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12th week of 2021 patent applcation highlights part 63
Patent application number
Title
Published
20210091014
Method for manufacturing a microelectronic device integrating a physical unclonable function provided by resistive memories, and said device
2021-03-25
20210091015
METHOD FOR PROTECTING AN INTEGRATED CIRCUIT, AND CORRESPONDING DEVICE
2021-03-25
20210091016
TRANSFORMERS WITH BUILD-UP FILMS
2021-03-25
20210091017
PACKAGE COMPRISING DISCRETE ANTENNA DEVICE
2021-03-25
20210091018
DEVICES AND METHODS FOR ENHANCING INSERTION LOSS-PERFORMANCE OF AN ANTENNA SWITCH
2021-03-25
20210091019
DISTRIBUTION LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF, AND BOND PAD STRUCTURE
2021-03-25
20210091020
INTEGRATED CIRCUIT STRUCTURE
2021-03-25
20210091021
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2021-03-25
20210091022
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
2021-03-25
20210091023
SEMICONDUCTOR DEVICE
2021-03-25
20210091024
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
2021-03-25
20210091025
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
2021-03-25
20210091026
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
2021-03-25
20210091027
ARRAY SUBSTRATE AND CHIP BONDING METHOD
2021-03-25
20210091028
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
2021-03-25
20210091029
SHIELDING STRUCTURES
2021-03-25
20210091030
ELECTROLESS-CATALYST DOPED-MOLD MATERIALS FOR INTEGRATED-CIRCUIT DIE PACKAGING ARCHITECTURES
2021-03-25
20210091031
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
2021-03-25
20210091032
PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT SIZE CHIPS
2021-03-25
20210091033
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
2021-03-25
20210091034
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
2021-03-25
20210091035
APPARATUS AND METHOD FOR SECURING SUBSTRATES WITH VARYING COEFFICIENTS OF THERMAL EXPANSION
2021-03-25
20210091036
TECHNIQUES FOR FORMING SEMICONDUCTOR DEVICE PACKAGES AND RELATED PACKAGES, INTERMEDIATE PRODUCTS, AND METHODS
2021-03-25
20210091037
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
2021-03-25
20210091038
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
2021-03-25
20210091039
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME
2021-03-25
20210091040
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
2021-03-25
20210091041
THREE-DIMENSIONAL INTEGRATED CIRCUIT TEST AND IMPROVED THERMAL DISSIPATION
2021-03-25
20210091042
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
2021-03-25
20210091043
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
2021-03-25
20210091044
SEMICONDUCTOR MEMORY DEVICE
2021-03-25
20210091045
SEMICONDUCTOR PACKAGE INCLUDING A FIRST SEMICONDUCTOR STACK AND A SECOND SEMICONDUCTOR STACK OF DIFFERENT WIDTHS
2021-03-25
20210091046
INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
2021-03-25
20210091047
3D Package Structure and Methods of Forming Same
2021-03-25
20210091048
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
2021-03-25
20210091049
METHOD FOR MANUFACTURING MICRO LED PANEL AND MICRO LED PANEL THEREOF
2021-03-25
20210091050
DISPLAY DEVICE
2021-03-25
20210091051
METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE
2021-03-25
20210091052
Fluidic Assembly Enabled Mass Transfer for MicroLED Displays
2021-03-25
20210091053
LIGHT EMITTING MODULE
2021-03-25
20210091054
POWER ELECTRONICS MODULE
2021-03-25
20210091055
LIGHT-EMITTING MODULE
2021-03-25
20210091056
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
2021-03-25
20210091057
DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED BONDING METHOD
2021-03-25
20210091058
TSV CHECK CIRCUIT WITH REPLICA PATH
2021-03-25
20210091059
Multi-Chip Semiconductor Package
2021-03-25
20210091060
STORAGE DEVICE AND METHOD OF MAKING THE SAME
2021-03-25
20210091061
GALLIUM NITRIDE AND SILICON CARBIDE HYBRID POWER DEVICE
2021-03-25
20210091062
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
2021-03-25
20210091063
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE SAME BY REPLACING CARRIER SUBSTRATE WITH SOURCE LAYER
2021-03-25
20210091064
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
2021-03-25
20210091065
Semiconductor Device with Multiple Polarity Groups
2021-03-25
20210091066
SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE
2021-03-25
20210091067
METHOD OF MANUFACTURING TRENCH TRANSISTOR STRUCTURE
2021-03-25
20210091068
ESD DEVICE WITH FAST RESPONSE AND HIGH TRANSIENT CURRENT
2021-03-25
20210091069
SEMICONDUCTOR DEVICE OF ELECTROSTATIC DISCHARGE PROTECTION
2021-03-25
20210091070
ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND LAYOUT DESIGN THEREOF
2021-03-25
20210091071
TRIMMABLE RESISTOR CIRCUIT AND METHOD FOR OPERATING THE TRIMMABLE RESISTOR CIRCUIT
2021-03-25
20210091072
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CIRCUIT
2021-03-25
20210091073
SEMICONDUCTOR DEVICE WITH NANOWIRE PLUGS AND METHOD FOR FABRICATING THE SAME
2021-03-25
20210091074
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2021-03-25
20210091075
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITHOUT FIN END GAP
2021-03-25
20210091076
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
2021-03-25
20210091077
SEMICONDUCTOR DEVICE
2021-03-25
20210091078
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-03-25
20210091079
STACKED TRANSISTOR WITH SEPARATE GATE
2021-03-25
20210091080
STACKED TRANSISTORS WITH SI PMOS AND HIGH MOBILITY THIN FILM TRANSISTOR NMOS
2021-03-25
20210091081
INTEGRATED CIRCUIT DEVICE
2021-03-25
20210091082
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT
2021-03-25
20210091083
SEMICONDUCTOR DEVICE
2021-03-25
20210091084
Semiconductor Devices and Methods of Manufacture
2021-03-25
20210091085
SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME
2021-03-25
20210091086
METHODS OF MANUFACTURING DEVICES INCLUDING A BURIED GATE CELL AND A BIT LINE STRUCTURE INCLUDING A THERMAL OXIDE BUFFER PATTERN
2021-03-25
20210091087
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
2021-03-25
20210091088
SEMICONDUCTOR DEVICE WITH NANOWIRE CAPACITOR PLUGS AND METHOD FOR FABRICATING THE SAME
2021-03-25
20210091089
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
2021-03-25
20210091090
MEMORY ARRAY WITH CONTINUOUS DIFFUSION FOR BIT-CELLS AND SUPPORT CIRCUITRY
2021-03-25
20210091091
SEMICONDUCTOR DEVICE HAVING A BUTTED CONTACT, METHOD OF FORMING AND METHOD OF USING
2021-03-25
20210091092
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR STORAGE DEVICE
2021-03-25
20210091093
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A STRING SELECTION LINE GATE ELECTRODE HAVING A SILICIDE LAYER
2021-03-25
20210091094
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
2021-03-25
20210091095
MEMORY DEVICE
2021-03-25
20210091096
FERROELECTRIC MEMORY DEVICES WITH REDUCED EDGE DEFECTS AND METHODS FOR FORMING THE SAME
2021-03-25
20210091097
MEMORY CELL ARRANGEMENT
2021-03-25
20210091098
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
2021-03-25
20210091099
MEMORY STRUCTURE
2021-03-25
20210091100
SEMICONDUCTOR MEMORY DEVICE
2021-03-25
20210091101
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
2021-03-25
20210091102
THREE-DIMENSIONAL MEMORY DEVICE HAVING MULTI-DECK STRUCTURE AND METHODS FOR FORMING THE SAME
2021-03-25
20210091103
THREE-DIMENSIONAL MEMORY DEVICE HAVING MULTI-DECK STRUCTURE AND METHODS FOR FORMING THE SAME
2021-03-25
20210091104
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
2021-03-25
20210091105
INTEGRATED CIRCUIT DEVICE
2021-03-25
20210091106
THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
2021-03-25
20210091107
SEMICONDUCTOR STORAGE DEVICE
2021-03-25
20210091108
MEMORY DEVICE AND MANUFACTURING METHOD OF MEMORY DEVICE
2021-03-25
20210091109
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
2021-03-25
20210091110
THREE-DIMENSIONAL MEMORY DEVICES WITH ARCHITECTURE OF INCREASED NUMBER OF BIT LINES
2021-03-25
20210091111
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
2021-03-25
20210091112
SEMICONDUCTOR DEVICE
2021-03-25
20210091113
MEMORY DEVICE
2021-03-25