17th week of 2022 patent applcation highlights part 78 |
Patent application number | Title | Published |
20220132673 | METHOD FOR OBTAINING INFORMATION ABOUT A LAYER OF AN ORGANIC SOLDERABILITY PRESERVATIVE ON A PRINTED CIRCUIT BOARD - A method for obtaining information about a layer of an organic solderability preservative on a printed circuit board, the method including
| 2022-04-28 |
20220132674 | PRINTED WIRING BOARD - A printed wiring board to which an electronic component is soldered by a jet soldering device, the printed wiring board includes as insulating substrate, a land provided on one surface of the insulating substrate, the one surface serving as a soldering surface, a through hole provided in the land and passing through the insulating substrate in a thickness direction of the insulating substrate. A lead of the electronic component is inserted into the through hole from the other surface of the insulating substrate, the other surface is opposed to the one surface, and an auxiliary conductor is provided in a region of a plane on the one surface, the region is adjacent to the land in a predetermined direction. The auxiliary conductor is provided to have a width equal to a width of the land in the same region of the plane. | 2022-04-28 |
20220132675 | EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer. | 2022-04-28 |
20220132676 | METHOD FOR MANUFACTURING CIRCUIT BOARD INCLUDING METAL-CONTAINING LAYER - Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c). | 2022-04-28 |
20220132677 | Rogowski Coil Integrated in Glass Substrate - A method of forming a current measurement device includes providing a glass substrate having first and second substantially planar surfaces that are opposite one another, forming a plurality of through-vias in the glass substrate that each extend between the first and second substantially planar surfaces, and forming conductive tracks on the glass substrate that connect adjacent ones of the through-vias together. Forming the plurality of through-vias includes applying radiation to the glass substrate, and the conductive tracks and the through-vias collectively form a coil structure in the glass substrate. | 2022-04-28 |
20220132678 | SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUIT BOARDS - A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate. | 2022-04-28 |
20220132679 | BENDABLE SUPPORTING STRUCTURE AND DISPLAY DEVICE - The present disclosure provides a bendable support structure and a flexible display device. The supporting structure includes a flexible substrate. The flexible substrate includes a bendable region, transition regions and non-bendable regions. The non-bendable regions are disposed on opposite sides of the bendable region. The bendable regions are connected to each of the non-bendable regions through one of the transition regions. First supporting units are fixedly disposed on each of the non-bendable regions. Second supporting units are disposed on each of the transition regions and connected to the first supporting units. A thickness of the second supporting unit gradually decrease from an end close to the non-bendable region to an end close to the bendable region | 2022-04-28 |
20220132680 | SUPPORT FOR FLEXIBLE DISPLAY MODULE, DISPLAY MODULE AND DEVICE - The disclosure provides a support for a flexible display module, a display module and a device. The support for the flexible display module comprises metal layers and supporting layers arranged with one above another, and is characterized in that each metal layer comprises non-patterned areas and patterned areas, the patterned area is a notch and/or a micro-hole etching area arranged on the metal layer, and a filling layer is arranged in the notch. | 2022-04-28 |
20220132681 | DISPLAY ASSEMBLIES INCORPORATING ELECTRIC VEHICLE CHARGING EQUIPMENT - A display assembly with integrated electric vehicle charging equipment includes a first and second side assembly connected to a structural frame, each including an electronic display subassembly located behind a cover. The electric vehicle charging equipment is connected to the structural frame between said first and second side assemblies in an at least partially recessed manner. Open or closed loops of air may be provided for cooling the first and second side assemblies and the electric vehicle charging equipment, which may all be connected to a common power source. | 2022-04-28 |
20220132682 | METHOD AND ELECTRONIC DEVICE FOR IMPROVING ANTENNA PERFORMANCE - An electronic device is provided. The electronic device includes a first housing, a second housing foldably connected to the first housing through a hinge device, a flexible display disposed to be supported by the second housing through the hinge device from the first housing, and a protective frame disposed on the second housing with edges of the flexible display interposed, wherein a conductive member is disposed based on at least one pattern between the protective frame and the edges of the flexible display. | 2022-04-28 |
20220132683 | LIGHT-EMITTING DEVICE - A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state. | 2022-04-28 |
20220132684 | DISPLAY DEVICE - A display device is provided. The display device includes a housing; a roller disposed inside the housing; a display unit configured to be rolled around the roller; a first arm and a second arm, wherein one end of the first arm is rotatably coupled to the display unit and another end of the first arm is rotatably coupled to the second arm; a lead screw disposed inside the housing; a slider configured to move along the lead screw according to a rotation of the lead screw; and a rod comprising one end rotatably coupled to the slider and another end rotatably coupled to the second arm such that the second arm is raised and lowered based on movement of the slider along the lead screw; wherein the rod and the second arm are rotatably coupled via at least a first connection member and a first intermediate member, wherein the first connection member is configured to pass through the second arm and the rod and the first intermediate member is configured to surround a portion of the first connection member which passes through the second arm. | 2022-04-28 |
20220132685 | POWER ROUTING MODULE WITH PORTS - A circuit board cover having a housing having a first surface, a perimeter edge, a housing cavity partially defined by the first surface and the perimeter edge, a skirt extending from the perimeter edge away from the first surface in a first direction to partially define the housing cavity, and a plurality of ports disposed on the first surface. The housing cavity can be operable to house a printed circuit board. Each of the plurality of ports can include (i) a sidewall extending away from the first surface in a second direction opposite to the first direction, (ii) a port cavity partially defined by the sidewall, and (iii) one or more terminals disposed at least partially within the port cavity. | 2022-04-28 |
20220132686 | MODULE CARRIER IN THE FIELD OF SECONDARY EXPLOSION PROTECTION - A module carrier for use in a potentially explosive atmosphere, in particular in a potentially explosive atmosphere in the form of gas or dust, including a housing for receiving at least one module with a pushbutton, wherein the at least one module can be switched to live via the pushbutton, wherein the module carrier further includes a locking cap, wherein the locking cap has a device for actuating the pushbutton and wherein, in the unactuated state, the pushbutton is switched to not live and the pushbutton is actuatable by locking the locking cap using the actuating device. | 2022-04-28 |
20220132687 | ELECTRONIC DEVICE - An electronic device includes a housing assembly, a sliding rail assembly, a reel assembly and a flexible screen. The sliding rail assembly is assembled to the housing assembly and includes a sliding rail including opposite front and rear surfaces. The reel assembly is fixed to an edge of the sliding rail slidable outwards from the housing assembly. The flexible screen includes a winding end, and has a first part provided at the front surface of the sliding rail and fixed to the housing assembly, and a second part extendably and retractably wound around the reel assembly through the winding end. The sliding rail is able to extend the second part of the flexible screen from the reel assembly when slid outwards from the housing assembly and to retract the second part of the flexible screen to the reel assembly when slid towards the housing assembly from an outside. | 2022-04-28 |
20220132688 | ELECTRONIC DEVICE - An electronic device includes a housing assembly, a sliding rail assembly, an elastic telescopic assembly and a flexible screen. The sliding rail assembly is assembled to the housing assembly and includes a sliding rail including opposite front and rear surfaces. The elastic telescopic assembly is located at the rear surface of the sliding rail and assembled to the housing assembly. The flexible screen has a part thereof provided at the front surface of the sliding rail and fixed to the housing assembly, and includes a telescopic end extending around an edge of the sliding rail to the rear surface of the sliding rail and coupled to the elastic telescopic assembly stressed by the telescopic end to extend and retract, and the sliding rail is slidable outwards from the housing assembly to extend the flexible screen and slidable towards the housing assembly from an outside to retract the flexible screen. | 2022-04-28 |
20220132689 | DISPLAY DEVICE - A display device includes: a display panel; a first support disposed on the display panel and including a housing, a movable part supported for slidable movement relative to the housing, and an elastic part having one side supported by the housing to press the movable part, and a body disposed on the first support and including an inner space overlapping the first support and a second support disposed in the inner space and supporting one side of the movable part. | 2022-04-28 |
20220132690 | ENCLOSURES HAVING AN ANTI-FINGERPRINT SURFACE - Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa·m | 2022-04-28 |
20220132691 | ELECTRONIC DEVICE - An electronic device includes: a first display, a transmission assembly, and at least two second displays. The first display includes a first surface and a second surface opposite to the first surface. The at least two second displays are connected to the transmission assembly. The transmission assembly drives the at least two second displays to move between first positions and second positions. When the at least two second displays are located at the first positions, at least part of each of the least two second displays is covered by a orthographic projection of the first display along a perpendicular direction of the second surface. When the at least two second displays are located at the second positions, at least two second displays are located on an periphery of the first display and abut against an outer peripheral wall of the first display. | 2022-04-28 |
20220132692 | EXPLOSION-PROOF APPARATUS WITH A FLAMEPROOF GAS FLOW PATH AND HEAT SINK - An explosion-proof apparatus with an explosion-proof housing and a cooling device. The explosion-proof housing has a plurality of outer walls enclosing a housing interior. A pressure-relief arrangement of the cooling device has at least one pressure relief opening with at least one gas-permeable, flameproof pressure-relief body. The pressure-relief opening passes through at least one of the outer walls. The cooling device also has at least one heat sink which forms at least one heat sink wall part of one the outer walls and which, as a heat sink wall part of this outer wall, directly borders, on its outer face, the surrounding area and directly borders, on its inner face, the housing interior. | 2022-04-28 |
20220132693 | DISPLAY SUPPORT SYSTEM AND METHOD FOR THE USE THEREOF - A display support system includes a support rail extending in a first direction and at least one support bar carried by the support rail. The support bar is moveable relative to the support rail in at least the first and second directions. A mounting member is engaged with the support bar, with the mounting member being adapted to be coupled to a display. A method for mounting an array of displays on a wall, and a support cart for mounting a display, are also provided. | 2022-04-28 |
20220132694 | ELECTRONIC DEVICE CONFIGURED TO BE MOUNTED IN A CLUSTER HOUSING AND COMPRISING A FRONT TRAY FOR MOUNTING AT LEAST ONE EXPANSION CARD - An electronic device configured to be mounted in a housing of a cluster, the device comprising a rear body housing at least one mother board configured to be powered by the cluster, a front tray housing at least one electronic board having at least one socket, the front tray comprising at least one fastening member for mounting an expansion card having an edge connector and a fastening portion, the electronic board being connected to the mother board by at least one flexible cable, the front tray being mounted slidable relatively from the rear body between a close position and an open position in which the front tray is at least partially removed from the cluster housing while keeping the rear body into the cluster housing so that an expansion card can be mounted/unmounted from the electronic board without powering off the device. | 2022-04-28 |
20220132695 | APPARATUS FOR POWER MODULE AND HEAT DISSIPATION OF AN INTEGRATED CIRCUIT - Embodiments of the present disclose a power module system including a power module operatively coupled to an integrated circuit die, where the power module includes a band comprising of a high thermally conductive material disposed around an inductor and where the band is at least partially disposed around the inductor | 2022-04-28 |
20220132696 | APPARATUS FOR AN INDUCTOR DISPOSED IN A BAND FOR METHOD OF HEAT DISPERSION - Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor. | 2022-04-28 |
20220132697 | VAPOR CHAMBER - A vapor chamber is provided that allows space-saving and weight reduction of a device in which the vapor chamber is to be mounted. The vapor chamber has a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, and a working fluid enclosed in the cavity portion. The container includes a heat transfer portion that transfers heat by a phase change of the working fluid, and an extending portion that extends outwards from the heat transfer portion and has a function other than a heat transfer function. | 2022-04-28 |
20220132698 | ELECTRONIC HOUSING ELEMENT COMPRISING A RADIATOR, AND ASSOCIATED ADJUSTMENT METHOD - An electronic housing element intended to be fastened to a circuit board having a component to be cooled, including: a frame made of plastics material having a rigid surround and an upper wall, and a radiator intended to cool the component, having: a gripping portion protruding from the upper wall of the frame and designed so as to engage with gripping claws of a gripping device, and a holding portion engaging with the upper wall of the frame. The upper wall of the frame is formed from a material that has a deflection temperature under load and is designed to deform in order to allow the orientation of the radiator to be adjusted when the upper wall reaches the deflection temperature under load. | 2022-04-28 |
20220132699 | AIR CONDITIONER - An air conditioner includes an inlet; a suction channel through which air sucked from the inlet flows; a spray unit configured to spray water to be vaporized; a first channel through which first air to be cooled by heat of vaporization of water sprayed from the spray unit flows; a heat exchanger configured to exchange heat between the first air and the air flowing through the suction channel to cool the air flowing through the suction channel; wall body defining the first channel located downstream of the heat exchanger in a flow direction of the first air; and an electric device configured to generate heat with power consumption by the air conditioner. The electric device is thermally connected to the wall body. | 2022-04-28 |
20220132700 | HEAT DISSIPATION SYSTEM OF PORTABLE ELECTRONIC DEVICE - A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively. | 2022-04-28 |
20220132701 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber. | 2022-04-28 |
20220132702 | SEALED COMMUNICATIONS MODULE WITH MULTI-PATH THERMAL MANAGEMENT SYSTEM - A thermal management system for use in a sealed communications module and associated systems and methods are disclosed herein. In some embodiments, the communications model includes a sealed housing and a circuit board assembly having one or more heat-generating electronic components positioned within the housing. The thermal management system is coupled to the circuit board assembly and positioned to disperse heat from the one or more electronic components. The thermal management system includes a first thermal pathway, a second thermal pathway, and a third thermal pathway. The first thermal pathway has a first end attached to the circuit board assembly and a second end positioned near the side wall of the housing. The second thermal pathway is coupled to the second end of the first thermal pathway. The third thermal pathway is coupled to the second end of the first thermal pathway. | 2022-04-28 |
20220132703 | Electronic Device System, Manufacturing Method, and Method for Controlling Electronic Device System - An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other. | 2022-04-28 |
20220132704 | TESTING METHODS AND APPARATUSES USING SIMULATED SERVERS - The present application pertains to testing methods and apparatus useful in single phase or two-phase liquid immersion cooling systems. Single phase systems use a fluid similar to mineral oil in which to immerse the servers. As the fluid is heated by the operating servers the fluid is circulated to one or more heat exchangers for cooling so the fluid never boils. In contrast, two-phase systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of immersion cooling so actual servers are not required to test various aspects of the liquid immersion cooling units. | 2022-04-28 |
20220132705 | APPARATUS FOR ELECTRONIC COOLING ON AN AUTONOMOUS DEVICE - An apparatus to cool electronics in an autonomous vehicle, where the autonomous vehicle includes significant computing power to receive data from on-board sensor, cellular data and user interactions and to navigate an environment to a predetermined location. The cooling system includes a radiator, fan, pump and cold plate. The cold plate is formed from two plates with extended surfaces that are mated together so that the cavities around the extended surfaces form a flow passage. The electronics processing the data and navigating are mounted on the outside surface of the cold plate. | 2022-04-28 |
20220132706 | DISPLAY DEVICE - A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area. | 2022-04-28 |
20220132707 | FORCED AIR COOLING FOR DISPLAY ASSEMBLIES USING CENTRIFUGAL FANS - Systems for forced air cooling of display assemblies are provided. An electronic display subassembly is located behind a cover and includes an interior channel. An open loop centrifugal fan is positioned at an intake or an exhaust and forces ambient air through an open loop pathway when activated. A closed loop airflow pathway encircles the electronic display subassembly. A closed loop centrifugal fan is positioned at a side channel and forces circulating gas through the closed loop airflow pathway. Electronic components for operating the display assembly are provided with the rear compartment. | 2022-04-28 |
20220132708 | SHIELD CASE - Provided is a shield case, including: a case main body configured to cover at least a part of a circuit pattern provided on a mounting surface of a substrate; a flange portion extending from an outer peripheral end portion of the case main body in a direction of separating away from the case main body along the mounting surface; and a bent portion bending and extending from an outer peripheral end portion of the flange portion in a direction of separating away from the mounting surface, wherein the shield case is to be mounted to the substrate by means of a joining member to be provided between the flange portion and a case mounting region of the substrate at which the flange portion is to be arranged, and between the bent portion and the case mounting region. | 2022-04-28 |
20220132709 | ANISOTROPIC HEAT TRANSFER, ELECTROMAGNETIC INTERFERENCE SHIELDING COMPOSITE AND METHOD FOR PREPARATION THEREOF - The present invention provides an anisotropic, thermal conductive, electromagnetic interference (EMI) shielding composite including a plurality of aligned polymer nanofibers to form a polymer mat or scaffold having a first and second planes of orientation of the polymer nanofibers. The first plane of orientation of the polymer nanofibers has a thermal conductivity substantially the same as or similar to that of the second plane, and the thermal conductivity of the first or second plane of orientation of the polymer nanofibers is at least 2-fold of that of a third plane of orientation of the polymer nanofibers which is about 90 degrees out of the first and second planes of orientation of the polymer nanofibers, respectively, while the electrical resistance of each of the first and second planes is at least 3 orders lower than that of the third plane. A method for preparing the present composite is also provided. | 2022-04-28 |
20220132710 | ADA COMPLIANT SHIELDED DOOR - An ADA compliant shielded door is disclosed. According to one aspect, a door is configured to create a radio frequency (RF) seal when the door is sealed so that RF energy is restricting from passing through a gap between an outer periphery of the door and a door frame when the door is sealed. The door includes: at least one knife edge along at least part of the outer periphery of the door, each knife edge configured to project into a channel of a door frame in a direction parallel to a face of the door when the door is sealed. The door also includes at least one contact element along a length of a knife edge, the at least one contact element being configured to make electrical contact with a channel wall of a channel of the door frame when the knife edge projects into the channel. | 2022-04-28 |
20220132711 | RADAR APPARATUS - A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case. | 2022-04-28 |
20220132712 | COMPONENT MOUNTER - A component mounter for mounting electronic components includes a mounting head with at least two suction nozzles in the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously. A control device, which is configured to control electronic component pickup and mounting operations, causes the mounting head to move so as to position the at least two suction nozzles that are lowered simultaneously in an electronic component pickup operation step to be located individually on at least two trays on the pallet, causes the at least two suction nozzles to be lowered simultaneously, and causes electronic components on the at least two trays to be picked up simultaneously. | 2022-04-28 |
20220132713 | COMPONENT FEEDING DEVICE - The component feeding device includes a body portion, a first sprocket, a second sprocket, a peeler, a pair of rollers, and an openable cover. The first sprocket transports the carrier tape to the downstream component pickup position. The second sprocket transports the carrier tape from the component pickup position to the discharge port. The pair of rollers discharges the cover tape peeled off at the peeler. The first sprocket, the second sprocket, and the pair of rollers are disposed below the openable cover. | 2022-04-28 |
20220132714 | Method for Removing and Repositioning Electronic Components Connected to a Circuit Board - A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board. | 2022-04-28 |
20220132715 | COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD - There is provided a component mounter that conveys in a board having a product area in which a pattern electrode incorporated in an electrical product is disposed and an inspection area in which an inspection electrode for inspecting electrical characteristics is disposed, and conveys out the board after repeatedly executing an operation of picking up a component supplied by a component feeder and installing the component in the product area according to an installation sequence program, the device including: target event occurrence detector for detecting occurrence of an event that requires inspection of the electrical characteristics with respect to the component supplied by the component feeder; a determiner for determining whether or not the inspection area is vacant; and inspection-required component installer for installing the component picked up from the component feeder in the inspection area as an inspection-required component, in a case where the target event occurrence detector detects the occurrence of the event and the determiner determines that the inspection area is vacant. | 2022-04-28 |
20220132716 | COMPONENT TYPE MANAGEMENT DEVICE - A component type management device includes an association registration section configured to register association data in which individual identification information of a component supply device which is attached to a component mounter and supplies a component is associated with a type of the component held in the component supply device, an association discarding section configured to discard the association data in a case where a predetermined condition is satisfied after the component supply device is detached from the component mounter, a detachment discrimination section configured to discriminate whether the component supply device is detached by an automatic exchanging device; and an association maintaining section configured to invalidate a function of the association discarding section before the predetermined condition is satisfied and maintain the association data in a case of being discriminated that the component supply device is detached by the automatic exchanging device. | 2022-04-28 |
20220132717 | COMPONENT MOUNTING SYSTEM - A component mounting system includes a component mounter group, a storage container, a loader, a host computer, and a production management computer. The host computer prepares jobs for each product based on a production plan for producing multiple types of products in which predetermined various types of components are mounted on a mounting target and sets a job in the jobs so prepared that satisfies a specified determination condition as a determined job. The production management computer shares the determined job with the host computer, makes a processing preparation for the determined job and thereafter causes the loader to unload and/or load component supply devices based on the results of the processing preparation for the determined job. | 2022-04-28 |
20220132718 | Curio Plant Named 'Blues' - A new cultivar of | 2022-04-28 |