14th week of 2016 patent applcation highlights part 53 |
Patent application number | Title | Published |
20160100487 | MANUFACTURING METHOD AND STRUCTURE OF CIRCUIT BOARD WITH VERY FINE CONDUCTIVE CIRCUIT LINES - A circuit board manufacturing method includes the steps of providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer having a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each recessed portion, and the conductive electrodes together forming a conductive layer; providing a substrate having an adhesive layer provided thereon for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the conductive motherboard and the masking layer to provide a circuit board. The conductive motherboard is repeatedly usable and presents the predetermined circuit pattern through electroforming process, and the circuit pattern can be transferred to the substrate. The whole circuit board manufacturing process is simplified while ensures largely upgraded yield rate of very fine conductive circuit lines on the circuit board. | 2016-04-07 |
20160100488 | COMPONENT PLACEMENT DEVICE AS WELL AS A METHOD FOR PICKING UP A COMPONENT AND PLACING A COMPONENT ON A SUBSTRATE - A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel. | 2016-04-07 |
20160100489 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE - This disclosure relates to integrated circuit (IC) packages and methods of manufacturing the same. In one method, a printed circuit board is provided with semiconductor die. The semiconductor die includes a Back-End-of-Line (BEOL) region, a Front-End-of-Line (FEOL) region, and a semiconductor handle such that the BEOL region, the FEOL region, and the semiconductor handle are stacked. A first polymer layer is provided over the printed circuit board so as to cover the semiconductor die. The semiconductor handle of the semiconductor die is exposed through the first polymer layer and removed. A second polymer layer is then provided so that the BEOL region, the FEOL region, and at least a portion of the second polymer layer are stacked. The second polymer layer may be provided to have high thermal conductivity and electric isolation properties thereby providing advantageous package characteristics. | 2016-04-07 |
20160100490 | MAKING A PLURALITY OF INTEGRATED CIRCUIT PACKAGES - A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads. | 2016-04-07 |
20160100491 | Method of mounting self-adhesive substrate on electronic device - A method of mounting a self-adhesive substrate on an electronic device comprising steps of: (S | 2016-04-07 |
20160100492 | CONTROLLING APPARATUS - A display and operating unit and a main unit are connected with the ability to be separated. In a state with the connection with the main unit separated, the display and operating unit is attached to the front surface side of a panel. In this case, the connector cable is passed through an opening formed on the panel and positioned at the back surface side of the panel, and packing is positioned so as to enclose the periphery of the opening, and the display and operating unit is attached to the front surface side of the panel. Then, the main unit is fixed to the back surface side of the panel, a connector CN | 2016-04-07 |
20160100493 | Below Grade Enclosure - An enclosure for telecommunications equipment suitable for below grade use with fiber optic equipment or electrical equipment is described. The enclosure incorporates a cam operated latching mechanism and compression plates to seal the door closed and create a water resistant or water tight seal. The enclosure may be used in a variety of applications, including above and below grade. The enclosure may also include a lift assist system to allow it to be easily raised and lowered from a below grade stowed position to an above grade service position. | 2016-04-07 |
20160100494 | THERMAL STABILIZATION OF TEMPERATURE SENSITIVE COMPONENTS - An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board. | 2016-04-07 |
20160100495 | PACKAGING FOR HIGH-POWER MICROWAVE MODULE - A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module. | 2016-04-07 |
20160100496 | COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device. | 2016-04-07 |
20160100497 | APPARATUS WITH WIRED ELECTRICAL COMMUNICATION - An apparatus for use subsea, the apparatus comprising a container having at least one aperture; a lid securable to the container to cover the at least one aperture, suitable to isolate the inside of the container from the outside of the container when fluid pressure outside the container is at least 5000 kPa. The lid has one or more electrical connections providing electrical communication from a first side of the lid to a second side of the lid. The apparatus further comprises one or more wires for providing electrical communication between one or more electrical components in the container and the one or more electrical connections in the lid. | 2016-04-07 |
20160100498 | LASER TRIMMING SURFACE CLEANING FOR ADHESION TO CAST METALS - A method bonds a first member to a second member. The method provides a first member having a bonding surface. A second member is molded from a metal material so as to have a surface constructed and arranged to be bonded to the bonding surface. The surface of the second member is laser trimmed to remove material and to remove byproducts, resulting from molding the second member, from the surface of the second member to thereby define a clean, laser trimmed surface of the second member. A sealant is provided between and in contact with the bonding surface and the clean, laser trimmed surface. The sealant is permitted to cure to thereby bond the first member to the second member. | 2016-04-07 |
20160100499 | ELECTRONIC DEVICE ADOPTING KEY-WATERPROOF STRUCTURE AND METHOD FOR WATERPROOFING KEY THEREOF - An electronic device and a method of waterproofing a key thereof are provided. The electronic device includes a body, a display device disposed in the body, a key disposed in the body, and a key-waterproof structure including an insert-injected product that includes an insert-injected sealing area, and a bonding area where a silicon-not-attached portion is formed. The method includes assembling a flexible printed circuit board, to which a key is attached, through a silicon-not-attached portion of an insert-injected product, which is made by insert-injecting a bracket and silicon rubber, and bonding the silicon-not-attached portion. | 2016-04-07 |
20160100500 | UNIVERSAL SERIAL BUS CONTROLLER AND WIRING SUBSTRATE - A universal serial bus controller and host are adapted for being electrically connected to a universal serial bus device. The universal serial bus host includes: a wiring substrate including a plurality of first substrate contacts and a plurality of second substrate contacts; a universal serial bus connecting port disposed on the wiring substrate via the first substrate contacts; and the universal serial bus controller including a plurality of pins electrically connected to the wiring substrate via the second substrate contacts. The universal serial bus controller and the host can decrease interferences among signals and avoid the complicated layout of the wiring substrate. | 2016-04-07 |
20160100501 | ELECTRONIC ASSEMBLY SUPPORTED BY A PLURALITY OF CARDS - A subsea electronics module for use in a subsea well installation, comprising: a backplane connecting a plurality of slots; a plurality of physical cards each supporting an electronic assembly having an identical architecture including a programmable logic module and a memory, the physical cards each being inserted into a respective slot of the backplane; and wherein the identical electronic assembly of each physical card is configured by program instructions stored in the memory thereon to be configured to perform in use a set of electronic functions of one of a plurality of different defined card roles in dependence on either one or both of: the position of the slot into which that card is inserted; an indication of a card role configuration selection for that card. | 2016-04-07 |
20160100502 | MODULAR INFORMATION TECHNOLOGY (IT) RACK AND AIR FLOW SYSTEM - A method for designing and assembling a modular IT rack includes a manufacturer designing and constructing lightweight, modular corrugated cardboard modules/segments and corresponding banding and corner components that can be used to assemble the modular IT rack. A user/assembler of the modular IT rack assembles modular tray grouping and enclosure (MTGE) casing units using a first set of cardboard modules. The user constructs trays using a second set of cardboard modules. The user affixes cable support components to the sides of sub-groups of the constructed trays. The user encloses sub-groups of trays having the affixed cable support components within the assembled MTGE casing units to create MTGE blocks. The user vertically stacks the MTGE blocks having the tray sub-groups and the affixed cable support components enclosed within. The user aligns and secures the vertically stacked MTGE blocks in a fixed position using banding and corner components. | 2016-04-07 |
20160100503 | SYSTEMS AND METHODS FOR COOLING A PROBE DISPOSED ABOUT A HOT GAS PATH - A system for cooling a probe disposed about a hot gas path is disclosed herein. The system may include a probe holder having a main body including an inner passage, an intermediate passage, and an outer passage. The intermediate passage and the outer passage may be in fluid communication. The probe may be disposed within the inner passage of the probe holder. The probe may include an internal passage. The system also may include a first cooling circuit in fluid communication with internal passage of the probe. Moreover, the system may include a second cooling circuit having an inlet in fluid communication with the intermediate passage and an outlet in fluid communication with the outer passage. | 2016-04-07 |
20160100504 | COOLING DEVICE FOR HEATING-GENERATING DEVICES - A cooling device for heating-generating devices that are removably inserted into a plurality of slots formed in a cabinet of an electronic apparatus, the cooling device includes: a first cooling device provided in the electronic apparatus; a second cooling device provided outside the electronic apparatus; and a flexible tube that interconnects the first cooling device and the second cooling device so that a coolant is circulated; wherein the first cooling device includes a coolant flow path that is connected to one end of the flexible tube, the coolant flow path cooling both side surfaces of each of the plurality of slots, wherein the second cooling device includes a connector connected to another end of the flexible tube, a cooling unit that cools the coolant, which enters the second cooling device through the flexible tube, and a pump that feeds out the coolant, which has been cooled, to the flexible tube. | 2016-04-07 |
20160100505 | DEVICE WITH HEAT TRANSFER PORTION - A subsea electronic device ( | 2016-04-07 |
20160100506 | RACK LEVEL AIR FLOW BAFFLE PROVIDING HOT AISLE SEPARATION FROM RACK-INSERTED IT COMPONENTS - An apparatus, an information handling system (IHS) and a method for supporting air flow management in a rack includes attaching a baffle made of a non-porous material with vertically-spaced apertures or air flow directing (AFD) sections with flanges that direct cooling air flow from heat dissipating electronic components of the rack towards a rear of the rack. The baffle is attached to a rear section of a chassis of the IHS. The baffle provides physical separation of (i) a cold aisle located towards a front section of the rack and the electronic components inserted into the rack chassis from (ii) a hot aisle located towards a rear of the rack. The flanges of the AFD section folds inward towards the electronic components to create a funnel for receiving a flow of cooling air from the hot aisle. | 2016-04-07 |
20160100507 | DATA CENTER CANOPY INCLUDING TURNING VANES - Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed. | 2016-04-07 |
20160100508 | DISPLAY APPARATUS - A display apparatus includes a display panel, and a heat-radiating sheet located on a non-display surface of the display panel, wherein the heat-radiating sheet includes a first heat-radiating sheet in a central portion of the display panel, and a second heat-radiating sheet in edge portions of the display panel, and locations (heights) of the first heat-radiating sheet and the second heat-radiating sheet in a vertical direction are different from each other. | 2016-04-07 |
20160100509 | SHIELDING UNIT - A shielding unit is formed by press-fitting a small diameter portion of a shielding shell into a shielding ring around which an end portion of a shielding member is wrapped, such that the end portion of the shielding member is sandwiched by the shielding ring and the small diameter portion. By having the end portion of the shielding member be folded over to the inside of the shielding ring when press-fitting the small diameter portion of the shielding shell into the shielding ring, even if the position of an opening is unknown, it is possible to reliably position the opening inside the shielding member, unexposed to the outside, after the press-fitting. This easily allows the end portion of the shielding member to be mounted and secured to the shielding shell so as not to be exposed to the outside. | 2016-04-07 |
20160100510 | Housing, Circuit Arrangement, Drive Arrangement and Method for Producing the Circuit Arrangement - A housing for a circuit assembly includes a housing interior chamber, an electromagnetic radiation-impermeable partition wall that divides the housing interior chamber into (a) a first housing interior chamber partial region configured to receive a first electrical component designed as a filter component and (b) a second housing interior chamber partial region configured to receive a second electrical component, an electromagnetic radiation-impermeable cover plate, and an electromagnetic radiation-impermeable housing section directly adjacent to the first housing interior chamber region. The partition wall, the cover plate, and the housing section enclose the first housing interior chamber partial region in three dimensions, creating a complete electromagnetic shielding of the first housing interior chamber partial region from the second housing interior chamber partial region. A circuit assembly having such a housing can be cost-effectively produced and has a reduced scope. | 2016-04-07 |
20160100511 | Aluminum EMI / RF Shield with Fins - A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for electronic components on a circuit board comprising a base having an upper surface and one or more sidewalls extending from a perimeter of the upper surface, the sidewalls configured to engage a fence of the circuit board, and a fin array attached to the upper surface of the base, the fin array having a plurality of stackable fins, each of the stackable fins having a wall and one or more engagement tabs extending from one or more edges of the wall, the engagement tabs interlocking the plurality of stackable fins together. | 2016-04-07 |
20160100512 | Pecan tree named 'Tom' - A pecan tree distinguished by the following unique combination of characteristics: high prolificacy, consistent production, early nut maturity, kernel size suited to confection trade, excellent color, absence of kernel speckling, excellent resistance to the scab fungus ( | 2016-04-07 |
20160100513 | Jasmium plant named 'MonHariklia' - A new and distinct | 2016-04-07 |
20160100514 | Abelia plant named 'ABENOV41' - A new cultivar of | 2016-04-07 |
20160100515 | Calla lily plant named 'Cardinal BLZ' | 2016-04-07 |