20th week of 2009 patent applcation highlights part 16 |
Patent application number | Title | Published |
20090121319 | POWER SEMICONDUCTOR DEVICES WITH MESA STRUCTURES AND BUFFER LAYERS INCLUDING MESA STEPS - A bipolar junction transistor includes a collector having a first conductivity type, a drift layer having the first conductivity type on the collector, a base layer on the drift layer and having a second conductivity type opposite the first conductivity type, a lightly doped buffer layer having the first conductivity type on the base layer and forming a p-n junction with the base layer, and an emitter mesa having the first conductivity type on the buffer layer and having a sidewall. The buffer layer includes a mesa step adjacent to and spaced laterally apart from the sidewall of the emitter mesa, and a first thickness of the buffer layer beneath the emitter mesa is greater than a second thickness of the buffer layer outside the mesa step. | 2009-05-14 |
20090121320 | Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method - The present invention includes a first step of forming a nitride semiconductor layer by metal organic chemical vapor deposition by using a first carrier gas containing a nitrogen carrier gas and a hydrogen carrier gas of a flow quantity larger than that of the nitrogen carrier gas to thereby supply a raw material containing Mg and a Group V raw material containing N, and a second step of lowering a temperature by using a second carrier gas to which a material containing N is added, and hence solves the problems. | 2009-05-14 |
20090121321 | Wafer and a Method of Dicing a Wafer - A wafer includes a plurality of chips, each of the chips being spaced from each other by kerf-line regions including a reduced width. | 2009-05-14 |
20090121322 | Semiconductor chip and semiconductor device - A semiconductor chip comprises a semiconductor substrate, a multi-layer wiring structure on the semiconductor substrate, a seal ring structure on the semiconductor substrate, and a semiconductor element arranged in an inner region of said semiconductor chip and in a frame region of said semiconductor chip. The semiconductor element comprises a chip internal circuit, the inner region is enclosed by the seal ling structure, and the seal ring structure separates the frame region as being outside of the inner region. | 2009-05-14 |
20090121323 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device and a method of fabricating the same. The semiconductor device includes a semiconductor substrate including an active surface and an inactive surface which faces the active surface, a device isolation layer and a pad stacked on the active surface; and a through electrode disposed in a first via hole and a second via hole and including a protruding part that protrudes from the pad, the first via hole penetrating the semiconductor substrate, the second via hole penetrating the device insulation layer and the pad continuously, wherein at least a surface of the protruding part of the through electrode is formed of an oxidation resistance-conductive material. | 2009-05-14 |
20090121324 | ETCH WITH STRIATION CONTROL - A method for etching a feature in an etch layer is provided. A patterned photoresist mask is formed over the etch layer with photoresist features with sidewalls wherein the sidewalls of the photoresist features have striations forming peaks and valleys. The striations of the sidewalls of the photoresist features are reduced. The reducing the striations comprises at least one cycle, wherein each cycle comprises etching back peaks formed by the striations of the sidewalls of the photoresist features and depositing on the sidewalls of the photoresist features. Features are etched into the etch layer through the photoresist features. The photoresist mask is removed. | 2009-05-14 |
20090121325 | METHOD FOR PRODUCING A THIN FILM TRANSISTOR AND A DEVICE OF THE SAME - A method for producing a thin film transistor and including the following steps for preparing a glass substrate; having a positive photosensitive coating on the glass substrate; providing a transparent mold plate, having a plurality of ladder opaque protrusions in accordance with a predetermined pattern having different depth; controlling the transparent mold plate downwardly to press into the positive photosensitive coating and non-contacting to the glass substrate; exploring a part of the positive photosensitive coating via an explosion by a UV light; remaining the other part of the positive photosensitive coating, which is shielded by the protrusions and shaped corresponding to the predetermined pattern; separating the transparent mold plate from the glass substrate, and removing the other parts of the photosensitive coating unshielded via a chemical solvent. Thereby, after the positive photosensitive coating is pressed, cured, and cleaned the thin film transistor is formed. | 2009-05-14 |
20090121326 | SEMICONDUCTOR PACKAGE MODULE - A semiconductor package module includes a circuit board including a board body having a receiving portion and conductive patterns formed on the board body; a semiconductor package received in the receiving portion and having conductive terminals electrically connected to the conductive patterns and an s semiconductor chip electrically connected to the conductive terminals; and a connection member electrically connecting the conductive patterns and the conductive terminals. In the present invention, after a receiving portion having a receiving space is formed in the board body of a circuit board and a semiconductor package is received in the receiving portion, and a connection terminal of the semiconductor package and a conductive pattern of the board body are electrically connected using a connection member, a plurality of semiconductor packages can be stacked in a single circuit board without increasing the thickness thereby significantly improving data storage capacity and data processing speed of the semiconductor package module. | 2009-05-14 |
20090121327 | Semiconductor device having spacer formed on semiconductor chip connected with wire - A semiconductor device includes a semiconductor chip, a supporting body that is disposed below the semiconductor chip and supports the semiconductor chip, a spacer that is fixed onto the first semiconductor chip, and a substrate that is located below the first semiconductor chip and electrically connected to the semiconductor chip with a wire. At least a part of the peripheral portion of the semiconductor chip is an overhang portion that projects more laterally than the peripheral portion of the supporting body. A covering portion that covers a part of the upper surface of the overhang portion is formed in the spacer. The wire is connected to a region in the upper surface of the overhang portion, the region being lateral to the outermost periphery of the covering portion of the spacer and not being covered with the covering portion of the spacer. A height of an apex of the wire from the upper surface of the first semiconductor chip as a reference, is greater than a height, from the reference, of at least a portion in the outermost periphery of the covering portion of the spacer, the portion having the wire arranged at its lateral side. | 2009-05-14 |
20090121328 | Glass Substrate of Flat Panel Display and Display Integrated Circuit Chip - An exemplary glass substrate of flat panel display is adapted for an integrated circuit (IC) chip. The IC chip has two opposite long sides and two opposite short sides. The glass substrate includes a display area and a plurality of conductive wires. The display area has a plurality of display elements formed therein. The conductive wires are electrically coupled to the IC chip and the display area, to transmit a signal provided from the IC chip to the display area. The IC chip includes a plurality of output terminals arranged at the long sides and electrically coupled to the respective conductive wires. The present invention also provides a display IC chip for receiving and outputting a first color signal, a second color signal and a third color signal. | 2009-05-14 |
20090121329 | LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF - A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail. | 2009-05-14 |
20090121330 | Clip Mount For Integrated Circuit Leadframes - A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using copper clip that include a structure portion that is received with a recess-like “tub” that is formed in the leadframe contact which tub is shaped to conform to the geometric shape of the clip. In the preferred embodiment, a leadframe structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. | 2009-05-14 |
20090121331 | Self-Aligning Structures and Method For Integrated Circuits - A lead frame having a die thereon connects a high current conductive area on the die to a lead frame contact using a copper clip that includes a structure portion that is received with a recess-like “tub” formed in the lead frame contact. In the preferred embodiment, a lead frame structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by solder paste or an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. One or more solder-holding pockets are formed a surface portion of the tub and/or the end of the clip that is received in the tub so that a volume of liquefied solder formed during the solder reflow step will effect alignment of any mis-aligned parts by “drawing” at least one of the parts against a “stop” surface. | 2009-05-14 |
20090121332 | SEMICONDUCTOR CHIP PACKAGE - A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring. | 2009-05-14 |
20090121333 | Flexible substrates having a thin-film barrier - Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature. | 2009-05-14 |
20090121334 | MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A required number of wiring layers | 2009-05-14 |
20090121335 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION - An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity. | 2009-05-14 |
20090121336 | STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor package provides an enhanced data storage capacity along with an improved data processing speed. The stacked semiconductor package includes a substrate having chip selection pads and a connection pad; a semiconductor chip module including a plurality of semiconductor chips including data bonding pads, a chip selection bonding pad, and data redistributions electrically connected with the data bonding pads and a data through electrode passing through the data bonding pad and connected with the data redistribution, the semiconductor chips being stacked so as to expose the chip selection bonding pad; and a conductive wire for connecting electrically the chip selection pad and the chip selection bonding pads. | 2009-05-14 |
20090121337 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR - To divide a semiconductor wafer by stealth dicing, a test pad in a cutting region and an alignment target are collectively arranged along one side in a width direction of the cutting region, and a laser beam for forming a modified region is irradiated to a position away in plane from the test pad and the alignment target Am. In this manner, defects in cutting shape in a cutting process of a semiconductor wafer using stealth dicing can be reduced or prevented. | 2009-05-14 |
20090121338 | ASSEMBLIES AND MULTI CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE HAVING CENTRALLY LOCATED, WIRE BONDED BOND PADS - An assembly method that includes providing a first semiconductor device and positioning a second semiconductor device at least partially over the first semiconductor device is disclosed. Spacers space the active surface of the first semiconductor device substantially a predetermined distance apart from the back side of the second semiconductor device. Discrete conductive elements are extended between the active surface of the first semiconductor device and the substrate prior to positioning of the second semiconductor device. Intermediate portions of the discrete conductive elements pass through an aperture formed between the active surface of the first semiconductor device, the back side of the second semiconductor device, and two of the spacers positioned therebetween. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed. | 2009-05-14 |
20090121339 | SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS - In a semiconductor module including multiple semiconductor devices, a signal that flows through a bonding wire connected to one semiconductor device is prevented from acting as noise which affects another semiconductor device, thereby improving the operation reliability of the semiconductor module. A second semiconductor device provided alongside a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire such as a gold wire. The bonding wire is provided across the side E2 of the second semiconductor device. The bonding wire connected to the first semiconductor device is provided across a side of the first semiconductor device that corresponds to the side El of the second semiconductor device, i.e., the side F2, F3, or F4 of the first semiconductor device. | 2009-05-14 |
20090121340 | Fully testable surface mount die package configured for two-sided cooling - A power semiconductor die is sandwiched between upper and lower heat conducting laminate structures to form a surface mount component that is configured for double-sided cooling. The upper heat conducting laminate structure electrically couples top-side die terminal(s) to conductors formed on the inboard face of the lower heat conducting laminate structure, and all of the die terminals are electrically coupled to conductors formed on the outboard face of the lower heat conducting laminate structure. The die package can be placed in a test fixture for full power testing, and when installed in an electronic assembly including a circuit board and upper and lower heatsinks, the die is thermally coupled to the upper heatsink through the upper heat conducting laminate structure, and to the lower heatsink through the circuit board and the lower heat conducting laminate structure. | 2009-05-14 |
20090121341 | COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR PACKAGE - A component for semiconductor package which has a protective insulating layer on at least one surface of a component body and exposes a conductive material of the component body to an opening part of the protective insulating layer is manufactured by a method including the steps of (a) forming a mask on at least one surface of the component body, (b) forming the protective insulating layer by filling an opening part of the mask with a protective insulating material by a molding method using a metal mold comprising a mold release film, and (c) removing the metal mold and removing the mask. A typical component is a lead frame or a substrate for semiconductor package. | 2009-05-14 |
20090121342 | SEMICONDUCTOR DEVICE INCLUDING MAIN SUBSTRATE AND SUB SUBSTRATES AND FABRICATION METHOD OF THE SAME - A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate. | 2009-05-14 |
20090121343 | CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION FROM SEMICONDUCTOR MODULES - Disclosed are embodiments of an improved semiconductor wafer structure having protected clusters of carbon nanotubes (CNTs) on the back surface and a method of forming the improved semiconductor wafer structure. Also disclosed are embodiments of a semiconductor module with exposed CNTs on the back surface for providing enhanced thermal dissipation in conjunction with a heat sink and a method of forming the semiconductor module using the disclosed semiconductor wafer structure. | 2009-05-14 |
20090121344 | SILICON INTERPOSER AND SEMICONDUCTOR DEVICE PACKAGE AND SEMICONDUCTOR DEVICE INCORPORATING THE SAME - A silicon interposer | 2009-05-14 |
20090121345 | SILICON INTERPOSER PRODUCING METHOD, SILICON INTERPOSER AND SEMICONDUCTOR DEVICE PACKAGE AND SEMICONDUCTOR DEVICE INCORPORATING SILICON INTERPOSER - A silicon interposer producing method comprising the steps of forming through holes | 2009-05-14 |
20090121346 | Flexible Interposer for Stacking Semiconductor Chips and Connecting Same to Substrate - A semiconductor device with a first ( | 2009-05-14 |
20090121347 | Semiconductor Device and Semiconductor Device Assembly - Disclosed are a semiconductor device wherein warping of a semiconductor chip due to a sudden temperature change can be prevented without increasing the thickness, and a semiconductor device assembly. The semiconductor device comprises a semiconductor chip, a front side resin layer formed on the front surface of the semiconductor chip by using a first resin material, and a back side resin layer formed on the back surface of the semiconductor chip by using a second resin material having a higher thermal expansion coefficient than the first resin material. The back side resin layer is formed thinner than the front side resin layer. | 2009-05-14 |
20090121348 | CHIP STRUCTURE AND PROCESS THEREOF AND STACKED STRUCTURE OF CHIPS AND PROCESS THEREOF - A chip structure and a stacked structure composed of the chip structures are provided. The chip structure has a substrate and at least one compliant contact. Furthermore, the chip structure may further have a redistribution layer for redistributing pads originally disposed around the substrate in a specific arrangement. The substrate has a first surface and a second surface. The compliant contact is embedded into the substrate and protrudes outside the first surface and the second surface of the substrate. The compliant contact has a compliant bump and a conductive layer encapsulating the compliant bump. The conductive layer can be connected with the redistribution layer. Two chip structures can be connected with each other through their compliant contacts or through their compliant contacts or redistribution layers. | 2009-05-14 |
20090121349 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP. | 2009-05-14 |
20090121350 | BOARD ADAPTED TO MOUNT AN ELECTRONIC DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFORE, AND PORTABLE DEVICE - A board adapted to mount an electronic device includes an insulating resin layer, a wiring layer of a predetermined pattern provided on one surface of the insulating resin layer, a bump electrode provided on an insulating-resin-layer-side surface of the wiring layer, and a covering, formed of a metal layer, which covers a top surface of the bump electrode and a region, at a side surface of the bump electrode, continuous with the top surface excluding a region in contact with the wiring layer. | 2009-05-14 |
20090121351 | Process for forming a bump structure and bump structure - A method for forming a bump structure and a bump structure for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon, used as an electric connection in an electronic circuit, includes the steps of forming a mandrel by steps including forming at least one opening extending through a bump-forming die body in the thickness direction thereof and positioning a bump-forming die lid on a surface of the bump-forming die body so as to cover one end of the opening and to thereby define a bump-forming recess. The bump-forming die body may be comprised of a metal sheet. A metal layer is formed at least on an inner surface of the bump-forming die lid exposed within the bump-forming recess. The mandrel is removed so as to expose the metal layer and form a bump structure. | 2009-05-14 |
20090121352 | MUTLI-PACKAGE MODULE AND ELECTRONIC DEVICE USING THE SAME - A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed. | 2009-05-14 |
20090121353 | DUAL DAMASCENE BEOL INTEGRATION WITHOUT DUMMY FILL STRUCTURES TO REDUCE PARASITIC CAPACITANCE - In accordance with the invention, there are methods of making semiconductor devices. The method can include forming a hard mask layer over a dielectric layer, forming a via through the hard mask layer and the dielectric layer, and depositing an anti-reflective coating in the via and over the hard mask layer. The method can also include etching a trench through the hard mask layer, etching a dummy fill pattern in the hard mask layer to a desired thickness, and etching the trench through the dielectric layer and the dummy fill through the hard mask layer and in the dielectric layer. The method can further include depositing copper in the via and in the trench and removing excess copper using chemical mechanical polishing, wherein the dummy fill in the dielectric layer is of desired reduced depth. | 2009-05-14 |
20090121354 | Semiconductor Device and Method of Fabricating the Same - In a method of fabricating a semiconductor device a plurality of metal lines is formed over a semiconductor substrate. A reaction-prevention layer is formed on the metal line of a region in which a via hole will be formed. An interlayer insulating layer is formed over the semiconductor substrate including the reaction-prevention layer. The via hole is formed by etching the interlayer insulating layer over the reaction-prevention layer. A via plug is formed within the via hole. | 2009-05-14 |
20090121355 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, an oxygen-containing insulating film disposed above the above-described semiconductor substrate, a concave portion disposed in the above-described insulating film, a copper-containing first film disposed on an inner wall of the above-described concave portion, a copper-containing second film disposed above the above-described first film and filled in the above-described concave portion, and a manganese-containing oxide layer disposed between the above-described first film and the above-described second film. Furthermore, a copper interconnection is formed on the above-described structure by an electroplating method and, subsequently, a short-time heat treatment is conducted at a temperature of 80° C. to 120° C. | 2009-05-14 |
20090121356 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The semiconductor device according to the present invention includes a first interlayer dielectric film, a plurality of copper damascene wires embedded in the first interlayer dielectric film at an interval from each other, and a diffusion preventing film stacked on the first interlayer dielectric film for preventing diffusion of copper contained in the copper damascene wires, while an air gap closed with the diffusion preventing film is formed between the copper damascene wires adjacent to each other by partially removing the first interlayer dielectric film from the space between these copper damascene wires. | 2009-05-14 |
20090121357 | DESIGN STRUCTURE FOR BRIDGE OF A SEMINCONDUCTOR INTERNAL NODE - A design structure for forming connections within a semiconductor device is disclosed. The semiconductor device incorporates a contact bridge between transistor contacts in close proximity. The contact bridge comprises a plurality of metal pillars each having a lower end in electrical contact with first and second transistor elements, respectively; one or more intermediate metal pillars disposed between and in electrical contact with an upper end of the metal pillars; and one or more separation regions of dielectric disposed below the intermediate metal pillar and between the lower ends of the first and second metal pillars. | 2009-05-14 |
20090121358 | DUAL DEPTH TRENCH TERMINATION METHOD FOR IMPROVING CU-BASED INTERCONNECT INTEGRITY - A trench is formed in a low K dielectric ( | 2009-05-14 |
20090121359 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes: a semiconductor substrate; a first insulating film (third insulating film | 2009-05-14 |
20090121360 | Semiconductor device having dual damascene structure - The semiconductor device includes multilayer wirings of a dual damascene structure. The multilayer wirings include a first wiring layer formed on a semiconductor substrate and a second wiring layer formed on the first wiring layer. The first wiring layer includes a first insulation film, plural first vias provided in the first insulation film, a second insulation film provided on the first insulation film, and a first wiring provided on the first vias and connected to those first vias in the second insulation film. The second wiring layer includes a third insulation film, plural second vias provided in the third insulation film, an adhesive layer provided on the third insulation film, a fourth insulation film provided on the adhesive layer, and a second wiring provided on the second vias and connected to those second vias in the fourth insulation film. In the first wiring layer, the aspect ratio L of a wiring having the minimum wiring width and the via aspect ratio V are in a relationship of L≧V and in the second wiring layer, the aspect ratio L of a wiring having the minimum wiring width and the via aspect ratio V is in a relationship of L2009-05-14 | |
20090121361 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF - A semiconductor device has a first semiconductor chip | 2009-05-14 |
20090121362 | SEMICONDUCTOR PACKAGE AND MOUNTING METHOD THEREOF - A semiconductor package and mounting method of improving reliability by strengthening adhesive strength of both a printed circuit board and a surface mounting package, includes a chip pad on which a semiconductor device is disposed, and lead terminals, wherein at least one of the chip pad and the lead terminals have a plurality of grooves. Accordingly, in comparison with a typical package, since a plurality of grooves are formed on both a chip pad and lead terminals of a package adhering to a printed circuit, an adhesive area of both the package and the cream solder is widened so that the shearing strength may be improved and greater solder joint reliability can be acquired. | 2009-05-14 |
20090121363 | Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process - A process for producing a circuit substrate having a resin sheet having embedded circuit chips which is obtained by embedding circuit chips into a resin sheet, which comprises steps of (a) arranging and fixing circuit chips on a substrate for processing, (b) coating the substrate for processing on which the circuit chips have been arranged and fixed with a liquid material for forming a resin sheet of an energy curing type to form an uncured coating layer, (c) curing the uncured coating layer by impressing energy to form a layer of a resin sheet having embedded circuit chips, and (d) removing the substrate for processing from the layer of a resin sheet having embedded circuit chips, and a circuit substrate obtained in accordance with the process. A circuit substrate having a resin sheet having embedded circuit chips for controlling pixels of displays and the like can be produced efficiently with excellent quality and excellent productivity. | 2009-05-14 |
20090121364 | WATER CARBONATION APPARATUS - There is described a water carbonation apparatus in which two carbonation units ( | 2009-05-14 |
20090121365 | Eddy chamber - The invention relates to an eddy chamber for generating turbulence in a medium flowing through the chamber, comprising an inlet opening, an outlet opening and at least two constrictions in the cross-section thereof. In the region of the constrictions, the inner profile of the eddy chamber has the form of wave crests ( | 2009-05-14 |
20090121366 | Humidifier - A humidifier ( | 2009-05-14 |
20090121367 | Heat exchanger for removal of condensate from a steam dispersion system - A steam dispersion apparatus includes a steam chamber communicating in an open-loop arrangement with a first steam source for supplying steam to the steam chamber. The steam chamber includes a steam dispersion location at which steam exits therefrom at generally atmospheric pressure. A heat exchanger communicates in a closed-loop arrangement with a second steam source for supplying steam to the heat exchanger at a pressure generally higher than atmospheric pressure. The heat exchanger is located at a location that is not directly exposed to the air to be humidified, the heat exchanger being in fluid communication with the steam chamber so as to contact condensate from the steam chamber. The heat exchanger converts condensate formed by the steam chamber back to steam when the condensate contacts the heat exchanger. | 2009-05-14 |
20090121368 | MOLDS FOR PRODUCING CONTACT LENSES - This invention describes molds made from alicyclic co-polymers that are useful in the production of contact lenses and methods for their use. | 2009-05-14 |
20090121369 | APPARATUS FOR MOLDING OPTICAL ELEMENT AND METHOD FOR MOLDING OPTICAL ELEMENT - A pressing device is provided so as to abut on an upper face of a drum mold of a mold to press the drum mold downward and fix the drum mold on a pedestal. While the drum mold is fixed to the pedestal by the pressing device, an upper mold is detached from and attached to the drum mold by a clamper. Further, a lower mold is engaged with a tapered engaging part of the drum mold through a tapered engaging part and fixed to the pedestal through the drum mold by the pressing device. According to this molding apparatus, the drum mold and the lower mold can be easily fixed to the pedestal by the pressing device irrespective of the presence or absence of an outer drum arranged in the outer periphery of the drum mold. | 2009-05-14 |
20090121370 | Molds for Production of Ophthalmic Devices - A mold assembly for the manufacture of at least one ophthalmic device used in or on the eye is disclosed, the mold assembly comprising a mateable pair of mold parts wherein at least one of the mold parts is made from a polymeric resin comprising a polymer backbone and one or more pendent groups having peroxide functionality and covalently linked to the polymer backbone. | 2009-05-14 |
20090121371 | Process for Producing Microlens - In a microlens formation step, the portions of a lens material film ( | 2009-05-14 |
20090121372 | Method and Apparatus for Pelletizing A Polymer Feed - A method and apparatus are described in which a polymer feed is pelletized by introducing the polymer feed to an extruder, removing heat from the polymer feed in the extruder, and extruding the polymer feed through a pelletizing die. | 2009-05-14 |
20090121373 | Method and Apparatus for Construction - A method and apparatus for constructing vertical walls using pourable concrete material. The apparatus is in the form of a kit of reusable components. The components are assembled in a series of steps, to form panels, and thereafter, concrete material is poured, in a single pour, in an upper opening between the panels. Once the concrete is set, the panels can be removed and reused. The kit includes base guide members ( | 2009-05-14 |
20090121374 | METHOD OF MANUFACTURING CRYSTAL ORIENTED CERAMICS - A method of manufacturing a crystal oriented ceramics is disclosed. The method comprises preparing step, mixing step, shaping step and sintering method. At least one of anisotropically shaped powder, used as raw material, and a compact, formed by shaping step, is selected to have an orientation degree of 80% or more with a full width at half maximum (FWHM) of 15° or less according to a rocking curve method. A microscopic powder, having an average grain diameter one-third or less that of anisotropically shaped powder, is prepared for mixing therewith to prepare raw material mixture. The raw material mixture is shaped into the compact so as to allow oriented planes of anisotropically shaped powder to be oriented in a nearly identical direction. In a sintering step, anisotropically shaped powder and microscopic powder are sintered with each other to obtain the crystal oriented ceramics. | 2009-05-14 |
20090121375 | Method for multilayer molding of thermoplastic resins and multilayer molding apparatus - A multilayer-molding method includes the steps of mixing at least one thermoplastic resin selected from a plurality of types of thermoplastic resins with a bubble-nucleating agent and a foaming gas, injecting the plurality of types of thermoplastic resins into a mold cavity such that the thermoplastic resins are layered in the mold cavity, and then, after increasing the volume of the mold cavity, foaming the at least one thermoplastic resin mixed with the bubble-nucleating agent and the foaming gas. The multilayer-molding method is characterized in that the foaming gas is supplied at a pressure of 0.1 MPa or more but less than 1.0 MPa to at least one injection-molding machine selected from a plurality of injection-molding machines, and that the thermoplastic resin plasticized in the injection-molding machine is mixed with the foaming gas. | 2009-05-14 |
20090121376 | METHOD FOR MAKING A POLYESTER FABRIC - A method for making a polyester fabric includes: (a) providing a plurality of fibers made from a polyester polymer; (b) spinning the fibers to form pre-oriented yarns; (c) texturing the pre-oriented yarns using air textured yarn techniques; (d) warping a portion of the textured yarns so as to form warp yarns; (e) wefting the remainder of the textured yarns so as to form weft yarns; and (f) weaving the warp and weft yarns to form the polyester fabric. | 2009-05-14 |
20090121377 | Method of Manufacturing Polytetrafluoroethylene Particle Aggregate and Method of Manufacturing Polytetrafluoroethylene Product - The present invention provides a method of manufacturing a polytetrafluoroethylene (PTFE) product offering better productivity and a higher degree of flexibility in form of the product to be obtained than the conventional methods of manufacturing a PTFE product, and a method of manufacturing PTFE particle aggregate obtained as an intermediate while manufacturing a PTFE product. According to the manufacturing methods, aggregate of PTFE particles including water and a surfactant is obtained by applying force to a dispersion of PTFE particles containing PTFE particles, a surfactant and water as a dispersion medium, where the force makes the PTFE particles approach or contact with each other. Such a manufacturing method may be carried out, for example, with a chamber ( | 2009-05-14 |
20090121378 | Heat fromad TPV co-extruded Header trim - A method is provided for manufacturing an upper reveal that conforms to a curved portion of a window opening of a motor vehicle door frame. The upper reveal is formed from TPV and a carrier. The method includes the steps of: co-extruding the TPV with the carrier; curing the TPV to form the upper reveal; heating the upper reveal to a temperature greater than a heat deformation temperature of the TPV; and bending the upper reveal to conform to the curved portion of the window opening of the motor vehicle door frame. | 2009-05-14 |
20090121379 | APPARATUS FOR ELECTRO-BLOWING OR BLOWING-ASSISTED ELECTRO-SPINNING TECHNOLOGY AND PROCESS FOR POST TREATMENT OF ELECTROSPUN OR ELECTROBLOWN MEMBRANES - A spinneret format, an electric-field reversal format and a process for post-treatment of membranes formed from electro-spinning or electro-blowing are provided, including a cleaning method and apparatus for electro-blowing or blowing-assisted electro-spinning technology. | 2009-05-14 |
20090121380 | Method of Obtaining Yarns Or Fiber Sheets Of Carbon From A Cellulose Precursor - A method of obtaining fiber textures of carbon from a cellulose precursor includes the steps of: spinning cellulose filaments ( | 2009-05-14 |
20090121381 | METHOD FOR MAKING FLASKLESS UPPER AND LOWER MOLDS, AN APPARATUS THEREFOR, AND A METHOD FOR PLACING A CORE - The purpose of the present invention is to provide a method to efficiently make flaskless upper and lower molds, to efficiently spray a release agent in a closed space, and to promptly place a core. | 2009-05-14 |
20090121382 | CORE-SETTING APPARATUS USED FOR A MOLDING APPARATUS AND A METHOD FOR SETTING A CORE - These inventions provide a core-setting apparatus and a method for setting the core in a lower mold used for a molding apparatus, wherein the core-setting apparatus has a simple structure and can maintain the core in the mold in a highly accurate position. The inventions consist of:
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20090121383 | Fibrillar Microstructure and Processes for the Production Thereof - This invention relates to a fibrillar microstructure and processes for the manufacture thereof. These processes involve micromachining and molding, and can prepare sub-micron dimensioned fibrillar microstructures of any shape from polymeric as well as other materials. | 2009-05-14 |
20090121384 | Method of producing fuel cell and production apparatus for fuel cell - A production apparatus for a tubular fuel cell, including a first extruder that supplies a first catalyst layer material to the outer peripheral surface of a cylindrically shaped inner electrode that exhibits conductivity, thereby forming a first catalyst layer, a second extruder that supplies an electrolyte layer material to the outer peripheral surface of the first catalyst layer, thereby forming an electrolyte layer, and a third extruder that supplies a second catalyst layer material to the outer peripheral surface of the electrolyte layer, thereby forming a second catalyst layer, wherein by conducting supply of the first catalyst layer material, the electrolyte layer material and the second catalyst layer material in an intermittent manner, at least a portion of the outer peripheral surface of the inner electrode is left exposed. | 2009-05-14 |
20090121385 | Method of forming a coating layer on the surface of a molded product within a mold - By managing a coating material injection time and the like parameters so that they may be controlled within specifically determined ranges, an in-mold coating formation method is provided for manufacturing a molded product coated with a coating layer having a uniform quality in its outside appearance. By continuously and unifyingly managing a mold opening amount and a mold closing force, an in-mold coating formation method and an in-mold coating formation apparatus are provided which are so formed that, if the control of a mold closing force and the control of a mold opening amount are continuously changed and at the same time a high precision and a high response are maintained, it is possible to enlarge a selectable range for selecting a molding condition, thereby producing an integrally formed molded product having an excellent outside appearance and whose coating layer has a high adhesion strength. Further, there are provided a mold having a specifically formed auxiliary cavity and an in-mold coating formation method which employs said mold, so that it is possible to prevent a coating material from leaking out of the mold, thereby shortening the molding formation cycle, and making it possible to manufacture a molded product having a stabilized quality. Moreover, by controlling an internal pressure in the mold cavity under a predetermined condition after the injection of the coating material, there is provided a further in-mold coating formation method which makes it possible to obtain an integrally formed molded product whose coating layer has a sufficient strength with the molded product, without having to use a special coating material and a special resin to be used for molding. In addition, by using a mold having a specifically shaped sub-cavity, there is provided a still further in-mold coating formation method which can keep mold temperature at a relatively low value, cause the coating material to cure at a predetermined temperature and within a predetermined time period, thereby shortening the molding formation cycle, improving the productivity, improving the physical properties of a coating layer, thus obtaining a good molded product. | 2009-05-14 |
20090121386 | Holder And Method For Shaping A Sound Tube - The present invention relates to a simplified manufacturing method for provision of a sound tube with a pre-formed shape, especially a sound tube for use in a BTE (Behind-The-Ear) hearing aid utilizing a holder with an external surface for imparting the shape of the surface to the sound tube, a first attachment element that is adapted to receive and hold a first connector at a first end of the sound tube, and a second attachment element that is adapted to receive and hold a second connector at a second end of the sound tube thereby keeping the sound tube in abutting contact with at least parts of the external surface whereby the external surface imparts the shape of the surface to the sound tube. | 2009-05-14 |
20090121387 | Apparatus and Method for Manufacturing Plastic Products - An injection molding apparatus ( | 2009-05-14 |
20090121388 | Unit and Method for Compression Moulding Polymeric Articles - The unit comprises a moulding machine having a plurality of press moulds (N) for moulding the article, which operate in sequence and are driven along a fixed operative path (P), and a feeder means ( | 2009-05-14 |
20090121389 | MOLD DEVICE AND METHOD FOR FORMING A LOCK BORE - A locking mechanism for an enclosure is provided. The enclosure comprises a base including a locking groove formed therein, and a lid pivotally coupled with the base having a lock bore formed therein. The lock mechanism is mounted in the lock bore and includes a pin that is selectively positioned within the locking groove to secure the lid to the base. Also provided is a molding device and method for forming the lock bore. The mold device includes a base member with a pair of arms having a mold protrusion and a lower cam surface. The molding device also includes a housing having a pair of mold protrusion openings. The mold protrusions selectively extend outwardly through mold protrusion openings when a wedge engages the lower cam surfaces on the arms, wherein the arms spread apart from one another to form a pair of snap grooves in the lock bore. | 2009-05-14 |
20090121390 | METHOD FOR PRODUCING OPTICAL RECORDING MEDIUM - A method for producing an optical recording medium, includes: filling a plurality of spaces with a liquid photosensitive material, wherein each of the plurality of spaces is surrounded by a surface of a sheet material and partition walls that are formed on the surface of the sheet material for separating a plurality of recording areas, and the surface of the sheet material has recessed parts at positions where the plurality of recording areas is to be formed, each of the recessed parts protruding and deformed to a back surface side of the sheet material so as to have a volume in relation to a volumetric shrinkage factor of the photosensitive material; and pressing a member having a substantially flat surface to a back surface of the sheet material to make the recessed parts substantially flat and heating and hardening the photosensitive material to form the plurality of recording areas. | 2009-05-14 |
20090121391 | METHOD AND SYSTEM FOR PACKAGING OF MEDICAL DEVICES INCLUDING SHAPE MEMORY POLYMERS - Methods and systems are described which allow medical devices containing shape memory polymers to be stored and/or transported without temperature control. Temperature control can be used to inhibit activation of shape memory polymers. Embodiments of methods described herein include activating shape memory polymers while within packaging which inhibits shape change due to activation. Packaging systems are also described herein. | 2009-05-14 |
20090121392 | METHOD AND APPARATUS FOR WRITING GRATING STRUCTURES USING CONTROLLED PHASE DELAY BETWEEN BEAMS - A method of writing a grating structure with at least one of predetermined amplitude, period and phase properties in a photosensitive waveguide, the method comprising providing at least two light beams which overlap in an overlap region to form an interference pattern; moving the photosensitive waveguide through the overlap region; and modulating the phase of at least one of the light beams relative to the phase of the other light beams using a non-mechanical beam modulator so that the interference pattern appears to move through the overlap region, the apparent movement being variably controlled in response to the movement of the photosensitive waveguide such that a grating structure is written with the at least one of predetermined amplitude, period and phase properties. The apparent movement of the interference pattern may be variably controlled to match the movement of the waveguide, or to be deliberately detuned. The grating structure may be chirped or apodized. | 2009-05-14 |
20090121393 | PROCESS OF FABRICATING THREE-DIMENSIONAL OBJECT - A light beam is irradiated to sinter powder layers into a plurality of cured layer which are superimposed to each other to fabricate a three-dimensional object. A portion forming an outer shell of the object is given by high-density cured layers, while the other portion is given by low-density cured layers. The high-density cured layer making up at least a side of the object is composed of a high-density primary cured layer obtained by irradiation of a primary irradiation to the powder layer, and a high-density secondary layer obtained by a secondary irradiation to a supplemental powder layer supplied on the high-density primary cured layer. Thus, the high-density cured layer is given a height in level with the low-density cured layer, which assures constant height of each cured layer which is a combination of the high-density cured layer and the low-density cured layer. | 2009-05-14 |
20090121394 | INJECTION MOLDING PROCESS - The present invention relates to an injection molding process that improves recovery limited productivity. The present invention advantageously applies pressurized fluid within the nozzle of an injection molding machine to improve the machine's productivity. In accordance with one aspect of the invention, an existing or new injection molding machine is outfitted with a pressurized fluid system at the nozzle between the plasticizer barrel and the melt manifold. The use of a specialized nozzle and isolation valve allows the pressurized fluid to displace material within the nozzle and runner, ensuring the proper pressure is applied to the plastic resin within the mold during pack and hold while the plasticizing screw can begin its recovery cycle. Finally, the pressurized fluid can be evacuated from the nozzle melt stream area either via the fluid entrance or a fluid pin. | 2009-05-14 |
20090121395 | Method and appartus for the vulcanisation of tyres for vehicle wheels - A vulcanisation apparatus and method for vehicle wheel tyres, includes at least one prevulcanisation work station to conduct a prevulcanisation of a radially internal portion of the tyre and at least two vulcanisation work stations wherein the remaining part of the vulcanisation of the whole tyre is carried out. | 2009-05-14 |
20090121396 | Method of Cooling Steel Plate - A method of cooling both surfaces of steel plate, while being constrained and conveyed between pairs of constraining rolls, by coolant sprays from top/bottom surface nozzle groups between pairs of constraining rolls, which method of cooling steel plate stably secures precision of cooling control from a start of cooling to an end of cooling in a steel plate cooling region between pairs of constraining rolls so as to uniformly cool the top and bottom surfaces of the steel plate and thereby stably secure the steel plate quality and cool the steel plate down to a target temperature with a good precision, specifically comprises dividing a steel plate cooling region between pairs of constraining rolls in which groups of top and bottom surface nozzles are arranged into at least a spray impact part region and spray non-impact part regions in a steel plate conveyance direction or in the steel plate conveyance direction and width direction, predicting a heat transfer coefficient for each divided region in advance, computing a predicted temperature history of the steel plate based on this predicted value, and setting and controlling amounts of sprayed coolant on the spray impact part regions by the groups of top and bottom surface nozzles. | 2009-05-14 |
20090121397 | REDUCTION RETORT, REDUCTION RETORT MANUFACTURE METHOD, AND VACUUM SMELTING REDUCTION FURNACE USING THE SAME - A reduction retort ( | 2009-05-14 |
20090121398 | ELECTROMAGNETIC SHOCK ABSORBER FOR VEHICLE - An electromagnetic shock absorber including: (a) a wheel-side member; (b) a body-side member movable relative to the wheel-side member; and (c) a damping force generator with an electromagnetic motor including stationary and movable elements movable relative to each other. The damping force generator can generate, based on a force generated by the motor, a damping force acting against a relative movement of the wheel-side member and the body-side member. The motor has an axis extending in a both-members-relative-movement direction as a direction of the above-described relative movement. The stationary element is supported by the wheel-side member via an elastic body, to be movable relative to the wheel-side member in the both-members-relative-movement direction. The electromagnetic motor allows relative movement of the stationary element and the movable element upon movement of the stationary element relative to the wheel-side member. | 2009-05-14 |
20090121399 | VIBRATION REDUCTION SYSTEM EMPLOYING ACTIVE BEARING MOUNTS - A vibration reduction system is provided for use in conjunction with a rotational device including a stationary body, a rotating body, and a first bearing assembly disposed between the stationary body and the rotating body. The vibration reduction system includes a first plurality of bearing mount actuators residing between the stationary body and the first bearing assembly. The first plurality of bearing mount actuators is configured to adjust the radial position of the first bearing assembly. The vibration reduction system further includes a vibration sensor, which is coupled to the stationary body, and a controller, which is coupled to the vibration sensor and to the first plurality of bearing mount actuators. The controller is configured to reduce vibrations sensed by the vibration sensor by selectively adjusting the radial position of the first bearing assembly utilizing the first plurality of bearing mount actuators. | 2009-05-14 |
20090121400 | VEHICLE SEAT AS WELL AS A SUPPORT SUITABLE FOR USE IN A VEHICLE - A vehicle seat is provided with at least one support comprising at least one deformable element. The support is provided with a number of deformable elements arranged adjacent to each other, which elements each comprise a wall portion and at least two deformable ribs extending at an angle from the wall portion. Ends of the ribs remote from wall portions are connected by strips that extend parallel to the wall portions. | 2009-05-14 |
20090121401 | Vibration damping assembly for a pulley that drives an auxiliary unit of a motor vehicle - Disclosed is an assembly for damping vibrations on a wheel that is used for driving a secondary unit of a vehicle. Said assembly comprises a damping device on the driving wheel that is mounted on a hub which is connected to a drive shaft of the secondary unit. A torsional vibration damper that is combined with a friction clutch is provided as a damping device. The friction clutch is fitted with at least one friction surface facing the hub and at least one second friction surface facing the friction ring in order to non-positively and/or positively couple the driving wheel to the hub via the damper cage of the torsional vibration damper such that torque is transmitted in a vibration damping manner from the driving wheel to the hub via the damper cage. The second friction surface is located between a plate spring and a support disk. The plate spring is connected to the damper cage while the support disk is connected to the hub. Also disclosed is an assembly encompassing several combined torsional vibration dampers. In addition, an assembly with fixed stops can be provided for transmitting high starting torques. Finally, an additional friction damping device is supplied on an assembly. | 2009-05-14 |
20090121402 | SUSPENSION FOR A VEHICLE - A suspension for a vehicle having a lower bracket secured to an axle housing. An air bag spring is cantilevered from the lower bracket. A shock absorber and a lower control arm are connected to the lower bracket. An upper bracket is secured to the axle housing. The upper bracket has two upwardly extending arms. An anti-roll bar and an upper control arm are pivotally connected to the upper bracket between said upwardly extending arms. | 2009-05-14 |
20090121403 | PIN CLAMP - A pin clamp assembly is provided which includes a housing, a locating pin, a body, a twist pin, and a cam pin. The locating pin extends from the body. Both the body and the locating pin include longitudinally extending cavities contiguously disposed therein. The body also includes a longitudinally extending slot. At least a portion of the locating pin and the body is located in a bore disposed through the housing. The twist pin is disposed in the longitudinally extending cavities of the locating pin and body. The twist pin includes a longitudinally extending arcuate slot. The cam pin is coupled to the housing. The cam pin engages the slot. An electrical driven actuator includes an electric motor that rotates to move the locating pin linearly to rotate the twist pin. | 2009-05-14 |
20090121404 | CLAMPING FIXTURE - A clamping fixture is provided for mounting work pieces. The clamping fixture includes a base, a supporting member, a covering member, and a positioning member. The supporting member and the positioning member are attached to the base. The work piece is clamped by the covering member and the supporting member. The positioning member is used for changing its position with respect to the base and fixedly mounted thereby for abutting against the work pieces. | 2009-05-14 |
20090121405 | CLAMPING DEVICE - The present invention relates to a clamping device comprising an elongate support structure carrying a fixed jaw and a movable jaw and an advancing clamping mechanism mounted on the support structure for advancing the movable jaw toward the fixed jaw in a longitudinal direction. The clamping device further comprises a transportation mechanism for convenient transportation. | 2009-05-14 |
20090121406 | Weldless mesotube grid holder - An apparatus for assembling an electronic device is disclosed, which includes one or more grid holders for maintaining one or more grids in association with a plurality of conducting components positioned perpendicular to the grid(s). One or more insulating components are also provided for mounting and supporting the conducting components. The grid holder(s) can be pushed onto the conducting components in order to eliminate the need for applying spot weld currents to the conducting components and thereby provide a weldless assembly apparatus for the precise construction of an electronic device. | 2009-05-14 |
20090121407 | POSTPROCESSING DEVICE AND IMAGE FORMING DEVICE - A postprocessing unit of a postprocessing device performs a postprocess including a preset folding process at a set folding position, with respect to recording sheets. A setting unit of the postprocessing device sets an adjustment amount of the folding position on the basis of a target value of the folding position, a measured value of the folding position after the folding process, and sheet quality information of the recording sheets. An adjusting unit of the postprocessing device adjusts the folding position of the postprocessing unit on the basis of the adjustment amount set by the setting unit. An adjustment control unit of the postprocessing device controls the adjustment by the adjusting unit on the basis of the adjustment amount set by the setting unit. | 2009-05-14 |
20090121408 | RECORDING MEDIUM POST-PROCESSING APPARATUS, IMAGE FORMING SYSTEM AND POST-PROCESSING METHOD - The recording medium post-processing apparatus is provided with: a recording-medium collecting member that collects plural recording mediums transported from outside as a recording-medium bundle; a stitching unit that stitches the recording mediums having: a supporting portion which supports the recording-medium bundle transported from the recording-medium collecting member; and a stapler portion which pushes a stitching needle into the supported recording-medium bundle; and a recording-medium bundle stacking member that is arranged below the stitching unit and stacks the recording-medium bundle stitched by the stitching unit in a vertical direction. The supporting portion and the stapler portion of the stitching unit are moved outside a position at one edge portion of the recording-medium bundle when the recording-medium bundle is not stitched. | 2009-05-14 |
20090121409 | PLASTIC CARD REORIENTING MECHANISM AND INTERCHANGEABLE INPUT HOPPER - A card reorienting mechanism and an input hopper of plastic card processing equipment, for example a desktop plastic card printer. The card reorienting mechanism is a modular unit that permits the entire mechanism to be inserted or removed as a single unit from the printer. In addition, the input hopper is designed as an interchangeable system that permits alteration in the card capacity of the hopper. | 2009-05-14 |
20090121410 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS PROVIDED THEREWITH - A sheet feeding device includes: a sheet feeding tray adapted to stack a sheet bundle including a plurality of sheets thereon; a blowing section which blows air against a leading edge of the sheet bundle in a sheet conveyance direction from a front side of the sheet conveyance direction; a sticking and conveying section which sticks an uppermost sheet stacked on the sheet feeding tray by air sucking, and feeds the uppermost sheet to a conveyance roller; a sucking duct provided inside the sticking and conveying section, which is divided into a plurality of ducts in the sheet conveyance direction; and an intercepting member which intercepts at least one of the plurality of divided ducts. | 2009-05-14 |
20090121411 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS - A sheet feeding device, having: a sheet feeding tray which stacks a paper sheet bundle formed by a plurality of sheets; a first blower which blows air to a side edge of the paper sheet bundle stacked on the sheet feeding tray; a second blower which blows air to a leading edge of the paper sheet bundle in a sheet conveyance direction from a forward side of the paper sheet bundle in the sheet conveyance direction; and an adsorption conveyance section which adsorbs a topmost sheet of the paper sheet bundle stacked on the sheet feeding tray and conveys the topmost sheet, wherein a first area in which the adsorption conveyance section is provided, and a second area in which a ventilation port of the first blower is provided, respectively includes an overlapping area in which the first area and the second area overlap on the sheet conveyance direction. | 2009-05-14 |
20090121412 | RECORDING APPARATUS - A recording apparatus includes: a loading section in which a recording medium is set; a feed roller feeding the recording medium set in the loading section; a first urging mechanism urging one of the loading section and the feed roller to decrease a distance between the set recording medium and the feed roller; an edge guide being movable in a width direction of the recording medium to align lateral edges of the recording medium set in the loading section; a DC motor allowing the edge guide to move; and a determination unit determining whether a current value at the time of driving the DC motor reaches a predetermined threshold value. Here, the driving of the DC motor is stopped when it is determined by the determination unit that the current value reaches the predetermined threshold value. | 2009-05-14 |
20090121413 | SHEET CASSETTE AND INFORMATION PROCESSING APPARATUS - A sheet cassette is adapted to be detachably attached to a cassette receiver of an information processing apparatus. A cassette body is formed with an opened space adapted to contain sheets therein. A stopper is operable to prevent a sheet from moving in a first direction to enter the opened space when a volume of the sheets contained in the opened space reaches a maximum containing capacity, while allowing the sheets contained in the opened space to move in a second direction to be fed to the information processing apparatus. | 2009-05-14 |
20090121414 | IMAGE FORMING DEVICE - An image forming device, which is configured to form an image on a sheet, includes a main body casing, a catch tray provided on the main body casing to be loaded with the sheet discharged in a first direction with the image formed thereon, and a cover configured to cover a downstream-side face of the main body casing in the first direction in an openable and closable manner. The catch tray is disposed such that a downstream-side end thereof in the first direction faces an upstream-side end of the cover in the first direction. The downstream-side end of the catch tray and the upstream-side end of the cover are configured to mutually overlap when viewed in a second direction perpendicular to the first direction and a vertical direction. | 2009-05-14 |
20090121415 | PAPER SHEET PROCESSING APPARATUS - A paper sheet processing apparatus including: an insertion slot into which a paper sheet is inserted, a paper sheet conveyance mechanism for conveying the paper sheet inserted into the insertion slot, a paper sheet traveling route through which the paper sheet is conveyed, a sensor for detecting the paper sheet existence in the paper sheet traveling route, a pair of contact members for holding the paper sheet, a driving source for moving one of the pair of contact members toward the other, and a control device for controlling driving of the driving source. Either of the pair of contact members is driven to convey the paper sheet. The control device controls the driving force to move either of the pair of contact members such that the pair of contact members are kept apart before the paper sheet is inserted and that the pair of contact members become closer to each other. | 2009-05-14 |
20090121416 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an image forming section, provided in an apparatus body, for forming an image on a sheet; a sheet transport path for transporting the sheet to the image forming section; a closing member, openably and closably mounted to the apparatus body, for exposing the sheet transport path in an opened state thereof; a first guide unit and a second guide unit, disposed along the sheet transport path, for guiding the sheet, the first and the second guide units being operable to shift between a proximate position where the first and the second guide units are close to each other, and an away position where the first and the second guide units are away from each other; and a position shifting mechanism for shifting the position of the second guide unit in association with a shifting operation of the first guide unit. | 2009-05-14 |
20090121417 | Apparatus and method for conveying a sheet - An apparatus and a method for successively conveying a series of sheets are disclosed. The apparatus has a first conveyer for conveying a sheet in a sheet conveying direction at a first speed and a second conveyer disposed spaced vertically away from the first conveyer for conveying the sheet in the same direction at a second speed. The second conveyer has a region overlapping with the first conveyer at least for a distance corresponding to a dimension of the sheet, e.g. the width of veneer sheet, as measured in the sheet conveying direction. A suction mechanism is disposed in said overlapping region for transferring by suction the sheet in the entirety of its dimension from the first conveyer to the second conveyer and holding by suction the sheet against the second conveyer. The sheet is further moved by the second conveyer, e.g. to a sheet stacking station. | 2009-05-14 |
20090121418 | Sheet feeding device and image forming apparatus - A sheet feeding device includes a sheet feeding member, a friction separation member, a retaining member, a downstream guiding member, and a biasing member. The downstream guiding member is arranged downstream of a sheet conveyance direction than the friction separation member such that its guide surface is inclined at a predetermined angle to a front surface of the friction separation member towards the sheet feeding member. A line joining an apex of a sheet guiding member arranged upstream of the sheet conveyance direction than the friction separation member and an apex of the downstream guiding unit is positioned towards the sheet feeding member than a contact portion of the sheet feeding member and the friction separation member. | 2009-05-14 |