14th week of 2018 patent applcation highlights part 47 |
Patent application number | Title | Published |
20180096893 | CONTACT RESISTANCE REDUCTION BY III-V Ga DEFICIENT SURFACE | 2018-04-05 |
20180096894 | METHOD OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND SEMICONDUCTOR DEVICE STRUCTURE | 2018-04-05 |
20180096895 | PREVENTING OXIDATION DEFECTS IN STRAIN-RELAXED FINS BY REDUCING LOCAL GAP FILL VOIDS | 2018-04-05 |
20180096896 | SEMICONDUCTOR ARRANGEMENT, METHOD OF MANUFACTURING THE SAME ELECTRONIC DEVICE INCLUDING THE SAME | 2018-04-05 |
20180096897 | METHOD OF FABRICATING DMOS AND CMOS TRANSISTORS | 2018-04-05 |
20180096898 | METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION | 2018-04-05 |
20180096899 | METHOD OF MANUFACTURING SELECTIVE NANOSTRUCTURES INTO FINFET PROCESS FLOW | 2018-04-05 |
20180096900 | INTEGRATED CIRCUIT WITH REPLACEMENT GATE STACKS AND METHOD OF FORMING SAME | 2018-04-05 |
20180096901 | LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE INTEGRATED WITH VERTICAL FIELD EFFECT TRANSISTOR | 2018-04-05 |
20180096902 | METALIZATION REPAIR IN SEMICONDUCTOR WAFERS | 2018-04-05 |
20180096903 | FAN-OUT PANEL LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME | 2018-04-05 |
20180096904 | CAPACITANCE MONITORING USING X-RAY DIFFRACTION | 2018-04-05 |
20180096905 | FACILITATION OF SPIN-COAT PLANARIZATION OVER FEATURE TOPOGRAPHY DURING SUBSTRATE FABRICATION | 2018-04-05 |
20180096906 | System and Method for Process-Induced Distortion Prediction During Wafer Deposition | 2018-04-05 |
20180096907 | SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME | 2018-04-05 |
20180096908 | SEMICONDUCTOR DEVICE | 2018-04-05 |
20180096909 | SEMICONDUCTOR DEVICE HAVING TWO ENCAPSULANTS | 2018-04-05 |
20180096910 | MOLDED RESIN-SEALED POWER SEMICONDUCTOR DEVICE | 2018-04-05 |
20180096911 | CASE AND ELECTRONIC DEVICE HAVING THE SAME | 2018-04-05 |
20180096912 | Component Carrier Comprising at Least One Heat Pipe and Method for Producing Said Component Carrier | 2018-04-05 |
20180096913 | Semiconductor Packages | 2018-04-05 |
20180096914 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2018-04-05 |
20180096915 | SEMICONDUCTOR DEVICE | 2018-04-05 |
20180096916 | REVERSIBLE SEMICONDUCTOR DIE | 2018-04-05 |
20180096917 | TEST SOCKET ASSEMBLY AND RELATED METHODS | 2018-04-05 |
20180096918 | Lead And Lead Frame For Power Package | 2018-04-05 |
20180096919 | Chip carrier configured for delamination-free encapsulation and stable sintering | 2018-04-05 |
20180096920 | SEMICONDUCTOR DEVICE PACKAGE HAVING SOLDER-MOUNTED CONDUCTIVE CLIP ON LEADFRAME | 2018-04-05 |
20180096921 | PACKAGE STRUCTURES | 2018-04-05 |
20180096922 | SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096923 | TAPELESS LEADFRAME PACKAGE WITH UNDERSIDE RESIN AND SOLDER CONTACT | 2018-04-05 |
20180096924 | CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR MANUFACTURING CHIP PACKAGES | 2018-04-05 |
20180096925 | SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS | 2018-04-05 |
20180096926 | INTERCONNECTION SUBSTRATE AND SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096927 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096928 | SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF | 2018-04-05 |
20180096929 | SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | 2018-04-05 |
20180096930 | MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL | 2018-04-05 |
20180096931 | INTERFACE STRUCTURES AND METHODS FOR FORMING SAME | 2018-04-05 |
20180096932 | METHODS OF FORMING METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS AND THE RESULTING PRODUCTS | 2018-04-05 |
20180096933 | METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING ON MULTILAYERED METAL CONTACTS, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM | 2018-04-05 |
20180096934 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2018-04-05 |
20180096935 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | 2018-04-05 |
20180096936 | Dielectric Film For Semiconductor Fabrication | 2018-04-05 |
20180096937 | SEMICONDUCTOR DEVICE | 2018-04-05 |
20180096938 | CIRCUIT BOARD WITH MULTIPLE DENSITY REGIONS | 2018-04-05 |
20180096939 | PACKAGE STRUCTURE WITH BUMP | 2018-04-05 |
20180096940 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096941 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096942 | INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME | 2018-04-05 |
20180096943 | INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME | 2018-04-05 |
20180096944 | SEMICONDUCTOR DEVICE | 2018-04-05 |
20180096945 | ADVANCED METAL INTERCONNECTS | 2018-04-05 |
20180096946 | SEMICONDUCTOR PACKAGES HAVING A FIDUCIAL MARKER AND METHODS FOR ALIGNING TOOLS RELATIVE TO THE FIDUCIAL MARKER | 2018-04-05 |
20180096947 | SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS | 2018-04-05 |
20180096948 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096949 | DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE | 2018-04-05 |
20180096950 | RADIO-FREQUENCY DEVICE WITH DUAL-SIDED OVERMOLD STRUCTURE | 2018-04-05 |
20180096951 | CIRCUITS AND METHODS RELATED TO RADIO-FREQUENCY DEVICES WITH OVERMOLD STRUCTURE | 2018-04-05 |
20180096952 | METHODS AND STRUCTURES FOR DICING INTEGRATED CIRCUITS FROM A WAFER | 2018-04-05 |
20180096953 | MOLDED LEAD FRAME DEVICE | 2018-04-05 |
20180096954 | FRAGMENTING COMPUTER CHIPS | 2018-04-05 |
20180096955 | ELECTRONIC COMPONENT GUARD RING | 2018-04-05 |
20180096956 | ELECTROSTATIC PROTECTION STRUCTURE, ARRAY SUBSTRATE AND DISPLAY DEVICE | 2018-04-05 |
20180096957 | ESD PROTECTION DEVICE AND METHOD FOR PRODUCING THE SAME | 2018-04-05 |
20180096958 | METHOD FOR IMPROVING WIRE BONDING STRENGTH OF AN IMAGE SENSOR | 2018-04-05 |
20180096959 | SEMI-CONDUCTOR PACKAGE STRUCTURE | 2018-04-05 |
20180096960 | Tall and Fine Pitch Interconnects | 2018-04-05 |
20180096961 | SEMICONDUCTOR DEVICE | 2018-04-05 |
20180096962 | SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO | 2018-04-05 |
20180096963 | Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application Processor and Memory Integration | 2018-04-05 |
20180096964 | MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER | 2018-04-05 |
20180096965 | METHOD FOR FORMING BALL IN BONDING WIRE | 2018-04-05 |
20180096966 | Multi-Purpose Non-Linear Semiconductor Package Assembly Line | 2018-04-05 |
20180096967 | ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2018-04-05 |
20180096968 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096969 | METHOD OF PRODUCING AN INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAGING OF CHIPS | 2018-04-05 |
20180096970 | INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE | 2018-04-05 |
20180096971 | SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING DIE RECOVERY IN TWO-LEVEL MEMORY (2LM) STACKED DIE SUBSYSTEMS | 2018-04-05 |
20180096972 | WAFER LEVEL PACKAGE AND WAFER LEVEL CHIP SIZE PACKAGE | 2018-04-05 |
20180096973 | System and Method for Providing 3D Wafer Assembly With Known-Good-Dies | 2018-04-05 |
20180096974 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2018-04-05 |
20180096975 | HIGH DENSITY PACKAGE ON PACKAGE DEVICES CREATED THROUGH A SELF ASSEMBLY MONOLAYER ASSISTED LASER DIRECT STRUCTURING PROCESS ON MOLD COMPOUND | 2018-04-05 |
20180096976 | Solution for Reducing Poor Contact in InFO Package | 2018-04-05 |
20180096977 | APPARATUS FOR MICRO PICK AND BOND | 2018-04-05 |
20180096978 | Photo-Sensitive Silicon Package Embedding Self-Powered Electronic System | 2018-04-05 |
20180096979 | A STACKED SEMICONDUCTOR PACKAGE HAVING FAULT DETECTION AND A METHOD FOR IDENTIFYING A FAULT IN A STACKED PACKAGE | 2018-04-05 |
20180096980 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MOUNTING DEVICE, AND MEMORY DEVICE MANUFACTURED BY METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2018-04-05 |
20180096981 | STANDARD CELL LAYOUT, SEMICONDUCTOR DEVICE HAVING ENGINEERING CHANGE ORDER (ECO) CELLS AND METHOD | 2018-04-05 |
20180096982 | METHOD AND SYSTEM FOR PROVIDING A MAGNETIC CELL USABLE IN SPIN TRANSFER TORQUE APPLICATIONS AND INCLUDING A SWITCHABLE SHUNTING LAYER | 2018-04-05 |
20180096983 | CROSS-DOMAIN ESD PROTECTION CIRCUIT | 2018-04-05 |
20180096984 | METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE | 2018-04-05 |
20180096985 | Method of Manufacturing a Semiconductor Device | 2018-04-05 |
20180096986 | ESD PROTECTION DIODE AND ELECTRONIC DEVICE INCLUDING THE SAME | 2018-04-05 |
20180096987 | Protection Circuit for Integrated Circuit Die-Let After Scribe Cut | 2018-04-05 |
20180096988 | BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS | 2018-04-05 |
20180096989 | SHALLOW TRENCH ISOLATION RECESS PROCESS FLOW FOR VERTICAL FIELD EFFECT TRANSISTOR FABRICATION | 2018-04-05 |
20180096990 | TRANSISTOR WITH IMPROVED AIR SPACER | 2018-04-05 |
20180096991 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | 2018-04-05 |
20180096992 | SHALLOW TRENCH ISOLATION RECESS PROCESS FLOW FOR VERTICAL FIELD EFFECT TRANSISTOR FABRICATION | 2018-04-05 |