20th week of 2018 patent applcation highlights part 57 |
Patent application number | Title | Published |
20180138024 | CONNECTOR PIECE FOR A TUBULAR TARGET | 2018-05-17 |
20180138025 | Adaptive and Targeted Control of Ion Populations to Improve the Effective Dynamic Range of Mass Analyser | 2018-05-17 |
20180138026 | MULTI-REFLECTION MASS SPECTROMETER WITH DECELERATION STAGE | 2018-05-17 |
20180138027 | PHOSPHOR-CONTAINING FILM AND BACKLIGHT UNIT | 2018-05-17 |
20180138028 | SELECTIVE INHIBITION IN ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS | 2018-05-17 |
20180138029 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-05-17 |
20180138030 | METHOD FOR CLEANING, PASSIVATION AND FUNCTIONALIZATION OF SI-GE SEMICONDUCTOR SURFACES | 2018-05-17 |
20180138031 | PROCESS CHAMBER HAVING SEPARATE PROCESS GAS AND PURGE GAS REGIONS | 2018-05-17 |
20180138032 | METHODS AND SOLUTIONS FOR CLEANING INGAAS (OR III-V) SUBSTRATES | 2018-05-17 |
20180138033 | REMOVAL OF METAL | 2018-05-17 |
20180138034 | FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE USING PATTERNING STACKS | 2018-05-17 |
20180138035 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM | 2018-05-17 |
20180138036 | METHOD FOR HIGH MODULUS ALD SIO2 SPACER | 2018-05-17 |
20180138037 | THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME, ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, DISPLAY PANEL AND DISPLAY DEVICE | 2018-05-17 |
20180138038 | CLEANING METHOD | 2018-05-17 |
20180138039 | METHOD OF FABRICATING BLACK PHOSPHORUS ULTRATHIN FILM AND BLACK PHOSPHORUS ULTRATHIN FILM THEREOF | 2018-05-17 |
20180138040 | SELF-ALIGNED MULTI-PATTERNING PROCESS FLOW WITH ALD GAPFILL SPACER MASK | 2018-05-17 |
20180138041 | METHODS FOR FORMING FINE PATTERNS USING SPACERS | 2018-05-17 |
20180138042 | Methods for Integrated Circuit Design and Fabrication | 2018-05-17 |
20180138043 | III-V SEMICONDUCTOR DIODE | 2018-05-17 |
20180138044 | WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING | 2018-05-17 |
20180138045 | SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF | 2018-05-17 |
20180138046 | METHOD AND STRUCTURE TO CONTROL CHANNEL LENGTH IN VERTICAL FET DEVICE | 2018-05-17 |
20180138047 | System and Method for Wafer-Scale Fabrication of Free Standing Mechanical and Photonic Structures By Ion Beam Etching | 2018-05-17 |
20180138048 | PATTERN FORMATION METHOD | 2018-05-17 |
20180138049 | SiN SPACER PROFILE PATTERNING | 2018-05-17 |
20180138050 | TOPOGRAPHIC PLANARIZATION METHOD FOR LITHOGRAPHY PROCESS | 2018-05-17 |
20180138051 | Methods of Sub-Resolution Substrate Patterning | 2018-05-17 |
20180138052 | Backside Polisher with Dry Frontside Design and Method Using The Same | 2018-05-17 |
20180138053 | Wet Etching Method and Etching Solution | 2018-05-17 |
20180138054 | TRANSITION METAL DRY ETCH BY ATOMIC LAYER REMOVAL OF OXIDE LAYERS FOR DEVICE FABRICATION | 2018-05-17 |
20180138055 | REMOVAL METHODS FOR HIGH ASPECT RATIO STRUCTURES | 2018-05-17 |
20180138056 | Package and Method for Integration of Heterogeneous Integrated Circuits | 2018-05-17 |
20180138057 | TRANSFER HEAD ARRAY | 2018-05-17 |
20180138058 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM | 2018-05-17 |
20180138059 | SUBSTRATE LIQUID PROCESSING APPARATUS AND METHOD | 2018-05-17 |
20180138060 | SUBSTRATE PROCESSING APPARATUS | 2018-05-17 |
20180138061 | SELECTIVE ETCH RATE MONITOR | 2018-05-17 |
20180138062 | INTEGRATED CIRCUIT PACKAGE SINGULATION ASSEMBLY | 2018-05-17 |
20180138063 | QUARTZ BOAT TRANSMISSION MECHANISM USED IN DIFFUSION FURNACE | 2018-05-17 |
20180138064 | WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION | 2018-05-17 |
20180138065 | WAFER CONTAINER WITH EXTERNAL PASSIVE GETTER MODULE | 2018-05-17 |
20180138066 | SUBSTRATE PROCESSING APPARATUS | 2018-05-17 |
20180138067 | SUBSTRATE LIFT BAR AND METHOD FOR SMEARING ANTI-STATIC LIQUID | 2018-05-17 |
20180138068 | SEALED SUBSTRATE CARRIERS AND SYSTEMS AND METHODS FOR TRANSPORTING SUBSTRATES | 2018-05-17 |
20180138069 | EDGE RING CENTERING METHOD USING RING DYNAMIC ALIGNMENT DATA | 2018-05-17 |
20180138070 | POSITIONING DEVICE | 2018-05-17 |
20180138071 | MICRO-TRANSFER-PRINTABLE FLIP-CHIP STRUCTURES AND METHODS | 2018-05-17 |
20180138072 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | 2018-05-17 |
20180138073 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | 2018-05-17 |
20180138074 | CARRIER RING AND CHEMICAL VAPOR DEPOSITION APPARATUS INCLUDING THE SAME | 2018-05-17 |
20180138075 | AIRGAP FORMATION WITH DAMAGE-FREE COPPER | 2018-05-17 |
20180138076 | INTERCONNECT STRUCTURE INCLUDING AIR GAP | 2018-05-17 |
20180138077 | METHOD OF FORMING INTERCONNECTION STRUCTURE | 2018-05-17 |
20180138078 | Method for Regulating Hardmask Over-Etch for Multi-Patterning Processes | 2018-05-17 |
20180138079 | ELECTRICALLY INSULATED FIN STRUCTURE(S) WITH ALTERNATIVE CHANNEL MATERIALS AND FABRICATION METHODS | 2018-05-17 |
20180138080 | HANDLE SUBSTRATE FOR USE IN MANUFACTURE OF SEMICONDUCTOR-ON-INSULATOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | 2018-05-17 |
20180138081 | SEMICONDUCTOR STRUCTURES AND METHOD FOR FABRICATING THE SAME | 2018-05-17 |
20180138082 | AIR-CAVITY MODULE WITH ENHANCED DEVICE ISOLATION | 2018-05-17 |
20180138083 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-05-17 |
20180138084 | ENHANCED VIA FILL MATERIAL AND PROCESSING FOR DUAL DAMASCENE INTEGRATION | 2018-05-17 |
20180138085 | SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL | 2018-05-17 |
20180138086 | Substrate and Method | 2018-05-17 |
20180138087 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | 2018-05-17 |
20180138088 | METHOD OF FORMING SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138089 | Wafer Level Package Structure and Method of Forming Same | 2018-05-17 |
20180138090 | STORAGE DEVICE FOR GENERATING TRACE DATA AND METHOD OF OPERATING THE SAME | 2018-05-17 |
20180138091 | VERTICAL FETS WITH VARIABLE BOTTOM SPACER RECESS | 2018-05-17 |
20180138092 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2018-05-17 |
20180138093 | LOW RESISTANCE SOURCE-DRAIN CONTACTS USING HIGH TEMPERATURE SILICIDES | 2018-05-17 |
20180138094 | STABLE MIXED OXIDE CATALYSTS FOR DIRECT CONVERSION OF ETHANOL TO ISOBUTENE AND PROCESS FOR MAKING | 2018-05-17 |
20180138095 | POROUS SILICON RELAXATION MEDIUM FOR DISLOCATION FREE CMOS DEVICES | 2018-05-17 |
20180138096 | ABNORMALITY DETECTION APPARATUS | 2018-05-17 |
20180138097 | SIZING DEVICE, POLISHING APPARATUS, AND POLISHING METHOD | 2018-05-17 |
20180138098 | CONTACT-VIA CHAIN AS CORROSION DETECTOR | 2018-05-17 |
20180138099 | SEMICONDUCTOR DEVICE PACKAGE STRUCTURE | 2018-05-17 |
20180138100 | POWER MODULE AND INVERTER EQUIPMENT | 2018-05-17 |
20180138101 | PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME | 2018-05-17 |
20180138102 | INTEGRATED PACKAGING DEVICES AND METHODS WITH BACKSIDE INTERCONNECTIONS | 2018-05-17 |
20180138103 | FINGERPRINT RECOGNITION MODULE AND MANUFACTURING METHOD THEREFOR | 2018-05-17 |
20180138104 | THERMAL VIA ARRANGEMENT FOR MULTI-CHANNEL SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138105 | THERMAL DISSIPATION DEVICE AND SEMICONDUCTOR PACKAGE DEVICE INCLUDING THE SAME | 2018-05-17 |
20180138106 | Superlattice Structures for Thermoelectric Devices | 2018-05-17 |
20180138107 | LEAD FRAME AND ELECTRONIC COMPONENT DEVICE | 2018-05-17 |
20180138108 | SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138109 | SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME | 2018-05-17 |
20180138110 | Enhanced Adhesion by Nanoparticle Layer Having Randomly Configured Voids | 2018-05-17 |
20180138111 | Package with interconnections having different melting temperatures | 2018-05-17 |
20180138112 | POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SENSE RESISTOR INTEGRATION FOR MULTI-PHASE POWER APPLICATIONS | 2018-05-17 |
20180138113 | SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRUCTURE | 2018-05-17 |
20180138114 | SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING PROCESS | 2018-05-17 |
20180138115 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2018-05-17 |
20180138116 | Semiconductor Device and Method | 2018-05-17 |
20180138117 | SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS | 2018-05-17 |
20180138118 | INTEGRATED CIRCUIT PACKAGE SUBSTRATE | 2018-05-17 |
20180138119 | DIELECTRIC THERMAL CONDUCTOR FOR PASSIVATING EFUSE AND METAL RESISTOR | 2018-05-17 |
20180138120 | Semiconductor Device with Metallization Structure on Opposite Sides of a Semiconductor Portion | 2018-05-17 |
20180138121 | SEMICONDUCTOR DEVICE AND A METHOD OF INCREASING A RESISTANCE VALUE OF AN ELECTRIC FUSE | 2018-05-17 |
20180138122 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | 2018-05-17 |
20180138123 | INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME | 2018-05-17 |