20th week of 2019 patent applcation highlights part 64 |
Patent application number | Title | Published |
20190148195 | SOLAR CELL SILICON WAFER CARRYING DEVICE AND TRANSMISSION SYSTEM | 2019-05-16 |
20190148196 | SYSTEMS, DEVICES, AND METHODS FOR USING A REAL TIME ENVIRONMENT SENSOR IN A FOUP | 2019-05-16 |
20190148197 | INITIALIZATION SETTING METHOD FOR RF COMMUNICATION OF UNMANNED TRANSPORTING DEVICE IN AUTOMATED MATERIAL HANDLING SYSTEM | 2019-05-16 |
20190148198 | SYSTEMS AND METHODS FOR AUTOMATED WAFER HANDLING | 2019-05-16 |
20190148199 | Robot Having Predetermined Orientation | 2019-05-16 |
20190148200 | LOADING APPARATUS AND OPERATING METHOD THEREOF | 2019-05-16 |
20190148201 | WAFER POSITIONING AND LOADING SYSTEM | 2019-05-16 |
20190148202 | SYSTEMS AND METHODS FOR WAFER ALIGNMENT | 2019-05-16 |
20190148203 | METHOD AND APPARATUS FOR LITHOGRAPHY IN SEMICONDUCTOR FABRICATION | 2019-05-16 |
20190148204 | ELECTROSTATIC CHUCK | 2019-05-16 |
20190148205 | ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | 2019-05-16 |
20190148206 | ELECTROSTATIC CHUCK | 2019-05-16 |
20190148207 | METHOD OF DEBONDING A CARRIER SUBSTRATE FROM A DEVICE SUBSTRATE, APPARATUS FOR PERFORMING THE SAME, AND METHOD OF SINGULATING SEMICONDUCTOR CHIPS INCLUDING THE SAME | 2019-05-16 |
20190148208 | PATTERNED CHUCK FOR DOUBLE-SIDED PROCESSING | 2019-05-16 |
20190148209 | SYSTEMS AND METHODS FOR ROBOTIC ARM SENSING | 2019-05-16 |
20190148210 | SUBSTRATE TRANSFER HAND AND ROBOT | 2019-05-16 |
20190148211 | DEPOSITION APPARATUS INCLUDING UPPER SHOWER HEAD AND LOWER SHOWER HEAD | 2019-05-16 |
20190148212 | SEMICONDUCTOR WAFER CLEANING APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFER | 2019-05-16 |
20190148213 | TRANSFER DEVICE | 2019-05-16 |
20190148214 | FINFET DEVICES WITH EMBEDDED AIR GAPS AND THE FABRICATION THEREOF | 2019-05-16 |
20190148215 | FinFET Devices with Embedded Air Gaps and the Fabrication Thereof | 2019-05-16 |
20190148216 | SEMICONDUCTOR DEVICES HAVING ISOLATION INSULATING LAYERS AND METHODS OF MANUFACTURING THE SAME | 2019-05-16 |
20190148217 | Method for Manufacturing a Semiconductor Device | 2019-05-16 |
20190148218 | MOSFETs with Channels on Nothing and Methods for Forming the Same | 2019-05-16 |
20190148219 | DEEP TRENCH ISOLATION STRUCTURE IN SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148221 | Patterning Methods for Semiconductor Devices and Structures Resulting Therefrom | 2019-05-16 |
20190148222 | 3D IC METHOD AND DEVICE | 2019-05-16 |
20190148223 | CONTACT METALLIZATION PROCESS | 2019-05-16 |
20190148224 | METHOD OF SELECTIVELY DEPOSITING A CAPPING LAYER STRUCTURE ON A SEMICONDUCTOR DEVICE STRUCTURE | 2019-05-16 |
20190148225 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH PROTECTION LAYER AND METHOD FOR FORMING THE SAME | 2019-05-16 |
20190148226 | INTEGRATED CIRCUIT DEVICES AND METHOD OF MANUFACTURING THE SAME | 2019-05-16 |
20190148227 | RLINK-ON-DIE INTERCONNECT FEATURES TO ENABLE SIGNALING | 2019-05-16 |
20190148228 | METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148229 | PLATED METALLIZATION STRUCTURES | 2019-05-16 |
20190148230 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-05-16 |
20190148231 | MOS TRANSISTOR FOR SUPPRESSING GENERATION OF PHOTO-INDUCED LEAKAGE CURRENT IN ACTIVE CHANNEL REGION AND APPLICATION THEREOF | 2019-05-16 |
20190148232 | METHODS FOR SINGULATION AND PACKAGING | 2019-05-16 |
20190148233 | Component and Method of Manufacturing a Component Using an Ultrathin Carrier | 2019-05-16 |
20190148234 | METHOD FOR PRODUCING A 3D MEMORY DEVICE | 2019-05-16 |
20190148235 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2019-05-16 |
20190148236 | Isolation Components for Transistors Formed on Fin Features of Semiconductor Substrates | 2019-05-16 |
20190148237 | METHOD OF FORMING MULTI-THRESHOLD VOLTAGE DEVICES USING DIPOLE-HIGH DIELECTRIC CONSTANT COMBINATIONS AND DEVICES SO FORMED | 2019-05-16 |
20190148238 | LOW-K GATE SPACER AND FORMATION THEREOF | 2019-05-16 |
20190148239 | Low-K Gate Spacer and Formation Thereof | 2019-05-16 |
20190148240 | GATE CONTACT STRUCTURES AND CROSS-COUPLED CONTACT STRUCTURES FOR TRANSISTOR DEVICES | 2019-05-16 |
20190148241 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | 2019-05-16 |
20190148242 | FORMING SINGLE DIFFUSION BREAK AND END ISOLATION REGION AFTER METAL GATE REPLACEMENT, AND RELATED STRUCTURE | 2019-05-16 |
20190148243 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148244 | FINFET DEVICES AND METHODS OF FORMING | 2019-05-16 |
20190148245 | FDSOI SEMICONDUCTOR DEVICE WITH CONTACT ENHANCEMENT LAYER AND METHOD OF MANUFACTURING | 2019-05-16 |
20190148246 | AUTOMATIC OPTIMIZATION OF MEASUREMENT ACCURACY THROUGH ADVANCED MACHINE LEARNING TECHNIQUES | 2019-05-16 |
20190148247 | NITRIDE SEMICONDUCTOR LAMINATE, METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR LAMINATE, AND METHOD FOR INSPECTING SEMICONDUCTOR LAMINATE | 2019-05-16 |
20190148248 | METHODS AND SYSTEMS FOR MATERIAL PROPERTY PROFILING OF THIN FILMS | 2019-05-16 |
20190148249 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, AND TEST METHOD FOR SEMICONDUCTOR CHIP | 2019-05-16 |
20190148250 | METALLIZATION PATTERNS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME | 2019-05-16 |
20190148251 | SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148252 | METHOD OF CURING THERMOPLASTICS WITH MICROWAVE ENERGY | 2019-05-16 |
20190148253 | System and Method for a Transducer in an eWLB Package | 2019-05-16 |
20190148254 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-05-16 |
20190148255 | SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2019-05-16 |
20190148256 | SEMICONDUCTOR PACKAGES RELATING TO THERMAL TRANSFER PLATE AND METHODS OF MANUFACTURING THE SAME | 2019-05-16 |
20190148257 | SEMICONDUCTOR PACKAGES RELATING TO THERMAL REDISTRIBUTION PATTERNS | 2019-05-16 |
20190148258 | POWER SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148259 | POWER CONVERTER AND POWER CONVERTER FOR RAILROAD VEHICLE | 2019-05-16 |
20190148260 | ELECTRONIC PACKAGE WITH TAPERED PEDESTAL | 2019-05-16 |
20190148261 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-05-16 |
20190148262 | Integrated Fan-Out Packages and Methods of Forming the Same | 2019-05-16 |
20190148263 | CLIP FOR SEMICONDUCTOR PACKAGE | 2019-05-16 |
20190148264 | Wafer Level Embedded Heat Spreader | 2019-05-16 |
20190148265 | SEMICONDUCTOR MODULE | 2019-05-16 |
20190148266 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME | 2019-05-16 |
20190148267 | Semiconductor Package and Method | 2019-05-16 |
20190148268 | UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN SEMICONDUCTOR PACKAGES | 2019-05-16 |
20190148269 | FOLDED SEMICONDUCTOR PACKAGE ARCHITECTURES AND METHODS OF ASSEMBLING SAME | 2019-05-16 |
20190148270 | METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED WETTABLE FLANK AND STRUCTURE | 2019-05-16 |
20190148271 | LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE | 2019-05-16 |
20190148272 | ELECTRICAL CONNECTIVITY FOR CIRCUIT APPLICATIONS | 2019-05-16 |
20190148273 | PACKAGE SUBSTRATE AND PACKAGE STRUCTURE | 2019-05-16 |
20190148274 | Intergrated Circuit Packages and Methods of Forming Same | 2019-05-16 |
20190148275 | STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF ASSEMBLING SAME, AND SYSTEMS CONTAINING SAME | 2019-05-16 |
20190148276 | SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME | 2019-05-16 |
20190148277 | Fan-Out Package Structure and Method | 2019-05-16 |
20190148278 | ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | 2019-05-16 |
20190148279 | ELECTRONICS PACKAGE HAVING A SELF-ALIGNING INTERCONNECT ASSEMBLY AND METHOD OF MAKING SAME | 2019-05-16 |
20190148280 | SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | 2019-05-16 |
20190148281 | POWER SEMICONDUCTOR MODULE AND ELECTRONIC DEVICE | 2019-05-16 |
20190148282 | ELECTRONIC DEVICE WITH DIE BEING SUNK IN SUBSTRATE | 2019-05-16 |
20190148283 | ELEMENT PLACE ON LAMINATES | 2019-05-16 |
20190148284 | MANAGED INTEGRATED CIRCUIT POWER SUPPLY DISTRIBUTION | 2019-05-16 |
20190148285 | STACKED SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR SYSTEM | 2019-05-16 |
20190148286 | MULTI-LEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY | 2019-05-16 |
20190148287 | Via Structure and Methods Thereof | 2019-05-16 |
20190148288 | Semiconductor Device and Method of Manufacture | 2019-05-16 |
20190148289 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-05-16 |
20190148290 | Two-Dimensional Via Pillar Structures | 2019-05-16 |
20190148291 | SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE | 2019-05-16 |
20190148292 | SEMICONDUCTOR DEVICES | 2019-05-16 |
20190148293 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | 2019-05-16 |
20190148294 | NOVEL PATTERNING APPROACH FOR IMPROVED VIA LANDING PROFILE | 2019-05-16 |
20190148295 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2019-05-16 |