16th week of 2011 patent applcation highlights part 15 |
Patent application number | Title | Published |
20110090649 | TILT-TYPE HEAT-DISSIPATING MODULE FOR INCREASING HEAT-DISSIPATING EFFICIENCY AND DECREASING LENGTH OF SOLDER PIN - A tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin is disposed on a circuit substrate. The tilt-type heat-dissipating module includes a substrate unit, a heat-dissipating unit and an electronic unit. The substrate unit has a heat-dissipating body disposed on the circuit substrate, and one part of a top surface of the heat-dissipating body is a first inclined plane. The heat-dissipating unit has a plurality of heat-dissipating fins connected to the heat-dissipating body. The electronic unit has a plurality of electronic elements disposed on the first inclined plane of the heat-dissipating body. Each electronic element has a plurality of pins bent downwards from a bottom thereof in order to electrically connect to the circuit substrate, and heat generated by the electronic elements is transmitted to external environment by matching the heat-dissipating body and the heat-dissipating fins. | 2011-04-21 |
20110090650 | THERMAL CONDUCTIVE MEMBER, MANUFACTURING METHOD OF THE THERMAL CONDUCTIVE MEMBER, HEAT RADIATING COMPONENT, AND SEMICONDUCTOR PACKAGE - A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer. | 2011-04-21 |
20110090651 | PACKAGE STRUCTURE - Provided is a package structure. The package structure includes a first substrate, a first device, a second substrate, a first via contact, and at least one second device. The first device is formed on the first substrate. The second substrate has an air gap over the first substrate and covers the first device. The first via contact is connected to the first device through the second substrate. At least one second device is electrically connected to the first via contact, and is stacked on the second substrate. | 2011-04-21 |
20110090652 | WATERPROOF STRUCTURE FOR PORTABLE TERMINAL - A waterproof structure for a portable terminal including a flexible printed circuit (FPC) extending outside of a first housing of a pair of housings from inside the first housing and arranged inside of a second housing of the pair of housings. A wiring hole is formed in each housing to provide a path allowing passage of the FPC therethrough. A waterproof member provided in the wiring hole substantially contacts at least inner walls of the housings and an outer circumferential surface of the FPC to prevent movement of the FPC. An outer circumferential surface of the waterproof member substantially contacts a circumference of an inlet of the wiring hole or an inner wall of the wiring hole. The waterproof member is provided between the housing of the portable terminal and the FPC improving a waterproof function and preventing moisture or water from being introduced into the housing of the terminal. | 2011-04-21 |
20110090653 | METHOD FOR PRODUCING A ROLLABLE WEB AND A ROLLABLE WEB - A method for producing a rollable web with successive antennas, where an electronic chip is attached to an antenna in a predetermined position. The position of an electronic chip changes with respect to the antenna when compared to at least some of the chips within individual and successive antennas. A rollable web includes successive antennas, where electronic chips are attached to antennas in a predetermined position. In the rollable web, the position of a chip changes with respect to the antenna compared to at least some of the chips within individual and successive antennas. | 2011-04-21 |
20110090654 | FIRE ALARM SYSTEM TRANSMITTER - Obtained is a fire alarm system transmitter having an improved insulating property without increasing an entire size of a casing. The fire alarm system transmitter includes: a printed circuit board with a substantially rectangular shape, on which a terminal block including a plurality of terminals aligned along one side of the printed circuit board is disposed; a casing with a substantially rectangular parallelepiped shape, in which the printed circuit board is mounted; and an electric-wire insertion portion provided on a side wall of the casing facing the one side, and extended from the side wall by a predetermined distance toward an outside of the casing, the side wall allowing a plurality of electric wires connected to the plurality of terminals to be inserted through the side wall. | 2011-04-21 |
20110090655 | LINECARD TO CHASSIS SECURING - A holder secures a linecard to a chassis. The holder acts as a releasable expansion bolt. To alleviate tolerance requirements for the linecard and/or chassis, the holder secures with minimal additional pressure being applied to force the linecard against the chassis. Rather than screwing a linecard face plate to the chassis card guide, the holder locks the linecard in place without requiring movement of the face plate against the chassis card guide. A gap may remain between the face plate and the chassis, substantially allowing for a desired amount of insertion of electrical connectors without adverse pressure or movement caused by the securing. | 2011-04-21 |
20110090656 | TERMINAL STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF - A method for manufacturing an electronic device comprising a terminal provided with a conductor which penetrates a cured prepreg is provided. At least one opening is formed in the prepreg. The prepreg is attached to a substrate over which an electronic element is formed so that the conductor included in the terminal overlaps with the opening. A conductive paste is provided in a region of the prepreg where the opening is provided. Part of the conductive paste flows into the opening to be in contact with the conductor included in the terminal. Then, heat treatment is performed so that the conductive paste and the prepreg are cured. In the process for manufacturing the terminal, it is not necessary to perform a step of forming an opening with a laser beam after the prepreg is cured. Thus, an adverse effect of a laser beam on the electronic element can be eliminated. | 2011-04-21 |
20110090657 | PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME - A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element. | 2011-04-21 |
20110090658 | PROTECTIVE CIRCUIT BOARD COVER - A protective, anti-tamper coating and methods of coating creation and application are provided. The coating may include an elastomeric layer to allow for strippability/removal. The coating may also include a “smart layer” for tamper detection, imaging prevention, and tamper prevention or underlying device de-activation/alteration upon tamper detection. The coating may also include one or more ground planes around the smart layer and one or more frangible layers designed to interrupt or alter smart layer function in the event of a tamper attempt. | 2011-04-21 |
20110090659 | Package Having An Inner Shield And Method For Making The Same - The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an inner shield and a conformal shield. The electrical elements are disposed on the substrate. The molding compound is disposed on a surface of the substrate, encapsulates the electrical elements, and includes at least one groove. The groove penetrates a top surface and a bottom surface of the molding compound and is disposed between the electrical elements, and there is a gap between a short side of the groove and a side surface of the molding compound. The inner shield is disposed in the groove and electrically connected to the substrate. The conformal shield covers the molding compound and a side surface of the substrate, and electrically connects the substrate and the inner shield. Therefore, the inner shield enables the electrical elements to have low electromagnetic interference and high electromagnetic compatibility. | 2011-04-21 |
20110090660 | PRINTED CIRCUIT BOARD - A printed circuit board includes a board body, a number of filtering capacitors, and a chip. The board body includes a chip mount area. The chip mount area includes a first area and a second area. The first and second areas each include a number of pads. The second area is surrounded by the first area. The pads of the second area are electrically connected to pins of the number of filtering capacitors. The pads of the first area are electrically connected to pins of the chip. The number of filtering capacitors is sandwiched between the chip and the second area. | 2011-04-21 |
20110090661 | CIRCUIT BOARD WITH CAPACITOR HAVING A MULTILAYER BODY AND DISPLAY DEVICE USING SAME - An exemplary circuit board includes a plate body and a multilayer capacitor installed on a surface of the plate body. The multilayer capacitor includes a multilayer body and two outer electrodes located at the two opposite ends of the multilayer body. The multilayer body includes a plurality of ceramic layers and a plurality of internal electrodes alternately arranged. The two outer electrodes are connected to the plate body, and a stacking direction of the multilayer body is substantially parallel to the surface of the plate body. | 2011-04-21 |
20110090662 | METHOD AND APPARATUS FOR IMPROVING POWER NOISE OF BALL GRID ARRAY PACKAGE - An apparatus and method of improving power noise of a Ball Grid Array (BGA) package are provided. The method includes securing a space for a passive element mounting pad, on which a passive element can be mounted, adjacent to a power pad on a Printed Circuit Board (PCB) corresponding to a power pin of the BGA package, mounting the passive element on the passive element mounting pad, and mounting the BGA package at a position on the PCB, wherein the position on the PCB overlaps the passive element and further wherein the BGA package is mounted above the passive element. | 2011-04-21 |
20110090663 | SUPPORT FOR ELECTRONIC EQUIPMENT - A mobile support such as a rack or a platform for a rack housing a server or other electronic equipment is capable of independent movement and automatic connection and disconnection from resources such as network connection, coolant supply and power supply. The coordination of a plurality of such mobile supports is envisaged so as to automatically distribute equipment in a data centre in such a way as to optimally use space and resources. | 2011-04-21 |
20110090664 | SHIELD CASE MOUNTING SUBSTRATE - In a shield case mounting substrate, a downwardly extending portion of a shield case is solder-bonded to a first land pattern and a second land pattern which are provided on the surface of a substrate. The width of the first land pattern in the thickness direction of the downwardly extending portion is greater than the width of the second land pattern in the thickness direction of the downwardly extending portion. Consequently, the high bonding strength between the shield case and the substrate can be ensured, and the positioning accuracy of the shield case on the substrate can also be ensured. | 2011-04-21 |
20110090665 | THIN FILM SURFACE MOUNT COMPONENTS - Surface mount components and related methods of manufacture involve one or more thin film circuits provided between first and second insulating substrates. The thin film circuits may include one or more passive components, including resistors, capacitors, inductors, arrays of one or more passive components, networks or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads being exposed between the substrates on end and/or side surfaces of the surface mount component. The exposed conductive pads are then electrically connected to external terminations. The external terminations may include a variety of different materials, including at least one layer of conductive polymer and may be formed as termination stripes, end caps or the like. Optional shield layers may also be provided on top and/or bottom device surfaces to protect the surface mount components from signal interference. For embodiments where one or more thin film circuits are provided between insulating base and cover substrates, such thin film circuit(s) can be formed with conductive pads that extend to and are initially exposed along one or more surfaces of the resultant component. The cover substrate is formed with a plurality of conductive elements (e.g., internal active electrodes, internal anchor electrodes and/or external anchor electrodes) that are designed to generally align with the conductive pads formed on the base substrate such that conductive element portions are exposed in groups along one or more peripheral surfaces of a device. External plated terminations are then formed directly to the exposed portions of the conductive elements. | 2011-04-21 |
20110090666 | TEMPERATURE SENSOR MOUNTING ARRANGEMENT FOR A BATTERY FRAME ASSEMBLY - A temperature sensor mounting arrangement for a battery frame assembly in which a plurality of rechargeable battery packs are supported and interconnected. The arrangement includes an elongated support member secured to a battery frame member and extending into an interior region of the frame member. At least one electrical interface connector is secured to a first end of the support member and an electronic temperature sensor is secured to a face of the support member in a target position proximate to a battery pack outer surface. A plurality of electrical conductors interconnects between the electrical connectors and the temperature sensor. The temperature sensor mounting arrangement is modularized and designed to enable high speed assembly during manufacturing and ensure repeatable frame to frame sensor positioning and accuracy of temperature readings. | 2011-04-21 |
20110090667 | ELECTRICAL COMPONENT ENCLOSURE - A system, including an enclosure and a module, where the module is disposed in the enclosure such that a tab of the enclosure is disposed in a slot of the module; and the module is configured to rotate about the slot. The enclosure can also be configured to receive modular mounting structures. The enclosure can also include multiple panels that create a smaller opening. | 2011-04-21 |
20110090668 | Light pen - First and second magnets of a light pen according to the present invention are used for replacing a conventional spring to be a switch structure of the light pen. Whereby, the elastic fatigue problem is not yielded, the switch structure is enabled to be more durable and dependable and can be used as a switch structure for a light pen whose stroke between two electric contact points from a separation state to a contact state is shorter. | 2011-04-21 |
20110090669 | LED LIGHTING DEVICE AND LIGHT SOURCE MODULE FOR THE SAME - An LED lighting device includes a supporting stage, a light source module, a heat dissipating module and a sleeve. The light source module is arranged on one side of the supporting stage and includes a plurality of white LEDs, a plurality of red LEDs, and a plurality of green LEDs. The heat dissipating module includes a plurality of heat-dissipating fins and a plurality of heat pipes passing through the heat-dissipating fins. The sleeve encloses the heat dissipating module. The LED lighting device mixes the lights from those LEDs to provide a light source with lower color temperature and higher color rendering index. | 2011-04-21 |
20110090670 | OPTICAL FILM AND LIGHT EMITTING DEVICE USING THE SAME - Disclosed is an optical film. The optical film includes:
| 2011-04-21 |
20110090671 | ILLUMINATION DEVICE - An illumination device may include a hollow body having at least one light emission opening, wherein the hollow body has at least partly a reflective surface at its inner side, and at least one semiconductor luminous element, wherein a predominant portion of the light emitted by the semiconductor luminous element is incident on the inner side of the hollow body and is reflected from there through the light emission opening. The device may furthermore include a covering for the light emission opening with a grid-type arrangement of light transmission openings, wherein the at least one semiconductor luminous element is fixed to the covering and is directed at the inner side of the hollow body, and wherein a side area of the covering that surrounds the light transmission openings is at least partly reflectively coated. | 2011-04-21 |
20110090672 | LIGHT GUIDE PLATES AND BACKLIGHT MODULE - A light guide plate includes a body having a bottom surface, a top surface opposite to the bottom surface, and at least one lateral side. A recess is defined at the top surface. The recess is concaved toward the bottom surface and has a reflective surface. Only one part of the reflective surface has reflective structure located thereon. A backlight module using the light guide plate is related. | 2011-04-21 |
20110090673 | Multi-function illuminating device - A multi-function illuminating device comprises a body including a light member disposed on a front end thereof and a button and a cell assembly, both of which electrically connect with the light member, and the switch being used to start and stop the light member, the body also including a cover mounted on a rear end thereof, characterized in that: the cover includes a fitting portion extending from a rear end thereof, and the fitting portion is formed in a polygonal shank shape to be fitted to a tool. | 2011-04-21 |
20110090674 | Display Cabinet Illumination - An illuminator ( | 2011-04-21 |
20110090675 | Multiple Positioned Light Source to Achieve Uniform or Graded Illumination - An integrated and modular lighting system is disclosed. The lighting system includes a plurality of modules, each module including at least two echelons of light emitting diodes and a power supply on a common substrate. The modular lighting system is used to provide uniform illumination of an enclosed display stand. | 2011-04-21 |
20110090676 | Illuminated Decorative Trim Assembly - The present invention relates to illuminated trim members configured for use with homes, building or otherwise. In one exemplary embodiment, the present invention provides an illuminated decorative trim assembly including a trim member. The trim member includes an upper member, a lower member and a connecting member joining the upper and lower members. The upper member, lower member or both form a plurality of openings along a length thereof. The trim assembly further includes a light fixture assembly including a plurality of receptacles aligned with the plurality of openings formed on the upper or lower member. The trim assembly also includes a plurality of electrically connected illuminating devices disposed along the light fixture assembly and in the receptacles. The trim assembly still further includes one or more translucent members disposed along the length of the upper or lower member to cover at least a portion of the plurality of openings. | 2011-04-21 |
20110090677 | COLLAPSIBLE LIGHTING DEVICE - The present invention includes a collapsible lighting device comprising: (a) a container having a base portion and optional lid portion, that is adapted to be reversibly moved from a closed position to an open position; (b) at least one light source disposed in the container; and (c) a collapsible envelope of a diffuser material disposed in the container, and adapted to be reversibly moved from a contained position defining a contained volume within the container when the container is in the closed position, to a deployed position when the container is in the open position. | 2011-04-21 |
20110090678 | Street light with continuous supply of light - The present invention provides an energy efficient street light, having a pole support and a light fixture mounted on the pole support. A first light receiving lens is located on the upper area of the light fixture for receiving natural light during day light hours. A second light receiving lens is located on the bottom area of the light fixture for receiving light from the light fixture when it is turned on at night. A plurality of solar panels are disposed in an enclosure above ground, or in an enclosure below ground. A plurality of light transmitting fiber optic cables are connected to the first and second light receiving lenses for transmitting light (natural and from the light fixture) to the plurality of solar panels 24 hours a day for storing the light energy to power the light fixture on one or more street lights. One or more electric cables are provided for transmitting electricity from the solar panels to one or more light fixtures. | 2011-04-21 |
20110090679 | LIGHT SOURCE FOR INJECTING LIGHT INTO A HAND-HELD MEDICAL APPLIANCE - The invention relates to a light source for coupling light into a hand-held medical device ( | 2011-04-21 |
20110090680 | LED REFLECTOR FIXTURE - Provided is a light fixture having a first elongate body defining a mounting surface. A light module is disposed adjacent the mounting surface and includes a module body and a plurality of light emitting devices disposed on the mounting body. The light emitting device defines an emitting axis about which light is emitted. The fixture further includes a first reflector member and a second reflector member disposed on opposed sides of the emitting axis for reflecting light emanated by the light emitting devices. The first reflector member and the second reflector member are pivotable to vary the angle at which light is emitted from the light fixture. | 2011-04-21 |
20110090681 | Housing for a LED Lighting System - The LED light fixture includes white LEDs having multiple, different color temperatures. Preferably, white LEDs having color temperatures of about 3500 and about 5000 degrees Kelvin (K) are selected. The intensity of each LED may be varied and the light radiated from the LEDs is mixed together. The resulting light emitted from the housing is a white light having a variable color temperature ranging from about 3500 to about 5000 K. The housing is preferably extruded aluminum. A portion of the housing is configured to mix the light together and to focus the light such that the output light is about thirty degrees off center. Electrical loading is off set to minimize load on power supplies. | 2011-04-21 |
20110090682 | LED TUBE - An LED (light emitting diode) tube includes a connecting member, an LED module mounted on a bottom side of the connecting member, a driving circuit module mounted on a top side of the connecting member, two covers engaging with two opposite lateral sides of the connecting member and two connectors. The two covers cover the driving circuit module and the LED module, respectively. The two connectors are located at two opposite ends of the LED tube. Two recesses are cooperatively defined by the two covers and the connecting member in two opposite sides of the LED tube and along a length of the LED tube. The recesses separate the two covers from each other and each have a width less than 12mm. | 2011-04-21 |
20110090683 | SURFACE-MODIFIED CONVERSION PHOSPHORS - The invention relates to surface-modified phosphor particles based on luminescent particles which comprise at least one luminescent compound, where (Ca,Sr,Ba) | 2011-04-21 |
20110090684 | LED-BASED LIGHTING FIXTURES FOR SURFACE ILLUMINATION WITH IMPROVED HEAT DISSIPATION AND MANUFACTURABILITY - LED-based lighting apparatus and assembly methods in which mechanical and/or thermal coupling between respective components is accomplished via a transfer of force from one component to another. In one example, a multiple-LED assembly is disposed in thermal communication with a heat sink that forms part of a housing. A primary optical element situated within a pressure-transfer member is disposed above and optically aligned with each LED. A shared secondary optical facility forming another part of the housing is disposed above and compressively coupled to the pressure-transfer members. A force exerted by the second optical facility is transferred via the pressure-transfer members so as to press the LED assembly toward the heat sink, thereby facilitating heat transfer. In one aspect, the LED assembly is secured in the housing without the need for adhesives. In another aspect, the secondary optical facility does not directly exert pressure onto any primary optical element, thereby reducing optical misalignment. | 2011-04-21 |
20110090685 | LED ILLUMINATION DEVICE WITH A HIGHLY UNIFORM ILLUMINATION PATTERN - An LED (light emitting diode) illumination device that can generate a uniform light output illumination pattern. The illumination device includes an array of LEDs, each having a LED central axis. The LED central axis of the array of LEDs is angled approximately toward a central point. The illumination source includes a reflector with a conic or conic-like shape. The reflector wraps around the front of the LED to redirect the light emitted along a LED central axis. | 2011-04-21 |
20110090686 | Compact Heat Sinks and Solid State Lamp Incorporating Same - A solid state lamp with efficient heat sink arrangement. To provide adequate cooling utilizing a defined form factor, such as that of the A-lamp incandescent bulb, the interior volume is used more efficiently. As one example, a solid state lamp employs a heat sink with inward facing fins. Solid state light sources, such as light emitting diodes (LEDs), are mounted on the exterior of the heat sink. An air path for convective flow is established through the center of the lamp. | 2011-04-21 |
20110090687 | LED illumination device capability of increasing angle of illumination - An LED illumination device capability of increasing angle of illumination comprises a heat sink base, an LED illumination module and a transparent, The heat sink base has a first surface, a second surface opposite to first surface and a first fixed portion formed at both sides of the heat sink base, wherein the first surface is formed with two inclined faces contrary to each other, the second surface is formed with a plurality of heat sink sheets. The LED illumination module is mounted on the two inclined faces of the heat sink base individually. The transparent board is formed with two second fixed portion located at the both sides of the transparent, so that the transparent board may be fixed at the first surface of the heat sink base. | 2011-04-21 |
20110090688 | ILLUMINATION DEVICE WITH OVERLAPPING ILLUMINATION AREA - An illumination device includes a housing, a cover and a plurality of lighting source modules. The plurality of lighting source modules is arranged in array. The cover includes a top surface and a bottom surface. The top surface faces the plurality of lighting source modules such that the light from the plurality of lighting source modules travels through the cover to the illumination area. Each of the plurality of lighting source modules has a predetermined height from the illumination area. A ratio of the total width of the lighting source modules to the predetermined height is less than or equal to a specific value, namely 10%, so that the illumination areas of all the plurality of lighting source modules substantially overlap. | 2011-04-21 |
20110090689 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION SYSTEM - A light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second conductive semiconductor layers; a first electrode on the first conductive semiconductor layer; a transparent electrode layer on the second conductive semiconductor layer; and a second electrode on the transparent electrode layer, where the second electrode is anchored to the transparent electrode. | 2011-04-21 |
20110090690 | UNIVERSAL MOUNTING CARRIER FOR SOLID STATE LIGHT EMITTING DEVICE ARRAYS - A light source includes one or more solid state light emitting devices, and a universal mounting carrier supporting the one or more solid state light emitting devices, wherein the universal mounting carrier is adapted for mounting into any of a plurality of street lights in place of a non-solid state light source, each of the street lights having at least one different physical dimension from the others. | 2011-04-21 |
20110090691 | LAMP ASSEMBLIES AND METHODS OF MAKING THE SAME - Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board. | 2011-04-21 |
20110090692 | LED LAMP HAVING IMPROVED WATERPROOF PERFORMANCE - An LED lamp includes a lamp seat, an illuminant module mounted on the lamp seat, an envelope covering the illuminant module, a waterproof cushion sandwiched between the lamp seat and the envelope and a pressing frame pressing the envelope toward the lamp seat. A plurality of protrusions protrude vertically and downwardly from the pressing frame. Outer faces of sidewalls of the lamp seat slant outwardly and upwardly relative to each other. A plurality of fasteners extend through the protrusions horizontally and are fastened on the sidewalls of the lamp seat, whereby the envelope is urged to tightly press the waterproof cushion toward the lamp seat. | 2011-04-21 |
20110090693 | BUILDING MATERIAL AND BUILT-UP BUILDING MATERIAL STRUCTURE - A building material whereinside an accommodating space is formed is disclosed. The building material includes a first area whereon at least one protruding part and at least one sunken part are formed alternately in a first direction, and a second area whereon at least one protruding part and at least one sunken part are formed alternately in the first direction. The protruding part of the second area aligns with the corresponding sunken part of the first area in a second direction substantially perpendicular to the first direction, and the sunken part of the second area aligns with the corresponding protruding part of the first area in the second direction. | 2011-04-21 |
20110090694 | ACTIVE BEZEL EDGE LIGHTING WITH DIFFUSER LAYER - A bezel for a TV display has two or more bezel elements, one being more diffusive of light from a source juxtaposed with the bezel assembly than the other element. One element can laterally border the other element or one element can be directly behind the other. More than two bezel elements may be used. | 2011-04-21 |
20110090695 | ILLUMINATION APPARATUS - An illumination apparatus including a light source that emits illumination light, an optical member that transmits the illumination light to externally project the illumination light, and a reflector that reflects illumination light from the light source towards the optical member, the device comprising: a drive device to drive the reflector and the light source to advance and retract in a substantially perpendicular direction relative to a light projection surface of the optical member; and a relative movement device to cause the light source to relatively move relative to the reflector in a process of driving to advance and retract by way of the drive device, wherein the relative movement device includes a straight guide member that causes the light source to move straight ahead in the substantially perpendicular direction relative to the reflector. | 2011-04-21 |
20110090696 | SEMICONDUCTOR LIGHT-EMITTING APPARATUS - A blue LED | 2011-04-21 |
20110090697 | SHEET AND LIGHT EMITTING DEVICE - A light emitting device | 2011-04-21 |
20110090698 | LIGHT SOURCE - Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. | 2011-04-21 |
20110090699 | BULB-TYPE LIGHTING SOURCE - To provide a bulb-type lighting source that employs a light-emitting element and has better heat dispersal characteristics than the conventional technology. | 2011-04-21 |
20110090700 | LIGHT SOURCE MODULE - A light source module includes a light source and housing. The housing includes a reflecting part, an installed part, and a stop. The reflecting part includes a paraboloidal surface configured for reflecting light beams from the light source. The light source is set in a focal point of the paraboloidal surface. The installed part is configured for installing the light source. The opening is configured for transmitting light beams reflected from the paraboloidal surface. The stop is perpendicularly connected with the installed part, and configured for preventing light beams from the light source from directly passing through the opening. | 2011-04-21 |
20110090701 | LED LAMP - An LED lamp includes an LED and a lens covering thereon. The LED has an optical axis. The lens includes a light incidence surface adjacent to the LED and a light emission surface opposite to the light incidence surface. A first imaginary plane and a second imaginary plane intersect at the optical axis of the LED, the light emission surface of the lens is symmetric about the first and second imaginary planes, respectively. In the first imaginary plane, light emitted from the light emission surface distribute regions which a light emitting angle of the LED lamp ranges from 0° to about 45°. In the second imaginary plane, light emitted from the light emission surface distribute regions which a light emitting angle of the LED lamp ranges from 0° to about 75°. | 2011-04-21 |
20110090702 | LIGHT PEN - A light pen with an open end includes a light emitting diode and a light shielding element. The light-emitting diode is fixed in the light pen, and includes a light guide body facing the open end. The light shielding element is made of opaque material and disposed between the open end and the light-emitting diode. The light shielding element defines a through hole configured for allowing light at a half-intensity angle of the light-emitting diode to pass therethrough. | 2011-04-21 |
20110090703 | SEMICONDUCTOR LIGHT EMITTING APPARATUS AND LIGHT SOURCE APPARATUS USING THE SAME - A semiconductor light emitting apparatus includes a solid-state light emitting device and a wavelength converter that converts primary light emitted by the solid-state light emitting device into secondary light at a loner-wavelength. The wavelength converter is an inorganic compact that includes a transparent wavelength conversion layer containing phosphor having a garnet crystal structure. The phosphor contains a constituent element group composed of at least one element selected from the group consisting of Mg, Ca, Sr, Ba, Y, La, Gd, Tb, and Lu. Part of the constituent element group is substituted by Ce | 2011-04-21 |
20110090704 | Molded Fluorescent Glass Lens and Manufacturing Method Thereof - A molded fluorescent glass lens and a manufacturing method thereof are disclosed. Firstly, coat fluorescent material on surface of a glass preform or a cavity of a mold core. Then by glass precision molding, the mold core is heated and pressured for casting the glass preform into a molded fluorescent glass lens. The fluorescent glass lens not only has shape and optical properties of the molded forming lens, but also has fluorescent properties from a fluorescent surface layer formed by fluorescent material inserted into the glass. Thus the produced molded fluorescent glass lens is applied to road reflectors, white light LED or other optical elements for use. | 2011-04-21 |
20110090705 | LUMINAIRE REFLECTOR - A luminaire reflector composed of a pot-like hollow, rotationally symmetrical, frustoconical reflector body having a peripheral wall that is circularly curved in a peripheral direction and increases in diameter from a rear side up to a front light exit opening is provided. The reflector body has an outwardly bent over, annular peripheral edge web that surrounds the light exit opening and is bounded by two circles of different radii. The peripheral wall of the reflector body is longitudinally divided into two to four shell-like wall parts correspondingly curved in the shape of a circular arc in a peripheral direction, or the peripheral may be formed from one piece. Each wall part, or the unitary peripheral wall, together with a part of the annular peripheral edge web, is formed from a pre-coated sheet metal material that is strongly optically reflecting at least on the inside. | 2011-04-21 |
20110090706 | AUTOMATIC ELECTRICAL CONNECTION ASSEMBLY FOR LIGHT MODULES - An illumination apparatus includes a solid state light emitting source and a first radiator thermally coupled to the solid state light emitting source, wherein the radiator is configured to be connectable to a second apparatus. The illumination apparatus further includes a one or more electrical conductors coupled to the radiator, wherein the electrical conductors are adapted to couple electrically to the solid state light emitting source. | 2011-04-21 |
20110090707 | MULTI-SOURCE SHADOWLESS OPERATING LAMP - A multi-source shadowless operating lamp is disclosed, which includes a central base, a link element received in the central base, and a plurality of spotlights mounted on a peripheral of the central base and spaced a distance apart from each other. A light field is defined below the central base and extends perpendicular to the central base. Each spotlight defines a light focus spot through the light field. The focus spots exactly pass the same height in the light field. Each spotlight includes a lamp shell connecting with the central base, a dissipation substrate accommodated in the lamp shell, and a plurality of LED sets. The LED sets at different positions respectively cast light to the focus spot of the spotlight. An angle between the dissipation substrate and the light shell is adjustable to change position of the focus spot of the spotlight relative to the light field. | 2011-04-21 |
20110090708 | Gobo Holder for a Gobo Wheel, and Gobo Wheel - A gobo holder for a gobo wheel has a base element, a gobo fastening element rotatably mounted to the base element, and a resilient latching member on the base element. The gobo holder is mounted to a gobo wheel having a latching feature for such time until a mechanical latching connection is achieved between the resilient latching member of the gobo holder and the latching feature of the gobo wheel. | 2011-04-21 |
20110090709 | ILLUMINATING DEVICE OF AN AUTOMOBILE'S TAILGATE HANDLE - The invention relates to an illuminating device of an automobile's tailgate handle. The illuminating device is installed in a groove formed in a tailgate handle, including a circuit board and a transparent covering. A through hole is bored in the groove. The circuit board is provided with plural LEDs and an electric wire connected with a control wire of an automobile's headlight. The transparent covering is put on the groove of the handle. Therefore, the LEDs in the handle can be lit as night warning signal if a car's headlight is turned on, as a turning signal a turning signal is turned on, or as a brake signal the brake is treaded on. | 2011-04-21 |
20110090710 | High Efficiency Light Pipe - Apparatus and method for transmitting concentrated light including concentrated solar energy over long distances, in particular from the stratosphere to earth's surface. The apparatus consists of a hollow gas tight tube light pipe ( | 2011-04-21 |
20110090711 | LIGHT EMITTING APPARATUS AND LIGHTING SYSTEM - A light emitting apparatus including a body including a first cavity; a first electrode and a second electrode on the body; a light emitting device disposed in the first cavity and being electrically connected with the first and the second electrodes; and a first molding member disposed in the first cavity, and including a fluorescent material. Further, a height ‘a’ of the light emitting device and a depth ‘y’ of the first cavity satisfy a relation 1.5a≦y≦3.0a, and the height ‘a’ and a horizontal distance ‘x’ from an upper outer edge of the light emitting device to an inner surface of the body forming the first cavity satisfy a relation 0.5a≦x≦1.5a. | 2011-04-21 |
20110090712 | PORTABLE COMPUTER DISPLAY HOUSING - A display housing for a portable computing device that utilizes a plastic cover bonded to an internal metal frame is described. To account for thermal cycling issues and in particular to prevent bond slippage, multiple types of adhesives are employed to join the metal frame and the plastic cover. In particular, a very high bond (VHB) adhesive material is used in certain areas to bond the metal inner frame to the plastic cover and a liquid adhesive is used in other areas. The plastic cover can be translucent to light. A method of coating the plastic cover to block light, such as from a backlight used for the display, is described. | 2011-04-21 |
20110090713 | FLEXIBLE BACKLIGHT MODULE - A flexible backlight module includes a light source module and a flexible light guide panel, wherein the flexible light guide panel has a light incident surface, a light reflecting surface, and a light outgoing surface. The light incident surface of the flexible light guide panel is directly connected and thereby optically coupled to the light source module so that the light emitted by the light source module can be completely coupled to the flexible light guide panel. Consequently, the loss of light is reduced while the luminous efficiency of light is increased. Light entering the flexible light guide panel is reflected by the light reflecting surface to the light outgoing surface and then projected outward. The flexible light guide panel can be curved as needed thanks to its flexibility and thus features a wide application range. | 2011-04-21 |
20110090714 | OUTPUT APPARATUS TO OUTPUT A VITAL OUTPUT FROM TWO SOURCES - An output apparatus includes a first source of a first signal having a first state or a different second state; a second source of a second signal having a first state or a different second state; and a circuit structured to output a vital output including a first state when the first state of the first signal corresponds to the first state of the second signal and, otherwise, including a different second state. At least one of the first signal and the second signal is a static signal. The other one of the first signal having the first state and the second signal having the first state is a dynamic signal. When at least one of the first signal has the different second state of the first signal and the second signal has the different second state of the second signal, the vital output includes the different second state. | 2011-04-21 |
20110090715 | ISOLATED SWITCHING POWER SUPPLY APPARATUS - A transformer includes a first secondary winding, a second secondary winding, and a third secondary winding. The second secondary winding and the third secondary winding are wound to include the same number of turns and to have opposite magnetic polarities. A low-pass filter includes a second inductor defined by a leakage inductance of the second secondary winding connected in series with the second secondary winding, a second inductor defined by a leakage inductance of the third secondary winding connected in series with the third secondary winding, and a second capacitor. An output voltage is output from an output terminal of the low-pass filter. | 2011-04-21 |
20110090716 | DC-DC CONVERTER WITH SNUBBER CIRCUIT - In order to achieve an object to reduce a surge voltage and suppress noise generation, the present invention provides a DC-DC converter with a snubber circuit, which boosts a voltage Vi of a DC power supply. The snubber circuit includes: a series circuit connected to both ends of a smoothing capacitor Co and including a snubber capacitor Cs and a snubber resistor Rs; a snubber diode Ds | 2011-04-21 |
20110090717 | Two-stage insulated bidirectional DC/DC power converter using a constant duty ratio LLC resonant converter - A two-stage insulated bidirectional DC/DC power converter is disclosed. A two-stage insulated bidirectional DC/DC power converter according to an embodiment of the invention has the characteristic of including: an LLC resonant converter operating at a constant duty ratio; a bidirectional converter joined to a front part of the LLC resonant converter and configured to perform a booster converter function of outputting the input voltage at a consistent input voltage for the LLC resonant converter, and a buck converter function of reducing the voltage by way of the LLC resonant converter and then outputting a consistent voltage; and a bidirectional converter control unit configured to control changes in an input voltage of the bidirectional converter and regulate an output voltage of the LLC resonant converter to thereby maintain a consistent input voltage of the LLC resonant converter, such that the LLC resonant converter operates at a constant duty ratio. | 2011-04-21 |
20110090718 | SWITCHING POWER SUPPLY DEVICE - The present invention has as an object to introduce a switching power supply device having a simple circuit structure and controlling a secondary-side output voltage in a highly-accurate and stable manner. The switching power supply device includes: an auxiliary winding resetting detecting circuit which is connected to the auxiliary winding, monitors an auxiliary winding voltage pulse signal generated on the auxiliary winding, and generates an auxiliary winding reset signal indicating timing of which a secondary-side current finishes flowing into the secondary winding and the auxiliary winding voltage signal drops; and an auxiliary winding voltage sample hold circuit which holds the auxiliary winding voltage signal. The auxiliary winding voltage sample hold circuit includes a delaying circuit which delays the auxiliary winding voltage signal, and holds the auxiliary winding voltage pulse signal delayed by the delaying circuit with the timing indicated by the auxiliary winding reset signal. | 2011-04-21 |
20110090719 | RF ISOLATION FOR POWER CIRCUITRY - System and method for providing isolated power to a component that is also subject a set of RF signals that includes at least a first RF signal having a first RF frequency is provided. There is included providing a DC voltage signal and modulating the DC voltage signal into an isolated power signal using an isolation transformer. The isolated power signal has an intermediate frequency that is higher than 60 Hz and lower than the first RF frequency. There is included supplying the DC voltage signal to the primary winding and obtaining the isolated power signal from the secondary winding; and delivering the isolated power to the component using the isolated power signal. | 2011-04-21 |
20110090720 | UNIT INVERTER SYSTEM - In a unit inverter system where multiple unit inverters are connected in parallel, the quantity of operating unit inverters is determined in accordance with an amount of power to be converted. A gate signal of a semiconductor switching element of a unit inverter is turned off after an output current of the inverter is reduced when reducing the quantity of inverter units, thereby improving the partial load efficiency of the system without an adverse effect on the system. A regulator connected to the inverter determines dead time of the inverter according to the output current value and an average output current value of the unit inverters, waits for the determined dead time so as to reduce the output current of the unit inverter, and then turns off the gate signal. | 2011-04-21 |
20110090721 | CAPACITIVE MATRIX CONVERTERS - A direct current (DC) to DC converter, including: input ports for receiving an input DC voltage; output ports for outputting an output DC voltage; a first matrix of capacitors and switches; a second matrix of capacitors and switches; and a control circuit, coupled to the switches of the first and second matrices, configure d to repetitively: (i) configure the first matrix to a charge configuration and couple the first matrix to the input ports while configuring the second matrix to a discharge configuration and coupling the second matrix to the output ports; (ii) maintain the charge and discharge configurations for a first period of time; (iii) configure the second matrix to the charge configuration and couple the second matrix to the input ports while configuring the first matrix to the discharge configuration and couple the first matrix to the output ports; and (iv) maintain the charge and discharge configurations for a second period of time; (a) wherein the charge configuration and the discharge configurations of each matrix out of the first and second matrices differ from each other by a replacement of serial connections of capacitors of the matrix to parallel connections of capacitors of the matrix; (b) wherein the charge configuration and a discharge configuration of each of the first and second matrices are responsive to required conversion ratio between the input DC voltage and the output DC voltage; and (c) each matrix of the first and second matrices comprises at least four capacitors. | 2011-04-21 |
20110090722 | VOLTAGE CONVERTER - A switched capacitor DC-DC voltage converter comprising: a first circuit ( | 2011-04-21 |
20110090723 | CONTACTLESS POWER RECEIVER AND METHOD OF OPERATION - A contactless power receiver is provided with a dynamically tuned pick up coil. The power transfer capacity of this power receiver is dynamically tuned using semiconductor devices that are operated in linear mode over part of their operation. The semiconductor devices are driven by a controller that is configured to implement a range of control strategies depending on system requirements. The semiconductor device may be used by itself or in conjunction with reactive elements to dynamically tune the pick up coil. In some implementations the contactless power receiver maybe configured to work with a consumer electronic or a wireless sensor device. The contactless power receiver can be integrated with the energy storage component of the device to provide a retrofit solution for existing products. The device can then be placed in vicinity of a planar magnetic field generated by a charging pad. | 2011-04-21 |
20110090724 | POWER CONVERTER - An isolated power converter comprising a transformer arranged in such a way that the mirrored primary voltage on the secondary side has a positive potential relative to ground, said converter comprising a derivating net arranged to cause the second transistor to conduct in dependence of the voltage across the secondary winding, the source of the second transistor being connected to the negative end of the secondary winding, the drain of a third transistor further being connected to the positive end of the secondary winding, a second capacitor and a second resistor being connected between the gate and the source of the third transistor, a third resistor connected between the second resistor and the drain of the second transistor, a third capacitor connected between the sources of the second and third transistors to provide a first output voltage on one terminal of the third capacitor and a second output voltage on the other terminal of the third capacitor. | 2011-04-21 |
20110090725 | Systems and Methods of Synchronous Rectifier Control - Systems and methods for synchronous rectifier control are provided. A synchronous rectifier includes parasitic drain inductance and parasitic source inductance. Compensation inductance is introduced to offset the effects of parasitic inductance. Compensation inductance may be formed from the trace inductance on the semiconductor die. In certain semiconductor packages, the parasitic inductance may be substantially fixed such that the layout can be modified to generate fixed compensation inductance. | 2011-04-21 |
20110090726 | PORTABLE ALTERNATING CURRENT INVERTER HAVING REDUCED IMPEDANCE LOSSES - A portable power supply apparatus is provided having reduced impedance losses. The portable power supply apparatus is comprised of: a portable housing; a battery system residing in the housing; and an inverter circuit residing in the housing. The battery system generates a direct current (DC) voltage having a magnitude greater than or equal to a peak value of a desired alternating current (AC) voltage. The inverter circuit receives the DC voltage directly from the battery system, converts the DC voltage to an AC output voltage and outputs the AC output voltage to one or more outlets exposed on an exterior surface of the portable housing. | 2011-04-21 |
20110090727 | Memory Module Having Signal Lines Configured for Sequential Arrival of Signals at Synchronous Memory Devices - A memory module includes a first signal line to carry a first signal. The first signal line has (i) a first line segment disposed along a length of the memory module and coupled to a termination, and (ii) a second line segment disposed along a width of the memory module and coupled to an edge finger. The first line segment and the second line segment are coupled together at a turn. A first synchronous memory device and a second synchronous memory device are coupled to the first line segment. The first signal arrives at the first synchronous memory device and the second synchronous memory device in a sequential manner. The memory module includes a clock line routed alongside the first signal line. A clock signal arrives at the first synchronous memory device and the second synchronous memory device in sequence alongside the first signal traversing along the first signal line. | 2011-04-21 |
20110090728 | MEMORY CORE AND SEMICONDUCTOR MEMORY DEVICE HAVING THE SAME - A memory core capable of decreasing the area of core conjunction region is disclosed. The memory core includes a first sub word-line driving circuit and a first sub word-line control signal generating circuit. The first sub word-line driving circuit is disposed in a first region, and generates a first word-line driving signal to provide the first word-line driving signal to an array unit. The first sub word-line control signal generating circuit is disposed in the first region, and generates the first sub word-line control signal based on a sub word-line driving signal. Therefore, the memory core has a small size and, consequently so can the semiconductor device. | 2011-04-21 |
20110090729 | SEMICONDUCTOR STORAGE DEVICE AND ROM GENERATOR - According to one embodiment, a semiconductor storage device includes a first memory cell, a second memory cell and a third memory cell. The first memory cell forms a connection path used for storage of data. The second memory cell varies a connection place from a connection place of the connection path formed in the first memory cell, and stores data different from the data stored in the first memory cell is stored. The third memory cell varies a connection place from the connection place of the connection path formed in the second memory cell, and stores data same as the data stored in the first memory cell is stored. | 2011-04-21 |
20110090730 | MAGNETIC MEMORY STRUCTURE AND OPERATION METHOD - A magnetic memory structure includes a memory track which has consecutive magnetic domains. Each of the magnetic domains has memory capacity of one bit. A first domain-wall injecting layer intersects and connects a terminal of the memory track and constantly stores a first binary data. A second domain-wall injecting layer against the first domain-wall injecting layer intersects and connects the terminal of the memory track and constantly stores a second binary data different from the first binary data. The memory track and one of the first domain-wall injecting layer and the second domain-wall injecting layer together form a domain wall. | 2011-04-21 |
20110090731 | GREEN TRANSISTOR FOR NANO-SI FERRO-ELECTRIC RAM AND METHOD OF OPERATING THE SAME - The present disclosure provides a green transistor for nano-Si Ferro-electric random access memory (FeRAM) and method of operating the same. The nano-Si FeRAM includes a plurality of memory cells arranged in an array with bit-lines and word-lines, and each memory cell includes a MOSFET including a gate, a source, a drain, a substrate, and a data storage element formed on the drain spacer of the gate and made of nano-Si in porous SiO | 2011-04-21 |
20110090732 | Magnetic Tunnel Junction Cell Adapted to Store Multiple Digital Values - A particular magnetic tunnel junction (MTJ) cell includes a side wall defining a first magnetic domain adapted to store a first digital value. The MTJ cell also includes a bottom wall coupled to the side wall and defining a second magnetic domain adapted to store a second digital value. | 2011-04-21 |
20110090733 | MEMORY WITH SEPARATE READ AND WRITE PATHS - A memory unit includes a giant magnetoresistance cell electrically coupled between a write bit line and a write source line. The giant magnetoresistance cell includes a free magnetic layer separated from a first pinned magnetic layer by a first non-magnetic electrically conducting layer. A magnetic tunnel junction data cell is electrically coupled between a read bit line and a read source line. The magnetic tunnel junction data cell includes the free magnetic layer separated from a second pinned magnetic layer by an oxide barrier layer. A write current passes through the giant magnetoresistance cell to switche the giant magnetoresistance cell between a high resistance state and a low resistance state. The magnetic tunnel junction data cell is configured to switch between a high resistance state and a low resistance state by magnetostatic coupling with the giant magnetoresistance cell, and be read by a read current passing though the magnetic tunnel junction data cell. | 2011-04-21 |
20110090734 | METHODS AND APPARATUS FOR STORING DATA IN A MULTI-LEVEL CELL FLASH MEMORY DEVICE WITH CROSS-PAGE SECTORS, MULTI-PAGE CODING AND PER-PAGE CODING - Methods and apparatus are provided for storing data in a multi-level cell flash memory device with cross-page sectors, multi-page coding and per-page coding. A single sector can be stored across a plurality of pages in the flash memory device. Per-page control is provided of the number of sectors in each page, as well the code and/or code rate used for encoding and decoding a given page, and the decoder or decoding algorithm used for decoding a given page. Multi-page and wordline level access schemes are also provided. | 2011-04-21 |
20110090735 | EXPANDED PROGRAMMING WINDOW FOR NON-VOLATILE MULTILEVEL MEMORY CELLS - Embodiments of the present disclosure provide methods, devices, modules, and systems for utilizing an expanded programming window for non-volatile multilevel memory cells. One method includes associating a different logical state with each of a number of different threshold voltage (Vt) distributions. In various embodiments, at least two Vt distributions include negative Vt levels. The method includes applying a read voltage to a word line of a selected cell while applying a pass voltage to word lines of unselected cells, applying a boost voltage to a source line coupled to the selected cell, applying a voltage greater than the boost voltage to a bit line of the selected cell, and sensing a current variation of the bit line in response to the selected cell changing from a non-conducting state to a conducting state. | 2011-04-21 |
20110090736 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a sense amplifier which senses identical multilevel data, which is stored in a memory cell, a plurality of number of times at a time of read, and a n-channel MOS transistor which has a current path one end of which is connected to the sense amplifier and the other end of which is connected to a bit line. The device further include a control unit which applies a first voltage to a gate electrode of the n-channel MOS transistor, thereby setting the n-channel MOS transistor in an ON state, and applies a second voltage which is higher than the first voltage, to the gate electrode during a period after first sense and before second sense. | 2011-04-21 |
20110090737 | 3D NON-VOLATILE MEMORY DEVICE AND METHOD FOR OPERATING AND FABRICATING THE SAME - A 3D non-volatile memory device includes a plate-type lower select line formed over a substrate, a lower select transistor formed in the lower select line, a plurality of memory cells stacked over the lower select transistor, an upper select transistor formed over the memory cells, and a line-type common source line formed over the substrate and spaced from the lower select line. | 2011-04-21 |
20110090738 | NAND FLASH MEMORY DEVICE HAVING DUMMY MEMORY CELLS AND METHODS OF OPERATING SAME - A NAND flash memory device includes a control circuit configured to apply, during a program operation, a first word line voltage to non-selected ones of a plurality of serially-connected memory cells, a second word line voltage greater than the first word line voltage to a selected one of the plurality of memory cells, and a third word line voltage lower than the first word line voltage to a dummy memory cell connected in series with the plurality of memory cells. In other embodiments, a control circuit is configured to program a dummy memory cell before and/or after each erase operation on a plurality of memory cells connected in series therewith. In still other embodiments, a control circuit is configured to forego erasure of a dummy memory cell while erasing a plurality of memory cells connected in series therewith. | 2011-04-21 |
20110090739 | INDEPENDENT WELL BIAS MANAGEMENT IN A MEMORY DEVICE - Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods. | 2011-04-21 |
20110090740 | NONVOLATILE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A flash memory device comprises alternately arranged odd and even memory cells. The odd and even memory cells are connected to corresponding odd and even bitlines, which are connected to corresponding odd and even page buffers. In a read operation of the flash memory device, data is sensed at two different times via the odd and even bitlines. In certain embodiments, data is read from the odd page buffers while data is being sensed via the even bit lines, or vice versa. | 2011-04-21 |
20110090741 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE ADAPTED TO STORE A MULTI-VALUED DATA IN A SINGLE MEMORY CELL - A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell. | 2011-04-21 |
20110090742 | SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS - In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable. | 2011-04-21 |
20110090743 | Sub Volt Flash Memory System - Various circuits include MOS transistors that have a bulk voltage terminal for receiving a bulk voltage that is different from a supply voltage and ground. The bulk voltage may be selectively set so that some MOS transistors have a bulk voltage set to the supply voltage or ground and other MOS transistors have a bulk voltage that is different. The bulk voltage may be set to forward or reverse bias pn junctions in the MOS transistor. The various circuits include comparators, operational amplifiers, sensing circuits, decoding circuits and the other circuits. The circuits may be included in a memory system. | 2011-04-21 |
20110090744 | CHANNEL PRECHARGE AND PROGRAM METHODS OF A NONVOLATILE MEMORY DEVICE - A channel pre-charge method of a nonvolatile memory device including a cell string includes pre-charging a channel of the cell string according to a first word line bias condition and pre-charging the channel of the cell string according to a second word line bias condition, different than the first word line bias condition. | 2011-04-21 |
20110090745 | SENSE AMPLIFIER WITH FAST BITLINE PRECHARGE MEANS - The disclosure relates to a sense amplifier comprising a cascode transistor and means for biasing the cascode transistor, supplying a control voltage to a gate terminal of the cascode transistor. The means for biasing the cascode transistor comprise means for isolating the gate terminal of the cascode transistor from the output of the voltage generator during a first period of the precharge phase, so as to boost the bitline voltage, then for linking the gate terminal to the output of the voltage generator during a second period of the precharge phase. Application in particular to sense amplifiers for non-volatile memories. | 2011-04-21 |
20110090746 | DEVICE AND METHOD GENERATING INTERNAL VOLTAGE IN SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device and a method of generating an internal voltage in the semiconductor memory device are provided. The semiconductor memory device includes a controller configured to activate a sensing enable signal when an active command is applied from outside, inactivate the sensing enable signal when a precharge command is applied, and output the sensing enable signal, and an array internal voltage generator configured to output an active array power supply voltage as an array power supply voltage when the sensing enable signal is activated, output an external array power supply voltage and a standby array power supply voltage as the array power supply voltage when the sensing enable signal is inactivated, and output the standby array power supply voltage alone as the array power supply voltage when the sensing enable signal is inactivated for at least a specific period. | 2011-04-21 |
20110090747 | INTEGRATED CIRCUIT COMPRISING A NON-DEDICATED TERMINAL FOR RECEIVING AN ERASE PROGRAM HIGH VOLTAGE - The disclosure relates to an integrated circuit electrically powered by a supply voltage and comprising a memory electrically erasable and/or programmable by means of a second voltage greater than the supply voltage. The integrated circuit comprises means for receiving the second voltage by the intermediary of a reception terminal of the supply voltage or by the intermediary of a reception or emission terminal of a data or clock signal. Applicable in particular to electronic tags comprising a reduced number of interconnection terminals. | 2011-04-21 |
20110090748 | DEVICE FOR SUPPLYING A HIGH ERASE PROGRAM VOLTAGE TO AN INTEGRATED CIRCUIT - The disclosure relates to a device for supplying to at least one integrated circuit a high voltage for erasing and/or programming of a memory. The device includes at least one contact terminal linked to at least one contact terminal of the integrated circuit, a monitor for monitoring a data signal received by the integrated circuit and detecting in the data signal a write command of the memory, and a voltage supplier for applying the high voltage to a terminal of the integrated circuit when a write command of the memory has been detected by the monitor. | 2011-04-21 |