Inventors list
Assignees list
Classification tree browser
Top 100 Inventors
Top 100 Assignees
16th week of 2022 patent applcation highlights part 58
Patent application number
Title
Published
20220122862
LINEAR GAUGE
2022-04-21
20220122863
TRANSFER DEVICE AND TRANSFER METHOD FOR MICRO LIGHT-EMITTING DIODE (MICRO LED), AND DISPLAY DEVICE
2022-04-21
20220122864
SMART SKIP TESTING METHOD FOR SEMICONDUCTOR MANUFACTURING
2022-04-21
20220122865
ENHANCED PROCESS AND HARDWARE ARCHITECTURE TO DETECT AND CORRECT REALTIME PRODUCT SUBSTRATES
2022-04-21
20220122866
MAGNETIC HOLDING STRUCTURES FOR PLASMA PROCESSING APPLICATIONS
2022-04-21
20220122867
BOAT TRANSFER METHOD AND HEAT TREATMENT APPARATUS
2022-04-21
20220122868
ALIGNMENT MECHANISM AND ALIGNMENT METHOD OF BONDING MACHINE
2022-04-21
20220122869
ALIGNMENT SYSTEM AND ALIGNMENT MARK
2022-04-21
20220122870
BACKSIDE GAS LEAKBY FOR BEVEL DEPOSITION REDUCTION
2022-04-21
20220122871
METHODS AND APPARATUS FOR PREVENTION OF COMPONENT CRACKING USING STRESS RELIEF LAYER
2022-04-21
20220122872
SYSTEMS AND METHODS OF SEASONING ELECTROSTATIC CHUCKS WITH DIELECTRIC SEASONING FILMS
2022-04-21
20220122873
MULTI-PRESSURE BIPOLAR ELECTROSTATIC CHUCKING
2022-04-21
20220122874
REAL TIME BIAS DETECTION AND CORRECTION FOR ELECTROSTATIC CHUCK
2022-04-21
20220122875
HIGH TEMPERATURE BIPOLAR ELECTROSTATIC CHUCK
2022-04-21
20220122876
SUBSTRATE SUPPORT FOR CHUCKING OF MASK FOR DEPOSITION PROCESSES
2022-04-21
20220122877
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH AT LEAST TWO SINGLE-CRYSTAL LAYERS
2022-04-21
20220122878
AUTOMATED PROCESS MODULE RING POSITIONING AND REPLACEMENT
2022-04-21
20220122879
PRE-LOADED BOWL MECHANISM FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN PATH
2022-04-21
20220122880
TRENCH ISOLATION PROCESS
2022-04-21
20220122881
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
2022-04-21
20220122882
SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD
2022-04-21
20220122883
METAL LINE PATTERNING
2022-04-21
20220122884
Metal Loss Prevention Using Implantation
2022-04-21
20220122885
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
2022-04-21
20220122886
LASER PROCESSING METHOD
2022-04-21
20220122887
Semiconductor Devices and Methods of Manufacture
2022-04-21
20220122888
SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME
2022-04-21
20220122889
Method For Forming Fins of Semiconductor Device
2022-04-21
20220122890
FINFET Gate Structure and Related Methods
2022-04-21
20220122891
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2022-04-21
20220122892
METHOD OF 3D LOGIC FABRICATION TO SEQUENTIALLY DECREASE PROCESSING TEMPERATURE AND MAINTAIN MATERIAL THERMAL THRESHOLDS
2022-04-21
20220122893
Semiconductor Device with Leakage Current Suppression and Method for Forming the Same
2022-04-21
20220122894
SEMICONDUCTOR DEVICE
2022-04-21
20220122895
METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
2022-04-21
20220122896
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
2022-04-21
20220122897
Integrated Circuit Package and Method
2022-04-21
20220122898
INTEGRATED FAN OUT PACKAGE AND METHOD
2022-04-21
20220122899
SEMICONDUCTOR APPARATUS AND VEHICLE
2022-04-21
20220122900
SYNTHETIC DIAMOND PLATES
2022-04-21
20220122901
SEMICONDUCTOR DEVICE
2022-04-21
20220122902
SEMICONDUCTOR APPARATUS
2022-04-21
20220122903
DEVICE WITH AN ETCH STOP LAYER AND METHOD THEREFOR
2022-04-21
20220122904
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING A CONDUCTIVE PAD WITH AN ANCHOR FLANGE
2022-04-21
20220122905
LEADFRAME PACKAGE WITH ISOLATION LAYER
2022-04-21
20220122906
STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING
2022-04-21
20220122907
JOINT CONNECTION OF CORNER NON-CRITICAL TO FUNCTION (NCTF) BALL FOR BGA SOLDER JOINT RELIABILITY (SJR) ENHANCEMENT
2022-04-21
20220122908
PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE INCLUDING A LOWER SEMICONDUCTOR PACKAGE AND AN UPPER SEMICONDUCTOR PACKAGE
2022-04-21
20220122909
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME
2022-04-21
20220122910
LOW-DISPERSION COMPONENT IN AN ELECTRONIC CHIP
2022-04-21
20220122911
DEVICE TERMINAL INTERCONNECT STRUCTURES
2022-04-21
20220122912
SEMICONDUCTOR DEVICE HAVING A STACKED STRUCTURE
2022-04-21
20220122913
SEMICONDUCTOR DEVICE WITH SOURCE RESISTOR AND MANUFACTURING METHOD THEREOF
2022-04-21
20220122914
FUSIBLE STRUCTURES AND METHODS OF MANUFACTURING SAME
2022-04-21
20220122915
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
2022-04-21
20220122916
SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE, AND MEMORY DEVICE AND SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE
2022-04-21
20220122917
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2022-04-21
20220122918
SEMICONDUCTOR PACKAGE
2022-04-21
20220122919
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
2022-04-21
20220122920
SEMICONDUCTOR DEVICE
2022-04-21
20220122921
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
2022-04-21
20220122922
Semiconductor Devices and Methods of Manufacture
2022-04-21
20220122923
METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED VIA RESISTANCE
2022-04-21
20220122924
INTEGRATED SELF-ALIGNED ASSEMBLY
2022-04-21
20220122925
MODULE AND METHOD OF MANUFACTURING THE SAME
2022-04-21
20220122926
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
2022-04-21
20220122927
Integrated Circuit Package and Method
2022-04-21
20220122928
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING DUMMY PATTERN AROUND ARRAY AREA
2022-04-21
20220122929
PACKAGE ROUTING FOR CROSSTALK REDUCTION IN HIGH FREQUENCY COMMUNICATION
2022-04-21
20220122930
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
2022-04-21
20220122931
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
2022-04-21
20220122932
MEMORY DEVICE HAVING VERTICAL STRUCTURE
2022-04-21
20220122933
MEMORY DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
2022-04-21
20220122934
INTEGRATED DEVICE PACKAGES
2022-04-21
20220122935
SACRIFICIAL DIELECTRIC FOR LITHOGRAPHIC VIA FORMATION TO ENABLE VIA SCALING IN HIGH DENSITY INTERCONNECT PACKAGING
2022-04-21
20220122936
ENHANCED MOLD COMPOUND THERMAL CONDUCTIVITY
2022-04-21
20220122937
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLADIUM-COATED COPPER BONDING WIRE, SEMICONDUCTOR DEVICE USING THE SAME, AND MANUFACTURING METHOD THEREOF
2022-04-21
20220122938
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
2022-04-21
20220122939
PRODUCING APPARATUS AND PRE-BONDING DEVICE
2022-04-21
20220122940
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
2022-04-21
20220122941
METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
2022-04-21
20220122942
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME
2022-04-21
20220122943
METHODS AND SYSTEMS FOR IMPROVING POWER DELIVERY AND SIGNALING IN STACKED SEMICONDUCTOR DEVICES
2022-04-21
20220122944
Semiconductor Device with Discrete Blocks
2022-04-21
20220122945
ELECTRONIC DEVICE
2022-04-21
20220122946
ELECTRONIC DEVICE
2022-04-21
20220122947
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
2022-04-21
20220122948
STRETCHABLE DISPLAY DEVICE
2022-04-21
20220122949
LIGHT EMITTING DIODE ARRAY CONTAINING A BLACK MATRIX AND AN OPTICAL BONDING LAYER AND METHOD OF MAKING THE SAME
2022-04-21
20220122950
SEMICONDUCTOR STRUCTURE AND ELECTRONIC DEVICE
2022-04-21
20220122951
PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING PACKAGING STRUCTURE
2022-04-21
20220122952
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2022-04-21
20220122953
MICRO LIGHT EMITTING DEVICE ARRAY AND METHOD OF MANUFACTURING THE SAME
2022-04-21
20220122954
SEMICONDUCTOR DEVICE
2022-04-21
20220122955
SEMICONDUCTOR PACKAGE
2022-04-21
20220122956
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
2022-04-21
20220122957
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2022-04-21
20220122958
CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS
2022-04-21
20220122959
INTEGRATED GRID CELL
2022-04-21
20220122960
POWER CELL FOR SEMICONDUCTOR DEVICES
2022-04-21
20220122961
SPLIT N-WELL CELLS HAVING A MERGED N-WELL DESIGN
2022-04-21