| 18th week of 2011 patent applcation highlights part 53 |
| Patent application number | Title | Published |
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| 20110104877 | Compositions and Methods for Forming a Semiconducting and/or Silicon-Containing Film, and Structures Formed Therefrom - Compositions, inks and methods for forming a patterned silicon-containing film and patterned structures including such a film. The composition generally includes (a) passivated semiconductor nanoparticles and (b) first and second cyclic Group IVA compounds in which the cyclic species predominantly contains Si and/or Ge atoms. The ink generally includes the composition and a solvent in which the composition is soluble. The method generally includes the steps of (1) printing the composition or ink on a substrate to form a pattern, and (2) curing the patterned composition or ink. In an alternative embodiment, the method includes the steps of (i) curing either a semiconductor nanoparticle composition or at least one cyclic Group IVA compound to form a thin film, (ii) coating the thin film with the other, and (iii) curing the coated thin film to form a semiconducting thin film. The semiconducting thin film includes a sintered mixture of semiconductor nanoparticles in hydrogenated, at least partially amorphous silicon and/or germanium. The thin film exhibits improved conductivity, density, adhesion and/or carrier mobility relative to an otherwise identical structure made by an identical process, but without either the semiconductor nanoparticles or the hydrogenated Group IVA element polymer. The present invention advantageously provides semiconducting thin film structures having qualities suitable for use in electronics applications, such as display devices or RF ID tags, while enabling high-throughput printing processes that form such thin films in seconds or minutes, rather than hours or days as with conventional photolithographic processes. | 2011-05-05 |
| 20110104878 | SEMICONDUCTOR DEVICE COMPRISING NMOS AND PMOS TRANSISTORS WITH EMBEDDED SI/GE MATERIAL FOR CREATING TENSILE AND COMPRESSIVE STRAIN - By forming a substantially continuous and uniform semiconductor alloy in one active region while patterning the semiconductor alloy in a second active region so as to provide a base semiconductor material in a central portion thereof, different types of strain may be induced, while, after providing a corresponding cover layer of the base semiconductor material, well-established process techniques for forming the gate dielectric may be used. In some illustrative embodiments, a substantially self-aligned process is provided in which the gate electrode may be formed on the basis of layer, which has also been used for defining the central portion of the base semiconductor material of one of the active regions. Hence, by using a single semiconductor alloy, the performance of transistors of different conductivity types may be individually enhanced. | 2011-05-05 |
| 20110104879 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS - Provided are a method of manufacturing a semiconductor device and a substrate processing apparatus, which can improve the surface roughness of an amorphous silicon film. The method of manufacturing a semiconductor device comprises: in a process of forming an amorphous silicon film on a substrate, setting, in an initial stage of the process, an in-furnace pressure to a first pressure to supply SiH | 2011-05-05 |
| 20110104880 | CORNER ROUNDING IN A REPLACEMENT GATE APPROACH BASED ON A SACRIFICIAL FILL MATERIAL APPLIED PRIOR TO WORK FUNCTION METAL DEPOSITION - In a replacement gate approach, a top area of a gate opening has a superior cross-sectional shape which is accomplished on the basis of a plasma assisted etch process or an ion sputter process. During the process, a sacrificial fill material protects sensitive materials, such as a high-k dielectric material and a corresponding cap material. Consequently, the subsequent deposition of a work function adjusting material layer may not result in a surface topography which may result in a non-reliable filling-in of the electrode metal. In some illustrative embodiments, the sacrificial fill material may also be used as a deposition mask for avoiding the deposition of the work function adjusting metal in certain gate openings in which a different type of work function adjusting species is required. | 2011-05-05 |
| 20110104881 | METHOD OF REDUCING WORDLINE SHORTING - A method of fabricating a memory device includes providing a substrate having an insulating layer, forming first, second, and third conductive layers on the insulating layer, forming a mask on the third conductive layer, etching through the third conductive layer and a first portion thickness of the second conductive layer using the mask to provide an etched sidewall portions of the third conductive layer and an etched upper surface of the second polysilicon layer, and forming a liner layer along the etched sidewall portions and the etched upper surface. | 2011-05-05 |
| 20110104882 | METHOD FOR PROCESSING SEMICONDUCTOR DEVICE - The present invention relates to a method for processing semiconductor devices with a fine structure, and more particularly, to a processing method suitable for miniaturizing semiconductor devices with a so-called high-k/metal gate structure. In an embodiment of the present invention, a deposited film, which includes an insulating film made of Hf or Zr and a material of Mg, Y or Al existing on, under or in the insulating film, is formed on a Si substrate and is removed by repeating a dry etching process and a wet etching process at least one time. The wet etching process is performed prior to the dry etching process. | 2011-05-05 |
| 20110104883 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device includes forming a gate insulating film on a semiconductor substrate, forming a first conductive layer on the gate insulating film, forming an intergate insulating film on the first conductive layer, forming a second conductive layer on the intergate insulating film, dividing the conductive layers and the intergate insulating film with a mask pattern formed on the second conductive layer, thereby forming a plurality of gate electrodes, forming a first recess on a first side wall of the first conductive layer and a second recess on a second side wall of the second conductive layer with side surfaces of the gate electrodes being exposed, and burying insulating films between the gate electrodes respectively and forming air gap portions respectively in portions of the buried insulating films corresponding to the recesses. | 2011-05-05 |
| 20110104884 | HOT EDGE RING WITH SLOPED UPPER SURFACE - A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface. | 2011-05-05 |
| 20110104885 | METHOD FOR TREATING A METAL OXIDE LAYER - The invention relates to a method for treating a metal oxide layer deposited on a substrate. The method comprises the step of applying a substantially atmospheric plasma process at a relatively low temperature. Preferably, the temperature during the plasma process is lower than approximately 180° C. Further, the atmospheric plasma process can be applied in a plasma chamber comprising H | 2011-05-05 |
| 20110104886 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE - A manufacturing method includes forming a semi-cured insulation layer made of a photosensitive material on a supporting body; forming an opening part in the insulation layer by a photolithography method, the opening part being configured to expose the supporting body; arranging a semiconductor chip on the insulation layer so that a position of an electrode of the semiconductor chip is consistent with a position of the opening part, and curing the insulation layer; forming sealing resin on a surface of the insulation layer at the semiconductor chip side, the sealing resin being configured to seal the semiconductor chip; removing the supporting body; and providing a wiring layer on a surface of the insulation layer opposite to the semiconductor chip side, the wiring layer being electrically connected to the electrode exposed in the opening part, so that a wiring structural body including the insulation layer and the wiring layer is formed. | 2011-05-05 |
| 20110104887 | Semiconductor element and method of manufacturing the same - A method of manufacturing a semiconductor element including a semiconductor substrate, a conductive post portion provided on the semiconductor substrate to protrude therefrom, and a solder layer provided on the conductive post portion, includes forming on the semiconductor substrate the conductive post portion having a distal end surface curved in a substantially arc shape by electrolytic plating, forming an intermediate solder layer on the distal end surface of the conductive post portion, and reflowing the intermediate solder layer to form the solder layer which has a thickest portion at a top of the distal end surface of the conductive post portion. | 2011-05-05 |
| 20110104888 | SEMICONDUCTOR DEVICES HAVING REDISTRIBUTION STRUCTURES AND PACKAGES, AND METHODS OF FORMING THE SAME - Semiconductor devices and methods of forming the same, including forming a chip pad on a chip substrate, forming a passivation layer on the chip pad and the chip substrate, forming a first insulation layer on the passivation layer, forming a recess and a first opening in the first insulation layer, forming a second opening in the passivation layer to correspond to the first opening, forming a redistribution line in a redistribution line area of the recess, the first opening, and the second opening, forming a second insulation layer on the redistribution line and the first insulation layer, and forming an opening in the second insulation to expose a portion of the redistribution line as a redistribution pad. | 2011-05-05 |
| 20110104889 | Methods of Forming Integrated Circuit Devices Using Contact Hole Spacers to Improve Contact Isolation - Methods of forming integrated circuit devices include upper sidewall spacers in contact holes to provide enhanced electrical isolation to contact plugs therein while maintaining relatively low contact resistance. These methods include forming an interlayer insulating layer on a semiconductor substrate. The interlayer insulating layer includes at least a first electrically insulating layer of a first material on the semiconductor substrate and a second electrically insulating layer of a second material on the first electrically insulating layer. A contact hole is formed that extends through the interlayer insulating layer and exposes a primary surface of the semiconductor substrate. This contact hole may be formed by selectively etching the second electrically insulating layer and the first electrically insulating layer in sequence and at a faster etch rate of the first material relative to the second material. This sequential etching of the first material at a faster rate than the second material may yield a contact hole having a recessed sidewall. | 2011-05-05 |
| 20110104890 | METHOD FOR FORMING CU ELECTRICAL INTERCONNECTION FILM - Provided is a Cu electrical interconnection film forming method, wherein an adhesive layer (base film) having improved adhesiveness with a Cu electrical interconnection film is used, in a semiconductor device manufacturing process. After forming a barrier film on a substrate whereupon a hole or the like is formed, a PVD-Co film or a CVD-Co film or an ALD-Co film is formed on the barrier film. Then, after filling up or burying the hole or the like, which has the Co film formed on the surface, with a CVD-Cu film or a PVD-Cu film, heat treatment is performed at a temperature of 350° C. or below, and the Cu electrical interconnection film is formed. | 2011-05-05 |
| 20110104891 | METHODS AND APPARATUS OF CREATING AIRGAP IN DIELECTRIC LAYERS FOR THE REDUCTION OF RC DELAY - A method and apparatus for generating air gaps in a dielectric material of an interconnect structure. One embodiment provides a method for forming a semiconductor structure comprising depositing a first dielectric layer on a substrate, forming trenches in the first dielectric layer, filling the trenches with a conductive material, planarizing the conductive material to expose the first dielectric layer, depositing a dielectric barrier film on the conductive material and exposed first dielectric layer, depositing a hard mask layer over the dielectric barrier film, forming a pattern in the dielectric barrier film and the hard mask layer to expose selected regions of the substrate, oxidizing at least a portion of the first dielectric layer in the selected region of the substrate, removing oxidized portion of the first dielectric layer to form reversed trenches around the conductive material, and forming air gaps in the reversed trenches while depositing a second dielectric material in the reversed trenches. | 2011-05-05 |
| 20110104892 | ETCHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - The present invention discloses technique of etching selectively a layer containing siloxane. The present invention provides a semiconductor device with reduced operation deterioration due to etching failure. A method for manufacturing a semiconductor device comprises steps of forming a conductive layer electrically connecting to a transistor, an insulating layer covering the conductive layer, and a mask formed over the insulating layer; and etching the insulating layer with a processing gas including a hydrogen bromide gas. | 2011-05-05 |
| 20110104893 | METHOD FOR FABRICATING MOS TRANSISTOR - A method for fabricating metal-oxide semiconductor (MOS) transistor is disclosed. The method includes the steps of: providing a semiconductor substrate having a gate and a source/drain region thereon; forming a Ni—Pt layer on surface of the gate and the source/drain region; performing a first rapid thermal process to react a portion of the Ni—Pt layer into a silicide layer; removing un-reacted nickel from the first rapid thermal process; removing un-reacted platinum from the first rapid thermal process; performing a second rapid thermal process for lowering the resistance of the silicide layer; and covering a contact etch stop layer (CESL) on the silicide layer after the second rapid thermal process. | 2011-05-05 |
| 20110104894 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes etching a semiconductor substrate using a hard mask layer as a barrier to form a trench defining a plurality of active regions, forming a gap-fill layer to gap-fill a portion of the inside of the trench so that the hard mask layer becomes a protrusion, forming spacers covering both sides of the protrusion, removing one of the spacers using a doped etch barrier as an etch barrier, and etching the gap-fill layer using a remaining spacer as an etch barrier to form a side trench exposing one side of the active region. | 2011-05-05 |
| 20110104895 | METHOD FOR FORMING A PLUG STRUCTURE - A method for forming a plug structure includes the following steps. A substrate is provided. The substrate includes a MOS device with a source/drain region, a dielectric layer disposed on the MOS device, an opening defined in the dielectric layer, and a first glue layer disposed on a sidewall and a bottom of the opening. A portion of the first glue layer disposed at the bottom of the opening is punched through to expose the source/drain region. A barrier layer is formed over the substrate after the first glue layer is punched through. The opening is filled with a conductive structure, wherein the barrier layer disposed at the bottom of the opening is remained when the conductive structure is filled into the opening. | 2011-05-05 |
| 20110104896 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS - There are provided a method of manufacturing a semiconductor device and a substrate processing apparatus, which are designed to prevent deterioration of the surface morphology of a Ni-containing film caused by dependence on an under layer, and to form a continuous film in a thin-film region. The method includes: loading a substrate into a process vessel; heating the substrate in the process vessel; pretreating the heated substrate by supplying a reducing gas into the process vessel and exhausting the reducing gas; removing the reducing gas remaining in the process vessel by supplying an inert gas into the process vessel and exhausting the inert gas; forming a nickel-containing film on the heated and pretreated substrate to a predetermined thickness by supplying a nickel-containing source into the process vessel and exhausting the nickel-containing source; and unloading the substrate from the process vessel. | 2011-05-05 |
| 20110104897 | CONTACT CLEAN BY REMOTE PLASMA AND REPAIR OF SILICIDE SURFACE - Embodiments provide methods for treating a metal silicide contact which includes positioning a substrate having an oxide layer disposed on a metal silicide contact surface within a processing chamber, cleaning the metal silicide contact surface to remove the oxide layer while forming a cleaned silicide contact surface during a cleaning process, and exposing the cleaned silicide contact surface to a silicon-containing compound to form a recovered silicide contact surface during a regeneration process. In some examples, the cleaning of the metal silicide contact surface includes cooling the substrate to an initial temperature of less than 65° C., forming reactive species from a gas mixture of ammonia and nitrogen trifluoride by igniting a plasma, exposing the oxide layer to the reactive species to form a thin film, and heating the substrate to about 100° C. or greater to remove the thin film from the substrate while forming the cleaned silicide contact surface. | 2011-05-05 |
| 20110104898 | Method of Forming Semiconductor Device - A method of forming a semiconductor device comprises forming a mask pattern over an etch target layer, forming an ion implantation region in the mask pattern through an ion implantation process, and forming an ion non-implantation region within the mask pattern, removing the ion implantation region on a top surface of the ion non-implantation region, removing the ion non-implantation region, and patterning the etch target layer by using spacers that comprise the ion implantation region as an etch mask. | 2011-05-05 |
| 20110104899 | SUB-LITHOGRAPHIC PRINTING METHOD - A trench structure and an integrated circuit comprising sub-lithographic trench structures in a substrate. In one embodiment the trench structure is created by forming sets of trenches with a lithographic mask and filling the sets of trenches with sets of step spacer blocks comprising two alternating spacer materials which are separately removable from each other. In one embodiment, the trench structures formed are one-nth the thickness of the lithographic mask's feature size. The size of the trench structures being dependent on the thickness and number of spacer material layers used to form the set of step spacer blocks. The number of spacer material layers being n/2 and the thickness of each spacer material layer being one-nth of the lithographic mask's feature size. | 2011-05-05 |
| 20110104900 | Alkaline Rinse Agents For Use In Lithographic Patterning - Lithographic patterning methods involve the formation of a (one or more) metal oxide capping layer, which is rinsed with an aqueous alkaline solution as part of the method. The rinse solution does not damage the capping layer, but rather allows for lithographic processing without thinning the capping layer or introducing defects into it. Ammoniated water is a preferred rinse solution, which advantageously leaves behind no nonvolatile residue. | 2011-05-05 |
| 20110104901 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device manufacturing method includes a process of forming a first organic film pattern on a to-be-etched layer on a substrate, a process of forming a silicon oxide film coating the first organic film pattern in an isotropic manner, a process of etching the silicon oxide film to form a first mask pattern in such a manner to cause the width of the line part of the first organic film pattern to have a fixed proportion with respect to a thickness of the silicon oxide film that coats a surface of the line part in the isotropic manner, a process of forming a second organic film pattern coating the silicon oxide film, a process of forming a second mask pattern that includes the silicon oxide film on a side face part in an area that is coated by the second organic film pattern, and a process of, in an area other than the area that is coated by the second organic film pattern, forming a third mask pattern in which an even number of the silicon oxide films are arranged. | 2011-05-05 |
| 20110104902 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - A plasma processing apparatus includes a processing chamber including a dielectric window; a coil shaped RF antenna provided outside the dielectric window; a substrate supporting unit, provided in the processing chamber, for mounting thereon a target substrate to be processed; a processing gas supply unit for supplying a desired processing gas to the processing chamber to perform a desired plasma process on the target substrate; and an RF power supply unit for supplying an RF power to the RF antenna to generate a plasma of the processing gas by an inductive coupling in the processing chamber. The apparatus further includes a floating coil electrically floated and arranged at a position outside the processing chamber where the floating coil is to be coupled with the RF antenna by an electromagnetic induction; and a capacitor provided in a loop of the floating coil. | 2011-05-05 |
| 20110104903 | MANUFACTURING APPARATUS AND METHOD FOR SEMICONDUCTOR DEVICE - A manufacturing apparatus for a semiconductor device, comprising: a chamber configured to process a wafer; a wafer stage installed in the chamber and formed with a plurality of holes for supplying gas to a rear surface of the wafer; a gas detection mechanism configured to detect an amount of gas leak from each of the plurality of holes, independently; a wafer position detection mechanism configured to determine a direction and an amount of a deviation of the wafer from a predetermined position on the wafer stage based on the detected amounts of gas leak of a hole and positions of the hole; and a wafer position adjustment mechanism configured to adjust a position of the wafer based on the direction and the amount of the deviation of the wafer from the predetermined position on the wafer stage. | 2011-05-05 |
| 20110104904 | METHOD OF PROCESSING SILICON WAFER - A method of processing a silicon wafer including sequentially carrying out the steps of (1) preparing a lapped semiconductor silicon wafer, (2) cleaning the wafer with a surfactant, (3) cleaning the wafer with alkali or acid, and (4) etching the wafer with high-purity sodium hydroxide. | 2011-05-05 |
| 20110104905 | ETCHING COMPOSITION, IN PARTICULAR FOR STRAINED OR STRESSED SILICON MATERIALS, METHOD FOR CHARACTERIZING DEFECTS ON SURFACES OF SUCH MATERIALS AND PROCESS OF TREATING SUCH SURFACES WITH THE ETCHING COMPOSITION - The present invention provides a chromium-free etching composition suitable for treating various silicon-containing surfaces, including strained silicon on insulator surfaces as well as stressed silicon surfaces. The novel and inventive etching composition in accordance with the present invention includes hydrofluoric acid, nitric acid, acetic acid and an alkali iodide, preferably potassium iodide, present in an amount of 1 mmol/100 ml or more. | 2011-05-05 |
| 20110104906 | METHOD OF GROWING OXIDE THIN FILMS - Process for producing silicon oxide containing thin films on a growth substrate by the ALCVD method. In the process, a vaporisable silicon compound is bonded to the growth substrate, and the bonded silicon compound is converted to silicon dioxide. The invention comprises using a silicon compound which contains at least one organic ligand and the bonded silicon compound is converted to silicon dioxide by contacting it with a vaporised, reactive oxygen source, in particular with ozone. The present invention provides a controlled process for growing controlling thin films containing SiO | 2011-05-05 |
| 20110104907 | METHODS OF FORMING A METAL SILICATE LAYER AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING THE METAL SILICATE LAYER - Methods of forming a metal silicate layer and methods of fabricating a semiconductor device including the metal silicate layer are provided, the methods of forming the metal silicate layer include forming the metal silicate using a plurality of silicon precursors. The silicon precursors are homoleptic silicon precursors in which ligands bound to silicon have the same molecular structure. | 2011-05-05 |
| 20110104908 | Laser Mask and Crystallization Method Using the Same - A crystallization method using a mask includes providing a substrate having a semiconductor layer; positioning a mask over the substrate, the mask having first, second and third blocks, each block having a periodic pattern including a plurality of transmitting regions and a blocking region, the periodic pattern of the first block having a first position, the periodic pattern of the second block having a second position, the periodic pattern of the third block having a third position, the first, second and third positions being different from each other; and crystallizing the semiconductor layer by irradiating a laser beam through the mask. | 2011-05-05 |
| 20110104909 | BOARD-MOUNTED ELECTRICAL CONNECTOR - An electrical connector includes an insulative housing and a plurality of terminals secured in the insulative housing. The insulative housing defines a front face and a rear face opposite to the front face. The housing further includes at least one tongue portion extending forwardly from the front face. At least one receiving space is recessed in the rear face and corresponding to the at least one tongue portion. Each terminal includes a retention portion secured in the insulative housing, a contact portion extending forwardly from one end of the retention portion and a tail portion extending from the other end of the retention portion. The contact portion is located on the at least tongue portion. The tail portions bend toward the front face and are received in the receiving space. | 2011-05-05 |
| 20110104910 | HIGH-FREQUENCY MODULE AND WIRELESS DEVICE - A high-frequency module includes: a shield cover of the high-frequency module; a coaxial connector which is fixed to an outer side surface of the shield cover; a center conductor of the coaxial connector which protrudes to the inside of a region of the high-frequency module; and a metal plate terminal which is mounted on a print wiring formed on a substrate. The shield cover is fixed to the substrate so as to cover the upper portion thereof, while the center conductor of the coaxial connector is fitted to the metal plate terminal so as to allow input and output of a high-frequency signal. | 2011-05-05 |
| 20110104911 | BRIDGE CONNECTORS AND CIRCUIT BOARD ASSEMBLIES INCLUDING THE SAME - A bridge connector configured to electrically and mechanically couple adjacent circuit boards. The connector includes a connector housing that has a mating side configured to interface with board surfaces of adjacent circuit boards when mounted thereon. The housing includes a contact-receiving slot that at least partially defines a restricted space. The connector also includes a bridge contact that is held within the slot and the restricted space. The bridge contact has a pair of contact ends that are spaced apart from each other and project from the mating side. The contact ends are inserted into corresponding through-holes of the adjacent circuit boards when the housing is mounted thereon. The bridge contact is sized and shaped relative to the restricted space to float within the slot such that the bridge contact at least one of shifts and pivots therein. | 2011-05-05 |
| 20110104912 | ELECTRICAL CONNECTOR HAVING PLATED CONDUCTIVE LAYER - An electrical connector for connecting two electronic devices includes a first housing having a plurality of first through holes, a second housing mounted under the first housing and having a plurality of second through holes respectively aligning with the first through holes. An inner wall of each second through hole is plated to have a conductive layer thereon. A contacting member is attached to the conductive layer and disposed beyond a bottom surface of the second housing for engaging with one electronic device. A plurality of contacts each includes a contacting portion disposed in the first through hole for engaging the other electronic device and an engaging section disposed in the second through hole and electrically contacted with the conductive layer. | 2011-05-05 |
| 20110104913 | Edge card connector having solder balls and related methods - An edge card connector includes: a substantially rigid, insulating housing having internal electrical contacts to engage the edge of a first circuit board inserted into the housing; solder balls arranged on an outer surface of the housing in a selected pattern to establish connections to corresponding conductive pads on a second circuit board when the solder balls are at least partially melted; and, electrical connections between the internal electrical contacts and the solder balls. The socket may contain additional features for added strength, ease of assembly, and other purposes. The system is assembled by placing the socket onto a circuit board, aligning the solder balls with respective contact pads, and fusing the solder balls to establish electrical connectivity. A standoff structure may be provided to avoid excessive compaction of the solder balls. | 2011-05-05 |
| 20110104914 | RELIABLE ELECTRICAL CONNECTION ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly has a printed circuit board having a row of first and second circuit traces and an electrical connector for mounting on the printed circuit board. The electrical connector includes an insulative housing having a longitudinal base and a pair of clip portions extending rearwardly from the base and a plurality of contacts respectively received in the insulative housing grouped into a set of first and second contacts. Each clip portion has a first partition, a second partition and a board-receiving groove therebetween. Each first contact has a first soldering point jointing on the first circuit trace and each second contact has a second soldering point jointing on the second circuit trace. At least one of the first contacts crossing over the second contact, and the first soldering point locates at the back of the second soldering point. When the printed circuit board is located in the entrance of the groove, the first soldering points are located between the first circuit traces and the second circuit traces so as to prevent the printed circuit board from abrading by the overlapped contacts. | 2011-05-05 |
| 20110104915 | BOARD MOUNTED ELECTRICAL CONNECTOR - A connector includes an insulator, and a plurality of spaced apart signal contacts and return reference contacts which are held by and routed through the insulator. The signal contacts form signal pairs which include a positive signal contact and a negative signal contact. At a first end of the insulator, the signal pairs and return reference contacts are provided in two rows. At the second end of the insulator, the signal pairs and return reference contacts are provided in at least three rows. The signal pairs and return reference contacts form either a plurality of isosceles triangles or a plurality of diagonal lines. | 2011-05-05 |
| 20110104916 | Plug-In Outlet (PIO) With Floating Fingerguard - A plug-in outlet for a busway system has a base mounted to a busway housing, wherein the base has an opening into which an electrical stab extends from a busbar of the busway system. A fingerguard is mounted to the base into the opening and has self-aligning features achieved by built-in tolerances. The fingerguard includes a central barrier for shielding a leading end of the electrical stab, the central barrier extending from side walls of the fingerguard and being separated by respective gaps from a top wall and a bottom wall of the fingerguard. The fingerguard further includes a top back latch and a bottom back latch for attaching the fingerguard to the stab, the top back latch and the bottom back latch extending from respective ones of the top wall and the bottom wall toward the stab and retaining the stab toward the fingerguard. | 2011-05-05 |
| 20110104917 | ELECTRONIC DEVICE WITH HIDDEN I/O INTERFACE MODULE - An electronic device with a hidden I/O interface module is disclosed. The electronic device includes a container and a surface with an opening, container and the opening communicate with each other. The container includes a first position and a second position. The electronic device also includes an I/O connection unit, a pivot module and a cover. The I/O connection unit is disposed at the container, electrically connected to the electronic device and includes a connecting surface. The pivot module is connected to the I/O connection unit. The cover is connected to the pivot module. When the cover is shut, it covers the container and makes the I/O connection unit located at the first position. When the cover is open, it drives the pivot module to drive the I/O connection unit to move to the second position to make the connecting surface of the I/O connection unit aligned with the surface. | 2011-05-05 |
| 20110104918 | Safety Gates for Electrical Outlets - A safety gate for selectively covering socket holes of an electrical outlet comprises an upper slide plate comprising an upper space with an upper recessed platform on a first side and an upper slant on an opposed side. A lower slide plate comprises a lower space with a lower slant on a first side and a lower recessed platform on an opposed side. The upper and lower spaces allow load plug pins to pass through, and the intervals of the spaces correspond to the interval of load plug pins. The upper slide plate is stacked with the lower slide plate to overlap the upper recessed platform with the lower slant and the upper slant with the lower recessed platform. The upper slide plate slides relative to the lower slide plate. Load plug pins slide along the inclined slopes of the upper and lower slants to slidingly displace the upper and lower slide plates a distance that is no less than the thickness of a pin. | 2011-05-05 |
| 20110104919 | RECEPTACLE WITH ANTENNA - An electrical receptacle is disclosed. The electrical receptacle includes a housing and at least one socket at least partially disposed within the housing and having at least a pair of entry ports. The at least one socket is controllable by a radio frequency signal. The electrical receptacle also includes an antenna at least partially disposed within the housing configured to at least receive the radio frequency signal used to control the at least one socket. The electrical receptacle further includes at least one tamper resistant device at least partially disposed within the housing. The at least one tamper resistant device is configured to block the entry ports unless a mating electrical plug is inserted into the at least one socket. | 2011-05-05 |
| 20110104920 | CARD SOCKET - [Object] To provide a card socket having a structure that achieves a low profile. | 2011-05-05 |
| 20110104921 | CONNECTOR AND SERIES OF CONNECTORS - A connector has a housing ( | 2011-05-05 |
| 20110104922 | MODULAR ELECTRICAL SYSTEM INCLUDING BACK-TO-BACK RECEPTACLE CONFIGURATIONS AND CAPABLE OF PROVIDING FOUR WIRE CIRCUITRY - A modular electrical system ( | 2011-05-05 |
| 20110104923 | FLUORESCENT LAMPHOLDER - A fluorescent lampholder with a top portion for supporting a fluorescent lamp and a base portion with a wire opening located on the bottom surface of the base that receives wires without exposing the wires to the exterior surface of a fixture. The lampholder is capable of supporting various types and/or sizes of fluorescent lamps such as “tall”, “medium” and “small” T-8 fluorescent lamps as well as other types and/or sizes of fluorescent lamps. | 2011-05-05 |
| 20110104924 | DEVICE CONNECTOR - A device connector has a housing main body ( | 2011-05-05 |
| 20110104925 | CONNECTOR SYSTEM, USE AND METHOD - The invention relates to a connector system with a connector and a complementary connector, wherein the connector includes a housing element with a locking device and an electrical contact element, wherein the electrical contact element is arranged in the area of a front end of the housing element, and includes a closing element arranged on the housing element, which closing element surrounds both at least the rear end of the housing element and an area of the electrical cable arranged outside the housing element, and is closely connected with the housing element and the electrical cable such that at the rear end, the interior of the housing element is sealed from the surrounding in a substantially fully moisture-tight manner. | 2011-05-05 |
| 20110104926 | ELECTRICAL CONNECTOR WITH AN IMPROVED BOARD LOCK - An electrical connector includes an insulative housing having a mating face, a mounting face, a pair of side walls, a elongated central slot recessed downwardly from the mating face, a first end wall and a second end wall, the central slot being positioned between the side walls, the first end wall and the second end wall, the side walls include a plurality of passageways communicating with the central slot; a plurality of contacts being retained in the passageways respectively and protruding into the central slot; a metal board lock extending downwardly through the first end wall and being attached to the first end wall; a retainer attached to the first end wall to mating with a corresponding card; the board lock is sandwiched between the retainer and the first end wall. | 2011-05-05 |
| 20110104927 | BURN-IN SOCKET - A burn-in socket ( | 2011-05-05 |
| 20110104928 | ELECTRICAL CONNECTOR WITH IMPROVED CAM ACTUATOR - An electrical connector includes an insulative base, a cover mounted on the base, a number of conductive terminals secured to the base, and a cam actuator extending through said cover and base to actuate the cover to slide on the base. The cam actuator includes a retention disk, a central disk, a cam disk, a transition disk, and a driving disk from down to up. The retention disk and the central disk are coaxial and located in the base. The cam disk, the transition disk, and the driving disk are coaxial and located in the cover. The cam actuator rotates on axis of the central disk. The axis of the cam disk is parallel to but offset from the axis of the central disk. The diameter of the transition disk is less than the diameter of the driving disk and more than the diameter of the cam disk. | 2011-05-05 |
| 20110104929 | Connector - A connector includes a female connector for accommodating a cylindrical and deformable female terminal provided at an end of a cable, a male connector for accommodating a male terminal configured to be inserted into the female terminal, a fastening member provided slidably around an outer periphery of the female terminal, and configured to tighten the female terminal to fasten the male terminal when inserted into the female terminal, and a slide mechanism for sliding the fastening member, which is provided in the female connector. | 2011-05-05 |
| 20110104930 | LOCKING DEVICE AND HIGH VOLTAGE SHIELD CONNECTOR HAVING THE SAME - The present invention provides a locking device and a high voltage shield connector having the same. The locking device of the present invention preferably includes a mounting hole configured to penetrate the circumferential surface of a female housing, a support member configured to be supported on an edge of the mounting hole, a restraining member extending to a lower portion of the support member and projecting to the inside of the female housing, and a locker formed on a male housing to restrain the restraining member to be connected to the female housing. | 2011-05-05 |
| 20110104931 | CABLE ASSEMBLY WITH LATCHING MECHANISM - An cable assembly ( | 2011-05-05 |
| 20110104932 | CONNECTION ADAPTER/TERMINAL SET AND CORRESPONDING CONNECTION ADAPTER AND TERMINAL - A connection adapter has electrical contacts for connection to a corresponding mating contact of a terminal. The mating contacts are received in terminal domes formed from an insulating material which is configured such that the mating contacts are accessible to a contact of the connection adapter through a contact guide opening in a terminal dome. Connection adapter guides in the terminal domes are configured to interact with terminal guides to guide the connection adapter from a placement position, where it is placed onto the terminal in the correct position where the connection adapter and terminal can be fitted together, to detent position, where the connection adapter is placed and held on the terminal so that the electrical contacts of the connection adapter and the mating contacts of the terminal can be moved relative to each other to establish electrical contact. | 2011-05-05 |
| 20110104933 | Communication Connector with Improved Crosstalk Communication - A communication jack has a housing with a face having a plug receiving aperture. A plurality of conductive path pairs extends from corresponding plug interface contacts located at the plug receiving aperture to corresponding output terminals. A first circuit board is connected to the plug interface contacts and a second circuit board is connected to the plug interface contacts and the output terminals. The first circuit board has a first single stage of crosstalk compensation with opposite polarity of the crosstalk of a plug for a first combination of the conductive path pairs. The second circuit board includes a second single stage of opposite polarity crosstalk compensation for some of the conductive path pairs not compensated on the first circuit board. The stages cancel substantially all of the crosstalk caused by the plug, for the signal operating frequencies, for corresponding combinations of the conductive path pairs. | 2011-05-05 |
| 20110104934 | Modular connector plug for high speed applications - A modular connector plug for high speed applications includes a wire guide filter at least partially situated in the conductor-receiving cavity of the housing of the plug. The wire guide filter includes an impedance containing portion comprising a longitudinally extending body having a plurality of longitudinally extending passageways and an internal cable guide portion comprising a longitudinally extending body defining a plurality of longitudinally extending passageways. | 2011-05-05 |
| 20110104935 | CONNECTOR AND ILLUMINATING DEVICE EQUIPPED WITH THE CONNECTOR - A connector according to the present invention connects a conductive member such as a radiating section which radiates generated heat from a heat source functioning with supplied power and a power connection section which connects with an external power source supplying power to the heat source. | 2011-05-05 |
| 20110104936 | ELECTRICAL CONNECTOR - An electrical connector including a housing provided thereon with an opening through which a flexible printed circuit board (an FPC) is inserted into the housing, a plurality of conductive contacts arranged on the housing, a conductive shell mounted on the housing for covering partially the same and provided with a holding member, and a movable lever, wherein the holding member comprises an arm portion extending from the conductive shell to the inside thereof, an engaging projection provided at an end of the arm portion for engaging with an engaging edged portion provided on the FPC inserted in the housing so as to hold the FPC, a pressure receiving portion extending from the engaging projection for receiving pressure from the movable lever and an indicating portion extending from the pressure receiving portion to take up selectively first and second positions for indicating a state of the holding member, and the indication portion taking up at least one of the first and second positions is able to be visually checked from the outside of the conductive shell. | 2011-05-05 |
| 20110104937 | PORTABLE ELECTRICAL POWER BOX - The portable electrical power box includes a power extension cord connected to a 240-volt input plug. Via the input plug, the device plugs into a 240-volt outlet in a home or other location where split phase power is available. Two branch circuits comprise 120-volt receptacles disposed on the power box. The power extension cord has a neutral wire, a first split voltage wire, and a second split voltage wire. The neutral and first split voltage wire feed voltage to the first branch circuit of receptacles. The neutral and second split voltage wire feed voltage to the second branch circuit of receptacles. This arrangement minimizes overloading electrical panels in homes with extension cords in the home's 120-VAC outlets. The device has circuit breakers to prevent overloads. | 2011-05-05 |
| 20110104938 | FPC U-SHAPED NAIL - To provide an electric connector capable of securing a sufficient distance between a position at which a projecting portion of a flat electric cable is placed and a position soldered on the surface of a circuit board even when the electric connector is formed having a low profile. An electric connector | 2011-05-05 |
| 20110104939 | FLEXIBLE CIRCUIT BOARD CONNECTOR WITH ANTI-DISENGAGEMENT MOVABLE COVER - A flexible circuit board connector with anti-disengagement movable cover collectively assembled and structured to include a lengthwise insulator, a U-shaped movable cover, a number of connecting terminals, and a pair of anti-disengagement panels. When the movable cover is pulled up, frontal sections of wing panels configured on left and right sides of the movable cover are subjected to confinement by blocking panels provided with functionality to fence therein, therewith preventing the wing panels of the movable cover from flexing or deformation, thereby preventing disengagement of the movable cover, and extending applicable life-span of the flexible circuit board connector, as well as enhancing an electrical connection of a flexible flat cable and the flexible circuit board connector therebetween. | 2011-05-05 |
| 20110104940 | THERMAL PROTECTION CIRCUITS FOR ELECTRONIC DEVICE CABLES - Connectors for cables such as a 30-pin connector are provided. The connectors may have thermal protection circuits and may carry a power supply voltage and a ground voltage. The thermal protection circuits may disable the power supply voltage when the temperature of the connector exceeds a threshold value. The thermal protection circuits may disable the power supply voltage when liquid is detected in the connector. The thermal protection circuits may disable the power supply voltage permanently or temporarily. In one example, when a cable is reset, the thermal protection circuits may use a record of previous fault events and measurements from thermal and liquid sensors to determine whether to enable or disable the power supply voltage. | 2011-05-05 |
| 20110104941 | STRUCTURE FOR ELECTRONICALLY CONNECTING BETWEEN TWO DEVICES - A structure for electronically connecting between two devices is provided. The structure includes a mount structure capable of mounting a first device, and a connector maintaining electronic connection with a second device and being movable on the mount structure depending on a connection position with the mounted first device. | 2011-05-05 |
| 20110104942 | MULTIPLE-POSITION MODULAR CONNECTOR EMPLOYING SHIELDED OR FILTERED SIGNAL CONDUCTORS FOR REDUCING ELECTRICAL NOISE - A multiple-position modular connector (jack, plug or both) includes a rigid insulating body and a set of spaced-apart coaxial conductors carried by the body. Each coaxial conductor has a mating end at a mating portion of the body providing electrical connection between the inner signal conductor and a corresponding conductor of a mating modular connector. A conductive structure extends between the outer shield conductors of the coaxial conductors and a reference contact at an outer surface of the body to provide a high-frequency ground for the outer shield conductors. In another aspect, a modular connector includes a printed circuit board carried by an insulative body and employing some combination of well-matched conductive paths and filtering circuitry such as common-mode coils or “chokes”. Electrical traces of the printed circuit board may include ground/reference traces interspersed among signal traces to provide shielding and uniform electrical characteristics to the signal traces. Filtering circuitry when present is disposed on the PC board along the signal traces and acts to reduce the level of common-mode signal components reaching the mating contacts from the cable. | 2011-05-05 |
| 20110104943 | Wire harness and method of manufacturing the same - A wire harness includes a cable, a connector comprising an outer housing comprising a resin, a cable insertion hole into which an end portion of the cable is inserted, and a concave portion formed on an insertion side of the cable insertion hole, and a welding member comprising a resin to provide air-tightness between the outer housing and the cable by being welded to the outer housing by ultrasonic welding. The welding member is formed around the cable so as to surround the cable while allowing a gap portion to have a predetermined clearance from the cable, and fitted into the concave portion of the outer housing. | 2011-05-05 |
| 20110104944 | CONTACT HOUSING AND ELECTRICAL CONTACT DEVICE - In a contact housing having a contact chamber for accommodating a contact body which can be inserted into the contact chamber through an assembly opening in a direction of insertion, in an operational position of the contact body in which it is stopped within the contact chamber, at least one element of contact chamber is lying against a stopping surface (support surface), of contact body, which generally points in a direction opposite to the insertion direction in such a way that the removal of the contact body is generally prevented counter to the insertion direction, the present invention provides that a center axis of the assembly opening has a lateral offset transversely to the direction of insertion with respect to a center axis of the stopped contact body; that in the contact chamber, in the direction of insertion, behind the assembly opening, a displaceably situated, elastically flexible spring is provided that extends into the path of the contact body, which narrows the path for the contact body and can be deflected by the contact body, and which is designed to be stressed in an assembly position during the insertion of the contact body. | 2011-05-05 |
| 20110104945 | SUPER-THIN USB CONNECTOR RECEPTACLE HOUSINGS HAVING REDUCED-WEAR FINGER CONTACTS - Structures, methods, and apparatus that provide connector receptacles that have a reduced tendency to scratch and otherwise mar connector inserts, have an aesthetically-pleasing appearance, have an improved tactile response when inserts are inserted, or are very thin or have a low profile. Various examples reduce scratches and wear by utilizing domes, cylinders, balls, or other structures as finger contacts in a connector receptacle. Another example provides aesthetically-pleasing connector receptacle enclosures by forming receptacle enclosures using the same type of material, or material having the same or similar color or texture, as is used for enclosing the electronic device that includes the receptacle. Another example provides an aesthetically-pleasing receptacle enclosure by forming receptacle enclosures that are, in part or in whole, contiguous or formed with the housing. Another example provides a super-thin connector receptacle by removing fingers and portions of a shell along one or more sides. | 2011-05-05 |
| 20110104946 | ELECTRICAL CONNECTOR HAVING SWITCHING TERMINAL - An electrical connector ( | 2011-05-05 |
| 20110104947 | CONDENSER CONNECTOR FOR VEHICLE - Disclosed herein is a condenser connector for a vehicle, in which a condenser is installed at a position which is nearest or virtually nearest to a noise source, thus effectively eliminating or reducing noise. The condenser connector includes a housing having an insertion part. One end of a terminal is connected to a wire, and the other end thereof is fitted into and secured to one end of the insertion part. A holder is fitted into and secured to the other end of the insertion part. A condenser has a contact terminal which is in contact with the terminal, and is mounted to the holder. | 2011-05-05 |
| 20110104948 | SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE - An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a contact tail of a conductive element in a connector. The shared pads are not connected through vias to internal circuit structures. Rather, a via, such as which would conventionally be formed as part of the connector mounting pad, is formed as part of a separate, adjacent pad. A second end of the capacitor is attached to the adjacent pad, forming an electrical connection between the conductive element and the via through the capacitor. Incorporating capacitors into the footprint reduces the number of vias required, which improves signal integrity. The capacitors may be placed on the printed circuit board separately from the connector or may be incorporated into the connector, allowing the connector and capacitors to be placed in one operation. | 2011-05-05 |
| 20110104949 | ELECTRICAL POWER OUTLET DEVICE AND MODULE THEREOF - The present invention relates to an electrical power outlet device and a module thereof. The electrical power outlet device includes an electrical power outlet section and a main body section. The electrical power outlet section has an electrical power outlet unit with a plurality of sockets, and an electric plug is inserted into the sockets and is remained firmly in an electrical power outlet. The main body section is connected with the electrical power outlet section and has a circuit device and an output unit, wherein the circuit device is connected with the corresponding plurality of sockets of the electrical power outlet unit to receive a power signal and converts the power signal to produce a converted signal, and the output unit is connected to the circuit device to send out a converted signal. | 2011-05-05 |
| 20110104950 | EXPANDABLE COMPUTER SYSTEM AND FASTENING DEVICE THEREOF - An expandable computer system and a fastening device are disclosed in this invention. The expandable computer system includes a computer, an expansion device and a rigid component. The expansion device includes a first holding portion disposed at a first side of the expansion device, and a first interface socket disposed at a second side of the expansion device. The computer includes a second holding portion and a second interface socket. The rigid component has two transmission plugs and a transmission circuit. The two transmission plugs are coupled with two terminals of the transmission circuit. When the first holding portion is connected with the second holding portion, the two transmission plugs are detachably connected with the first interface socket and the second interface socket to fasten the expansion device to the computer. | 2011-05-05 |
| 20110104951 | CONNECTOR - A connector is provided with a frame ( | 2011-05-05 |
| 20110104952 | CARD EDGE CONNECTOR - A card edge connector comprises a pair of mount members attached to the bottom of the insulating housing thereof. Each mount member comprises a body portion, at least one fitting nail connected to the body portion and configured to be disposed transversely for being soldered on a printed circuit board, and a tab portion connecting to the body portion and configured to be freely insertable into an aperture formed on the printed circuit board. | 2011-05-05 |
| 20110104953 | ELECTRICAL CONNECTOR HAVING OFFSET MOUNTING TERMINALS - In accordance with one embodiment, an electrical connector includes a housing that supports a plurality of electrical contacts. Each electrical contact defines a mating end and an opposing mounting end, and a plurality of mounting terminals disposed at the mounting end. The mounting terminals of each contact are arranged in at least one column extending along a longitudinal direction, such that each column is spaced along a lateral direction, and the mounting terminals of adjacent contacts are longitudinally offset. | 2011-05-05 |
| 20110104954 | Rotation axis, digital device and USB device - The invention relates to communications technologies and discloses a rotation axis, a digital device and a Universal Serial Bus (USB) device. The rotation axis includes a sleeve, an elastic body, an indented washer, and a movable support. The sleeve includes a lip and a cylinder. The elastic body, the indented washer, and the movable support are configured sequentially around the cylinder with the lip adjacent to the elastic body along the axial direction of the cylinder beginning with the lip. A number of concave indents are configured on one end-surface of the indented washer and distributed on a circle. The end-surface of the indented washer where the concave indents are configured contacts one end-surface of the movable support. A number of protrusions are configured on the end-surface of the movable support to mate the concave indents. In the invention, a rotation axis is constituted by a few parts including a sleeve, an elastic body, an indented washer, and a movable part. Therefore, the rotation axis is characterized by simple structure, small size, low cost, and good reliability. | 2011-05-05 |
| 20110104955 | IMPLANTABLE MEDICAL DEVICE HEADERS THAT FACILITATE DEVICE AND LEAD CONFIGURATION VARIANTS - Implantable medical devices include headers having various features such as a modular design whereby the header is constructed from a series of stacked contact modules. Additional features include a feedthrough where pins exiting a housing of the implantable medical device extend into the header to make direct electrical connection to electrical contacts present within the header where those electrical contacts directly engage electrical connectors of leads inserted into the header. Other features include electrical contacts that are relatively thin conductors on the order of 0.040 inches or less and may include radial protrusions where the radial protrusions establish contact with the electrical connectors of the lead. Furthermore, electrical contacts may be mounted within the header in a floating manner so that radial movement of the electrical contact may occur during lead insertion. | 2011-05-05 |
| 20110104956 | ELECTRICAL CONNECTOR WITH CONTACTS FIRMLY RETAINED IN HOUSING - An electrical connector ( | 2011-05-05 |
| 20110104957 | CONNECTOR AND DISPLAY APPARATUS HAVING THE SAME - A connector includes female and male connectors. The female connector includes a housing having a groove recessed from a front surface of the housing, a signal terminal including a signal contact section provided at a first wall of the groove and an external connection section connected with the signal contact section and protruding out of the housing through a rear surface of the housing, and a grounding terminal including a grounding contact section provided at an opposing wall facing the first wall of the groove and a grounding connection section connected with the grounding contact section, the grounding connection section extending out of the groove at the front surface of the housing. A display apparatus includes the female connector receiving an external signal, a printed circuit board provided on which with the female connector is mounted and including a driving circuit, and a display panel displaying an image according to a driving signal from the driving circuit. | 2011-05-05 |
| 20110104958 | ELECTRICAL CONNECTING MEMBER FOR SECONDARY BATTERY - Disclosed herein is a connection member for secondary batteries to achieve the electrical connection in a battery pack including two or more cylindrical secondary batteries in a physical contact manner, the connection member including an outer circumferential contact part contacting an electrode terminal of a lower battery cell along the outer circumferential region of the electrode terminal of the lower battery cell, such that the outer circumferential contact part can be electrically connected to the electrode terminal of the lower battery cell in a surface contact manner, for minimizing the change of resistance at the contact region against an external force and restraining a possibility that the electrode terminal of the lower battery cell is depressed, and a central contact part contacting an electrode terminal of an upper battery cell or the central region of a sidewall of the battery pack for providing an elastic contact force to the entire connection member mounted between the electrode terminals of the respective battery cells or between the electrode terminals of the battery cells and the sidewall of the battery pack. | 2011-05-05 |
| 20110104959 | PRESS-CONTACT POGO PIN CONNECTOR - A press-contact pogo pin connector is provided which has a machining cost lower than those of conventional connectors, can be easily reduced in height, and does not cause instantaneous interruption. A molded insulating housing has a cylinder hole in which a pin is installed, and the pin installed inside the cylinder hole is urged by a coil spring installed inside the cylinder hole so as to protrude from the housing. A flange portion on the rear side of the pin urged by the coil spring abuts against the peripheral portion of the front opening of the cylinder hole on the front side of the housing so that the pin is prevented from falling off. A contact integrally includes a substrate connection terminal portion and a contact spring portion that extends inside the cylinder hole and is brought into press-contact with the pin at all times. The contact is secured to the housing. | 2011-05-05 |
| 20110104960 | ELECTRICAL CONNECTION DEVICE - Electric connection device for connecting a conductor having at least one contact bush of a conductive material with a clearing for a contact spring and a contact spring disposed thereat which clamps a conductor plugged into the contact bush from a plug-in side against the inner wall of the contact bush wherein the contact spring is pivotable outwardly through the clearing. | 2011-05-05 |
| 20110104961 | EARTH TERMINAL - An earth terminal is disclosed. The earth terminal includes a fixing member fixed to a vehicle body by a bolt, a barrel member to which an earth wire is inserted and fixed, and a cut member for connecting the fixing member and the barrel member, in which the cut member is broken or disengaged by bending. Since the cut member is bent and broken, if necessary, the earth wire is easily and conveniently disengaged from the vehicle body to enhance a disengaging performance of a wire harness. | 2011-05-05 |
| 20110104962 | VEHICLE CONTROL DEVICE - A device for controlling a vehicle, in particular a watercraft with a drive system with an energy generating device including a combustion engine, an electric generator adapted to coact with said combustion engine, and a rectifier for rectifying the electrical energy; an energy storage device to store the electrical energy for energy output as and how required; and an energy distribution system for distributing the energy made available by the energy generating and/or the energy storage device to at least one electric motor used to drive a propeller, as well as to other electric power consumers. A central control unit is data-technically coupled with the energy generating device, the energy storage device and the energy distribution system to coordinate energy generation, storage and distribution. The central control device has output means for display of information to a user and/or input means ( | 2011-05-05 |
| 20110104963 | ELECTRICALLY POWERED WATERCRAFT - Improvements to electrically powered watercraft including kayaks are disclosed. The watercraft comprises a hull defining a cavity and a battery powered retractable propulsion unit. The retractable propulsion unit can be retracted into the cavity with powered or unpowered means. Various retractable propulsion units are disclosed, including propulsion units that are steerable wherein the thrust can be selectively directed. Specific embodiments to improve the steerability of electrically powered watercraft are disclosed. Mechanisms for disengaging the steering controls from the retractable propulsion units are also disclosed. Locking mechanisms for locking the retractable propulsion unit in an extended or fully retracted position are also disclosed. | 2011-05-05 |
| 20110104964 | MOUNT STRUCTURE OF OUTBOARD MOTOR - A mount structure of an outboard motor includes a first member, a second member, a buffer member, a sandwiching member, and a second elastic member. A propulsive force generated by a propeller of the outboard motor is applied to the first member. The second member is arranged such that the propulsive force is transmitted to the second member via the first member. The buffer member includes an outer sleeve fixed to the first member, an inner sleeve inserted in the outer sleeve, a first elastic member fixed to the outer sleeve and the inner sleeve. The sandwiching member is arranged to sandwich the second member and the inner sleeve in a direction of action of the propulsive force. The second elastic member is fixed to the first member. The second elastic member is opposed to the sandwiching member across a gap in the direction of action. | 2011-05-05 |
| 20110104965 | BOAT PROPELLING APPARATUS - A boat propelling apparatus includes an outboard engine including an outboard engine main body arranged to propel a boat; a trim bracket which includes mutually opposed platy side portions and a platy front portion connecting the side portions with each other, and arranged to pivotably support the outboard engine main body; and a clamp bracket which is mountable to and demountable to a boat edge and is connected with the trim bracket via one of the side portions and the front portion. The clamp bracket includes a swivel bracket mounted to the trim bracket and a holding portion which holds the swivel bracket. The swivel bracket has a convex portion whereas the holding portion has a concave portion. The concave portion and the convex portion have an identical curvature. | 2011-05-05 |
| 20110104966 | BOAT PROPELLING APPARATUS AND BOAT - A boat propelling apparatus is compact and capable of making an adjustment on its engine output characteristic. The boat propelling apparatus includes an engine, a surge tank and an intake manifold. The intake manifold includes therein an internal space for air to flow from the surge tank, and air intake passages branching from the internal space. The intake manifold includes recesses and a boss arranged to fit an extension member to define extension passages inside the internal space. | 2011-05-05 |
| 20110104967 | Flotation Device - A device which will act efficiently as a float for any article (e.g. keys, mobile telephone, wallet) attached thereto when dropped into water comprises an inflatable bag ( | 2011-05-05 |
| 20110104968 | RETRACTABLE SWIM FINS - Retractable swim fins that attach to the legs of a swimmer to aid movement through the water. In one example embodiment, a retractable swim fin includes an upper support frame, a lower support frame, and a sliding assembly connecting the upper support frame to the lower support frame. The upper support frame is configured to be attached to the front of a swimmer's lower leg. The lower support frame includes means for aquatic propulsion and is configured to extend, in a swimming position, to a position beneath the sole of the swimmer's foot. The lower support frame is also configured to retract, in a walking position, to a position above the sole of the swimmer's foot. The walking position enables the swimmer to walk barefoot on a surface without the lower support frame substantially contacting the surface. The sliding assembly is configured to allow the lower support frame to retract. | 2011-05-05 |
| 20110104969 | Body board - The present invention describes a versatile body board having a fore section and an aft section suitable for wave boarding. The multi-purpose board of the present invention is provided with an aft section having crotch-sized width in order to allow a user's legs to kick within a general lateral outline of a wider fore section. The combination board can be utilized for wave boarding and body boarding. | 2011-05-05 |
| 20110104970 | LOW LINT FIBROUS STRUCTURES AND METHODS FOR MAKING SAME - Fibrous structures that exhibit low dry lint scores, and more particularly fibrous structures containing filaments and solid additives that exhibit low dry lint scores and methods for making such fibrous structures are provided. | 2011-05-05 |
| 20110104971 | Fibrous article with fabric-like surface and process of manufacturing same - A fibrous article having a fabric-like surface and process of manufacturing same are provided. The fibrous article includes an outer fabric substrate; an intermediate fiber substrate; and an inner thermoplastic resin layer. A first thermoplastic resin is formed between the fabric substrate and the fiber substrate. The first thermoplastic resin is further formed between the fiber substrate and the thermoplastic resin layer. The thermoplastic resin layer is formed by injection molding by causing a second thermoplastic resin to react with the first thermoplastic resin. A person may have the feeling of touching fabric when touches the fibrous article. | 2011-05-05 |
| 20110104972 | PROTECTIVE BARRIER HAVING SELF-DECONTAMINATING PROPERTIES - A protective material includes a porous substrate having cross-linked self-decontaminating polymer grafted thereon, the cross-linked self-decontaminating polymer having been converted after grafting to activate self-decontaminating function. The cross-linked self-decontaminating polymer provides the protective material with reversible swelling ability to block the porous substrate when the protective barrier is contacted by liquids. | 2011-05-05 |
| 20110104973 | Manufacturing Method for Flexible Display Apparatus - A manufacturing method for flexible display apparatus includes following steps. A carrier frame is formed on a rigid substrate. A flexible substrate is formed on the carrier substrate, wherein a border of the flexible substrate is supported by the carrier frame. A display unit is formed on the flexible substrate. At least a portion of the flexible substrate is separated from the carrier frame. In the manufacturing method, the flexible substrate and the carrier frame can be easily separated. | 2011-05-05 |
| 20110104974 | LIQUID CRYSTAL DISPLAY DEVICE HAVING PATTERNED SPACERS AND METHOD OF FABRICATING THE SAME - A liquid crystal display device includes first and second substrates, a black matrix on the second substrate, the black matrix including a plurality of open portions corresponding to pixel regions and a plurality of holes disposed adjacent to the plurality of open portions, color filter layers on the black matrix, and a plurality of patterned spacers corresponding to each of the plurality of holes between the first and the second substrates. | 2011-05-05 |
| 20110104975 | METHOD OF MANUFACTURING DISPLAY PANEL - A cutting step of forming a crack (C) above at least one side of a sealant ( | 2011-05-05 |
| 20110104976 | CARBON NANOTUBE ELECTRON GUN - An electron gun, an electron source for an electron gun, an extractor for an electron gun, and a respective method for producing the electron gun, the electron source and the extractor are disclosed. Embodiments provide an electron source utilizing a carbon nanotube (CNT) bonded to a substrate for increased stability, reliability, and durability. An extractor with an aperture in a conductive material is used to extract electrons from the electron source, where the aperture may substantially align with the CNT of the electron source when the extractor and electron source are mated to form the electron gun. The electron source and extractor may have alignment features for aligning the electron source and the extractor, thereby bringing the aperture and CNT into substantial alignment when assembled. The alignment features may provide and maintain this alignment during operation to improve the field emission characteristics and overall system stability of the electron gun. | 2011-05-05 |
