12th week of 2012 patent applcation highlights part 16 |
Patent application number | Title | Published |
20120068310 | SEMICONDUCTOR DEVICE - A carrier is prevented from being stored in a guard ring region in a semiconductor device. The semiconductor device has an IGBT cell including a base region and an emitter region formed in an n− type drift layer, and a p type collector layer arranged under the drift layer with a buffer layer interposed therebetween. A guard ring region having a guard ring is arranged around the IGBT cell. A lower surface of the guard ring region has a mesa structure provided by removing the collector layer. | 2012-03-22 |
20120068311 | SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor substrate having a semiconductor device formable area, wherein a reinforcing part, which is thicker than the semiconductor device formable area and has a top part of which surface is flat, is formed on an outer circumference part of the semiconductor substrate, and an inner side surface connecting the top part of the reinforcing part and the semiconductor device formable area has a cross-sectional shape of which inner diameter becomes smaller as being closer to the semiconductor device formable area. | 2012-03-22 |
20120068312 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 2012-03-22 |
20120068313 | Semiconductor device and method of forming conductive TSV with insulating annular ring - A semiconductor wafer has an insulating layer formed over an active surface of the wafer. A conductive layer is formed over the insulating layer. A first via is formed from a back surface of the semiconductor wafer through the semiconductor wafer and insulating layer to the conductive layer. A conductive material is deposited in the first via to form a conductive TSV. An insulating material can be deposited in the first via to form an insulating core within the conductive via. After forming the conductive TSV, a second via is formed around the conductive TSV from the back surface of the semiconductor wafer through the semiconductor wafer and insulating layer to the conductive layer. An insulating material is deposited in the second via to form an insulating annular ring. The conductive via can be recessed within or extend above a surface of the semiconductor die. | 2012-03-22 |
20120068314 | CROSSLINKABLE DIELECTRICS AND METHODS OF PREPARATION AND USE THEREOF - The present invention relates to an electronic device comprising at least one dielectric layer, said dielectric layer comprising a crosslinked organic compound based on at least one compound which is radically crosslinkable and a method of making the electronic device. | 2012-03-22 |
20120068315 | METHOD OF IMPROVING MECHANICAL PROPERTIES OF SEMICONDUCTOR INTERCONNECTS WITH NANOPARTICLES - In a BEOL process, UV radiation is used in a curing process of ultra low-k (ULK) dielectrics. This radiation penetrates through the ULK material and reaches the cap film underneath it. The interaction between the UV light and the film leads to a change the properties of the cap film. Of particular concern is the change in the stress state of the cap from compressive to tensile stress. This leads to a weaker dielectric-cap interface and mechanical failure of the ULK film. A layer of nanoparticles is inserted between the cap and the ULK film. The nanoparticles absorb the UV light before it can damage the cap film, thus maintaining the mechanical integrity of the ULK dielectric. | 2012-03-22 |
20120068316 | TRANSITION FROM A CHIP TO A WAVEGUIDE PORT - The present invention relates to a transition from a chip to a waveguide port ( | 2012-03-22 |
20120068317 | TSOP WITH IMPEDANCE CONTROL - A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element arranged in a plane positioned adjacent the lead frame and substantially parallel to the lead plane, the conductive element being capacitively coupled to the leads such that the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path, and an encapsulant which encapsulates the leads and the conductive element. The leads and, desirably, the conductive element have respective connection regions which are not covered by the encapsulant. | 2012-03-22 |
20120068318 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADDLE MOLDING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a hole, a recess, and a pad, the hole over the recess; mounting an integrated circuit to the package paddle; forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle; attaching connectors directly on the integrated circuit, the lead, and the package paddle; and forming an encapsulation covering the integrated circuit and within the hole and the recess. | 2012-03-22 |
20120068319 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and mounted over the carrier top side; mounting base vertical interconnects directly on the base interconnect pads; attaching a base package substrate to the base integrated circuit and directly on the base vertical interconnects; forming a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads; and removing a portion of the connection carrier with the base device pads and the base interconnect pads partially exposed opposite the base package substrate. | 2012-03-22 |
20120068320 | Integrated Power Converter Package With Die Stacking - An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry. | 2012-03-22 |
20120068321 | SEMICONDUCTOR DEVICE - The invention enhances resistance to a surge in a semiconductor device having a semiconductor die mounted on a lead frame. An N type embedded layer, an epitaxial layer and a P type semiconductor layer are disposed on the front surface of a P type semiconductor substrate forming an IC die. A metal thin film is disposed on the back surface of the semiconductor substrate, and a conductive paste containing silver particles and so on is disposed between the metal thin film and a metal island. When a surge is applied to a pad electrode disposed on the front surface of the semiconductor layer, the surge current flowing from the semiconductor layer into the semiconductor substrate runs toward the metal island through the metal thin film. | 2012-03-22 |
20120068322 | PACKAGE SUBSTRATE, MODULE AND ELECTRIC/ELECTRONIC DEVICES USING THE SAME - A package substrate includes: a first conductive layer having plural first terminal pattern portions connected to a semiconductor part loaded on a first principal surface through plural first external connection conductors, which is formed on the first principal surface; a second conductive layer having plural second terminal patterns connected to a system substrate mounted on a second principal surface opposite to the first principal surface through a second external connection conductor, which is formed on the second principal surface; an intermediate conductive layer formed between the first conductive layer and the second conductive layer; interlayer insulating layers formed between the first conductive layer and the intermediate conductive layer as well as between the second conductive layer and the intermediate conductive layer; and plural interlayer connection conductors stacked for connecting between the first conductive layer and the second conductive layer so as to pierce through the interlayer insulating layers. | 2012-03-22 |
20120068323 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE - A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface. | 2012-03-22 |
20120068324 | SEMICONDUCTOR DEVICE - A semiconductor device includes at least two or more groups of external connection terminals to which a substrate that drives a bare chip by inputting a signal from an external apparatus to the bare chip is electrically connected, the at least two or more groups of external connection terminals being formed outside an image area of the bare chip, wherein at least one group of terminals constitutes a first group of terminals, another group of terminals constitutes a second group of terminals, the first group of terminals doubles as the second group of terminals, and a substrate for inspection doubling as a substrate for mounting is electrically connected to the first group of terminals. | 2012-03-22 |
20120068325 | SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL - In one embodiment, a semiconductor structure including a first substrate, a semiconductor device on the first substrate, a second substrate, and a conductive bond between the first substrate and the second substrate that surrounds the semiconductor device to seal the semiconductor device between the first substrate and the second substrate. The conductive bond comprises metal, silicon, and germanium. A percentage by atomic weight of silicon in the conductive bond is greater than 5%. | 2012-03-22 |
20120068326 | ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS - A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling. | 2012-03-22 |
20120068327 | MULTI-FUNCTION AND SHIELDED 3D INTERCONNECTS - A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening extending through the semiconductor element. At least one of the conductive pads can at least partially overlie the opening and can be electrically connected with at least one of the active semiconductor devices. The microelectronic unit can also include a first conductive element exposed at the rear surface for connection with an external component, the first conductive element extending through the opening and electrically connected with the at least one conductive pad, and a second conductive element extending through the opening and insulated from the first conductive element. The at least one conductive pad can overlie a peripheral edge of the second conductive element. | 2012-03-22 |
20120068328 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVAL AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an interconnect structure having a structure bottom side, a structure top side, and a cavity, the structure bottom side electrically connected to the structure top side; mounting an integrated circuit entirely within the cavity, the integrated circuit having an active side coplanar with the structure top side; forming an encapsulation partially covering the interconnect structure and the integrated circuit, the encapsulation having an encapsulation top side coplanar with the structure top side and the active side; forming a top re-passivation layer over the structure top side and the encapsulation; and mounting a heat sink over the top re-passivation layer for removing heat from the active side. | 2012-03-22 |
20120068329 | SEMICONDUCTOR DEVICE - The present invention provides a semiconductor device capable of selecting a desired circuit (step-down circuit (or step-up/step-down circuit) and step-up circuit) on the user side at low cost. A semiconductor device according to the present invention includes a diode element and a switching element (IGBT). An anode terminal of the diode element and one main electrode terminal of the switching element are adjacently arranged at a predetermined distance from each other. In addition, a cathode terminal of the diode element and the other main electrode terminal of the switching element are adjacently arranged at another predetermined distance from each other. | 2012-03-22 |
20120068330 | STAGED VIA FORMATION FROM BOTH SIDES OF CHIP - A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad. | 2012-03-22 |
20120068331 | Microsprings Partially Embedded In A Laminate Structure And Methods For Producing Same - At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring. | 2012-03-22 |
20120068332 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a stack substrate with a component side; connecting an integrated circuit component to the component side; attaching a conductive post to the component side and adjacent the integrated circuit component, the conductive post having a protruded end above the integrated circuit component; forming a protection layer on a top and sides of the protruded end, the protection layer having a width equal to a width of the conductive post; applying a stack encapsulation over the integrated circuit component, over the stack substrate, and around a portion of the conductive post, the protection layer exposed from the stack encapsulation; and mounting a base package under the stack substrate, base package connected to the stack substrate. | 2012-03-22 |
20120068333 | Wire Bond Through-Via Structure and Method - A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer. | 2012-03-22 |
20120068334 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Semiconductor devices of embodiments include a plurality of solder bumps electrically connected on a plurality of electrode pads disposed on a semiconductor substrate in parallel at a pitch of 40 μm or less via under bump metals. The ratio of the diameter (the top diameter) of the portion of each solder bump most away from the semiconductor substrate and the diameter (the bottom diameter) of the bottom side of each solder bump is 1:1 to 1:4. | 2012-03-22 |
20120068335 | PRINTED CIRCUIT BOARD HAVING HEXAGONALLY ALIGNED BUMP PADS FOR SUBSTRATE OF SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - Provided are a printed circuit board (PCB) having hexagonally aligned bump pads as a substrate of a semiconductor package, and a semiconductor package including the same. The PCB includes: a PCB body; a bottom metal layer at a bottom of the PCB body; and a top metal layer at a top of the PCB body, and the top metal layer includes: vias vertically connected to the PCB body; bump pads hexagonally aligned in a horizontal direction around the vias; and connection patterns connecting the vias to two or more of the bump pads. Accordingly, the number of bump pads in a unit area of the PCB may be increased. | 2012-03-22 |
20120068336 | Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die - A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer. | 2012-03-22 |
20120068337 | Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection - A semiconductor device has a semiconductor die mounted to a substrate with a plurality of composite interconnects formed between interconnect sites on the substrate and bump pads on the die. The interconnect sites are part of traces formed on the substrate. The interconnect site has a width between 1.0 and 1.2 times a width of the trace. The composite interconnect is tapered. The composite interconnects have a fusible portion connected to the interconnect site and non-fusible portion connected to the bump pad. The non-fusible portion can be gold, copper, nickel, lead solder, or lead-tin alloy. The fusible portion can be tin, lead-free alloy, tin-silver alloy, tin-silver-copper alloy, tin-silver-indium alloy, eutectic solder, or other tin alloys with silver, copper, or lead. An underfill material is deposited between the semiconductor die and substrate. A finish such as Cu—OSP can be formed over the substrate. | 2012-03-22 |
20120068338 | IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL - A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential. | 2012-03-22 |
20120068339 | VLSI Package for High Performance Integrated Circuit - A packaged integrated circuit is presented for placement on a printed circuit board (PCB) layer providing power lines and data access channels. The packaged integrated circuit includes; a package substrate having data channels and power lines; a circuit substrate having functional components, wherein (a) the power lines and the data channels in the package substrate are coupled to the functional components of the substrate by conducting bumps, (b) the conducting balls coupling the data access channels in the PCB to the data channels in the package substrate are located along the edges of the package substrate; and (c) the conducting balls coupling the power lines in the PCB and the power lines in the package substrate are located in an interior portion of the package substrate. Also, an integrated circuit may further include a circuit substrate having active components, including a SerDes circuit at a center portion of the substrate. | 2012-03-22 |
20120068340 | Ball grid array semiconductor package and method of manufacturing the same - Provided is a BGA semiconductor package including: a substrate on which a semiconductor device is mounted; an adhesive for adhering the semiconductor device and the substrate to each other; a micro ball having conductivity, the micro ball being fitted into a through-hole provided in the substrate; a bonding wire for electrically connecting the semiconductor device and the micro ball to each other; and an encapsulation member for encapsulating, with an encapsulation resin, the semiconductor device, the adhesive, a part of the micro ball, and the bonding wire, only on a surface side of the substrate on which the semiconductor device is mounted, in which at least a part of a bottom surface of the micro ball has an exposed portion as an external connection terminal, which is exposed through the through-hole provided in the substrate as a bottom surface of the encapsulation member. | 2012-03-22 |
20120068341 | Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method - A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity. | 2012-03-22 |
20120068342 | ELECTRICALLY CONDUCTIVE ADHESIVE FOR TEMPORARY BONDING - The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from electrical charge build-up on the microelectronic devices during the formation of through-silicon vias. | 2012-03-22 |
20120068343 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor device includes a semiconductor substrate, an interlayer dielectric film, a contact hole, a contact plug and a nickel silicide film. The semiconductor substrate includes silicon. The interlayer dielectric film is formed on the semiconductor substrate. The contact hole is formed in the interlayer dielectric film. A contact plug is formed within the contact hole. A nickel silicide film is formed on a bottom part of the contact hole and electrically connected to the contact plug. A position of an interface between the nickel silicide and the contact plug is higher than a position of an interface between the semiconductor substrate and the interlayer dielectric film. | 2012-03-22 |
20120068344 | INTERCONNECT STRUCTURE WITH A PLANAR INTERFACE BETWEEN A SELECTIVE CONDUCTIVE CAP AND A DIELECTRIC CAP LAYER - A selective conductive cap is deposited on exposed metal surfaces of a metal line by electroless plating selective to exposed underlying dielectric surfaces of a metal interconnect structure. A dielectric material layer is deposited on the selective conductive cap and the exposed underlying dielectric layer without a preclean. The dielectric material layer is planarized to form a horizontal planar surface that is coplanar with a topmost surface of the selective conductive cap. A preclean is performed and a dielectric cap layer is deposited on the selective conductive cap and the planarized surface of the dielectric material layer. Because the interface including a surface damaged by the preclean is vertically offset from the topmost surface of the metal line, electromigration of the metal in the metal line along the interface is reduced or eliminated. | 2012-03-22 |
20120068345 | LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS - In various embodiments, a layer stack is provided. The layer stack may include a carrier; a first metal disposed over the carrier; a second metal disposed over the first metal; and a solder material disposed above the second metal or a material that provides contact to a solder that is supplied by an external source. The second metal may have a melting temperature of at least 1800° C. and is not or substantially not dissolved in the solder material at least one of during a soldering process and after the soldering process. | 2012-03-22 |
20120068346 | STRUCTURE FOR NANO-SCALE METALLIZATION AND METHOD FOR FABRICATING SAME - A method for forming structure aligned with features underlying an opaque layer is provided for an interconnect structure, such as an integrated circuit. In one embodiment, the method includes forming an opaque layer over a first layer, the first layer having a surface topography that maps to at least one feature therein, wherein the opaque layer is formed such that the surface topography is visible over the opaque layer. A second feature is positioned and formed in the opaque layer by reference to such surface topography. | 2012-03-22 |
20120068347 | METHOD FOR PROCESSING SEMICONDUCTOR STRUCTURE AND DEVICE BASED ON THE SAME - Methods for fabricating a device and related device structures are provided herein. According to one embodiment, a method for fabricating a device includes the acts of producing a substrate; forming a structure on the substrate having a lower dielectric layer, a metal layer, an upper dielectric layer, a planarizing layer, and a layer of photoresist material; developing the photoresist material according to a mask pattern; etching the planarizing layer and the upper dielectric layer according to the mask pattern; removing the photoresist material and the planarizing layer upon etching of the planarizing layer and the upper dielectric layer; applying a selective metal growth or metal/organic film to respective exposed portions of the metal layer following etching of the upper dielectric layer, thereby obtaining an inverted mask pattern; and etching at least the metal layer and the lower dielectric layer according to the inverted mask pattern. | 2012-03-22 |
20120068348 | Interconnect Regions - Some embodiments include interconnect regions. The regions may contain, along a cross section, a closed-shape interior region having an electrically conductive material therein, a first dielectric material configured as a liner extending entirely around a lateral periphery of the interior region, and at least two dielectric projections joining to the dielectric material liner and being laterally outward of the interior region. The dielectric projections may have an outer dielectric ring surrounding an inner dielectric region. The outer ring may consist of the first dielectric material and the inner dielectric region may be a composition different from a composition of the first dielectric material, and in some embodiments the composition within the inner dielectric region may be gaseous. | 2012-03-22 |
20120068349 | TAPE PACKAGE - A tape package providing a plurality of input and output portions each having a minimum pitch. The tape package includes a tape wiring substrate including first and second wirings, and a semiconductor chip mounted on the tape wiring substrate, and including a first edge, a first pad disposed adjacent to the first edge, and a second pad disposed to be farther spaced apart from the first edge than the first pad, where the first wiring is connected to a portion of the first pad that is spaced from the first edge by a first distance, and where the second wiring is connected to a portion of the second pad that is spaced from the first edge by a second distance that is greater than the first distance. | 2012-03-22 |
20120068350 | SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME - A semiconductor package, an electronic device, and an electronic system employing the same are provided. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip structure. A first PCB land region is provided on a first surface of the PCB. A plurality of first chip land regions are provided on a first surface of the semiconductor chip structure which faces the first surface of the PCB. A first connection structure for electrically connecting the first PCB land region to the plurality of first chip land regions is provided. | 2012-03-22 |
20120068351 | CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING - An assembly and method of making same are provided. The assembly can be formed by juxtaposing a first electrically conductive element overlying a major surface of a first semiconductor element with an electrically conductive pad exposed at a front surface of a second semiconductor element. An opening can be formed extending through the conductive pad of the second semiconductor element and exposing a surface of the first conductive element. The opening may alternatively be formed extending through the first conductive element. A second electrically conductive element can be formed extending at least within the opening and electrically contacting the conductive pad and the first conductive element. A third semiconductor element can be positioned in a similar manner with respect to the second semiconductor element. | 2012-03-22 |
20120068352 | STACKED CHIP ASSEMBLY HAVING VERTICAL VIAS - An assembly and method of making same are provided. The assembly can be formed by stacking a first semiconductor element atop a second semiconductor element and forming an electrically conductive element extending through openings of the semiconductor elements. The openings may be staged. The conductive element can conform to contours of the interior surfaces of the openings and can electrically connect conductive pads of the semiconductor elements. A dielectric region can be provided at least substantially filling the openings of the semiconductor elements, and the electrically conductive element can extend through an opening formed in the dielectric region. | 2012-03-22 |
20120068353 | Semiconductor Device and Method of Forming Dam Material With Openings Around Semiconductor Die for Mold Underfill Using Dispenser and Vacuum Assist - A semiconductor wafer contains a plurality of semiconductor die separated by saw streets. A dam material is formed over the saw streets around each of the semiconductor die. A plurality of openings is formed in the dam material. The openings in the dam material can be formed on each side or corners of the first semiconductor die. The semiconductor wafer is singulated through the dam material to separate the semiconductor die. The semiconductor die is mounted to a substrate. A mold underfill is deposited through a first opening in the dam material. A vacuum is drawn on a second opening in the dam material to cause the underfill material to cover an area between the first semiconductor die and substrate without voids. The number of second openings can be greater than the number of first openings. The first opening can be larger than the second opening. | 2012-03-22 |
20120068354 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor memory device includes a multilayer body, a second electrode film provided on the multilayer body, a second insulating film provided on the second electrode film, a semiconductor film, a memory film and a gate insulating film. At boundary between the inner surface of the second through hole and the inner surface of the third through hole, or on the inner surface of the second through hole, a step difference is formed so that an upper side from the step difference is thicker than a lower side from the step difference. | 2012-03-22 |
20120068355 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device including two silicon wafers stacked and bonded together with bumps of one wafer electrically coupled with those of the other wafer, in which generation of voids on the junction surface between the silicon wafers is suppressed. Due to a recess made in the surface of a buried conductive film, a cavity is formed in the junction surface between the silicon wafers. The ends of the cavity extend to the periphery of the junction surface between the silicon wafers. This allows the air trapped on the junction surface between the silicon wafers to get out through the cavity, thereby reducing the possibility of generation of voids on the junction surface. | 2012-03-22 |
20120068356 | Component having a VIA - A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap. | 2012-03-22 |
20120068357 | SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a base, a semiconductor element, an electrode terminal, a connecting member and a joining material. The semiconductor element is mounted on the base. The electrode terminal is provided spaced from the base. The connecting member connects the semiconductor element to the electrode terminal and includes a plurality of through holes provided in one end portion of the connecting member. The one end portion is connected to the semiconductor element. The joining material intervenes between the semiconductor element and the connecting member and penetrates into the plurality of through holes. | 2012-03-22 |
20120068358 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME - A semiconductor package includes: a semiconductor substrate; an inner insulator layer formed on the substrate; at least one internal wiring extending from a front side of the substrate along one of lateral sides of the substrate to a rear side of the substrate; a first outer insulator layer disposed at the front side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole; and a second outer insulator layer disposed at the rear side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole which exposes a portion of the internal wiring. | 2012-03-22 |
20120068359 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device comprises: a core substrate; at least one insulating layer and at least one wiring layer which are disposed on each of a first surface of the core substrate and a second surface opposite to the first surface; a via(s) which is disposed in each of the insulating layer and the core substrate, and connects the wiring layers to each other; a semiconductor element, mounted on the first surface of the core substrate, with a surface for forming an electrode terminal(s) facing up; and a connecting portion(s) which penetrates the insulating layer disposed on the first surface and directly connects the electrode terminal of the semiconductor element and the wiring layer disposed on the first surface. A minimum wiring pitch of the wiring layer directly connected to the connecting portion is smaller than that of any of the wiring layer(s) disposed on the second surface. | 2012-03-22 |
20120068360 | Stacked Semiconductor Device Assembly - The semiconductor device system includes multiple stacked substantially identical semiconductor devices each including a first side and an opposing second side. First and second pads are disposed at the first side of the semiconductor device, while third and fourth pads are disposed at the second side of the semiconductor device. First interface circuit is electrically coupled to the first pad and the third pad, while second interface circuit is electrically coupled to the second pad and the fourth pad. The second interface circuit is separate and distinct from the first interface circuit. At least one first semiconductor device of the multiple semiconductor devices is offset from other of the multiple semiconductor devices such that the fourth pad on the first semiconductor device is aligned with, and electrically connected to, the first pad on an adjacent one of the multiple semiconductor devices. In some embodiments, the first pad is associated with a first capacitance, while the second pad is associated with a second capacitance that is smaller than the first capacitance. | 2012-03-22 |
20120068361 | STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL - A microelectronic assembly may include microelectronic devices arranged in a stack and having device contacts exposed at respective front surfaces. Signal conductors having substantial portions extending above the front surface of the respective microelectronic devices connect the device contacts with signal contacts of an underlying interconnection element. A rear surface of a microelectronic device of the stack overlying an adjacent microelectronic device of the stack is spaced a predetermined distance above and extends at least generally parallel to the substantial portions of the signal conductors connected to the adjacent device, such that a desired impedance may be achieved for the signal conductors connected to the adjacent device. | 2012-03-22 |
20120068362 | SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR MEMBER AND MOUNTING MEMBER - A semiconductor device including: a semiconductor member having thereon a plurality of interconnect pads: and a mounting member having a plurality of electrode terminals electrically and mechanically connected to the respective interconnect pads for mounting the semiconductor chip on the mounting member, the electrode terminals forming a plurality of I/O cells each having part of the electrode terminals, the part of electrode terminals including signal terminals, the I/O cells forming a first group of the I/O cells and a second group of I/O cells disposed on an inner position of the mounting member with respect to the first group. The higher integration of the semiconductor device having the higher performances can be realized because the interconnect lines can be drawn to the outer periphery of the chip from the interconnect pads corresponding to each of the I/O cells when the chip is miniaturized or the number of the ball electrodes is increased. | 2012-03-22 |
20120068363 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal. | 2012-03-22 |
20120068364 | Device and Method for Manufacturing a Device - A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the first material. | 2012-03-22 |
20120068365 | METAL CAN IMPEDANCE CONTROL STRUCTURE - A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential. | 2012-03-22 |
20120068366 | SELECTIVE ETCH CHEMISTRIES FOR FORMING HIGH ASPECT RATIO FEATURES AND ASSOCIATED STRUCTURES - An interlevel dielectric layer, such as a silicon oxide layer, is selectively etched using a plasma etch chemistry including a silicon species and a halide species and also preferably a carbon species and an oxygen species. The silicon species can be generated from a silicon compound, such as Si | 2012-03-22 |
20120068367 | VACUUM ACTIVATED POWER TOWER - The Present Invention is a modular tower structure comprising a common up-flow column topped with a covered header to which multiple independent down-flow and scavenger columns are attached. It employs a renewable energy process for extracting energy from the atmosphere. The process works by creating a vacuum into which atmospheric air is drawn through a vacuum operated motor driver. The motor in turn can operate other mechanisms as electric power generators. | 2012-03-22 |
20120068368 | METHOD FOR MANUFACTURING OPTICAL DIFFRACTION ELEMENT - If an optical lens base having a diffraction grating on the surface is made of a resin, a corrosion reaction is produced between the optical lens base and a nanocomposite film material, thus deteriorating performance as a diffractive optical element. In the manufacturing process of a diffractive optical element according to the present invention, the nanocomposite film material is dripped onto a die and then heated and dried, thereby vaporizing away a solvent from the nanocomposite film material. After that, the dies are assembled to form a nanocomposite film with a predetermined thickness on the optical lens base. As a result, a diffractive optical element with excellent optical properties can be obtained without producing a reaction between the optical lens base and the nanocomposite film material. | 2012-03-22 |
20120068369 | METHOD FOR PRODUCING A LIGHT SOURCE HAVING A DIODE LASER AND A PLURALITY OF OPTICAL FIBERS - A method is described for producing a light source, in particular a light source for optically exciting a laser device, for example a laser device of a laser ignition system of an internal combustion engine, including a diode laser having a plurality of emitters and a fiber optic device. The fiber optic device includes a plurality of optical fibers, each fiber having a first end and a lateral surface area. The first ends are situated relative to the emitters in such a way that light generated by the emitters is injected into the first ends of the optical fibers. The optical fibers are situated in abutment along their lateral surface areas, at least in the region of the first ends of the optical fibers. The method is characterized by the following steps: arranging a plurality of optical fibers which form a fiber section in a subregion, the fiber section being situated between two opposite pressing surfaces; heating the fiber section; and exerting a force on the heated optical fibers with the aid of the pressing surfaces. The force and the heating initially result in deformation of the heated optical fiber. The exerted force and/or a temperature of the optical fibers is/are selected in such a way that the deformation ceases when the optical fibers for the first time fill, at least largely, a region between the pressing surfaces. | 2012-03-22 |
20120068370 | Method for Producing Wafer Lens, and Method and Apparatus for Producing Wafer Lens Laminate - Disclosed is a method for producing a wafer lens, wherein misalignment between a glass substrate and a molding mold is suppressed from occurring. The method for producing a wafer lens comprises: a step wherein, in a first reduced pressure atmosphere, an energy-curable resin is arranged between a glass substrate ( | 2012-03-22 |
20120068371 | PROCESSES FOR IMPROVED OPTICAL FILMS - A method of forming an optical film results in a film having a useful central 60% portion with a caliper variation of about 5% or less of an average thickness of the film. The method includes selecting a draw ratio λ in a first in-plane stretch direction, setting an effective draw gap defined by a length L and a width W, and stretching a polymer film at the draw ratio and effective draw gap. The effective draw gap is set such that the stretching step fits into one of two regimes, the first regime referred to as a uniaxial regime and characterized by a β equal to or less than about 1.0; and the second regime referred to as a planar extension regime and characterized by a β equal to or greater than about 10.0. The disclosure also describes an optical film formed by the method. | 2012-03-22 |
20120068372 | NANOIMPRINT TEMPLATE AND PATTERN TRANSCRIPTION APPARATUS - According to one embodiment, a nanoimprint template using a pattern transcription to a substrate by a nanoimprint technique, the template includes a transcription pattern and an alignment mark on a main surface of a main body, wherein the alignment mark comprises a polarizer. | 2012-03-22 |
20120068373 | IN AN INJECTION MOLDING MACHINE, A METHOD OF CONTROLLING AN UPSTREAM MELT PREPARATION DEVICE | 2012-03-22 |
20120068374 | METHOD FOR MAKING A REINFORCEMENT PROVIDED WITH AT LEAST ONE ADHESIVE SURFACE CAPABLE OF BEING REPOSITIONED AND RESULTING REINFORCEMENT - A method for making a fiber reinforcement designed in particular to be incorporated in at least one matrix, characterized in that it includes performing the following steps: preparing a fiber-based material, and depositing on at least one of surfaces of the resulting material an adhesive capable of being reposition. Also, the reinforcement resulting from this method. | 2012-03-22 |
20120068375 | PLASTIC OBJECT FOR USE IN PERSONAL HYGIENE - A unitary two component article for personal hygiene, such as a toothbrush, wherein the same is formed by injection molding of two differing plastic materials. The plastics do not adhesively or chemically bond to each other. The two differing plastic parts of the toothbrush are mechanically connected, such as by interfitting portions of the two plastic components or by shrinking one plastic component about the other. | 2012-03-22 |
20120068376 | RAIL SUPPORT DEVICE AND SHEET STRETCHING METHOD - A rail support device installed in a clip chain type sheet stretching apparatus configured to stretch a sheet includes a first rail support member, a second rail support member, and an arc shaped rail support member. The arc shaped rail support member is engaged with each of the connecting portions of the first and second rail support members to form a higher pair. The rail support device is symmetrical with respect to an intersection angle bisecting plane which is a plane developing in a vertical direction and including an intersection angle bisector. | 2012-03-22 |
20120068377 | System and Method for Making Shaped Bands - A system and method for making shaped bands includes stretching a band into a shape, heating the band to a softening point of a material of the band, and cooling the band to room temperature, such that the band sets into the shape. Other embodiments include an apparatus comprising a pegboard with a plurality of holes, and a plurality of pegs configured to be inserted into corresponding holes from the plurality of holes, wherein the corresponding holes are located at vertices of a shape, and stretching the band around the pegs into the shape. Another embodiment includes attaching the band to a metal wire and bending the metal wire into the shape. | 2012-03-22 |
20120068378 | METHOD FOR BUILDING THREE-DIMENSIONAL MODELS WITH EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEMS - A method for building a three-dimensional model with an extrusion-based additive manufacturing system having an extrusion head, the method comprising depositing a consumable material from a liquefier assembly at an extrusion rate to substantially normalize a meniscus height within the liquefier assembly. | 2012-03-22 |
20120068379 | REUSABLE EAR FITTING PIECE FOR CREATING AN EAR IMPRESSION - An ear fitting piece for creating an ear impression and a method for creating an ear impression. In order to allow the creation of an ear impression at low cost, the ear fitting piece for creating an ear impression has a liquid, which has a first state in which it can be shaped and a second state in which it is solidified, a soft rubber sleeve, which encloses the liquid, and an activating device, which is designed to cause a change of state from the first state to the second state of the liquid. A further change of state from the second state to the first state of the liquid can be caused by heating. | 2012-03-22 |
20120068380 | CONTINUOUS FORMING SYSTEM UTILIZING UP TO SIX ENDLESS BELTS - A system for providing shape and/or surface features to a moldable material includes, in an exemplary embodiment, at least two first opposed flat endless belts spaced apart a first distance, with each having an inner surface and an outer surface. The system also includes at least two second opposed flat endless belts disposed substantially orthogonal to the first two opposed endless belts and spaced apart a second distance. A mold cavity is defined at least in part by the inner surfaces of the at least two opposed flat endless belts. The system further includes a drive mechanism for imparting motion to at least two of the opposed flat endless belts. | 2012-03-22 |
20120068381 | MOBILE SELF-CONTAINED STONE-MAKING AND CONCRETE-PROCESSING FACTORY - A novel mobile self-contained stone-making and cement-forming factory comprises, in general, four main components, namely (1) a power plant, (2) a receptacle for receiving local aggregate, (3) a batching module for mixing aggregate with cementitious material and water and for feeding the batch to a compression station and (4) the compression station for compressing the batch into a stone, block, paver, tile, brick or other stone-type product of variable size, colour, and surface finish. These main four components are supported together on a trailer or other portable frame that can be towed or otherwise transported to the construction site. Optional compression plates can be provided to produce customized double-faced stone products. The mobile factory-enables efficient, inexpensive, onsite manufacturing of a broad range of different stone products. | 2012-03-22 |
20120068382 | SYSTEMS AND METHODS FOR CONTROLLING PERMEABILITY IN VACUUM INFUSION PROCESSES - Systems and methods for controlling permeability in vacuum infusion processes are disclosed. A system includes a tool surface, a flexible film, a preform, a magnetic field source, and a magnetic element. The flexible film has a periphery sealingly coupled to the tool surface to define a volume. The preform is disposed within the volume. The magnetic field source is configured to generate a magnetic field. The magnetic element is positioned to receive the magnetic field generate by the magnetic field source. The magnetic element is configured to move the flexible film away from the upper side of the tool surface under application of the magnetic field. A method includes generating a magnetic field with the magnetic field source and receiving the magnetic field with the magnetic element to move the flexible film away from the upper side of the tool surface, thereby increasing permeability of the preform. | 2012-03-22 |
20120068383 | MATERIAL FABRICATION USING ACOUSTIC RADIATION FORCES - Apparatus and methods for using acoustic radiation forces to order particles suspended in a host liquid are described. The particles may range in size from nanometers to millimeters, and may have any shape. The suspension is placed in an acoustic resonator cavity, and acoustical energy is supplied thereto using acoustic transducers. The resulting pattern may be fixed by using a solidifiable host liquid, forming thereby a solid material. Patterns may be quickly generated; typical times ranging from a few seconds to a few minutes. In a one-dimensional arrangement, parallel layers of particles are formed. With two and three dimensional transducer arrangements, more complex particle configurations are possible since different standing-wave patterns may be generated in the resonator. Fabrication of periodic structures, such as metamaterials, having periods tunable by varying the frequency of the acoustic waves, on surfaces or in bulk volume using acoustic radiation forces, provides great flexibility in the creation of new materials. Periodicities may range from millimeters to sub-micron distances, covering a large portion of the range for optical and acoustical metamaterials. | 2012-03-22 |
20120068384 | NANOFIBROUS MATERIALS AS DRUG, PROTEIN, OR GENETIC RELEASE VEHICLES - The present invention is a bioactive, nanofibrous material construct which is manufactured using a unique electrospinning perfusion methodology. One embodiment provides a nanofibrous biocomposite material formed as a discrete textile fabric from a prepared liquid admixture of (i) a non-biodegradable durable synthetic polymer; (ii) a biologically active agent; and (iii) a liquid organic carrier. These biologically-active agents are chemical compounds which retain their recognized biological activity both before and after becoming non-permanently bound to the formed textile material; and will become subsequently released in-situ as discrete freely mobile agents from the fabric upon uptake of water from the ambient environment. | 2012-03-22 |
20120068385 | Metallocene-Produced Polyethylene For Glossy Plastic Containers - A high gloss plastic container prepared from a metallocene-produced polyethylene having a density of from 0.930 to 0.966 g/cm | 2012-03-22 |
20120068386 | METHOD FOR MAKING A RESERVOIR - The invention described herein relates to a method by which a reservoir having desired end connection profiles may be made using shape memory characteristics of crosslinking to compressively seal the connection profiles into the reservoir. | 2012-03-22 |
20120068387 | MOLDING METHOD USING SHAPE MEMORY POLYMER - A method is provided for molding a composite part defined by using a preform comprising a shape memory polymer (SMP) binder. A bound preform comprising the SMP binder in a permanent shape and defined by a simplified geometry provided to a mold. The bound preform is heated above a transformation temperature of the SMP binder and deformed into a shaped preform defined by the temporary shape of the SMP binder. In a molding sequence, the shaped preform is constrained in its temporary shape by the mold while resin is introduced to the mold and cured to produce a final part. The shape of the cured part defines the temporary shape of the SMP binder. The bound preform may be generally configured as a mat or be defined by a substantially flat surface such that the preform may be used as a preform to mold a variety of differing part configurations. | 2012-03-22 |
20120068388 | METHOD OF MANUFACTURING HOLLOW BODY - A hollow body formed of a thermoplastic resin and having uniform inner diameter and thickness and an excellent inner surface smoothness, and, in particular, a pipe-shaped hollow body having a bent portion is manufactured by injection molding. | 2012-03-22 |
20120068389 | Methods of fabricating polycrystalline ceramic for thermoelectric devices - Provided is a method of fabricating polycrystalline ceramic for thermoelectric devices. The method includes preparing calcined ceramic powders, forming a ceramic sheet by uni-axially pressing the calcined ceramic powders, stacking a plurality of the ceramic sheets in a uni-axial direction, and cofiring the stacked the plurality of the ceramic sheets. | 2012-03-22 |
20120068390 | Ceramic Spark Plug Insulator And Method Of Making - A method of making a spark plug insulator includes forming green ceramic core tube and core nose performs. The core nose perform is nested within the firing end of the core tube perform and they are fired to sinter them and to form a direct bond between them in a region of overlap. | 2012-03-22 |
20120068391 | COOLING APPARATUS, COOLING METHOD, MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF HOT-ROLLED STEEL SHEET - The present invention provides a cooling apparatus of a hot-rolled steel sheet capable of manufacturing a hot-rolled steel sheet having ultra fine crystal grains. | 2012-03-22 |
20120068392 | DEVICE FOR DISTRIBUTING CHARGE MATERIAL INTO A SHAFT FURNACE - A device for distributing charge material into a shaft furnace includes a main housing, a distribution chute, a suspension rotor and an adjustment rotor, which are rotatable about a substantially vertical axis, the chute is suspended to the suspension rotor to rotate therewith for circumferential distribution of charge material and adjustable in orientation through the adjustment rotor for radial distribution of charge material, a differential gear interconnects the suspension rotor and the adjustment rotor and is configured to transmit to the adjustment rotor the same speed of rotation that is imparted to the suspension rotor by a main rotation drive unless an adjustment drive imparts differential rotation to the adjustment rotor, the device further including:
| 2012-03-22 |
20120068393 | METHOD FOR MACHINING A WORKPIECE AS WELL AS SUCH MACHINING DEVICE - For machining a workpiece the workpiece is fixed in a first gripping device of a machining device in order to make at least one element. Next the workpiece is transferred to the second gripping device of the machining device, where the workpiece is fixed by means of the element in the second gripping device of the machining device, while the first gripping device remains connected to the machining device. The element comprises a dovetail-shaped mounting element. | 2012-03-22 |
20120068394 | Multiple Vise System - A multiple vise system comprising at least two vise heads, each vise head comprising two jaws and a tightening screw and also comprising a supporting structure. The supporting structure is configured to support each vise head and allows the position of the vise heads to be adjusted according to at least two degrees of freedom with respect to each other. Position adjustment is achieved by means of track and slots mechanisms, swivels and telescoping poles. A number of secondary clamps are included to hold specially shaped objects such as printed circuit boards and to hold objects too large to be held by a vise head. | 2012-03-22 |
20120068395 | ASSEMBLY FACILITATION APPARATUS AND METHOD - An assembly apparatus includes a frame and a contact structure connected to and supported by the frame. The contact structure is configured to receive and secure a workpiece having a plurality of working locations. The contact structure and the workpiece are capable of movement relative to the frame such that each working location of the workpiece has an assembly position proximate to an assembly substation and another position that is distal from the assembly substation, and such that the working location at its assembly position is substantially equidistant from assembly substation relative to the other working locations in their respective assembly positions. | 2012-03-22 |
20120068396 | No-mar workpiece support - A workpiece support that presents a generally planar workpiece contacting surface having high friction, gripping pad(s) that will not mar a workpiece surface, and thus provides a versatile accessory for home hobbyists and artisans alike that protects the supported surface of the workpiece. By providing a non-marring workpiece support, such as that illustrated in FIGS. | 2012-03-22 |
20120068397 | METHOD AND DEVICE FOR INSERTING SUPPLEMENTS INTO MULTIPAGE PRINTED PRODUCTS - A method for inserting a supplement into a multipage printed product having a back and composed of signatures and/or individual sheets, and being transported with the back oriented parallel to a conveying direction. The multipage printed product is supplied with a signature or an individual sheet projecting from the multipage printed product to define a predetermined separating location between the projecting signature or individual sheet and an adjacent signature or sheet. The multipage printed product is opened at the predetermined separating location and then the opening is expanded. The supplement is thereafter inserted into the expanded separating location. | 2012-03-22 |
20120068398 | SHEET HANDLING APPARATUS - According to one embodiment, a sheet handling apparatus includes a conveying path to convey a sheet, a processing portion to perform a predetermined process on the sheet while conveying the sheet on the conveying path, a separable roller pair that is arranged at a certain distance from the processing portion on an upstream side or a downstream side in conveying direction, the separable roller pair being adapted to hand over the sheet between the conveying path and the processing portion by holding the sheet with a nip and rotating, a separating mechanism to separate the separable roller pair, and a controller that controls the separating mechanism such that the separable roller pair is separated before or after processing is started with the processing portion on a sheet that is conveyed on the conveying path. | 2012-03-22 |
20120068399 | PAPER SHEETS INSPECTION APPARATUS - According to one embodiment, a paper sheets inspection apparatus includes a transfer mechanism configured to transfer paper sheets through an inspection position, a guide member including a guide surface opposed to the paper sheet at the inspection position, a standard plate on the guide member, including a reflection surface exposed on the guide surface at the inspection position, an air supply device configured to spout air flowing from a lateral position of the standard plate along the reflection surface, and form an air curtain between the standard plate and the paper sheet, a light source configured to radiate inspection light toward the reflection surface, and a photoreceptor configured to receive the inspection light reflected from the reflection surface of the standard plate and the inspection light reflected from a surface of the paper sheet at the inspection position. | 2012-03-22 |
20120068400 | TRANSPORT DEVICE AND RECORDING APPARATUS - A transport device includes a stopper which comes into contact with a target ahead of a guide surface of a guide member and regulates movement of the target and a slider which slides by contact of the target with the stopper. The stopper has a first regulation surface with which the target comes into contact ahead of the guide surface of the guide member, and a second regulation surface which regulates the movement of the target which moves along the first regulation surface. A damper mechanism is connected to the slider and has a damper force that weakens kinetic energy by the target that the stopper receives. | 2012-03-22 |
20120068401 | HOLDING DEVICE OF RECORDING MEDIUM, IMAGE FORMING APPARATUS, AND CONVEYING METHOD OF RECORDING MEDIUM - According to one embodiment, the image forming apparatus includes, an endless device having a plurality of suction holes, and a negative pressure chamber which communicates with the suction holes, a rotation mechanism which rotates the endless device, a suction mechanism which discharges air in the negative pressure chamber, an opening and closing mechanism which has a switching blade which opens and closes the suction holes, a driving mechanism which moves the switching blade to a first position and a second position, a recording head unit, a supply mechanism which supplies the recording medium to the endless device, and a controller. If the switching blade moves to the first position, the suction holes are shut. If the switching blade moves to the second position, the suction holes communicate with the negative pressure chamber. The controller drives the opening and closing mechanism according to the size of the recording medium. | 2012-03-22 |
20120068402 | Media Dam and Media Path for an Imaging Device - A media dam for a media path of an imaging device along which a media sheet traverses according to one example embodiment includes a plurality of inclined rib members. The rib members form a contact surface for engaging and deflecting the media sheet along the media path. The contact surface has a top edge that includes at least one sloped portion. | 2012-03-22 |
20120068403 | Image Forming Apparatus - A pair of conveyor rollers arranged in an image forming apparatus to convey a recording is configured to be shiftable relative to the body between a first position and a second position. A first holding member is configured to support one of the conveyor so that the supported conveyor roller is swingable around a pivot to allow the pair of conveyor rollers to be shifted between the first position and the second position. The first holding member including a sheet guide portion which provides a variable-position guideway extending from a position located upstream along the sheet conveyance path toward a peripheral surface of the supported conveyor roller, where the sheet guide portion moves to a position suitable to guide the recording sheet to be nipped by the pair of conveyor rollers at least when the pair of conveyor rollers is shifted to the first position. | 2012-03-22 |
20120068404 | TABLE GAME AND METHOD OF PLAY - A table game has a plurality of pucks for sliding across a table top that is divided into an elongated runner section and a scoring section. Both the runner section and the scoring section have multiple bumpers for affecting the path of the pucks, and the scoring section has multiple scoring indicators representing different scores. Each player has a predetermined number of throws and once a set score is reached, a winner is crowned. | 2012-03-22 |
20120068405 | Lawn game method using rolling disks - A lawn game uses a pair of markers toward which each player rolls a disk while standing proximate the other maker. Once all disks have been rolled, the disk closest to the marker determines which player scores points for that round. For the player scoring points, all of that player's disks that are within a certain distance from the rolled to marker score, with each disk laying flat, the number showing on the side of the disk equals the points gained for that disk, the sum of the numbers on each side of a disk remaining on its outer edge equals the points gained for that disk, and the number showing on the side of the disk laying against the rolled to marker multiplied by a multiplier equals the points gained for that disk. A rope removably attachable to the markers helps with measurements. | 2012-03-22 |
20120068406 | GAME BALLS BEARING MULTIPLE GAME INDICIA AND GAMES PLAYED THEREWITH - A game ball has two different game indicia associated therewith. One or more of such game balls may be part of a set of game balls, such as a set of balls used to play a bingo, keno or lottery game where the game indicia may comprise numbers used to play lottery or keno, or combinations of letters and numbers for play of a bingo game. Compared to game balls bearing a single game indicia, selection of a game ball bearing multiple game indicia presents a player with an increased or bonus matching opportunity. The game balls may be physical elements or be electronic representations, such as displayed images, thereof. | 2012-03-22 |
20120068407 | BOARD GAME FOR ENHANCING MENTAL SKILLS THROUGH FORMATION OF SHAPES AND PATTERNS - A board game for two to four players comprising a playing board having twenty-five recessed square spaces arranged in a grid of five rows and five columns. One-hundred triangular chips in four colors consisting of twenty-five chips per color intended to removably fill said square spaces wherein four triangular chips capable of being snugly fitted within one square space. The objective is to fill the spaces with chips forming different forms or shapes as well as patterns corresponding to points or score wherein the first player that reached at least twenty-one points and calls “DEAL” wins. Players should therefore prevent each opponent from reaching the winning point. Any player, who calls “DEAL” whose combination of forms is below twenty-one points, commits “FALSE ALARM” and shall be penalized. In an event when no player has earned twenty-one points, the winner will be the player with the highest point. | 2012-03-22 |
20120068408 | MULTI-PLAYER GAME - Methods and systems are provided herein for playing a multi-player game. Players select words related to a seed word and place or write the selected words in spaces on a game board. In some embodiments, the related words are synonyms, while in other embodiments they are one of antonyms, homophones, or homonyms. Each of the words, when placed in the spaces on the game board, shares at least one letter with a word previously placed on the game board. A score is determined for each player in the multi-player game by summing a point value assigned to each letter in each word placed by the player on the game board. | 2012-03-22 |
20120068409 | Method For Playing A Card Game - A method of playing a card game. The first step is to provide a deck of cards, wherein each playing card has a specific numeric value. A player places an Ante. The dealer then deals an initial hand of two cards face down to the dealer and to the player. The player views the initial hand of two cards in order to decide whether to stay or fold. The player forfeits his ante if the player decides to fold. Next, the player places a bet if the player decides to stay. The player then reveals his cards. The next step is to determine if the point value of the player's initial two-card hand is fourteen or fifteen. If the player's initial two-card hand has a point value of fourteen or fifteen, then the player is provided with an option to either (i) double down on the player's bet and take only one additional card, or (ii) not double down on the player's bet and take two additional cards. Thereafter, the dealer deals either the single additional card or the two additional cards face up to the player, depending upon the player's decision. If the player's initial two-card hand does not have a point value of fourteen or fifteen, then the player is required to take two additional cards. These additional two cards are dealt face up. The player's hand may never contain more than four cards. The dealer continues to deal cards to himself until the point value of the dealer's hand is greater than or equal to twenty one. The player loses if the point value of his hand exceeds twenty-five. The player wins if the player's hand has a point value of twenty-five and the dealer's hand has a point value that does not equal twenty-five, or if the point value of the player's hand is less than twenty-five and the point value of the dealer's hand is greater than twenty-five. There are other scenarios in which the player can win and there are scenarios in which the dealer can win. | 2012-03-22 |