| 18th week of 2010 patent applcation highlights part 34 |
| Patent application number | Title | Published |
|---|
| 20100110597 | DRIVE AMPLIFIER SYSTEM AND OVER-CURRENT DETECTION METHOD FOR THE SAME - A drive amplifier system includes a drive control device, a power supply, and at least one drive amplifier. The power supply includes a power control circuit, a rectifier, and a current sensor. The power control circuit includes an over-current detection circuit, a controller, and a state comparator. The drive amplifier includes a control circuit, a state memory, and an inverting circuit. When a actual current provided for the at least one drive amplifier by the power supply is more than a reference voltage, the over-current detection circuit outputs an over-current detection signal. | 2010-05-06 |
| 20100110598 | LINE COMMUTATION TYPE FAULT CURRENT LIMITER - A line commutation type fault current limiter which can reduce manufacturing and maintenance costs, carry out line commutation by operating a cutoff switch by fault current energy, respond rapidly to a fault, be immediately restored to an original state, and perform either an active or a passive operation. The line commutation type fault current limiter includes a coupled inductor having a primary side connected to a main circuit and a secondary side matched with the primary side, a Zener diode switch electrically connected to the secondary side of the coupled inductor, a line commutation switch connected to the Zener diode switch as well as the primary side of the coupled inductor to form a bypass path in parallel with the primary side of the coupled inductor and to cut off the main circuit, when the Zener diode switch is turned on, and a current limiting unit electrically connected in parallel with the line commutation switch to limit a current flowing into the main circuit. | 2010-05-06 |
| 20100110599 | OVERCURRENT PROTECTION APPARATUS - An overcurrent protection apparatus which, when a layer short or a dead short occurs in a load circuit, interrupts the circuit in accordance with respective situations, whereby the load circuit is protected is provided. The apparatus includes a first overcurrent detecting section for detecting a counter electromotive force generated in a power supply wiring, and a second overcurrent detecting section, disposed in each of the plural load circuits, for detecting that a load current ID becomes an overcurrent. The apparatus includes a delaying section for outputting a delay signal at a first delay time when an overcurrent is detected by the second overcurrent detecting section, and for outputting the delay signal at a second delay time which is shorter than the first delay time when an overcurrent is detected by both of the first overcurrent detecting section and the second overcurrent detecting section. According to the configuration, in the case of the occurrence of a layer short, the load circuit can be interrupted at the first delay time, and, in the case of the occurrence of a dead short, the load circuit can be interrupted at the second delay time. | 2010-05-06 |
| 20100110600 | SWITCHING CONTROLLER AND SWITCHING CONTROL SYSTEM FOR CIRCUIT BREAKER - The MPU for switching control arithmetic operation | 2010-05-06 |
| 20100110601 | WIRELESS COMMUNICATION DEVICE - A wireless communication device includes a PCB, a grounded electrostatic protection element and an antenna. The PCB includes a ground and an antenna clearance portion. The ground portion includes a ground layer. The antenna clearance portion overlaps the antenna and includes a plurality of second key contacts, a plurality of ground contacts and a plurality of microstrips. The second key contacts are placed on a top surface of the PCB. The ground contacts and the microstrips are placed on a bottom surface of the PCB and corresponding to the second key contacts. The plurality of microstrips connect the plurality of ground contacts to the ground layer. The electrostatic protection element connects the second key contacts to protect them from electrostatic interference. | 2010-05-06 |
| 20100110602 | ELECTRIC FIELD CONTROL METHODS AND APPARATUSES FOR CORONA WIND FANS - The present invention is a method of controlling the electric field in a corona wind fan to eliminate sparks and thereby increase the operating window and mechanical output of the device. A corona wind device moves a gas using ions that are generated by two electrodes. The electric field in a corona wind system is highly non-uniform. An intense field, of limited size, is needed to generate ions. It is desirable for the remainder of the system to be at as low a field as possible so as to prevent sparks from forming between electrodes. A contoured collector electrode creates this desirable electric field over most of a corona wind device. However, the electric field at the edges and ends of a contoured collector remain as weak points in the device. If not addressed, sparks will form prematurely at these points limiting the overall performance. Several methods to control the field at these points were developed. | 2010-05-06 |
| 20100110603 | WAFER GROUNDING METHOD FOR ELECTROSTATIC CLAMPS - An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece. | 2010-05-06 |
| 20100110604 | ELECTROSTATIC CHUCK GROUND PUNCH - An electrostatic chuck and method for clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. A punch is operably coupled to the clamping plate and an electrical ground, wherein the punch comprises a trigger mechanism and a punch tip. The punch tip translates between extended and retracted positions, wherein a point of the punch tip is proud of the clamping surface when the punch tip is in the extended position. The punch tip is configured to translate toward the clamping surface upon clamping the workpiece to the clamping plate. Upon reaching the retracted position, the trigger mechanism imparts an impact force to the punch tip, forcing the punch tip into the workpiece and providing an electrical ground connection to the workpiece. | 2010-05-06 |
| 20100110605 | ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA REACTOR - Provided is an electrostatic chuck assembly for a plasma reactor. The assembly includes an electrostatic chuck, an electrostatic chuck cover ring, and a cathode assembly cover ring. The electrostatic chuck includes a body part and a protrusion part. The body part has a disk shape of a first diameter. The protrusion part is formed integrally with the body part and protrudes from the body part, and has a disk shape of a second diameter less than the first diameter. The electrostatic chuck cover ring is disposed to surround an outer circumference of the protrusion part. The cathode assembly cover ring is disposed at an upper part of the cathode assembly to surround an outer circumference of the electrostatic chuck cover ring and an outer circumference of the body part. | 2010-05-06 |
| 20100110606 | TUNABLE CAPACITOR USING ELECTROWETTING PHENOMENON - A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range. | 2010-05-06 |
| 20100110607 | Vertical capacitors and method of fabricating same - A fabrication method which forms vertical capacitors in a substrate. The method is preferably an all-dry process, comprising forming a through-substrate via hole in the substrate, depositing a first conductive material layer into the via hole using atomic layer deposition (ALD) such that it is electrically continuous across the length of the via hole, depositing an electrically insulating, continuous and substantially conformal isolation material layer over the first conductive layer using ALD, and depositing a second conductive material layer over the isolation material layer using ALD such that it is electrically continuous across the length of the via hole. The layers are arranged such that they form a vertical capacitor. The present method may be successfully practiced at temperatures of less than 200° C., thereby avoiding damage to circuitry residing on the substrate that might otherwise occur. | 2010-05-06 |
| 20100110608 | Core-shell structured dielectric particles for use in multilayer ceramic capacitors - This invention provides a method to make core-shell structured dielectric particles which consist of a conductive core and at least one layer of insulating dielectric shell for the application of multilayer ceramic capacitors (MLCC). The use of said core-shell instead of conventionally solid dielectric particles as the capacitor's active layers simplifies the MLCC manufacturing processes and effectively improves the MLCC properties. In particular, the use of core-shell particles with a thin shell of high permittivity dielectric material improves the capacitance volumetric efficiency, and the use of core-shell particles with a thick shell of dielectric will improve capacitor device's energy storage capacity as the results of improved electrical and mechanical strength. | 2010-05-06 |
| 20100110609 | HIGHLY DIELECTRIC FILM HAVING HIGH WITHSTANDING VOLTAGE - The present invention relates to a highly dielectric film formed by using (A) a fluorine-containing resin comprising vinylidene fluoride unit and tetrafluoroethylene unit in a total amount of not less than 95% by mole, and provides a film for a film capacitor which has high dielectric property and high withstanding voltage and can be made thin. | 2010-05-06 |
| 20100110610 | ELECTRONIC DEVICE - An electronic device including electronics arranged in an electronics compartment and having electronic and/or electromechanical components. The device automatically detects and/or monitors wear of its electronic and/or electromechanical components and includes an apparatus for detecting and/or monitoring wear of the electronic and/or electromechanical components. Included is at least one element arranged in the electronics compartment. This element is independent of the electronics and has at least one physical property, which changes irreversibly as a function of wear of the element. The apparatus further includes a circuit for measuring the physical property, and an evaluating unit, which, based on the measured physical property, detects and/or monitors wear of the element and makes available a wear-dependent output signal. | 2010-05-06 |
| 20100110611 | Highly Porous Activated Carbon With Controlled Oxygen Content - Nanoporous activated carbon material having a high specific capacitance in EDLCs and controlled oxygen content, and methods for making such activated carbon material. Reduction of oxygen content is achieved by (a) curing a carbon precursor/additive mixture in an inert or reducing environment, and/or (b) refining (heating) activated carbon material after synthesis in an inert or reducing environment. The inert or reducing environment used for curing or refining is preferably substantially free of oxygen. | 2010-05-06 |
| 20100110612 | Electrode for energy storage device - An energy storage device electrode product is provided. The product comprises: at least one current collector and at least one electrode film disposed adjacent to the at least one current collector. The at least one current collector comprises a plurality of voids extending through a thickness of the current collector, wherein the plurality of voids allow electrolyte to flow through the thickness of the current collector. The plurality of voids extending through the current collector is formed without reducing a surface area of a conductive material of the current collector disposed adjacent to the electrode by more than about fifty percent. A method of producing an electrode product and a double layer capacitor product are also disclosed. | 2010-05-06 |
| 20100110613 | Ultracapacitor electrode with controlled iron content - Particles of active electrode material are made by blending or mixing a mixture of activated carbon, optional conductive carbon, and binder. In selected implementations, iron level in the activated carbon is relatively low, a small amount of conductive carbon with low impurity levels and high conductivity is used, and the binder is inert. For one example, iron content of the activated carbon and the resultant mixture is below 20 ppm. The electrode material may be attached to a current collector to obtain an electrode for use in various electrical devices, including a double layer capacitor. The electrode decreases current leakage of the capacitor. | 2010-05-06 |
| 20100110614 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor includes: an anode made of a valve metal or an alloy of a valve metal; a dielectric layer formed on the surface of the anode; an electrolyte layer formed on the dielectric layer; a cathode layer formed on the electrolyte layer; and a resin outer package covering a capacitor element composed of the anode, the dielectric layer, the electrolyte layer and the cathode layer. The electrolyte layer is composed of a first electrolyte region provided on the dielectric layer, a second electrolyte region provided on the first electrolyte region and in contact with the cathode layer, and a third electrolyte region provided, in a portion of the electrolyte layer on which the cathode layer is not provided, in contact with the second electrolyte region or the first electrolyte region. | 2010-05-06 |
| 20100110615 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING SAME - A solid electrolytic capacitor according to the present invention comprises an anode body, an anode lead in contact with an outer surface of the anode body, a dielectric layer formed on a surface of the anode lead, and a cathode layer formed on a surface of the dielectric layer. The anode lead is provided with a plurality of openings passing through the anode lead. Another solid electrolytic capacitor according to the present invention comprises an anode body, an anode lead in contact with an outer surface of the anode body, a dielectric layer formed on a surface of the anode lead, and a cathode layer formed on a surface of the dielectric layer. The anode lead is provided with a cutout on an outer circumference edge of the anode lead. | 2010-05-06 |
| 20100110616 | Disconnect switch with overcurrent device and enclosure for reduced hazard - A disconnect switch and an overcurrent protection device are combined in a single enclosure which has two isolated compartments, with independent access to each compartment. The enclosure is adapted for mounting on a vertical surface (suitable for mounting on a wall). The disconnect switch is contained within a first compartment, and the overcurrent protection device is contained within a second compartment. Interconnecting conductors connect the disconnect switch to the overcurrent protection device through an enclosure wall which separates the two compartments. After installation in an electric power system, when the disconnect switch is in the OFF position, shock hazards and arc-flash hazards are present only within the compartment containing the disconnect switch. The compartment containing the overcurrent protection device is completely de-energized, and can therefore be safely accessed for maintenance, inspection, and testing. | 2010-05-06 |
| 20100110617 | EMBEDDED ANTENNA APPARATUS FOR UTILITY METERING APPLICATIONS - An embedded antenna for facilitating wireless transmission of utility meter data is disclosed, where in one embodiment an RF antenna is a part of the faceplate of the utility meter. In another embodiment the utility meter faceplate is a single-layer or a multi-layer printed circuit board (PCB) with the RF antenna printed on any desired layer. Such faceplates may be labeled to be viewable from outside of the meter housing and/or have openings to accommodate visual access to an output display of the meter consumption information. | 2010-05-06 |
| 20100110618 | Housing Arrangement For Fault Determination Apparatus And Method For Installing The Same - A fault determination apparatus includes a housing. The housing includes a circuit board disposed there within. The housing is shaped and dimensioned for non-intrusive placement within an existing electrical system. The circuit board is configured to provide one of a transmitter or a receiver within a fault determination system. A first set of connectors is disposed at a first side of the housing and a second set of connectors disposed at the second end of the housing. The first set of connectors and the second set of connectors are directly connected through the wires provided inside the apparatus while at least one wires under fault monitoring are tapped to the circuit board and configured so as to be electrically coupled to the existing electrical system. | 2010-05-06 |
| 20100110619 | PORTABLE ELECTRONIC DEVICE - A portable electronic device includes a housing, a battery cover detachably assembled to the housing, a power module, and a switch mounted in the housing. The switch is turned on by a portion of the battery cover pressing the switch when the battery cover is assembled to the housing. | 2010-05-06 |
| 20100110620 | CONTROL DEVICE PARTICULARLY REMOTE CONTROL FOR INDUSTRIAL APPLIANCES - Disclosed is a control device, particularly a remote control for industrial appliances, comprising a housing for accommodating the control electronics and at least one control element. The housing ( | 2010-05-06 |
| 20100110621 | RACK WITH VERTICAL MOUNTING PROVIDING ROOM FOR RACK PDU - An electronic component equipment rack utilizes vertically extending adjustable rails to support electronic components therein. The vertically extending rails are configured to allow a power distribution unit to be attached thereto. The dimensions of the vertically extending rails allow the power distribution unit to be disposed between the attached vertically extending rail and an associated adjacent opposed side of the rack. The vertically extending rails can be Z-shaped with front and rear flanges and a side panel extending therebetween. The power distribution unit can be attached to the rear flange and be adjacent the rear flange and the side panel. The power distribution unit can be flush with the front flange. The rack and the opening between opposing vertically extending rails can conform to the EIA3 10-D standard. | 2010-05-06 |
| 20100110622 | Product Case and an Electronic Device Using the Same - The present invention discloses a product case for housing an electronic device, wherein the product case comprising a case body; a decoration layer disposed on the case body; a decorating panel; wherein the surface of the decoration layer is configured with a chamber, and the decorating panel is configured to be inlayed inside the chamber. According to the present invention, the product case is configured with the decoration layer, and the decorating panel is configured to be inlayed inside the chamber. Therefore, the design of the electronic device is improved without influencing the decoration layer. Further, the design of the electronic device case may be customized in accordance with the requirement of the consumer. | 2010-05-06 |
| 20100110623 | DRIVER CIRCUIT AND DISPLAY DEVICE - The driver circuit includes an inverter circuit having a first thin film transistor including a first oxide semiconductor film and a second transistor including a second oxide semiconductor film. The first thin film transistor and the second thin film transistor are enhancement transistors, in which a silicon oxide film including an OH group is provided on and in contact with the first oxide semiconductor film and the second oxide semiconductor film, and a silicon nitride film is provided on and in contact with the silicon oxide film. | 2010-05-06 |
| 20100110624 | DISPLAY DEVICE AND METHOD FOR ASSEMBLING THE SAME - A display device includes a casing, a display panel assembled in the casing, and a front panel assembled at the casing to cover edges of the display panel. The front panel includes two first boards and two second boards. Each of the first boards includes a main portion and two auxiliary portions located at two sides of the main portion. The two second boards are stacked on the auxiliary portions. A method for assembling a display device is also disclosed. | 2010-05-06 |
| 20100110625 | FOLDABLE MOBILE COMPUTING DEVICE AND OPERATING METHOD OF THE SAME - A foldable mobile computing device and the operating method are disclosed, wherein the foldable mobile computing device comprises a first main-body, a second main-body and a pivotal axis. The first main-body has a first surface with a display unit mounted thereon and a second surface; the second main-body has a fourth surface and a third surface having a touch interface set thereon functioning as a keyboard when the foldable mobile computing device is operated with a keyboard input paradigm; and the pivot axis couples the first main-body and the second main-body. When the second surface and the fourth surface are clapped together, the foldable mobile computing device is operated with a non-keyboard input paradigm; and when the first surface and the third surface are driven to form an angle values in a certain range, the non-keyboard input paradigm is shifted to the keyboard input paradigm. | 2010-05-06 |
| 20100110626 | System and Method for High Density Information Handling System Enclosure - An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers. | 2010-05-06 |
| 20100110627 | THERMAL MODULE CAPABLE OF DISSIPATING HEAT GENERATED BY A PLURALITY OF HEAT SOURCES AND RELATED COMPUTER SYSTEM - A thermal module includes a base including a first plate having a first side for connecting with a first heat source so as to conduct heat generated by the first heat source, and a second plate connected to the first plate. A height difference is formed between the first plate and the second plate. The second plate includes a second side opposite to the first side of the first plate for connecting with the second heat source so as to conduct heat generated by the second heat source. The thermal module includes a heat-dissipating device connected to the base for dissipating the heat transmitted to the first plate and for dissipating the heat transmitted to the second plate. A height difference is formed between the first heat source and the second heat source, and the base is positioned between the first heat source and the second heat source. | 2010-05-06 |
| 20100110628 | Apparatus and Method for Enhancing the Maintainability and Cooling of Computer Components on Trays in a Cabinet - A computer system includes a cabinet, a first port mounted on a rear panel of the cabinet, and a tray mounted in the cabinet and having computer components mounted thereon. A front panel of the tray faces outward from a front side of the cabinet opposite the rear panel. The computer system further includes a second port mounted on the front panel of the tray, and a first cable that electrically couples the first port and the second port. The first cable is routed within the cabinet and protrudes from the front side of the cabinet. The first port also remains coupled to the second port as the tray slides outwards from the front side of the cabinet so that the computer components substantially protrude from the front side of the cabinet. The first port and the second port are for at least one of electrical power and network connectivity. | 2010-05-06 |
| 20100110629 | Laptop cover - There is disclosed a snuggly fitting laptop computer cover that is exceptionally easy to fit over a laptop computer, that provides cable plug access and adequate cooling when the computer is in use. | 2010-05-06 |
| 20100110630 | SYNTHETIC JET EMBEDDED HEAT SINK - A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink. | 2010-05-06 |
| 20100110631 | SPLASH RESISTANT POWER ADAPTER - An external AC power adapter defines a power conversion chamber that retains power conversion circuitry operable to convert an input power to an output power. The power adapter further include an intake chamber and an outlet chamber, both having an aperture that places the respective chamber in fluid communication with the power conversion chamber. Each chamber may have at least one vent to the ambient environment such that an air mover is operable to circulate ambient air through the power conversion chamber. Each chamber may include a guard that deters liquid that has entered the respective chamber from flowing into the associated aperture. | 2010-05-06 |
| 20100110632 | Network switch cooling system - A high-performance network switch chassis has multiple network ports and air openings on the front end of the chassis, and multiple fan modules mounted on the back end of the chassis. The fan modules are hot-swap replaceable so that replacement of one of the fan modules does not require interruption of network switch operation. Air-blockers associated with each fan module prevent recirculation of air when fan modules are removed. Different types of fan modules may be used to provide either front-to-rear or rear-to-front airflow through the chassis. A fan speed controller determines fan speed based on temperature using one of two profiles. The two profiles correspond to the two different airflow directions. | 2010-05-06 |
| 20100110633 | INTEGRATED ACTIVE COOLED CABINET/RACK FOR ELECTRONIC EQUIPMENTS - An integrated active cooled cabinet/rack for electronic equipments. An aspect of the present invention is to provide a control unit for the cabinet, that enables individual equipment monitoring and control and thereby ensure that the equipment housed in the cabinet and generating the highest level of heat is cooled down to an acceptable preset temperature. | 2010-05-06 |
| 20100110634 | METHOD AND APPARATUS FOR AN ENVIRONMENTALLY-PROTECTED ELECTRONIC EQUIPMENT ENCLOSURE - A method and apparatus for an electronic equipment enclosure that provides directed airflow only to those volumes within the enclosure that require the airflow. The electronic equipment enclosure further provides protection from contaminants such as falling dirt, rain, sleet, snow, windblown dust, splashing water, hose-directed water, and ice. A pedestal may be coupled to the electronic equipment enclosure that facilitates movement of the electronic equipment enclosure via a pallet jack, forklift, front loader, or similar jacking device. A sidecar may also be coupled to one or more sides of the electronic equipment enclosure to facilitate vertically mounted equipment within the sidecar. | 2010-05-06 |
| 20100110635 | THERMAL MANAGEMENT OF VERY SMALL FORM FACTOR PROJECTORS WITH SYNTHETIC JETS - A thermal management device ( | 2010-05-06 |
| 20100110636 | Insulating and Dissipating Heat Structure of an Electronic Part - An insulating and dissipating heat structure of an electronic part includes an electronic component, a heat sink attached to one surface of the electronic component, a housing having a first notch for coupling with the heat sink, and fluid filled in the housing for cooling. The housing is made of an insulating material. The heat sink, the fluid, and the housing of the present invention are able to lower the temperate and dissipate heat. Particularly, the housing has the character of insulation to meet the safety requirements of high power electronic parts, without concerning about electric conduction and leakage. | 2010-05-06 |
| 20100110637 | HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES - Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interactive SiC surface layer on diamond particles. The interactive surface converted SiC coated diamond particles are then disposed into a mold and between the particles and permitted to rapidly solidify under pressure. The surface conversion interactive SiC coating on the diamond particles achieves minimal interface thermal resistance with the metal matrix which translates into good mechanical strength and stiffness of the composites and facilitates near theoretical thermal conductivity levels to be attained in the composite. Secondary working of the diamond metal composite can be performed for producing thin sheet product. | 2010-05-06 |
| 20100110638 | SEMICONDUCTOR DEVICE - A semiconductor module mounted on a vehicle is disclosed. The semiconductor module includes a semiconductor element, a forced-cooling type cooler, and a heat mass. Heat generated in the semiconductor element is conducted to the cooler. The heat mass is joined onto the semiconductor element, so as to be thermally coupled to the semiconductor element. The heat mass is formed such that the thermal resistance of a part of the heat mass that corresponds to a high temperature part of the semiconductor element in a heat generating state is lower than the thermal resistance of a part of the heat mass that corresponds to a lower temperature part of the semiconductor element. | 2010-05-06 |
| 20100110639 | TERMINAL PLATE CIRCUIT - In a terminal plate circuit in which the bottom surface of the diode is attached to the surface of the terminal plate with solder so as to dissipate the heat of the diode, heat transfer from the diode to the terminal plate is facilitated by removing the air bubbles in the solder during the soldering. A terminal plate circuit configured in such a manner that a metal part of a bottom surface of a diode of surface mounting type is soldered onto a surface of a terminal plate that is larger than the metal part, characterized in that streaks consisting of a plurality of lines that do not intersect with each other are formed on the surface of the terminal plate onto which the diode is to be soldered, whereby air bubbles generated within the solder during the soldering are let to escape from a lower surface of the diode to outside through the streaks. This terminal plate circuit is suitable for the use in a terminal box for solar cell panel. | 2010-05-06 |
| 20100110640 | Thermally Conductive Covers For Electric Circuit Assemblies - A method of producing a thermally conductive cover for an electric circuit assembly having a plurality of heat dissipating components is disclosed. The thermally conductive cover including a top surface, a bottom surface, and at least one rib extending downwardly from the bottom surface. The method includes selecting a plurality of dimensions for the thermally conductive cover such that the bottom surface will be spaced above and extend over top sides of the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The at least one rib will extend over and be spaced from the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The method further includes producing the thermally conductive cover with the selected dimensions. Thermally conductive covers are also disclosed. | 2010-05-06 |
| 20100110641 | POWER SUPPLY APPARATUS - A power supply apparatus includes a printed circuit board having the longitudinal direction and including first and second regions where AC and DC circuit components are mounted respectively. A first heat dissipation plate and a second heat dissipation plate provided to stand respectively in the first and second regions each include, as seen in a plan view, a linear first straight portion and two second straight portions extending respectively from the two ends of the first straight portion in opposite directions respectively and in the longitudinal direction. Respective first straight portions of the first and second heat dissipation plates are opposite to each other, and one of the second straight portions of the first heat dissipation plate and one of the second straight portions of the second heat dissipation plate are partially opposite to each other. | 2010-05-06 |
| 20100110642 | MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN - A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts. | 2010-05-06 |
| 20100110643 | FLASH DRIVE AND HOUSING ASSEMBLY THEREOF - A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position. | 2010-05-06 |
| 20100110644 | ELECTRONIC COMPONENT - An electronic component for an integrated mechatronic system has at least two housing parts with at least one housing base, a housing cover, and an electrical connection between the components disposed in the interior of the housing and components located outside the housing. The electrical connection is fixed on the housing base. The housing cover is glued directly to the electrical connection and/or the housing base and, in this manner, enables lasting hermetically sealed protection for the sensitive electronic components. | 2010-05-06 |
| 20100110645 | Telecommuncations chassis having mezzanine card slots - Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane. | 2010-05-06 |
| 20100110646 | ELECTRONIC APPARATUS - An electronic apparatus, which accommodates a chip card, includes a casing, a limit element and a carrier. The limit element is connected to the casing and has a protruding part. The carrier is slidingly disposed on the casing and has at least a contact area disposed on a side of the carrier. The limit element is located at a first position as the protruding part contacts the contact area, and the limit element is located at a second position as the protruding part is away from the contact area. The protruding part moves between the first position and the second position. | 2010-05-06 |
| 20100110647 | Molded Memory Card With Write Protection Switch Assembly - A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. The molded plastic casing defines a pre-molded switch slot that facilitates an insert-in switch assembly process for mounting a write protect switch. The write protect switch includes a movable switch button engaged in the switch slot, and a switch cap secured over the switch slot. | 2010-05-06 |
| 20100110648 | SURFACE CONTACT CARD RETENTION ASSEMBLY - A retention assembly for securing a surface contact card in a portable electronic device includes a main body defining a receiving groove in the main body, and a locking member slidably positioned on the main body adjacent to the receiving groove. The locking member is slidable from a first position at a side of the receiving groove to a second position on a top of the receiving groove, and is latched at the second position, thereby pressing opposite ends of the surface contact card. | 2010-05-06 |
| 20100110649 | Suspension board with circuit - A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device. | 2010-05-06 |
| 20100110650 | Soldering Strategies for Printed Circuit Board Assemblies - Disclosed herein is a method for forming solder joints including providing a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces. The printed circuit board supports on the first outer surface at least one electronic component having a plurality of leads, and further includes a plurality of through-hole clusters. Each through-hole cluster is associated with a single lead and includes a central hole portion surrounded by a plurality of other hole portions. A plurality of solder joints is formed by subsequently moving the printed circuit board over a wave soldering tank filled with solder. Each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces. Each solder joint is formed by solder which is wicked up by the through-hole cluster to extend from the second surface to the first surface. | 2010-05-06 |
| 20100110651 | Integrated Circuit Coating For Improved Thermal Isolation - During manufacture of an electronic device, an aerogel coating is applied to a first side of an IC substrate of a first IC. A bonding procedure is initiated, during which IC interconnects are either placed on the coated side of the substrate or on the opposite side of the substrate. The first IC is connected on a carrier to a second IC with the coated side of the first IC facing the second IC to reduce heat transmission to the second IC during operation of the first IC. The aerogel coating reduces thermal stress to the circuit board and surrounding components, reduces the risk of overheating of critical circuit components, provides chemical and mechanical insulation from contamination during subsequent wafer handling operations, and provides a thermal isolator between IC regions of dissimilar power dissipation, which isolator facilitates efficient thermal extraction from localized hotspots. | 2010-05-06 |
| 20100110652 | ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES - The anisotropically conductive adhesive composition according to the present invention is an anisotropically conductive adhesive composition to connect a first circuit member where a first circuit electrode is formed on the principal surface of a first substrate and a second circuit member where a second circuit electrode is formed on the principal surface of a second substrate with the first circuit electrode and the second circuit electrode placed opposite, wherein the anisotropically conductive adhesive composition comprises an adhesive and a coated particle where at least part of the surface of a conductive particle is coated with an insulating material containing a polymer electrolyte and an inorganic oxide fine particle. | 2010-05-06 |
| 20100110653 | PORTABLE ELECTRIC DEVICE - A portable electric device such as a mobile phone is disclosed. The portable electric device comprises a first chassis and a second chassis, and the first chassis and the second chassis are foldably coupled. The first chassis comprises a case member that comprises a coupling recess, a first recess and a second recess. The coupling recess and the first recess face a same side of the case member. The second recess faces an opposite side of the case member to the coupling recess and the first recess. The second recess is located at a rear side of the coupling recess. The first recess and the second recess accommodate a first electronic component and a second electronic component, respectively. | 2010-05-06 |
| 20100110654 | INNER-CONNECTING STRUCTURE OF LEAD FRAME AND ITS CONNECTING METHOD - An inner-connecting structure of the lead frame is disclosed in the present invention, which includes a plurality of leads, an insulation film arranged on a portion of a first surface of those leads, a plurality of holes formed on the insulation film to expose a portion of the first surface of a portion of those leads, and a conductive element selectively connecting the exposed portion of those leads electrically. Besides, an inner-connecting method of the lead frame is also disclosed herein. The insulation film is utilized to separate the conductive element from the lead frame so that the lead can be easily interconnected with each other. | 2010-05-06 |
| 20100110655 | CARD CASE - The present invention provides a card case that can prevent skimming, when a noncontact IC card is sent to a card user from an issuer of it, or carried by the card user. Since metal films, which shield from an electromagnetic wave, are provided in a card main body, it makes prevention of skimming possible, when the noncontact IC card is sent to the card user from the card issuer. The card user peels off a peeling the section by taking off the seal of openings from an adhesive section, and then insert the card main body having the exposed the adhesive section into a card storing section formed in his wallet or commuter pass holder. As a result, skimming of the IC card can be prevented even when it is carried by the card user in his wallet or the commuter pass holder. | 2010-05-06 |
| 20100110656 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate. | 2010-05-06 |
| 20100110657 | Instrument Panel And Gauge With Ultraviolet Indicia - An instrument panel including nanophosphor indicia which is not visible under normal lighting conditions and low light conditions, but emits visible light in response to UV light. | 2010-05-06 |
| 20100110658 | SEMI-DIRECT SOLID STATE LIGHTING FIXTURE AND DISTRIBUTION - In one embodiment of the present invention, a suspendable semi-direct lighting fixture is provided for illuminating a work surface. The suspendable semi-direct lighting fixture includes a downlighting fixture portion, and a solid state uplighting fixture portion disposable above the downlighting fixture portion. The downlighting fixture portion and the solid state uplighting fixture portion are suspendable below a ceiling, and the solid state uplighting fixture portion is operable to emit light substantially in a 90-135 degree zone and substantially not in a 135-180 degree zone. An auxiliary solid state uplighting fixture for use with a downlighting fixture is also disclosed. Methods employing such lighting fixtures are further disclosed. | 2010-05-06 |
| 20100110659 | LED LIGHTING UNIT AND METHOD FOR MANUFACTURING THE SAME - An LED lighting unit and a method for manufacturing the same can include a first cavity and a second cavity which has a depth that is different from that of the first cavity. The first and the second cavities can include an LED chip and an encapsulating resin including a phosphor. Color temperatures of light emitted from these cavities can be controlled by changing thicknesses of the encapsulating resin based on the depth of each of these cavities so as to be located on a substantially black body, and the variability of the optical characteristics can be reduced due to the simple structure. Thus, the LED lighting unit can emit light having a favorable color temperature that is close to a natural light using light that is emitted from these cavities. The manufacturing method can include forming the thickness of the encapsulating resin with accuracy, and therefore can provide a suitable LED lighting unit for various lighting systems. | 2010-05-06 |
| 20100110660 | LIGHT EMITTING DIODE EMERGENCY LIGHTING MODULE - The present invention uses “Chip-on-Board” (COB) metal core printed circuit board (PCB) technology in conjunction with high efficiency compact imaging and non-imaging optics to provide an emergency light that is more compact, offers higher performance with respect to luminance levels (higher brightness), longer life, and lower cost relative to systems incorporating pre-packaged LED devices. The thermal impedance between the LED junction and the heat sink is significantly reduced for COB technology by placing the LED die directly on a metal core (or other high thermal conductivity material substrate), thereby increasing temperature dependant life and thermally dependant output power. Additionally, because there is no encapsulant or domed optic over the LED die initially, it is possible to get a much more compact and efficient substantially Etendue (area, solid angle, index squared product) preserving collection optic directly over the die. Cost is significantly reduced for COB configurations due to elimination of the expense of additional components attached to the LED die for the case of pre-packaged LED devices. | 2010-05-06 |
| 20100110661 | LIGHT UNIT AND DISPLAY APPARATUS HAVING THE SAME - Disclosed are a light unit and a display apparatus having the same. The light unit comprises a bottom cover; a light source module comprising light emitting diodes on and/or inserted under the bottom cover; a dispersion member that disperses light which is generated from the light emitting diode, on the light source module; and an optical plate on the dispersion member. | 2010-05-06 |
| 20100110662 | OPTICAL MEMBER AND DISPLAY DEVICE HAVING THE SAME - An optical member includes; an incident surface on which light is incident, an exit surface which is disposed substantially opposite the incident surface and from which the light exits, a prism pattern disposed on the exit surface, and a diffusion pattern which is aligned with the prism pattern and is disposed in a total internal reflection region in which the light incident on the incident surface is totally internally reflected by the prism pattern and output through the incident surface. | 2010-05-06 |
| 20100110663 | LIGHTING DEVICE FOR DISPLAY DEVICE AND DISPLAY DEVICE - A lighting device for a display device includes a light source and a chassis arranged to cover the light source. The chassis includes a base member made of resin material, and further includes a metallic skeleton frame provided on the base member. Thus, the lighting device for a display device having a simple construction capable of preventing or suppressing beat tones generated on a lamp housing member is provided without increasing the thickness of the device. | 2010-05-06 |
| 20100110664 | LIGHTING DEVICE FOR DISPLAY DEVICE AND DISPLAY DEVICE - A lighting device | 2010-05-06 |
| 20100110665 | LIGHTING DEVICE FOR DISPLAY DEVICE AND DISPLAY DEVICE - A lighting device for a display device includes a light source and a chassis arranged to cover the light source. The chassis includes an opening section located directly below a portion of or all of the light source. Thus, the lighting device for a display device, having a simple construction capable of preventing or suppressing beat tones generated on a lamp housing member, is provided without increasing the thickness of the device. | 2010-05-06 |
| 20100110666 | LAMP SOCKET ASSEMBLY, BACKLIGHT ASSEMBLY, DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE DISPLAY DEVICE - A lamp socket assembly includes a base plate, and lamp sockets, each lamp socket including a connection terminal, each connection terminal connected to a terminal of a lamp, and one or more first fixing portions, each of which is integrated with the connection terminal, penetrates the base plate, has at least one bent end, and contacts opposing surfaces of the base plate. | 2010-05-06 |
| 20100110667 | ILLUMINATING DEVICE, DISPLAY DEVICE HAVING IT, AND TELEVISION RECEIVER - A thin, lightweight illuminating device, in the form of a backlight unit, is capable of securing even brightness and improving light use efficiency. The backlight unit includes a light source including a plurality of light emitting diodes mounted on a mounting surface of a board, a diffusion plate which has a light introduction surface that faces the mounting surface of the board at a predetermined distance therefrom and diffuses the light emitted from the plurality of light emitting diodes, and a reflection sheet that is adhered to the mounting surface of the board. A light emission direction of the plurality of light emitting diodes is parallel or substantially parallel to the light introduction surface of the diffusion plate. | 2010-05-06 |
| 20100110668 | Hideaway Christmas Lights Party Lights Tuck Lights Train lights - Improvements in remote control hideaway holiday/party lights/messages lights with a casing that is permanently fixed to a home or business is disclosed. The lights are on a string and roll up or down below over eve, fascia or rain gutters. After the holiday or event simply pressing a remote control will retract the lighting into a concealed enclosure till the next party or holiday season comes around. The remote has a distinctive key code, which makes the lights operate for each owner. The concealed enclosure consist of door(s), depends on the number of lighting styles, power supply, drive motor, a string light(s) on a spool inside and controls. The lights come in many colors and types and may include shapes. Each enclosure can be self-contained with a solar charger, light sensor, or timer, and a battery that allows each unit to operate autonomously. | 2010-05-06 |
| 20100110669 | Light retainer assembly - Light emitting devices having unitary and simplified construction for securing a lighting assembly within the device, and ease of replacement of the light emitting element of the lighting assembly. The lighting assembly is mounted within the light emitting device though use of a fastener. | 2010-05-06 |
| 20100110670 | Magnetically actuated flashlight - A magnetically actuable flashlight includes a holder member and a light containing member. The holder member includes a first magnetic members, and the light containing member is capable of being selectively magnetically coupled to the holder member. The light containing member includes a housing, and a switch member contained within the housing. The switch member is movable between a switch on and a switch off position. A second magnetic members is coupled to the switch member. The second magnetic member is magnetically attractive to the first magnetic member for selectively magnetically coupling the holder member to the light containing member. A power source is coupled to the switch member and at least one light is selectively electrically coupled to the power source through the switch member. The magnetic coupling of the holder member and the light receiving member causes the second magnetic member to move the switch to the switch off position to electrically uncouple the at least one light and power source. | 2010-05-06 |
| 20100110671 | METHOD, SYSTEM, AND APPARATUS FOR HIGHLY CONTROLLED LIGHT DISTRIBUTION FROM LIGHT FIXTURE USING MULTIPLE LIGHT SOURCES (LEDS) - Disclosed herein are apparatus, methods, and systems for deriving composite beams from a plurality of light sources such as LEDs. Optical units comprising a plurality of light sources, each source having an associated optic which is individually positionable, are developed using optimization techniques that allow for lighting different target areas in an effective manner by rotating or otherwise positioning the reflectors, refractive lenses, TIR lenses, or other lens types to create a composite beam. The apparatus, methods, and systems of lighting herein make it possible to widely vary the types of beams from an available fixture using a small number of optics and fixtures. In some cases, by using a combination of individual beam patterns from the same or different types of light sources, a small set of individual optics may be sufficient to create a majority of the typical and specialized composite beams needed to meet the needs of most lighting projects and target areas. | 2010-05-06 |
| 20100110672 | SYSTEM, METHOD AND TOOL FOR OPTIMIZING GENERATION OF HIGH CRI WHITE LIGHT, AND AN OPTIMIZED COMBINATION OF LIGHT EMITTING DIODES - The present invention relates to a system, method and tool for optimizing combination of Light Emitting Diodes (LEDs), and to an optimized combination of LEDs. The system and method provide a plurality of LEDs and corresponding specifications. Then, a color temperature and a color rendering index are selected. Calculations are performed for subgroups of LEDs. At least one optimized combination of LEDs having an optimized corresponding luminous flux is identified according to selected color temperature, color rendering index and LEDs' specifications. In another aspect, the present invention relates to a tool for optimizing white light generated by a combination of LEDs. The tool comprises a repository for storing specifications for the combination of LEDs, a selection module for selecting at least one of the following parameters: a color temperature, a color rendering index and a maximum shift variance from a black body locus, and a processing module for calculating for subgroups of LEDs resulting color temperature, color rendering index, luminous flux, and for identifying an optimized selection of LEDs. The present invention also relates to an optimized combination of LEDs for producing white light with high color rendering index, the combination of LEDs excluding blue LEDs. | 2010-05-06 |
| 20100110673 | LUMINAIRE WITH LEDS - A luminaire comprises a light guiding layer ( | 2010-05-06 |
| 20100110674 | Foam part and sound absorber which is mounted in a suspended manner - The invention relates to a foam part ( | 2010-05-06 |
| 20100110675 | LIGHT OUTPUT DEVICE - A light output device comprises a first and a second substrate arrangement ( | 2010-05-06 |
| 20100110676 | Compact Led Downlight with cuspated flux-redistribution lens - A lighting device has a light source, a reflector dish with a central opening facing the light source, and a lens between the light source and the reflector dish. The lens is so arranged that light emitted from the source towards the central opening of the reflector dish is diffracted away from the central opening. The reflector dish is arranged to reflect light received from the source through the lens back past the lens and source. | 2010-05-06 |
| 20100110677 | LIGHT FIXTURE WITH INNER AND OUTER TROUGH REFLECTORS - A light fixture includes a light source and inner and outer trough reflectors. The inner and outer trough reflectors may have coaxial imaginary linear focal axes. Each of the inner and outer trough reflectors may be configured to collimate light emitted from the light source. | 2010-05-06 |
| 20100110678 | LIGHT-EMITTING DIODE TUBE STRUCTURE - The present invention relates to a light-emitting diode (LED) tube structure, which comprises a lamp cover and a light-emitting assembly. The light-emitting assembly is disposed under the lamp cover; and a condenser film or a diffuser film is disposed above the light-emitting assembly. By using the condenser film or the diffuser film, the light emitted by LEDs can be condensed or diffused for using. | 2010-05-06 |
| 20100110679 | LIGHT EMITTING DIODE LIGHT MODULE AND OPTICAL ENGINE THEREOF - An optical engine of a light emitting diode (LED) light module comprises a heat dissipation device, an LED light bar and an optical component. The heat dissipation device comprises a base plate and a plurality of fin plates vertically welded onto a surface of the base plate. The LED light bar is disposed on an opposite surface of the base plate so that the LED light bar can dissipate heat through the fin plates. The optical component having a space for accommodating the LED light is provided to form a desired light distribution pattern. | 2010-05-06 |
| 20100110680 | MOUNTING ARRANGEMENT FOR LIGHTING MODULES AND CORRESPONDING METHOD - A lighting module includes a base plate for fixing to a mounting surface, and a reflector body carrying a printed circuit board with one or more electrical light sources such as high power LEDs. The printed circuit board (includes electrical contact pins to the electrical light sources. The base plate and the reflector body are provided with complementary coupling formations for snap-like coupling the base plate and the reflector body with an electrical line interposed in between for feeding the light sources with the electrical contact pins electrically contacting the electrical line. The module may include force-generating formations to urge the printed circuit board against the base plate to promote heat transfer in between. | 2010-05-06 |
| 20100110681 | MARINE LIGHTING APPARATUS AND METHOD - A marine lighting device mounts in-line with a tubular member of a marine vessel structure such as a T-top, tower or hand rail. An LED light bar having an array of LEDs supportably mounted to a circuit board is sealably enclosed in a tubular lens which, in turn is disposed within a tubular housing, a central portion of which is provided with an opening through which illumination from the LEDs is emitted after passing through the lens. A sleeve coupling is used to mount at least one end of the housing to a free end of the tubular member. In lieu of using a sleeve coupling at both ends one end of the housing may be flared to receive one of the free ends of the tubular member. A lighted T-top incorporating at least one such marine lighting device and a lighted marine handrail are also disclosed. | 2010-05-06 |
| 20100110682 | Led-based secondary general illumination lighting color slaved to alternate general illumination lighting - One aspect relates to combining an at least one LED-based secondary general illumination lighting with an at least one primary general illumination lighting to at least partially provide an at least one combined general illumination lighting. The aspect further comprises sensing one or more sensed optical characteristics of an at least one alternate general illumination lighting. The aspect further comprises controlling at least one controlled optical characteristics of the at least one LED-based secondary general illumination lighting to control the at least one combined general illumination lighting at least partially responsive to the sensing the one or more sensed optical characteristics of an at least one alternate general illumination lighting. | 2010-05-06 |
| 20100110683 | LED LAMP - An LED lamp includes a heat sink having a planar base, a plurality of LED modules attached to a bottom face of the base, an envelope disposed on the bottom face of the base and covering the LED modules, and a lamp bracket securing the base and the envelope together. The lamp bracket includes a vertical frame which defines an opening at a lateral side thereof, an engaging flange extending from an inner face of the frame and supporting a fixing flange of the envelope, and a plurality of protrusions projecting from the inner face of the frame above the engaging flange and pressing the base downwardly towards the envelope. The base of the heat sink and the envelope are inserted into the vertical frame through the opening. | 2010-05-06 |
| 20100110684 | LIGHT EMITTING DIODE LUMINAIRES AND APPLICATIONS THEREOF - LED assemblies and luminaires comprising the same are described herein. In some embodiments, the LED assemblies and luminaires are suitable for use in a wide variety of applications including outdoor lighting applications such as roadway and sidewalk lighting, parking lot lighting and residential area lighting. | 2010-05-06 |
| 20100110685 | LIGHT TUBE - A light tube including a heat sink, a light transmissive cover disposed on the heat sink, and at least one light source module is provided. A containing space is formed between the heat sink and the light transmissive cover. The light source module includes a carrier, a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of non-light-emitting passive devices. The carrier is disposed on the heat sink. The first light-emitting devices are arranged on the carrier along a first straight reference line to form a first line of light-emitting devices. The second emitting devices are arranged on the carrier along a second straight reference line to form a second line of light-emitting devices. The non-light-emitting passive devices are disposed on the carrier and between the first and second lines of light-emitting devices and electrically connected to the first and the second light-emitting devices. | 2010-05-06 |
| 20100110686 | LED LIGHT MODULE - An LED light module of uniformly mixed light is provided. The LED light module has a plurality of shifted-disposed LED packages, arranged as a polygon, disposed on a substrate. Each of the shifted-disposed LED packages includes a base, and an LED die disposed aside from a center of the base. The light emitted from the shifted-disposed LED package is asymmetrically dispersed and is tilted to a predetermined direction. Therefore, the lights from the shifted-disposed LED packages are centralized and uniformly mixed as white light. | 2010-05-06 |
| 20100110687 | LED LAMP - An LED lamp includes a lamp body, a casing connecting the lamp body and a position post connecting the casing. The lamp body includes a plurality of lamp modules and at least a bracket. Each of the lamp modules includes a heat sink and an LED module attached to the heat sink. The lamp body can be arranged in multi forms by the at least a bracket connecting different numbers of the lamp modules together. The lamp body can have one of the following forms: an L-shaped form, a U-shaped form and a square, loop-shaped form. | 2010-05-06 |
| 20100110688 | LIGHTING DISPLAY SYSTEM - A lighting display system having an anti-theft feature has a mounting structure having at least one mounting plate having a front side and a back side, a first conductor line carried by the at least one mounting plate, a second conductor line carried by the at least one mounting plate and spaced apart from and extending parallel to the first conductor line, a plurality of first holes traversing the at least one mounting plate adjacent to the first conductor line, a plurality of second holes traversing the at least one mounting plate adjacent to the second conductor line, and a power supply terminal electrically connected to the first and second conductor lines and which is connectable to a power supply, and a plurality of luminescent bodies, wherein each of the plurality of luminescent bodies has a first contact plug exposed at a back side of the luminescent body and connected to the first conductor line by a first fixing member being in threaded engagement with the first contact plug, a second contact plug exposed at a back side of the luminescent body and connected to the second conductor line by a second fixing member being in threaded engagement with the second contact plug, wherein a mathematical line extending between centres of the first and second contact plugs is oriented at an angle a of more than 105° or less than 85° relative to a direction of extension of the first conductor line, and a plurality of light sources electrically connected to the first and second conductor lines via the first and second plugs and fixing members. | 2010-05-06 |
| 20100110689 | Articulating Joint For Dental or Medical Lights - An articulating joint for supporting a medical or dental light having a first mounting post rotatably couples the light to a support structure having a second mounting post. The articulating joint includes a joint body having first and second terminal ends. A first bearing and a first brake are located proximate the first end for receiving and frictionally engaging the first mounting post. The joint body may further include a second bearing and a second brake proximate the second end for receiving and frictionally engaging the second mounting post. The articulating joint further includes a cover that is removably coupled to the joint body over at least the first bearing and the first brake. | 2010-05-06 |
| 20100110690 | Display and Method for Modifying Color Resists of Color Filter - A method for modifying color resists of color filter includes the steps of: providing a white light-emitting diode (WLED) emitting light having wavelength of λ | 2010-05-06 |
| 20100110691 | LED FIXTURE AND MASK STRUCTURE THEREOF - An LED fixture include a mask structure and an LED module. The mask structure includes a cooling fin set of buckling type, an upper socket and a lower socket. The cooling fin set is constituted by a plurality of cooling fins that are encircled and inter-buckled to each other. An interior enclosed by the cooling fin set is formed into an accommodating space and a fitting hole connecting the accommodating space. The upper socket is assembled to one side of the fitting hole, while the lower socket is assembled to another side of the fitting hole. Meanwhile, the upper socket and the lower socket are respectively fastened by the cooling fin set through a clipping-and-abutting manner. The LED module is arranged by accommodating in the accommodating space and is connected to the cooling fin set as well. Accordingly, the entirely cooling effectiveness is promoted and the using lifetime is prolonged. | 2010-05-06 |
| 20100110692 | STRUCTURE OF HEAT DISSIPATION SUBSTRATE FOR POWER LED AND A DEVICE MANUFACTURED BY IT - A structure of heat dissipation substrate of power LED and a device made thereof overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes. The power LED device manufactured by using the heat dissipation substrate includes a heat sink, a circuit board with a counterbore, a LED chip, bonding wires, and encapsulation colloid. The encapsulation colloid covers the side of the circuit board carrying the chip and lead lines, and an external electrode part is kept outside. The encapsulation colloid functions not only as a sealing layer for sealing the chip and the bonding wire, but also as an optical lens integrated with the device. | 2010-05-06 |
| 20100110693 | LIGHT FIXTURE - The invention describes and shows a light fixture ( | 2010-05-06 |
| 20100110694 | COMPACT BEAM FORMER FOR INDUCTION HID LAMP - A light distribution assembly includes an electrodeless HID light source providing emitted light along substantially first and second hemispherical zones. A first optical element redirects a portion of light from the first hemispherical zone into a first desired direction in the second hemispherical zone. A second optical element redirects at least a portion of light within the second hemispherical zone. Other optical elements may be added to tailor the light distribution. Various combinations of these components may be used to create the desired illumination pattern. | 2010-05-06 |
| 20100110695 | LIGHTING LENS AND LIGHTING DEVICE EQUIPPED WITH THE SAME - A lighting lens can sufficiently suppress unevenness color and improve light use efficiency. This light lens has: first incidence surface | 2010-05-06 |
| 20100110696 | ICICLE ATTACHMENT - An icicle attachment for a light bulb which includes a hollow tube having a shape simulating a pendant spear of ice. The tube is tapered and receives a standard string light bulb with two radially inwardly directed spokes for enabling a bulb socket to be inserted therepast and thereafter retain the bulb socket in the tube top. Slits formed in the walls of the tube proximate the open body and communicating therewith enhance water drainage from the tube and light escape or sparkle of the icicle attachment. | 2010-05-06 |
