Patents - stay tuned to the technology

Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


11th week of 2012 patent applcation highlights part 29
Patent application numberTitlePublished
20120063053ANTI-STATIC AND LIGHTNING COMPATIBLE TRANSPORT ELEMENT - Described are transport elements for dissipating electrostatic charge including at least two outer structural layers coupled in an overlapping arrangement. Some examples may include a transport element having an inner structural layer coupled to an inner surface of the at least two outer structural layers. Other examples may include an outer resin layer coupled to the outer surface of the at least two outer structural layers, wherein the outer resin layer comprises materials that display a distinctive appearance when viewed under an ultraviolet light. An electrical resistance per length of the outer structural layers, the inner structural layer, and/or the outer resin layer is about 102012-03-15
20120063054ELECTRICAL ARRANGEMENT OF HYBRID IGNITION DEVICE - A corona ignition system 2012-03-15
20120063055Direct-current current transformer - The present invention provides a direct-current current transformer, or DCCT, yielding bandwidth from DC to several MHz. The DCCT according to this invention is a simple, open-loop, device in which flux densities occur at very low levels, avoiding difficulties occasioned by core saturation.2012-03-15
20120063056Dielectric Ceramic Composition and Ceramic Electronic Component - A dielectric ceramic composition includes a compound having perovskite type crystal structure shown by a general formula ABO2012-03-15
20120063057Methods and apparatus related to a purge valve for a capacitor - In some embodiments, an apparatus includes a housing and a purge valve. The housing defines a cavity and a lumen extending from a volume of the cavity to a volume outside the cavity. The purge valve is disposed within the lumen and includes an occlusion member. A portion of the occlusion member has a width substantially equal to a width of an end portion of the lumen such that the portion of the occlusion member is disposed within the end portion of the lumen when the purge valve is in a first configuration. The portion of the occlusion member being disposed outside the end portion of the lumen when the purge valve is in a second configuration.2012-03-15
20120063058COMPOSITE ELECTRODE ACTIVE MATERIAL HAVING M1-xRuxO3 (M=Sr, Ba, Mg), SUPERCAPACITOR USING THE SAME AND FABRICATION METHOD THEREOF - Disclosed are a composite electrode active material and a supercapacitor using the same, and more particularly, an electrode active material having M2012-03-15
20120063059HYBRID SUPERCAPACITOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a hybrid supercapacitor manufactured according to a method of manufacturing a hybrid supercapacitor including: forming a lithium thin film on one surface of a separator; facing the lithium thin film and an active material layer of an anode each other; forming an electrode cell by alternately disposing the anode and the cathode, having the separator therebetween; and pre-doping the anode with lithium ions from the lithium thin film by receiving the electrode cell and an electrode solution in a housing.2012-03-15
20120063060ELECTRIC DOUBLE LAYER CAPACITOR - A collector for an electric double layer capacitor including a conductive sheet, and a film adhered on surface of the conductive sheet and including carbon fine particle and polysaccharide and/or cross-linked polysaccharide. An electrode for an electric double layer capacitor including a collector having a conductive sheet and a film adhered on surface of the conductive sheet, and a film including activated carbon and adhered on surface of the film of the collector. The film of the collector includes carbon fine particle and polysaccharide and/or cross-linked polysaccharide. An electric double layer capacitor including an electrode, a separator, and an electrolyte. The electrode includes a collector having a conductive sheet and a film adhered on surface of the conductive sheet, and a film including activated carbon and adhered on surface of the film of the collector. The film of the collector includes carbon fine particle and polysaccharide and/or cross-linked polysaccharide.2012-03-15
20120063061Electrolyte solution composition and energy storage device including the same - Disclosed herein are an electrolyte solution composition and an energy storage device including the same. The electrolyte solution composition contains: a lithium salt including lithium ions; and a solvent made of a material selected from a group consisting of at least one cyclic carbonate compound and propionate compound. The electrolyte solution composition may balancedly maintain characteristics at a room temperature and a low temperature and be used for pre-doping lithium ions, thereby making it possible to improve pre-doping efficiency.2012-03-15
20120063062Electrolyte solution composition and energy storage device with the same - Disclosed herein are an electrolyte solution composition and an energy storage device including the same. The electrolyte solution composition contains: a lithium salt including lithium ions; and a solvent made of a material selected from a group consisting of at least one cyclic carbonate compound. The electrolyte solution composition may balancedly maintain characteristics at a room temperature and a high temperature and be used for pre-doping lithium ions, thereby making it possible to improve pre-doping efficiency.2012-03-15
20120063063PROCESS FOR SOLID ELECTROLYTIC CAPACITORS USING POLYMER SLURRIES - A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; apply a thin polymer layer onto the dielectric, and2012-03-15
20120063064POWER DISTRIBUTION SYSTEM, AND ELECTRICAL BUS ASSEMBLY AND ELECTRICAL CONDUCTOR MECHANISM THEREFOR - An electrical conductor mechanism is provided for an electrical bus assembly of a power distribution system, such as a residential load center, which includes a number of electrical switching apparatus, such as circuit breakers. The electric conductor mechanism includes at least one planar member having first and second opposing sides. The first side is attached to a corresponding stab of the electrical bus assembly. The second side is electrically connected to a corresponding one of the circuit breakers, thereby electrically connecting it to the stab of the electrical bus assembly. An electrical bus assembly and a power distribution system employing the aforementioned electrical conductor mechanism are also disclosed.2012-03-15
20120063065Collar Style cover and housing assembly for field device - A field device assembly includes a housing body, a first circuitry subassembly mounted to the housing body and positioned at least partially within the housing body, a first cover chassis having a shoulder, mating flame path restricting structures positioned on the first cover chassis and the housing body, a first threaded collar configured to fit about the first cover chassis and to permit rotation relative to the first cover chassis, and a second circuitry subassembly secured to the first cover chassis. The first threaded collar is threadably engaged with the housing body, and includes an engagement structure engaged with the shoulder of the first cover chassis to secure the first cover chassis to the housing body. The second circuitry subassembly includes an electrical connector configured for linear insertion engagement with a mating electrical connector within the housing body to electrically connect the first and second circuitry subassemblies.2012-03-15
20120063066ERGONOMIC ACCESSORY FOR USE WITH A PORTABLE ELECTRONIC DEVICE - An ergonomic band for attaching to a rear surface of a portable electronic device, or a case configured for attachment with such a device. The ergonomic band may include one or more slits for receiving at least one finger of a user such that the device becomes ergonomically attached to the hand or wrist of a user. Two ergonomic bands may be provided. Each ergonomic band enables relaxation of anatomical features during prolonged use of portable electronic devices. The ergonomic band, or bands, can be attached to a device or device case using an adhesive or mechanical fit, or alternatively the band may conform through a slot pair. In certain embodiments, the ergonomic band can be detached and re-engaged as desired by a user.2012-03-15
20120063067PANEL FIXING MECHANISM AND DISPLAYING DEVICE THEREOF - A panel fixing mechanism includes a supporting component for supporting a side of a panel, a positioning structure passing through the supporting component for engaging inside a hole on the panel so as to guide a connector to insert into a socket of the panel, and a hook structure for supporting another side of the panel and wedging into a slot on the panel in a movable manner.2012-03-15
20120063068PORTABLE ELECTRONIC DEVICE - A portable electronic device includes a main body, at least one first rotary arm rotatably connected to the main body, and at least one second rotary arm rotatably connected to the main body. At least one connection port is located on at least one of the first rotary arm and the second rotary arm. When the at least one first rotary arm and the at least one second rotary arm are flush with the main body, the at least one connection port is hidden. By rotating the at least one first rotary arm or the at least one second rotary arm until the at least one first rotary arm or the at least one second rotary arm is not flush with the main body, the at least one connection port is exposed.2012-03-15
20120063069PLASMA DISPLAY APPARATUS - A plasma display apparatus is provided, which includes a plasma display panel, a chassis base which supports the plasma display panel, a driving board which is electrically connected to the plasma display panel and arranged on the chassis base, and which supplies a driving signal to the plasma display panel, and a back cover which covers the plasma display panel, wherein the back cover is connected to a ground area of the driving board.2012-03-15
20120063070VIBRATILE DISPLAY DEVICE - A vibratile display device includes a back plate, a panel assembly and at least one flexible pin. The back plate has a plurality of first fixing holes. The panel assembly is fixed to the back plate and includes a base and a display panel. The base has a carrier portion and a plurality of lugs extending outward from the carrier portion. Each lug has at least one second fixing hole corresponding to the first fixing holes. The display panel is disposed on the carrier portion of the base. An insert portion of the flexible pin is inserted into the first fixing hole of the back plate, and a neck portion of the flexible pin is inserted into the corresponding second fixing hole. A lean portion of the flexible pin is located between the base and the back plate. A top portion of the flexible pin protrudes a surface of the lugs.2012-03-15
20120063071Machinable metal/diamond metal matrix composite compound structure and method of making same - A high thermal conductivity metal/diamond metal matrix composite made from diamond particles having thin layers of beta-SiC chemically bonded to the surfaces thereof, is utilized in combination with a machinable metal/carbonaceous material metal matrix composite in an integral metal matrix composite compound structure, to provide a machinable high thermal conductivity heat-dissipating substrate for electronic devices.2012-03-15
20120063072TERMINAL DEVICE AND TILTING MECHANISM - A tilting hinge is disposed on a fixed housing and includes a rotating shaft, a bearing, and a movable piece. The rotating shaft includes a protrusion. Meanwhile, a lower half of the rotating shaft has a spiral curved surface. The bearing is provided with a spiral groove following the lower half of the rotating shaft, and the rotating shaft is biased toward the groove on the bearing by use of presser bar springs. Tilting of the movable housing causes the protrusion on the rotating shaft to slide on a surface of the groove on the bearing, and a rotation center of the rotating shaft to move upward.2012-03-15
20120063073ELECTRONIC DEVICE AND CAP - An electronic device has a cap protecting an opening disposed in a case. The cap includes a base portion covering the opening, a leg portion extended from a part of the base portion; an attachment portion having a large diameter surface that has a diameter larger than the diameter of the leg portion and includes a connecting region that connects with the leg portion at the end of the leg portion opposite to the base portion, and a protruding portion protruding from a region other than the connecting region of the large diameter surface of the attachment portion.2012-03-15
20120063074MOBILE TERMINAL DEVICE - A mobile terminal device includes a case that forms a storage space for storing a component and that includes an open section at a first surface, a display module that is stored in the open section of the case and that includes a display surface for allowing information to be displayed thereon adjacent to the first surface, a plate that is fixed to an inner surface of the case and that partitions the storage space into a space for storing the display module and a space for storing a component other than the display module, a panel that covers the open section of the case and that supports the display module such that the display module is sandwiched between the panel and the plate, and an adhesive that adheres the panel and a surrounding region of the open section of the case.2012-03-15
20120063075EXTERNAL COMPONENT AND PORTABLE ELECTRONIC DEVICE - An external component attachable to a portable electronic device includes a curved surface attachable to a convex surface of the portable electronic device and attaching portions formed at both ends of the curved surface and fixable to the portable electronic device. The curved surface curves such that the width between the attaching portions is narrower than the width between fixing portions of the portable electronic device to which the attaching portions are fixable.2012-03-15
20120063076GLASS COMPOSITION AND COVERING AND SEALING MEMBERS USING SAME - A glass composition according to the present invention comprises: transition metals; phosphorus; barium; and zinc, the transition metals including: vanadium; and tungsten and/or iron, the glass composition not containing substances included in the JIG level A and B lists, an softening point of the glass composition being from 430 to 530° C., an average linear expansion coefficient of the glass composition being from 6 to 9 ppm/° C. at temperatures from 30 to 250° C.2012-03-15
20120063077HANDHELD TERMINAL DEVICE AND ELECTRONIC EQUIPMENT - Provided is a handheld terminal device in which an excellent seal can be obtained without causing twisting, air bubbles, or gaps in double-sided tape. The handheld terminal device (2012-03-15
20120063078MOTOR CONTROL MODULE - A control module 2012-03-15
20120063079ELECTRONIC DEVICE - An electronic device includes a body having a rear wall, and an I/O port assembly rotatably connected to the body. A plurality of interface ports are arranged at the I/O port assembly. The I/O port assembly is rotatable around an axis from a first position to a second position. When the I/O port assembly rotates to the first position, the interface ports face the rear wall and are hidden, and when the I/O port assembly rotates to the second position, the interface ports are opposite to the rear wall and are exposed.2012-03-15
20120063080SERVER - A server includes a casing, a motherboard, a power supply unit and a pair of expansion modules. The motherboard is disposed in the casing, and the motherboard includes two slots disposed in the casing. The power supply unit is disposed in the casing and under the motherboard. The expansion modules are disposed in the casing, and each of the expansion modules includes a connecting card and a plurality of expansion cards. When the connecting card is electrically coupled to one of the slots of the motherboard, the expansion modules are disposed at two opposite sides of the motherboard correspondingly.2012-03-15
20120063081DOCKING STATION FOR A VIDEO MONITOR - A docking station for a video monitor including a base plate adapted to mount to a seat back, spaced-apart shafts rotatably mounted on the base plate including spaced apart hooks for engaging catches of the video monitor, a biasing member biasing the hooks toward a latching direction, alignment posts extending from the base plate for aligning the video monitor relative to the base plate, and an electrical connector mounted to the base plate for mating with an electrical connector of the video monitor to provide power and signals to the monitor.2012-03-15
20120063082DATA CENTER - A data center includes a housing and a number of server module assemblies received in the housing. Airflow interspaces are formed between neighboring server module assemblies, and between the two outmost server module assemblies and corresponding sidewalls of the housing. The airflow interspaces are alternately used for cold aisles and hot aisles. An inside of each server module is communicated with one of the hot aisles and one of the cold aisles at opposite sides of the server module. A number of cooling units are installed in the housing over the server module assemblies. A number of fans are installed in the housing to draw hot air from the hot aisles to flow through the corresponding cooling units to be cooled, and the cooled air flow into the corresponding cold aisles, thereby creating air differences in air pressure between the cold aisles and the hot aisles.2012-03-15
20120063083SERVER SYSTEM WITH HEAT DISSIPATING DEVICE - An exemplary server system includes a server cabinet, two rows of racks arranged in the server cabinet, a number of servers mounted in the racks and a heat dissipating device. The server cabinet includes two side plates parallel to each other. The servers of each row are evenly distributed between the side plates. A channel is defined between the two rows of racks. The heat dissipating device includes an air conditioner arranged over the racks for generating cooling air and an air guiding mechanism. The air conditioner defines a number of apertures facing the passage. The guiding mechanism includes a number of tubes received in the passage and respectively coupled to the apertures of the air conditioner. Each of the tubes defines a number of air outlets for exhausting the cooling air towards the servers.2012-03-15
20120063084CIRCUIT BOARD CHASSIS AND METHOD INCLUDING SIDEWALL APERTURE AND BACKPLANE INSERTION SLOTS FOR SIDE ASSEMBLED BACKPLANE - A circuit board chassis and a method for assembling a backplane and a circuit board into the circuit board chassis include an aperture within at least one sidewall of the circuit board chassis. The backplane is inserted and assembled into the circuit board chassis through the aperture (that may include a counter-opposed pair of backplane insertion and assembly slots) in a first direction, and a circuit board is inserted and assembled into the circuit board chassis and the backplane in a second direction perpendicular to the first direction. By inserting and assembling the backplane into the aperture and slots, rather than assembling the backplane as an external surface component of the circuit board chassis, the embodiments provide for ease of replacement of the backplane and circuit board under space constrained limitations. The resulting embodiments also provide enhanced rigidity and enhanced thermal dissipation within the circuit board chassis.2012-03-15
20120063085Jet Impingement Heat Exchanger Apparatuses and Power Electronics Modules - A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.2012-03-15
20120063086ELECTRONIC DEVICE - An electronic device includes a chassis, a blower, a first block, and a second block. The chassis includes a top surface and a bottom surface parallel to the top surface. The blower is received in the chassis. The blower includes an upper surface, a lower surface parallel to the upper surface, and an outlet defined between the upper surface and the lower surface. The first block is disposed between the upper surface and the top surface to seal a gap between the upper surface and the top surface. The second block is disposed between the lower surface and the bottom surface to seal a gap between the lower surface and the bottom surface.2012-03-15
20120063087CONTAINER DATA CENTER AND AIR INTAKE APPARATUS - A container data center includes a movable container, two server systems having a cold aisle and two hot aisles, two fan apparatuses, an exchanger, and an air intake apparatus. The air intake apparatus includes a number of air intake elements each defining an air channel. The fan apparatuses are operable to transfer hot airflow in the hot aisles into the heat exchanger, and then the heat exchanger transforms the hot airflow into cold airflow and transfers the cold airflow into the cold aisle through the air intake apparatus. The air intake elements are connected together and cover the cold aisle. The air intake elements of the air intake apparatus are arranged in a “V” shape along an orientation toward the airflow of the cold aisle.2012-03-15
20120063088HEAT DISSIPATING APPARATUS - A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion.2012-03-15
20120063089ELECTRONIC DEVICE - An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel.2012-03-15
20120063090COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An apparatus for cooling a stacked die package comprises a substrate, a first die above the substrate, a second die above the first die, and a housing containing the first and second dies. The housing seals the first and second dies from the environment. The apparatus further includes a cooling fluid in fluid communication with the first die and the second die to transfer the heat from the dies to the housing.2012-03-15
20120063091Cooling Apparatuses and Power Electronics Modules - A cooling apparatus for a power electronics system includes a jet plate, a target plate, a plurality of fluid collection passageways, and a fluid outlet. The jet plate includes an array of impingement jets having a jet body and an impingement jet channel. The target plate includes an array of microchannel cells having a plurality of radially-extending wavy-fin microchannels. The coolant fluid is directed toward an impingement location through the array of impingement jets and travels through the wavy-fin microchannels. The plurality of fluid collection passageways are arranged in a grid pattern such that the coolant fluid exits the wavy-fin microchannels and flows into the plurality of fluid passageways. The coolant fluid exits the cooling apparatus through the fluid outlet. The cooling apparatus may be incorporated into a power electronics module having a power electronics device to cool the power electronics device.2012-03-15
20120063092HEAT-DISSIPATING DEVICE AND ELECTRIC APPARATUS HAVING THE SAME - A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in which a wick is formed on an inner surface of the heat pipe and a working fluid is injected into the heat pipe, and a heat-dissipating heat pipe unit having an oscillating capillary type of a loop heat pipe, in which the loop heat pipe is formed as a capillary and a working fluid is injected into the loop heat pipe. Here, the heat pipe includes a radiator being disposed adjacent to a heat source and transporting heat transferred from the heat source to the loop heat pipe, and the loop heat pipe includes a heat-receiving portion, which is thermally coupled to the radiator, and a heat-dissipating portion, which releases heat absorbed from the heat-receiving portion.2012-03-15
20120063093REDUCING THERMAL GRADIENTS TO IMPROVE THERMOPILE PERFORMANCE - With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB.2012-03-15
20120063094THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING - Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.2012-03-15
20120063095ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER - An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.2012-03-15
20120063096SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG - To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.2012-03-15
20120063097MONOLITHIC MICROWAVE INTEGRATED CIRCUIT - A monolithic microwave integrated circuit structure having a semiconductor substrate structure with a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface and a metal layer on an opposite surface overlaying the interconnection section and absent from overlaying at least one of the input section and the output section.2012-03-15
20120063098ASSEMBLY TO PROVIDE THERMAL COOLING - In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.2012-03-15
20120063099RAIL SEAL FOR ELECTRONIC EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure, one or more panels attached to the frame structure, at least one vertical mounting rail fastened to the frame structure, and a rail seal attached to the at least one vertical mounting rail. The rail seal includes a generally flat panel portion and a seal along an edge thereof. The seal is adapted to engage at least one of the one or more panels to provide an air dam between the one or more panels and the at least one vertical mounting rail.2012-03-15
20120063100ELECTRONIC MODULE WITH IMPROVED LATCH MECHANISM - An electronic module (2012-03-15
20120063101Capacitive touch interface assembly - A display assembly includes a transparent cover piece, a display shroud having a contact structure arranged to face the transparent cover piece, an interface subassembly mounted on the display shroud, an electronics board shroud having a support member and a connection feature, and a biasing member operably engaged between the display shroud and the electronics board shroud. The connection feature mechanically connects the electronics board shroud to the display shroud while permitting axial displacement and rotation therebetween. The biasing member rests on the support member of the electronics board shroud, and the biasing member is configured to urge the contact structure of the display shroud into physical contact with the transparent cover piece. The interface subassembly includes a display circuit for providing a digital display and a touch circuit for providing touch actuation at or near the digital display through the transparent cover piece.2012-03-15
20120063102Electronic Device, Circuit Board Assembly, and Semiconductor Device - According to one embodiment, an electronic device includes a housing, a circuit board, and a component. The circuit board is provided in the housing, and includes a first pad and a second pad exposed on the surface. The component includes a first electrode and a second electrode. The first electrode is exposed on the circuit board-facing surface of the component fading the surface of the circuit board and bonded to the first pad via a bonding agent. The second electrode is exposed on the circuit board-facing surface and bonded to the second pad via a bonding agent. The second electrode is wider than the first electrode and projects more than the first electrode does.2012-03-15
20120063103THERMAL INTERFACE MATERIAL FOR REDUCING THERMAL RESISTANCE AND METHOD OF MAKING THE SAME - The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.2012-03-15
20120063104CONTROL UNIT FOR OCCUPANT PROTECTION MEANS FOR A VEHICLE AND A METHOD FOR ASSEMBLING A CONTROL UNIT OF THIS TYPE - A control unit and a method for assembling a control unit for occupant protection means for a vehicle are described. A p.c. board is enclosed between a plastic cover and a plastic base and assembled. A non-positive and/or positive connection is implemented for this assembly, and the control unit is pre-attached. The at least one connection is produced without tools.2012-03-15
20120063105ELECTRONIC DEVICE WITH CABLE - An electronic device includes a chassis, a bracket received in the chassis and a cable. A storage device is received in the bracket, and a wire is connected to the storage device. A motherboard is attached to the chassis, and at least two inserting slots are located on the motherboard. A first circuit board is electronically connected to the wire. The cable is electronically connected to the first circuit board and includes a connecting component and at least two connectors. The connecting component is electronically connected to the first circuit board, and the at least two connectors are electronically connected to the at least two inserting slots.2012-03-15
20120063106RF LAYERED MODULE USING THREE DIMENSIONAL VERTICAL WIRING AND DISPOSING METHOD THEREOF - Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via- hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.2012-03-15
20120063107SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE - A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.2012-03-15
20120063108CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME - In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes.2012-03-15
20120063109ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.2012-03-15
20120063110MODULE BOARD - A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.2012-03-15
20120063111ELECTRICAL OUTLET BOX - An electrical outlet box includes a housing comprising a plurality of electrical components and a switch; a cover adapted to close onto the housing and comprising an opening above the switch; and at least one manipulation assembly each disposed between the opening of the cover and the switch, each manipulation assembly comprising a membrane member mounted on the opening of the cover, and a lever block so that a pressing of the membrane member can turn on or off the switch via the lever block.2012-03-15
20120063112ELECTRONIC DEVICE - An electronic device includes a main body, a hinge, a display, and a protective structure. A recessed portion is defined in an edge area of the main body. The hinge includes a shaft passing through the recessed portion with a part of an outer surface exposed in the recessed portion. The display is connected to the main body with the hinge and is capable of rotating relative to the main body with the shaft. The protective structure is detachably mounted to the main body and partly received in the recessed portion for engaging with the main body to completely receive the outer surface of the shaft.2012-03-15
20120063113CONDUCTIVE BUFFER MATERIAL AND DISPLAY DEVICE - A conductive buffer material (2012-03-15
20120063114CONTROL DEVICE - A control device includes a housing, a control module having a movable member mounted in the housing and movable by the user and having a magnet located on each of the two distal ends thereof, and a circuit module that includes a microprocessor, a rotation sensor module electrically connected to the microprocessor and adapted for sensing rotation of the movable member or a sleeve on the movable member and producing a respective control signal, and a magnetic sensor module electrically connected to the microprocessor and adapted for sensing the strength of the magnetic field emitted by each magnet indicative of the direction and amount of a linear displacement of the movable member and producing a respective control signal. Subject to non-contact sensing design, the control device avoids any mechanical fatigue or contact failure.2012-03-15
20120063115ULTRASONIC BONDING OF DISCRETE PLASTIC PARTS TO METAL - Electronic devices and other apparatuses that include plastic parts ultrasonically bonded to metal parts are disclosed. A first component or part includes a metallic surface region having a surface roughness with one or more surface irregularities. A second component or part formed from a plastic material that can include an energy director is attached to the metallic surface region via an ultrasonic bond, such that a portion of the plastic material is melted or otherwise formed into the surface irregularities to attach the two components or parts together. The parts can be housings, internal components or other items. The surface irregularities can be formed as a result of a chemical etching process, a machining process, or a combination thereof, and can result in the creation of undercuts or cavities in the metallic surface region.2012-03-15
20120063116LED FRESNEL LIGHTING SYSTEM INCLUDING ACTIVE COOLING - A lighting apparatus for film, television, video capture, motion picture and photography which includes a Fresnel lens fixed in a housing which contains a tight array of high power LEDs. The LED panel or board is mated to a heat dissipating apparatus to provide active cooling and together forming an LED engine. The LED engine is mounted to a slider allowing the LED engine to be adjusted within the housing with respect to the lens. Light shaping diffusion may be included on the housing. A power supply unit may also be included in the housing. When in electrical communication, the LED engine and power supply unit function as an integrated self-contained lighting apparatus. Optionally, the power supply may have an integrated dimmer switch, and may be capable of receiving PFC power or have an integrated battery unit.2012-03-15
20120063117LIGHT SOURCE APPARATUS - Provided is a light source apparatus having a phosphor layer 2012-03-15
20120063118BARREL GRINDING OF LUMIRAMIC PLATELETS - The invention relates to a method for post-processing luminescent ceramic bodies (2012-03-15
20120063119BACKLIGHT LAMP GUIDE, BACK COVER AND BACKLIGHT - The disclosed technology provides a backlight lamp guide, a back cover for a backlight, and a backlight. The backlight lamp guide, the back cover and the backlight comprise a lateral positioning mechanism. The lateral positioning mechanism prevents the backlight lamp guide and the back cover from moving with respect to each other in a direction parallel to the back cover.2012-03-15
20120063120BACKLIGHT ASSEMBLY AND METHOD OF ASSEMBLING THE SAME AND LIQUID CRYSTAL DISPLAY INCLUDING BACKLIGHT ASSEMBLY - A backlight assembly includes a light source unit including a circuit board, a light source disposed on a first plane, of the circuit board, and at least one connection unit disposed on a second plane opposite to the first plane of the circuit board and electrically connected to the light source, a receiving container having a bottom plate and sidewalls extending from edges of the bottom plate and receiving the light source unit, the bottom plate including at least one opening portion in which the connection unit is inserted and exposed to the outside, and at least one driving unit disposed at a rear surface of the receiving container and connected to the connection unit for driving the light source unit.2012-03-15
20120063121Multi-Die LED Package and Backlight Unit Using the Same - A multi-die LED package comprises a diode that works as a light-emitting diode for emitting light and as a sensing diode for detecting at least one physical quantity. The multi-die LED package is able to provide desired luminance and color independent of aging, temperature or other effects.2012-03-15
20120063122ILLUMINATION DEVICE, DISPLAY DEVICE, AND TELEVISION RECEIVER - The backlight unit (2012-03-15
20120063123LASER PROJECTION BRA SYSTEM - This invention relates to a woman's wardrobe for use in entertainment, and, in particular, on stage concerts for projection of laser light from a woman's body. The above system provides a unique small visual entertainment system that operates on batteries to enable the individual to walk about the stage.2012-03-15
20120063124DEVICE AND SYSTEM FOR ILLUMINATED APPAREL - A system for creating a lighted apparel design includes a light element and a securing member for securing the light element to the apparel item. The securing member is an adhesive. The securing member secures the light element to an associated apparel item at a desired location on the apparel item to create a lighted design on the apparel item.2012-03-15
20120063125DISPLAY CASE LIGHTING - The present embodiments provide channel letter lighting devices and/or systems. A lighting unit, comprising: a housing; a printed circuit board (PCB) mounted within the housing and having a plurality light emitting elements on the PCB which emit light when an electrical signal is applied to the light emitters; and a plurality of reflectors, each of which comprised of an at least one partial parabola which reflects light substantially away from the housing, the plurality of reflectors over the PCB and the light emitters such that each of the light emitters is surrounded by at least one of the plurality of reflectors.2012-03-15
20120063126PENDANT HAVING AN INDIVIDUALIZING ELEMENT - Pendant 1 having a base body 4 with a front side 2 and a back side 3 and an element individualizing the pendant arranged on the base body 4, such that the element individualizing the pendant is designed as a lenticular object 5.2012-03-15
20120063127Indirect Light Assembly - An apparatus and associated method for operating a portable light assembly. In accordance with some embodiments, a frame providing a bridge and defining a transport region and a deployment region is slidingly connected to a mast. An arm is further connected to the mast by a hinge while a light fixture is connected to the arm. In various embodiments, the light fixture is capable of transitioning from a deployed position where the mast engages the deployment region and a transport position where the mast and light fixture are disposed within the transport region.2012-03-15
20120063128LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.2012-03-15
20120063129LAMP DESIGNED TO USE SOLID-STATE LIGHT EMITTING DEVICE AS LIGHT SOURCE - Provided is a lamp designed to use as a light source a solid-state light emitting device with a simple and inexpensive structure and having an improved heat dissipation performance. A lamp uses a solid-state light emitting device as a light source. A cap is mounted to an external apparatus at the time of use. A housing is made of a translucent material and is connected to the cap. A light-emitting module includes one or a plurality of solid-state light emitting devices and is mounted such that the main-light-emission side (lower side in FIG. 2012-03-15
20120063130LIGHTING DEVICE - The present invention describes a lighting device. The lighting device includes a first light guiding pillar, at least one first point-form light source, a second light guiding pillar and at least one second point-form light source. The first point-form light source is disposed near at least one end of the first light guiding pillar. The first and the second light guiding pillars are parallel with each other and integrally formed in one piece. The second point-form light source is disposed near at least one end of the second light guiding pillar. The first and the second light guiding pillars are integrated into a connection body having two opposite surfaces respectively forming two straight grooves on an intersection of the first and the second light guiding pillars, wherein two bottoms of the straight grooves are spaced by a predetermined distance.2012-03-15
20120063131Illumination System for Use in a Stereolithography Apparatus - The invention concerns an illumination system for use in a stereolithography apparatus, comprising a planar support supporting a two-dimensional array of individually controllable wide-angle light-emitting diodes (LEDs); and a multilens projector array arranged relative to the array, and adapted to project a focused image of the LEDs onto a work area. The multilens projector array is arranged to project light from the LED array having a light emitting edge area image spot size which is smaller than or equal to a light emitting central area image spot size.2012-03-15
20120063132MODULAR LED FLOOD LIGHT - A modular luminaire which uses LED light sources. The basic frame comprises two end pieces compressed together by through bolts. At least one elongated heat sink is compressed between the end pieces. Each heat sink may bear a plurality of LEDs mounted on a printed circuit board which may have an integral metallic backplate, and is installed on one of the heat sinks with a layer of heat conductive grease therebetween. The heat sinks have fins projecting in three directions, the fourth direction being accounted for by the LEDs, and are rotatable about their longitudinal axes to adjust direction of light propagation. The heat sinks are arrayed in an arc, so that the outside heat sinks shield observers from direct glare from opposed heat sinks. Heat sinks may be extruded to form cooling fins and slots which may receive fasteners such as screws.2012-03-15
20120063133LIGHT REFLECTION SHEET, LIGHT SOURCE DEVICE, AND DISPLAY DEVICE - A through hole penetrating in a vertical direction and a slot which is separated from the through hole in the direction along the sheet surface and is long in a separating direction are provided on a light reflection sheet supported on a support body supporting a light source for reflecting light emitted from the light source, and there are provided a first shaft member fitted in the through hole for setting a position of the light reflection sheet with respect to the support body, and a second shaft member fitted in the slot to enable a relative movement in a longitudinal direction of the slot for setting the position of the light reflection sheet with respect to the support body.2012-03-15
20120063134LAMP - A lamp includes a frame; a light emitting mechanism coupled to the frame, the light emitting mechanism comprising a carrier, a plurality of dents disposed on the carrier, light-emitting diodes disposed in the dents, respectively, and series-connected to each other, and a power supply unit connecting with the light-emitting diodes; a lampshade coupled to the frame and configured to hermetically seal the light emitting mechanism; and a plurality of lenses coupled to the lampshade, or coupled to the dents and configured to hermetically seal the light-emitting diodes, respectively. The light-emitting diodes generate light directed to a required position by the lenses due to the directivity of the light-emitting diodes and focused by the lenses, such that the lamp is advantageously characterized by a large illumination angle and capable of saving power.2012-03-15
20120063135CIRCUIT BOARD FOR AN LED LUMINAIRE - Disclosed is an LED light source automated luminaire with a LEDs mounted on a partitionable circuit board. The partitionable circuit board allows for less expensive service cost while maintaining lower costs of manufacture of the luminaire.2012-03-15
20120063136Addressable or Static Light Emitting or Electronic Apparatus - The present invention provides an addressable or static electronic apparatus, such as a light emitting display. An exemplary apparatus comprises a substrate having a plurality of cavities; a plurality of first conductors coupled to the substrate and at least partially within the cavities, with the plurality of first conductors having a first and substantially parallel orientation; a plurality of light emitting diodes or other electronic components coupled to the plurality of first conductors and having a second orientation substantially normal to the first orientation; and a plurality of substantially optically transmissive second conductors coupled to the plurality of light emitting diodes and having a third orientation substantially normal to the second orientation and substantially perpendicular to the first orientation. In an exemplary method, the plurality of electronic components in a suspending medium are deposited within the plurality of cavities, and the plurality of electronic components are oriented using an applied field, followed by a bonding of the plurality of electronic components to the plurality of first conductors.2012-03-15
20120063137Foldable LED light recycling cavity - LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity.2012-03-15
20120063138EGRESS LIGHTING FOR TWO MODULE LUMINAIRES - Embodiments of the invention provide for a lighting system for illuminating aisles with shelving. A rail can include a plurality of LEDs that extend along the length of the rail. The rail can be coupled with a node that includes various components along with an egress light source. The LEDs can be used to primarily illuminate the shelving on both or one side of the aisle. The egress light can be used to illuminate the aisle during times of emergency, at night, or when egress may be required.2012-03-15
20120063139Light Band and Method for Producing a Light Band - A light band (2012-03-15
20120063140Lighting fixture with adjustable light pattern and foldable house structure - A lighting fixture includes a reflector reflecting light from a fluorescent lamp to a desired direction, and one or more lamp connectors connecting the reflector to rotatably and detachably coupling with the fluorescent lamp, wherein the reflector is adapted to selectively rotate with respect to an axis of the fluorescent lamp for reflecting light from the fluorescent lamp so as to change a light pattern of the fluorescent lamp towards an opening of the foldable housing. The foldable housing includes two side frames and a retention frame extended between the two side frames to retain a distance therebetween, wherein the side frames are pivotally coupled with the retention frame to fold between an unfolded position to retain the fluorescent lamp in longitudinal position and a folded position to form a compact size for storage and transportation.2012-03-15
20120063141LIGHTING DEVICE - A lighting device is provided to include a plurality of lens bodies. The connecting portion connecting the plurality of lens bodies includes a first major surface and a second major surface opposite to the first major surface. The first major surface is in contact with the lateral portion at a first contact under an outer edge of the leading lens. The second major surface is in contact with the lateral portion at a second contact located below the first contact. The first contact is located outside of a point of intersection along the first major surface with respect to the center of each lens body, the point of intersection at which an extraction of the first major surface intersects with an extension of a ray of the emitted light which is incident on the light incident surface and is projected on the second contact.2012-03-15
20120063142Illuminating and Targeting Systems and Methods Having Variable Liquid Lens - Systems and methods that incorporate a variable liquid lens are disclosed. In at least some embodiments, a light projecting system includes a light source, and a light processing assembly configured to receive a light beam from the light source and to project an output field. The light processing assembly includes at least one liquid lens configured to controllably process the light beam such that the output field is variable between a relatively-broader illuminating field and a relatively-narrower targeting field. In some embodiments, a controller may controllably adjust the at least one liquid lens to alternately provide the illuminating field and the targeting field, and may controllably adjust at least one dwell time to adjust a brightness of at least one of the illuminating and targeting fields, respectively.2012-03-15
20120063143LIGHTING DEVICE - A lighting device is provided. The lighting device includes: a light source module mounted on a substrate; a lens unit provided on the light source module and including an accommodating groove accommodating the light source module; a housing unit accommodating the lens unit therein to protect the lens unit from an outside; a supporting unit fixed to the substrate and including a coupling hole having the housing unit coupled thereto to thereby support the housing unit; and a height adjustment unit allowing the housing unit to be vertically-movably coupled to the supporting unit and adjusting a height of the lens unit such that the height of the lens unit is varied.2012-03-15
20120063144Light Coloring System - A rainbow wheel that colors light that is passed therethrough. The wheel can be formed using a photolithographic process. Another supermagenta wheel can be used to increase the number of colors that can be obtained.2012-03-15
20120063145SHEET AND LIGHT-EMITTING DEVICE - A transparent sheet for use with a light emitting body with one of surfaces of the transparent sheet being adjacent to the light emitting body, wherein the other surface of the sheet is divided into a plurality of minute regions δ, a largest inscribed circle of the minute regions δ having a diameter from 0.2 μm to 1.5 μm, each of the minute regions δ being adjoined by and surrounded by two or more other ones of the plurality of minute regions δ, the plurality of minute regions δ include a plurality of minute regions δ2012-03-15
20120063146SPOT LIGHT SOURCE AND BULB-TYPE LIGHT SOURCE - In a spot light source 2012-03-15
20120063147STAGE LIGHTING FIXTURE - A stage lighting fixture having: 2012-03-15
20120063148LIGHT-EMITTING MODULE AND LIGHTING APPARATUS - A light-emitting module includes a substrate having a front surface side component mounting surface and a rear surface side flat heat dissipating surface. Light-emitting elements are arranged to protrude at a central portion of the component mounting surface and radiate light at least man upper surface direction and in a direction along the component mounting surface. A lighting circuit component is electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged closer to the peripheral edge side of the substrate than the light emitting elements: A connector for power supply connection is arranged closer to the peripheral edge side of the substrate than the light emitting elements on the component mounting surface of the substrate and is electrically connected to the lighting circuit component.2012-03-15
20120063149MULTIFUNCTIONAL AMBIENT LIGHTING COMPOSITIONS - An acrylic or other polymer composition, optionally containing aluminum trihydrate, and having undoped and/or doped titanium dioxide dispersed evenly throughout is disclosed. Said composition provides a sterile surface which can be renewed. Said composition provides a highly sterile surface upon photoactivation of the surface by at least either low-level ultraviolet irradiation or ambient/natural light (as when using doped titanium dioxide). A method of using such a surface material is also disclosed. Said acrylic or other polymer composition may be adhered onto a polycarbonate or other polymeric backing, optionally by an intervening layer of a third polymer. The resulting acrylic or other polymer/polycarbonate or other polymer combination is adapted to provide ambient lighting when exposed to a light source.2012-03-15
20120063150LIGHT SOURCE DEVICE AND DISPLAY DEVICE PROVIDED WITH SAME - A light source device includes a circuit board having a LED mounted on a surface, a lens attached to the surface so as to diffuse light emitted from the LED, a reflecting sheet having a through hole in the inside of which the lens is disposed and reflecting light emitted from the LED at an opposite side of the surface, and a restricting member which is disposed at one of an edge of the through hole in the reflecting sheet and the lens, and restricts a deviation of the reflecting sheet in a direction departing from the surface.2012-03-15
20120063151ILLIMINATION DEVICE WITH AFTERGLOW CHARACTERISTICS - The invention relates to illumination devices (2012-03-15
20120063152ADJUSTABLE SRUCTURE FOR LAMP STAND - An adjustable structure for lamp stand, in which a swivel mount is fitted to the upper portion of a base, thereby enabling ends of a first bar support and a telescopic link to be pin connected to the swivel mount, while the other ends are pin connected to a second bar support. A lamp swivel component is disposed on the end of the second bar support. Accordingly, relative positions between the first bar support, the second bar support and the telescopic link can be freely adjusted, while still providing stable support to the structure.2012-03-15
Website © 2022 Advameg, Inc.