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18th week of 2018 patent applcation highlights part 67
Patent application number
Title
Published
20180122710
GATE HEIGHT AND SPACER UNIFORMITY
2018-05-03
20180122711
DUAL LINER SILICIDE
2018-05-03
20180122712
POROUS SILICON RELAXATION MEDIUM FOR DISLOCATION FREE CMOS DEVICES
2018-05-03
20180122713
SELECTIVE SURFACE TREATMENT OF THALLIUM BROMIDE (TLBR)-BASED DETECTORS TO IMPROVE LONGEVITY AND/OR RESTORE OPERATIONAL CAPACITY THEREOF
2018-05-03
20180122714
FLIPPED VERTICAL FIELD-EFFECT-TRANSISTOR
2018-05-03
20180122715
SEMICONDUCTOR DEVICE
2018-05-03
20180122716
ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICATIONS
2018-05-03
20180122717
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2018-05-03
20180122718
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2018-05-03
20180122719
Apparatus for Manufacturing a Thermoelectric Module
2018-05-03
20180122720
Package with vertically spaced partially encapsulated contact structures
2018-05-03
20180122721
PLUG STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME
2018-05-03
20180122722
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
2018-05-03
20180122723
SEMICONDUCTOR DEVICE
2018-05-03
20180122724
Semiconductor Device Having Leadframe With Pressure-Absorbing Pad Straps
2018-05-03
20180122725
SEMICONDUCTOR DIE PACKAGE AND MANUFACTURING METHOD
2018-05-03
20180122726
SEMICONDUCTOR DEVICE
2018-05-03
20180122727
SEMICONDUCTOR DEVICE
2018-05-03
20180122728
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME
2018-05-03
20180122729
HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE
2018-05-03
20180122730
PRODUCING WAFER LEVEL PACKAGING USING LEADFRAME STRIP AND RELATED DEVICE
2018-05-03
20180122731
PLATED DITCH PRE-MOLD LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD OF MAKING SAME
2018-05-03
20180122732
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-05-03
20180122733
METHOD FOR MANUFACTURING CIRCUIT REDISTRIBUTION STRUCTURE
2018-05-03
20180122734
PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME
2018-05-03
20180122735
MODULE ASSEMBLY
2018-05-03
20180122736
GLASS FIBER REINFORCED PACKAGE SUBSTRATE
2018-05-03
20180122737
FABRICATING UNIQUE CHIPS USING A CHARGED PARTICLE MULTI-BEAMLET LITHOGRAPHY SYSTEM
2018-05-03
20180122738
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2018-05-03
20180122739
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE
2018-05-03
20180122740
Forming a Stacked Capacitor
2018-05-03
20180122741
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
2018-05-03
20180122742
SEMICONDUCTOR MEMORY DEVICES
2018-05-03
20180122743
METHOD FOR FABRICATING A LOCAL INTERCONNECT IN A SEMICONDUCTOR DEVICE
2018-05-03
20180122744
AVD HARDMASK FOR DAMASCENE PATTERNING
2018-05-03
20180122745
INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE
2018-05-03
20180122746
COOLER WITH EMI-LIMITING INDUCTOR
2018-05-03
20180122747
SEMICONDUCTOR PACKAGE ASSEMBLY
2018-05-03
20180122748
FLOATING PACKAGE STIFFENER
2018-05-03
20180122749
SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
2018-05-03
20180122750
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
2018-05-03
20180122751
Ring Structures in Device Die
2018-05-03
20180122752
IC with Insulating Trench and Related Methods
2018-05-03
20180122753
DEVICE COMPRISING A STACK OF ELECTRONIC CHIPS
2018-05-03
20180122754
ON-DIE SEAL RINGS
2018-05-03
20180122755
RADIO FREQUENCY (RF) APPARATUS
2018-05-03
20180122756
PACKAGING PROCESS OF ELECTRONIC COMPONENT
2018-05-03
20180122757
BONDING PAD STRUCTURE HAVING ISLAND PORTIONS AND METHOD FOR MANUFACTURING THE SAME
2018-05-03
20180122758
DISPLAY APPARATUS AND METHOD FOR BINDING THE SAME
2018-05-03
20180122759
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR
2018-05-03
20180122760
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
2018-05-03
20180122761
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FORMING THE SAME
2018-05-03
20180122762
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIATED SYSTEMS AND METHODS
2018-05-03
20180122763
LEADLESS PACKAGE WITH NON-COLLAPSIBLE BUMP
2018-05-03
20180122764
CHIP PACKAGE STRUCTURE WITH BUMP
2018-05-03
20180122765
BONDING WIRE FOR SEMICONDUCTOR DEVICE
2018-05-03
20180122766
SEMICONDUCTOR DEVICE
2018-05-03
20180122767
ELECTRONIC DEVICE
2018-05-03
20180122768
SPRING ELEMENT FOR A POWER SEMICONDUCTOR MODULE
2018-05-03
20180122769
Fog Bonding Device and Method Thereof
2018-05-03
20180122770
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC CHIP AND A CARRIER SUBSTRATE AND ELECTRONIC DEVICE
2018-05-03
20180122771
SEMICONDUCTOR PACKAGES HAVING ASYMMETRIC CHIP STACK STRUCTURE
2018-05-03
20180122772
SEMICONDUCTOR PACKAGES
2018-05-03
20180122773
SEMICONDUCTOR DEVICE
2018-05-03
20180122774
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
2018-05-03
20180122775
SEMICONDUCTOR DEVICE STRUCTURE
2018-05-03
20180122776
ELECTRONIC CIRCUIT BOARD, LAMINATED BOARD, AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT BOARD
2018-05-03
20180122777
HYBRID MICRO-CIRCUIT DEVICE WITH STACKED CHIP COMPONENTS
2018-05-03
20180122778
INTEGRATED CIRCUIT MODULE AND METHOD OF FORMING SAME
2018-05-03
20180122779
STACKED MEMORY WITH INTERFACE PROVIDING OFFSET Interconnect S
2018-05-03
20180122780
CHIP PACKAGE STRUCTURE WITH MOLDING LAYER
2018-05-03
20180122781
Semiconductor Device and Method of Manufacture
2018-05-03
20180122782
Power Module
2018-05-03
20180122783
LIGHT EMITTING DEVICE
2018-05-03
20180122784
COMPACT INTEGRATED DEVICE PACKAGES
2018-05-03
20180122785
DIRECT BANDGAP SEMICONDUCTOR BONDED TO SILICON PHOTONICS
2018-05-03
20180122786
DISPLAY DEVICES AND METHODS FOR FORMING THE SAME
2018-05-03
20180122787
DISPLAY DEVICE AND METHOD FOR FORMING THE SAME
2018-05-03
20180122788
LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
2018-05-03
20180122789
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
2018-05-03
20180122790
SEMICONDUCTOR PACKAGE
2018-05-03
20180122791
Package Structure and Methods of Forming the Same
2018-05-03
20180122792
VERTICAL TRANSISTORS WITH MERGED ACTIVE AREA REGIONS
2018-05-03
20180122793
MEMORY CELLS INCLUDING VERTICAL NANOWIRE TRANSISTORS
2018-05-03
20180122794
ELECTROSTATIC PROTECTION DEVICE OF LDMOS SILICON CONTROLLED STRUCTURE
2018-05-03
20180122795
MEMORY CELL WITH ASYMMETRICAL TRANSISTOR, ASYMMETRICAL TRANSISTOR AND METHOD OF FORMING
2018-05-03
20180122796
FORMING ON-CHIP METAL-INSULATOR-SEMICONDUCTOR CAPACITOR
2018-05-03
20180122797
FORMING ON-CHIP METAL-INSULATOR-SEMICONDUCTOR CAPACITOR
2018-05-03
20180122798
Methods of Forming an Array Comprising Pairs of Vertically Opposed Capacitors and Arrays Comprising Pairs of Vertically Opposed Capacitors
2018-05-03
20180122799
JFET AND LDMOS TRANSISTOR FORMED USING DEEP DIFFUSION REGIONS
2018-05-03
20180122800
FABRICATION OF VERTICAL FIN FIELD EFFECT TRANSISTORS HAVING TOP AIR SPACERS AND A SELF-ALIGNED TOP JUNCTION
2018-05-03
20180122801
FIN CUT DURING REPLACEMENT GATE FORMATION
2018-05-03
20180122802
METHODS FOR FABRICATING FIN FIELD EFFECT TRANSISTORS
2018-05-03
20180122803
Circuit Arrangement Having a First Semiconductor Switch and a Second Semiconductor Switch
2018-05-03
20180122804
SPECIAL CONSTRUCT FOR CONTINUOUS NON-UNIFORM ACTIVE REGION FINFET STANDARD CELLS
2018-05-03
20180122805
Semiconductor Device and Fabricating the Same
2018-05-03
20180122806
METHOD TO IMPROVE THE HIGH K QUALITY FOR FINFET
2018-05-03
20180122807
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE
2018-05-03
20180122808
METHODS AND APPARATUSES INCLUDING AN ACTIVE AREA OF A TAP INTERSECTED BY A BOUNDARY OF A WELL
2018-05-03
20180122809
DYNAMIC RANDOM ACCESS MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-05-03