18th week of 2013 patent applcation highlights part 17

Patent application number	Title	Published
18th week of 2013 patent applcation highlights part 17
20130105897	Nanowire FET and FINFET Hybrid Technology	2013-05-02
20130105898	Recessed Single Crystalline Source and Drain For Semiconductor-On-Insulator Devices	2013-05-02
20130105899	INPUT/OUTPUT ELECTROSTATIC DISCHARGE DEVICE WITH REDUCED JUNCTION BREAKDOWN VOLTAGE	2013-05-02
20130105900	Methods of Forming PFET Devices With Different Structures and Performance Characteristics	2013-05-02
20130105901	SEMICONDUCTOR DEVICE WITH METAL GATE ELECTRODE AND HIGH-K DIELECTRIC MATERIAL AND METHOD FOR FABRICATING THE SAME	2013-05-02
20130105902	NONVOLATILE SEMICONDUCTOR MEMORY DEVICE	2013-05-02
20130105903	SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THEREOF	2013-05-02
20130105904	RADIATION HARDENED INTEGRATED CIRCUIT	2013-05-02
20130105905	SEMICONDUCTOR DEVICE WITH METAL GATE AND HIGH-K DIELECTRIC LAYER, CMOS INTEGRATED CIRCUIT, AND METHOD FOR FABRICATING THE SAME	2013-05-02
20130105906	CMOS Device Having Dual Metal Gates and Method of Manufacturing the Same	2013-05-02
20130105907	MOS DEVICE AND METHOD OF MANUFACTURING THE SAME	2013-05-02
20130105908	SEMICONDUCTOR DEVICE	2013-05-02
20130105909	HIGH VOLTAGE CMOS WITH TRIPLE GATE OXIDE	2013-05-02
20130105910	Remote Doped High Performance Transistor Having Improved Subthreshold Characteristics	2013-05-02
20130105911	SEMICONDUCTOR DEVICE	2013-05-02
20130105912	SEMICONDUCTOR DEVICE	2013-05-02
20130105913	Current Control Semiconductor Element and Control Device Using the Same	2013-05-02
20130105914	STRUCTURE OF FIELD EFFECT TRANSISTOR WITH FIN STRUCTURE AND FABRICATING METHOD THEREOF	2013-05-02
20130105915	METAL OXIDE SEMICONDUCTOR DEVICE HAVING A PREDETERMINED THRESHOLD VOLTAGE AND A METHOD OF MAKING	2013-05-02
20130105916	HIGH SELECTIVITY NITRIDE ETCH PROCESS	2013-05-02
20130105917	Methods of Epitaxially Forming Materials on Transistor Devices	2013-05-02
20130105918	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF	2013-05-02
20130105919	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME	2013-05-02
20130105920	SEMICONDUCTOR STRUCTURE	2013-05-02
20130105921	MICROSYSTEM DEVICE AND METHODS FOR FABRICATING THE SAME	2013-05-02
20130105922	SEMICONDUCTOR PRESSURE SENSOR AND METHOD OF MANUFACTURING SEMICONDUCTOR PRESSURE SENSOR	2013-05-02
20130105923	DEEP WELL PROCESS FOR MEMS PRESSURE SENSOR	2013-05-02
20130105924	SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS	2013-05-02
20130105925	Integrated Die-Level Cameras And Methods Of Manufacturing The Same	2013-05-02
20130105926	BACK SIDE ILLUMINATION IMAGE SENSOR AND MANUFACTURING METHOD THEREOF	2013-05-02
20130105927	PHOTOELECTRIC CONVERSION ELEMENT	2013-05-02
20130105928	BACKSIDE-THINNED IMAGE SENSOR USING Al2O3 SURFACE PASSIVATION	2013-05-02
20130105929	RESIN COMPOSITION	2013-05-02
20130105930	METHOD FOR MAKING SEMICONDUCTOR LIGHT DETECTION DEVICES	2013-05-02
20130105931	SOLID-STATE IMAGING APPARATUS	2013-05-02
20130105932	METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE	2013-05-02
20130105933	SEMICONDUCTOR APPARATUS	2013-05-02
20130105934	SEMICONDUCTOR DEVICE	2013-05-02
20130105935	SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR DESIGNING THE SAME	2013-05-02
20130105936	SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING IMPROVED INTERCONNECT ACCURACY NEAR CELL BOUNDARIES	2013-05-02
20130105937	SIMPLIFIED PITCH DOUBLING PROCESS FLOW	2013-05-02
20130105938	DEVICE MATCHING LAYOUT AND METHOD FOR IC	2013-05-02
20130105939	SEMICONDUCTOR DEVICE	2013-05-02
20130105940	SEMICONDUCTOR DEVICE HAVING A FUSE ELEMENT	2013-05-02
20130105941	SEMICONDUCTOR DEVICE INCLUDING IN WAFER INDUCTORS, RELATED METHOD AND DESIGN STRUCTURE	2013-05-02
20130105942	FINFET DEVICES	2013-05-02
20130105943	PACKAGING SUBSTRATE HAVING EMBEDDED CAPACITORS AND FABRICATION METHOD THEREOF	2013-05-02
20130105944	METAL CAPACITOR DESIGN FOR IMPROVED RELIABILITY AND GOOD ELECTRICAL CONNECTION	2013-05-02
20130105945	MULTI-JUNCTION PHOTODIODE IN APPLICATION OF MOLECULAR DETECTION AND DISCRIMINATION, AND METHOD FOR FABRICATING THE SAME	2013-05-02
20130105946	SEMICONDUCTOR DEVICE INCLUDING GROUP III-V COMPOUND SEMICONDUCTOR LAYER, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE	2013-05-02
20130105947	HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SEMICONDUCTOR SUBSTRATE	2013-05-02
20130105948	PROCESS FOR IMPROVING CRITICAL DIMENSION UNIFORMITY OF INTEGRATED CIRCUIT ARRAYS	2013-05-02
20130105949	LAMINATED SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME	2013-05-02
20130105950	3D CHIP PACKAGE WITH SHIELDED STRUCTURES	2013-05-02
20130105951	BLOCK POWER SWITCH WITH EMBEDDED ELECTROSTATIC DISCHARGE (ESD) PROTECTION AND ADAPTIVE BODY BIASING	2013-05-02
20130105952	SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF	2013-05-02
20130105953	POWER MODULE PACKAGE	2013-05-02
20130105954	SEMICONDUCTOR PACKAGE	2013-05-02
20130105955	SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE MODULE HAVING THE SAME	2013-05-02
20130105956	POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME	2013-05-02
20130105957	LEAD FRAME SEMICONDUCTOR DEVICE	2013-05-02
20130105958	Compact Wirebonded Power Quad Flat No-Lead (PQFN) Package	2013-05-02
20130105960	Low Stray Inductance Power Module	2013-05-02
20130105961	LOW INDUCTANCE POWER MODULE	2013-05-02
20130105962	THERMAL DISSIPATION IN CHIP	2013-05-02
20130105963	Semiconductor Device and Method of Forming Thermal Interface Material and Heat Spreader Over Semiconductor Die	2013-05-02
20130105964	Semiconductor Device	2013-05-02
20130105965	CHIP	2013-05-02
20130105966	THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION	2013-05-02
20130105967	Semiconductor Die and Method of Forming Sloped Surface in Photoresist Layer to Enhance Flow of Underfill Material Between Semiconductor Die and Substrate	2013-05-02
20130105968	TSV Backside Processing Using Copper Damascene Interconnect Technology	2013-05-02
20130105969	SOLDER BONDING PROCESS FORMING A SEMICONDUCTOR CHIP IN MULTIPLE STAGES ON A 3-DIMENSIONAL STACKED ASSEMBLY	2013-05-02
20130105970	Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe	2013-05-02
20130105971	Solder Interconnect Pads with Current Spreading Layers	2013-05-02
20130105972	STACKED PACKAGES USING LASER DIRECT STRUCTURING	2013-05-02
20130105973	EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE	2013-05-02
20130105974	SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN METAL LAYERS	2013-05-02
20130105975	SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME	2013-05-02
20130105976	METHOD TO ALIGN MASK PATTERNS	2013-05-02
20130105977	Electronic Device and Method for Fabricating an Electronic Device	2013-05-02
20130105978	SILICON SUBMOUNT FOR LIGHT EMITTING DIODE AND METHOD OF FORMING THE SAME	2013-05-02
20130105979	Package on Package Devices and Methods of Packaging Semiconductor Dies	2013-05-02
20130105980	SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR PRODUCING SAME, AND METHOD OF BONDING ELECTRONIC COMPONENT	2013-05-02
20130105981	FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING	2013-05-02
20130105982	LAND GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE	2013-05-02
20130105983	SEMICONDUCTOR DEVICE AND METHOD FORMING PATTERNS WITH SPACED PADS IN TRIM REGION	2013-05-02
20130105984	SEMICONDUCTOR DEVICE PACKAGE ADAPTER	2013-05-02
20130105985	SEMICONDUCTOR DEVICE	2013-05-02
20130105986	SEMICONDUCTOR DEVICE WITH VIAS ON A BRIDGE CONNECTING TWO BUSES	2013-05-02
20130105987	LAMINATE INTERCONNECT HAVING A COAXIAL VIA STRUCTURE	2013-05-02
20130105988	SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP WITH THROUGH OPENING	2013-05-02
20130105989	Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect	2013-05-02
20130105990	SEMICONDUCTOR DEVICE	2013-05-02
20130105991	EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE	2013-05-02
20130105992	SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME	2013-05-02
20130105993	SEMICONDUCTOR DEVICE INTERCONNECT	2013-05-02
20130105994	HEATSINK ATTACHMENT MODULE	2013-05-02
20130105995	SEMICONDUCTOR DEVICE STRUCTURES AND THEIR FABRICATION	2013-05-02
20130105996	LOW ENERGY ETCH PROCESS FOR NITROGEN-CONTAINING DIELECTRIC LAYER	2013-05-02
20130105997	SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET	2013-05-02

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