13th week of 2020 patent applcation highlights part 56 |
Patent application number | Title | Published |
20200098572 | CONTACT STRUCTURES WITH DEPOSITED SILICIDE LAYERS | 2020-03-26 |
20200098573 | Film Forming Method and Substrate Processing System | 2020-03-26 |
20200098574 | TUNGSTEN DEFLUORINATION BY HIGH PRESSURE TREATMENT | 2020-03-26 |
20200098575 | Etching Method, Etching Apparatus, and Storage Medium | 2020-03-26 |
20200098576 | Method for High Aspect Ratio Photoresist Removal in Pure Reducing Plasma | 2020-03-26 |
20200098577 | METHODS FOR MULTIPLE-PATTERNING NANOSPHERE LITHOGRAPHY FOR FABRICATION OF PERIODIC THREE-DIMENSIONAL HIERARCHICAL NANOSTRUCTURES | 2020-03-26 |
20200098578 | EXTREME ULTRAVIOLET LITHOGRAPHY PATTERNING WITH DIRECTIONAL DEPOSITION | 2020-03-26 |
20200098579 | SPACER SCULPTING FOR FORMING SEMICONDUCTOR DEVICES | 2020-03-26 |
20200098580 | SELF-ALIGNED DOUBLE PATTERNING (SADP) METHOD | 2020-03-26 |
20200098581 | EXTREME ULTRAVIOLET LITHOGRAPHY PATTERNING WITH DIRECTIONAL DEPOSITION | 2020-03-26 |
20200098582 | ETCHING METHOD AND PLATING SOLUTION | 2020-03-26 |
20200098583 | METHOD OF FABRICATING SEMICONDUCTOR STRUCUTRE | 2020-03-26 |
20200098584 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE STRUCTURE | 2020-03-26 |
20200098585 | Semiconductor Structure and Manufacturing Method Thereof | 2020-03-26 |
20200098586 | SELECTIVE MATERIAL REMOVAL | 2020-03-26 |
20200098587 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | 2020-03-26 |
20200098588 | Dry Ashing by Secondary Excitation | 2020-03-26 |
20200098589 | SELECTIVE PHOTORESIST ETCHING FOR BRIDGE DEFECT REMOVAL | 2020-03-26 |
20200098590 | CMP SLURRY AND CMP METHOD | 2020-03-26 |
20200098591 | METAL HETEROJUNCTION STRUCTURE WITH CAPPING METAL LAYER | 2020-03-26 |
20200098592 | CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON SUBSTRATE | 2020-03-26 |
20200098593 | WASHING METHOD, WASHING DEVICE, STORAGE MEDIUM, AND WASHING COMPOSITION | 2020-03-26 |
20200098594 | SUBSTRATE PROCESSING SYSTEM AND METHOD FOR SUPPLYING PROCESSING FLUID | 2020-03-26 |
20200098595 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR OPERATING THE SAME | 2020-03-26 |
20200098596 | SUBSTRATE LOADING SYSTEM | 2020-03-26 |
20200098597 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | 2020-03-26 |
20200098598 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | 2020-03-26 |
20200098599 | SUBSTRATE BONDING APPARATUS AND BONDING METHOD USING THE SAME | 2020-03-26 |
20200098600 | HEAT TREATMENT METHOD FOR MANAGING DUMMY WAFER | 2020-03-26 |
20200098601 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS FOR MANAGING DUMMY WAFER | 2020-03-26 |
20200098602 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD | 2020-03-26 |
20200098603 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-03-26 |
20200098604 | SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER MODULE | 2020-03-26 |
20200098605 | APPARATUS AND METHOD FOR MEASURING WARPAGE | 2020-03-26 |
20200098606 | VACUUM PROCESSING APPARATUS AND METHOD OF CONTROLLING VACUUM PROCESSING APPARATUS | 2020-03-26 |
20200098607 | SUBSTRATE TREATING APPARATUS | 2020-03-26 |
20200098608 | METHOD AND DEVICE FOR TREATING SUBSTRATES | 2020-03-26 |
20200098609 | SUBSTRATE TREATING APPARATUS | 2020-03-26 |
20200098610 | SUBSTRATE TREATING APPARATUS | 2020-03-26 |
20200098611 | SUBSTRATE TREATING APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE TREATING APPARATUS | 2020-03-26 |
20200098612 | INDEXER APPARATUS, SUBSTRATE TREATING APPARATUS, METHOD FOR CONTROLLING INDEXER APPARATUS, AND METHOD FOR CONTROLLING SUBSTRATE TREATING APPARATUS | 2020-03-26 |
20200098613 | WAFER POD HANDLING METHOD | 2020-03-26 |
20200098614 | APPARATUS FOR PACKING ULTRA-SMALL ELECTRONIC DEVICES | 2020-03-26 |
20200098615 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-03-26 |
20200098616 | Integrated Circuit Dielectric Material | 2020-03-26 |
20200098617 | Devices with Backside Metal Structures and Methods of Formation Thereof | 2020-03-26 |
20200098618 | SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE, METHOD FOR FORMING THEREOF, AND INTEGRATED CIRCUIT | 2020-03-26 |
20200098619 | CLADDED METAL INTERCONNECTS | 2020-03-26 |
20200098620 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-03-26 |
20200098621 | MICROELECTRONIC ASSEMBLIES HAVING MAGNETIC CORE INDUCTORS | 2020-03-26 |
20200098622 | LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF | 2020-03-26 |
20200098623 | Contacts and Interconnect Structures in Field-Effect Transistors | 2020-03-26 |
20200098624 | FILM FORMING METHOD AND FILM FORMING APPARATUS | 2020-03-26 |
20200098625 | SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE | 2020-03-26 |
20200098626 | VOID-FREE HIGH ASPECT RATIO METAL ALLOY INTERCONNECTS AND METHOD OF MANUFACTURE USING A SOLVENT-BASED ETCHANT | 2020-03-26 |
20200098627 | EMBEDDING METHOD AND PROCESSING SYSTEM | 2020-03-26 |
20200098628 | SYSTEMS AND METHODS FOR IMPROVING WITHIN DIE CO-PLANARITY UNIFORMITY | 2020-03-26 |
20200098629 | HARDENED PLUG FOR IMPROVED SHORTING MARGIN | 2020-03-26 |
20200098630 | SEMICONDUCTOR DEVICE | 2020-03-26 |
20200098631 | CAPACITANCE REDUCTION BY METAL CUT DESIGN | 2020-03-26 |
20200098632 | Methods for Reducing Contact Depth Variation in Semiconductor Fabrication | 2020-03-26 |
20200098633 | FULLY SELF-ALIGNED VIA | 2020-03-26 |
20200098634 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | 2020-03-26 |
20200098635 | METHOD OF CUTTING SUBSTRATE AND METHOD OF SINGULATING SEMICONDUCTOR CHIPS | 2020-03-26 |
20200098636 | ELEMENT CHIP MANUFACTURING METHOD | 2020-03-26 |
20200098637 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE | 2020-03-26 |
20200098638 | IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER | 2020-03-26 |
20200098639 | APPROACH TO PREVENT COLLAPSE OF HIGH ASPECT RATIO FIN STRUCTURES FOR VERTICAL TRANSPORT FIN FIELD EFFECT TRANSISTOR DEVICES | 2020-03-26 |
20200098640 | GATE STACK TREATMENT | 2020-03-26 |
20200098641 | Structure and Method for Metal Gates with Roughened Barrier Layer | 2020-03-26 |
20200098642 | HYBRID-CHANNEL NANO-SHEET FETS | 2020-03-26 |
20200098643 | NANOSHEET TRANSISTORS WITH DIFFERENT GATE DIELECTRICS AND WORKFUNCTION METALS | 2020-03-26 |
20200098644 | Methods of Forming Epitaxial Structures in Fin-Like Field Effect Transistors | 2020-03-26 |
20200098645 | FinFET EPI Channels Having Different Heights on a Stepped Substrate | 2020-03-26 |
20200098646 | Methods of Forming Isolation Features in Metal Gates | 2020-03-26 |
20200098647 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING | 2020-03-26 |
20200098648 | REFLECTANCE MEASUREMENT SYSTEM AND METHOD THEREOF | 2020-03-26 |
20200098649 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 2020-03-26 |
20200098650 | METHOD FOR CALIBRATING TEMPERATURE IN CHEMICAL VAPOR DEPOSITION | 2020-03-26 |
20200098651 | Systems and Methods for Controlling Plasma Instability in Semiconductor Fabrication | 2020-03-26 |
20200098652 | REPAIR METHOD AND APPARATUS FOR FLEXIBLE DISPLAY PANEL AND THE FLEXIBLE DISPLAY PANEL THEREOF | 2020-03-26 |
20200098653 | SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM | 2020-03-26 |
20200098654 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-03-26 |
20200098655 | ENCLOSURE FOR AN ELECTRONIC COMPONENT | 2020-03-26 |
20200098656 | ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE | 2020-03-26 |
20200098657 | CONTACT STACKS TO REDUCE HYDROGEN IN THIN FILM TRANSISTOR | 2020-03-26 |
20200098658 | INITIATION OF ONE OR MORE PROCESSORS IN AN INTEGRATED CIRCUIT | 2020-03-26 |
20200098659 | HIGH RESISTIVITY WAFER WITH HEAT DISSIPATION STRUCTURE AND METHOD OF MAKING THE SAME | 2020-03-26 |
20200098660 | SEMICONDUCTOR DEVICE | 2020-03-26 |
20200098661 | LIQUID METAL TIM WITH STIM-LIKE PERFORMANCE WITH NO BSM AND BGA COMPATIBLE | 2020-03-26 |
20200098662 | Power Semiconductor Module Arrangement | 2020-03-26 |
20200098663 | COMPOSITE MATERIAL, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | 2020-03-26 |
20200098664 | USING A THERMOELECTRIC COOLER TO REDUCE HEAT TRANSFER BETWEEN HEAT-CONDUCTING PLATES | 2020-03-26 |
20200098665 | NON-PLANAR CONFORMING HEATSINK | 2020-03-26 |
20200098666 | SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES | 2020-03-26 |
20200098667 | SEMICONDUCTOR MODULE AND VEHICLE | 2020-03-26 |
20200098668 | THERMAL MANAGEMENT SOLUTIONS FOR EMBEDDED INTEGRATED CIRCUIT DEVICES | 2020-03-26 |
20200098669 | THERMAL MANAGEMENT SOLUTIONS FOR SUBSTRATES IN INTEGRATED CIRCUIT PACKAGES | 2020-03-26 |
20200098670 | INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTICULAR DUAL SIDE COOLING PACKAGE | 2020-03-26 |
20200098671 | POWER MODULES AND RELATED METHODS | 2020-03-26 |