15th week of 2018 patent applcation highlights part 39 |
Patent application number | Title | Published |
20180102296 | SUBSTRATE | 2018-04-12 |
20180102297 | FAN-OUT SEMICONDUCTOR PACKAGE AND PHOTOSENSITIVE RESIN COMPOSITION | 2018-04-12 |
20180102298 | SEMICONDUCTOR DEVICE | 2018-04-12 |
20180102299 | Underfill Control Structures and Method | 2018-04-12 |
20180102300 | Connectable Package Extender for Semiconductor Device Package | 2018-04-12 |
20180102301 | DOUBLE-SIDE COOLING TYPE POWER MODULE AND PRODUCING METHOD THEREOF | 2018-04-12 |
20180102302 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | 2018-04-12 |
20180102303 | SUBSTRATE FOR POWER MODULE, COLLECTIVE SUBSTRATE FOR POWER MODULES, AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE | 2018-04-12 |
20180102304 | ELECTRONIC MODULE AND METHOD FOR ENCAPSULATION THEREOF | 2018-04-12 |
20180102305 | SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY | 2018-04-12 |
20180102306 | MULTI-PHASE COMMON CONTACT PACKAGE | 2018-04-12 |
20180102307 | COMMON CONTACT LEADFRAME FOR MULTIPHASE APPLICATIONS | 2018-04-12 |
20180102308 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | 2018-04-12 |
20180102309 | POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME | 2018-04-12 |
20180102310 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | 2018-04-12 |
20180102311 | SEMICONDUCTOR PACKAGE UTILIZING EMBEDDED BRIDGE THROUGH-SILICON-VIA INTERCONNECT COMPONENT | 2018-04-12 |
20180102312 | Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect | 2018-04-12 |
20180102313 | WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER | 2018-04-12 |
20180102314 | SEMICONDUCTOR DEVICE | 2018-04-12 |
20180102315 | SURFACE AREA-DEPENDENT SEMICONDUCTOR DEVICE WITH INCREASED SURFACE AREA | 2018-04-12 |
20180102316 | INTEGRATED CIRCUIT DEVICE INCLUDING VERTICAL MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-04-12 |
20180102317 | INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS | 2018-04-12 |
20180102318 | COMPOUND RESISTOR STRUCTURE FOR SEMICONDUCTOR DEVICE | 2018-04-12 |
20180102319 | Methods for Reducing Dual Damascene Distortion | 2018-04-12 |
20180102320 | SELF-FORMED LINER FOR INTERCONNECT STRUCTURES | 2018-04-12 |
20180102321 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME | 2018-04-12 |
20180102322 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-04-12 |
20180102323 | ARRANGEMENT FOR SPATIALLY LIMITING A RESERVOIR FOR A MARKER MATERIAL | 2018-04-12 |
20180102324 | MARK FORMING METHOD AND DEVICE MANUFACTURING METHOD | 2018-04-12 |
20180102325 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-04-12 |
20180102326 | Perimeter Control Of Crack Propagation In Semiconductor Wafers | 2018-04-12 |
20180102327 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE | 2018-04-12 |
20180102328 | INTEGRATED CIRCUIT CHIP REINFORCED AGAINST FRONT SIDE DEPROCESSING ATTACKS | 2018-04-12 |
20180102329 | TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBSTRATE(S) | 2018-04-12 |
20180102330 | SENSING CHIP PACKAGE HAVING ESD PROTECTION AND METHOD MAKING THE SAME | 2018-04-12 |
20180102331 | Interconnections for a Substrate Associated with a Backside Reveal | 2018-04-12 |
20180102332 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-04-12 |
20180102333 | WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSITION FOR WAFER LAMINATE | 2018-04-12 |
20180102334 | WAFER LAMINATE AND METHOD OF PRODUCING THE SAME | 2018-04-12 |
20180102335 | MIXED UBM AND MIXED PITCH ON A SINGLE DIE | 2018-04-12 |
20180102336 | MIXED UBM AND MIXED PITCH ON A SINGLE DIE | 2018-04-12 |
20180102337 | CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT | 2018-04-12 |
20180102338 | CIRCUIT BOARD WITH BRIDGE CHIPLETS | 2018-04-12 |
20180102339 | SEMICONDUCTOR PACKAGE | 2018-04-12 |
20180102340 | APPARATUS FOR CORRECTING A PARALLELISM BETWEEN A BONDING HEAD AND A STAGE, AND A CHIP BONDER INCLUDING THE SAME | 2018-04-12 |
20180102341 | Conductive Paste For Bonding | 2018-04-12 |
20180102342 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF | 2018-04-12 |
20180102343 | SEMICONDUCTOR PACKAGE WITH IMPROVED BANDWIDTH | 2018-04-12 |
20180102344 | NON-VOLATILE MEMORY SYSTEM WITH WIDE I/O MEMORY DIE | 2018-04-12 |
20180102345 | Semiconductor Device and Method of Manufacture | 2018-04-12 |
20180102346 | SEMICONDUCTOR DEVICE | 2018-04-12 |
20180102347 | DATA STORAGE DEVICE HAVING MULTI-STACK CHIP PACKAGE AND OPERATING METHOD THEREOF | 2018-04-12 |
20180102348 | OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT | 2018-04-12 |
20180102349 | MULTI-PHASE POWER CONVERTER WITH COMMON CONNECTIONS | 2018-04-12 |
20180102350 | LED DISPLAY MODULES AND METHODS FOR MAKING THE SAME | 2018-04-12 |
20180102351 | Semiconductor Devices and Methods of Manufacture Thereof | 2018-04-12 |
20180102352 | Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation | 2018-04-12 |
20180102353 | ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND VERTICAL COMMUNICATION CHANNELS | 2018-04-12 |
20180102354 | METHOD, APPARATUS, AND SYSTEM FOR TWO-DIMENSIONAL POWER RAIL TO ENABLE SCALING OF A STANDARD CELL | 2018-04-12 |
20180102355 | ESD PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2018-04-12 |
20180102356 | Transient Voltage Suppression Diodes with Reduced Harmonics, and Methods of Making and Using | 2018-04-12 |
20180102357 | ELECTROSTATIC DISCHARGE GUARD RING WITH SNAPBACK PROTECTION | 2018-04-12 |
20180102358 | DEVICE FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGES WITH A DISTRIBUTED TRIGGER CIRCUIT | 2018-04-12 |
20180102359 | HIGH DENSITY NANOSHEET DIODES | 2018-04-12 |
20180102360 | SEMICONDUCTOR DEVICE | 2018-04-12 |
20180102361 | SWITCHING DEVICE | 2018-04-12 |
20180102362 | FINFETS WITH CONTROLLABLE AND ADJUSTABLE CHANNEL DOPING | 2018-04-12 |
20180102363 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2018-04-12 |
20180102364 | INTEGRATED CIRCUIT DEVICES AND METHOD OF MANUFACTURING THE SAME | 2018-04-12 |
20180102365 | MEMORY DEVICE FOR A DYNAMIC RANDOM ACCESS MEMORY | 2018-04-12 |
20180102366 | SEMICONDUCTOR MEMORY DEVICE HAVING COPLANAR DIGIT LINE CONTACTS AND STORAGE NODE CONTACTS IN MEMORY ARRAY AND METHOD FOR FABRICATING THE SAME | 2018-04-12 |
20180102367 | MIRROR CONTACT CAPACITOR | 2018-04-12 |
20180102368 | SEMICONDUCTOR ARRANGEMENT HAVING CAPACITOR SEPARATED FROM ACTIVE REGION | 2018-04-12 |
20180102369 | SELECTIVE EPITAXY GROWTH FOR SEMICONDUCTOR DEVICES WITH FIN FIELD-EFFECT TRANSISTORS (FINFET) | 2018-04-12 |
20180102370 | SEMICONDUCTOR STRUCTURE | 2018-04-12 |
20180102371 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-04-12 |
20180102372 | FERROELECTRIC COMPOSITION ON SEMICONDUCTOR AND METHOD FOR PRODUCING SAME | 2018-04-12 |
20180102373 | SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME | 2018-04-12 |
20180102374 | Ferroelectric Capacitor, Ferroelectric Field Effect Transistor, And Method Used In Forming An Electronic Component Comprising Conductive Material And Ferroelectric Material | 2018-04-12 |
20180102375 | SELECT TRANSISTORS WITH TIGHT THRESHOLD VOLTAGE IN 3D MEMORY | 2018-04-12 |
20180102376 | NON-VOLATILE MEMORY | 2018-04-12 |
20180102377 | INTEGRATED CIRCUIT WITH DECOUPLING CAPACITOR IN A STRUCTURE OF THE TRIPLE WELL TYPE | 2018-04-12 |
20180102378 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | 2018-04-12 |
20180102379 | MANUFACTURE METHOD OF ARRAY SUBSTRATE AND ARRAY SUBSTRATE MANUFACTURED BY THE METHOD | 2018-04-12 |
20180102380 | THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND LIQUID CRYSTAL DISPLAY | 2018-04-12 |
20180102381 | DISPLAY DEVICE | 2018-04-12 |
20180102382 | ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, AND DISPLAY PANEL | 2018-04-12 |
20180102383 | THIN FILM TRANSISTOR ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF | 2018-04-12 |
20180102384 | SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | 2018-04-12 |
20180102385 | BACK-SIDE ILLUMINATED IMAGE SENSOR | 2018-04-12 |
20180102386 | SOLID-STATE IMAGING DEVICE, METHOD OF DRIVING SOLID-STATE IMAGING DEVICE, IMAGING SYSTEM, AND MOVABLE OBJECT | 2018-04-12 |
20180102387 | COLOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | 2018-04-12 |
20180102388 | SOLID-STATE IMAGING APPARATUS | 2018-04-12 |
20180102389 | IMAGE SENSOR | 2018-04-12 |
20180102390 | INTEGRATED IMAGING SENSOR WITH TUNABLE FABRY-PEROT INTERFEROMETER | 2018-04-12 |
20180102391 | BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS | 2018-04-12 |
20180102392 | IMAGE SENSOR | 2018-04-12 |
20180102393 | PHOTO DETECTOR DEVICE | 2018-04-12 |
20180102394 | OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES | 2018-04-12 |
20180102395 | HIGH DENSITY RESISTIVE RANDOM ACCESS MEMORY (RRAM) | 2018-04-12 |