14th week of 2011 patent applcation highlights part 6 |
Patent application number | Title | Published |
20110079889 | CAVITY STRUCTURE COMPRISING AN ADHESION INTERFACE COMPOSED OF GETTER MATERIAL - A structure comprising a cavity delimited by a first substrate and a second substrate attached to the first substrate by an adhesion interface, in which a first part of a first portion of a getter material forms part of the adhesion interface, and a second part of the first portion of getter material is placed in the cavity, the first portion of getter material being placed against the first substrate or the second substrate, the adhesion interface further comprising part of a second portion of a getter material thermocompressed to the first part of the first portion of getter material, said second portion of getter material being placed against the second substrate when the first portion of getter material is placed against the first substrate or placed against the first substrate when the first portion of getter material is placed against the second substrate. | 2011-04-07 |
20110079890 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE, AND MOBILE PHONE INCLUDING THE SEMICONDUCTOR PACKAGE STRUCTURE - Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips. | 2011-04-07 |
20110079891 | INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: forming a stack module including: providing a stack die and encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die; mounting the stack module on a package base; connecting the pad to the package base; mounting a top die on the protruding support; connecting the top die to the package base; and encapsulating the top die, the package base, and the stack module with a package encapsulant. | 2011-04-07 |
20110079892 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package includes a substrate having a pad region, a device region, and a remained scribe region located at a periphery of the substrate; a signal and an EMI ground pads disposed on the pad region; a first and a second openings penetrating into the substrate to expose the signal and the EMI ground pads, respectively; a first and a second conducting layers located in the first and the second openings and electrically connecting the signal and the EMI ground pads, respectively, wherein the first conducting layer and the signal pad are separated from a periphery of the remained scribe region, and wherein a portion of the second conducting layer and/or the EMI ground pad extend(s) to a periphery of the remained scribe region; and a third conducting layer surrounding the periphery of the remained scribe region to electrically connect the second conducting layer and/or the EMI ground pad. | 2011-04-07 |
20110079893 | DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF - Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component. | 2011-04-07 |
20110079894 | Template Process for Small Pitch Flip-Flop Interconnect Hybridization - A process is disclosed for high density indium bumping of microchips by using an innovative template wafer upon which the bumps are initially fabricated. Once fabricated, these bumps are transferred to the microchip, after which can be hybridized to another microchip. Such a template wafer is reusable, and thus provides an economical way to fabricate indium bumps. Reusability also eliminates nonuniformities in bump shape and size in serial processing of separate microchips, which is not the case for other indium bump fabrication processes. Such a fabrication process provides a way to form relatively tall indium bumps and accomplishes this without the standard thick photoresist liftoff process. The described process can be suitable for bump pitches under 10 microns, and is only limited by the resolution of the photolithography equipment used. | 2011-04-07 |
20110079895 | BUMP STRUCTURE, CHIP PACKAGE STRUCTURE INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SAME - A bump structure includes a first substrate, a plurality of first bond pads, a plurality of dielectric bumps, a plurality of under bump metal layers, and a plurality of metal layers. The plurality of first bond pads are spaced apart on the first substrate. The plurality of dielectric bumps disposed corresponding to the first bond pads electrically isolate the first bond pads from each other. Each under bump metal layer is formed between the respective first bond pad and the dielectric bump, extending through a side surface of the respective dielectric bump, and correspondingly forming an extension portion between two adjacent dielectric bumps, wherein each extension portion has a length along the extending direction thereof shorter than the pitch between two adjacent dielectric bumps. Each metal layer is formed on the side surface of the respective dielectric bump and the respective extension portion. | 2011-04-07 |
20110079896 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD - A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion. | 2011-04-07 |
20110079897 | INTEGRATED CIRCUIT CHIP AND FLIP CHIP PACKAGE HAVING THE INTEGRATED CIRCUIT CHIP - In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode. | 2011-04-07 |
20110079898 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT - A substrate includes an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film. A wiring pattern is adhered to the first surface of the insulating film by an adhesive material. A first portion of the wiring pattern is formed over the penetrating hole, and a part of the adhesive material is formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole. An external electrode contacts the first portion of the wiring pattern and projects through the penetrating hole and extends beyond the second surface of the insulating film. | 2011-04-07 |
20110079899 | EMBEDDED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps; forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern; forming a channel in the substrate forming encapsulation; and applying a conductive material in the channel. | 2011-04-07 |
20110079900 | MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES - Methods for forming interconnects in microfeature workpieces, and microfeature workpieces having such interconnects are disclosed herein. The microfeature workpieces may have a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side. In one embodiment, a method includes (a) constructing an electrically conductive interconnect extending from the terminal to at least an intermediate depth in the substrate with the interconnect electrically connected to the terminal, and (b) removing material from the second side of the substrate so that a portion of the interconnect projects from the substrate. | 2011-04-07 |
20110079901 | Methods of Forming Back Side Layers For Thinned Wafers and Related Structures - A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed. | 2011-04-07 |
20110079902 | SEMICONDUCTOR DEVICE - A semiconductor device has a wiring substrate provided with an external connecting terminal on a lower surface, a semiconductor chip mounted onto an upper surface of the wiring substrate, a cap-shaped heat dissipation member arranged on the upper surface of the wiring substrate so as to cover the semiconductor chip, a fixing pin for fixing the heat dissipation member onto the upper surface of the wiring substrate, and a heat transfer material sandwiched between a lower surface of the heat dissipation member just above the semiconductor chip and the upper surface of the semiconductor chip. | 2011-04-07 |
20110079903 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate containing a semiconductor component and a conductive pad thereon. A through hole penetrates the semiconductor substrate from a backside thereof to expose the conductive pad. A redistribution layer is below the backside of the semiconductor substrate and electrically connected to the conductive pad in the through hole. A conductive trace layer is below the redistribution layer and extended along a sidewall of the semiconductor substrate to electrically contact with an edge of the redistribution layer. | 2011-04-07 |
20110079904 | Semiconductor device - Wire bonding method for reducing height of a wire loop in a semiconductor device, including a first bonding step of bonding an initial ball formed at a tip end of a wire onto a first bonding point using a capillary, thereby forming a pressure-bonded ball; a wire pushing step of pushing the wire obliquely downward toward the second bonding point at a plurality of positions by repeating a sequential movement for a plurality of times, the sequential movement including moving of the capillary substantially vertically upward and then obliquely downward toward the second bonding point by a distance shorter than a rising distance that the capillary has moved upward; and a second bonding step of moving the capillary upward and then toward the second bonding point, and bonding the wire onto the second bonding point by pressure-bonding. | 2011-04-07 |
20110079905 | Die Stacking System and Method - Die stacking systems and methods are disclosed. In an embodiment, a semiconductor device includes a passivation surface and a conductive die receiving surface located in an opening of the passivation surface. The conductive die receiving surface has a surface area that is larger than a footprint of a second die that is electrically coupled to the conductive die receiving surface. | 2011-04-07 |
20110079906 | PRE-PACKAGED STRUCTURE - A pre-packaged structure includes a substrate with a substrate circuit, a die having a core circuit and disposed on the substrate, a passivation selectively covering the core circuit, a buffer metal layer electrically connected to the core circuit and completely covering the passivation and a copper wire bond electrically connected to the buffer metal layer and the substrate circuit. | 2011-04-07 |
20110079907 | SEMICONDUCTOR DEVICE HAVING A COPPER PLUG - Disclosed is a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. In a further embodiment, there may also be an aluminum layer between the insulation layer and copper plug. Also disclosed is a process for making the semiconductor device. | 2011-04-07 |
20110079908 | Stress buffer to protect device features - Disclosed is a stress buffer structure intended to be disposed adjacent a face of a semiconductor substrate. The stress buffer structure includes at least one polymer layer formed on the face of the semiconductor substrate and a plurality of metal plates disposed over the polymer layer, wherein the metal plates is physically and electrically isolated from the bond pads of the semiconductor substrate. The disclosed stress buffer structure provides protection to semiconductor components that are sensitive to stress. Also disclosed are semiconductor packages having the disclosed stress buffer structure and the methods of making the semiconductor packages. | 2011-04-07 |
20110079909 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A generation of a void in a recessed section is inhibited. A method for manufacturing a semiconductor device includes: an operation of forming recessed sections in an insulating film, which is formed on a semiconductor substrate; an operation of forming a seed film in the recessed section; an operation of forming a cover metal film in the recessed section; an operation of selectively removing the cover metal film to expose the seed film over the bottom section of the recessed section; and an operation to carrying out a growth of a plated film to fill the recessed section by utilizing the seed film exposed in the bottom section of the recessed section as a seed. | 2011-04-07 |
20110079910 | DUAL METAL INTERCONNECTS FOR IMPROVED GAP-FILL, RELIABILITY, AND REDUCED CAPACITANCE - Embodiments of apparatus and methods for forming dual metal interconnects are described herein. Other embodiments may be described and claimed. | 2011-04-07 |
20110079911 | Method for the Connection of Two Wafers, and a Wafer Arrangement - A method for the connection of two wafers in which a contact area is formed between the two wafers by placing the two wafers one on top of the other. The contact area is heated locally and for a limited time. A wafer arrangement comprises two wafers which have been placed one on top of the other and between whose opposite surfaces a contact area is located. The wafers are connected to one another at selected areas of the contact area. | 2011-04-07 |
20110079912 | Connection for Off-Chip Electrostatic Discharge Protection - A method and apparatus for off-chip ESD protection, the apparatus includes an unprotected IC | 2011-04-07 |
20110079913 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device, includes temporarily fixing a semiconductor chip to a supporting member to direct a connection electrode toward the supporting member side, forming an insulating layer for preventing resin-permeation covering the semiconductor chip, on the supporting member and the semiconductor chip, forming a resin substrate sealing a periphery and a back surface side of the semiconductor chip, on the insulating layer, and removing the supporting member to expose the connection electrode of the semiconductor chip. A build-up wiring is connected directly to the connection electrode of the semiconductor chip. | 2011-04-07 |
20110079914 | STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - This invention prevents a break in a signal wire disposed between wire ends due to attenuation and improves production yields of devices. In a standard cell, a first signal wire extends in a first direction. Second and third signal wires extend in a second direction substantially perpendicular to the first direction and are facing each other across the first signal wire. The second and third signal wires have the widths larger than the width of the first signal wire. | 2011-04-07 |
20110079915 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor chip is provided comprising a semiconductor substrate on which an integrated circuit is formed. The semiconductor chip, which is provided on the semiconductor substrate in an area array, further comprises a plurality of electrodes electrically coupled with the inside of the semiconductor substrate, wherein the electrodes are arranged into a plurality of first groups respectively lined along a plurality of paralleling first straight lines and, further, into a plurality of second groups respectively lined along a plurality of second straight lines which extend so as to intersect with the first straight lines. | 2011-04-07 |
20110079916 | ELECTRONIC ASSEMBLIES INCLUDING MECHANICALLY SECURED PROTRUDING BONDING CONDUCTOR JOINTS - An electronic assembly includes an IC die including a semiconductor top surface having active circuitry thereon and a bottom surface, and at least one protruding bonding feature having sidewall surfaces and a leading edge surface extending outward from the IC die. A workpiece has a workpiece surface including at least one electrical connector and at least one framed hollow receptacle coupled to the electrical connector. The receptacle is formed from metal and includes sidewall portions and a bent top that defines a cavity. The bent top includes bent peripheral shelf regions that point downward into the cavity and towards the sidewall portions. The protruding bonding feature is inserted within the cavity of the receptacle and contacts the bent peripheral shelf regions along a contact area to form a metallic joint, wherein the contact area is at least primarily along the sidewall surfaces. | 2011-04-07 |
20110079917 | Interposer structure with passive component and method for fabricating same - According to an exemplary embodiment, an interposer structure for electrically coupling a semiconductor die to a support substrate in a semiconductor package includes at least one through-wafer via extending through a semiconductor substrate, where the at least one through-wafer via provides an electrical connection between the semiconductor die and the support substrate. The interposer structure further includes a passive component including a trench conductor, where the trench conductor extends through the semiconductor substrate. The passive component further includes a dielectric liner situated between the trench conductor and the semiconductor substrate. The passive component can further include at least one conductive pad for electrically coupling the trench conductor to the semiconductor die. The passive component can be, for example, an inductor or an antenna. | 2011-04-07 |
20110079918 | PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE - Removal of organic mask material from an etched dielectric film with an etchant gas mixture including silicon fluoride (SiF | 2011-04-07 |
20110079919 | ELECTRICAL CONNECTION VIA FOR THE SUBSTRATE OF A SEMICONDUCTOR DEVICE - An electrical connection via passing through a substrate for a semiconductor device is made of at least one conducting ring formed in an annular hole passing through the substrate. | 2011-04-07 |
20110079920 | ELECTRICAL CONNECTION VIA FOR THE SUBSTRATE OF A SEMICONDUCTOR DEVICE - An electrical connection via is formed through a substrate to make an electrical connection from one face of the substrate to the other. The via includes a ring made of an electrically conductive material. The ring is formed in a hole in the substrate so as to at least partly form the via. | 2011-04-07 |
20110079921 | GENERATION OF METAL HOLES BY VIA MUTATION - A semiconductor interconnect architecture provides a reduction in the intersection of vias on the last layer (“VL”) and holes in the last thin metal layer (“MLHOLE”) without degradation of the product yield or robustness, or increases copper dishing. The mutation of some dense redundant VLs to MLHOLEs decreases the number of intersections between VLs and MLHOLEs. | 2011-04-07 |
20110079922 | INTEGRATED CIRCUIT WITH PROTECTIVE STRUCTURE, AND METHOD OF FABRICATING THE INTEGRATED CIRCUIT - A structure includes a semiconductor substrate having semiconductor devices formed on or in the substrate. An interconnecting metallization structure is formed over and connected to the devices. The interconnecting metallization structure including at least one dielectric layer. A passivation layer is deposited over the interconnecting metallization structure and the dielectric layer. At least one metal contact pad and at least one dummy metal structure are provided in the passivation layer. The contact pad is conductively coupled to at least one of the devices. The dummy metal structure is spaced apart from the contact pad and unconnected to the contact pad and the devices. | 2011-04-07 |
20110079923 | Vertically Stackable Dies Having Chip Identifier Structures - A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through silicon via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through silicon vias that are each hard wired to an external electrical contact. | 2011-04-07 |
20110079924 | Vertically Stackable Dies Having Chip Identifier Structures - A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through vias that are each hard wired to an external electrical contact. | 2011-04-07 |
20110079925 | Flip Chip Interconnect Method and Design For GaAs MMIC Applications - A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate. | 2011-04-07 |
20110079926 | Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same - There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved. | 2011-04-07 |
20110079927 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 2011-04-07 |
20110079928 | SEMICONDUCTOR INTEGRATED CIRCUIT AND MULTI-CHIP MODULE - In a semiconductor integrated circuit requiring a large number of pads, an internal circuit is arranged in the center portion, and a plurality of two kinds of I/O circuits for inputting and outputting signals from and to the outside and many pads are arranged along four sides of the semiconductor integrated circuit. The plurality of I/O circuits that are of one of the foregoing two kinds are one-pad I/O circuits on which one pad is arranged in a direction toward the internal circuit, whereas the plurality of I/O circuits that are of the other of the foregoing two kinds are two-pad I/O circuits on which two pads are arranged in zigzag relationship in a direction toward the internal circuit. The number of arranged pads equals to the number of pads required for the semiconductor integrated circuit. The one-pad I/O circuits and the two-pad I/O circuits are provided with power source wirings for supplying power thereto. The power source wirings extend along the arrangement direction of the one-pad I/O circuits and the second-pad I/O circuits to be ring-shaped. power source wiring migration areas for changing power source wirings between the one-pad I/O circuits and second-pad I/O circuits are disposed in four corner portions of the semiconductor integrated circuit. | 2011-04-07 |
20110079929 | KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION - The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor. | 2011-04-07 |
20110079930 | CONNECTION METHOD, CONNECTION TOOL, AND CONNECTION JIG FOR OPTICAL FIBER - A method of butting and connecting a first optical fiber and a second optical fiber in an optical connector comprises placing said optical connector that holds said first optical fiber in wherein an optical fiber connection tool; mounting said optical fiber holder on a holder mounting base of a front end bevel processing tool; processing a front end face of said second optical fiber such that said front end face of said second optical fiber is beveled relative to the surface perpendicular to the optical fiber axis direction; transferring said optical fiber holder to said holder support base; and moving said optical fiber holder toward said optical connector along said guide part, and butting and connecting the beveled front end face of said second optical fiber to the front end face of said first optical fiber such that their bevel directions are aligned. | 2011-04-07 |
20110079931 | METHODS FOR GLOBALLY TREATING SILICA OPTICS TO REDUCE OPTICAL DAMAGE - A method for preventing damage caused by high intensity light sources to optical components includes annealing the optical component for a predetermined period. Another method includes etching the optical component in an etchant including fluoride and bi-fluoride ions. The method also includes ultrasonically agitating the etching solution during the process followed by rinsing of the optical component in a rinse bath. | 2011-04-07 |
20110079932 | Heat-foamable sheet, method for manufacturing the same, foaming filler member, and method for filling inner space of hollow member - There are provided a foaming filler member which allows, even when the inner space of a hollow member has a protruding space, easy filling of the protruding space without using an extra member, a heat-foamable sheet used for the foaming filler member, a method for manufacturing the heat-foamable sheet, and a method for filling the inner space of the hollow member. A heat-foamable sheet which extends in one direction when heated at 100 to 130° C. for 20 minutes and has an extension ratio of 5 to 50% in the extension direction is manufactured by stretch-forming a heat-foamable material. Even when the inner space has the protruding space, the protruding space can be easily filled at low cost without using an extra member by using the heat-foamable sheet as the foaming filler member, disposing the foaming filler member in the main space of the inner space, and foaming it such that the extending direction of the heat-foamable sheet is oriented toward the protruding space. | 2011-04-07 |
20110079933 | IMD/IMR TRANSFER PATTERN METHOD - An IMD (in-mold decoration)/IMR (in-mold roller or in-mold release) transfer pattern method includes the steps of (a) preparing an in-mold transfer-pattern film, (b) processing the in-mold transfer-pattern film into a predetermined three-dimensional shape fitting the configuration of the desired finished product, (c) inserting the three-dimensional in-mold transfer-pattern film in an injection-molding mold for molding with a plastic material and (d) removing the molded product from the injection-molding mold after the injection-molding mold has been cooled down and then removing the thin film substrate and the release layer of the in-mold transfer-pattern film from the molded product. This method prevents the in-mold transfer-pattern film from wrinkling or cracking during injection-molding so that the finished product has a smooth perfect surface. | 2011-04-07 |
20110079934 | Manufacture of polyvinylchloride articles - The present invention describes an advantageous way of lubricating polyvinylchloride during an extrusion process. | 2011-04-07 |
20110079935 | Cable guide system for a mold forming and extruding machine and a method of use - A cable guide system and method are disclosed for a mold forming and extruding machine. The machine has a pair of spaced apart vertical members. The cable guide system includes a support shaft secured to the pair of vertical members. The support shaft retains a first stop member, a tensioning device, a spool loaded with a flexible reinforcement cable, and a second stop member. The spool cooperates with the tensioning device to prevent the cable from prematurely unraveling. The cable guide system further includes a guide member located below and forward of the spool and in horizontal alignment with a plunger. The guide member is capable of changing the direction of the flexible reinforcement cable as it is unwound from the spool. The plunger is capable of extruding a moldable substance from the machine while allowing the flexible reinforcement cable to pass through an aperture formed therein. | 2011-04-07 |
20110079936 | Methods and Apparatus for Variable Property Rapid Prototyping - In an exemplary implementation of this invention, a plurality of materials are heated, mixed and extruded from a nozzle. The ratio of materials in the extruded mixture may be dynamically varied in such a way that the composition of the extruded material varies in a substantially continuous gradient. The deposited material is selectively deposited layer by layer. The composition of the resulting 3D object may vary, over at least part of its volume, in a substantially continuous gradient. Furthermore, a plurality of such nozzles may be employed, at least one of which extrudes support material and at least one of which extrudes parts material, in each case in such a way that the composition of the extruded material varies in a substantially continuous gradient. | 2011-04-07 |
20110079937 | Mold For Actuation Sled Having A Curved Guide Member - An apparatus for injection molding includes at least one mold part having at least one surface. The mold part includes at least one mold part having at least one substantially central, sloping, non-linear surface, the at least one mold part including at least one shaped portion. The mold part further includes at least one substantially closed cavity region disposed within the at least one substantially central, sloping, non-linear surface. The mold part further includes at least one gate disposed on a base portion of the mold part for providing fluid communication to the at least one cavity region, the base portion having a plurality of recesses/depressions extending longitudinally along the length of the mold part. Additionally, at least one flow restrictor may be positioned on the mold part for initially directing flow of injected fluid to the at least one shaped portion. | 2011-04-07 |
20110079938 | COMPOSITE LEVEL TOOL - A method of manufacturing a level tool is presented. The method includes providing a frame, providing a pair of plastic cover plates arranged on opposite sides of the frame, and forming at least one vial window in each cover plate by a dual plastic injection molding process, wherein the at least one vial window is made of a plastic material of a different color than the cover plate and is configured to receive and support at least a portion of a vial. | 2011-04-07 |
20110079939 | IMPRINT LITHOGRAPHY APPARATUS AND METHOD - An imprint lithography method is disclosed for forming a patterned layer from an imprintable liquid medium on a substrate by means of an imprint template having a patterned surface. The method involves contacting the patterned surface and imprintable liquid medium together for a filling period. Light emergent (e.g., scattered or reflected) from an interface between the medium and the patterned surface is collected and measured during the filling period to obtain data concerning one or more voids at the interface, and an estimated end time for the filling period is derived from a relationship between the data and time. The method may allow subsequent process steps to be undertaken more rapidly, with reduced risk of defects arising from remnants of unfilled voids. An imprint lithography apparatus and component for putting the method into effect are also disclosed. | 2011-04-07 |
20110079940 | METHOD OF BLOW MOLDING A BULK METALLIC GLASS - A very low pressure gas or blow forming process for shaping a bulk metallic glass (BMG) in its supercooled liquid state that avoids the fractional stick forces experienced by conventional shaping techniques by engineering the expansion of a pre-shape or parison of BMG material such that substantially all of the lateral strain required to form the final article is accomplished prior to the outer surface of the parison contacting the surface of the shaping apparatus is provided. The capability offered by the inventive shaping process to avoid the frictional forces exerted by the shaping apparatus surface allows for the formation of precision net-shape complex multi-scale parts and components using processing conditions inaccessible by conventional processes. | 2011-04-07 |
20110079941 | Method of fabricating an implantable medical device with biaxially oriented polymers - Methods and systems for manufacturing an implantable medical device, such as a stent, from a tube with desirable mechanical properties, such as improved circumferential strength and rigidity, are described herein. Improved circumferential strength and rigidity may be obtained by inducing molecular orientation in materials for use in manufacturing an implantable medical device. Some embodiments may include inducing molecular orientation by expansion of a molten annular polymer film. Other embodiments may include inducing circumferential molecular orientation by inducing circumferential flow in a molten polymer. In certain embodiments, circumferential orientation may be induced by expansion of a polymer tube. Further embodiments may include manufacturing an implantable medical device from a biaxially oriented planar polymer film. | 2011-04-07 |
20110079942 | ISOLATION SYSTEM FOR REDUCED VIBRATIONS IN A VEHICLE INTERIOR - A vibration isolation scheme includes an interior sled mounted to a vehicle body by one or more sled isolators having damping properties. The sled floats with respect to the vehicle body to isolate vehicle occupants from vibrations otherwise transmitted from the vehicle body. The sled isolators can be located at specific vibrational nodes to target a particular frequency or a range of frequencies. The damping properties of the sled isolators can attenuate vibrations in ranges outside the target frequencies. | 2011-04-07 |
20110079943 | Work apparatus - A work apparatus has at least one handle ( | 2011-04-07 |
20110079944 | ALLOY FOR SPRING, PLATE MATERIAL FOR SPRING, AND SPRING MEMBER - Provided are an alloy for spring, a plate material for spring, and a spring member, all of which are high in mechanical strength, also high in fatigue strength, and excellent in corrosion resistance. An alloy for spring of the present invention includes, as composition in terms of weight ratio, 28 to 42% Co, 10 to 27% Cr, 3 to 12% Mo, 15 to 40% Ni, 0.1 to 1.0% Ti, 1.5% or less Mn, 0.1 to 26.0% Fe, 0.1% or less C, and inevitable impurities, and at least one kind selected from 3.0% or less Nb, 5.0% or less W, 0.5% or less Al, 0.1% or less Zr, and 0.01% or less B. | 2011-04-07 |
20110079945 | Spring Suspension for a Handlebar-Steered Vehicle - A coil spring suspension designed for a handlebar-steered vehicle. The coil spring suspension generally includes a first tube, a coil spring, a shaft and a guide. A first end of the coil spring is disposed within the first tube and fixedly supported proximate a first end of the first tube. The coil spring extends beyond a second end of the first tube. The shaft fixedly supports a second end of the coil spring. The shaft and the first tube are slidably displaced relative to each other upon suspension loading to lengthwise compress the coil spring. The guide is disposed within the first tube and connected to the coil spring between the first and second ends of the coil spring. The guide is displaced with the coil spring under suspension loading and limiting lateral displacement of the coil spring. | 2011-04-07 |
20110079946 | Apparatus for Connecting Two Vises to Each Other - An apparatus is disclosed for connecting a bar of a vise to a bar of another vise. The apparatus includes a sheath and two fastening units. The sheath includes two cavities each axially defined in an end thereof and two apertures defined therein transversely and each in communication with a related one of the cavities. Each of the fastening units can be inserted in a related one of the apertures of the sheath and an aperture defined in the bar of a related one of the vises, thus connecting the bars to each other. | 2011-04-07 |
20110079947 | Model airplane work station - A work station for securely and temporarily holding a model airplane for the purpose of making adjustments, repairs or performing other maintenance on the plane. The work station is on wheels, contains a tool box with tools and a clamp and cradle to securely hold the airplane or only the fuselage, if desired. The work station can be disassembled and stored away in the back of a small vehicle. The clamp and cradle may be mounted on the tool box, which may be easily removed from the work station. In this way, the tool box acts as smaller portable work station, as well. | 2011-04-07 |
20110079948 | SHEET PROCESSING APPARATUS AND SHEET PROCESSING METHOD - There is provided a technique in which while the occurrence of a sheet jam is avoided, a pair of folding rollers for a folding process and a stapler for a staple process can be disposed to be close to each other, and a contribution can be made to the improvement of productivity. A staple unit is provided which performs a staple process to a bundle of sheets transported to a specified staple position in a sheet transport path, and staples the bundle of sheets by causing a press unit that presses a sheet surface of the bundle of sheets when the staple process is performed to cooperate with a reception unit that is disposed to face an inside of the sheet transport path through a hole provided in an inner wall of the sheet transport path and receives the bundle of sheets pressed by the press unit, and a vicinity of an upstream side edge of the reception unit in a sheet transport direction on the sheet transport path is covered by an elastic member supported by one of a wall surface of the sheet transport path and the reception unit. | 2011-04-07 |
20110079949 | SHEET FINISHING APPARATUS AND CONTROL METHOD - A sheet finishing apparatus includes an inlet roller to receive a sheet conveyed from an image forming apparatus, a sheet introduction unit to guide the sheet received by the inlet roller to a finishing unit, a sheet ejection unit to guide the sheet performed to a post process by the finishing unit to an ejection port and to eject from the ejection port, a paper storage tray to receive the ejected sheet, a drive unit including a plurality of motors to drive respective devices, and a control unit to control operations of the plurality of motors. In a trial operation of the sheet finishing apparatus, the control unit controls the plurality of motors, and first drives a motor with a sound pressure level less than a previously set reference level. | 2011-04-07 |
20110079950 | UNIT FOR INSERTING A SINGLE VALUABLE DOCUMENT - A device for accepting a value document comprises a support means which forms a supporting surface for the value document onto which the value document can be placed for acceptance, a guide means for the value document on which the value document resting at least partly on the supporting surface can be aligned with one side along a predefined draw-in direction, and a draw-in device for drawing in along the draw-in direction the value document lying against the guide means and resting at least partly on the supporting surface, wherein the supporting surface has at least one surface area which is inclined toward the guide means relative to a predefined horizontal plane. | 2011-04-07 |
20110079951 | FEED DEVICE WITH CONTROLLED ENVELOPE SEPARATION - In a mailpiece feed device designed to be mounted upstream from a franking machine, and comprising at least a mailpiece feed zone for receiving a stack of mailpieces supported by a plurality of drive rollers and a separation zone for individually selecting the mailpieces, there are provided control means for varying the speed of rotation of said plurality of drive rollers when, at the outlet of said separation zone, a measurement of a gap between successive mailpieces differs from a predefined gap by a predetermined correction threshold. | 2011-04-07 |
20110079952 | PRINTING APPARATUS - A printing apparatus includes a transporting roller formed of a metal plate bent into a cylindrical shape. The transporting roller has a first driving member that transmits a rotational driving force to the transporting roller, and a second driving member that transmits the rotational driving force transmitted thereto to a processing unit that performs printing-related processing. The first and second driving members are provided on one end side of a transporting area where recording media are transported. | 2011-04-07 |
20110079953 | DOUBLE FEEDING DETECTION APPARATUS, AUTO SHEET FEEDER AND DOUBLE FEED DETECTION METHOD - A double feed detection apparatus includes a first element and a second element at positions where they are opposite to each other across a sheet, and a direction in which an ultrasonic wave or a light passes through the sheet is vertical to a conveyance direction of the sheet. An auto sheet feeder includes the first element and the second element of the double feed detection apparatus in a range from a downstream side of a joining point of an outside conveyance path and an inside conveyance path in the sheet conveyance direction to a near side of a read part. | 2011-04-07 |
20110079954 | STORAGE FILM FEED - A storage film feed feeds a storage film from a flexible sleeve open on one side at a rear side in a storage film detection device. The storage film feed has a feed opening with a penetration gap for the storage film and a slide located in the feed opening for fixing the sleeve. The slide is disposed perpendicular to a flat side of the sleeve. The storage film feed further has a stopping member for the slide, the flat side of the sleeve rests against the stopping member when the slide is actuated. | 2011-04-07 |
20110079955 | SHEET STACKING DEVICE, SHEET PROCESSING DEVICE, AND IMAGE FORMING APPARATUS - In order to stack a larger number of sheets on trays by reducing a total thickness of the trays and enabling the trays to ascend and descend actually over long distances, a sheet stacking device includes an upper-tray and a lower-tray which are ascendible and descendible and on which sheets delivered from a delivery roller pair are stacked, a motor and a belt for allowing both the trays to ascend and descend, a clutch for disconnecting the upper-tray and the belt from each other, and a claw and a rack for stopping self-weight descent of the upper-tray when the clutch effects the disconnection. A clearance between the upper-tray under the disconnection by the clutch and in the stop of the self-weight descent by the claw engaged with the rack and the lower-tray connected to the belt is adjustable by ascent and descent of the lower-tray by the motor. | 2011-04-07 |
20110079956 | CARD SHOE APPARATUS ACCURATELY IDENTIFYING CARD INFORMATION OF CARD - The following members are included: a storage unit | 2011-04-07 |
20110079957 | TOKEN MOVEMENT GAME WITH ROTATING GAMEBOARD - A token game set that includes a game board with a stationary portion and a rotating portion. The stationary and rotating portions each having a plurality of token spaces. The game set also includes a plurality of tokens that are located on the token spaces. The game set can be played by initially placing a plurality of first tokens onto token spaces in a first area of the stationary portion, and a plurality of second tokens onto token spaces in a second area of the stationary portion. The first and second tokens may be moved into the rotating portion. The rotating portion is then rotated to move the positions of the first and second tokens. The game board can be arranged so that the tokens can be moved in accordance with the rules of “Chinese Checkers”. | 2011-04-07 |
20110079959 | USING REAL PLAYING CARDS FOR ONLINE GAMING - On or more apparatuses, systems, and methods are disclosed for playing an online card game using real cards. Real playing cards are transferred from a deck of playing cards to a card holding position in a card holder, such as for a sufficient number of players for a game. From an appropriate card viewing position, an actual image of the card (either front or back) is captured, such as by a video camera. The captured image of the card is used to display to an online player, who is playing a virtual card game, such as poker, where the online player may be locally or remotely connected. The image of the card is used in lieu of a virtual image in the virtual representation of an online card game. | 2011-04-07 |
20110079960 | Multi-Piece Pressure Operated Rings for a Downhole Pump Plunger - A pressure responsive seal ring assembly includes a first and second arcuate-shaped ring segment configured for non-interlocking assembly onto a plunger body. A tab extends beyond a first end of each ring segment and is received by a recessed portion in the first end of the opposing ring segment. The tabs and recessed portions provide a gap in the outer peripheral surface of the assembled ring. A second tab extends beyond a second end of the second ring segment and is received by a recessed portion in the second end of the first ring segment. Pads provide an inter-space effective for allowing fluid flow between the interior peripheral surface and the plunger body. The ring segments expand radially outward with an increase in pressure to provide a seal and retract radially inward with a decrease in pressure. The ring segments, however, remain connected and resist fluid flow therebetween. | 2011-04-07 |
20110079961 | Slide Ring Seal - Slide ring seals have the problem that they generate noise under certain conditions of use. In order to suppress this noise in an effective way, the slide ring seal has at least one damping part that comprises at least one shaped sheet metal part. It is provided with at least one elastically deformable spring part that is supported under pretension. Between the damping part and the support area microfriction is generated that leads to an effective noise damping action. The slide ring seal is advantageously used in the automotive field. | 2011-04-07 |
20110079962 | MODULAR POLYMERIC EMI/RFI SEAL - A seal includes a seal body including an annular cavity, and an annular spring within the annular cavity. The seal body, the seal body includes a composite material having a thermoplastic material and a filler. The composite material can have a Young's Modulus of at least about 0.5 GPa, a volume resistitivity of not greater than about 200 Ohm-cm, an elongation of at least about 20%, a surface resistitivity of not greater than about 10 | 2011-04-07 |
20110079963 | VACUUM APPARATUS OF ROTARY MOTION ENTRY - A vacuum apparatus of rotary motion entry is disclosed, which comprises: a shaft sleeve, disposed on a cavity wall of a vacuum system; a rotary shaft, ensheathed by the shaft sleeve; and a transmission set, connected to the rotary shaft for driving the same; wherein, the rotary shaft is disposed passing through a hole formed on the base of the shaft sleeve while there are a first bearing, a second bearing, a sealing ring and a shaft seal being arranged separately inside the hole. Moreover, the shaft seal has a flake-like lip flange formed extending toward the center of the hole, that is capable of being extended away from the vacuum system by the inserting of the rotary shaft into the hole, and thereby, enabling the lip flange to engage with the rotary shaft tightly by the atmospheric pressure and thus isolating the outside world from the vacuum system. | 2011-04-07 |
20110079964 | BIMETALLIC STATIC GASKET AND METHOD OF CONSTRUCTION THEREOF - A static gasket and method of construction thereof is provided. The gasket includes a functional layer constructed of one type of metal having an opening bounded by an inner periphery an outer periphery. The gasket further includes a carrier layer constructed of a different metal than the functional layer. The carrier layer has an opening bounded by an inner periphery configured to receive the outer periphery of the functional layer in a line-to-line or loose fit. The functional layer is configured in substantially coplanar relation with the carrier layer with a first portion of the outer periphery of the functional layer being welded to a radially aligned first portion of the inner periphery of the carrier layer. A second portion of the outer periphery of the functional layer remains detached from a radially aligned second portion of the inner periphery of the carrier layer. | 2011-04-07 |
20110079965 | SEAL, FURNACE PART PROVIDED WITH SUCH A SEAL, AND FURNACE INCLUDING SUCH A SEAL - The invention relates to a seal ( | 2011-04-07 |
20110079966 | ASSEMBLY COMPRISING A SEAL INSERTED BETWEEN TWO COMPONENTS OF DIFFERENT MEAN THERMAL EXPANSION COEFFICIENT, ASSOCIATED SEAL, APPLICATION TO SEALING OF HTE ELECTROLYZERS AND SOFC FUEL CELLS - The invention concerns an assembly typically operating at above 500° C., between two components of different mean thermal expansion coefficients, between which a seal is inserted having a coefficient which differs by a value of at least 1.10 | 2011-04-07 |
20110079967 | WINCH WINDER ADAPTER FOR A ROTARY POWER TOOL AND METHOD - A winch winder adapter for a rotary power tool, such as a drill or power screwdriver, to quickly and easily wind-up the strap on the winch bracket. For example, the strap may be wound up by inserting the adapter into the collar of the winch drum and actuating the rotary power tool. The high speed output rotation of the tool rotates the adapter which, when coupled to the collar, quickly rotates the drum and winds-up the strap. This can be helpful especially when there may be numerous cargo strap winches along the length of a cargo vehicle. | 2011-04-07 |
20110079968 | Turf groomer - A turf groomer for grooming and maintaining synthetic turf including a base structure, and at least one brush arm, at least one rotating member, and a plurality of rake tines connected to the base structure. The at least one brush arm has a plurality of arm segments and is positioned at a front region of the base structure. The at least one rotating member has one or more prongs extending radially from its center, is positioned along an axis of rotation, and is distally spaced from the at least one brush arm. The plurality of rake tines is distally spaced from the at least one rotating member. The turf groomer may include a second brush arm positioned at a rear region of the base structure, and a static reducing device to inhibit the buildup of static electricity as the turf groomer passes over the turf, and/or an extension brush arm. | 2011-04-07 |
20110079969 | Hybrid leveling system - A large vehicle with air bags and a leveling system that controls air flow into and out of an air spring (also known as an “air bag”) to maintain the air spring height close to the optimum level. The system is altered at minimum cost to further minimize the repeated flow of air into and out of the air spring, to thereby save fuel. A mechanical-to-electrical converter ( | 2011-04-07 |
20110079970 | SNOWMOBILE SKI EDGE - The snowmobile ski edge includes a main body having a plurality of mounting holes formed on a mounting face of the main body and a plurality of raised, breaker rails formed on the opposite face of the main body. The breaker rails are spaced across the width of the main body and break up ice and snow in front of the snowmobile skis to easily form new paths, which substantially reduces darting. Each breaker rail is angled to form a leading breaking face and a trailing face extending towards the back of the main body. Carbide inserts are disposed in grooves on both the breaking and trailing faces to strengthen and increase wear characteristics of the breaker rails. The main body includes sloping sides, which together with the breaker rails form channels to funnel broken ice and snow towards the back and reduce drag. | 2011-04-07 |
20110079973 | TRANSPORT CARRIAGE FOR INDUSTRIAL PLANTS - A transport carriage for industrial plants comprises a bearing structure mounted on a plurality of wheel units pivoting around respective vertical axes. The wheel pivoting units are connected by means of kinematisms to a single control plate mounted articulated around a vertical axis. The control plate may be manoeuvred by means of a steering unit including a steering plate which is mounted articulated around the same articulation axis of the control plate. The steering unit is provided with a vertical bar suitable to be engaged into a hole of the steering plate and into any one among the two holes of control plate (5) to join the plates integrally in the rotation around the articulation axis thereof. When the engagement member is inserted into the abovementioned first hole, the wheels of the carriage are prearranged for movement in the normal advancement direction, with the possibility of steering within a limited angular field. When the engagement bar is inserted into the second hole the steering unit may be manoeuvred over a greater angular field, which allows directing the wheels of the pivoting units in an orthogonal direction with respect to direction A. | 2011-04-07 |
20110079974 | CARTS FOR USE IN SECURITY SCREENING - The present invention the present invention relates to methods and systems for performing security screening using trays and a cart to facilitate the management and flow of those trays. | 2011-04-07 |
20110079975 | Vehicle Having Multiple Operational Modes - A vehicle includes a deck, an aft running gear attached to the deck, a steering assembly, a flexible joint attaching the steering assembly to the deck, such that the steering assembly is pivotable about the flexible joint with respect to the deck between a rider-standing mode and a rider-sitting mode, and a brake assembly attached to the deck. | 2011-04-07 |
20110079976 | Skateboard with enclosed chassis and improved suspension - A skateboard with an internal chassis and external shell allows for the enclosure of internal components within a contoured body. The skateboard makes use of a plurality of shock absorbers and swing-arms to provide superior riding characteristics on rough terrain. | 2011-04-07 |
20110079977 | Steering Cylinder Mounting Arrangement Used With A Length-Adjustable Axle - A self-propelled windrower includes a rear axle having end sections which are adjustable to vary the tread width of caster-mounted rear wheels having upright spindles mounted for swiveling within cylindrical receptacles defining outer ends of the axle end sections. Front wheels of the windrower are steerable and a steering assist is provided including right and left steering cylinders having barrels respectively mounted to right and left reaction arms by a mounting permitting the cylinder to pivot vertically and horizontally, with the rods being coupled to respective steering arms fixed to the top of the spindles. In a first embodiment, right and left brackets are respectively fixed to forward surfaces of opposite end regions of a tubular center section of the rear axle in which the axle end sections are received for telescopic adjustment. The right and left reaction arms are respectively mounted to the right and left brackets when the end sections are in inward narrow tread width positions, and are respectively mounted to forward surface locations of outer end regions of the axle end sections when the latter are in outward wide tread width positions. In a second embodiment, the reaction arms are mounted to spindle receptacles at the outer ends of the axle sections such that the reaction arms may be secured in an infinite number of angular positions about the spindle receptacles so as to accommodate different tread widths of the steered rear wheels and/or different machine configurations and/or improved access to the machine without interference with other parts, other attachments, or for any other reasons. | 2011-04-07 |
20110079978 | AXLE ASSEMBLY - An axle assembly for an undercarriage of a vehicle includes two side plates, a differential, and a skid plate. The two side plates have surfaces configured to support a vehicle hull. The differential is generally positioned between the two side plates. During operation of the axle assembly, the differential receives torque from a driveshaft and provides the torque to half shafts. The skid plate includes an array of beams extending between the side plates and below the differential. The skid plate is designed to shield the differential and portions of the undercarriage of the vehicle from ground obstacles. | 2011-04-07 |
20110079979 | VEHICLE SUSPENSION ARM - A vehicle suspension arm ( | 2011-04-07 |
20110079980 | ANTI-TORQUE SYSTEM FOR A TRACTION ASSEMBLY - This invention relates to a traction assembly for a vehicle which uses an endless traction band and a plurality of wheels for propulsion. More particularly, the traction assembly comprises a sprocket wheel which has a different size and number of sprocket teeth depending on whether the traction kit replaces the front wheels or the rear wheels of the vehicle. The sprocket wheel of the traction kit can also be configured such that its sprocket teeth are laterally offset. The traction kit can also comprise an anti-torque system that prevent physical contact between the traction kit and the vehicle and that can bias the position of the traction kit in order to improve the steering performance. Finally, the traction assembly can comprise a pivotable extension which lengthens the traction assembly and improves its traction capabilities. | 2011-04-07 |
20110079981 | Running Board Attachment - A running board attachment. The running board attachment forms a barrier to restrict the passage of objects through the area between a vehicle body and a running board mounted distantly from the vehicle body. | 2011-04-07 |
20110079982 | Spiral Rotor Chain Shifting System - A mechanism for shifting a chain from one sprocket to another sprocket is disclosed herein. The mechanism preferably includes rotor assembly, a control element and a chain tensioner. The rotor assembly preferably has a conical shaped body with a chain slot having clearance windows and cam surfaces. The control element rotates the rotor assembly to shift the chain from one of the sprockets to another sprocket without lateral movement of the rotor assembly. | 2011-04-07 |
20110079983 | Double-Acting Gas Suspension System - A suspension system for use with a motorcycle includes a single body having two double-acting pneumatic cylinders in axial alignment therein. The suspension system may be sold in a kit, and may be retrofitted on an existing OEM motorcycle front wheel fork. | 2011-04-07 |
20110079984 | BICYCLE WHEEL SECURING STRUCTURE - A bicycle wheel securing structure includes a bicycle fork, an adapter and a holding member. The bicycle fork has two axle support portions that are spaced apart for receiving a bicycle hub therebetween. The adapter is disposed in an adapter receiving bore in one of the axle support portions. The adapter includes a threaded axle mounting opening. The holding member is operatively coupled between the adapter and the one of the axle support portions with the adapter. The holding member prevents both rotational movement of the adapter with respect to the bicycle fork and axial movement of the adapter with respect to the bicycle fork along an axis of the axle mounting opening when the holding member is in a retaining position. The adapter is rotatable within the adapter receiving bore without moving axially with respect to the bicycle fork when the holding member is in a releasing position. | 2011-04-07 |
20110079985 | TOW BEHIND STEERABLE CADDY TRAILER - A steerable caddy trailer is provided that has an improved structure including a main frame assembly, spindle assemblies attached to each end of the main frame for attachment of a wheel, a pair of swinging arms forwardly extending from the main frame and pivotally attached to the main frame, and tie rods connecting the swinging arms with the spindle assembly such that pivoting of the swinging arms steers the wheels. | 2011-04-07 |
20110079986 | Personal Transportation Device and Method - A personal transportation device, typically for use in snow, includes first and second foot boards and a boot binding assembly for each. Each foot board may have a reverse or zero camber, with the underside having a generally flat or convex central portion and upwardly and outwardly extending end portions, which acts to lift the end portions off of the riding surface during use thereby improving performance. In some examples, the boot binding assembly may be oriented generally parallel to the length or width. The central portion may have a convex v-shape region to create a vertex under the rider's foot. One or more longitudinally extending ribs may extend from the underside of the foot boards. The foot boards may include shock absorbing bumpers or riding-surface-engaging projections extending from the edges. Attraction or repulsion elements may also be used along the edges. A method for moving may also be used. | 2011-04-07 |
20110079987 | COLLAPSIBLE TROLLEY - A collapsible trolley includes a push rod, a holder, a central rod, a connecting rod, and two wheel rods. The central rod and the two wheel rods are coupled with a wheel, respectively. The push rod is movably connected with the holder, and connected with the central rod via a movable sleeve. The connecting rod is bent and inserted through the push rod, and has two ends connected with the two wheel rods. One end of each of the two wheel rods is pivotally connected to the central rod. When in use, the trolley is quickly extended to form a three-wheel trolley. When not in use, the trolley is able to be collapsed quickly, reducing its size. | 2011-04-07 |
20110079988 | PASSIVE AIRBAG VENTING - An occupant protection apparatus comprises an inflatable airbag with a panel, the panel including a first vent opening that permits inflation fluid to escape out of the airbag; and a valve sheet including a second vent opening movable relative to the first vent opening, the valve sheet having opposite ends that are each fixed to a surface of the airbag. One end of the valve sheet moves with the panel during inflation of the airbag to move the second vent opening relative to the first vent opening. The apparatus also includes a valve guide or envelope to guide movement of the valve sheet relative to the panel, the valve sheet is capable of sliding between the valve guide and the panel. Both ends of the valve sheet remain fixed to the panel during and after inflation of the airbag. The valve sheet includes a tear tab to temporarily retain the valve sheet to the panel. | 2011-04-07 |
20110079989 | AIRBAG ARRANGEMENT FOR A VEHICLE OCCUPANT RESTRAINT SYSTEM - An airbag arrangement for a vehicle occupant restraint system is provided. The airbag arrangement comprising an inflatable airbag for protecting a vehicle occupant, a fastening element for fastening the airbag to a support structure, and means for counteracting a torquing of the fastening element pre-mounted at the airbag, wherein the means comprise an opening through which the pre-mounted fastening element reaches, said opening being designed to counteract a torquing of the pre-mounted fastening element. The opening comprises two sections that cross one another. | 2011-04-07 |
20110079990 | VEHICLE CURTAIN AIRBAG - A post-deployment, position-stabilized curtain airbag has a top edge from which an inflatable safety cushion is supported by a vehicle for deployment into a vehicle passenger compartment between occupant and occupant enclosure. A fill chamber is secured to the top edge of the safety cushion. An inflatable structural member is mechanically connected to the safety cushion. The fill chamber directs pressurized gas into the safety cushion and the structural member. The structural member deploys into the passenger compartment between the safety cushion and occupant enclosure limiting outboard displacement of the safety cushion. The structural member fully deploys after the safety cushion. Another structural member deploys along the top edge of the safety cushion limiting pivoting of the safety cushion there relative to the fill chamber. Pressurized gas enters each structural member through auxiliary passageways having oppositely directed entrances and outlets. | 2011-04-07 |
20110079991 | AIR BAG WITH PRESSURE-MANAGED GAS DELIVERY INFLATABLE DUCT - An inflatable side airbag has an inflatable duct for the delivery of inflation gas. The inflatable duct of the inflatable side airbag provides for rapid deployment of a multi-chamber air bag while controlling the rate of inflation and the relative pressure of the chambers. The inflatable duct allows a single inflator to inflate a high pressure pelvis chamber and a lower pressure thorax chamber while preventing fluid communication between the two chambers upon completion of inflation. | 2011-04-07 |