| 22nd week of 2012 patent applcation highlights part 14 |
| Patent application number | Title | Published |
|---|
| 20120133017 | SEMICONDUCTOR STRUCTURES INCLUDING POLYMER MATERIAL PERMEATED WITH METAL OXIDE - Methods of forming metal oxide structures and methods of forming metal oxide patterns on a substrate using a block copolymer system formulated for self-assembly. A block copolymer at least within a trench in the substrate and including at least one soluble block and at least one insoluble block may be annealed to form a self-assembled pattern including a plurality of repeating units of the at least one soluble block laterally aligned with the trench and positioned within a matrix of the at least one insoluble block. The self-assembled pattern may be exposed to a metal oxide precursor that impregnates the at least one soluble block. The metal oxide precursor may be oxidized to form a metal oxide. The self-assembled pattern may be removed to form a pattern of metal oxide lines on the substrate surface. Semiconductor device structures are also described. | 2012-05-31 |
| 20120133018 | SEMICONDUCTOR DEVICE AND METHOD OF REPAIRING THE SAME - A method of repairing a semiconductor device includes forming a first conductive interconnection and a second conductive interconnection spaced from the first conductive interconnection on a semiconductor substrate, forming a magnetic fuse on the first conductive interconnection and forming a first contact plug on the second conductive interconnection, forming a metal interconnection on the magnetic fuse and the first contact plug, and applying a bias to the first conductive interconnection or to the second conductive interconnection corresponding to a normal cell or a redundancy cell and the metal interconnection. The method can readily prevent the problems caused in a laser cutting method without using a method of physically cutting a fuse by radiation of a laser when a semiconductor device fuse is repaired. | 2012-05-31 |
| 20120133019 | FUSE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A fuse of a semiconductor device includes first fuse metals formed over an underlying structure and a second fuse metal formed between the first fuse metals. Accordingly, upon blowing, the fuse metals are not migrated under conditions, such as specific temperature and specific humidity. Thus, reliability of a semiconductor device can be improved. | 2012-05-31 |
| 20120133020 | SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR AND AN ELECTRICAL CONNECTION VIA AND FABRICATION METHOD - A dielectric wafer has, on top of its front face, a front electrical connection including an electrical connection portion. A blind hole passes through from a rear face of the wafer to at least partially reveal a rear face of the electrical connection portion. A through capacitor is formed in the blind hole. The capacitor includes a first conductive layer covering the lateral wall and the electrical connection portion (forming an outer electrode), a dielectric intermediate layer covering the first conductive layer (forming a dielectric membrane), and a second conductive layer covering the dielectric intermediate layer (forming an inner electrode). A rear electrical connection is made to the inner electrode. | 2012-05-31 |
| 20120133021 | SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR AND AN ELECTRICAL CONNECTION VIA, AND FABRICATION METHOD - A main blind hole is formed in a front face of a wafer having a rear face. A through capacitor is formed in the main blind hole including a conductive outer electrode, a dielectric intermediate layer, and a filling conductive material forming an inner electrode. Cylindrical portions of the outer electrode, the dielectric intermediate layer and the inner electrode have front ends situated in a plane of the front face of the wafer. A secondary rear hole is formed in the rear face of the wafer to reveal a bottom of the outer electrode. A rear electrical connection is made to contact the bottom of the outer electrode through the secondary rear hole. A through hole via filled with a conductive material is provided adjacent the through capacitor. An electrical connection is made on the rear face between the rear electrical connection and the through hole via. | 2012-05-31 |
| 20120133022 | METHODS OF FABRICATING PASSIVE ELEMENT WITHOUT PLANARIZING AND RELATED SEMICONDUCTOR DEVICE - Methods of fabricating a passive element and a semiconductor device including the passive element are disclosed including the use of a dummy passive element. A dummy passive element is a passive element or wire which is added to the chip layout to aid in planarization but is not used in the active circuit. One embodiment of the method includes forming the passive element and a dummy passive element adjacent to the passive element; forming a dielectric layer over the passive element and the dummy passive element, wherein the dielectric layer is substantially planar between the passive element and the dummy passive element; and forming in the dielectric layer an interconnect to the passive element through the dielectric layer and a dummy interconnect portion overlapping at least a portion of the dummy passive element. The methods eliminate the need for planarizing. | 2012-05-31 |
| 20120133023 | THREE DIMENSIONAL INTEGRATED DEEP TRENCH DECOUPLING CAPACITORS - A method of forming an integrated circuit device includes forming a plurality of deep trench decoupling capacitors on a first substrate; forming a plurality of active circuit devices on a second substrate; bonding the second substrate to the first substrate; and forming electrical connections between the deep trench capacitors and the second substrate. | 2012-05-31 |
| 20120133024 | Semiconductor Device and Method for Manufacturing a Semiconductor Device - According to an embodiment, a method for manufacturing a semiconductor device is provided. The method includes providing a mask layer which is used as an implantation mask when forming a doping region and which is used as an etching mask when forming an opening and a contact element formed in the opening. The contact element is in contact with the doping region. | 2012-05-31 |
| 20120133025 | APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION - An apparatus includes an electrostatic discharge (ESD) protection device configured to protect a circuit from ESD conditions. The protection device includes an emitter region having a first diffusion polarity; a collector region laterally spaced apart from the emitter region, and having the first diffusion polarity; and a barrier region interposed laterally between the emitter region and the collector region while contacting the emitter region. The barrier region has a second diffusion polarity opposite from the first diffusion polarity. The device can further include a base region having the second diffusion polarity, and laterally surrounding and underlying the emitter region and the barrier region. The barrier region can have a higher dopant concentration than the base region, and block a lateral current flow between the collector and emitter regions, thus forming a vertical ESD device having enhanced ESD performance. | 2012-05-31 |
| 20120133026 | Electrically Actuated Device And Method Of Controlling The Formation Of Dopants Therein - An electrically actuated device includes a first electrode, a second electrode, and an active region disposed between the first and second electrodes. The device further includes at least one of dopant initiators or dopants localized at an interface between i) the first electrode and the active region, or ii) the second electrode and the active region, or iii) the active region and each of the first and second electrodes. | 2012-05-31 |
| 20120133027 | Semiconductor substrate suitable for the realisation of electronic and/or optoelectronic devices and relative manufacturing process - A semiconductive substrate that is suitable for realising electronic and/or optoelectronic devices that include at least one substrate, in particular of single crystal silicon, and an overlying layer of single crystal silicon. Advantageously, the semiconductive substrate comprises at least one functional coupling layer suitable for reducing the defects linked to the differences in the materials used. The functional coupling layer can comprise a corrugated portion made in the layer of single crystal silicon and suitable for reducing the defects linked to the differences in lattice constant of such materials used. Alternatively, the functional coupling layer can comprise a porous layer arranged between the substrate of single crystal silicon and the layer of single crystal silicon, and suitable for reducing the stress caused by the differences between the thermal expansion coefficients of the materials used. A manufacturing process of such a semiconductive substrate is also described. | 2012-05-31 |
| 20120133028 | METHOD OF PRODUCING A THIN LAYER OF SEMICONDUCTOR MATERIAL - A semiconductor structure includes a thin semiconductor layer fixed on an applicator or flexible support, the thin layer having an exposed surface characterized by fractured solid bridges spaced apart by cavities. A method of producing the thin layer of semiconductor material includes implanting ions into the semiconductor wafer to define a reference plane, where the ion dose is above a minimum dose, but below a critical dose so as to avoid degrading the wafer surface. The method further includes applying a thermal treatment to define a layer of microcavities and applying stress to free the thin layer from the wafer. | 2012-05-31 |
| 20120133029 | METHOD OF NANOSTRUCTURING A FILM OR A WAFER OF MATERIAL OF THE METAL OXIDE OR SEMI-CONDUCTOR TYPE - A method for nanostructuring a film ( | 2012-05-31 |
| 20120133030 | TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF - The disclosure provides a TSV substrate structure and the stacked assembly of a plurality of the substrate structures, the TSV substrate structure including: a substrate comprising a first surface, a corresponding second surface, and a TSV communicating the first surface with the second surface through the substrate; and a conductor unit completely filling the TSV, the conductor unit comprising a conductor body which has a first and a second ends corresponding to the first and second surfaces of the substrate, respectively. | 2012-05-31 |
| 20120133031 | FABRICATION OF SELF-ASSEMBLED NANOWIRE-TYPE INTERCONNECTS ON A SEMICONDUCTOR DEVICE - Consistent with an example embodiment, there is a semiconductor device with nanowire-type interconnect elements. | 2012-05-31 |
| 20120133032 | PACKAGE HAVING ESD AND EMI PREVENTING FUNCTIONS AND FABRICATION METHOD THEREOF - A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits. | 2012-05-31 |
| 20120133033 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI-ROW LEADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a base structure having an intermediate lead with an intermediate concave side and an intermediate convex side, a peripheral lead with a peripheral concave side and a peripheral convex side, and a paddle with a paddle concave side and a paddle convex side; applying an inner multi-layer finish directly on the intermediate concave side, the peripheral concave side, and the paddle concave side; applying an outer multi-layer finish directly on the intermediate convex side, the peripheral convex side, and the paddle convex side; mounting an integrated circuit device over the inner multi-layer finish; attaching an interconnect directly to the inner multi-layer finish on the peripheral concave side and directly to integrated circuit device; and applying an encapsulation over the integrated circuit device, the interconnect, and the base structure, with the outer multi-layer finish exposed from the encapsulation. | 2012-05-31 |
| 20120133034 | LEAD FRAME FOR ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - In a lead frame for an electronic component according to the present invention, a metal plate 3 is extended by a punch 5 into a hole 4 formed on a metal plate 2 and the two metal plates are connected on the inner surface of the hole 4, thereby improving a bonding strength while keeping the small size and thickness of the lead frame with a simple method. | 2012-05-31 |
| 20120133035 | TCP-TYPE SEMICONDUCTOR DEVICE AND METHOD OF TESTING THEREOF - A semiconductor device includes a base film, a semiconductor chip mounted on the base film, and a plurality of leads formed on the base film, each of the leads including one end coupled to the semiconductor chip and another end being opposite to the one end. The another end of a first one of the leads and the another end of a second one of the leads are located at different positions respectively between the semiconductor chip and a cut line along which the base film is cut. | 2012-05-31 |
| 20120133036 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION SUPPORTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad; forming a support structure between the inner pad and the outer pad; mounting an integrated circuit device over the component pad; attaching an interconnect to the integrated circuit device and the outer pad, the interconnect above the inner pad and supported by the support structure; and applying an encapsulation over the connection structure, the interconnect, and the integrated circuit device. | 2012-05-31 |
| 20120133037 | CLIP INTERCONNECT WITH ENCAPSULATION MATERIAL LOCKING FEATURE - A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part. The locking feature is located in at least one of the plurality of sides of the bridge part. The locking feature comprises an alternating pattern of teeth and valleys. | 2012-05-31 |
| 20120133038 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE - An integrated circuit package system includes a trace frame includes: an encapsulant; a first series of bonding pads along a length of the encapsulant; a second series of the bonding pads along a width of the encapsulant; conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and a first integrated circuit die on the encapsulant and on the conductive traces that extend beyond the first integrated circuit die. | 2012-05-31 |
| 20120133039 | SEMICONDUCTOR PACKAGE WITH THERMAL VIA AND METHOD OF FABRICATION - A semiconductor package includes a block for encapsulating a microchip and its electrical connection wires. The encapsulating block has at least one front recess disposed on top of the microchip. A thermally conducting filling material fills the front recess so as to form a thermal via. A radiating structure is attached over the encapsulating block and in thermal communication with the thermal via. | 2012-05-31 |
| 20120133040 | SEMICONDUCTOR CHIP AND SOLAR SYSTEM - There is provided a semiconductor chip having four sides and being substantially formed in a rectangle, the semiconductor chip including: a first terminal which is located along one side of the four sides of the semiconductor chip and which is to be electrically connected to a solar cell outside the semiconductor chip; a second terminal which is located along the one side of the semiconductor chip and which is to be electrically connected to a secondary cell outside the semiconductor chip; and an interconnection line that electrically interconnects the first terminal and the second terminal. | 2012-05-31 |
| 20120133041 | Semiconductor Devices Having Electrodes and Methods of Fabricating the Same - Some embodiments provide a semiconductor device including a substrate having a first surface and an opposite second surface. An electrode extends within the substrate towards the first surface and has a protruding portion extending from the first surface. A supporting portion extends from the first surface of the substrate to a sidewall of the protruding portion that supports the protruding portion. Methods of fabricating the same are also provided. | 2012-05-31 |
| 20120133042 | MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME - A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent. | 2012-05-31 |
| 20120133043 | Solder Joint Flip Chip Interconnection - A flip chip interconnect has a tapering interconnect structure, and the area of contact of the interconnect structure with the site on the substrate metallization is less than the area of contact of the interconnect structure with the die pad. Also, a bond-on-lead or bond-on-narrow pad or bond on a small area of a contact pad interconnection includes such tapering flip chip interconnects. Also, methods for making the interconnect structure include providing a die having interconnect pads, providing a substrate having interconnect sites on a patterned conductive layer, providing a bump on a die pad, providing a fusible electrically conductive material either at the interconnect site or on the bump, mating the bump to the interconnect site, and heating to melt the fusible material. | 2012-05-31 |
| 20120133044 | METAL CONTAINING SACRIFICE MATERIAL AND METHOD OF DAMASCENE WIRING FORMATION - According to one embodiment, a via and trench are formed in a semiconductor structure. The via and the trench are suitable for having a metal-based wire placed therein by damascene, dual damascene, plating and other suitable techniques. The via is etched into a dielectric layer of a semiconductor structure comprising a base cap layer, the dielectric layer formed over the base cap layer, and a hardmask formed over the dielectric layer. The via is filled with a sacrifice material, where the sacrifice material contains a metal or a metal compound, where the sacrifice material additionally forms a sacrifice layer over the hardmask layer. The sacrifice material placed in the via does not contain a material or film containing a Si—O bond. The sacrifice material is used as a support for a photomask that is placed over the sacrifice layer, where the photomask is developed to have a trench pattern formed therein. Then, one or more of the hardmask layer and the dielectric layer is etched with the trench pattern, and the sacrifice material and the sacrifice layer are removed by contact with a remover solution containing one or more selected from an acidic compound, water, a base compound, and an oxidant. | 2012-05-31 |
| 20120133045 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. | 2012-05-31 |
| 20120133046 | SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF - A semiconductor structure and a process thereof are provided. The semiconductor structure includes a semiconductor wafer having a first surface and a second surface opposite to the first surface, through silicon vias and a crack stopping slot. The through silicon vias are embedded in the semiconductor wafer and connected between the first surface and the second surface. The crack stopping slot is located in the periphery of the second surface of the semiconductor wafer. The depth of the crack stopping slot is less than or equal to the thickness of the semiconductor wafer. The process firstly provides a semiconductor wafer having through silicon vias. Then, the aforementioned crack stopping slot is formed at a back side of the semiconductor wafer opposite to the first surface. Next, the semiconductor wafer is thinned from the back side to expose a second end of each through silicon via. | 2012-05-31 |
| 20120133047 | Method of Plating Through Wafer Vias in a Wafer for 3D Packaging - Therefore, a method of plating wafer via holes in a wafer is provided. A substrate ( | 2012-05-31 |
| 20120133048 | SEMICONDUCTOR DEVICE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE - In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector. | 2012-05-31 |
| 20120133049 | Process of Fabricating Semiconductor Device and Through Substrate via, and Through Substrate via Structure Therefrom - A method of fabricating a semiconductor device, a process of fabricating a through substrate via and a substrate with through vias are provided. The substrate with through vias includes a semiconductor substrate having a back surface and a via penetrating the back surface, a metal layer, a first insulating layer and a second insulating layer. The first insulating layer is formed on the back surface of the substrate and has an opening connected to the through via. The second insulating layer is formed on the first insulating layer and has a portion extending into the opening and the via to form a trench insulating layer. The bottom of the trench insulating layer is etched back to form a footing portion at the corner of the via. The footing portion has a height less than a total height of the first and second insulating layers. | 2012-05-31 |
| 20120133050 | TUNNEL JUNCTION VIA - A memory device comprising a plurality of tunnel junctions (TJs) includes a bottom wiring layer; a top wiring layer; a plurality of TJs contacting the bottom wiring layer and the top wiring layer; and a plurality of tunnel junction vias (TJVs) contacting the bottom wiring layer and the top wiring layer, wherein the plurality of TJVs each have a lower resistance the each of the plurality of TJs, wherein the plurality of TJVs comprise at least one concave surface, and wherein the at least one concave surface of the plurality of TJVs is configured to trap etched material during formation of the TJVs so as to reduce the resistance of the plurality of TJVs. | 2012-05-31 |
| 20120133051 | SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE - A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing interconnections through the silicon carrier to the chip; liquid microchannels for cooling; a liquid coolant flowing through the microchannels; and an interconnect to one or more chips or chip stacks. | 2012-05-31 |
| 20120133052 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes an embedding layer in which one or more semiconductor element(s) is embedded and one or more interconnect layers as well as one or more insulation layers on one or both sides of the embedding layer. The embedding layer includes a woven cloth formed by reinforcement fibers. The woven cloth has an opening on its site embedding the semiconductor element. The opening is arranged so that direction of the reinforcement fibers will have a preset angle with respect to a direction of a side of or a tangent to at least a portion of the opening, the preset angle being other than a square angle or a zero angle (parallelism). | 2012-05-31 |
| 20120133053 | SURFACE MOUNT SEMICONDUCTOR DEVICE - A surface mount semiconductor device has a semiconductor die encapsulated in a molding compound. Electrical contact elements of an intermediate set are disposed on the molding compound. A set of coated wires electrically connect bonding pads of the semiconductor die and the electrical contact elements of the intermediate set. A layer of insulating material covers the coated wires, the die and the electrical contact elements of the intermediate set. Electrically conductive elements are exposed at an external surface of the layer of insulating material and contact respective electrical contact elements of the intermediate set through the layer of insulating material. | 2012-05-31 |
| 20120133054 | DETECTOR ARRAY WITH A THROUGH-VIA INTERPOSER - A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack. | 2012-05-31 |
| 20120133055 | Semiconductor chip and semiconductor device - A semiconductor chip capable of realizing reduction in cost when the semiconductor chip is mounted over a package substrate, miniaturization of the package substrate, and optimization of an interconnect pattern. The semiconductor chip includes a first electrode pad group provided in the semiconductor chip, and comprised of at least one electrode pad, and a second electrode pad group provided in the semiconductor chip, and comprised of at least one other electrode pad capable of outputting a signal identical to a signal outputted by the one electrode pad. Further, either the one electrode pad of the first electrode pad group, or the one other electrode pad of the second electrode pad group, closer in distance to one other electrode pad of one other semiconductor chip is coupled to the one other electrode pad of the one other semiconductor chip. | 2012-05-31 |
| 20120133056 | SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS AND SEMICONDUCTOR DEVICE FABRICATING METHOD - There is provided a semiconductor device which includes a primary semiconductor chip | 2012-05-31 |
| 20120133057 | EDGE CONNECT WAFER LEVEL STACKING - A stacked microelectronic assembly includes a first stacked subassembly and a second stacked subassembly overlying a portion of the first stacked subassembly. Each stacked subassembly includes at least a respective first microelectronic element having a face and a respective second microelectronic element having a face overlying and parallel to a face of the first microelectronic element. Each of the first and second microelectronic elements has edges extending away from the respective face. A plurality of traces at the respective face extend about at least one respective edge. Each of the first and second stacked subassemblies includes contacts connected to at least some of the plurality of traces. Bond wires conductively connect the contacts of the first stacked subassembly with the contacts of the second stacked subassembly. | 2012-05-31 |
| 20120133058 | SEMICONDUCTOR DEVICE - The semiconductor device has the CSP structure, and includes: a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps are arranged in two rows along the periphery of the semiconductor device. The electrode pads are arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring is extended from an electrode pad, and is connected to any one of the outermost solder bumps or any one of the inner solder bumps. | 2012-05-31 |
| 20120133059 | RADIATION CURABLE INK JET COMPOSITION, RECORDED MATTER, AND INK JET RECORDING METHOD - The invention provides a radiation curable ink jet ink composition including: a monomer equal to or more than 20% by mass and equal to or less than 50% by mass with respect to the total mass of the ink composition, which is represented by the following formula (I); and N-vinylcaprolactam equal to or more than 5% by mass and equal to or less than 15% by mass with respect to the total mass of the ink composition: | 2012-05-31 |
| 20120133060 | RADIATION-CURABLE INK JET COMPOSITION, RECORDING MATTER, AND INK JET RECORDING METHOD - A radiation-curable ink jet ink composition contains a polymerizable compound, an photopolymerization initiator and polysiloxane, in which the ink composition is used for recording on a package substrate as a recording medium; the polymerizable compound contains one or more kinds of compound having a pentaerythritol skeleton; an HLB value of the polysiloxane is 5 to 12; and the polysiloxane content is 0.1 to 2% by mass with respect to the total amount of the ink composition. | 2012-05-31 |
| 20120133061 | PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME - To provide a photosensitive adhesive which is sufficiently excellent in terms of all the properties of attachment, pattern formability, thermocompression bondability and high-temperature adhesion, and which has thermocompression bondability for adherends after patterning by exposure and development, and is capable of alkali development, as well as a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer and a semiconductor device, which employ the same. A photosensitive adhesive comprising (A) an imide group-containing resin with a fluoroalkyl group, (B) a radiation-polymerizable compound, (C) a photoinitiator and (D) a thermosetting component. | 2012-05-31 |
| 20120133062 | HIGH-SPEED CENTRIFUGAL ATOMIZATION MIXING NET FOR EXHAUST OUTLET PIPE - A high-speed centrifugal atomization mixing net for an exhaust outlet pipe, including a spray pipe, a shaft sleeve, an induced air blade, and an atomization net. The spray pipe is capable of rotating. The shaft sleeve is fixedly disposed on the spray pipe. The induced air blade is disposed on the front of the shaft sleeve. The atomization net is disposed at the back of the shaft sleeve. A spray hole opposite to the shaft sleeve is disposed on a side wall of the spray pipe. Multiple inclined spray grooves are disposed on side wall of the shaft sleeve. An end of the induced air blade is bent. The bending direction of the induced air blade is the same as an inclination direction of the induced air blade. The bent part of the induced air blade is connected to an outer edge of the atomization net whereby forming a stop plate. | 2012-05-31 |
| 20120133063 | JET STREAM GENERATING METHOD AND APPARATUS - A condensing system is provided. The condensing system may include baffle plate units having a substantially flat surface and openings configured for cooling fluid to flow through; and baffles attached to the baffle plate unit, the baffles oriented at an acute angle with respect to the baffle plate unit, the baffles having a flat surface and figured to diffuse a cooling fluid into a thin, turbulent film at a similar acute angle. A method of condensing a fluid is provided. The method includes defining a path for the fluid to be condensed to flow; spraying a cooling fluid against a baffle thereby creating a turbulent film of cooling fluid in the path for the fluid to be condensed and orienting some of the baffles to create a film of cooling fluid oriented in one direction and orienting other baffles to create a film of cooling fluid in a second direction wherein the path of the fluid to be condensed causes the fluid to be condensed to flow over films oriented in both the first and second directions. | 2012-05-31 |
| 20120133064 | SYSTEMS AND METHODS FOR THE PRODUCTION OF CONTACT LENSES - An apparatus for spin casting lenses includes a rotatable tube, the rotatable tube defining a longitudinal cavity, wherein the longitudinal cavity is configured to receive molds. According to one exemplary embodiment, the rotatable tube is made of metal and includes a plurality of apertures configured to permit the transmission of actinic radiation. | 2012-05-31 |
| 20120133065 | REAL-TIME, CLOSED-LOOP SHAPE CONTROL OF EXTRUDED CERAMIC HONEYCOMB STRUCTURES - Systems and methods for real-time, closed-loop shape control of extruded ceramic honeycomb structures are disclosed. Methods include extruding batch material through an extruder barrel and through an extruder die using at least one extrusion screw to form the extrudate, and measuring a shape of the extrudate immediately adjacent the die. The batch material water content is determined or measured, at least one of the extruder barrel and screw temperature are measured, and the extrusion screw rotation rate are measured. At least one of the batch material water content, barrel temperature, screw temperature and rotation rate is adjusted to maintain the extrudate shape to within a select tolerance. | 2012-05-31 |
| 20120133066 | DEVICE FOR REGULATING DEFORMATIONS OF THE BED OF A GEOMETRICALLY AERODYNAMIC MOLD AND MOLDING METHOD WITH THIS DEVICE - The invention describes a regulating device that adapts to the aerodynamic profile of a mold bed made of composite material offsetting the geometrical deviations occurring in the mold bed. The device comprises some stiffening ribs ( | 2012-05-31 |
| 20120133067 | AUTOCLAVE MOLDING METHOD AND AUTOCLAVE MOLDING APPARATUS - The composite material formed of a fiber substrate and a matrix is placed in a vacuum bag and then in the molding chamber. Saturated steam of a predetermined temperature needed for the composite material is supplied to the molding chamber, and the temperature and the pressure inside the molding chamber are controlled so that the inside of the molding chamber may be maintained at a predetermined temperature and a predetermined pressure needed for the composite material in order to carry out a curing step. | 2012-05-31 |
| 20120133068 | INSULATION CONTAINING HEAT EXPANDABLE SPHERICAL ADDITIVES, CALCIUM ACETATE, CUPRIC CARBONATE, OR A COMBINATION THEREOF - A method of making thermal insulation includes, forming a thermal insulation product precursor having randomly distributed inorganic fibers and about 5-500 wt. % heat-expandable hollow microspheres in dry or slurry form and having a polymeric shell and having disposed therein a blowing agent or gas, and calcium acetate or cupric carbonate, or a combination of calcium acetate and cupric carbonate, and heating the precursor to expand the microspheres. | 2012-05-31 |
| 20120133069 | MOLDING METHOD FOR EXPANDABLE POLYPROPYLENE - The present invention provides a vacuum thermoforming process-combined one-step molding method for expandable polypropylene, comprising the steps of silk screen printing on a plastic sheet, subjecting the plastic sheet to vacuum thermoforming to provide a vacuum thermoforming part, and foaming an expandable polypropylene and integratedly molding the expandable polypropylene with the vacuum thermoforming part. The expandable polypropylene vacuum thermoforming product produced by the method according to the present invention exhibits an improved impact resistance, and the production process is more superior. | 2012-05-31 |
| 20120133070 | SAFETY STUFFED TOY AND METHOD FOR PRODUCING THE SAME - A safety stuffed toy has a latex body formed to define an exterior appearance and having a chamber therein, and a PU stuffing formed by polyurethane foam, fully filled in the chamber and adhered to an inner wall of the latex body. A method for producing a safety stuffed toy has a mold preparing step, a latex injecting step, a polyurethane filling step, a foaming step and a demolding step. As the PU stuffing is securely bonded to the latex body and won't be easily fragmented, the present invention is advantageous in providing a safer stuffed toy. Besides, the foaming process of the polyurethane foam material spontaneously and extensively spreads the polyurethane foam material inside the chamber of body to facilitate stuffing the body effectively. | 2012-05-31 |
| 20120133071 | METHOD FOR PRODUCING LEATHER PELLETS AND COMPOUND GRANULES, AND USE THEREOF - A method for producing leather pellets, and a method for producing compound granules from leather pellets and a polymer material, for use in molded parts or films. The leather pellets are produced through the following steps: Shavings, crust leather remnants and finished leather waste are obtained as waste products in leather production and finished leather processing; the shavings, crust leather remnants and finished leather waste are milled into ground leather stock comprising leather fibers; the ground stock is pressed into leather pellets; and the leather pellets are dried to a residual moisture content of no more than 30% by weight. The leather pellets can be mixed with a polymer material at a ratio of 10-95% by weight and bonded to one another and shaped forming compound granules. The compound granules can be used to produce molded parts by injection molding or films by calendering. | 2012-05-31 |
| 20120133072 | FULLY-CURED THERMALLY OR ELECTRICALLY CONDUCTIVE FORM-IN-PLACE GAP FILLER - Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An amount of the compound is dispensed from a nozzle, screen, stencil, or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound. | 2012-05-31 |
| 20120133073 | MOLASSES BINDER - A binder based predominantly on molasses which incorporates both polymeric and monomeric polycarboxylic acid components to form a composite including both melanoidin and polyester polymeric structures. The binder incorporates the chemical profile of molasses with a mixture of polycarboxylic acids which combines to form a strong and weatherable binder composition which may be used to bind loosely or non-assembled matter. | 2012-05-31 |
| 20120133074 | METHOD FOR MAKING WASTE COLLECTION TUBE - A method for making a waste collection tube for a dry electrophotographic printer includes molding an open construction waste tube which has mirror construction symmetry. A first half and a second half of the open construction waste tube are joined by a flexible hinge. The first half and the second half of the open construction waste tube is folded together along the hinge which joins the first half and the second half together. | 2012-05-31 |
| 20120133075 | Carbonated Beverage Delivery Tubes and Methods for Carbonated Beverage Dispensers - Carbonated beverage delivery tubes and methods for fabrication having a unitary molded structure to define a smooth beverage intake of decreasing area to a smaller diameter flexible plastic tube, and at the other end of the small diameter plastic tube, a smooth transition through an outward flaring region to decrease the velocity of the beverage without initiating foaming within the carbonated beverage delivery. | 2012-05-31 |
| 20120133076 | IMPRINT LITHOGRAPHY - An imprinting method is disclosed that, in embodiment, includes contacting first and second spaced target regions of an imprintable medium on a substrate with first and second templates respectively to form respective first and second imprints in the medium and separating the first and second templates from the imprinted medium. | 2012-05-31 |
| 20120133077 | Resin Mold for Imprinting and Method for Producing the Same - Provided is a resin mold for imprinting which is free from transfer defects, has excellent releasability from a resin subjected to imprinting, and does not cause any defect by imprinting. The resin mold for imprinting includes a resin layer having a recessed and projected pattern surface, an inorganic material layer formed with a uniform thickness on at least the recessed and projected pattern surface of the resin layer, and a release agent layer formed with a uniform thickness on at least the recessed and projected pattern surface of the inorganic material layer. | 2012-05-31 |
| 20120133078 | Step and Flash Imprint Lithography - A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer. | 2012-05-31 |
| 20120133079 | SILICONE RUBBER COMPOSITIONS - The present invention relates to silicone rubber compositions, methods for their preparation and uses thereof. In particular, the invention relates a heat curable silicone rubber composition comprising: 100 parts by weight of a defined HCR silicone elastomer; 0.5 to 30 parts by weight of hollow filler; and 0.1 to 3.0 parts by weight of a curing agent. | 2012-05-31 |
| 20120133080 | Additive Manufacturing Methods for Improved Curl Control and Sidewall Quality - There is provided methods and apparatus for improving the accuracy of three-dimensional objects formed by additive manufacturing. By depositing or hardening build material within the interior of the layers in certain patterns, the stresses that lead to curl in the object can be isolated and controlled. Similarly, certain patterns for depositing or hardening the build material provide for reduced layer thicknesses to improve the sidewall quality of the object being formed. The patterns within the interior of the layers can include gaps or voids for particular layers being deposited or hardened, and the gaps or voids can be partially filled, fully filled, or not filled at all when subsequent layers are deposited or hardened. Accordingly, the accuracy of three-dimensional objects formed by additive manufacturing is improved. | 2012-05-31 |
| 20120133081 | METHOD AND APPARATUS FOR MANUFACTURING TIRE | 2012-05-31 |
| 20120133082 | DEVICE AND METHOD FOR MANUFACTURING TIRE TREAD FEATURES - A device and method for manufacturing features into the tread of a tire are provided. The device and method provide for manufacturing tread features of various shapes and sizes. The tread features may be recessed, protruding, or flush with respect to the surrounding tread surface. The device and method may be used for both new tire constructions as well as retreading operations. | 2012-05-31 |
| 20120133083 | Stereolithography Machine - The invention is a stereolithography machine ( | 2012-05-31 |
| 20120133084 | Method of processing a substrate - In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into the trench, the imprint material in the trench may be embossed using a stamp device, and the stamp device may be removed from the trench. | 2012-05-31 |
| 20120133085 | CERAMIC GREEN SHEET DRYING APPARATUS AND METHOD OF FABRICATING CERAMIC GREEN SHEET USING THE SAME - There is provided a method of fabricating a ceramic green sheet, the method including: forming a ceramic green sheet by applying ceramic slurry onto a support substrate; and drying the ceramic green sheet by allowing the ceramic green sheet to pass through a plurality of drying zones, wherein positive internal differential pressure is applied to at least one of drying zones disposed at a front end of the plurality of drying zones, the internal differential pressure being defined as a pressure value obtained by subtracting a discharging pressure (P | 2012-05-31 |
| 20120133086 | MEASURING TIRE PRESSURE IN A TIRE MOLD - Pressure sensors may be used to directly measure the pressure between a green tire and a curing apparatus during shaping and/or during curing. | 2012-05-31 |
| 20120133087 | METHOD AND APPARATUS FOR MANUFACTURING ARTICLES WITH THE HELP OF A MOULD - The object of the invention is a method and an apparatus for manufacturing articles with the help of a mould. The solution according to the invention comprises a strong pressure-resistant frame ( | 2012-05-31 |
| 20120133088 | LARGE REFRACTORY ARTICLE AND METHOD FOR MAKING - A method of sintering large refractory ceramic articles is disclosed. The method includes supporting a green refractory body on a plurality of support plates, the support plates in turn being supported by a plurality of support members having arcuate upper and lower surfaces. A setter material is disposed between the green refractory body to be sintered and the support plates. As the refractory body is sintered, the density of the article increases. Concurrently, the dimensions of the body decrease, which shrinkage, unless otherwise accommodated, may cause fracture of the body. The support plates and the structure of the support members, move to prevent the development of detrimental stresses in the refractory body as it sinters. | 2012-05-31 |
| 20120133089 | HEAT TREATMENT FURNACE - A heating section | 2012-05-31 |
| 20120133090 | Supplementary vehicle spring assembly - A supplementary vehicle spring assembly for a leaf spring of a vehicle is provided, the leaf spring defining a fixed end and a free end. The supplementary vehicle spring assembly comprises a first tension spring arrangement fitted to the fixed end of the leaf spring, a second tension spring arrangement fitted to the free end of the leaf spring, and a bracket arrangement proximate an axle of the vehicle, the bracket arrangement connecting the first and second tension spring arrangements. The first and second tension spring arrangements each comprise a connector arm for securing the arrangements to the respective ends of the leaf spring, a first connector rod extending from the connector arm and being secured to a first end of at least one tension spring, and a second connector rod extending from a second end of the tension spring, the second connector rods securing the first and second tension spring arrangements to opposite ends of the bracket arrangement. | 2012-05-31 |
| 20120133091 | ROLL-ROD FOR VEHICLE - A roll-rod for a vehicle includes an inner pipe protruding from an end surface of a roll-rod body which penetrates an insulator engaged to a bracket and an end plate may be coupled to a rear side of the inner pipe, a fastening bolt being mounted to fasten the end plate to the inner pipe, wherein the insulator has a supporter inserted into a through-hole formed in the bracket and having a pipe shape, and a first front stopper extended from the supporter and protruding to the front of the bracket, and a first rear stopper extended from the supporter and protruding to the rear of the bracket, wherein the first front stopper, the first rear stopper and the supporter may be integrally molded to be fixedly coupled to the bracket. | 2012-05-31 |
| 20120133092 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS - A sheet feeding device includes: a sheet storage unit that stores a sheet stack of a plurality of sheets; and a plurality of nozzles configured to generate air currents blown out to the sheet stack, the air currents separate an uppermost sheet from the rest of stack of the plurality of sheets including a next sheet, the next sheet being situated immediately below the uppermost sheet. | 2012-05-31 |
| 20120133093 | SHEET CONVEYING DEVICE HAVING FUNCTION OF CORRECTING SKEW OF SHEET - A sheet conveying device that makes it possible to perform printing at high speed with high accuracy by easily correcting skew of a sheet, such as an index tab sheet, without requiring troublesome operations. Sheet detection sensors for detecting a sheet and skew correction rollers for conveying the sheet are disposed in a direction crosswise to a conveying direction of the sheet. A skew correction drive controller measures a leading edge detection time between respective detections of a leading edge of the sheet by the sensors, and controls the conveying speeds of the skew correction rollers independently of each other such that a skew represented by the leading edge detection time is corrected. If the leading edge detection time is not smaller than a predetermined threshold value, the skew correction drive controller reduces a skew correction amount for correcting the skew by a predetermined amount. | 2012-05-31 |
| 20120133094 | SHEET-CONVEYING APPARATUS AND IMAGE-READING APPARATUS - Provided is a sheet-conveying apparatus including: a skew-feeding correction member having an abutting portion which is brought into contact with a conveyed sheet; and a positioning portion positioning the skew-feeding correction member and having a biasing member for biasing the skew-feeding correction member to a direction opposite to a direction to which the skew-feeding correction member rotates by the sheet. The sheet-conveying apparatus is set so that a formula M+M| 2012-05-31 | |
| 20120133095 | PAPER-STOPPING MECHANISM OF AUTOMATIC DOCUMENT FEEDER - A paper-stopping mechanism of an automatic document feeder is provided. The paper-stopping mechanism comprises an auxiliary gear, a traction member and a paper-stopping arm. As a paper pick-up arm of the automatic document feeder is moved upwardly or downwardly, the auxiliary gear is rotated in different directions. Upon rotation of the auxiliary gear, the auxiliary gear is engaged with a rack of the traction member to drive movement of the traction member. Consequently, a transverse rod of the traction member is sustained against the paper-stopping arm or raises the paper-stopping arm. When the transverse rod is sustained against the paper-stopping arm, the paper-stopping arm fails to be rotated in the paper-feeding direction, so that the function of stopping the paper is achieved. | 2012-05-31 |
| 20120133096 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - The invention is directed to providing a sheet feeding apparatus including a stop mechanism configured to stop a sheet storage unit while the sheet storage unit is being drawn out from an apparatus main body, a stop release mechanism configured to release stop of the sheet storage unit by a stop mechanism and to enable detachment from the apparatus main body, a holding mechanism configured to hold a release state using the stop release mechanism of the stop of the sheet storage unit by the stop mechanism, and a return mechanism configured to release the holding of the release state of the stop mechanism by the holding mechanism while the sheet storage unit is being attached to the apparatus main body, and to return the sheet storage unit to a stop state using the stop mechanism. | 2012-05-31 |
| 20120133097 | Compact transportable target game - A target game has a target apparatus and at least one throwing device. | 2012-05-31 |
| 20120133098 | ANTI-EXTRUSION BACKUP SYSTEM, PACKING ELEMENT SYSTEM HAVING BACKUP SYSTEM, AND METHOD - An antiextrusion backup system includes an inner expandable backup ring having a first set of slots. An outer expandable backup ring having a second set of slots wherein the outer expandable back up ring is rotationally locked to the inner expandable backup ring to prevent an extrusion gap in an expanded condition of the backup rings. A method for operating within a tubular is also included. | 2012-05-31 |
| 20120133099 | MECHANICAL SEAL ASSEMBLY WITH COMPENSATION ELEMENT - The invention relates to a mechanical seal assembly for sealing between a high pressure region ( | 2012-05-31 |
| 20120133100 | COMPRESSION UNIT - A compression unit ( | 2012-05-31 |
| 20120133101 | METHOD AND APPARATUS FOR PACKING RINGS - A seal assembly for a turbomachine is provided. The turbomachine includes a stationary housing and a rotor rotatable about an axis. The seal assembly includes a plurality of arcuate packing ring segments disposed intermediate to the rotor and the stationary housing, and a plurality of inter-segment gaps disposed between the plurality of arcuate packing ring segments. The plurality of inter-segment gaps are inclined at a first angle from a radial axis of the rotor and inclined in a direction of motion of the plurality of arcuate packing ring segments. The seal assembly also includes a biasing member disposed intermediate to the stationary housing and the plurality of arcuate packing ring segments and coupled to both. | 2012-05-31 |
| 20120133102 | CLOTH SEAL FOR TURBO-MACHINERY - The present invention provides a cloth seal for use with turbine components. The cloth seal may include a number of cloth layers, a shim positioned between the cloth layers, and an end seal positioned at an end of the cloth layers so as to block a leakage flow path through at least one of the cloth layers. | 2012-05-31 |
| 20120133103 | FIXTURE FOR SECURING A THIN-WALLED COMPONENT - A fixture for securing a cylindrical or shell thin-walled component includes a support having one or more securing devices for securing the component to the support. The fixture also includes an inflatable pressure element which, in use, is positioned within the secured component and is adapted to press outwardly, when inflated, against a liner inserted between the pressure element and the inner thin wall of the component. The liner has one or more elastic members, which bias it against the outward expansion of the inflated pressure element. The inflated pressure element and the liner damp vibrations in the component during machining of the outer side of the thin wall. | 2012-05-31 |
| 20120133104 | ROLLER SKATE - The present invention relates to an inline frame ( | 2012-05-31 |
| 20120133105 | STROLLER WITH BRAKING DEVICE - A stroller with a braking mechanism that automatically configures itself in a braking position provides protection against the unattended stroller from rolling away. By applying force to a handle, the braking mechanism is released and the stroller is able to be pushed as usual. The handle and braking mechanism are biased in the braking position by a spring located near the rear wheels. The braking mechanism applies sufficient frictional force against the tire of the wheel to prevent the wheel from rolling. | 2012-05-31 |
| 20120133106 | FOLDABLE WALKER APPARATUS - There is provided a wheel mounting assembly having a wheel fork. The fork includes an interior and an inwardly extending protrusion disposed within the interior. The assembly includes a rotatable member operatively connected to the fork and disposed within the interior of the fork. The protrusion abuts and positions in place the rotatable member. The assembly includes a shaft. The rotatable member rotatably connects the shaft to the wheel fork. The assembly includes a retaining member connected to the shaft. The retaining member is configured to abut the protrusion of the fork and thus inhibit dislodgement of the rotatable member from the fork when the shaft is tilted relative to the fork. | 2012-05-31 |
| 20120133107 | BICYCLE SEAT POST - A bicycle seat post includes a head for mounting with a seat, and a tubular body extending downwards from the head and having a hollow portion at a periphery thereof for insertion of a seat tube. Thus, the bicycle scat post can offer a flexible structure to increase the effective contact area between the tubular body and the seat tube, such that the bicycle seat post can be thinly fixed to the seat tube for enhancing the structural stabilization. | 2012-05-31 |
| 20120133108 | VEHICLE HAVING AT LEAST TWO WHEELS AND A SUSPENDED FRAME, AND EQUIPPED WITH A CARRIER ASSEMBLY - The invention relates to a vehicle having at least two wheels and having a suspended frame, with a carrier assembly designed, in particular, to perform a luggage rack or child seat carrier function. The vehicle includes a front chassis, a rockable rear assembly carrying a driving rear wheel, secured to the chassis via a shock-absorber system and hinged to said chassis about a first pivot point, and a carrier assembly comprising a carrier element having a front end and a rear end, and a support element having a top end and a bottom end. The front end of said carrier element is connected to the chassis, and its rear end is hinged to said top end of said support element about a second pivot point. The bottom end of the support element is hinged to the rockable rear assembly about a third pivot point. During compression of the shock-absorber system, the support element goes from a position in which the third pivot point is situated on a first side of the axis passing through the other two pivot points, to a position in which said third pivot point is situated on a second side of the axis, so that all three pivot points are substantially aligned at at least one stage of compression of the shock-absorber system. | 2012-05-31 |
| 20120133109 | Special wheelchair device for fully supporting the feet of the user - A special wheelchair device made for fully supporting the feet of the user. It relates to a support accessory for providing added comfort to a person confined to a wheelchair. It spans the space between the left and right foot rests. It is comprised of a length of a sleeve made of a durable material and configured with at least one open end; an elongated cross-section; an external top surface with features like a tread; an essentially smooth bottom surface featuring a shelf-like recess; and an internal aperture with features wherein one of the end with an internal aperture of the device may slide over and essentially encase either of the foot plates of the wheelchair and wherein the opposite end with the shelf may rest on the other un-encased foot plate which results in a closure of the space between the two foot plates. | 2012-05-31 |
| 20120133110 | Transportation Storage Device - A transportation storage device comprising a frame to provide a general shape for the transportation storage device, where the frame is wide enough to fit through a doorway; a plurality of adjustable height segments combined with a front height segment to create a peripheral support for the frame; a handle attached to a top portion of the frame to enable a user to control how the transportation storage device maneuvers; a pair of handle ends attached atop the plurality of adjustable height segments; a set of wheels attached to a bottom portion of the frame, where the set of wheels enables the user to push the transportation storage device; and a set of platforms attached between the plurality of adjustable height segments and the front height segment wherein the set of platforms provides a shelf for the user to place a plurality of items. | 2012-05-31 |
| 20120133111 | INTEGRATED INFUSION MANAGEMENT SYSTEM - An integrated infusion management system provides for stable support of components attached to the system, even when the system is mobile. The system is optionally a mobility assist or walker for a patient who is attached to any number of medical components. A central trunk connects to a two-sided base that does not interfere with patient motion. The trunk may be angled with respect to vertical and oriented to support medical components in a configuration that is tip-resistant. The system is optionally deployable to facilitate conversion between a compact storage configuration and a stable deployed configuration. In an embodiment, additional deployable features include holding arms for holding various medical components, wheels, mobility arms and handles. Also provided is a novel wheel system with deployable wheels and methods associated with providing compact storage of any one or more of the systems presented herein. | 2012-05-31 |
| 20120133112 | MULTI-FUNCTIONAL COLLAPSIBLE WHEELED APPARATUS - A wheeled apparatus includes a base having sides, a front, rear, upper surface and lower surface, with a pair of leaves forming sides of the base and pivotally connected thereto and a pair of gates forming the front and rear and pivotally connected to the base and leaves. A handle subassembly and a leg subassembly are connected to the base, with a wheel subassembly connected to the leg subassembly. The apparatus is configurable in a cart mode, a table mode with gates and leaves oriented in a flat horizontal plane, a dolly mode with leaves and gates connected to form a cart but with leg subassembly lowered closer to the ground relative to the cart mode, and a stowage mode, where the leaves and gates collapse into the base, the handle subassembly retracts into the base, and the leg subassembly collapses up into the lower surface of the base. | 2012-05-31 |
| 20120133113 | TRANSFER AND LOCOMOTION APPARATUS - Disclosed is a transfer and locomotion apparatus with excellent functionality, stability, versatility, and user-friendliness such that a person requiring nursing care can transfer between the transfer and locomotion apparatus to a bed and a toilet seat, etc., keeping the orientation of the body. The apparatus has a simple structure, is operable by a single person, imposes no strain on the person's back and lumbar part, etc., and can comfortably be used even if the person has injured-spine and so forth. The apparatus comprises a base part having a driving part, a seat part provided on the base part and which a user can sit from a back portion or a side portion, and a breast pad part standing in a front end side of the seat part and contacting a breast of the user. At least one of the seat part and the breast pad part is held to be able to move forward and backward, and upward and downward with respect to the base part. | 2012-05-31 |
| 20120133114 | INTERNAL AIRBAG DEVICE - An internal airbag device may include an inflator, an airbag housing mounted in a roof in a region between a front seat and a rear seat, and an airbag received in the airbag housing to deploy downwards by gas supplied from the inflator, wherein the airbag includes a horizontal airbag section supported by the roof during the gas may be supplied therein in a deployment thereof, and a vertical airbag section fluid-connected to the horizontal airbag section and extending downwards from an end of the horizontal airbag section opposite the rear seat in a deployment thereof. | 2012-05-31 |
| 20120133115 | Skid Plates for a Motorcycle - A two-wheel vehicle for carrying out tire grip measurements. The vehicle is equipped with three spars fitted onto one side of the vehicle, the ends of the spars forming a plane approximately parallel to the circumferential plane of the rear wheel of the vehicle and the distance between said plane and the circumferential plane of the rear wheel of the vehicle being greater than 350 mm. | 2012-05-31 |
| 20120133116 | SAFETY APPARATUS FOR MOTORCYCLE - Disclosed is a safety device for motorcycle, the safety device for motorcycle comprising: a supporting assembly installed onto both lateral side of the motorcycle body, with a plurality of parts of which are rotatable relative to each other; a supporting wheel installed onto the supporting assembly which is rotatable relative to the supporting assembly a push-pull unit that connects the supporting assembly to the motorcycle body, pushes the supporting assembly in order for the supporting wheel contacting with ground, and pulls the supporting assembly in order for the supporting wheel for taking off the ground; and a control unit that controls the push-pull unit. According to the present invention the motorcycle will not easily fall down when it stops for a moment in driving, the driver can easily support the motorcycle, and the motorcycle will not incline over a predetermined angle in driving curved path. | 2012-05-31 |
