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11th week of 2018 patent applcation highlights part 57
Patent application number
Title
Published
20180076135
Inductor System and Method
2018-03-15
20180076136
TRIMMING DEVICE
2018-03-15
20180076137
UTILIZATION OF BACKSIDE SILICIDATION TO FORM DUAL SIDE CONTACTED CAPACITOR
2018-03-15
20180076138
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCING STRESS
2018-03-15
20180076139
CONTACT FOR SEMICONDUCTOR DEVICE
2018-03-15
20180076140
SEMICONDUCTOR DEVICES HAVING INTERCONNECTION STRUCTURE
2018-03-15
20180076141
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2018-03-15
20180076142
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
2018-03-15
20180076143
METAL ALLOY CAPPING LAYERS FOR METALLIC INTERCONNECT STRUCTURES
2018-03-15
20180076144
Contact Structure and Method of Forming
2018-03-15
20180076145
SELF-ALIGNED TRANSISTORS FOR DUAL-SIDE PROCESSING
2018-03-15
20180076146
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2018-03-15
20180076147
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE MODULE
2018-03-15
20180076148
THROUGH-MOLD FEATURES FOR SHIELDING APPLICATIONS
2018-03-15
20180076149
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2018-03-15
20180076150
SEMICONDUCTOR CHIP, SEMICONDUCTOR APPARATUS, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER DICING METHOD
2018-03-15
20180076151
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
2018-03-15
20180076152
High-voltage Light Emitting Diode and Fabrication Method Thereof
2018-03-15
20180076153
POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE
2018-03-15
20180076154
SINGLE LEAD-FRAME STACKED DIE GALVANIC ISOLATOR
2018-03-15
20180076155
Extremely High Frequency Electronic Component
2018-03-15
20180076156
FAN-OUT SEMICONDUCTOR PACKAGE
2018-03-15
20180076157
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-03-15
20180076158
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-03-15
20180076159
Pad Design for Reliability Enhancement in Packages
2018-03-15
20180076160
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER
2018-03-15
20180076161
NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
2018-03-15
20180076162
CHIP MOUNTING STRUCTURE
2018-03-15
20180076163
METHOD OF FORMING SOLDER BUMPS
2018-03-15
20180076164
METHOD OF FORMING SOLDER BUMPS
2018-03-15
20180076165
METHOD OF FORMING SOLDER BUMPS
2018-03-15
20180076166
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
2018-03-15
20180076167
METALLIC RIBBON FOR POWER MODULE PACKAGING
2018-03-15
20180076168
Fluidic Self Assembly of Contact Materials
2018-03-15
20180076169
CHIP BONDING PROCESS
2018-03-15
20180076170
ADVANCED CHIP TO WAFER STACKING
2018-03-15
20180076171
MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE
2018-03-15
20180076172
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2018-03-15
20180076173
SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE CHIPS MOUNTED OVER WIRING SUBSTRATE
2018-03-15
20180076174
SEMICONDUCTOR PACKAGE WITH REDUCED PARASITIC COUPLING EFFECTS AND PROCESS FOR MAKING THE SAME
2018-03-15
20180076175
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
2018-03-15
20180076176
SIGNAL ISOLATOR HAVING BIDIRECTIONAL COMMUNICATION BETWEEN DIE
2018-03-15
20180076177
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
2018-03-15
20180076178
FAN-OUT SEMICONDUCTOR PACKAGE
2018-03-15
20180076179
STACKED TYPE CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-03-15
20180076180
SEMICONDUCTOR DEVICE HAVING STACKED CHIPS
2018-03-15
20180076181
LIGHT SOURCE DEVICE AND LIGHT EMITTING APPARATUS
2018-03-15
20180076182
DISPLAY DEVICES
2018-03-15
20180076183
LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING DEVICE PACKAGE MODULE
2018-03-15
20180076184
Semiconductor Packages having Dummy Connectors and Methods of Forming Same
2018-03-15
20180076185
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
2018-03-15
20180076186
SEMICONDUCTOR MEMORY SYSTEM
2018-03-15
20180076187
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
2018-03-15
20180076188
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
2018-03-15
20180076189
MINIMUM TRACK STANDARD CELL CIRCUITS FOR REDUCED AREA
2018-03-15
20180076190
SEMICONDUCTOR DEVICE HAVING ENGINEERING CHANGE ORDER (ECO) CELLS AND METHOD OF USING
2018-03-15
20180076191
SEMICONDUCTOR DEVICE
2018-03-15
20180076192
ELECTROSTATIC PROTECTION DIODE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING ELECTROSTATIC PROTECTION STRUCTURE
2018-03-15
20180076193
SEMICONDUCTOR DEVICE
2018-03-15
20180076194
TRANSISTOR FOR INCREASING A RANGE OF A SWING OF A SIGNAL
2018-03-15
20180076195
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
2018-03-15
20180076196
DIODE
2018-03-15
20180076197
SEMICONDUCTOR DEVICES EMPLOYING FIELD EFFECT TRANSISTORS (FETs) WITH MULTIPLE CHANNEL STRUCTURES WITHOUT SHALLOW TRENCH ISOLATION (STI) VOID-INDUCED ELECTRICAL SHORTS
2018-03-15
20180076198
Techniques Providing Metal Gate Devices with Multiple Barrier Layers
2018-03-15
20180076199
COMPLIMENTARY METAL-OXIDE-SEMICONDUCTOR CIRCUIT HAVING TRANSISTORS WITH DIFFERENT THRESHOLD VOLTAGES AND METHOD OF MANUFACTURING THE SAME
2018-03-15
20180076200
FinFET CMOS WITH SILICON FIN N-CHANNEL FET AND SILICON GERMANIUM FIN P-CHANNEL FET
2018-03-15
20180076201
SEMICONDUCTOR DEVICE
2018-03-15
20180076202
FinFET CMOS WITH SILICON FIN N-CHANNEL FET AND SILICON GERMANIUM FIN P-CHANNEL FET
2018-03-15
20180076203
Structure and Method for Semiconductor Device
2018-03-15
20180076204
MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
2018-03-15
20180076205
SEMICONDUCTOR INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
2018-03-15
20180076206
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
2018-03-15
20180076207
MASK ROM AND PROCESS FOR FABRICATING THE SAME
2018-03-15
20180076208
SEMICONDUCTOR DEVICE
2018-03-15
20180076209
Integrated Assemblies and Methods of Forming Integrated Assemblies
2018-03-15
20180076210
SEMICONDUCTOR MEMORY DEVICE
2018-03-15
20180076211
SEMICONDUCTOR MEMORY DEVICE
2018-03-15
20180076212
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE
2018-03-15
20180076213
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
2018-03-15
20180076214
SEMICONDUCTOR DEVICE INCLUDING STACKED STRUCTURE
2018-03-15
20180076215
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
2018-03-15
20180076216
SEMICONDUCTOR MEMORY DEVICE
2018-03-15
20180076217
THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE
2018-03-15
20180076218
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2018-03-15
20180076219
METHOD AND DEVICE FOR SYNTHESIZING A CIRCUIT LAYOUT
2018-03-15
20180076220
CONDUCTIVE CONTACTS IN SEMICONDUCTOR ON INSULATOR SUBSTRATE
2018-03-15
20180076221
DISPLAY DEVICE
2018-03-15
20180076222
CAVITY FORMATION USING SACRIFICIAL MATERIAL
2018-03-15
20180076223
DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS
2018-03-15
20180076224
PIXEL STRUCTURE AND RELATED FABRICATION METHOD
2018-03-15
20180076225
Sub-Fin Removal for SOI Like Isolation with Uniform Active Fin Height
2018-03-15
20180076226
ASYMMETRIC BAND GAP JUNCTIONS IN NARROW BAND GAP MOSFET
2018-03-15
20180076227
EMBEDDED SECURITY CIRCUIT FORMED BY DIRECTED SELF-ASSEMBLY
2018-03-15
20180076228
ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY PANEL AND DISPLAY APPARATUS INCLUDING THE ARRAY SUBSTRATE
2018-03-15
20180076229
Flexible Display Device with Side Crack Protection Structure and Manufacturing Method for the Same
2018-03-15
20180076230
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
2018-03-15
20180076231
DISPLAY DEVICE AND ELECTRONIC DEVICE
2018-03-15
20180076232
SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
2018-03-15
20180076233
Thin Film Transistor Substrate and Display Device Including the Same
2018-03-15
20180076234
DISPLAY DEVICE
2018-03-15