A detector proximate the transport detects a multifeed indication in the transport path or a misfeed indication in the transport path. A processing system processes the indications and issues a termination signal if a multifeed or a misfeed, or both, is determined. | 2013-06-06 |
| 20130140761 | Image Forming Device Capable of Stably Feeding Recording Sheet - An image forming device includes: a feeding roller; a support shaft; a support portion; a drive shaft; a planetary gear unit; and a driving force transmission unit. The support portion rotatably supports the feeding roller and is pivotally movably supported to the support shaft. The drive shaft is rotatable upon receipt of a driving force from a motor. The planetary gear unit includes a sun gear rotatable integrally with the drive shaft, and a planetary gear swingably movable about the sun gear while maintaining meshing engagement therewith. The transmission unit includes an input gear meshingly engageable with the planetary gear when the drive shaft rotates. The transmission unit transmits the driving force to the feeding roller through the drive shaft, the sun gear, the planetary gear, and the input gear. | 2013-06-06 |
| 20130140762 | IMAGE FORMING DEVICE PROVIDED WITH SHEET CASSETTE HAVING IMPROVED INSERTING AND REMOVING WORKABILITY - An image forming device includes: an image forming unit; a casing; a tray; a cover; and a handle portion. The image forming unit is configured to form an image on a sheet. The casing is formed with an opening and configured to accommodate the image forming unit therein. The tray is configured to accommodate in a stacked state a plurality of sheets to be fed toward the image forming unit. The tray is configured to be inserted into the casing through the opening to be attached to the casing and removed from the casing through the opening to be detached from the casing. The cover is configured to be connected to the tray and moved relative to the tray. The cover is configured to cover at least a part of the opening when the tray is attached to the casing. The handle portion is provided at the tray. | 2013-06-06 |
| 20130140763 | Non-Stop Device - In the case of a non-stop device having load-bearing rods ( | 2013-06-06 |
| 20130140764 | IMAGE FORMING APPARATUS CAPABLE OF DUPLEX PRINTING - An image forming apparatus has a rockable member which is configured to rotate about an axis defined at a first end portion among: a first position at which a second end portion at a downstream side in the forward feed direction with respect to the first end portion is supported by the guide member having the first orientation; a second position at which the second end portion is located at a higher position that the second end portion when located at the first position; and a third position at which the second end portion is located at a lower position that the second end portion when located at the first position; and a signal generating unit configured to output a signal corresponding to the position of the rockable member. A photo sensor is provided to generate a signal in accordance with an orientation of the rockable member. | 2013-06-06 |
| 20130140765 | SHEET STORAGE APPARATUS AND IMAGE FORMATION SYSTEM USING THE APPARATUS - To provide a sheet storage apparatus for enabling a sheet to be aligned so that the length-direction position and width-direction position of the sheet coincide with correct reference positions in positioning and storing the sheet in a predetermined position on a tray, it is configured that a paper feed rotating member in a center portion of a sheet that is carried out onto the tray and a paper-pressing guide in the side portion are disposed swingably up and down in the sheet load direction, and that the paper-pressing guide moves upward integrally with the paper feed rotating member floating a predetermined amount or more from the sheet top surface on the tray corresponding to a curl of the sheet. | 2013-06-06 |
| 20130140766 | Combined Ultrasonic-Based Multifeed Detection Method And Sound-Based Damage Detection Method - A method for feeding sheets through a sheet transport path. Ultrasonic energy is directed toward a sheet in the transport path while an audio receiver detects audio data generated by the ultrasonic source and the mechanisms that transport the sheet. The audio data is processed to determine whether a multifeed or a misfeed condition exists in the transport path. | 2013-06-06 |
| 20130140767 | PRINTING APPARATUS, CONTROL METHOD THEREOF, AND STORAGE MEDIUM STORING PROGRAM - This invention relates to a printing apparatus and control method thereof. In the printing apparatus and control method thereof, an image is input, and an envelope is conveyed so that the long edge of the envelope serves as the leading end in the conveyance direction. When the envelope is conveyed so that the long edge of the envelope serves as the leading end in the conveyance direction, it is controlled to shift the image by a set offset amount to be used to print an image on an envelope, and print the image on the envelope. | 2013-06-06 |
| 20130140768 | SHEET CONVEYANCE APPARATUS AND PRINTING APPARATUS - A sheet conveyance apparatus includes: a guide unit for guiding the side end of the sheet; a first roller pair arranged on the downstream side of the guide unit for conveying the sheet, including a driven roller held in contact with a whole sheet in a sheet width direction; and a second roller pair having a conveyance roller arranged on the downstream side of the roller and adapted to convey the sheet, and a plurality of pinch rollers pinching the sheet in cooperation with the conveyance roller, wherein each of the plurality of pinch rollers applies to the sheet a conveyance force inclined toward a conveyance path side end, which is nearer to the pinch roller, and wherein the smaller the distance between the pinch roller and the conveyance path side end, the greater the inclination of the conveyance force thereof. | 2013-06-06 |
| 20130140769 | GAME MACHINE - A game machine includes: an entertainment button that can move up and down from a normal operation position to a protruding position in which the entertainment button protrudes upward from the normal operation position; an assigned object determining part that determines an assigned object that defines a result of a game; an assigned object display part that displays an assigned object symbol corresponding to the assigned object determined by the assigned object determining part; a movement determining part that determines whether or not to move the entertainment button from the normal operation position to the protruding position; a drive control part to move the entertainment button from the normal operation position to the protruding position, when the movement determining part determines to move the entertainment button from the normal operation position to the protruding position; and a push operation detecting part that detects the entertainment button being pushed. | 2013-06-06 |
| 20130140770 | Game - A puzzle game includes a cylindrical body having a plurality of generally circular raceways arranged vertically. Each raceway is formed so as to retain a plurality of balls and have at least one opening to permit a ball to be moved to an adjacent raceway. The game also includes a plurality of balls sized to fit in the raceways and be retained in the raceways. The ball can include a number of groups equal to the number of raceways, where each group has a unique marking. | 2013-06-06 |
| 20130140771 | System and Methods for Generating a Game Board and Playing Games Therewith - The present disclosure relates to a system and methods for a board game in which boards, each containing multiple letters are combined in numerous combinations and configurations in order to generate and play different board games on different game boards. The object of the board game is for a player or team to place that team's colored translucent chips or tokens on letters and adjacent letters to create words, thereby creating a line or path of chips. By using this line of chips and adding to the line at each turn, the player or team can meet certain objectives, such as connecting various locations or ends on the game board, or racing from one end of the game board to the other, and other objectives as necessary to play each game. | 2013-06-06 |
| 20130140772 | Three Dice Game - An apparatus and method for a three dice game of chance. A game surface is provided having discrete sections, each section including a plurality of numbers, e.g., four numbers from 3 to 18 obtained by the sum of a roll of three dice. The numbers have various payout odds, each section also having payout odds. A wager placed on a number in a particular section is paid off in accordance with the payout odds associated with that number. If the rolled sum does not correspond to that number but does correspond to another number in that section, wager is paid off in accordance with the payout odds of that section. In a particular embodiment, increased odds are given for rolling a hard way number wherein all three dice have the same number. | 2013-06-06 |
| 20130140773 | BACCARAT ASSOCIATED WAGERING GAME - Systems and methods for providing wagering games associated with an underlying game of baccarat in which wagers are won if the baccarat outcome data includes specific tie outcomes. | 2013-06-06 |
| 20130140774 | ANNULAR SEAL APPARATUS AND METHOD - A non-contacting shaft seal apparatus according to which an alternating array of axially-spaced, porous and non-porous annular segments extend radially-inward from the inside surface of an annular seal body and to a radial clearance defined between the segments and a rotating shaft. | 2013-06-06 |
| 20130140775 | Seal With Bellows Type Nose Ring - A wellhead assembly having concentric tubulars and a seal assembly in an annulus between the tubulars. The seal assembly includes an upper portion having an annular body with a U-shaped cross section and a nose ring seal. The nose ring seal has a bellows like cross section and provides sealing in the annulus and exerts a lockdown force onto one of the tubulars. Metal inlays are provided on the outer edges of the folds in the bellows and a compressible medium is disposed between the folds. | 2013-06-06 |
| 20130140776 | SLIDING ELEMENT, IN PARTICULAR PISTON RING, HAVING A COATING AND PROCESS FOR PRODUCING A SLIDING ELEMENT - A sliding element, in particular piston ring, has on at least one running surface, from the inside outwards, a coating having a metal-containing adhesive layer and a ta-C type DLC layer with a thickness of at least 10 μm. | 2013-06-06 |
| 20130140777 | ROTARY WHEEL SEALING SYSTEM - A rotary wheel assembly is configured for use with a system for conditioning air to be supplied to an enclosed structure. The rotary wheel is configured to be positioned within a supply air stream and an exhaust air stream. The assembly includes a cassette frame, a wheel rotatably secured within the cassette frame, and a self-adjusting seal subassembly configured to maintain sealing engagement with respect to a surface of the wheel. The self-adjusting seal subassembly includes at least one seal member. | 2013-06-06 |
| 20130140778 | SHOPPING CARTS - A method of making a shopping cart includes forming a frame capable of supporting a plurality of basket assembly types, selecting from the plurality of basket assembly types a first basket assembly defining a first basket assembly type; and connecting the first basket assembly to the frame. | 2013-06-06 |
| 20130140779 | BOTTLE HOLDER FOR MOBILE MEDICAL DEVICE - An oxygen, or other type of, bottle holder is attached to a medical device and includes an upper portion and a lower portion. The lower portion includes a cylindrical recess into which the bottom of the bottle is inserted. The upper portion includes a clamp that may include either a movable arm or movable fingers. The movable fingers pivot about a common pivot axis and are retractable into, and extendable out of, a housing. The movable arm includes different sections with different levels of curvature. A trigger may be included that automatically opens the clamp upon the insertion of the bottle therein, as well as automatic closing of the clamp thereafter, thereby relieving the user from having to manually manipulate the clamp for it to secure the upper end of the bottle. The device may be wheeled chair, cot, stretcher, bed, or other device that holds an oxygen bottle. | 2013-06-06 |
| 20130140780 | POLE AND TOPPER FOR MOBILE MEDICAL DEVICE - A wheeled medical device—such as a cot, stretcher, bed, wheeled chair, or other medical device—includes a pole on which is mounted a removable topper. The topper may include a plurality of IV hooks used to support an IV bag. The hooks may be defined in an endless ribbon that is circular, or that is another closed shape. No prongs, hooks, or other projections extend outwardly from the topper, thereby reducing the potential dangerousness of accidental impacts with the topper. Whether the topper includes hooks or not, it may also be used as an information communication medium, such as through the use of colors, shapes, or other structures that signify certain information. The information may identify characteristics of the patient associated with the medical device or characteristics of the medical device itself, or still other information. | 2013-06-06 |
| 20130140781 | WALKING SAFETY AID APPARATUS - A safety walker includes a pair of side members, arms and spring loaded pins engaging the arms so as to allow movement of the side members between an operative position, wherein the side members are disposed in a spaced apart generally parallel relationship with each other and a generally folded position, wherein the side members are generally juxtaposed in a generally planar relationship with and in close proximity to each other. There is also a seat that is configured for movement between a stored position wherein the seat is disposed generally parallel to a rear leg of one of the pair of the side members and a second position wherein the seat is disposed generally horizontally across a space between rear legs of the pair of the side members. The safety walker is also configured for supporting various medical devices often connected to the user. | 2013-06-06 |
| 20130140782 | WHEELED CHAIR - A wheeled chair for transporting patients includes a frame, a seat, a plurality of wheels, and a plurality of armrests. The armrests are pivotable about a common pivot axis that is oriented generally horizontally and that is positioned underneath the seat and forward of a back support. Each armrest may include a locking mechanism for holding the armrests in a use position. When locked in the use position, a user may apply an upward force on the armrests to lift the chair upwardly that does not cause pivoting of the armrests. The chair is designed to allow nesting with other chairs of similar design. The front wheels may be positioned laterally apart a greater distance than the rear wheels to allow a first chair to nestingly receive a rear portion of a second chair. Foley hooks may also be included on the chair for hanging a Foley catheter bag. | 2013-06-06 |
| 20130140783 | BRAKES FOR MOBILE MEDICAL DEVICE - A brake system for a medical device, such as a cot, stretcher, bed, wheeled chair, or other medical device, includes a pin and toothed wheel arrangement wherein the selective insertion of a pin between teeth on the toothed wheel brakes the system, while the removal of the pin from between the teeth unbrakes the system. Multiple pins may be used with a single toothed wheel wherein the pins are offset from each other relative to the teeth so that, when one pin is inserted between teeth, the other pin is at least partially blocked from being inserted between the teeth. This effectively increases the resolution of the toothed wheel. The toothed wheel may be axially spaced from wheel(s) that roll on the ground. When so spaced, the toothed wheel, and all of the braking components associated therewith, may be enclosed within a housing separate from the rolling wheel(s). | 2013-06-06 |
| 20130140784 | BIASING AIR SUSPENSION SYSTEM FOR A TRAILER - An air suspension system of a tandem axle assembly for a trailer includes a front axle air spring configured to be coupled to a front axle assembly of the tandem axle assembly and a rear axle air spring configured to be coupled to a rear axle assembly of the tandem axle assembly. The air suspension system further includes an air reservoir in fluid communication with the front axle air spring and the rear axle air spring and a ratio valve in fluid communication with the air reservoir, the front axle air spring, and the rear axle air spring. The ratio valve is positioned between the air reservoir and the front axle air spring. Further, the ratio valve is selectively operable to send a lesser amount of air from the air reservoir to the front axle air spring than to the rear axle air spring. | 2013-06-06 |
| 20130140785 | Vehicle Axle - A traverse strut for use in a twist beam axle assembly is provided. The traverse strut extends along a length and presents a central section; a pair of end sections; and a pair of intermediate sections between the central section and the respective end sections. At least a portion of the central section has a first wall thickness, at least a portion of each end section has a second wall thickness that is greater than the first wall thickness and at least a portion of each intermediate section has a third wall thickness that is greater than the second wall thickness. Additionally, at least two of the central, intermediate and end sections is work hardened. The transverse strut has improved performance and lower weight as compared to other known transverse struts. | 2013-06-06 |
| 20130140786 | SUSPENSION DEVICE - A suspension device for suspension of an axle | 2013-06-06 |
| 20130140787 | SLIDER - A slider is provided which can travel ahead by placing a user's foot on a board and stamping the ground with the other foot like a known kick board or which can exercise a user by causing shafts each having a rear board fixed thereto to sufficiently extend backward and moving the shafts at symmetric angles relative to each other and can spontaneously travel ahead by means of waveform-like actions using rear casters attached to the bottoms of the rear boards. | 2013-06-06 |
| 20130140788 | WHEELED PATIENT SUPPORT WITH FOOT RESTS - A wheeled chair for transporting patients includes a plurality of footrests for supporting a patient's feet thereon. Each footrest is pivotable between an up position and a down position, and includes a biasing mechanism for biasing the footrest toward the up position, or the down position, or whichever of the two positions the footrest is currently closer to. A swing mechanism swings the footrests from a use position in front of the seat to a stowed position alongside the seat. A trigger, such as a button, automatically activates the swinging. The swinging may take place about a vertical axis that is common to the axis about which the front caster wheels swivel. Pivot extensions may be included on the footrests that provide a tool for enabling a caregiver to manually pivot the footrest between the up and down positions with his or her foot. | 2013-06-06 |
| 20130140789 | WHEELED CHAIR WITH LEG RESTS - A leg rest for a patient transport device, such as a wheeled chair, bed, stretcher, cot, or the like, is movable between a stowed position underneath a seat and a use position extending forwardly from the seat. The leg rest includes a latch and a handle for releasing the latch. The latch is adapted to automatically retain the leg rest in whichever of the use and stowed positions it currently is in. Pulling on the handle releases the latch and allows the leg rest to be moved between the use and stowed positions. The leg rest includes a pad that is positioned, when the leg rest is in the use position, to contact a patient's calf. The leg rest is configured to both pivot about a pivot axis and to have two different sections that translate with respect to each other. | 2013-06-06 |
