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11th week of 2019 patent applcation highlights part 54
Patent application numberTitlePublished
20190081016HIGH-VOLTAGE MOSFET STRUCTURES2019-03-14
20190081017MEMORY DEVICE2019-03-14
20190081018METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE2019-03-14
20190081019ELECTRONIC COMPONENT2019-03-14
20190081020METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE, AND MEMBER FOR SEMICONDUCTOR DEVICE2019-03-14
20190081021METHOD OF MANUFACTURING STACKED WAFER ASSEMBLY2019-03-14
20190081022SEMICONDUCTOR SENSOR PACKAGE2019-03-14
20190081023RECESSED AND EMBEDDED DIE CORELESS PACKAGE2019-03-14
20190081024APPARATUS AND METHOD OF POWER TRANSMISSION SENSING FOR STACKED DEVICES2019-03-14
20190081025DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE2019-03-14
20190081026LIGHT EMITTING PANEL2019-03-14
20190081027INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE2019-03-14
20190081028OPTICAL MODULE, MODULE, AND METHODS FOR MANUFACTURING OPTICAL MODULE AND MODULE2019-03-14
20190081029SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE2019-03-14
20190081030SEMICONDUCTOR DEVICE2019-03-14
20190081031DISPLAY DEVICE2019-03-14
20190081032SEMICONDUCTOR DEVICE2019-03-14
20190081033SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE2019-03-14
20190081034ESD PROTECTION CIRCUIT2019-03-14
20190081035ELECTROSTATIC DISCHARGE PROTECTION DEVICES2019-03-14
20190081036ESD PROTECTION DEVICE2019-03-14
20190081037ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE2019-03-14
20190081038DECOUPLING CAPACITOR CIRCUIT2019-03-14
20190081039Method of Forming Compound Semiconductor Body2019-03-14
20190081040SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF2019-03-14
20190081041HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY2019-03-14
20190081042SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME2019-03-14
20190081043Semiconductor Device2019-03-14
20190081044SEMICONDUCTOR DEVICE HAVING SUB REGIONS TO DEFINE THRESHOLD VOLTAGES2019-03-14
20190081045HIGH-VOLTAGE SEMICONDUCTOR DEVICE2019-03-14
20190081046STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUGH WAFER VIA WITHIN CMOS CIRCUITRY2019-03-14
20190081047SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME2019-03-14
20190081048SEMICONDUCTOR MEMORY DEVICE2019-03-14
20190081049VNW SRAM WITH TRINITY CROSS-COUPLE PD/PU CONTACT AND METHOD FOR PRODUCING THE SAME2019-03-14
20190081050Two-Port SRAM Structure2019-03-14
20190081051SRAM CELL WITH T-SHAPED CONTACT2019-03-14
20190081052SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME2019-03-14
20190081053MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR2019-03-14
20190081054SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME2019-03-14
20190081055THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF2019-03-14
20190081056SEMICONDUCTOR MEMORY AND SEMICONDUCTOR MEMORY MANUFACTURING METHOD2019-03-14
20190081057SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR2019-03-14
20190081058SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR2019-03-14
20190081059TRENCH STRUCTURES FOR THREE-DIMENSIONAL MEMORY DEVICES2019-03-14
20190081060JOINT OPENNING STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME2019-03-14
20190081061Device, A Method Used In Forming A Circuit Structure, A Method Used In Forming An Array Of Elevationally-Extending Transistors And A Circuit Structure Adjacent Thereto2019-03-14
20190081062MEMORY DEVICE2019-03-14
20190081063MEMORY DEVICE2019-03-14
20190081064SEMICONDUCTOR MEMORY DEVICE2019-03-14
20190081065SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME2019-03-14
20190081066METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE2019-03-14
20190081067NONVOLATILE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME2019-03-14
20190081068TUNNELING FIELD EFFECT TRANSISTOR 3D NAND DATA CELL STRUCTURE AND METHOD FOR FORMING THE SAME2019-03-14
20190081069THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME2019-03-14
20190081070STAIRCASE STRUCTURE FOR MEMORY DEVICE2019-03-14
20190081071Integrated Structures and Methods of Forming Vertically-Stacked Memory Cells2019-03-14
20190081072METHOD OF PROCESSING A SUBSTRATE AND A DEVICE MANUFACTURED BY USING THE METHOD2019-03-14
20190081073SEMICONDUCTOR MEMORY DEVICE2019-03-14
20190081074ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME2019-03-14
20190081075SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE2019-03-14
20190081076THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY PANEL2019-03-14
20190081077ACTIVE MATRIX SUBSTRATE2019-03-14
20190081078SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME2019-03-14
20190081079INTEGRATED TENSILE STRAINED SILICON NFET AND COMPRESSIVE STRAINED SILICON-GERMANIUM PFET IMPLEMENTED IN FINFET TECHNOLOGY2019-03-14
20190081080ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME AND DISPLAY DEVICE2019-03-14
20190081081ACTIVE MATRIX SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD2019-03-14
20190081082Semiconductor Device and Method for Manufacturing the Same2019-03-14
20190081083THIN FILM TRANSISTOR AND DISPLAY DEVICE COMPRISING THE SAME2019-03-14
20190081084ARRAY SUBSTRATE, FABRICATION METHOD THEREOF, DRIVING TRANSISTOR AND DISPLAY PANEL2019-03-14
20190081085DISPLAY DEVICE2019-03-14
20190081086FLEXIBLE ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, FLEXIBLE DISPLAY PANEL AND DISPLAY APPARATUS2019-03-14
20190081087STACK STRUCTURE AND PREPARATION METHOD THEREOF2019-03-14
20190081088DISPLAY DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRODE FORMING METHOD2019-03-14
20190081089DISPLAY DEVICE, MANUFACTURING METHOD OF DISPLAY DEVICE, AND ELECTRODE FORMING METHOD2019-03-14
20190081090DISPLAY DEVICE2019-03-14
20190081091ARRAY SUBSTRATE, DISPLAY PANEL, ENCAPSULATION METHOD THEREOF, AND DISPLAY APPARATUS2019-03-14
20190081092METHOD FOR FABRICATING AN IMAGE SENSOR2019-03-14
20190081093IMAGE SENSOR AND IMAGE CAPTURING DEVICE2019-03-14
20190081094IMAGE SENSOR AND IMAGE-CAPTURING DEVICE2019-03-14
20190081095PIXEL-LEVEL BACKGROUND LIGHT SUBTRACTION2019-03-14
20190081096CAPACITOR INCLUDING FIRST ELECTRODE, DIELECTRIC LAYER, AND SECOND ELECTRODE, IMAGE SENSOR, AND METHOD FOR PRODUCING CAPACITOR2019-03-14
20190081097OPTICAL SENSOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF2019-03-14
20190081098IMAGE SENSORS WITH IN-PIXEL LENS ARRAYS2019-03-14
20190081099IMAGING DEVICE2019-03-14
20190081100IMAGE SENSOR AND IMAGE CAPTURE DEVICE2019-03-14
20190081101SEMICONDUCTOR MEMORY DEVICE2019-03-14
20190081102SEMICONDUCTOR MEMORY DEVICES2019-03-14
20190081103CHALCOGENIDE MEMORY DEVICE COMPONENTS AND COMPOSITION2019-03-14
20190081104METHODS OF OPERATING MEMORY DEVICES AND ELECTRONIC SYSTEMS2019-03-14
20190081105THREE-DIMENSIONAL SEMICONDUCTOR DEVICE2019-03-14
20190081106IMAGING DEVICE INCLUDING AT LEAST ONE UNIT PIXEL CELL AND VOLTAGE APPLICATION CIRCUIT2019-03-14
20190081107IMAGING DEVICE INCLUDING AT LEAST ONE UNIT PIXEL CELL2019-03-14
20190081108DISPLAY APPARATUS2019-03-14
20190081109DISPLAY SUBSTRATE AND FABRICATION METHOD THEREOF, DISPLAY DEVICE2019-03-14
20190081110ORGANIC EL DISPLAY DEVICE2019-03-14
20190081111ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME2019-03-14
20190081112DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR2019-03-14
20190081113SUBPIXEL ARRANGEMENTS OF DISPLAYS AND METHOD FOR RENDERING THE SAME2019-03-14
20190081114DISPLAY AND A LIGHT SENSOR OPERABLE AS AN INFRARED EMITTER AND INFRARED RECEIVER2019-03-14
20190081115DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE2019-03-14
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