19th week of 2021 patent applcation highlights part 62 |
Patent application number | Title | Published |
20210143104 | INTEGRATED CIRCUIT PRODUCT CUSTOMIZATIONS FOR IDENTIFICATION CODE VISIBILITY | 2021-05-13 |
20210143105 | SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHMENT ANGLE AND METHOD | 2021-05-13 |
20210143106 | PACKAGED DEVICE CARRIER FOR THERMAL ENHANCEMENT OR SIGNAL REDISTRIBUTION OF PACKAGED SEMICONDUCTOR DEVICES | 2021-05-13 |
20210143107 | SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE | 2021-05-13 |
20210143108 | Semiconductor Device Having a Thin Semiconductor Die | 2021-05-13 |
20210143109 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2021-05-13 |
20210143110 | PRE-CONDITIONED SELF-DESTRUCTING SUBSTRATE | 2021-05-13 |
20210143111 | PACKAGE SPARK GAP STRUCTURE | 2021-05-13 |
20210143112 | SEMICONDUCTOR DEVICE | 2021-05-13 |
20210143113 | Semiconductor Device and Method of Manufacturing the Semiconductor Device | 2021-05-13 |
20210143114 | SEMICONDUCTOR DEVICE WITH EDGE-PROTECTING SPACERS OVER BONDING PAD | 2021-05-13 |
20210143115 | BONDED ASSEMBLY CONTAINING A DIELECTRIC BONDING PATTERN DEFINITION LAYER AND METHODS OF FORMING THE SAME | 2021-05-13 |
20210143116 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | 2021-05-13 |
20210143117 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME | 2021-05-13 |
20210143118 | SEMICONDUCTOR PACKAGES HAVING VIAS | 2021-05-13 |
20210143119 | SEMICONDUCTOR PACKAGE STRUCTURES, SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME | 2021-05-13 |
20210143120 | Preform Diffusion Soldering | 2021-05-13 |
20210143121 | COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE | 2021-05-13 |
20210143122 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE | 2021-05-13 |
20210143123 | Batch Diffusion Soldering and Electronic Devices Produced by Batch Diffusion Soldering | 2021-05-13 |
20210143124 | LOGIC DRIVE BASED ON MULTICHIP PACKAGE USING INTERCONNECTION BRIDGE | 2021-05-13 |
20210143125 | Scalable Architecture for Reduced Cycles Across SoC | 2021-05-13 |
20210143126 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2021-05-13 |
20210143127 | POWER DELIVERY NETWORK FOR ACTIVE-ON-ACTIVE STACKED INTEGRATED CIRCUITS | 2021-05-13 |
20210143128 | STACK PACKAGES WITH INTERPOSER BRIDGE | 2021-05-13 |
20210143129 | SEMICONDUCTOR MODULE, DIMM MODULE, MANUFACTURING METHOD OF SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF DIMM MODULE | 2021-05-13 |
20210143130 | MULTI-DIE MODULE WITH CONTACTLESS COUPLER AND A COUPLING LOSS REDUCTION STRUCTURE | 2021-05-13 |
20210143131 | Device and Method for UBM/RDL Routing | 2021-05-13 |
20210143132 | SEMICONDUCTOR DEVICE | 2021-05-13 |
20210143133 | Light-Emitting Package Structure and Manufacturing Method Thereof | 2021-05-13 |
20210143134 | DRIVING SUBSTRATE, METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE | 2021-05-13 |
20210143135 | ENHANCED COLOR GAMUT FOR ELECTRONIC DISPLAYS | 2021-05-13 |
20210143136 | POWER CONVERTER | 2021-05-13 |
20210143137 | DISPLAY DEVICE AND METHOD OF FABRICATING THE DISPLAY DEVICE | 2021-05-13 |
20210143138 | SOLID STATE TRANSDUCERS WITH STATE DETECTION, AND ASSOCIATED SYSTEMS AND METHODS | 2021-05-13 |
20210143139 | IMAGE MODULE PACKAGE HAVING GLASS FILTER SECURED BY TRANSPARENT ADHESIVE | 2021-05-13 |
20210143140 | PIXEL, DISPLAY DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | 2021-05-13 |
20210143141 | CHIP POWER SUPPLY SYSTEM, CHIP, PCB, AND COMPUTER DEVICE | 2021-05-13 |
20210143142 | Integrated Assemblies Comprising Sense-Amplifier-Circuitry and Wordline-Driver-Circuitry Under Memory Cells of a Memory Array | 2021-05-13 |
20210143143 | Multi-Stack Package-on-Package Structures | 2021-05-13 |
20210143144 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR | 2021-05-13 |
20210143145 | ELECTROSTATIC DISCHARGE GUARD RING WITH SNAPBACK PROTECTION | 2021-05-13 |
20210143146 | APPARATUS FOR SUPPRESSING PARASITIC LEAKAGE FROM I/O-PINS TO SUBSTRATE IN FLOATING-RAIL ESD PROTECTION NETWORKS | 2021-05-13 |
20210143147 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME | 2021-05-13 |
20210143148 | SEMICONDUCTOR DEVICE | 2021-05-13 |
20210143149 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | 2021-05-13 |
20210143150 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-05-13 |
20210143151 | LATCH-UP IMMUNIZATION TECHNIQUES FOR INTEGRATED CIRCUITS | 2021-05-13 |
20210143152 | GATE-CUT ISOLATION STRUCTURE AND FABRICATION METHOD | 2021-05-13 |
20210143153 | FIN FIELD-EFFECT TRANSISTOR (FET) (FINFET) CIRCUITS EMPLOYING REPLACEMENT N-TYPE FET (NFET) SOURCE/DRAIN (S/D) TO AVOID OR PREVENT SHORT DEFECTS AND RELATED METHODS OF FABRICATION | 2021-05-13 |
20210143154 | SEMICONDUCTOR MEMORY DEVICES | 2021-05-13 |
20210143155 | SEMICONDUCTOR DEVICE WITH EPITAXIAL STRUCTURES AND METHOD FOR FORMING THE SAME | 2021-05-13 |
20210143156 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-05-13 |
20210143157 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2021-05-13 |
20210143158 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-05-13 |
20210143159 | STACKED VERTICAL TRANSISTOR MEMORY CELL WITH EPI CONNECTIONS | 2021-05-13 |
20210143160 | SEMICONDUCTOR DEVICES | 2021-05-13 |
20210143161 | A novel antifuse OTP structure with hybrid junctions | 2021-05-13 |
20210143162 | SEMICONDUCTOR MEMORY DEVICE INCLUDING CAPACITOR | 2021-05-13 |
20210143163 | Vertical 3D Stack NOR Device | 2021-05-13 |
20210143164 | Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells | 2021-05-13 |
20210143165 | Integrated Assemblies Having Anchoring Structures Proximate Stacked Memory Cells, and Methods of Forming Integrated Assemblies | 2021-05-13 |
20210143166 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ON-PITCH DRAIN SELECT LEVEL STRUCTURES AND METHODS OF MAKING THE SAME | 2021-05-13 |
20210143167 | Memory Arrays And Methods Used In Forming A Memory Array | 2021-05-13 |
20210143168 | SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING THE SAME | 2021-05-13 |
20210143169 | SEMICONDUCTOR DEVICES INCLUDING STAIRCASE STRUCTURES | 2021-05-13 |
20210143170 | MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2021-05-13 |
20210143171 | Integrated Assemblies and Methods of Forming Integrated Assemblies | 2021-05-13 |
20210143172 | SEMICONDUCTOR DEVICE INCLUDING VERTICAL MEMORY STRUCTURE | 2021-05-13 |
20210143173 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | 2021-05-13 |
20210143174 | INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES | 2021-05-13 |
20210143175 | ELECTRONIC DEVICE HAVING STACKED STRUCTURES AND METHOD FOR MANUFACTURING THE SAME | 2021-05-13 |
20210143176 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2021-05-13 |
20210143177 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | 2021-05-13 |
20210143178 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-05-13 |
20210143179 | NOVEL 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | 2021-05-13 |
20210143180 | NOVEL 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | 2021-05-13 |
20210143181 | SEMICONDUCTOR DEVICE | 2021-05-13 |
20210143182 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-05-13 |
20210143183 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND DISPLAY DEVICE | 2021-05-13 |
20210143184 | THIN-FILM TRANSISTOR ARRAY SUBSTRATE AND DISPLAY DEVICE | 2021-05-13 |
20210143185 | MANUFACTURING METHOD OF DISPLAY SUBSTRATE MOTHERBOARD, AND DISPLAY DEVICE | 2021-05-13 |
20210143186 | DISPLAY DEVICE | 2021-05-13 |
20210143187 | THIN FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | 2021-05-13 |
20210143188 | NEGATIVE TRANSCONDUCTANCE DEVICE AND MULTI-VALUED INVERTER LOGIC DEVICE USING THE SAME | 2021-05-13 |
20210143189 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | 2021-05-13 |
20210143190 | CONDENSING ASSEMBLY, VACUUM DRYING DEVICE, AND METHOD FOR MANUFACTURING A DISPLAY SUBSTRATE | 2021-05-13 |
20210143191 | IMAGE SENSOR | 2021-05-13 |
20210143192 | DISPLAY DEVICE | 2021-05-13 |
20210143193 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | 2021-05-13 |
20210143194 | IMAGE SENSOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-05-13 |
20210143195 | SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS | 2021-05-13 |
20210143197 | IMAGE SENSING DEVICE | 2021-05-13 |
20210143198 | PHOTOELECTRIC CONVERSION APPARATUS AND EQUIPMENT | 2021-05-13 |
20210143199 | IMAGE SENSOR FLIP CHIP PACKAGE | 2021-05-13 |
20210143200 | IMAGE SENSOR | 2021-05-13 |
20210143201 | Optical Component with Waveguide Based Filter | 2021-05-13 |
20210143202 | IMAGE SENSORS WITH LIGHT CHANNELING REFLECTIVE LAYERS THEREIN | 2021-05-13 |
20210143203 | IMAGING DEVICE AND ELECTRONIC DEVICE | 2021-05-13 |
20210143204 | IMAGE SENSOR AND ELECTRONIC APPARATUS INCLUDING THE SAME | 2021-05-13 |