21st week of 2009 patent applcation highlights part 30 |
Patent application number | Title | Published |
20090128958 | MASTER CARRIER FOR MAGNETIC TRANSFER AND MAGNETIC RECORDING MEDIUM MANUFACTURED USING THE SAME - A magnetic transfer master substrate for transferring magnetic information thereof to a perpendicular recording magnetic recording medium in contact therewith under application of a magnetic field comprises a transfer surface area with a magnetic layer formed thereon in a pattern according to the magnetic information to be transferred to the perpendicular magnetic recording medium and a non-transfer surface area laying below said transfer surface area, wherein the magnetic layer has a perpendicular magnetic anisotropy of an anisotropy energy higher than 4×10 | 2009-05-21 |
20090128959 | Self PSA adjustment using thermal adapter on suspension for improving takeoff in hot/wet environment - A suspension arm assembly for a hard disk drive that includes a suspension arm and a thermal adaptor. The thermal adaptor has a thermal coefficient of expansion that is different from the thermal coefficient of expansion of the suspension arm so that a pitch static angle is increased with an increase in temperature. The suspension arm assembly is attached to an actuator arm and coupled to a head of the disk drive. The head may be parked on a landing zone of a disk surface while the disk is stationary. When the disk is spun, an air bearing is formed between the disk surface and the head. If the drive is operating at an elevated temperature the static angle of the suspension arm will increase to increase the slider's pitch angle and air bearing flying height. | 2009-05-21 |
20090128960 | Thin plate formation method, thin plate and suspension correction apparatus, and correction method - Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area. | 2009-05-21 |
20090128961 | DISK APPARATUS - In a disk apparatus, an actuator includes a magnetic plate member which generates a magnetic attraction force for turning the actuator in the unloading direction by interaction with a stationary magnet. The plate member is superposed on the stationary magnet in the plane direction while keeping a gap with the stationary magnet in the vertical direction. An area of the plate member superposed on the stationary magnet is increased as the actuator turns in the unloading direction and approaches the outer stopper. When the actuator approaches the outer stopper, the stationary magnet gives, to the plate member, a magnetic attraction force of such an intensity that brings the actuator on the outer stopper against a friction force applied to the actuator. | 2009-05-21 |
20090128962 | READ-HEAD, MAGNETIC HEAD AND MAGNETIC STORAGE APPARATUS - The read-head is capable of corresponding to high recording density without deteriorating characteristics even if a small size read-element is used. The read-head of the present invention comprises: a read-element including a free layer; and a magnetic domain control layer for domain-controlling the free layer. The magnetic domain control layer is composed of a soft magnetic material including at least one substance selected from the group consisting of Fe, Co and Ni. A ratio (a/b) of a length (a) of the magnetic domain control layer in the core width direction to a length (b) thereof in the height direction is 5 or more, and the length (b) is 100 nm or less. | 2009-05-21 |
20090128963 | NARROW TRACK EXTRAORDINARY MAGNETO RESISTIVE [EMR] DEVICE WITH WIDE VOLTAGE TABS AND DIAD LEAD STRUCTURE - A Lorenz magnetoresistive sensor having a pair of voltage leads and a pair of current leads. The voltage leads are located at either side of one of the current leads and are separated by a distance that is substantially equal to the length of a bit to be measured. The Lorenz magnetoresistive sensor can be, for example an extraordinary magnetoresistive sensor having a quantum well structure such as a two dimensional electron gas and a shunt structure formed on an edge of the quantum well structure opposite the voltage and current leads. | 2009-05-21 |
20090128964 | METHOD FOR MANUFACTURING A PERPENDICULAR MAGNETIC WRITE HEAD WITH WRAP AROUND MAGNETIC TRAILING AND SIDE SHIELDS - A method for manufacturing a magnetic write head having a wrap around magnetic shield. The method allows a highly accurate short wavelength such as 193 mm photolithography to be used to accurately define the placement and critical dimension of wrap around magnetic shield. The method includes the formation of a magnetic write pole, top gap, and side gap and the deposition of a RIEable fill layer thereover, and CMP to planarization. A 193 nm photolithography and ion milling is used to form a mask over the RIEable layer and one or more reactive ion etching processes are performed to pattern the RIEable layer through 193 nm photolithography mask. A wrap around shield can then be electroplated into the opening formed in the RIEable layer. | 2009-05-21 |
20090128965 | CPP MAGNETO-RESISTIVE ELEMENT PROVIDED WITH A PAIR OF MAGNETIC LAYERS AND NICR BUFFER LAYER - A magnetic field detecting element has a stack which includes a NiCr layer, a first magnetic layer whose magnetization direction varies in accordance with an external magnetic field, a non-magnetic spacer layer, and a second magnetic layer whose magnetization direction varies in accordance with the external magnetic field, said NiCr layer, said first magnetic layer, said spacer layer and said second magnetic layer being disposed in this order and being arranged in contact with each other, wherein a sense current is adapted to flow in a direction that is perpendicular to a film surface of said stack; and a bias magnetic layer which is disposed on a side of said stack, said side being opposite to an air bearing surface of said stack, wherein said bias magnetic layer is adapted to apply a bias magnetic field to said stack in a direction that is perpendicular to said air bearing surface. Both first and second magnetic layers have bcc crystalline structures, and said non-magnetic spacer layer has a film configuration in which an insulating layer or a semiconductor layer is inserted into a metal layer. | 2009-05-21 |
20090128966 | MAGNETIC MEMORY CELL BASED ON A MAGNETIC TUNNEL JUNCTION(MTJ) WITH LOW SWITCHING FIELD SHAPES - Embodiments of the invention magnetic memory device, comprising: a magnetic tunnel junction (MTJ) which includes a Magnetic Tunnel Junction (MTJ) stack which has one of a crescent-shaped profile and an elbow-shaped profile in cross-section. | 2009-05-21 |
20090128967 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device comprises a first terminal (denoted by VCC) connected to a power supply in a normally mounted state, a second terminal (denoted by SB) connected to a signal line in the normally mounted state and to a power supply in a reversely mounted state, a third terminal (denoted by SGND) connected to the ground in the normally mounted state, fourth terminals (denoted by HU−, HW−) connected to the signal line in the normally mounted state and to the ground in the reversely mounted state, electrostatic protective diodes (denoted by D | 2009-05-21 |
20090128968 | STACKED-DIE PACKAGE FOR BATTERY POWER MANAGEMENT - A stacked-die package for battery protection is disclosed. The battery protection package includes a power control integrated circuit (IC) stacked on top of integrated dual common-drain metal oxide semiconductor field effect transistors (MOSFETs) or two discrete MOSFETs. The power control IC is either stacked on top of one MOSFET or on top of and overlapping both two MOSFETs. | 2009-05-21 |
20090128969 | ADAPTIVE ELECTROSTATIC DISCHARGE (ESD) PROTECTION OF DEVICE INTERFACE FOR LOCAL INTERCONNECT NETWORK (LIN) BUS AND THE LIKE - Adaptive electrostatic discharge (ESD) protection of a device interface has very good ESD robustness when it is handled or when installed into or removed from a system. And has robust immunity to DPI, electromagnetic interference (EMI) and the like, when it is operational in a system. There is a significant capacitive coupling between the drain and gate of a ESD protection metal oxide semiconductor (MOS) device to enhance ESD protection and lower snap back voltage thereof whenever there is no (or a low level) DPI on the external connection to be protected. Whereupon when a significant DPI/EMI signal is detected on the external connection, the capa citive coupling between the drain and gate of the MOS ESD protection device is disconnected, bypassed or attenuated so that DPI/EMI immunity of the device is enhanced. | 2009-05-21 |
20090128970 | ADAPTIVE ELECTROSTATIC DISCHARGE (ESD) PROTECTION OF DEVICE INTERFACE FOR LOCAL INTERCONNECT NETWORK (LIN) BUS AND THE LIKE - Adaptive electrostatic discharge (ESD) protection of a device interface has very good ESD robustness when it is handled or when installed into or removed from a system. And has robust immunity to DPI, electromagnetic interference (EMI) and the like, when it is operational in a system. There is a significant capacitive coupling between the drain and gate of a ESD protection metal oxide semiconductor (MOS) device to enhance ESD protection and lower snap back voltage thereof whenever there is no (or a low level) DPI on the external connection to be protected. Whereupon when a significant DPI/EMI signal is detected on the external connection, the capa citive coupling between the drain and gate of the MOS ESD protection device is disconnected, bypassed or attenuated so that DPI/EMI immunity of the device is enhanced. | 2009-05-21 |
20090128971 | SEMICONDUCTOR INTEGRATED CIRCUIT - The invention provides a semiconductor integrated circuit preventing an electrostatic breakdown due to a surge voltage applied to a power supply wiring or a ground wiring and preventing noise interference between a digital circuit and an analog circuit. By providing a first electrostatic breakdown protection diode and a first electrostatic breakdown protection bipolar transistor in a first island region, the first electrostatic breakdown protection diode and the first electrostatic breakdown protection bipolar transistor turn on when a surge voltage is applied to a first ground wiring and protect a digital circuit against an electrostatic breakdown. Furthermore, a first isolation layer is contacted with the first ground wiring in a position that is more adjacent to a first ground pad than the digital circuit, and a second isolation layer is contacted with a second ground wiring in a position that is more adjacent to a second ground pad than an analog circuit. This prevents noise interference between the digital circuit and the analog circuit. | 2009-05-21 |
20090128972 | THREE-PHASE DETECTION MODULE - An apparatus includes a first optocoupler and a control module. The first optocoupler selectively allows a first current to flow from a first one of a first pair of N power supply lines to a second one of the first pair. N is an integer greater than two. The N power supply lines each provide a phase signal. The control module controls the first optocoupler and determines an occurrence of a phase failure of the phase signals based on a first signal, which is based on the first current. | 2009-05-21 |
20090128973 | Power supply control circuit including overvoltage protection circuit - A protection ability of a power supply control circuit is improved so as to protect an output transistor against a back electromotive voltage from a load, a dump surge voltage, and a positive spike surge voltage which has a smaller energy but is higher than the dump surge voltage. The power supply control circuit includes: an output MOS transistor (power semiconductor device) connected between a first power supply terminal and an output terminal; a load connected to the output terminal; a first dynamic clamping circuit for controlling a voltage difference between a first power supply line and the output terminal; and a first switch connected between the first dynamic clamping circuit and the output MOS transistor, in which a conductive state is determined according to a result of comparison between a reference voltage and a voltage at the output terminal. The power supply control circuit further includes a second dynamic clamping circuit for controlling a voltage difference between the first power supply terminal and the output terminal to protect the output MOS transistor. The second dynamic clamping circuit operates in response to application of a positive spike surge voltage which is higher than the dump surge voltage. | 2009-05-21 |
20090128974 | Drive Circuit for Switching Device - A drive circuit that controls a switching device ON/OFF and a soft cutoff command circuit that gradually decreases the gate terminal voltage of the switching device when short circuit of the switching device is detected. Additionally, an ON-pulse retention command circuit retains the output of the drive circuit ON when the gate terminal voltage is judged to have exceeded a specified value by a gate voltage judgment comparator that detects the gate terminal voltage of the switching device. | 2009-05-21 |
20090128975 | Integrated Circuit Protected Against Short Circuits and Operating Errors Following the Passage on an Ionizing Radiation - An integrated circuit chip comprising a number of semiconductor components exhibiting parasitic components through which a short-circuit between the circuit supply voltage and ground could occur, wherein said semiconductor components are distributed in elementary blocks, each elementary block being independently connected, for its power supply, to the supply or ground lines of the main supply network of the integrated circuit by a current-limiting device capable of stopping a short-circuit starting in the considered block, and each block being sized so that logic errors occurring in this block are correctable by error-correction means. | 2009-05-21 |
20090128976 | Energy Pathway Arrangements for Energy Conditioning - The system of an energy conditioner comprising: a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer; wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said third conductive shield layer; wherein said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer are conductively connected to one another; a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer; and a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer | 2009-05-21 |
20090128977 | Method to protect Ethernet connected products - The present invention relates to a method for protecting electronic products, which electronic product comprises an Ethernet connector, where the Ethernet connector comprises a protection circuit, which circuit comprises at least one capacitor and at least one resister, where the Ethernet connector is used to protect against high energy transients, where the Ethernet connector comprises a protection circuitry. Where the Ethernet connector comprises a protection circuitry, which protection circuitry is characterized in that in the protection circuitry is the electrically product ground and Ethernet ground connected by at least a VDR (Voltage Dependant Resistor), which VDR is connected between the Ethernet ground and the product ground in the protection circuitry. | 2009-05-21 |
20090128978 | Hybrid surge protector for a network interface device - A hybrid surge protector for a network interface device (NID) is disclosed. The hybrid surge protector includes a fail-safe spring connected to the ground electrode of a three-electrode gas tube. Tabs on the fail-safe spring are held away from the gas-tube end electrodes by a fusible element. The hybrid surge protector also includes metal-oxide varistor elements (“MOVs”) in contact with the gas-tube end electrodes and with the ground electrode via an MOV spring. This arrangement provides for two initial paths to ground-one path from the gas-tube end electrodes to the ground electrode through the gas tube, and another from the gas-tube end electrodes to the ground electrode through the MOVs and the MOV spring. The dominant path to ground starts as the MOV ground path but switches to the gas-tube path as the gas tube becomes activated. Another path to ground via the fail-safe spring is also available should the gas tube overheat. A surge protection module that includes the hybrid surge protector is also disclosed. | 2009-05-21 |
20090128979 | SYSTEM AND METHOD FOR PROTECTING A COIL STRUCTURE IN A CONTROLLED SWITCH - A system and method for protecting a coil structure in a controlled switch. In one embodiment, the invention relates to a circuit including at least one load switch connectable between a power source and a load and at least one auxiliary switch, each switch actuable between a default position and a switched position, a coil structure configured to actuate the at least one load switch and at least one auxiliary switch in response to a control input, the coil structure switchable between an actuating configuration for actuating the at least one load switch and the at least one auxiliary switch from the default position, and a holding configuration for holding the at least one load switch and the at least one auxiliary switch in the switched position, and a resettable current limiting device configured to limit the current flow in the actuating configuration of the coil structure if the current flow exceeds a threshold for a predetermined period of time, wherein the at least one auxiliary switch is configured to switch the coil structure from the actuating configuration to the holding configuration. | 2009-05-21 |
20090128980 | CIRCUIT ARRANGEMENT FOR CONTROLLING ELECTROMAGNETIC VALVES AND VALVE DEVICE WITH A CONTROLLABLE VALVE - A circuit arrangement for controlling electromagnetic valves, has a control unit that issues control signals for controlling the angular position of an electromagnetic valve and receives a reply signal regarding the value. The circuit arrangement receives the control signals of the control unit and issues the reply signal to it. A bridge circuit receives control signals from the circuit arrangement for the triggering of a valve servomotor and issues a reply signal, which indicates the angular position of the valve to the circuit arrangement. The circuit arrangement has an angular sensor that transmits a value, which indicates the angular position of the valve to the circuit arrangement. When a rise of the current of the servomotor above a predetermined threshold is detected, the bridge circuit sets a status flag. The circuit arrangement then transmits a predetermined level to the control unit, and the control unit detects the predetermined level. When a level is determined to be impermissible, the control unit requests the value, which indicates the angular position of the valve, from the circuit arrangement and processes this value. | 2009-05-21 |
20090128981 | MULTIPLE-AXIS CONTROL APPARATUS FOR IONIZATION SYSTEMS - A bipolar ionization apparatus includes a positive high voltage power supply having an output with at least one positive ion emitting electrode connected thereto and configured to generate positive ions. A negative high voltage power supply has an output with at least one negative ion emitting electrode connected thereto and is configured to generate negative ions. A controller for an ionizer outputs a positive high voltage ionization waveform and a negative high voltage ionization waveform. The controller simultaneously adjusts an amplitude and a duty cycle of each of the waveforms. | 2009-05-21 |
20090128982 | STATIC ELECTRICITY ELIMINATING APPARATUS AND ELECTRONIC APPARATUS - A static electricity eliminating apparatus for eliminating static electricity which has built up on a medium, e.g., card-shaped that may be inserted into and removed from an opening of a card loading body is provided. The static electricity eliminating apparatus includes a housing having an opening through which the medium may be inserted and removed. The apparatus includes a conductive member with one end fixed to the housing, and the other end that extends over the opening so as to block the insertion-and-removal opening, and which eliminates static electricity which has built up on the medium by contacting the medium when the medium is inserted into the insertion-and-removal opening. | 2009-05-21 |
20090128983 | Protection device against electrical discharges in fixing elements with high charges - The invention relates to a device ( | 2009-05-21 |
20090128984 | MAINTENANCE-FREE STATIC ELIMINATOR - A static eliminator comprises at least one discharge needle for generating ions to eliminate static charge. A first hollow cylinder includes at least one opening for ions generated by the discharge needle to be emitted outside and provided with brushes for cleaning the discharge needle. A second hollow cylinder is provided with the discharge needle and rotatably disposed inside the first hollow cylinder. A discharge needle rotating mechanism is provided for causing to rotate the second hollow cylinder around the axis thereof to clean the discharge needle by wiping the discharge needle with the brushes. | 2009-05-21 |
20090128985 | MULTILAYER CAPACITOR - A first internal electrode includes a first lead portion and a second lead portion. A second internal electrode includes a third lead portion and a fourth lead portion. A third internal electrode includes a main electrode portion and a fifth lead portion. A fourth internal electrode includes a main electrode portion and a sixth lead portion. A joint portion between the main electrode portion and the fifth lead portion of the third internal electrode is located between an edge on the first side face side and an edge on the second side face side in a capacitance forming region when viewed from an opposing direction of the third and fourth side faces. A joint portion between the main electrode portion and the sixth lead portion of the fourth internal electrode is located between an edge on the first side face side and an edge on the second side face side in a capacitance forming region when viewed from the opposing direction of the third and fourth side faces. | 2009-05-21 |
20090128986 | HYBRID DISCOIDAL/TUBULAR CAPACITOR - A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second electrodes. Either the first or second electrode is not conductively coupled to any electrode transversely extending into the body. The resulting arrangement provides a hybrid capacitor having characteristics of both a tubular capacitor and a discoidal capacitor. | 2009-05-21 |
20090128987 | FILTERING CAPACITOR FEEDTHROUGH ASSEMBLY - A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture, the capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture and an electrically conductive continuous coil is disposed within the aperture and between the terminal pin and the capacitor. The electrically conductive continuous coil mechanically secures and electrically couples the terminal pin to the capacitor. | 2009-05-21 |
20090128988 | DIELECTRIC CERAMIC COMPOSITION FOR LOW-TEMPERATURE SINTERING AND HOT INSULATION RESISTANCE AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - A dielectric ceramic composition for low-temperature sintering and hot insulation resistance (hot IR) is capable of carrying out low-temperature sintering, improving a hot IR characteristic, and meeting X5R characteristics, and a multilayer ceramic capacitor makes use of the dielectric ceramic composition. The dielectric ceramic composition includes a main component BaTiO | 2009-05-21 |
20090128989 | Dielectric ceramic, ceramic electronic element, and multilayer ceramic capacitor - A dielectric ceramic including a perovskite compound represented by the general formula {(Ba | 2009-05-21 |
20090128990 | DIELECTRIC CERAMIC, METHOD OF PRODUCING THE SAME, AND MONOLITHIC CERAMIC CAPACITOR - A dielectric ceramic contains a barium titanate compound oxide as a main component; at least one rare earth element R selected from Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; Mg; and Ni, such that a crystalline compound oxide containing the rare earth element R, Ni, and Ti as main components is present. Dielectric ceramic layers are made of the dielectric ceramic. Accordingly, even when a higher electric field is continuously applied under a high-temperature atmosphere for a long time, high reliability can be ensured. | 2009-05-21 |
20090128991 | Methods and apparatuses for stacked capacitors for image sensors - Capacitive circuits and methods of forming capacitive circuits including a first capacitor and a second capacitor connected in parallel to the first capacitor, wherein the first capacitor is positioned at least partially above the second capacitor. | 2009-05-21 |
20090128992 | MOS CAPACITOR STRUCTURE AND LINEARIZATION METHOD FOR REDUCED VARIATION OF THE CAPACITANCE - A highly linearized capacitor structure is formed by a first capacitor, that is coupled between a first terminal and a common node, combine with a second capacitor, that is coupled between a second terminal and the common node. When a bias voltage is applied, the capacitance values of the first and second capacitors combine and a capacitance variation of the first capacitor is compensated by a capacitance variation of the second capacitor to reduce and linearize overall capacitance variation in the combined capacitor structure. | 2009-05-21 |
20090128993 | MULTI-TIER CAPACITOR STRUCTURE, FABRICATION METHOD THEREOF AND SEMICONDUCTOR SUBSTRATE EMPLOYING THE SAME - A multi-tier capacitor structure has at least one multi-tier conductive layer. At least one conductive via passes through the multi-tier conductive layer. When currents flow through the conductive via, different current paths are presented in the conductive via in response to different current frequency; in other words, different inductor is induced. Therefore, a single plate capacitor structure has function of hierarchical decoupling capacitor effect. | 2009-05-21 |
20090128994 | Capacitor and manufacturing method thereof - A capacitor comprising an electrode made from an electroconductive material and activated carbon in combination with quaternary ammonium tosylate, and a method for manufacturing the same. The method enables the preparation of a high capacitance electrode without special facilities. The capacitor exhibits high specific capacitance and a high energy density. | 2009-05-21 |
20090128995 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF FABRICATING THE SAME - A solid electrolytic capacitor comprising an anode body, a dielectric layer placed on the surface of the anode body, a conductive polymer layer placed on the surface of the dielectric layer, and a housing accommodating at least the anode body, the dielectric layer and the conductive polymer layer, wherein a water-retaining layer having higher water absorption than that of the housing is placed between the conductive polymer layer and the housing. | 2009-05-21 |
20090128996 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor that prevents leakage current from increasing. The solid electrolytic capacitor includes an anode, a cathode, and a dielectric layer arranged between the anode and the cathode in contact with the cathode. The dielectric layer includes a plurality of recesses arranged in the surface of the dielectric layer, each recess having an opening in an interface with the cathode. Each of the recesses has a depth that is 0.1 to 1.5 times the diameter of the opening. | 2009-05-21 |
20090128997 | SOLID ELECTROLYTIC CAPACITOR - An aspect of the invention provides a solid electrolytic capacitor that comprises: an anode formed of a valve metal or an alloy mainly made of a valve metal; a dielectric layer formed on a surface of the anode; a first conducting polymer layer formed on the dielectric layer, the first conducting polymer layer containing a non-ionic surfactant; a second conducting polymer layer formed on the first conducting polymer layer; and a cathode layer formed on the second conducting polymer layer. | 2009-05-21 |
20090128998 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor comprising a capacitor element having an anode member and a cathode member, an anode terminal electrically connected with the anode member, a cathode terminal electrically connected with the cathode member, and a mold resin portion covering the capacitor element; wherein the cathode terminal has an upper step portion in face-to-face contact with the cathode member and a lower step portion exposed out of the mold resin portion and a bottom surface of the mold resin portion and an upper surface of the lower step portion of the cathode terminal are disposed in an approximately same plane. | 2009-05-21 |
20090128999 | Closing apparatus for a withdrawable-part rack - At least one embodiment of the invention provides that, for a closing apparatus for a part rack withdrawable via V-shaped rod assemblies, the closing apparatus includes at least one pin formed on rod assemblies or as part of them, each pin engaging in a slot in an actuating element. Owing to the use of the slots, the actuating element can be formed as a rigid body, with the result that no frictional forces need to be overcome when inserting a circuit breaker into a withdrawable-part rack with the closing apparatus according to at least one embodiment of the invention. With the closing apparatus according to at least one embodiment of the invention, a locking element can have a particularly simple design: it can be guided in the actuating element. | 2009-05-21 |
20090129000 | INTER-RACK AIRFLOW ARRESTING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK OF A DATA CENTER - An airflow arrester is provided and configured to reside between electronics racks disposed in a row within a data center. The airflow arrester includes a panel, which when operatively disposed, has a first vertical end, a second vertical end, and a central vertical hinge located intermediate the first and second vertical ends. The airflow arrester further includes an attachment mechanism at the first vertical end and at the second vertical end, and when operatively disposed between a first and second structures, the airflow arrester has a single V-shaped configuration, and is sized and constructed to block airflow from passing therebetween. The single V-shaped configuration provides operational stability to the airflow arrester by translating net twisting forces applied to the airflow arrester to normal forces applied to the first and second structures at the attachment points of the airflow arrester to the first and second structures. | 2009-05-21 |
20090129001 | COMPUTER HOST HAVING TWO LAYERS INSIDE - A computer host having two layers inside includes a chassis, a partition, a first circuit board, a second circuit board, and an electrical connecting device. The partition divides the interior of the chassis into a first accommodation space and a second accommodation space. The first circuit board and the second circuit board are disposed on two sides of the partition respectively, and are respectively located in the first accommodation space and the second accommodation space. The electrical connecting device is used to electrically connect the first circuit board and the second circuit board, so that the first and second circuit boards together form a complete electronic circuit system for the operation of the computer host. | 2009-05-21 |
20090129002 | COMPUTER ENCLOSURE ADAPTED FOR MOUNTING DIFFERENT TYPES OF TRANSFER CARDS - A computer enclosure includes a chassis having a rear wall, a transfer card, a mounting bracket, and a PCI card. An expansion slot is defined in the rear wall of the chassis. A detachable shielding cover is formed on the rear wall adjacent to the expansion slot. The transfer card is secured in the chassis. The transfer card has a circuit board perpendicular to the rear wall. The mounting bracket is secured to the rear wall of the chassis and has a width substantially equal to a length of the expansion slot. The PCI card is secured to the mounting bracket and perpendicularly attached to the transfer card. A receiving space corresponding to the shielding cover is defined shielding cover and the PCI card, for receiving a connector between the mounting bracket and the circuit board of the transfer card. | 2009-05-21 |
20090129003 | Operator control unit - A mobile operator control unit for remotely controlling a robot includes a housing with a reconfigurable user interface with multiple sockets. A plurality of control modules are each removably received in a socket and include one or more switches. A module interface is connected to the one or more switches. A baseboard processing unit is connected to each module interface for receiving and processing signals received from the module interfaces. A transmitter is responsive to the baseboard processing unit for transmitting signals to the robot based on the activation of the module switches. | 2009-05-21 |
20090129004 | Electrically conducting and optically transparent nanowire networks - A network of nanowires has a plurality of interconnected nanowires. Each interconnected nanowire includes a metal in its composition. The network of nanowires is electrically conducting and substantially transparent to visible light. An electronic or electro-optic device has a network of nanowires. The network of nanowires has a plurality of interconnected nanowires, each interconnected nanowire including a metal in its composition. The network of nanowires is electrically conducting and substantially transparent to visible light. A metal-oxide nanowire has a metal oxide doped with a second metal in a composition thereof. The metal-oxide nanowire is electrically conducting and substantially transparent to visible light. | 2009-05-21 |
20090129005 | Display Device, Manufacturing Method of the Display Device, and Portable Computer Having the Display Device - A display device includes a display panel, and a chassis supporting the display panel, and including a conductive material. The display device includes a circuit board including a signal wiring connected to the display panel to apply a driving signal to the display panel, and a grounding wiring for grounding. The display device includes a connector connected with a signal cable that applies an external signal and is connected to the signal wiring and the grounding wiring of the circuit board. The display device includes an exposed grounding unit exposing part of the grounding wiring on the circuit board, wherein the exposed grounding unit is disposed adjacent to the connector. The display device includes a conductive member which connects the exposed grounding unit with the chassis. | 2009-05-21 |
20090129006 | PORTABLE MEDIA PLAYER AND METHOD FOR CONTROLLING DISPLAY MODE THEREOF - An exemplary portable media player includes a main body and a cover. The portable media player further includes a main display unit, an auxiliary display unit, a control device, and a power management unit. The control device provides a first control signal when the cover is detected to be in the first state, and a second control signal when the cover is detected to be in the second state. The power management unit is electrically coupled to the control device, the main display unit, and the auxiliary unit. The power management selectively supplies electrical power to the main display unit and the auxiliary unit based on the first control signal and the second control signal, respectively. | 2009-05-21 |
20090129007 | PERSONAL COMPUTER - A personal computer, provided with a housing comprising at least a battery power supply, a processor and a memory, wherein the housing is divided into a first housing part and a second housing part that is hingingly coupled with the first housing part, and wherein the first housing part comprises a data entry unit and the second housing part comprises a visual display unit, and wherein the battery power supply is accommodated in the second housing part. | 2009-05-21 |
20090129008 | OPTICAL DISK DRIVE WITH SLIDING BAR - An optical disk drive includes a main body defining a receiving space and a pivotable cover. A latching mechanism that contacts the cover at two points distributes stresses better than where the latching mechanism only contacts the cover at one point. | 2009-05-21 |
20090129009 | FIXING APPARATUS FOR HARD DISK DRIVE - An exemplary fixing apparatus is for mounting a hard disk drive having a plurality of holes in sidewalls thereof. The fixing apparatus includes a first side plate, a bracket, a locking tab, and a transverse bar. The bracket includes an end plate, and a second side plate perpendicular to the end plate. The first side plate is pivotably attached to a free end of the end plate of the bracket. The transverse bar is pivotably attached to a free end of the second side plate of the bracket. The locking tab is attached to an outside of the first side plate to detachably engage with the transverse bar. | 2009-05-21 |
20090129010 | CRADLE FOR A PORTABLE TERMINAL - A cradle for a portable terminal is provided. The cradle includes a base, an inclined support installed on the base, and a connector. The inclined support supports the portable terminal when the portable terminal is mounted in the cradle. The connector has a protruding portion that protrudes toward one surface of the inclined support, and the connector contacts an interface connector of the portable terminal when the portable terminal is mounted in the cradle. The connector pivots on the inclined support. | 2009-05-21 |
20090129011 | Liquid cooled module - A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component. | 2009-05-21 |
20090129012 | METHOD AND APPARATUS FOR HEAT TRANSFER - A heat transfer apparatus for a memory module with a heat spreader that includes a channel being attachable on top of the memory module, and further includes attachment parts that are in thermal communication with the channel to engage with the heat spreader. | 2009-05-21 |
20090129013 | ELECTRONIC EQUIPMENT ENCLOSURE WITH EXHAUST AIR DUCT AND ADJUSTABLE FILLER PANEL ASSEMBLIES - An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure. | 2009-05-21 |
20090129014 | Equipment Rack and Associated Ventilation System - A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape. A cable management system includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device. | 2009-05-21 |
20090129015 | ACOUSTICALLY ABSORPTIVE ANTI-RECIRCULATION PANEL FOR ONE OR MORE ELECTRONICS RACKS OF A DATA CENTER - An acoustically absorptive panel is provided configured to reside above multiple electronics racks disposed in a row within a data center. The acoustically absorptive panel is configured to extend a height above the multiple electronics racks sufficient to at least partially block hot air recirculation from one or more air outlet sides of the multiple electronics racks to one or more air inlet sides of the electronics racks. The acoustically absorptive panel includes an acoustically absorptive material selected to attenuate noise, and in one embodiment, includes printed material on at least one side thereof related to one or more of the multiple electronics racks. | 2009-05-21 |
20090129016 | AIRFLOW ARRESTING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK OF A DATA CENTER - An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism. | 2009-05-21 |
20090129017 | BLOWER AND ELECTRIC DEVICE WITH SUCH BLOWER MOUNTED THEREON - A supply current control circuit controls the voltage of a low-voltage direct-current power source so that the average current of an inverter circuit detected by a current detecting circuit becomes constant at a specified current value. Accordingly, characteristics that are little in the amount of change of air volume are obtained. | 2009-05-21 |
20090129018 | HEAT DISSIPATION DEVICE ASSEMBLY WITH A FAN DUCT HAVING GUIDING MEMBERS FOR GUIDING A SCREWDRIVER TO ASSEMBLE THE HEAT DISSIPATION DEVICE ASSEMBLY TO A PRINTED CIRCUIT BOARD - A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink ( | 2009-05-21 |
20090129019 | HEAT DISSIPATION DEVICE WITH FAN HOLDER - A heat dissipation device includes a heat sink attached to an electronic component, a fan and a fan holder mounting the fan onto the heat sink. The heat sink includes a plurality of fins. The fan holder includes a plurality of walls connecting with each other. A pair of tabs is formed on one of the walls for abutting against the fan, and a pair of fasteners is formed on another wall and opposite to the tabs. Each of the fasteners includes a sleeve formed on the another wall, a pressing member movably received in the sleeve, and a crank pivotally engaged with the sleeve. When the crank is positioned in a closed position, the pressing member is pushed out of the sleeve by the crank and abuts against the fan. The fasteners cooperate with the tabs to mount the fan onto the fan holder. | 2009-05-21 |
20090129020 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes an heat producing component mounted on a first surface of a circuit board, a second heat producing component mounted on a second surface of the circuit board, a cooling fan overlapping the circuit board, a first heat radiating member located between the cooling fan and an exhaust aperture, a first heat transfer member which extends along the first surface of the circuit board and which transports heat generated by the first heat producing component to the first heat radiating member, a second heat radiating member including a part positioned opposite the second heat producing component with respect to the circuit board, and a second heat transfer member including a part extending along the second surface of the circuit board, the second heat transfer member transporting heat generated by the second heat producing component to the second heat radiating member. | 2009-05-21 |
20090129021 | GAS STATION TELEVISION - Preferred embodiments relates to a cooling system and a method for cooling an electronic display. Embodiments include a transparent liquid cooling chamber, a reservoir tank, and a pump. The components in the system are preferably housed within the electronic display housing. The cooling chamber defines a fluid compartment that is anterior to and coextensive with the electronic display surface. Circulating coolant removes heat directly from the electronic display surface by advection. In order to view the display, the coolant fluid is transparent or at least semi-transparent. The image quality of an exemplary embodiment remains essentially unchanged, even though coolant is flowing over the visible face of the electronic display surface. | 2009-05-21 |
20090129022 | Micro-chimney and thermosiphon die-level cooling - A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated. | 2009-05-21 |
20090129023 | THERMAL MODULE ALLOWING ADJUSTMENT IN THE HEIGHT OF HEAT SINK RELATIVE TO FIXING RACK - A thermal module includes a fixing rack and a heat sink fitted in the fixing rack. The fixing rack is provided at an inner side with a plurality of stoppers and a plurality of projected portions located adjacent to the stoppers with a height difference existed between them. The heat sink is provided along an outer periphery with a plurality of vertically extended grooves. The heat sink may be selectively fitted in the fixing rack with the grooves corresponding to or not corresponding to the projected portions on the fixing rack, so that an upper surface of the heat sink may be upward abutted on the upper stoppers or the projected portions, respectively, to restrict the fixing rack from sliding downward. Meanwhile, due to the height difference between the stoppers and the projected portions, a distance between the upper surface of the heat sink and the fixing rack is adjustable. | 2009-05-21 |
20090129024 | INVERTED THROUGH CIRCUIT BOARD MOUNTING WITH HEAT SINK - The apparatus contains a printed circuit board in which a heat sink is mounted adjacent to one side of the printed circuit board in contact with a heat generating device mounted to the circuit board and positioned at least in part within an aperture in the circuit board. | 2009-05-21 |
20090129025 | Illumination device comprising a substrate plate and a heat sink - The invention relates to an illumination device ( | 2009-05-21 |
20090129026 | Heat sink for semiconductor device and semiconductor module assembly including the heat sink - Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a portion of the second surface of the heat sink base to which no clip is coupled; and second fins provided on portions of the second surface of the heat sink base to which a clip may be coupled. The semiconductor module assembly may secure the heat sinks to both surfaces of a semiconductor module using the clip. Accordingly, air may flow smoothly through the second fins on the portions to which the clip may be coupled, thereby improving the cooling function of the heat sinks. | 2009-05-21 |
20090129027 | INTEGRATED NON-ISOLATED VRM AND MICROPROCESSOR ASSEMBLY - The present invention provides one single chip solution for a non-isolated DC-DC regulator. The advantage is high reliability, lower cost and smaller space on the motherboard. This integrated solution opens the door for a distributed architecture with few millimeter high 1″×1″ regulator. Such regulators could be populated as QFP ICs are on all system boards. The present invention is based on a single VRM chip, PBGA multilayer board with processor signal pads and power points. The multilayer board periphery has SMD components such as ceramic capacitors, ICs, MOSFETs and a rectangular metal heat sink along with ferrite cores which sandwich the multilayer board and SMDs to form inductors for the multiphase solution. | 2009-05-21 |
20090129028 | Power module and method of fabricating the same - Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other. | 2009-05-21 |
20090129029 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT - A method for manufacturing an integrated circuit is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conductive material, fixing the electronic component on the printed circuit board. | 2009-05-21 |
20090129030 | Arrester block module assembly and method - An electrical surge arrester includes an arrester block stack with a plurality of cylindrical surge arrester components arranged substantially coaxially to form a cylindrical stack of components having a longitudinal axis. First and second electrical conductive terminals are disposed at each end of the block stack and electrically coupled to the components. A spacer is disposed between each of the terminals and the plurality of cylindrical surge arrester components. A crimp pin is disposed in each of the metal terminals to plastically deform the terminals to compress the block stack. Rubber sheds can be directly molded around the device. | 2009-05-21 |
20090129031 | Planar Element Module, Manufacturing Method of Planar Element Module, and Planar Element Device - A flat pressure sensor of the invention is prepared by processing a thin film of a polymer material to have plurality of substantially square openings | 2009-05-21 |
20090129032 | MODULAR SYSTEM CONTROLLED ACCORDING TO POWER REQUIREMENTS - The invention relates to a modular system comprising a primary module, several individual modules that can be connected to said primary module and a power supply unit that is connected to the primary module and supplies the connected individual modules with a voltage. According to the invention, the system is equipped with a descriptor element for each individual module. The descriptor element is read by the primary module and encodes or displays the power requirements of the assigned individual module. The primary module reads the descriptor elements of the connected individual modules and uses said elements to determine the total power requirements of the modular system, or of all connected individual modules. | 2009-05-21 |
20090129033 | Sliding adapter panel with living hinge and forward/rearward locking - An adapter panel including a chassis and a plurality of sliding adapter packs that define a front adapter field of the adapter panel. The sliding adapter packs includes a frame assembly having a living hinge and a lever arm. The living hinge locks the sliding adapter packs into both a forward and a rearward position. The living hinge is activated by either pulling or pushing the lever arm. | 2009-05-21 |
20090129034 | IMAGING DEVICE - An imaging device includes a lens module and a printed circuit board. The lens module includes a substrate with a lens unit and an imaging sensor mounted on a same side thereof. The substrate defines a groove therein. The printed circuit board defines a recessed portion accommodating the substrate therein, and includes a locking member engaging in the groove to detachably secure the lens module thereto. | 2009-05-21 |
20090129035 | Electronic control apparatus - In an electronic control apparatus, a connector mounted on a circuit board accommodated in a casing body constructed with top and bottom casings is partially exposed outside the casing body to be mated with an external connector. A sealant is interposed between the top and bottom casings, between the top casing and the connector, and between the bottom casing and the connector. A sealing part of at least one of the top and bottom casings has a substantially rectangular ring shape with rounded four corners. A sealing part of the connector faces two adjacent corners of the rectangular sealing part and one side of the rectangular sealing part directly connecting the two adjacent corners. | 2009-05-21 |
20090129036 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A semiconductor device includes: a wiring substrate that includes multiple connection pads provided on a top surface thereof and multiple lands provided on a bottom surface thereof and electrically connected to the connection pads, respectively; a semiconductor chip that is mounted on the top surface of the wiring substrate; multiple electrode pads provided on the semiconductor chip; wirings that electrically connect the electrode pads and the connection pads, respectively; a seal that is made of an insulating resin and covers at least the semiconductor chip and the wirings; and a through hole that is provided on a peripheral region of the wiring substrate, into which a fixing member is to be attached by insertion | 2009-05-21 |
20090129037 | PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME - The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element. | 2009-05-21 |
20090129038 | CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of the insulating layer; a circuit element electrically connected to the conductive pattern; and a lead connected to a pad formed of the conductive pattern. Furthermore, a power element is fixed to the top surface of a land portion formed of a part of the lead. Accordingly, the land portion serves as a heat sink, thereby contributing to heat dissipation. | 2009-05-21 |
20090129039 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7. | 2009-05-21 |
20090129040 | Circuit board having power source - A circuit board having a power source is provided, including: a carrier board having a first dielectric layer disposed on at least a surface thereof and a first circuit layer disposed on the first dielectric layer, wherein the first circuit layer has at least an electrode pad; a first electrode plate disposed on the electrode pad; an insulating frame member disposed on the first electrode plate, with a portion of the first electrode plate being exposed from the insulating frame member, wherein electrolyte is received in the insulating frame member and in contact with the first electrode plate; and a porous second electrode plate disposed on the insulating frame member and the electrolyte, the second electrode plate being in contact with the electrolyte, so as to provide the power source for the circuit board. | 2009-05-21 |
20090129041 | Stacked semiconductor module, method of fabricating the same, and electronic system using the same - A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs. | 2009-05-21 |
20090129042 | Modular EMI Waveguide Suppression For Openings In Electrical Enclosures - A method for suppression of EMI emissions around an opening of an electronic enclosure that holds a physical layer switch. Fiber optic cables are installed on a plurality of ports attached to the switch such that the cables pass through the opening in the cabinet. The cables are divided into a plurality of discrete bundles. An enclosure is placed around each bundle while the enclosure is in an open state and thereafter the enclosure is closed such that the enclosure surrounds the bundle. The enclosure is designed such that it suppresses EMI emissions. After the enclosures are closed, they are positioned in an arrangement in the opening of the electronic enclosure. | 2009-05-21 |
20090129043 | EMI SHIELDING AND ENVIRONMENTAL SEAL DEVICE - An EMI shield for a movable component such as an antenna of an electronic device includes a microfiber ring of densely packed microfibers extending from an EMI shielding housing across the space defined by an opening in the housing for the movable component. Multiple microfiber rings can be used separated by spacers, and an environmental shield can be included. | 2009-05-21 |
20090129044 | Harness Routing Structure - A harness routing structure comprises: a battery case that defines an internal space which houses a battery and an electric appliance on a hybrid motor vehicle, and that is formed of a first member; a reinforcement that is provided in the battery case, and that is formed of a second member having a greater strength than the first member and that reinforces the battery case; and a harness routed at a position along the reinforcement. | 2009-05-21 |
20090129045 | Fiber containment system - The present invention relates to a telecommunications termination panel with a housing including a front opening and a rear opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. A cable path is defined along a bottom of the housing along the first side between the cable entry of the tray and the rear opening. A movable plate is positioned adjacent the first side and is movable between a first position defining an upper limit of the cable path when the tray is closed and a second position allowing access to the cable path when the tray is open. The movement of the plate between the first and second positions is actuated by the movement of the tray between the closed and open positions. The present invention further relates to a telecommunications termination panel with a housing including a front opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. The tray is pivotable between an open position and a closed position. The tray includes a cover which can be moved between an operational position and an access position when the tray is in the open position. With the cover in the operational position, the tray is prevented from moving from the open position to the closed position. | 2009-05-21 |
20090129046 | Photographic Diffuser - A photographic light diffusing device for mounting to a photographic light source includes a base for attaching the photographic light diffusing device to the photographic light source, a semi-transparent hood extending from the base and defining a top edge, and a flap hinged to the top edge of the hood and rotatable with respect to the hood. | 2009-05-21 |
20090129047 | DOUBLE-SIDED LIGHT EMITTING DEVICE - A double-sided light emitting device including lower and upper substrates, an emission element formed between an inner surface of the upper substrate and an inner surface of the lower substrate and emitting predetermined light, an upper layer of polarizing material disposed on at least one of inner and outer surfaces of the upper substrate, and a lower layer of polarizing material disposed on at least one of inner and outer surfaces of the lower substrate. | 2009-05-21 |
20090129048 | Brightness adjustable keyboard illuminating module of electronic device - A brightness adjustable keyboard illuminating module of an electronic device includes a controlling unit, a voltage regulating unit, and a projection lamp unit. The controlling unit is used for receiving a brightness adjusting command to generate a pulse width modulation (PWM) signal according to the brightness adjusting command. The voltage regulating unit receives the PWM signal and regulates a voltage of an output driving signal according to a duty cycle of the PWM signal. The projection lamp unit receives the driving signal and projects light in response to the voltage of an output driving signal, to the keyboard of the electronic device. | 2009-05-21 |
20090129049 | Segmented Light Guide - An exemplary embodiment of a segmented light guide includes a light channeling layer having at least one slit dividing the light channeling layer into a plurality of segments, and at least one LED associated with the light channeling layer. The slit substantially prevents light from migrating in the segmented light guide between adjacent segments that are divided by the slit. | 2009-05-21 |
20090129050 | LASER ETCHED GRAPHIC FOR A DECORATIVE SURFACE - A disclosed vehicle instrument panel includes a control panel having illuminated buttons formed with an illuminatable decorative surface. The disclosed decorative surface includes a translucent layer disposed between a background layer and a graphic layer. Material is removed from the background layer to reveal the underlying translucent and graphic layers. The depth within which material is removed is determined to fall within a thickness of the translucent layer such that any variation in depth is accommodated within the translucent layer. | 2009-05-21 |
20090129051 | MEDICAL ILLUMINATION UNIT - A medical illumination unit ( | 2009-05-21 |
20090129052 | Illuminator with fluorescent substance - An illuminator includes a light emitting light source and a fluorescent substance. The fluorescent substance includes a crystal of nitride or oxy-nitride having a β-type Si | 2009-05-21 |
20090129053 | LIGHT-ENHANCED ELEMENT - The present invention provides a light-enhanced element including a transparent element including a fluorescent brightening agent, wherein the fluorescent brightening agent can absorb the first light emitted by a light-emitting element and subsequently emits the second light having a wavelength longer than that of the first light. | 2009-05-21 |
20090129054 | DISPLAY DEVICE - A display device such as a light box comprises: a housing; a light source accommodated in this housing; and at least one diffusely translucent display face illuminated by the light from this light source. | 2009-05-21 |
20090129055 | ILLUMINATING DEVICE HAVING FLUORESCENT LAMP, DISPLAY APPARATUS INCLUDING THE SAME, AND LIGHT-DIFFUSING FILM - An illuminating device includes a fluorescent lamp including a blue phosphor and a red phosphor applied on an inner surface, the fluorescent lamp emitting blue light and red light from the blue phosphor and the red phosphor, respectively; and a green phosphor layer disposed outside the fluorescent lamp, the green phosphor layer containing a green phosphor containing Eu | 2009-05-21 |
20090129056 | Light guide plate and backlight unit - A light guide plate includes: a plate surrounded by two main surfaces and a plurality of end surfaces connecting the main surfaces, one of the end surfaces designated as an entrance surface, one of the main surfaces designated as a reflection surface; a first reflection element provided in a first region of the reflection surface separated from the entrance surface, and configured to reflect a light incident from the entrance surface in a first angle with respect to the reflection surface; and a second reflection element provided in a second region of the reflection surface between the entrance surface and the first region, and configured to reflect the light in a second angle different from the first angle with respect to the reflection surface. | 2009-05-21 |
20090129057 | Illuminated Display Window for LED and/or LC Displays - A display window is particularly suited for LED and/or LC displays. The display window includes a lighting device and a microstructure for illuminating the display window. The microstructure is disposed on the side of the display window facing the display. | 2009-05-21 |