| 23rd week of 2009 patent applcation highlights part 15 |
| Patent application number | Title | Published |
|---|
| 20090140405 | SEMICONDUCTOR DEVICE AND RESIN ADHESIVE USED TO MANUFACTURE THE SAME - A semiconductor device includes: a semiconductor element; a package body having the semiconductor element bonded inside thereof and electrically connected to the semiconductor element; a lid-like member covering the semiconductor element, and bonded to the package body to form a hollow structure; and a bonding member for bonding the package body and the lid-like member to each other. The bonding member is a resin adhesive containing an epoxy resin, a polymerization initiator, and a filling material, and a content of the filling material in the bonding member is 30 wt % to 60 wt %. | 2009-06-04 |
| 20090140406 | Semiconductor Mount - A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A first surface of the planar element is mounted to the substrate and is located to surround the semiconductor device such that the semiconductor device is aligned by the aperture. The mount further has means for mounting the semiconductor device to the substrate in an aligned position. Some embodiments include a method of making and/or using such a mount. | 2009-06-04 |
| 20090140407 | INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH ANTI-MOLD FLASH FEATURE - An integrated circuit package-on-package system includes: mounting an integrated circuit package system having a mountable substrate over a package substrate with the mountable substrate having a mold structure; forming a package encapsulation having a recess over the package substrate and the integrated circuit package system. The present invention also includes: forming an anti-mold flash feature with an extension portion of the package encapsulation and constrained by the mold structure at the bottom of the recess, and partially exposing the mountable substrate in the recess with the anti-mold flash feature formed with the mold structure; and mounting an integrated circuit device over the mountable substrate in the recess. | 2009-06-04 |
| 20090140408 | INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT - An integrated circuit package-on-package system includes: providing a bottom integrated circuit package system having a bottom substrate; mounting a top integrated circuit package system having a top substrate over the bottom integrated circuit package system; forming a top stacking via through the top substrate; forming a bottom stacking via into the bottom integrated circuit package system to the bottom substrate; and forming a stacking via interconnect with the top stacking via and the bottom stacking via aligned and connected. | 2009-06-04 |
| 20090140409 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having bumps on the backside thereof, a first semiconductor chip mounted on the surface of the substrate, a second semiconductor chip mounted on the first semiconductor chip above the surface of the substrate, a first bonding wire having a length L | 2009-06-04 |
| 20090140410 | ELECTRONIC PART AND METHOD OF PRODUCING THE SAME - It is an object of the invention to provide an electronic part capable of forming an accurate gap between opposing substrates while also capable of decreasing the area of the electronic part, and a method of producing the same. A second electrode portion ( | 2009-06-04 |
| 20090140411 | RESIN-SEALED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, BASE MATERIAL FOR THE SEMICONDUCTOR DEVICE, AND LAYERED AND RESIN-SEALED SEMICONDUCTOR DEVICE - The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively. | 2009-06-04 |
| 20090140412 | SEMICONDUCTOR DEVICE HAVING IMPROVED SOLDER JOINT AND INTERNAL LEAD LIFETIMES - A semiconductor chip is mounted on a flexible wiring board through the interposition of an elastmer. The flexible wiring board is made up of a tape on which wiring is fixed. A part of the wiring is projected beyond the edge of the tape, extended in the direction of the thickness of the elastmer and connected to an electrode of the semiconductor chip. The edge of the tape beyond which the wiring is projected protrudes beyond the edge of the elastmer by a length no smaller than the thickness of the elastmer. | 2009-06-04 |
| 20090140413 | SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTURING METHOD OF THE SAME - A semiconductor package structure and the applications thereof and the manufacturing method are disclosed. The semiconductor package structure includes a carrier, a semiconductor device, a first package body, a lid and a second package body. The semiconductor device is electrically connected to the carrier via a first conductive element. The first package body is molded on the carrier to surround the semiconductor device. The lid is disposed on top of the first package body and has at least one protrusion. The second package body is molded on the carrier to encapsulate the protrusion, whereby the protrusion is embedded within the second package body thereby locking the lid in place against the first package body. | 2009-06-04 |
| 20090140414 | Semiconductor device - A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At least one terminal block has at least one wiring terminal for electrically connecting the semiconductor element and the external connection terminals. | 2009-06-04 |
| 20090140415 | COMBINATION SUBSTRATE - A combination substrate includes a first substrate having wiring board mounting pads for installing a printed wiring board and connection pads on an opposite side of the wiring board mounting pads, a second substrate having package substrate mounting pads for mounting one or more package substrates and having connection pads on an opposite side of the package substrate mounting pads, a middle substrate positioned between the first substrate and the second substrate and including conductive members electrically connecting the connection pads on the first substrate and the connection pads on the second substrate, and a die positioned between the first substrate and the second substrate and mounted on one of the first substrate and the second substrate. | 2009-06-04 |
| 20090140416 | Cap member and semiconductor device employing same - A cap member capable of alleviating degradation of reliability and improving fabrication yields is provided. The cap member has a cylindrical side wall portion, a top face portion closing one end of the side wall portion and having a light exit hole formed therein to allow extraction of laser light from a semiconductor laser chip; a light transmission window fitted to the top face portion to stop the light exit hole, and a flange portion arranged at the other end of the side wall portion and welded on the upper face of a stem on which the semiconductor laser chip is mounted. A groove portion is formed in an inner surface of the top face portion, and this groove portion makes part of the top face portion in a predetermined region less thick than the other part thereof. | 2009-06-04 |
| 20090140417 | Holistic Thermal Management System for a Semiconductor Chip - Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to the semiconductor chip. A vapor chamber is coupled to the diamond heat spreader. | 2009-06-04 |
| 20090140418 | METHOD FOR INTEGRATING POROUS LOW-K DIELECTRIC LAYERS - Described herein are methods for integrating low-k dielectric layers with various interconnect structures. In one embodiment, a method for restoring a porous dielectric layer includes forming an opening in the porous low-k dielectric layer. The method further includes forming an opening in a barrier layer. The method further includes depositing a restoring dielectric layer to seal a surface layer of pores of the porous dielectric layer. In one embodiment, the restoring dielectric layer is non-porous and hydrophobic to prevent the porous dielectric layer from adsorbing moisture and consequently increasing the dielectric constant of the porous dielectric layer. The method further includes performing a clean operation on the interconnect structure prior to metallization. The method further includes depositing, masking, and etching a metal layer. | 2009-06-04 |
| 20090140419 | EXTENDED PLATING TRACE IN FLIP CHIP SOLDER MASK WINDOW - A flip chip in accordance with an exemplary embodiment of the present invention has a ball grid array and a die disposed on the ball grid array, wherein the ball grid array includes conducting pads disposed under the die. Traces connecting conducting pads under the die are accessible to leads on the die by way of a solder mask window. These traces continue through the solder mask window and extend out to the border of the ball grid array and are used for both signaling purposes and electroplating purposes. | 2009-06-04 |
| 20090140420 | SOFT ERROR RATE MITIGATION BY INTERCONNECT STRUCTURE - A method creates a structure that comprises a carrier connected to an integrated circuit chip by pillars and openings. Thus, in this structure, at least one conductive pillar extends a distance or height from the surface of the integrated circuit chip and a barrier surrounds the lower portion of the conductive pillar such that the barrier covers at least some portion of the height of the pillar that is closest to the chip surface. There is at least one opening in the carrier that is large enough to accommodate the conductive pillar and the barrier, and the conductive pillar and the barrier are positioned in opening. A solder is used in the bottom of the opening to connect the conductive pillar to the bottom of the opening. The barrier prevents the solder from contacting the portion of the conductive pillar protected by the barrier. | 2009-06-04 |
| 20090140421 | Semiconductor Device and Method of Making Integrated Passive Devices - A semiconductor device has integrated passive circuit elements. A first substrate is formed on a backside of the semiconductor device. The passive circuit element is formed over the insulating layer. The passive circuit element can be an inductor, capacitor, or resistor. A passivation layer is formed over the passive circuit element. A carrier is attached to the passivation layer. The first substrate is removed. A non-silicon substrate is formed over the insulating layer on the backside of the semiconductor device. The non-silicon substrate is made with glass, molding compound, epoxy, polymer, or polymer composite. An adhesive layer is formed between the non-silicon substrate and insulating layer. A via is formed between the insulating layer and first passivation layer. The carrier is removed. An under bump metallization is formed over the passivation layer in electrical contact with the passive circuit element. A solder bump is formed on the under bump metallization. | 2009-06-04 |
| 20090140422 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE WITH IMPROVED BUMPING OF CHIP BUMPS AND CONTACT PADS AND SEMICONDUCTOR PACKAGE HAVING THE SAME - The present invention relates to a substrate for a semiconductor package and a semiconductor package having the same. A substrate for a semiconductor package includes a substrate body; a contact pad group including a plurality of contact pads parallely arranged at a determined interval on a surface of the substrate body; dummy contact pads arranged at both sides of the contact pad group, respectively; and solder resist patterns covering the substrate body and having openings exposing the dummy contact pads and the contact pad group. When bumping the semiconductor chip having the bumps to the solders arranged on the contact pads formed on the substrate, the bumping defect caused due to different volumes of each solder can be prevented. | 2009-06-04 |
| 20090140423 | UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY - A a metallic adhesion layer is formed on a last level metal plate exposed in an opening of a passivation layer. A Ni—Ti alloy in which the weight percentage of Ti is from about 6.5% to about 30% is deposited by sputtering onto the metallic adhesion layer to form an underbump metallic layer. A wetting layer comprising Cu or Ag or Au is deposited on top of Ni—Ti layer by sputtering. A C4 ball is applied to a surface of the wetting layer for C4 processing. The sputter deposition of the Ni—Ti alloy offers economic and performance advantages relative to known methods in the art since the Ni—Ti alloy in the composition of the present invention is non-magnetic and easy to sputter, and the consumption of the inventive Ni—Ti alloy is limited during C4 processing. Also, Sn in the solder reacts uniformly with both Ni and Ti and the consumption of Ni—Ti by Sn solder is less than that for pure Ni. | 2009-06-04 |
| 20090140424 | WAFER LEVEL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A wafer level semiconductor package includes a semiconductor chip having a circuit part. A bonding pad group is disposed in the semiconductor chip and included in the bonding pad group is a power pad that is electrically connected to the circuit part. An internal circuit pattern is disposed at a side of the bonding pad group. An additional power pad is disposed at a side of the bonding pad group, and the additional power pad is electrically connected to the circuit part. An insulation layer pattern is disposed over the semiconductor chip, and the insulation layer includes openings that expose the power pad, the internal circuit pattern, and the additional power pad. A redistribution is disposed over the insulation layer pattern, and the redistribution is electrically connected to at least two of the power pad, the internal circuit pattern, and the additional power pad. | 2009-06-04 |
| 20090140425 | Chip Package - The present provides the improved structure of a chip package, comprising an electrical contact surface of at least a chip configured with a under fill layer, the first solder mask layer, the first metal layer, dielectric material layer, the second metal layer, the second solder mask layer, and metal ball layer, characterized in the electrical contact surfaces among the first metal layer, the second metal layer, and the chip accomplish the electrical connection by employing the contacts of the surfaces of the conducting layers | 2009-06-04 |
| 20090140426 | FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized. | 2009-06-04 |
| 20090140427 | Metal foil interconnection of electrical devices - An electrical assembly ( | 2009-06-04 |
| 20090140428 | AIR GAP STRUCTURE HAVING PROTECTIVE METAL SILICIDE PADS ON A METAL FEATURE - A hard mask is formed on an interconnect structure comprising a low-k material layer and a metal feature embedded therein. A block polymer is applied to the hard mask layer, self-assembled, and patterned to form a polymeric matrix of a polymeric block component and containing cylindrical holes. The hard mask and the low-k material layer therebelow are etched to form cavities. A conductive material is plated on exposed metallic surfaces including portions of top surfaces of the metal feature to form metal pads. Metal silicide pads are formed by exposure of the metal pads to a silicon containing gas. An etch is performed to enlarge and merge the cavities in the low-k material layer. The metal feature is protected from the etch by the metal silicide pads. An interconnect structure having an air gap and free of defects to surfaces of the metal feature is formed. | 2009-06-04 |
| 20090140429 | Metal interconnection of a semiconductor device and method of manufacturing the same - A method of manufacturing a metal interconnection of a semiconductor device includes forming a base layer with at least one groove, the at least one groove having an open upper portion, forming a first metal layer in the at least one groove, forming a seed metal layer on the first metal layer in the at least one groove, the seed metal layer being only on a bottom surface of the at least one groove, and forming a metal pattern grown from the seed metal layer to fill the at least one grove. | 2009-06-04 |
| 20090140430 | Copper Alloy Sputtering Target and Semiconductor Element Wiring - A first copper alloy sputtering target comprising 0.5 to 4.0 wt % of Al and 0.5 wtppm or less of Si and a second copper alloy sputtering target comprising 0.5 to 4.0 wt % of Sn and 0.5 wtppm or less of Mn are disclosed. The first and/or the second alloy sputtering target can further comprise one or more elements selected from among Sb, Zr, Ti, Cr, Ag, Au, Cd, In and As in a total amount of 1.0 wtppm or less. A semiconductor element wiring formed by the use of the above targets is also disclosed. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics. | 2009-06-04 |
| 20090140431 | HYBRID CONTACT STRUCTURE WITH LOW ASPECT RATIO CONTACTS IN A SEMICONDUCTOR DEVICE - By forming the first metallization layer of a semiconductor device as a dual damascene structure, the contact elements may be formed on the basis of a significantly reduced aspect ratio, thereby enhancing process robustness and also improving electrical performance of the contact structure. | 2009-06-04 |
| 20090140432 | PAD STRUCTURE TO PROVIDE IMPROVED STRESS RELIEF - A semiconductor interconnection comprises a semiconductor device, a substrate adjacent the semiconductor device, and a plurality of spring contacts on the semiconductor device or the substrate. A plurality of solder connections are on the opposite semiconductor device or substrate. Each spring contact comprises a contact surface and a conductive material on the contact surface. Upon assembly of the semiconductor device and the substrate, the conductive material on the plurality of spring contacts makes contact with each of the plurality of solder connections. The conductive material is in a liquid state at manufacturing or operating temperatures of the semiconductor device. Thus, the conductive material could be a solid at room temperature and transition to a liquid state at the semiconductor's manufacturing or operating temperatures. | 2009-06-04 |
| 20090140433 | MEMS chip-to-chip interconnects - A chip-to-chip interconnect system suited for MEMS that do not require low-resistance connections is described. The interconnects may be fabricated simultaneously with MEMS ribbon structures such as are found in MEMS optical modulators. | 2009-06-04 |
| 20090140434 | FLEXIBLE COLUMN DIE INTERCONNECTS AND STRUCTURES INCLUDING SAME - A flexible column interconnect for a microelectronic substrate includes a plurality of conductive columns extending from a bond pad or other conductive terminal in substantially mutually parallel arrangement, providing redundant current paths between the bond pad and a common cap in the form of a contact pad to which they are all joined. The flexibility of the interconnect may be varied by controlling the column dimensions, height, aspect ratio, number of columns, column material and by applying a supporting layer of dielectric material to a controlled depth about the base of the columns. A large number of interconnects may be formed on a wafer, partial wafer, single die, interposer, circuit board, or other substrate. | 2009-06-04 |
| 20090140435 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF PROTOTYPING A SEMICONDUCTOR CHIP - In a semiconductor integrated circuit device comprising a semiconductor chip having a number of conductor layers and a number of via layers between the conductor layers, a routing matrix is provided in a small area of the chip to act as a revision number register. The routing matrix includes a matrix block having, in each metal layer of the chip, conductor tracks, the tracks in each metal layer running in a respective direction different from the direction of the tracks in the adjacent metal layers so that the tracks of each consecutive pair of metal layers cross over each other. In each via layer between consecutive metal layers, the matrix block includes selectively placed vias interconnecting the tracks in the adjacent metal layers on each side of the respective via layer. The tracks in each metal layer comprise source tracks and output tracks, the source tracks being coupled respectively to logic level sources of opposite polarity and the output tracks providing register outputs which carry a high or low logic level depending on their individual connections in the routing matrix block to the supply lines. The arrangement is such that when a change in the primary circuits of the chip is required, a new revision number output can be generated by altering the interconnections of the conductor tracks of the routing matrix only in the respective metal layer or via layer which has been changed in the primary circuits. | 2009-06-04 |
| 20090140436 | METHOD FOR FORMING A VIA IN A SUBSTRATE AND SUBSTRATE WITH A VIA - The present invention relates to a method for forming a via in a substrate and a substrate with a via. The method for forming a via in a substrate includes the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a groove that has a side wall and a bottom wall on the first surface of the substrate; (c) forming a first conductive metal on the side wall and the bottom wall of the groove so as to form a central groove; (d) forming a center insulating material in the central groove; (e) forming an annular groove that surrounds the first conductive metal on the first surface of the substrate; (f) forming a first insulating material in the annular groove; and (g) removing part of the second surface of the substrate to expose the first conductive metal, the center insulating material and the first insulating material. As a result, thicker insulating material can be formed in the via, and the thickness of the insulating material in the via is even. | 2009-06-04 |
| 20090140437 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF - A semiconductor device including an intermediate insulating film formed over a plurality of first conductors over a semiconductor substrate. Contact holes are formed in the intermediate insulating film over the first conductors, and contact plugs are buried in the contact holes, respectively. A plurality of second conductors are formed over the plurality of contact plugs on the intermediate insulating film, respectively, and are electrically connected to the plurality of first conductors via the contact plugs. In certain regions of the semiconductor device, the contact plugs may terminate within the intermediate insulating film, thereby electrically insulating the second conductors from the first conductors. | 2009-06-04 |
| 20090140438 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Wirings each having a side face with a different angle, which is made accurately, in a desired portion over one mother glass substrate are provided without increasing the steps. With the use of a multi-tone mask, a photoresist layer is formed, which has a tapered shape in which the area of a cross section is reduced gradually in a direction away from one mother glass substrate. At the time of forming one wiring, one photomask is used and a metal film is selectively etched, whereby one wiring having a side face, the shape (specifically, an angle with respect to a principal plane of a substrate) of which is different depending on a place, is obtained. | 2009-06-04 |
| 20090140439 | METHOD OF MANUFACTURING A CHIP AND A CHIP STACK - Provided are a chip, a chip stack, and a method of manufacturing the Same. A plurality of chips which each include: at least one pad formed on a wafer; and a metal layer which protrudes up to a predetermined thickness from the bottom of the wafer and is formed in a via hole exposing the bottom of the pad are stacked such that the pad and the metal layer of adjacent chips are bonded. This leads to a simplified manufacturing process, high chip performance and a small footprint for a chip stack. | 2009-06-04 |
| 20090140440 | MULTI-CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME - A multi-chip stack structure and a method for fabricating the same are provided. The method for fabricating a multi-chip stack structure includes disposing a first chip group comprising a plurality of first chips on a chip carrier by using a step-like manner, disposing a second chip on the first chip on top of the first chip group, electrically connecting the first chip group and the second chip to the chip carrier through bonding wires, using film over wire (FOW) to stack a third chip on the first and the second chips with an insulative film provided therebetween, wherein the insulative film covers part of the ends of the bonding wires of the first chip on the top of the first group and at least part of the second chip, and electrically connecting the third chip to the chip carrier through bonding wires, thereby preventing directly disposing on a first chip a second chip having a planar size far smaller than that of the first chip as in the prior art that increases height of the entire structure and increases the wiring bonding difficulty. | 2009-06-04 |
| 20090140441 | Wafer Level Die Integration and Method - In a wafer level chip scale package (WLSCP), a semiconductor die has active circuits and contact pads formed on its active surface. A second semiconductor die is disposed over the first semiconductor die. A first redistribution layer (RDL) electrically connects the first and second semiconductor die. A third semiconductor die is disposed over the second semiconductor die. The second and third semiconductor die are attached with an adhesive. A second RDL electrically connects the first, second, and third semiconductor die. The second RDL can be a bond wire. Passivation layers isolate the RDLs and second and third semiconductor die. A plurality of solder bumps is formed on a surface of the WLSCP. The solder bumps are formed on under bump metallization which electrically connects to the RDLs. The solder bumps electrically connect to the first, second, or third semiconductor die through the first and second RDLs. | 2009-06-04 |
| 20090140442 | Wafer Level Package Integration and Method - In a wafer level chip scale package, a wafer level interconnect structure is formed on a dummy substrate with temperatures in excess of 200° C. First semiconductor die are mounted on the wafer level interconnect structure. The wafer level interconnect structure provides a complete electrical interconnect between the semiconductor die and one or more of the solder bumps according to the function of the semiconductor device. A second semiconductor die can be mounted to the first semiconductor die. A first encapsulant is formed over the semiconductor die. A second encapsulant is formed over the first encapsulant. The dummy substrate is removed. A first UBM is formed in electrical contact with the first conductive layer. Solder bumps are made in electrical contact with the first UBM. A second UBM is formed to electrically connect the semiconductor die to the wafer level interconnect structure. | 2009-06-04 |
| 20090140443 | Microstructure with Enlarged Mass and Electrode Area for Kinetic to Electrical Energy Conversion - A microstructure has a substrate, a fixed electrode having a plurality of fixed fingers fixed to the substrate, a movable electrode having a body ( | 2009-06-04 |
| 20090140444 | Compressed gas system useful for producing light weight drilling fluids - A compressor station having at least one primary compressor and a booster compressor is controlled to conserve energy and air, and to respond quickly to sudden changes in demand for air, by employing a volume bottle to buffer changes in air pressure and by recycling already compressed air from the intake to the output of the booster compressor. The system may be used in air drilling and to provide compressed air for generating low density drilling fluid on site by injecting microbubbles into a base drilling fluid. Two different methods of generating microbubbles are illustrated. The primary and booster compressors are kept in a state of readiness during drill pipe connection time, providing for a rapid resumption of pressure and air flow after connection is completed. The system can utilize gases other than air. | 2009-06-04 |
| 20090140445 | High Throughput Imprint Based on Contact Line Motion Tracking Control - Systems and methods for controlling velocity of a contact line and height profile between a template and a substrate during imprinting of polymerizable material are described. | 2009-06-04 |
| 20090140446 | Molding machine control apparatus and molding method for molding machine - An object is to provide a molding machine control apparatus which can reduce power consumption when operation of a molding machine is continued in a state where a post-process machine stops and which can prevent deterioration in the quantity of molded products in subsequently molding, as well as a molding method for a molding machine. A molding machine control apparatus includes an injection apparatus having an injection nozzle; a mold apparatus; a mold-clamping apparatus; a plasticization-moving apparatus; mode-setting processing means which sets, on the basis of a state of a post-process machine, one of a normal mode for operating the molding machine in accordance with a normal molding cycle and a cycle extension mode for operating the molding machine in accordance with a molding cycle longer than the normal molding cycle; and cycle-extension processing means which extends the molding cycle when the cycle extension mode is set by increasing a time between start of the plasticization retreat and completion of the plasticization advancement, from that in the case where the normal mode is set. | 2009-06-04 |
| 20090140447 | Expansion Injection Molding Process And Mold For Expansion Injection Molding - To provide an expansion injection molding process, which is freed from the occurrence of swirl marks on the surface of a molded article and by which foamed injection moldings having good appearance can be produced in a short molding cycle and at a low cost; and a mold for expansion injection molding. | 2009-06-04 |
| 20090140448 | DEFOAMING METHOD, DEFOAMING DEVICE AND MANUFACTURING METHOD OF TRANSFER MOLD - A defoaming method for removing air bubbles from a curable resin material and a contact portion of the resin material with an irregular structure of a flat metallic mold. The mold includes a fine structural region having a fine irregular structure and a flat region in the periphery of the fine structural region. The curable resin material is applied to the irregular structure of the fine structural region, filling the irregular structure with the resin material. | 2009-06-04 |
| 20090140449 | Process for Producing a Hyper-Elastic, High Strength Dilatation Balloon made from Multi-Block Copolymers - A self-wrapping dilatation balloon comprising a multiblock copolymer having high elasticity and elastic recovery from nominal strains greater than about 30% is described. Also described herein, is a polymeric extrudate for making a dilatation balloon comprising a multiblock copolymer having tensile strength in the range of about 50 MPa to about 450 MPa, strain at break in the range of about 50% to about 600% and substantially complete elastic recovery from nominal strains of at least about 30%. The extrudate has phase-separated microdomains that are macroscopically aligned in parallel, perpendicular, transverse or a combination thereof. Also described herein is a process for producing a polymeric extrudate for use as a dilatation balloon. The process comprises extruding a multiblock copolymer mixture or composition to form an extrudate. The extruding is done such that the extrudate has phase-separated microdomains that are macroscopically aligned in parallel, perpendicular, transverse or a combination thereof. After extrusion, the process optionally comprises the steps of drawing and coagulating the extrudate. | 2009-06-04 |
| 20090140450 | Fabrics Made from a Blend of Polypyridobisimidazole/Flame-Retardant Treated Cellulose Fibers and Articles Made Therefrom - The invention concerns flame retardant fabrics made from mixtures of polypyridobisimidazole fibers with cellulose fibers that have been treated to make them flame retardant and articles made therefrom. | 2009-06-04 |
| 20090140451 | MATERIAL PLACEMENT METHOD AND APPARATUS - A roller assembly for bidirectionally dispensing and compacting a strip of a material onto a surface without requiring the roller assembly to rotate 180° to dispense the material in the reverse direction. The roller assembly comprises a first guide element, a second guide element, a third guide element, and a compacting roller. When the first guide element is in a first position, the strip of the material is fed to the second guide element. When the first guide element is in a second position, the strip of the material is fed to the third guide element. The compacting roller is malleable and substantially crowned around an outer circumferential surface of the compacting roller to provide even compaction to the strip of the material. | 2009-06-04 |
| 20090140452 | Ceramic Precursor Batch Composition And Method Of Increasing Ceramic Precursor Batch Extrusion Rate - A ceramic precursor batch composition comprising inorganic ceramic-forming ingredients, a hydrophobically modified cellulose ether binder having a molecular weight less than or equal to about 300,000 g/mole and an aqueous solvent is provided. The ceramic precursor batch composition has a ratio of binder to aqueous solvent of less than about 0.32. The ceramic precursor batch composition may be used to increase the rate of extrusion of the composition. A method for increasing a rate of extrusion of a ceramic precursor batch composition is also disclosed. | 2009-06-04 |
| 20090140453 | Methods and apparatus for plugging honeycomb structures - A plugging apparatus for plugging channels in a honeycomb structure used to form a particulate filter. The apparatus includes an extrusion apparatus that holds plugging material and that has an opening through which the plugging material is extruded. An extrusion plate having first through holes that correspond in location to a subset of honeycomb channels is arranged adjacent the opening. An annular flow plate is operatively arranged face-to-face with the extrusion plate. The annular flow plate has second through holes corresponding in location to the first through holes but that are smaller to compensate for a radial variation in the extrusion rate when plugging the channels in the honeycomb structure. The plugging apparatus is thus able to fill select channel ends with same-size plugs, which leads to a better-performing filter. | 2009-06-04 |
| 20090140454 | BELT-TYPE APPARATUS FOR CONTINUOUS PLATE FORMATION AND METHOD OF CONTINUOUS PLATE FORMATION WITH BELT - Disclosed is an apparatus for continuous plate formation using belts, in which a polymerizable raw material is fed to one end of a space surrounded by opposed surfaces of two endless belts | 2009-06-04 |
| 20090140455 | METHOD OF PRODUCING REINFORCED, FORMED FABRICS - The invention relates to a method of producing reinforced, formed fabrics, consisting in producing a continuous fabric alternated with a membrane ( | 2009-06-04 |
| 20090140456 | Writing Instrument With Rotatable Handles and Method for Making the Same - A writing instrument comprising a writing utensil and associated handles interconnected to each other to allow a user to selectively position the writing utensil in either an extended position of use or a closed position of storage, as well as a variety of positions there between. In an open position, the handles may be positioned adjacent one another with the writing utensil extended longitudinally away from the adjacent handles in a position of use. In a closed position, the handles may be positioned adjacent to the longitudinal length of the writing utensil, with the writing utensil at least partially enclosed between the handles in a position of storage. The rotation of the handles about the writing utensil allows a user to manipulate the handles in a variety of ways, similar to that of a “butterfly knife” or similar device comprising balisong style openings. In one aspect of the invention, the writing instrument may be used to perform moves or tricks as a novelty device to provide entertainment and enjoyment to a user. A method of manufacturing the writing instrument by injection molding is also disclosed. | 2009-06-04 |
| 20090140457 | APPARATUS AND METHOD FOR IN-MOLD-DECORATION - An apparatus for in-mold-decoration includes a mold, a foil, and a press member. The mold includes a female mold and a male mold with a protrusion protruding therefrom towards the female mold. The foil is applied to a surface of the female mold facing the male mold and corresponding to a surface of a molded product to be decorated. The press member is positioned between the male mold and the female mold and the foil is further extended to be on a surface of the press member to be urged thereby to cover an end of the molding space as the press member is positioned to cooperate with the male and female molds to define a molding space thereamong, thereby ensuring the foil with a printed layer thereon completely and uniformly covers the surface of the molded product to be decorated, even unto its very edges. | 2009-06-04 |
| 20090140458 | POROUS TEMPLATE AND IMPRINTING STACK FOR NANO-IMPRINT LITHOGRAPHY - An imprint lithography template or imprinting stack includes a porous material defining a multiplicity of pores with an average pore size of at least about 0.4 nm. A porosity of the porous material is at least about 10%. The porous template, the porous imprinting stack, or both may be used in an imprint lithography process to facilitate diffusion of gas trapped between the template and the imprinting stack into the template, the imprinting stack or both, such that polymerizable material between the imprinting stack and the template rapidly forms a substantially continuous layer between the imprinting stack and the template. | 2009-06-04 |
| 20090140459 | METHOD FOR PRODUCING A SINTERED BODY - This invention relates to a method for forming a three dimensional sintered body ( | 2009-06-04 |
| 20090140460 | Hinged pointer pottery sizing guide - In embodiments of the present invention improved capabilities are described for reproducing the size of a first ceramic ware in the making of a second ceramic ware. In embodiments, the first ceramic ware may be received on a pottery wheel. A hinged pointer may then be presented to a position on the first ceramic ware, where the hinged pointer may include a pointer connected to a supporting structure by way of a hinge. The first ceramic ware may then be removed from the pottery wheel, and material for the making of the second ceramic ware may be placed on the pottery wheel. The process of making the second ceramic ware may then progress, where the making includes sizing the second ceramic ware to the position of the hinged pointer. | 2009-06-04 |
| 20090140461 | MOLDING APPARATUS AND METHOD OF FORMING UNDERCUTS - A molding apparatus can include a primary mold, a stripper, and a swinging member. The swinging member can comprise a molding surface defining an undercut portion of a molded item. The swinging member can directly contact or attached to the stripper and the primary mold. To facilitate removal of a molded item, the swinging member can withdraw through a hole in the primary mold as a direct result of a motion of the stripper to pull the molded item off the primary mold. The molded item can then be easily removed. | 2009-06-04 |
| 20090140462 | Apparatuses for Forming Objects With Undercut Portions - An apparatus for forming an object from a dose of plastics comprises a die arrangement provided with a cavity for receiving said dose and with at least two parts that are reciprocally movable for shaping an undercut portion of said object, at least one fluid for applying a clamping force so as to keep said at least two parts in contact; said at least one fluid is such as to increase discontinuously said clamping force from an initial force that is applicable when said dose is substantially contained in said cavity to a final force applicable when said at least two parts shape said undercut portion. | 2009-06-04 |
| 20090140463 | GOLF BALL MIXING AND DISPENSING PROCESS - The present invention provides an improved process for mixing castable polyurethanes and polyureas and for prolonging the dispensing time for dispensing them into a golf ball mold for application to a golf ball sub-assembly. A nozzle framework includes support housing heaters and heater adaptors for each dispensing port to delay the onset of drool and improve cut off in the dispensing tubes. The combination of fluorinated dispensing ports, the heating of the polyureas or polyurethanes, and inclusion of a capillary orifice in each dispensing port significantly prolongs the time before the advent of drool is detected. | 2009-06-04 |
| 20090140464 | METHOD FOR CURING A BINDER ON INSULATION FIBERS - The invention relates to curing a binder on fibrous insulation wherein, heated gas flows as a ratio of, an upward flow into the fibrous insulation, and a downward flow into the fibrous insulation, to heat the binder to its curing temperature; and the binder is cooled, thereby curing at least a portion of the binder to a thermoset state. When a remainder of the binder remains uncured, another stage of heating the binder with a ratio of heated gas followed by cooling, will cure the remainder of the binder. | 2009-06-04 |
| 20090140465 | Gate Insert - Disclosed, amongst other things, is a gate insert of an injection mold that includes a base member. The base member defines a nozzle interface for receiving, in use, a nozzle of a melt distribution system that is heated, in use, by a heater, and a gate, the gate configured to fluidly link, in use, a melt channel of the nozzle with a molding cavity. The gate insert further includes a thermal regulator associated with the base member, the thermal regulator includes a direct energy conversion device that is capable of heating and cooling, wherein the thermal regulator is controllably operable, in use, to control the temperature of the gate. | 2009-06-04 |
| 20090140466 | OPTICAL SHAPING APPARATUS AND OPTICAL SHAPING METHOD - The cross-sectional shape data of a three-dimensional model is divided according to work small areas obtained by dividing a work entire area where optical shaping work is performed into a plurality of areas, and work small area data which is cross-sectional shape data corresponding to said work small areas is generated. Also, the work small area data is enlarged with offset width based on the contracting ratio of a light hardening resin, and areas, which are wider than the work small areas on the surface of the light hardening resin by the offset width, are subjected to one-shot exposure based on the enlarged work small area data to form a hardening layer for each of the work small areas. The present invention can be applied to, for example, an optical shaping apparatus. | 2009-06-04 |
| 20090140467 | Method of Plugging Honeycomb Bodies - A method of making a plugged honeycomb structure includes providing a honeycomb structure having a first end face and a second end face and an array of cells extending between the first end face and the second end face. The method includes bringing a first mask into contact with the first end face and injecting a plugging medium through the first flexible mask into at least some of the cells at the first end face. The method further includes removing the mask from the first end face, followed by contacting the first end face with a heated first solid body, wherein the plugging medium in the first end face is heated. | 2009-06-04 |
| 20090140468 | PROCESS FOR PRODUCING MOLD - To provide a process for producing a hollow cylindrical or solid cylindrical mold having a seamless patterned layer comprising a fluoropolymer. | 2009-06-04 |
| 20090140469 | ONE-PIECE BLOW MOLD HALVES FOR MOLDING A CONTAINER - A blow mold is disclosed. The mold comprises a pair of mold halves having an operative configuration wherein said mold halves together define a cavity for a container. The container has a main body and a characteristic selected from the group of characteristics consisting of: a push-up base; an integral finish; and an embossed or a debossed feature. Each of the pair of mold halves has a first portion and a second portion formed integrally with the first portion. When the pair of mold halves is in the operative configuration, the first portions collectively define the main body and the second portions collectively define the characteristic. The blow mold can be used for prototyping, and can also be used for production. | 2009-06-04 |
| 20090140470 | Article of Footwear of Nonwoven Material and Method of Manufacturing Same - A method of forming a portion of an article of footwear includes the steps of providing a last having an exterior surface, extruding a plurality of polymeric fibers, projecting a stream of the extruded polymeric fibers onto the last to form a mat having the shape of the exterior of the last, and subjecting the mat to heat and pressure in a mold. | 2009-06-04 |
| 20090140471 | Method Of Manufacturing A Ceramic Honeycomb Structure - A method of manufacturing a honeycomb structure is disclosed wherein a green honeycomb body having a first contour is differentially altered such that the green honeycomb body has a second contour which is wider at a first end than at a second end. In one aspect, the altering is accomplished by removing a part of the green honeycomb body, such as with a removal tool. In another aspect, the altering is accomplished by exposing different regions of the honeycomb body to different drying environments. | 2009-06-04 |
| 20090140472 | REDUCTION APPARATUS, REDUCTION APPARATUS MANUFACTURE METHOD, AND VACUUM SMELTING REDUCTION FURNACE USING THE SAME - The invention discloses a reduction apparatus having a main body made of silicon carbide-based material and collectively formed by a top portion, a bottom portion, and a side portion, wherein the bottom portion includes a slanted plane, and the main body has an inlet and a metallic vapor exit provided near the top portion and an outlet provided near the lowest end of the slanted bottom portion; an inlet closure connected with the inlet; an outlet closure connected with the outlet; and a metal collector or a condenser connected with the metallic vapor exit. The invention solved problems found in conventional reduction retorts, including: small capacity, low metal output, inconvenience in charging reactant material and discharging spent residue, and heavy workload for workers. The invention also shortened the time for reduction reaction, increased production efficiency and output of the reduction furnace, and reduced production cost. The invention can be used in production of metal such as magnesium, strontium, zinc, and beryllium by vacuum smelting reduction process. | 2009-06-04 |
| 20090140473 | REFRACTORY CRUCIBLES CAPABLE OF MANAGING THERMAL STRESS AND SUITABLE FOR MELTING HIGHLY REACTIVE ALLOYS - Refractory crucibles capable of managing thermal stress and suitable for melting highly reactive alloys having a facecoat, a backing, and at least one retaining ring applied about at least a portion of the backing of the crucible, the retaining ring comprising a composition selected from the group consisting of conductive materials, non-conductive materials, and combinations thereof. | 2009-06-04 |
| 20090140474 | INTEGRATED CROSSOVER VALVE - An air suspension includes a crossover valve in fluid communication with a manifold, a first set of springs in fluid communication with the manifold through a first set of valves, and a second set of springs in fluid communication with the manifold through a second set of valves. The crossover valve is movable between an open position to allow fluid communication to each of the first and the second sets of springs and a closed position that separates the first set of springs from the second set of springs. | 2009-06-04 |
| 20090140475 | Hydraulic dampers with pressure regulated control valve - A suspension damper includes a housing bounding a main chamber. A hydraulic fluid is disposed within the main chamber. A piston rod is selectively movable between an advanced position wherein a portion of the piston rod is advanced into the main chamber and a retracted position wherein the portion of the piston rod is retracted from the main chamber, wherein as the piston rod is moved a fluid pressure of the hydraulic fluid within the main chamber progressively increases and a portion of the hydraulic fluid passes through a passage within the housing. A control valve is at least partially disposed within the main chamber, the control valve being moved by the fluid pressure of the hydraulic fluid so as to progressively restrict the flow of the hydraulic fluid through the passage as the fluid pressure of the hydraulic fluid within the main chamber progressively increases. | 2009-06-04 |
| 20090140476 | Fluid filled type vibration damping device - A fluid filled type vibration damping device including: a partition member having a communication passage connecting a pressure receiving and equilibrium chambers; an obstructing rubber elastic plate juxtaposed against the communication passage from a pressure receiving chamber side, adapted to obstruct the communication passage, and arranged to be exposed to pressure of the pressure receiving and the equilibrium chamber at both faces; and a constraining member provided for retaining an outer peripheral section of the obstructing rubber elastic plate in contact against the partition member at multiple locations. The constraining member provides an opening/closing control member operated to induce the obstructing rubber elastic plate to push against the partition member and close off the communication passage, and to induce elastic deformation of the obstructing rubber elastic plate to be separated from the partition member. | 2009-06-04 |
| 20090140477 | Fluid filled type vibration damping device - A fluid filled type vibration damping device including: a partition member having a communication passage connecting a pressure receiving and equilibrium chambers; an obstructing rubber elastic plate juxtaposed against the communication passage from an equilibrium chamber side, adapted to obstruct the communication passage, and arranged to be exposed to pressure of the pressure receiving and the equilibrium chamber at both faces; and a constraining member provided for retaining an outer peripheral section of the obstructing rubber elastic plate in contact against the partition member at multiple locations. The constraining member provides an opening/closing control member operated to induce the obstructing rubber elastic plate to push against the partition member and close off the communication passage, and to induce elastic deformation of the obstructing rubber elastic plate to be separated from the partition member. | 2009-06-04 |
| 20090140478 | Stop element for hydraulic bearing and hydraulic bushing equipped therewith - The invention relates to a stop element ( | 2009-06-04 |
| 20090140479 | VARIABLE COMPLIANCE SUSPENSION BUSHING - A variable compliance bushing including means to selectively vary the stiffness of the connection between the parts joined by the bushing and especially suitable in vehicle suspension systems where the stiffness of the connection can be varied depending on road conditions or the like to provide better handling and rider comfort. | 2009-06-04 |
| 20090140480 | CLAMP - A clamp adapted to be removably fixed to a further object. The clamp includes first and second clamp members, each being configured to apply a clamping force to the further object to which the clamp is removably fixed. One clamp actuator is adapted to drive movement of both the first and second clamp members with respect to each other along respective first and second axes. The first axis intersects the second axis. | 2009-06-04 |
| 20090140481 | SOLID SURFACE CLAMP HAVING MULTIPLE CLAMPING JAWS ON A SINGLE ELONGATED MEMBER - A solid surface clamp is provided. The solid surface clamp has a top jaw and a bottom jaw. A connecting rod is attached to one of the jaws, and slideably extends through the other jaw. Alignment surfaces may be incorporated into the jaws to assist in accurately positioning the material to be laminated. A compression device is connected to the portion of the connecting rod that extends through the jaw. A shroud shields the compression device, thereby protecting the compression device from contamination by the laminating adhesive. An elongated stiffening member may be used to apply the clamping force over a longer surface, allowing for greater spacing between clamps and extended regions of even clamping pressure. | 2009-06-04 |
| 20090140482 | FLEXIBLE HEADER SYSTEM FOR MACHINING WORKPIECES - A manufacturing system includes a configurable positioning apparatus and machining system for processing a workpiece retained by the positioning apparatus. The positioning apparatus has different configurations for retaining different types of workpieces, such as panels, fuselages, airfoil skins, and engine housings. The positioning apparatus includes a first support rail and a second support rail spaced apart from the first support rail. The first and second support rails support a plurality of stackable headers that cooperate to position the workpiece. The headers have adjustable heights along their lengths in order to accommodate the shape of the workpiece. | 2009-06-04 |
| 20090140483 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS PROVIDED WITH THE SAME - When a sheet bundle is being conveyed by any one pair of plural pairs of rollers independently movable toward and away from the bundle sheet, before the bound portion of the sheet bundle passes the pair of rollers, the pair of rollers on the downstream side nearest to the bound portion are separated from the sheet bundle, and the pairs of rollers more downstream than that pair convey the sheet bundle. Thereby, it happens less often that the pairs of rollers gather the air collected between adjacent ones of the sheets of the sheet bundle to the bound portion to thereby cause a slack to the sheets, and the occurrence of wrinkles or twists in the sheet bundle can be reduced. Also, the pair of rollers are separated from the sheet bundle before the bound portion passes the pair of rollers, whereby it happens less often that the pair of rollers are damaged by the bound portion, and the sheet bundle can be conveyed smoothly. | 2009-06-04 |
| 20090140484 | SHEET FEED DEVICES AND IMAGE RECORDING APPARATUS COMPRISING SUCH SHEET FEED DEVICES - A sheet feed device includes a first tray comprising a first plate configured to receive a first plurality of sheets thereon, in which the first tray includes a support, and a second tray positioned on the first tray. The second tray includes a first and a second side portion, and a second plate configured to receive a second plurality of sheets thereon. The device also includes a feed roller configured to selectively feed the sheets in a sheet feed direction. The support is configured to selectively support the second tray at a retracted position and a sheet feed position at which the feed roller is configured to selectively feed the first plurality of sheets and the second plurality of sheets, respectively. Moreover, a shortest distance between an upper surface of the first plate and a lower surface of the second plate when the second tray is in the sheet feed position is less than a shortest distance in the retracted position. | 2009-06-04 |
| 20090140485 | RECORDING MATERIAL GUIDING DEVICE AND RECORDING APPARATUS - In a recording material guiding device, a second guide member is comprised of a hopper swinging surface, an edge guide member including a second side end guide member, and a liftup preventing guide. The hopper swinging surface is engaged in an opening provided in a side surface of a reference end guide serving as a first guide member. The second guide member can be slid in a main scanning direction with respect to the reference end guide (first guide member). During recording, a gap can be formed between the second side end guide member and a side end of the recording paper by sliding the second side end guide member from a first position to a second position, so that frictional contact can be prevented at the side end of the recording paper on the second side end guide member side. | 2009-06-04 |
| 20090140486 | SHEET CONVEYING DEVICE AND IMAGE FORMING APPARATUS - A spring is bridged between a pair of press levers, and a pair of driven rollers is pressurized uniformly, so that clamping and conveying force of the sheet of paper P on the front side and rear side by conveying rollers and the driven rollers is made equal such as Pf=Pr, the sheet of paper P are prevented from being skewed, while the sheet of paper P are clamped and conveyed by a conveying device, and the good conveying of the sheet of paper P is improved, thus the image quality is improved. | 2009-06-04 |
| 20090140487 | OPTION-TYPE PAPER FEEDING DEVICE - The invention provides an option-type paper feeding device that can contribute to enhancing printing operation efficiency while taking advantage of variable printing speed in a printing apparatus. A high-volume paper feeding device includes: a paper stacking section; a paper feeding mechanism; and an intermediate transport section connected to a paper feeding section of a printing apparatus such as a stencil printing apparatus. The intermediate transport section includes: a first paper transport means; and a second paper transport means provided downstream of the first paper transport means, and an inkjet printing section is provided above the first paper transport means. The transport speed of the first paper transport means is fixed to a speed suitable for printing by the inkjet printing section, while the transport speed of the second paper transport means is variable. The transport speed of the second paper transport means is adjusted by control means (not shown in drawings) in accordance with the printing speed of a printing apparatus connected to the high-volume paper feeding device. | 2009-06-04 |
| 20090140488 | DOCUMENT PROCESSING MACHINE - A document processing machine including a document feeder including a support intended to receive a stack of documents, and a unit for extracting documents from the stack of documents and transferring the extracted documents onto a horizontal support of a downstream processing unit, wherein the support of the document feeder is inclined relative to the horizontal is described. | 2009-06-04 |
| 20090140489 | MEASURING DEVICE, SHEET-SHAPED MATERIAL TRANSPORTING DEVICE, IMAGE FORMATION DEVICE AND MEASURING METHOD - A measuring device, wherein a feed-out member feeds out an uppermost one of plural sheet-shaped materials stacked on a base by rotating in contact with the uppermost sheet-shaped material, has a detector that detects a force imparted to the base and the sheet-shaped materials not in contact with the feed-out member, the force being generated by feeding-out the uppermost sheet-shaped material. | 2009-06-04 |
| 20090140490 | DOCUMENT CONVEYING DEVICES AND IMAGE READING DEVICES COMPRISING SUCH DOCUMENT CONVEYING DEVICES - A document conveying device includes a conveying path and a feed unit. The feed unit includes a tray including a document positioning surface configured to receive documents thereon, in which the document positioning surface has a hole formed therethrough. The feed unit also includes a separation roller which is rotatably supported by a drive shaft extending in a direction orthogonal to a document conveying direction and is configured to contact an uppermost document of the documents and to separate and convey the uppermost document. The separation roller includes a first end and a second end opposite the first end. Moreover, the feed unit includes a document sensor including a detection portion configured to detect the documents and to selectively move between a first position in which the detection portion projects from the document positioning surface via the hole and a second position in which the detection portion is retracted from the document positioning surface via the hole. In addition, the feed unit includes a casing pivotably mounted on the drive shaft. The casing includes a plate extending adjacent to the first end of the separation roller in the document conveying direction, and the first end of the separation roller and the detection portion are positioned closer to the second end of the separation roller than the plate of the casing. | 2009-06-04 |
| 20090140491 | Sheet Transporting apparatus - A sheet transporting apparatus that can realize a jam disposal mechanism with simple structure and that can achieve size reduction has a manual operation unit that is fitted coaxially with a roller shaft of an upstream-side transport roller or with a roller shaft of a downstream-side transport roller and that, when rotated in a state where drive motors are stationary, makes the upstream-side transport roller shaft and the downstream-side transport roller shaft rotate. | 2009-06-04 |
| 20090140492 | Card reading shoe with card stop feature and systems utilizing the same - A semi-automatic gaming table system is disclosed, comprising; a gaming table surface; at least one playing card delivery device, the playing card delivery device comprising a card storage area, an internal processor, a card moving system, a delivery end and a card imaging system; a plurality of electronic player interfaces mounted in the gaming table surface that communicate with a game controller; a game controller, the game controller programmed to communicate with the internal processor and the player interfaces, to detect at least one condition and respond by instructing the card handling system to stop delivering cards to the delivery end. A method of monitoring play of a casino card game is disclosed, the method comprising: a player electronically making a wager on a semi-automatic gaming system; a dealer dealing physical cards to each player from a card handling device; automatically sensing a rank and/or suit of cards being delivered; automatically determining a number of cards dealt to each player; and when a predetermined condition is sensed, directing a card handling device to cease moving cards to a delivery end, wherein one card is available for removal until the condition is cleared. | 2009-06-04 |
| 20090140493 | LIQUID PROJECTILE LAUNCHING AND DETECTING DEVICES AND SET THEREOF - A set comprises at least one first device comprising at least one liquid reservoir and at least one liquid projectile launching mechanism. When, actuated by the user, the liquid projectile launching mechanism draws a portion of the liquid from the reservoir and launches this portion of liquid outward from the first device. The first device may be designed to be carried by a user or otherwise supported by a user's body. The set further comprises at least one second device comprising a liquid reactive material. | 2009-06-04 |
| 20090140494 | Flow Inducing Ring For a Mechanical Seal - A flow inducing ring for a mechanical seal includes a body portion having a first edge face and a second edge face, and at least one first groove extending both axially and circumferentially in one direction across the body portion from the first edge face to the second edge face. At least one second groove extends both axially and circumferentially in an opposite direction across the body portion from the first edge face to the second edge face. Each of the first groove and the second groove includes an entry portion, configured to draw a barrier fluid into the groove from the first edge face, and an exit portion, that is configured to expel barrier fluid from the groove to the second edge face and to impede the drawing of barrier fluid into the groove from the second edge face. | 2009-06-04 |
| 20090140495 | Shaft Seal - A shaft seal which is in particular suitable for vacuum pumps, such as screw pumps, comprises an inner sealing ring ( | 2009-06-04 |
| 20090140496 | Sealing Device - For reliable assembling, a sealing device has an oil seal ( | 2009-06-04 |
| 20090140497 | FLEXIBLE SEAL FOR GAS TURBINE ENGINE SYSTEM - A gas turbine engine system includes an airframe support, a gas turbine engine mounted to the airframe support, a nozzle exhaust mounted to the airframe support, and a flexible annular seal having a first end that is attached to the gas turbine engine and a second end that is attached to an exhaust nozzle. The flexible annular seal may include a flexible annular wall that permits relative deflection between the gas turbine engine and the exhaust nozzle to facilitate the reduction of undesirable load transfer. | 2009-06-04 |
| 20090140498 | Sealing Device - To avoid strict control of flatness of a pressing portion, while keeping stability, in a sealing device comprising a metal ring and a seal portion, a metal ring ( | 2009-06-04 |
| 20090140499 | GASKETS FOR PROVIDING ENVIRONMENTAL SEALING AND/OR ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING - A gasket generally includes upper and lower members and first and second oppositely-disposed lateral members. The first and second oppositely-disposed lateral members connect the lower member to the upper member such that a spaced distance separates the lower member's inner surface from the upper member's inner surface. The first and second lateral members, lower member, and lower member may collectively define a generally trapezoidal profile. | 2009-06-04 |
| 20090140500 | Tool-Holding Chuck for Equipping a Rotating Machine - The invention concerns a mandrel comprising a body ( | 2009-06-04 |
| 20090140501 | Hydraulic System for a Vehicle Suspension - A suspension system for a vehicle body and at least two forward and two rearward wheel assemblies. The suspension system has a hydraulic system including at least one front left, front right, rear left and rear right wheel rams ( | 2009-06-04 |
| 20090140502 | STEERING SYSTEM - The present invention improves response characteristics in turning traveling of a vehicle while traveling stability at the time of turning is kept. The present invention provides a system in which toe angles of left and right rear wheels are controlled based on a steering angular velocity, not a steering angle of a steering. In a steering system in which toe angles of left and right rear wheels are controlled independently, a steering angular velocity is calculated from a steering angle, and toe angle changers are controlled to tilt the toe angle of the right rear wheel to the left when the steering angular velocity is on the left side, and is controlled to tilt the toe angle of the left rear wheel to the left when the steering angular velocity is on the right side. | 2009-06-04 |
| 20090140503 | Skibob and Method for Riding a Chairlift - Skibobs are disclosed having features for conveying the skibob with rider on a moving chairlift while the rider remains mounted on the seat of the skibob. The frame and suspension are configured for elevating the underside of the skibob seat above the level of the chairlift bench during loading, so that the chairlift bench, while moving forward from behind the rider, can pick up the skibob, rider and all, and carry the mounted rider up the ski slope without falling. As the undercarriage of the skibob is lifted off the snow, the rider is deposited on the chairlift bench so that the seat of the skibob is secured in place by the weight of the rider on the seat. During offloading, the skibob is nonetheless readily disengaged from the chairlift bench with an active boost from the suspension and optional spring-loaded seat as the undercarriage contacts the offloading platform, permitting the rider to ski away from the chairlift without dismounting the skibob, thus improving ease of use for riders with limits in physical capacity. These and other features of the invention are a benefit to disabled persons in gaining access to the ski slopes. | 2009-06-04 |
| 20090140504 | SHOPPING BAG WITH DETACHABLE WHEEL CHASSIS - The present invention relates to a shopping bag with a detachable wheel chassis. Said shopping bag comprises a bag body having bag handles and receiving portion on its bottom; and a wheel chassis connected with the shopping bag body in an inserting manner, which includes a pair of wheels and a shaft on two ends of which the wheels are respectively fitted by means of fixing elements and on which a supporting assembly including a supporting rod, two supporting members and a bracket is provided, and an inserting element is also provided wherein the inserting element can be inserted into the receiving portion of the bag body. Such a shopping bag has the advantages of simple structure producible in various sizes, ease of use, force saving and easily marketed. | 2009-06-04 |
