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18th week of 2013 patent applcation highlights part 49
Patent application numberTitlePublished
20130109149Methods for Forming Resistive-Switching Metal Oxides for Nonvolatile Memory Elements2013-05-02
20130109150SYSTEMS AND METHODS FOR FABRICATING SELF-ALIGNED MEMORY CELL2013-05-02
20130109151METHOD FOR FORMING VOID-FREE DIELECTRIC LAYER2013-05-02
20130109152METHOD OF MAKING LOWER PARASITIC CAPACITANCE FINFET2013-05-02
20130109153MULTIPLE SEAL RING STRUCTURE2013-05-02
20130109154METHOD AND APPARATUS FOR PRODUCING SILICON NITRIDE FILM2013-05-02
20130109155METHOD OF FORMING SEED LAYER AND METHOD OF FORMING SILICON-CONTAINING THIN FILM2013-05-02
20130109156Indium Phosphide Substrate Manufacturing Method and Epitaxial Wafer Manufacturing Method2013-05-02
20130109157NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME2013-05-02
20130109158Methods of Fabricating Semiconductor Devices Using Mask Shrinking2013-05-02
20130109159GAS DISPERSION APPARATUS2013-05-02
20130109160METHODS FOR DEPOSITING THIN FILMS COMPRISING INDIUM NITRIDE BY ATOMIC LAYER DEPOSITION2013-05-02
20130109161METAL ORGANIC CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD2013-05-02
20130109163FABRICATING METHOD OF SEMICONDUCTOR ELEMENT2013-05-02
20130109164REMOTE PLASMA RADICAL TREATMENT OF SILICON OXIDE2013-05-02
20130109165METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH VERTICAL GATE TRANSISTOR2013-05-02
20130109166METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH CONTROLLED P-CHANNEL THRESHOLD VOLTAGE2013-05-02
20130109167NANOWIRE EFUSES2013-05-02
20130109168METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE2013-05-02
20130109169METHODS OF MANUFACTURING STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE2013-05-02
20130109170DEPOSITION METHOD AND A DEPOSITION APPARATUS OF FINE PARTICLES, A FORMING METHOD AND A FORMING APPARATUS OF CARBON NANOTUBES, AND A SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME2013-05-02
20130109171Method for etching substrate2013-05-02
20130109172HIGH TEMPERATURE TUNGSTEN METALLIZATION PROCESS2013-05-02
20130109173METHODS FOR REMOVING SILICON NITRIDE SPACER, FORMING TRANSISTOR AND FORMING SEMICONDUCTOR DEVICES2013-05-02
20130109174Methods of Forming Conductive Structures Using a Spacer Erosion Technique2013-05-02
20130109175METHOD OF FABRICATING SEMICONDUCTOR DEVICES2013-05-02
20130109176Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation2013-05-02
20130109177SEMICONDUCTOR DEVICE MANUFACTURING METHOD2013-05-02
20130109178Semiconductor Element Having a Conductive Via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via2013-05-02
20130109179SEMICONDUCTOR PROCESS, SEMICONDUCTOR ELEMENT AND PACKAGE HAVING SEMICONDUCTOR ELEMENT2013-05-02
20130109180METHOD FOR POLISHING SILICON WAFER, AND POLISHING SOLUTION FOR USE IN THE METHOD2013-05-02
20130109181Method Of Polishing A Substrate2013-05-02
20130109182Method Of Polishing Using Tunable Polishing Formulation2013-05-02
20130109183Multilayer Construction2013-05-02
20130109184PLASMA ETCHING METHOD2013-05-02
20130109185METHOD OF FABRICATING MINIATURIZED SEMICONDUCTOR OR OTHER DEVICE2013-05-02
20130109186METHOD OF FORMING SEMICONDUCTOR DEVICES USING SMT2013-05-02
20130109187POST ETCH TREATMENT (PET) OF A LOW-K DIELECTRIC FILM2013-05-02
20130109188PLASMA ETCH PROCESSES FOR BORON-DOPED CARBONACEOUS MASK LAYERS2013-05-02
20130109189SYSTEM ARCHITECTURE FOR PLASMA PROCESSING SOLAR WAFERS2013-05-02
20130109190PULSED PLASMA WITH LOW WAFER TEMPERATURE FOR ULTRA THIN LAYER ETCHES2013-05-02
20130109191METHOD TO PREPARE SEMI-CONDUCTOR DEVICE COMPRISING A SELECTIVE ETCHING OF A SILICIUM-GERMANIUM LAYER2013-05-02
20130109192SUSCEPTOR WITH RING TO LIMIT BACKSIDE DEPOSITION2013-05-02
20130109193SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD2013-05-02
20130109194POLISHING LIQUID COMPOSITION2013-05-02
20130109195FILM FORMING APPARATUS AND METHOD OF OPERATING THE SAME2013-05-02
20130109196FILM FORMING APPARATUS AND METHOD OF OPERATING THE SAME2013-05-02
20130109197METHOD OF FORMING SILICON OXIDE FILM2013-05-02
20130109198HIGH CARBON CONTENT MOLECULES FOR AMORPHOUS CARBON DEPOSITION2013-05-02
20130109199METHOD FOR FABRICATING OXIDES/SEMICONDUCTOR INTERFACES2013-05-02
20130109200METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE2013-05-02
20130109201ELECTRICAL POWER CONNECTOR2013-05-02
20130109203CONNECTOR, ELECTRICAL CONNECTION BOX AND CONNECTOR MANUFACTURING METHOD2013-05-02
20130109204SOCKET AND POWER ADAPTER EMPLOYING SAME2013-05-02
20130109205BUS BAR ARRANGEMENTS FOR MULTIPLE OUTLET ELECTRICAL RECEPTACLES2013-05-02
20130109206USB DEVICE AND METHOD OF MOVING USB CONNECTOR2013-05-02
20130109207TAMPER RESISTANT ELECTRICAL WIRING DEVICE SYSTEM2013-05-02
20130109208CARD EDGE CONNECTOR WITH IMPROVED LOCK MECHANISM2013-05-02
20130109209HOUSING FOR AN ELECTRONIC CIRCUIT2013-05-02
20130109210COAXIAL CONNECTOR'S PLUG AND SOCKET AS WELL AS COAXIAL CONNECTOR2013-05-02
20130109211CONNECTOR AND WATERPROOF CONNECTOR2013-05-02
20130109212WATERPROOF CONNECTOR2013-05-02
20130109213SAFETY SOCKET2013-05-02
20130109214CARD EDGE CONNECTOR2013-05-02
20130109215LEVER TYPE CONNECTOR2013-05-02
20130109216TOP LATCHING ASSEMBLY AND CONNECTOR2013-05-02
20130109217FIXING STRUCTURE WITH INTERFACE CARD MODULE AND FIXING STRUCTURE THEREOF2013-05-02
20130109218CONNECTOR2013-05-02
20130109219MODULAR ELECTRICAL CONNECTOR MODULE2013-05-02
20130109220ATTACHABLE PLUG-TYPE CONNECTOR2013-05-02
20130109221ELECTRICAL TERMINAL AND RECEPTACLE ASSEMBLY2013-05-02
20130109222CONNECTOR RETAINING DEVICE2013-05-02
20130109223POWER CONNECTOR2013-05-02
20130109224ELECTRICAL POWER CONNECTOR2013-05-02
20130109225ELECTRICAL CONNECTOR HAVING LOW PROFILE CHARACTERISTICS2013-05-02
20130109226CONNECTION ARRANGEMENT, AND ALSO A HOLDING ELEMENT FOR PURPOSES OF CONNECTING AN ELECTRICAL LINE TO A COMPONENT SECTION2013-05-02
20130109227ELECTRONIC ACCESSORIES FOR DIGITAL MUSIC PLAYERS AND RELATED METHODS2013-05-02
20130109228COAXIAL CONNECTOR2013-05-02
20130109229COAXIAL CONNECTOR2013-05-02
20130109230CONTINUITY MAINTAINING BIASING MEMBER2013-05-02
20130109231COAXIAL CONNECTOR2013-05-02
20130109232ELECTRICAL CONNECTOR WITH HYBRID SHIELD2013-05-02
20130109233USB FEMALE CONNECTOR2013-05-02
20130109234CAPACITOR2013-05-02
20130109235THUMB DRIVE CHASSIS STRUCTURE2013-05-02
20130109236MODULAR OPEN FUSE HOLDER WITH MULTI-STAGE POSITIONABLE COVER2013-05-02
20130109237ELECTRICAL TERMINAL AND RECEPTACLE ASSEMBLY2013-05-02
20130109238Electrical Connector with Grounding Contact Having Forked Soldering Branches2013-05-02
20130109239ELECTRICAL POWER CONNECTOR2013-05-02
20130109240CARD EDGE CONNECTOR2013-05-02
20130109241ELECTRICAL POWER CONNECTOR2013-05-02
20130109242Cable Connector with Inner Circuit Board for Connecting with Cables2013-05-02
20130109243Connector2013-05-02
20130109244ELECTRICAL CONNECTOR ASSEMBLY2013-05-02
20130109245ELECTRICAL CONNECTOR ASSEMBLY2013-05-02
20130109246ELECTRICAL CONNECTOR WITH REDUCED NORMAL FORCE2013-05-02
20130109247CONNECTOR2013-05-02
20130109248SPLIT JACK ASSEMBLIES AND METHODS FOR MAKING THE SAME2013-05-02
20130109249Solar Grounding Spring2013-05-02
20130109250FEMALE TERMINAL FITTING2013-05-02
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