15th week of 2017 patent applcation highlights part 42 |
Patent application number | Title | Published |
20170103876 | PLASMA GENERATOR, ANNEALING DEVICE, DEPOSITION CRYSTALLIZATION APPARATUS AND ANNEALING PROCESS | 2017-04-13 |
20170103877 | PLASMA ETCHING METHOD | 2017-04-13 |
20170103878 | Coupling device for mass spectrometry apparatus | 2017-04-13 |
20170103879 | SAMPLE ANALYSIS SYSTEMS AND METHODS OF USE THEREOF | 2017-04-13 |
20170103880 | SYSTEMS FOR SEPARATING IONS AND NEUTRALS AND METHODS OF OPERATING THE SAME | 2017-04-13 |
20170103881 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2017-04-13 |
20170103882 | Method of Manufacturing Semiconductor Wafers and Method of Manufacturing a Semiconductor Device | 2017-04-13 |
20170103883 | Method for Forming Aluminum-Containing Dielectric Layer | 2017-04-13 |
20170103884 | Deposited Material and Method of Formation | 2017-04-13 |
20170103885 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE-PROCESSING APPARATUS, AND RECORDING MEDIUM | 2017-04-13 |
20170103886 | Method for Producing a Semiconductor Using a Vacuum Furnace | 2017-04-13 |
20170103887 | METHOD FOR FORMING EPITAXIAL LAYER | 2017-04-13 |
20170103888 | AMINE CATALYSTS FOR LOW TEMPERATURE ALD/CVD SiO2 DEPOSITION USING HEXACHLORODISILANE/H2O | 2017-04-13 |
20170103889 | Method for Producing a Pillar Structure in a Semiconductor Layer | 2017-04-13 |
20170103890 | POLYCRYSTALLINE SEMICONDUCTOR LAYER AND FABRICATING METHOD THEREOF | 2017-04-13 |
20170103891 | METHODS OF FORMING PATTERNS OF A SEMICONDUCTOR DEVICES | 2017-04-13 |
20170103892 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | 2017-04-13 |
20170103893 | ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS | 2017-04-13 |
20170103894 | Method of Manufacturing a Silicon Carbide Semiconductor Device by Removing Amorphized Portions | 2017-04-13 |
20170103895 | LASER IRRADIATION APPARATUS AND LASER IRRADIATION METHOD | 2017-04-13 |
20170103896 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2017-04-13 |
20170103897 | DEVICES WITH MULTIPLE THRESHOLD VOLTAGES FORMED ON A SINGLE WAFER USING STRAIN IN THE HIGH-K LAYER | 2017-04-13 |
20170103898 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2017-04-13 |
20170103899 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | 2017-04-13 |
20170103900 | METHOD FOR FORMING WAFER | 2017-04-13 |
20170103901 | CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING | 2017-04-13 |
20170103902 | Laser-Induced Forming and Transfer of Shaped Metallic Interconnects | 2017-04-13 |
20170103903 | METHOD OF MANUFACTURING BONDED BODY | 2017-04-13 |
20170103904 | INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY | 2017-04-13 |
20170103905 | METHOD FOR PACKAGING AN INTEGRATED CIRCUIT DEVICE WITH STRESS BUFFER | 2017-04-13 |
20170103906 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2017-04-13 |
20170103907 | DIODE LASER FOR WAFER HEATING FOR EPI PROCESSES | 2017-04-13 |
20170103908 | SUBSTRATE CARRIER FOR ACTIVE/PASSIVE BONDING AND DE-BONDING OF A SUBSTRATE | 2017-04-13 |
20170103909 | SUBSTRATE ANGLE ALIGNMENT DEVICE, SUBSTRATE ANGLE ALIGNMENT METHOD, AND SUBSTRATE TRANSFER METHOD | 2017-04-13 |
20170103910 | METHOD OF USING A WAFER CASSETTE TO CHARGE AN ELECTROSTATIC CARRIER | 2017-04-13 |
20170103911 | CONTROL SYSTEMS EMPLOYING DEFLECTION SENSORS TO CONTROL CLAMPING FORCES APPLIED BY ELECTROSTATIC CHUCKS, AND RELATED METHODS | 2017-04-13 |
20170103912 | TOOL FOR MANIPULATING SUBSTRATES, MANIPULATION METHOD AND EPITAXIAL REACTOR | 2017-04-13 |
20170103913 | METHOD FOR MANUFACTURE OF A SEMICONDUCTOR WAFER SUITABLE FOR THE MANUFACTURE OF AN SOI SUBSTRATE, AND SOI SUBSTRATE WAFER THUS OBTAINED | 2017-04-13 |
20170103914 | METHODS FOR FORMATION OF LOW-K ALUMINUM-CONTAINING ETCH STOP FILMS | 2017-04-13 |
20170103915 | Method for Interconnect Scheme | 2017-04-13 |
20170103916 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2017-04-13 |
20170103917 | FORMING REPLACEMENT LOW-K SPACER IN TIGHT PITCH FIN FIELD EFFECT TRANSISTORS | 2017-04-13 |
20170103918 | Contact Structure of Gate Structure | 2017-04-13 |
20170103919 | FABRICATION METHOD FOR SEMICONDUCTOR DEVICE | 2017-04-13 |
20170103920 | WAFER PROCESSING METHOD | 2017-04-13 |
20170103921 | PROCESSING METHOD OF OPTICAL DEVICE WAFER | 2017-04-13 |
20170103922 | METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING BACK LAYER | 2017-04-13 |
20170103923 | MULTI-GATE TRANSISTOR WITH VARIABLY SIZED FIN | 2017-04-13 |
20170103924 | METHOD FOR INSPECTING PHOTORESIST PATTERN | 2017-04-13 |
20170103925 | METHOD OF MEASURING A SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME | 2017-04-13 |
20170103926 | MOUNTING SUBSTRATE AND ELECTRONIC APPARATUS | 2017-04-13 |
20170103927 | MULTI-DIE PACKAGE COMPRISING UNIT SPECIFIC ALIGNMENT AND UNIT SPECIFIC ROUTING | 2017-04-13 |
20170103928 | POLISHING METHOD AND POLISHING APPARATUS | 2017-04-13 |
20170103929 | SEMICONDUCTOR CHIPS HAVING DEFECT DETECTING CIRCUITS | 2017-04-13 |
20170103930 | STACKED SEMICONDUCTOR APPARATUS BEING ELECTRICALLY CONNECTED THROUGH THROUGH-VIA AND MONITORING METHOD | 2017-04-13 |
20170103931 | SCAN TESTABLE THROUGH SILICON VIAs | 2017-04-13 |
20170103932 | SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULATED STACKED-SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SAME | 2017-04-13 |
20170103933 | Isolation Rings for Packages and the Method of Forming the Same | 2017-04-13 |
20170103934 | HEAT SINK FOR A SEMICONDUCTOR CHIP DEVICE | 2017-04-13 |
20170103935 | FLOW PASSAGE MEMBER AND SEMICONDUCTOR MODULE | 2017-04-13 |
20170103936 | DBC STRUCTURE USING A SUPPORT INCORPORATING A PHASE CHANGE MATERIAL | 2017-04-13 |
20170103937 | Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices | 2017-04-13 |
20170103938 | SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME | 2017-04-13 |
20170103939 | ULTRATHIN ROUTABLE QUAD FLAT NO-LEADS (QFN) PACKAGE | 2017-04-13 |
20170103940 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2017-04-13 |
20170103941 | PACKAGE WITH BI-LAYERED DIELECTRIC STRUCTURE | 2017-04-13 |
20170103942 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE | 2017-04-13 |
20170103943 | MOLDING COMPOUND WRAPPED PACKAGE SUBSTRATE | 2017-04-13 |
20170103944 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE | 2017-04-13 |
20170103945 | WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2017-04-13 |
20170103946 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2017-04-13 |
20170103947 | FACETED STRUCTURE FORMED BY SELF-LIMITING ETCH | 2017-04-13 |
20170103948 | INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME | 2017-04-13 |
20170103949 | FORMING INTERLAYER DIELECTRIC MATERIAL BY SPIN-ON METAL OXIDE DEPOSITION | 2017-04-13 |
20170103950 | RESIN STRUCTURE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN, AND METHOD FOR MANUFACTURING SAID STRUCTURE | 2017-04-13 |
20170103951 | FAN-OUT SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2017-04-13 |
20170103952 | NOISE SHIELDING TECHNIQUES FOR ULTRA LOW CURRENT MEASUREMENTS IN BIOCHEMICAL APPLICATIONS | 2017-04-13 |
20170103953 | METHOD FOR FABRICATING PACKAGE STRUCTURE | 2017-04-13 |
20170103954 | STACKING OF MULTIPLE DIES FOR FORMING THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC) STRUCTURE | 2017-04-13 |
20170103955 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2017-04-13 |
20170103956 | INTEGRATED CIRCUIT PACKAGE | 2017-04-13 |
20170103957 | FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION | 2017-04-13 |
20170103958 | SEMICONDUCTOR PACKAGE | 2017-04-13 |
20170103959 | ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME | 2017-04-13 |
20170103960 | SEMICONDUCTOR DEVICE | 2017-04-13 |
20170103961 | PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES | 2017-04-13 |
20170103962 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2017-04-13 |
20170103963 | MICRO-SCRUB PROCESS FOR FLUXLESS MICRO-BUMP BONDING | 2017-04-13 |
20170103964 | APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING | 2017-04-13 |
20170103965 | DATA STORAGE DEVICE AND AN ELECTRONIC DEVICE INCLUDING THE SAME | 2017-04-13 |
20170103966 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE SAME | 2017-04-13 |
20170103967 | BONDING PAD ARRANGMENT DESIGN FOR MULTI-DIE SEMICONDUCTOR PACKAGE STRUCTURE | 2017-04-13 |
20170103968 | Embedded wire bond wires | 2017-04-13 |
20170103969 | Bonded Dies with Isolation | 2017-04-13 |
20170103970 | 3D INTEGRATED CIRCUIT PACKAGE WITH THROUGH-MOLD FIRST LEVEL INTERCONNECTS | 2017-04-13 |
20170103971 | LIGHT EMITTING DEVICE | 2017-04-13 |
20170103972 | LIGHT-EMITTING DEVICE, INTEGRATED LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING MODULE | 2017-04-13 |
20170103973 | Method and Structure of Three-Dimensional Chip Stacking | 2017-04-13 |
20170103974 | METHOD FOR DESIGNING VEHICLE CONTROLLER-ONLY SEMICONDUCTOR BASED ON DIE AND VEHICLE CONTROLLER-ONLY SEMICONDUCTOR BY THE SAME | 2017-04-13 |
20170103975 | DISPLAY PANEL | 2017-04-13 |