| 22nd week of 2011 patent applcation highlights part 14 |
| Patent application number | Title | Published |
|---|
| 20110127636 | INTEGRATED PASSIVE DEVICE ASSEMBLY - There is provided an integrated passive device assembly including: a substrate having a wiring pattern disposed therein; a mounting part disposed on an upper surface of the substrate, formed of an insulating material, and having an integrated passive device mounted on an upper surface thereof; a conductive pattern disposed inside the mounting part; and a connecting part disposed on the substrate and electrically connected to the integrated passive device. The connecting part and the conductive pattern are electrically connected to the wiring pattern. | 2011-06-02 |
| 20110127637 | Nanopillar E-Fuse Structure and Process - Techniques for incorporating nanotechnology into electronic fuse (e-fuse) designs are provided. In one aspect, an e-fuse structure is provided. The e-fuse structure includes a first electrode; a dielectric layer on the first electrode having a plurality of nanochannels therein; an array of metal silicide nanopillars that fill the nanochannels in the dielectric layer, each nanopillar in the array serving as an e-fuse element; and a second electrode in contact with the array of metal silicide nanopillars opposite the first electrode. Methods for fabricating the e-fuse structure are also provided as are semiconductor devices incorporating the e-fuse structure. | 2011-06-02 |
| 20110127638 | COMPLEMENTARY DOPING METHODS AND DEVICES FABRICATED THEREFROM - Improved complementary doping methods are described herein. The complementary doping methods generally involve inducing a first and second chemical reaction in at least a first and second portion, respectively, of a dopant source, which has been disposed on a thin film of a semiconductor or semimetal material. The chemical reactions result in the introduction of an n-type dopant, a p-type dopant, or both from the dopant source to each of the first and second portions of the thin film of the semiconductor or semimetal. Ultimately, the methods produce at least one n-type and at least one p-type region in the thin film of the semiconductor or semimetal. | 2011-06-02 |
| 20110127639 | SEMICONDUCTOR NANOSTRUCTURE - The present disclosure relates to a semiconductor nanostructure. The semiconductor nanostructure includes a substrate and at least one ridge. The substrate includes a first crystal plane and a second crystal plane perpendicular to the first crystal plane. The at least one ridge extends from the first crystal plane along a crystallographic orientation of the second crystal plane. A width of cross section at a position of half the height of the at least one ridge is less than 17 nm. The semiconductor nanostructure is a patterned structure which can lead to generate a quantum confinement effect, such that the impurity scattering phenomenon is reduced. | 2011-06-02 |
| 20110127640 | STIFFENING LAYERS FOR THE RELAXATION OF STRAINED LAYERS - The present invention relates to a method for relaxing a strained material layer by providing a strained material layer and a low-viscosity layer formed on a first face of the strained material layer; forming a stiffening layer on at least one part of a second face of the strained material layer opposite to the first face thereby forming a multilayer stack; and subjecting the multilayer stack to a heat treatment thereby at least partially relaxing the strained material layer. | 2011-06-02 |
| 20110127641 | SELF-ORGANIZED PIN-TYPE NANOSTRUCTURES, AND PRODUCTION THEREOF ON SILICON - By means of an RIE etch process for silicon ( | 2011-06-02 |
| 20110127642 | PACKAGE INCLUDING AT LEAST ONE TOPOLOGICAL FEATURE ON AN ENCAPSULANT MATERIAL TO RESIST OUT-OF-PLANE DEFORMATION - Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed. | 2011-06-02 |
| 20110127643 | METHOD AND APPARATUS FOR CONFORMABLE POLISHING - A multi-station polish system and process for polishing thin, flat (planar) and rigid workpieces. Workpieces are conveyed through multiple polishing stations that include a bulk material removal belt polishing station and finishing rotary polishing station. The bulk of the material is relatively quickly removed at the bulk removal station using a conformable abrasive belt and the workpiece surface is then polished to the desired finish at the finishing station using a conformable annular rotary polishing pad. | 2011-06-02 |
| 20110127644 | WAFER AND METHOD FOR FORMING THE SAME - A wafer and a method for forming the same are disclosed. The wafer forming method can separate respective chips from others by performing a Deep Reactive Ion Etching (DRIE) process on a wafer including a plurality of chips. The wafer includes a plurality of chips configured to be arranged in row and column directions on the wafer, a scribe region configured to be formed among the plurality of chips so as to separate each chip, and an alignment key pattern configured to be arranged on the plurality of chips. | 2011-06-02 |
| 20110127645 | WAFER AND METHOD FOR FORMING THE SAME - A wafer and a method for forming the same are disclosed. The wafer forming method can separate respective chips from others by performing a Deep Reactive Ion Etching (DRIE) process on a wafer including a plurality of chips. The wafer includes a plurality of chips configured to be arranged in row and column directions on the wafer, a scribe line configured to be formed among the plurality of chips so as to separate each chip, and an align key line configured to be formed in one side of the wafer so as to form an align key pattern. | 2011-06-02 |
| 20110127646 | WAFER AND METHOD FOR FORMING THE SAME - A wafer and a method for forming the same are disclosed. The wafer forming method can separate respective chips from others by performing a Deep Reactive Ion Etching (DRIE) process on a wafer including a plurality of chips. The wafer includes a plurality of chips configured to be arranged in row and column directions on the wafer, a scribe lane formed among the plurality of chips, configured to separate each of the plurality of chips using a Deep Reactive Ion Etching (DRIE) process, and an alignment key pattern configured to be arranged on the plurality of chips. The DRIE process is performed at a front side of the wafer on a basis of the align key pattern. | 2011-06-02 |
| 20110127647 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME - A semiconductor device includes a semiconductor substrate having a main surface in which a semiconductor element region where a plurality of functional elements are formed is formed; a multilevel wiring layer disposed on the main surface of the semiconductor substrate; a first organic insulating material layer disposed on the multilevel wiring layer; a groove that penetrates the multilevel wiring layer on a scribe region that surrounds the semiconductor element region; and an organic insulating material that is spaced from the first organic insulating material layer and disposed in the groove. | 2011-06-02 |
| 20110127648 | Heat Spreader Structures in Scribe Lines - An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge. | 2011-06-02 |
| 20110127649 | 3D INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME - Provided are a three-dimensional (3D) interconnection structure and a method of manufacturing the same. The 3D interconnection structure includes a wafer that has one side of an inverted V-shape whose middle portion is convex and a lower surface having a U-shaped groove for mounting a circuit, and a first electrode formed to cover a part of the inverted V-shaped one side of the wafer and a part of the U-shaped groove. | 2011-06-02 |
| 20110127650 | Method of Manufacturing a Semiconductor Device and Semiconductor Devices Resulting Therefrom - A method is disclosed for manufacturing a semiconductor device, including providing a substrate comprising a main surface with a non flat topography, the surface comprising at least one substantial topography variation, forming a first capping layer over the main surface such that, during formation of the first capping layer, local defects in the first capping layer are introduced, the local defects being positioned at locations corresponding to the substantial topography variations and the local defects being suitable for allowing a predetermined fluid to pass through. Associated membrane layers, capping layers, and microelectronic devices are also disclosed. | 2011-06-02 |
| 20110127651 | CHAIN SCISSION POLYESTER POLYMERS FOR PHOTORESISTS - Polymers for extreme ultraviolet and 193 nm photoresists are disclosed. The polymers comprise a photoacid generator (PAG) residue, an acid cleavable residue and a diacid joined by ester linkages. The polymers include a photoacid generating diol, a diacid and an acid table diol. | 2011-06-02 |
| 20110127652 | THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME - A three-dimensional semiconductor integrated circuit device is provided. A first semiconductor chip includes a solid-state circuit and is smaller than a base, and is stacked on the base. The first chip is buried by a first filling material having approximately the same contour as the base. Buried electrodes that penetrate through the first chip along its thickness direction are formed in the first chip. A second semiconductor chip includes a solid-state circuit and is smaller than the base, and is stacked on the first chip. The second chip is buried by a second filling material having approximately the same contour as the base. Buried electrodes that penetrate through the second chip along its thickness direction are formed in the second chip. The first and second filling materials have processibilities required for forming the buried electrodes and thermal expansion coefficients equivalent to those of the first and second chips, respectively. | 2011-06-02 |
| 20110127653 | PACKAGE SYSTEM WITH A SHIELDED INVERTED INTERNAL STACKING MODULE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a package system includes: providing a base package substrate having conductive elements; providing an internal stacking module having a semiconductor die mounted on a package substrate and a first encapsulant surrounding at least portions of the semiconductor die and the package substrate; covering at least portions of the first encapsulant in the internal stacking module with an electromagnetic interference shield, the electromagnetic interference shield shaped to have an outside face; mounting the internal stacking module over the base package substrate with the outside face of the electromagnetic interference shield facing the base package substrate; and encapsulating at least portions of the internal stacking module, the electromagnetic interference shield, and the base package substrate using a second encapsulant. | 2011-06-02 |
| 20110127654 | Semiconductor Package and Manufacturing Methods Thereof - A semiconductor package and manufacturing methods thereof are provided. In one embodiment, the semiconductor package includes a die, a shield, a package body, and a redistribution layer. The die has an active surface and an inactive surface. The shield is disposed over the inactive surface of the die. The package body encapsulates the die and a first portion of the shield, where a first surface of the package body is substantially coplanar with the active surface of the die. The redistribution layer is disposed on the active surface of the die and on portions of the first surface of the package body. | 2011-06-02 |
| 20110127655 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor element, a wiring board including a conductor portion formed on a first surface thereof on which the semiconductor element is mounted, the conductor portion being electrically connected to the semiconductor element, and a concave cap provided to seal the first surface of the wiring board, the concave cap being mounted through an adhesive on the first surface of the wiring board | 2011-06-02 |
| 20110127656 | SEMICONDUCTOR-DEVICE MOUNTED BOARD AND METHOD OF MANUFACTURING THE SAME - In a method of manufacturing a semiconductor-device mounted board, connection terminals are formed on electrode pads on a semiconductor integrated circuit respectively. A first insulating layer is formed to cover the connection terminals. A plate-like medium having a rough surface is disposed on the first insulating layer. The rough surface of the plate-like medium is pressed onto the first insulating layer so that a part of each of the connection terminals is exposed. A semiconductor device is produced by removing the plate-like medium. A second insulating layer is formed to cover side surfaces of the semiconductor device. A wiring pattern is formed to cover surfaces of the first and second insulating layers, the wiring pattern being electrically connected to the exposed connection terminal parts. | 2011-06-02 |
| 20110127657 | WIRING CIRCUIT STRUCTURE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE USING THE STRUCTURE - A conductor layer | 2011-06-02 |
| 20110127658 | Muti Thickness Lead Frame - A lead frame includes a lead frame | 2011-06-02 |
| 20110127659 | PACKAGE INCLUDING AN INTERPOSER HAVING AT LEAST ONE TOPOLOGICAL FEATURE - Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an encapsulant material formed over the die and the interposer, and disposed in the at least one depression to resist movement of the encapsulant material relative to the interposer. Other embodiments may be described and claimed. | 2011-06-02 |
| 20110127660 | METHODS AND MATERIALS FOR THE REDUCTION AND CONTROL OF MOISTURE AND OXYGEN IN OLED DEVICES - Embodiments of the invention provide an electronic device which may include an interior compartment housing at least one electronic component that may be reactive to target impurities. The electronic component may include at least a cathode and an anode. A purifier material may be interspersed within a conducting polymer layer between the cathode and the anode. The purifier material may decrease target impurities within the interior compartment of the electronic device from a first level to a second level. | 2011-06-02 |
| 20110127661 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips. | 2011-06-02 |
| 20110127662 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKABLE PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package base having an inward base side and an outward base side; mounting a device over the inward base side and connected to the outward base side; connecting a silicon interposer having a through silicon via to the device and having an external side facing away from the device; and applying an encapsulant around the device, over the package base, and over the silicon interposer with the external side substantially exposed, the encapsulant having a protrusion over the outward base side. | 2011-06-02 |
| 20110127663 | MAGNETIC PARTICLE-BASED COMPOSITE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the substrate and the integrated heat spreader. A semiconductor die is disposed above the substrate and in the cavity. An array of first-level solder joints is disposed between the substrate and the semiconductor die. A layer of magnetic particle-based composite material is also disposed in the cavity. | 2011-06-02 |
| 20110127664 | Electronic package including high density interposer and circuitized substrate assembly utilizing same - An electronic package for interconnecting a high density pattern of conductors of an electronic device (e.g., semiconductor chip) of the package and a less dense pattern of conductors on a circuitized substrate (e.g., PCB), the package including in one embodiment but a single thin dielectric layer (e.g., Kapton) with a high density pattern of openings therein and a circuit pattern on an opposing surface which includes both a high density pattern of conductors and a less dense pattern of conductors. Conductive members are positioned in the openings to electrically interconnect conductors of the electronic device to conductors of the circuitized substrate when the package is positioned thereon. In another embodiment, the interposer includes a second dielectric layer bonded to the first, with conductive members extending through the second layer to connect to the less dense pattern of circuitized substrate conductors. Circuitized substrate assemblies using the electronic packages of the invention are also provided. | 2011-06-02 |
| 20110127665 | INTEGRATED CIRCUIT MODULE - An integrated circuit module includes a carrier substrate, a semiconductor die disposed in the carrier substrate, a ground pad disposed on the carrier substrate, and an antenna partially embedded in the carrier substrate. The antenna includes a ground layer in thermal contact with the ground pad for dissipating heat generated from the semiconductor die. | 2011-06-02 |
| 20110127666 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - An embodiment of the present invention relates to a chip package and fabrication method thereof, which includes a chip protection layer or an additional etching stop layer to cover conducting pads to prevent dicing residue from damaging or scratching the conducting pads. According to another embodiment, a chip protection layer, an additional etching stop layer formed thereon, or a metal etching stop layer level with conducting pads or combinations thereof may be used when etching an intermetal dielectric layer at a structural etching region and a silicon substrate to form an opening for subsequent semiconductor manufacturing processes. | 2011-06-02 |
| 20110127667 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 2011-06-02 |
| 20110127668 | Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area - A semiconductor wafer has a first conductive layer formed over its active surface. A first insulating layer is formed over the substrate and first conductive layer. A second conductive layer is formed over the first conductive layer and first insulating layer. A UBM layer is formed around a bump formation area over the second conductive layer. The UBM layer can be two stacked metal layers or three stacked metal layers. The second conductive layer is exposed in the bump formation area. A second insulating layer is formed over the UBM layer and second conductive layer. A portion of the second insulating layer is removed over the bump formation area and a portion of the UBM layer. A bump is formed over the second conductive layer in the bump formation area. The bump contacts the UBM layer to seal a contact interface between the bump and second conductive layer. | 2011-06-02 |
| 20110127669 | SOLDER STRUCTURE, METHOD FOR FORMING THE SOLDER STRUCTURE, AND SEMICONDUCTOR MODULE INCLUDING THE SOLDER STRUCTURE - The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 μm. | 2011-06-02 |
| 20110127670 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package includes a substrate having an upper and a lower surface and including: at least a first contact pad; a non-optical sensor chip disposed overlying the upper surface, wherein the non-optical sensor chip includes at least a second contact pad and has a first length; a protective cap disposed overlying the non-optical sensor chip, wherein the protective cap has a second length, an extending direction of the second length is substantially parallel to that of the first length, and the second length is shorter than the first length; an IC chip disposed overlying the protective cap, wherein the IC chip includes at least a third contact pad and has a third length, and an extending direction of the third length is substantially parallel to that of the first length; and bonding wires forming electrical connections between the substrate, the non-optical sensor chip, and the IC chip. | 2011-06-02 |
| 20110127671 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip. With respect to an arrangement of the plurality of data system bonding pads of the data processor chip, an arrangement of the data system bonding pads to which the memory chip, coupled by the data system wiring, corresponds is made such that memory chips are disposed in an alternating sequence. | 2011-06-02 |
| 20110127672 | SEMICONDUCTOR PACKAGE HAVING A STACKED WAFER LEVEL PACKAGE AND METHOD FOR FABRICATING THE SAME - A semiconductor package having a stacked wafer level structure includes a base substrate; a semiconductor chip; a redistribution pattern; and a second insulation layer pattern. The base substrate having a chip region and a peripheral region disposed at the periphery of the chip region. The semiconductor chip is disposed over the chip region and has a bonding pad. The first insulation layer pattern covers the chip region and the peripheral region and exposes the bonding pad. The redistribution pattern is disposed over the first insulation layer pattern and extends from the bonding pad to the peripheral region. The second insulation layer pattern is disposed over the first insulation layer pattern and opening some portion of the redistribution pattern disposed in the peripheral region. | 2011-06-02 |
| 20110127673 | WIRING STRUCTURE AND METHOD - Disclosed is an improved integrated circuit wiring structure configured to prevent migration of wiring metal ions (e.g., copper (Cu+) ions in the case of a copper interconnect scheme) onto the surface of an interlayer dielectric material at an interface between the interlayer dielectric material and an insulating cap layer. Specifically, the top surfaces of wires and the top surface of a dielectric layer within which the wires sit are not co-planar. Thus, the interfaces between the wires and an insulating cap layer and between the dielectric layer and the same insulating cap layer are also not co-planar. Such a configuration physically prevents migration of wiring metal ions from the top surface of the wires onto the top surface of the dielectric layer at the interface between the dielectric layer and cap layer and, thereby prevents time dependent dielectric breakdown (TDDB) and eventual device failure. Also disclosed herein are embodiments of a method of a forming such an integrated circuit wiring structure. | 2011-06-02 |
| 20110127674 | LAYER STRUCTURE FOR ELECTRICAL CONTACTING OF SEMICONDUCTOR COMPONENTS - A layer structure for the electrical contacting of a semiconductor component having integrated circuit elements and integrated connecting lines for the circuit elements, which is suitable in particular for use in a chemically aggressive environment and at high temperatures, i.e., in so-called “harsh environments,” and is simple to implement. This layer structure includes at least one noble metal layer, in which at least one bonding island is formed, the noble metal layer being electrically insulated from the substrate of the semiconductor component by at least one dielectric layer, and having at least one ohmic contact between the noble metal layer and an integrated connecting line. The noble metal layer is applied directly on the ohmic contact layer. | 2011-06-02 |
| 20110127675 | LAMINATE ELECTRONIC DEVICE - A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern. | 2011-06-02 |
| 20110127676 | Lead pin for semiconductor package and semiconductor package - Disclosed is a lead pin for a semiconductor package. The lead pin includes a coupling pin inserted into a hole formed in an external device, a head portion disposed at one end of the coupling pin, and a step portion formed in a stepped manner between the coupling pin and the head portion, the step portion having a smaller size than the head portion. | 2011-06-02 |
| 20110127677 | Method of manufacturing semiconductor device, and semiconductor device - A semiconductor device including a substrate, and an insulating film formed over the substrate, wherein the insulating film has a first contact having a rectangular geometry in a plan view, and second to fifth contacts provided respectively adjacent to the individual edges of the rectangular first contact, formed therein. | 2011-06-02 |
| 20110127678 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CIRCUITRY AND POST - An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant. | 2011-06-02 |
| 20110127679 | Stacked Structure of Semiconductor Packages Including Through-Silicon Via and Inter-Package Connector, and Method of Fabricating the Same - A stacked structure of semiconductor packages includes an upper semiconductor package, a lower semiconductor package and inter-package connectors. The upper semiconductor package includes an upper package substrate, a plurality of upper semiconductor chips stacked on the upper package substrate, and conductive upper connection lands formed on a bottom surface of the upper package substrate. The lower semiconductor package includes a lower package substrate, a plurality of lower semiconductor chips stacked on the lower package substrate, and lower through-silicon vias vertically penetrating the lower semiconductor chips. The inter-package connectors may electrically connect the through-silicon vias to the upper connection lands. | 2011-06-02 |
| 20110127680 | SPACER, AND ITS MANUFACTURING METHOD - Provided are a spacer capable of avoiding a poor connection due to the suction of solder when the clearance width between a soldered semiconductor device and a printed circuit board is made constant, and a manufacturing method for the spacer. The spacer includes an electrically insulating base member, and at least one solder guiding terminal. The base member has a bottom face, a top face and at least one side face, of which the bottom face and the top face are out of contact with each other whereas the side face contacts one or both the bottom face and the top face. The solder guiding terminal covers the bottom face partially, the top face partially, and the side face partially or wholly. A solder guiding face as the surface of a portion of the solder guiding terminal covering the side face is not normal to the bottom face. | 2011-06-02 |
| 20110127681 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package and a fabrication method thereof are provided according to an embodiment of the invention. The chip package includes a semiconductor substrate containing a chip and having a device area and a peripheral bonding pad area. A plurality of conductive pads is disposed at the peripheral bonding pad area and a passivation layer is formed over the semiconductor substrate to expose the conductive pads. An insulating protective layer is formed on the passivation layer at the device area. A packaging layer is disposed over the insulating protective layer to expose the conductive pads and the passivation layer at the peripheral bonding pad area. The method includes forming an insulating protective layer to cover a plurality of conductive pads during a cutting process and removing the insulating protective layer on the conductive pads through an opening of a packaging layer. | 2011-06-02 |
| 20110127682 | DEVICE FOR IMPROVED DELIVERY OF GAS TO FLUID - The device is of the frustum dispersion type having a housing forming a conical cavity, sealed at its large end, tapering to a discharge orifice at the other end. There is a fluid inlet, which tangential to the cavity near the sealed end. There is a hollow, tapered helix cut cone shape in the center of the cavity, affixed to the sealed end, with the point thereof axially aligned with the discharge orifice to help enable the continuous swirling motion of the contained fluid and to act as a gas inlet port to start the formation of a gas vortex. As fluid in the cavity approaches the discharge orifice, it is accelerated because of the reduction of area inside the cavity as it tapers. The change in specific gravities between the fluid and the gas causes a swirling centrifugal force on the liquid and a centripetal inner swirling of the gas. The result is at the point of discharge, the fluid is heavily loaded with small bubbles of gas. | 2011-06-02 |
| 20110127683 | HUMIDIFIER FOR FUEL CELL - The present invention provides a humidifier for a fuel cell, in which a plurality of hollow fiber membranes having different diameters are appropriately arranged to control the flow direction of dry air introduced into the humidifier, thus uniformly humidifying the dry air. | 2011-06-02 |
| 20110127684 | APPARATUS AND METHOD FOR MANUFACTURING MICRO LENS ARRAY - An apparatus for manufacturing a micro lens array, wherein lenses having various standards are easily manufactured by forming a micro lens array by adjusting a vacuum condition in a vacuum chamber. The apparatus including: a vacuum chamber including a vacuum space therein; a vacuum unit for forming a vacuum inside the vacuum chamber; an upper frame disposed inside the vacuum chamber and to which a substrate is installed on a lower surface of the upper frame; an elevator for ascending and descending the upper frame; a lower frame disposed below the upper frame; a master plate disposed on the lower frame and includes a plurality of molding grooves on an upper surface of the master plate; and a heater installed to a side of the master plate to heat up the master plate. | 2011-06-02 |
| 20110127685 | METHOD OF MANUFACTURING LENS CASTING MOLD AND METHOD OF MANUFACTURING EYEGLASS LENS - An aspect of the present invention relates to a method of manufacturing a lens casting mold by introducing a forming mold, with a forming surface on which a glass material being formed is positioned, into a continuous heating furnace and conducting thermal treatment while conveying the forming mold in the furnace to form an upper surface of the glass material being formed by bring a lower surface of the glass material being formed into tight contact with the forming surface. The aspect comprises utilizing a forming mold having a curvature distribution on the forming surface as the forming mold; specifying an average curvature in a direction running from a geometric center toward a perimeter portion of the forming surface of the forming mold in two or more different directions before introduction to the furnace; directly or indirectly measuring a temperature at two or more measurement points on the forming surface of the forming mold in one or two or more regions within the furnace and specifying a direction running from the geometric center of the forming surface toward a point that is of maximum temperature among the two or more measurement points as a maximum temperature direction; continuously or intermittently repeating approximately full circle rotation in a horizontal direction of the forming mold during passage through the furnace; and in the region in which the maximum temperature direction has been specified, the rotation is conducted so that an angular rotation speed of the forming mold decreases as the average curvature in an n | 2011-06-02 |
| 20110127686 | THERMOFORMER - There is provided an automatic thermoformer for dental and other prosthetic devices, that operates vertically on a blank, without operator manipulation thereof. | 2011-06-02 |
| 20110127687 | Extruder And Process For Preparing A Mixture Of Polymer And Diluent - The invention generally relates to an extruder for preparing a mixture of polymer and diluent. The extruder includes multiple extruder stages, the multiple extruder stages comprising an inlet stage, a dispersion stage, and at least one mixing stage comprising a reverse mixing screw segment having a helical flight that traverses and forms an outer periphery thereof, the helical flight having a plurality of notches positioned therealong. A process for extruding the polymer-diluent mixture is also provided. | 2011-06-02 |
| 20110127688 | METHOD FOR MANUFACTURING MOLDED FOAM - A method for manufacturing molded foam which uses cheap materials, is light in weight and which is excellent in impact resistance. In the method for manufacturing molded foam, propylene homopolymer with a long chain branch, propylene ethylene block copolymer and low density polyethylene are mixed in the base resin at a prescribed mixing ratio. A blowing agent is added to carry outfoaming. A prescribed mixing ratio is determined based on the value arrived at by a multiplying melt tension of each material mixed with the melt flow rate and the Tensile Rupture Elongation. | 2011-06-02 |
| 20110127689 | APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - An apparatus for manufacturing an electronic component includes: upper and lower metal molds, at least one of which being formed as a porous member on which an electronic component is mounted, including an internal space for accommodating the electronic component therein; a release film providing unit providing a release film to the internal space of the upper and lower metal molds; and a molding resin providing unit providing a molding resin to the internal space to allow the electronic component to be injection-molded. | 2011-06-02 |
| 20110127690 | Stamper For Microneedle Sheet, Production Method Thereof, And Microneedle Production Method Using Stamper - Microneedle sheets are produced by injecting a needle raw material into a stamper formed with a concavity in a base material. However, it was not easy to increase the degree of sharpness of the concavity which corresponds to the stamper tips. A method for producing a stamper including the steps of heating a sheet-like base material and an original plate having a conical protrusion, inserting the protrusion of the original plate into the base material to form a conical concavity in the original plate, cooling the original plate with the original plate still inserted in the base material, releasing the original plate from the base material, and heating the base material. | 2011-06-02 |
| 20110127691 | FACTORY FOR THE MOLDING MANUFACTURE OF PRECAST CONCRETE VOUSSOIRS FOR THE CONSTRUCTION OF WIND GENERATOR SUPPORT TOWERS - A factory for the molding manufacture of precast concrete voussoirs for the construction of wind generator support towers, the concrete voussoirs manufactured by molding in said factory, and a wind generator support tower at least partially constructed by concrete voussoirs manufactured by molding in said factory, as well as to the operating method of said factory. | 2011-06-02 |
| 20110127692 | METHOD OF MANUFACTURING SEAL PART - To form gaskets on both sides of a base material ( | 2011-06-02 |
| 20110127693 | METHOD OF MANUFACTURING THROTTLE VALVES AND THROTTLE BODIES - A method of molding a part, such as throttle valve and a throttle body, of a throttle device includes resin-molding the part by an injection molding process using a molding die. The molding die has a mold cavity having a cavity portion for molding a base that may protrude from the resin part. The cavity portion for molding the base communicates with an injection gate, from which molten resin is injected into the mold cavity. The configuration of at least one of the base and the injection gate is determined such that a projection formed at the injection gate can be removed without substantially damaging the resin part. | 2011-06-02 |
| 20110127694 | METHOD OF MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT (AS AMENDED) - A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold. | 2011-06-02 |
| 20110127695 | Use of thermoplastic composition comprising thermoplastic polyurethanes as additive - The present invention discloses the use in rotomolding or slush molding applications of a composition comprising a polyolefin, a processing aid and optionally a UV-stabilizer. | 2011-06-02 |
| 20110127696 | POLYPROPYLENE RESIN COMPOSITION, RESIN MOLDED PART AND PRODUCTION METHOD THEREOF - A polypropylene resin composition contains 2 to 15 wt % of a moldability improver (A) and 85 to 98 wt % of a polypropylene resin (B). The moldability improver (A) is formed of propylene block copolymers (A-1) and (A-2). Each of the propylene block copolymers (A-1) and (A-2) has a crystalline propylene polymer component (A-11), (A-21) and a propylene-ethylene random copolymer component (A-12), (A-22). The propylene block copolymer (A-1) is characterized in that the melt flow rate of the crystalline propylene polymer component (A-11) is high, whereas the propylene block copolymer (A-2) is characterized in that the content ratio of the propylene-ethylene random copolymer component (A-22) is high. The polypropylene resin (B) is formed of a propylene-ethylene block copolymer (B-1), at least one of an ethylene elastomer and a styrene elastomer (B-2) and an inorganic filler (B-3). | 2011-06-02 |
| 20110127697 | METHOD AND APPARATUS FOR CONTROLLING THE SIZE OF A LASER BEAM FOCAL SPOT - A method and apparatus is described that allows the width of fine line structures ablated or cured by a focussed laser beam on the surface of flat substrates to be dynamically changed while the beam is in motion over the substrate surface while simultaneously maintaining the beam focal point accurately on the surface. A three-component variable optical telescope is used to independently control the beam diameter and collimation by movement of first and second optical components relative to the third optical component. The method allows different focal spot diameters and different ablated or cured line widths to be rapidly selected and ensures that the beam shape in the focal spot remains constant and the depth of focus is always maximized. | 2011-06-02 |
| 20110127698 | VACUUM BAG FOR HOT DRAPE FORMING - A method and an apparatus for conforming a blank onto forming surface sections of a forming tool by drawing a vacuum against an elastic vacuum bag for transmitting forming forces from the elastic vacuum bag to the blank. The elastic vacuum bag includes at least one bag section having a different stiffness than other bag sections. The at least one bag section is an elongated bag section having a stiffness larger than that of surrounding bag sections. The location of the elongated bag section of the elastic vacuum bag corresponds, when the elastic vacuum bag after completion lies against the forming surface sections having the blank in between, with an elongated forming surface section of the forming tool where the blank requires a forming force being larger than that of the surrounding bag sections. | 2011-06-02 |
| 20110127699 | Method And Apparatus For Thermally Debindering A Cellular Ceramic Green Body - Cellular ceramic green bodies are debindered in a heated circulating oxygen-containing atmosphere while being supported on a plurality of flow-restricting support members for selectively restricting circulation of the atmosphere through cellular core sections of the bodies, and while allowing for a free circulation of the atmosphere past the support members and green bodies. | 2011-06-02 |
| 20110127700 | METHOD FOR PRODUCING A CERAMIC COMPONENT - The invention relates to a method for producing a ceramic component. With the method, a ceramic base material in powdered form and a mold having the shape of the ceramic component are provided. The ceramic base material is introduced into the mold. The ceramic component is presintered at a temperature between 880° C. and 980° C. and is then removed from the mold. The surface of the ceramic component is treated with a blasting material and the ceramic component is sintered at a temperature that is higher than the presintering temperature. With the method according to the invention, ceramic components having higher surface roughness can be produced. Due to the higher surface roughness it is easier to apply a firmly adhering coating to the ceramic component. | 2011-06-02 |
| 20110127701 | DYNAMIC CONTROL OF LANCE UTILIZING CO-FLOW FLUIDIC TECHNIQUES - A jet of gas injected from a lance is fluidically deviated with a gas flowing in either the same or opposite direction as the jet of gas. The gas used to fluidically deviate the jet is the same as or different from the gas in the jet. | 2011-06-02 |
| 20110127702 | DYNAMIC CONTROL OF LANCE UTILIZING COUNTERFLOW FLUIDIC TECHNIQUES - A jet of gas injected from a lance is fluidically deviated with a gas flowing in either the same or opposite direction as the jet of gas. The gas used to fluidically deviate the jet is the same as or different from the gas in the jet. | 2011-06-02 |
| 20110127703 | DYNAMIC LANCES UTILIZING FLUIDIC TECHNIQUES - A jet of gas injected from a lance is fluidically deviated with a gas flowing in either the same or opposite direction as the jet of gas. The gas used to fluidically deviate the jet is the same as or different from the gas in the jet. | 2011-06-02 |
| 20110127704 | VISCOUS STRAND DAMPER ASSEMBLY - A damper assembly includes a fixed rack gear, a rotary gear damper having a gear engaged with the rack gear and a tether movable with the damper along the rack gear and a tether connecting the damper and a movable object to be controlled by the damper. The tether includes enlarged integral ends to secure the tether relative to the damper and the article to be controlled by the damper. A constant force spring interconnects movement of the damper relative to the fixed rack gear. | 2011-06-02 |
| 20110127705 | TUBULAR TORSION BAR - A tubular torsion bar includes an elongated inner tube of flexible material having a proximal end and a distal end and an elongated outer tube of flexible material having a proximal end and a distal end. A joiner bushing fixedly attaches the distal end of the inner tube to the distal end of the outer tube with the inner tube and outer tube positioned in coaxial and substantially coextensive concentric nesting positions. Mounting apparatus is fixedly attached to the proximal end of the outer tube and a planetary gear system is coupled to the proximal ends of the inner tube and the mounting apparatus and designed to provide a selected torque versus deflection characteristic of the tubular torsion bar. | 2011-06-02 |
| 20110127706 | DAMPERS FOR MOUNTAIN BIKES - An apparatus of a damper ( | 2011-06-02 |
| 20110127707 | Switchback mechanism and image forming apparatus - In a color printer in which a drive force of a fixed gear that rotates not in both a forward direction and a reverse direction but in either one direction only is transmitted to a discharging unit, a swing gear is attached to a branch guide via a switching link and a transmission link as a link mechanism. When a solenoid mechanism starts driving, the transmission link rotates. In accordance with the rotation of the transmission link, the switching link rotates, so that a switching among a discharge conveying path, a duplex-printing conveying path, and a switchback conveying path by the branch guide and a switching of a rotating direction of a transmission gear can be simultaneously performed. | 2011-06-02 |
| 20110127708 | SHEET CONVEYING APPARATUS - A sheet conveying apparatus for OCR/VSC integrated systems, which selectively delivers postal items to upper- and lower-side stackers, includes at least one pair of conveyor belts bifurcating from a bifurcation gate to the down-side stackers, and at least one pair of conveyor belts bifurcating from the bifurcation gate to the upper-side stackers. The conveyor belts include a first twisted section, an S-shaped ascending portion, and a second twisted portion. Each postal item is tilted by the first twisted portion, then raised by the S-shaped ascending portion with its tilted attitude maintained, and returned to upright by the second twisted portion. | 2011-06-02 |
| 20110127709 | SHEET CONVEYANCE APPARATUS, IMAGE FORMING APPARATUS, AND IMAGE READING APPARATUS - In a sheet conveyance apparatus, a sponge roller is provided at a joining portion in which a first sheet conveyance path joins a second sheet conveyance path. A leading edge of a sheet or tailing edge of a sheet abuts at the sponge roller when the sheet is conveyed from the first conveyance path to the second conveyance path. In a projection surface in a direction orthogonal to a sheet conveyance direction in the second sheet conveyance path, an outer periphery of the sponge roller and an outer periphery of a conveyance roller, which is positioned in a downstream side, are partially overlapped in the second conveyance path. Further the sponge roller is rotatably arranged. With such a configuration, the noise generated in the joining portion can be reduced, and effect to reduce the noise can be continued. | 2011-06-02 |
| 20110127710 | FEED ASSEMBLY AND IMAGE FORMING APPARATUS INCORPORATING FEED ASSEMBLY - A feed assembly configured to feed a sheet, including: a feed roller configured to convey the sheet; a support element configured to rotatably and detachably support the feed roller; a base including a guide surface configured to guide the sheet; a frictional element configured to generate a frictional force on the sheet guided by the guide surface; and an elastic member provided between the frictional element and the base; wherein a recess is defined in the guide surface to accommodate the frictional element; and the elastic member causes the frictional element to project from the guide surface when the feed roller is detached from the support element. | 2011-06-02 |
| 20110127711 | Sheet feeding device and image forming apparatus incorporating same - A sheet feeding device includes a sheet carrying unit, an attraction separation device electrostatically attracting and separating an uppermost sheet from a sheet stack and including multiple rollers, an endless dielectric belt stretched over the multiple rollers, and an elastic member provided inside a loop of the belt to cause the endless dielectric belt to contact the uppermost sheet, a sheet conveying device, and a lifting and lowering device. The lifting and lowering device lifts the sheet stack to a lift position at which the uppermost sheet contacts with the attraction separation device, and the attraction separation device stands by for a predetermined time to attract the uppermost sheet and starts to convey the uppermost sheet after the predetermined time elapses in a state in which the sheet stack remains at the lift position. | 2011-06-02 |
| 20110127712 | SHEET FEEDING APPARATUS - A sheet feeding apparatus capable of obtaining a sufficient conveying force for pulling back double-fed overlapping sheets to a stacking tray side. A sheet feeding member feeds sheets incoming from a stacking tray which stacks the sheets into a conveying pass. A separating member separates the sheets fed to the conveying pass by the sheet feeding member one by one. A double feed detection sensor generates an output for detecting double feed of sheets fed to the conveying pass. A rotatable member contacts the fed sheet. A driving unit rotationally drives at least the rotatable member in a rotational direction for reverse feeding of sheets. A control unit controls the driving unit when the double feed of sheets is detected based on the output of the double feed detection sensor, such that the rotatable member is rotationally driven in the rotational direction for reverse feeding of sheets. | 2011-06-02 |
| 20110127713 | FEEDING DEVICE AND IMAGE FORMING APPARATUS HAVING THE SAME - The feeding device includes a storage unit, a feeding roller which rotates while contacting the uppermost sheet stored in the storage unit to move the uppermost sheet forward, a separation plate disposed forward in the movement direction of the uppermost sheet and provided with an inclined surface inclined with respect to the movement direction, and a separation auxiliary member is disposed along the inclined surface of the separation plate and operated by a force received when the uppermost sheet comes in contact. The separation auxiliary member includes a rotation shaft parallel with the inclined surface, and a first resistance part rotating about the rotation shaft as the center from an initial position projecting from the inclined surface to an embedded position embedded in the inclined surface as a friction coefficient of the first resistance part is higher than that of the inclined surface and the received force is increased. | 2011-06-02 |
| 20110127714 | SHEET SIZE DETECTING MECHANISM FOR USE IN AUTOMATIC DOCUMENT FEEDER - A sheet size detecting mechanism includes an adjustable module, a sensing module and a controlling unit. The adjustable module includes a first sheet guide, a second sheet guide, an adjustable part and a circular gear. The adjustable part is a moved to a position where the first sheet guide and the second sheet guide are respectively in contact with two parallel edge sides of a sheet. The circular gear is rotated as the adjustable part is moved. The sensing module includes a sustaining element and a circuit board. The sustaining element is connected to an underside of the circular gear, and synchronously rotated with the circular gear. When the circular gear is rotated by an angle, the sustaining element is in contact with a specified one of the plural sensing regions, so that the circuit board generates a sensing signal. According to the sensing signal, the sheet size is acquired. | 2011-06-02 |
| 20110127715 | IMAGE FORMING APPARATUS - The present invention provides a sheet feeder apparatus in which a regulating member can securely be fixed without generating lateral slip of a sheet and an image forming apparatus. The regulating member regulates a sheet position in a width direction, and a fixing portion fixes the regulating member to a position according to a sheet size. The fixing portion includes plural rack gears which are provided in a surface opposite a surface abutting on the sheet of the regulating member; plural relay gears which engage the plural rack gears; a rotating shaft on which the plural relay gears are provided; and a lock mechanism which regulates rotation of the rotating shaft when the regulating member is moved away from the regulated sheet, the lock mechanism permitting the rotation of the rotating shaft when the regulating member is moved in a direction in which the regulating member contacts the regulated sheet. | 2011-06-02 |
| 20110127716 | TARGET ASSEMBLY FOR A GOLF PUTTING GAME - The present invention is directed to target assembly for receiving a golf ball comprising a plurality of parallel golf ball receiving elongate channels; each channel having substantially the same width the other channels and each channel comprising a plurality of discrete golf ball receiving zones. That the channels may be adjusted and adapted to provide one or more consolidated target for players to aim for on the golf ball putting practice device. The sub-divisions of each channel and the plurality of channels form a grid structure. By assigning different scores to the different sub-divisions of each channel, one or indeed multiple targets can be formed. These targets can be then altered to prevent ‘muscle memory’ effects from assisting a player to achieve a high score. | 2011-06-02 |
| 20110127717 | PUZZLE - A hidden maze puzzle device includes one or more traps, wherein when one of the traps is activated by a user, a reset action is triggered to send the user back to the start of the puzzle. The puzzle includes an outer housing section, a shaft section slidably and rotatably moveable within the outer housing section, and a spring-loaded pin in engagement with both the outer housing and the shaft for guiding a user though the puzzle. | 2011-06-02 |
| 20110127718 | Apparatus and Method for an Illusionary Three-Dimensional Puzzle - Disclosed herein is an apparatus that includes, a substrate having a first side and a second side, wherein the substrate is divided into a plurality of pieces, and a two-dimensional image situated on at least one of the first side and second side of the substrate, wherein each piece contains a complementary image portion, such that when the plurality of pieces having complementary image portions are positioned adjacent each other, the image is complete, and wherein the image includes a plurality of colors configured to facilitate a three-dimensional illusion. | 2011-06-02 |
| 20110127719 | Electronic Board Game - An electronic board game for at least two players, comprising an electronic device containing blocks to set the fundamental parameters and rules of the game and to create a game board with fields and with game pieces in the initial and current positions, which also contains the third block for the current evaluation of the numerical values of the individual fields, which vary in the course of the game depending on the positions of the game pieces the current numerical values of the fields being dependent on the current strength, expressed as a number, with which the game pieces in whose range of power these fields are located affect the fields, and also contains blocks to display the game pieces on the game board and to color and show the numerical values of the individual fields depending on the current. | 2011-06-02 |
| 20110127720 | TOWER: 3D CHESS PLATFORM - Whereas prior art inventions had sets with widely spaced and fixed boards, this invention—for playing chess and its variants in the third dimension; has seventeen interlocking, interchangeable, rotating, revolving parts. When fully constructed the several parts forms a tower with eight interlocking, rotating, revolving tiers no more than three and a half to four feet in height, each tier is design to hold a custom design clear acrylic chessboard with alternating raised squares of varying styles and design measuring up to 20.″×20.″×0.25; moreover, the basic rules of three dimensional/multilevel chess. | 2011-06-02 |
| 20110127723 | Marksman target stand - A firearms marksman target stand comprising a rigid plastic pipe frame connected by plastic joints encompassing a solid foam board backing to hold sheet targets. Said foam board backing is connected to and away from frame sides and at the top and bottom by plastic cable ties forming the framed target mounting area. Two rigid plastic pipe legs are coupled to framed target mounting area by plastic tee joints, already utilized at the bottom corners of framed target area. The target stand is supported in an upright position by two galvanized spikes driven into the ground and fitted properly inside bottom ends of said rigid plastic pipe legs. This target stand is light weight compact and stands freely in an upright position presenting a framed target area to mount many various size targets, and is stored and transported with legs and spikes attached to sides of framed target area. | 2011-06-02 |
| 20110127724 | GAMES USING DARTS OR ARROWS - The present document describes games using darts or arrows. More particularly, this description relates to targets and accessories used for new games. | 2011-06-02 |
| 20110127725 | PRESSURE-BALANCED FLOATING SEAL HOUSING ASSEMBLY AND METHOD - A dynamic sealing mechanism for a machine assembly that includes a seal housing of generally cylindrical form having opposed ends, the seal housing axially positioned between a pressure housing and a retaining member and laterally translatable relative to the pressure housing. The dynamic sealing mechanism includes a shaft located at least partially within the seal housing, the shaft having a sealing surface of generally cylindrical form, relatively movable with respect to the seal housing, and having at least one radial bearing positioned radially by the shaft and locating the radial position of the seal housing. At least three fluid pressure-generated forces act axially on the seal housing to produce a net fluid pressure-generated axial force that is negligible. | 2011-06-02 |
| 20110127726 | Hydrodynamic Circumferential Seal System for Large Translations - A circumferential seal system for sealing a high pressure region from a low pressure region separated by a runner with an outer circumferential surface and a seal ring disposed about the outer circumferential surface is described. The seal system includes a plurality of groove sets separately disposed along the outer circumferential surface. Each groove set further includes at least two grooves. At least one groove within each groove set exerts a lifting force via a fluid from the high pressure region onto the seal ring as the runner translates with respect to the seal ring along an axis substantially perpendicular to the rotation of the runner. The continuous feed of fluid onto the seal ring ensures a thin film between the seal ring and the runner regardless of their relative arrangement during axial excursions of the runner resulting from conditions within a turbine engine. | 2011-06-02 |
| 20110127727 | SEALING ARRANGEMENT AND SEALING METHOD - The invention relates to a sealing arrangement ( | 2011-06-02 |
| 20110127728 | SEALING RINGS FOR A LABYRINTH SEAL - In sealing rings for a labyrinth seal that are arranged on a rotationally symmetrical component and in frictional contact with a stationary run-in layer, a part of the sealing ring ( | 2011-06-02 |
| 20110127729 | CYLINDER HEAD GASKET - A cylinder head gasket | 2011-06-02 |
| 20110127730 | SEAL CONFIGURATION FOR THE MOTOR VEHICLE FRONT WALL - A seal configuration is provided for sealing an opening of a motor vehicle front wall provided for the passage of heating and/or air-conditioning pipes, such as heating and/or air-conditioning pipes, having a two-component seal body insertable into the opening, which has an outer peripheral edge component made of a first seal material and an inner seal component made of a second seal material. The first and the second seal materials have different moduli of elasticity and/or different acoustic damping properties. | 2011-06-02 |
| 20110127731 | Adapter For A Power Tool - An adapter for a power tool is disclosed which comprises a drive shaft that can be connected to an output shaft of the power tool in a rotationally fixed manner. There is a receiving connector on the power tool. On the adapter there is provided an assigned sleeve that can be pushed onto the receiving connector, and which comprises a clamping ring, which acts together with locking members in order to effect locking of the sleeve on the receiving connector when in a closed position, the clamping ring being held so as to be movable in the axial direction and being preloaded in the direction of the closed position. The locking members act together with the clamping ring in such a way that locking is effected automatically in the closed position when the adapter is pushed onto the power tool as far as the closed position, and a release of the adapter from the closed position can be effected through an axial movement of the clamping ring against its preload. | 2011-06-02 |
| 20110127732 | Stair Climbing Wheel with Multiple Configurations - A stair climbing wheel and vehicles are described. The stair climbing wheel has a rolling wheel and a plurality of deployable protrusions that allow the wheel to climb stairs. The deployable protrusions can be deployed from or retracted into the rolling wheel. In the retracted position, the stair climbing wheel functions as a traditional circular wheel. These stair climbing wheels can be incorporated on a wide variety of vehicles, such as hand trucks, wheelchairs, and personal transports to allow these vehicles to climb stairs. | 2011-06-02 |
| 20110127733 | Controllable Suspension Architecture for Enhanced Armoured Vehicle Survivability - The present embodiments relate to a semi-active suspension control system that utilizes controllable dampers for the purpose of improving maneuverability and vehicle hull stabilization. The disclosed semi-active control system can work in conjunction with a height management unit and on vehicles having variable ride heights, and hull stability and maneuverability can be achieved regardless of vehicle payload and ride height. | 2011-06-02 |
| 20110127734 | SKATING DEVICE - The present invention relates to a skating device which comprises two footboard assemblies with ground contact rollers or skids; two rods, wherein each rod comprises a distal end and a proximal end. The distal ends of the rods are mounted to the footboard assemblies, respectively, and the proximal ends of the rods are mountable to a common support means located above the footboard assemblies. Each footboard assembly is allowed to move at least in two degrees of freedom with respect to the support means such that a skating movement of the two footboard assemblies with respect to the support means is possible. | 2011-06-02 |
| 20110127735 | STACKABLE ROLL CONTAINER WITH INSERT BASES - The invention relates to a stackable roll container ( | 2011-06-02 |
| 20110127736 | EQUIPMENT CARRIER - An equipment carrier for transporting one or more work items includes a vertical frame attached to a base frame, where the base frame has, in a preferred embodiment, an expandable portion that telescopes out from the vertical frame. The equipment carrier also includes a locking mechanism for attaching the equipment carrier to a standard dolly. The use of the equipment carrier in combination with the dolly allows for easy transport of the equipment carrier. In one embodiment, work piece arms for supporting work items are pivotally connected to the front of the vertical frame allowing them to swing into horizontal position and then fold down into a vertical position. Also attached to the vertical frame is a strut that is also pivotally connected to the front face of the vertical frame. The strut swings up to support the work piece arm when it is in the horizontal position. The equipment carrier also has components for carrying additional accessories work items needed. | 2011-06-02 |
| 20110127737 | WHEELED HAMPER SYSTEM - An apparatus for providing improved transportability for a clothes hamper to and from a laundry facility comprising: a four-wheel assembly and an extendable handle assembly for removable attachment to an existing clothes hamper. The wheeled hamper system further comprises castors which may be rotatable through 360 degrees enabling the clothes hamper to be maneuvered in virtually any direction. At least two wheels of the wheeled hamper system may comprise a wheel brake thereby allowing the clothes hamper to remain stationary during non-use and in-use periods. The extendable handle assembly may be extended or retracted by a user allowing the clothes hamper to be easily pushed or pulled on either four wheels or two wheels. A hamper lid may further be removably attached to the clothes hamper by a hinge enabling the hamper lid to be swingably closed thereby securely retaining the contents of the clothes hamper during transport. In an alternative embodiment, the four-wheel assembly, extendable handle assembly, and hamper lid may be pre-installed to a clothes hamper. | 2011-06-02 |
