16th week of 2017 patent applcation highlights part 51 |
Patent application number | Title | Published |
20170110338 | Near-Unity Photoluminescence Quantum Yield in MoS2 | 2017-04-20 |
20170110339 | IC DEVICE HAVING PATTERNED, NON-CONDUCTIVE SUBSTRATE | 2017-04-20 |
20170110340 | LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL | 2017-04-20 |
20170110341 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2017-04-20 |
20170110342 | DIE MOUNTING SYSTEM AND DIE MOUNTING METHOD | 2017-04-20 |
20170110343 | Semiconductor Device Leadframe | 2017-04-20 |
20170110344 | WET ETCHING APPARATUS | 2017-04-20 |
20170110345 | DISPENSE NOZZLE WITH A SHIELDING DEVICE | 2017-04-20 |
20170110346 | METAL LIFTOFF TOOLS AND METHODS | 2017-04-20 |
20170110347 | SUBSTRATE SUPPORTING UNIT, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SUBSTRATE SUPPORTING UNIT | 2017-04-20 |
20170110348 | Decapsulation System | 2017-04-20 |
20170110349 | SUBSTRATE PROCESSING SYSTEM | 2017-04-20 |
20170110350 | SERVICE TUNNEL FOR USE ON CAPITAL EQUIPMENT IN SEMICONDUCTOR MANUFACTURING AND RESEARCH FABS | 2017-04-20 |
20170110351 | LOAD LOCK INTERFACE AND INTEGRATED POST-PROCESSING MODULE | 2017-04-20 |
20170110352 | SUBSTRATE CARRIER SYSTEM | 2017-04-20 |
20170110353 | WAFER BOAT, ANNEALING TOOL AND ANNEALING METHOD | 2017-04-20 |
20170110354 | WAFER TRANSPORT ASSEMBLY WITH INTEGRATED BUFFERS | 2017-04-20 |
20170110355 | SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATE FOR SUBSTRATE RELATED TO PHOTOMASK | 2017-04-20 |
20170110356 | ELECTROSTATIC CHUCK DESIGN FOR COOLING-GAS LIGHT-UP PREVENTION | 2017-04-20 |
20170110357 | HEATING MEMBER, ELECTROSTATIC CHUCK, AND CERAMIC HEATER | 2017-04-20 |
20170110358 | PIXELATED CAPACITANCE CONTROLLED ESC | 2017-04-20 |
20170110359 | CONTROLLED SPALLING UTILIZING VAPORIZABLE RELEASE LAYERS | 2017-04-20 |
20170110360 | WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER | 2017-04-20 |
20170110361 | DIELECTRIC WITH AIR GAPS FOR USE IN SEMICONDUCTOR DEVICES | 2017-04-20 |
20170110362 | SOI STRUCTURE AND FABRICATION METHOD | 2017-04-20 |
20170110363 | LIQUID COMPOSITION FOR CLEANING SEMICONDUCTOR DEVICE, METHOD FOR CLEANING SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2017-04-20 |
20170110364 | REVERSE SELF ALIGNED DOUBLE PATTERNING PROCESS FOR BACK END OF LINE FABRICATION OF A SEMICONDUCTOR DEVICE | 2017-04-20 |
20170110365 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | 2017-04-20 |
20170110366 | PHOTOMASK FOR FORMING MULTIPLE LAYER PATTERNS WITH A SINGLE EXPOSURE | 2017-04-20 |
20170110367 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE | 2017-04-20 |
20170110368 | SELECTIVE BOTTOM-UP METAL FEATURE FILLING FOR INTERCONNECTS | 2017-04-20 |
20170110369 | ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME | 2017-04-20 |
20170110370 | SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STRUCTURES | 2017-04-20 |
20170110371 | METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP | 2017-04-20 |
20170110372 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2017-04-20 |
20170110373 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR AND METHOD THEREOF | 2017-04-20 |
20170110374 | NANOWIRE CHANNEL STRUCTURES OF CONTINUOUSLY STACKED NANOWIRES FOR COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) DEVICES | 2017-04-20 |
20170110375 | INTEGRATED CIRCUIT WITH REPLACEMENT GATE STACKS AND METHOD OF FORMING SAME | 2017-04-20 |
20170110376 | STRUCTURES WITH THINNED DIELECTRIC MATERIAL | 2017-04-20 |
20170110377 | METHOD AND DEVICE FOR LEVELING A SUBSTRATE STACK | 2017-04-20 |
20170110378 | METHOD FOR ESTIMATING DEPTH OF LATENT SCRATCHES IN SiC SUBSTRATES | 2017-04-20 |
20170110379 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | 2017-04-20 |
20170110380 | MONITORING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2017-04-20 |
20170110381 | EXTERNAL GETTERING METHOD AND DEVICE | 2017-04-20 |
20170110382 | SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR MODULE | 2017-04-20 |
20170110383 | SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC ABSORPTION AND SHIELDING | 2017-04-20 |
20170110384 | Heat Spreader Having Thermal Interface Material Retainment | 2017-04-20 |
20170110385 | HEAT-CONDUCTIVE SHEET AND PRODUCTION METHOD THEREFOR | 2017-04-20 |
20170110386 | HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATING COMPONENT, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, INTEGRATED MODULE, AND INFORMATION PROCESSING SYSTEM | 2017-04-20 |
20170110387 | SEMICONDUCTOR DEVICE WITH HEAT INFORMATION MARK | 2017-04-20 |
20170110388 | SEMICONDUCTOR DEVICE | 2017-04-20 |
20170110389 | LEAD FRAME AND SEMICONDUCTOR DEVICE | 2017-04-20 |
20170110390 | SUPPORT AND/OR CLIP FOR SEMICONDUCTOR ELEMENTS, SEMICONDUCTOR COMPONENT, AND PRODUCTION METHOD | 2017-04-20 |
20170110391 | SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS | 2017-04-20 |
20170110392 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME STRUCTURE | 2017-04-20 |
20170110393 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | 2017-04-20 |
20170110394 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 2017-04-20 |
20170110395 | SEMICONDUCTOR DEVICE | 2017-04-20 |
20170110396 | Integrated secure device | 2017-04-20 |
20170110397 | METHOD AND APPARATUS FOR FORMING SELF-ALIGNED VIA WITH SELECTIVELY DEPOSITED ETCHING STOP LAYER | 2017-04-20 |
20170110398 | INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME | 2017-04-20 |
20170110399 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | 2017-04-20 |
20170110400 | LAYOUT METHOD FOR COMPOUND SEMICONDUCTOR INTEGRATED CIRCUITS | 2017-04-20 |
20170110401 | BONDING STRUCTURES AND METHODS FORMING THE SAME | 2017-04-20 |
20170110402 | CONDUCTIVE STRUCTURES, SYSTEMS AND DEVICES INCLUDING CONDUCTIVE STRUCTURES AND RELATED METHODS | 2017-04-20 |
20170110403 | PACKAGE STRUCTURE, FAN-OUT PACKAGE STRUCTURE AND METHOD OF THE SAME | 2017-04-20 |
20170110404 | TRENCH MOSFET WITH SELF-ALIGNED BODY CONTACT WITH SPACER | 2017-04-20 |
20170110405 | Dual Power Structure with Connection Pins | 2017-04-20 |
20170110406 | SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT | 2017-04-20 |
20170110407 | INTERPOSER-LESS STACK DIE INTERCONNECT | 2017-04-20 |
20170110408 | INTEGRATED CIRCUIT ASSEMBLY | 2017-04-20 |
20170110409 | METHOD OF FORMING DEEP TRENCH AND DEEP TRENCH ISOLATION STRUCTURE | 2017-04-20 |
20170110410 | MARK FORMING METHOD AND DEVICE MANUFACTURING METHOD | 2017-04-20 |
20170110411 | HEAT SINK OF A METALLIC SHIELDING STRUCTURE | 2017-04-20 |
20170110412 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2017-04-20 |
20170110413 | WAFER LEVEL SHIELDING IN MULTI-STACKED FAN OUT PACKAGES AND METHODS OF FORMING SAME | 2017-04-20 |
20170110414 | COMPOUND SEMICONDUCTOR SUBSTRATE | 2017-04-20 |
20170110415 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS | 2017-04-20 |
20170110416 | CHIP PACKAGE HAVING A PROTECTION PIECE COMPLIANTLY ATTACHED ON A CHIP SENSING SURFACE | 2017-04-20 |
20170110417 | EXTREMELY STRETCHABLE ELECTRONICS | 2017-04-20 |
20170110418 | DIGITAL CIRCUIT AND METHOD FOR MANUFACTURING A DIGITAL CIRCUIT | 2017-04-20 |
20170110419 | WAFER LEVEL PACKAGE WITH TSV-LESS INTERPOSER | 2017-04-20 |
20170110420 | TRAP LAYER SUBSTRATE STACKING TECHNIQUE TO IMPROVE PERFORMANCE FOR RF DEVICES | 2017-04-20 |
20170110421 | Semiconductor Device and Method | 2017-04-20 |
20170110422 | SURFACE FINISHES FOR INTERCONNECTION PADS IN MICROELECTRONIC STRUCTURES | 2017-04-20 |
20170110423 | SEMICONDUCTOR CHIP DEVICE | 2017-04-20 |
20170110424 | Semiconductor Die Contact Structure and Method | 2017-04-20 |
20170110425 | INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURES AND METHODS OF FORMING SAME | 2017-04-20 |
20170110426 | LID STRUCTURE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING THE SAME | 2017-04-20 |
20170110427 | CHIP PACKAGE AND METHOD FOR MANUFACTURING SAME | 2017-04-20 |
20170110428 | SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION AND POLYMER FILM | 2017-04-20 |
20170110429 | SEMICONDUCTOR DEVICE WITH AN ANTI-PAD PEELING STRUCTURE AND ASSOCIATED METHOD | 2017-04-20 |
20170110430 | BONDING WIRE FOR SEMICONDUCTOR DEVICE | 2017-04-20 |
20170110431 | PILLAR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2017-04-20 |
20170110432 | PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME | 2017-04-20 |
20170110433 | APPARATUS FOR REMOVING CHIP | 2017-04-20 |
20170110434 | HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND PROCESS FOR MAKING THE SAME | 2017-04-20 |
20170110435 | METHOD FOR HEATING A METAL MEMBER, METHOD FOR BONDING HEATED METAL MEMBERS, AND APPARATUS FOR HEATING A METAL MEMBER | 2017-04-20 |
20170110436 | PLASMA ETCH SINGULATED SEMICONDUCTOR PACKAGES AND RELATED METHODS | 2017-04-20 |
20170110437 | WIRE BOND CLEANING METHOD AND WIRE BONDING RECOVERY PROCESS | 2017-04-20 |