Inventors list
Assignees list
Classification tree browser
Top 100 Inventors
Top 100 Assignees
10th week of 2021 patent applcation highlights part 63
Patent application number
Title
Published
20210074546
METHOD AND SYSTEM OF ESTIMATING WAFER CRYSTALLINE ORIENTATION
2021-03-11
20210074547
METHOD FOR FABRICATING TRANSISTOR GATE, AS WELL AS TRANSISTOR STRUCTURE
2021-03-11
20210074548
Methods of Forming Silicide Contact in Field-Effect Transistors
2021-03-11
20210074549
METHOD FOR FORMING ETCHING MASK AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
2021-03-11
20210074550
ETCHING METHOD AND PLASMA TREATMENT DEVICE
2021-03-11
20210074551
MULTI-LAYERED POLYSILICON AND OXYGEN-DOPED POLYSILICON DESIGN FOR RF SOI TRAP-RICH POLY LAYER
2021-03-11
20210074552
Shutter Disk
2021-03-11
20210074553
Cross-Wafer RDLs in Constructed Wafers
2021-03-11
20210074554
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2021-03-11
20210074555
SUBSTRATE PROCESSING DEVICE
2021-03-11
20210074556
BRUSH WITH NON-CONSTANT NODULE DENSITY
2021-03-11
20210074557
APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF CLEANING SAME
2021-03-11
20210074558
SUBSTRATE PROCESSING APPARATUS
2021-03-11
20210074559
WORKPIECE CUTTING METHOD
2021-03-11
20210074560
APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP
2021-03-11
20210074561
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2021-03-11
20210074562
ULTRAVIOLET IRRADIATION APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SAME
2021-03-11
20210074563
SYSTEM AND METHOD FOR MANUFACTURING PLURALITY OF INTEGRATED CIRCUITS
2021-03-11
20210074564
METHOD AND SYSTEM FOR INSPECTING PROCESSING APPARATUS
2021-03-11
20210074565
WAFER CASSETTE STOCKER AND WAFER CASSETTE DRYING METHOD USING THE SAME
2021-03-11
20210074566
WAFER PRE-ALIGNER AND METHOD OF PRE-ALIGNING WAFER
2021-03-11
20210074567
Automatic Teaching of Substrate Handling for Production and Process-Control Tools
2021-03-11
20210074568
WAFER HOLDING BODY
2021-03-11
20210074569
ELECTROSTATIC PUCK AND METHOD OF MANUFACTURE
2021-03-11
20210074570
ELECTROSTATIC CHUCK DEVICE AND METHOD FOR PRODUCING ELECTROSTATIC CHUCK DEVICE
2021-03-11
20210074571
ELECTROSTATIC CHUCK
2021-03-11
20210074572
ELECTROSTATIC CHUCK
2021-03-11
20210074573
INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE
2021-03-11
20210074574
VACUUM CHUCK, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME AND RELATED METHOD OF MANUFACTURE
2021-03-11
20210074575
CHUCK TABLE AND METHOD OF MANUFACTURING CHUCK TABLE
2021-03-11
20210074576
SEMICONDUCTOR MANUFACTURING DEVICE
2021-03-11
20210074577
BULK SUBSTRATES WITH A SELF-ALIGNED BURIED POLYCRYSTALLINE LAYER
2021-03-11
20210074578
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
2021-03-11
20210074579
Semiconductor Device and Method
2021-03-11
20210074580
Conductive Feature Formation and Structure
2021-03-11
20210074581
Interconnect Structure and Method
2021-03-11
20210074582
PROCESS FOR MAKING INTERCONNECT OF GROUP III-V SEMICONDUCTOR DEVICE, AND GROUP III-V SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT MADE THEREBY
2021-03-11
20210074583
INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESS
2021-03-11
20210074584
METHOD OF SELECTIVE DEPOSITION FOR FORMING FULLY SELF-ALIGNED VIAS
2021-03-11
20210074585
STEALTH DICING METHOD AND APPARATUS
2021-03-11
20210074586
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
2021-03-11
20210074587
Sawn Leadless Package Having Wettable Flank Leads
2021-03-11
20210074588
WAFER PROCESSING METHOD
2021-03-11
20210074589
WAFER PROCESSING METHOD
2021-03-11
20210074590
GATE STRUCTURE AND METHOD OF FORMING SAME
2021-03-11
20210074591
Notched Gate Structure Fabrication
2021-03-11
20210074592
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-03-11
20210074593
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES
2021-03-11
20210074594
SEMICONDUCTOR SUBSTRATE MEASURING APPARATUS AND PLASMA TREATMENT APPARATUS USING THE SAME
2021-03-11
20210074595
POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOSITION
2021-03-11
20210074596
SEMICONDUCTOR DEVICE AND NONVOLATILE MEMORY DEVICE INCLUDING CRACK DETECTION STRUCTURE
2021-03-11
20210074597
DISPLAY DEVICE INCLUDING A TEST UNIT
2021-03-11
20210074598
ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS
2021-03-11
20210074599
POLYGON INTEGRATED CIRCUIT (IC) PACKAGING
2021-03-11
20210074600
CHIP PACKAGE STRUCTURE WITH CAVITY IN INTERPOSER
2021-03-11
20210074601
Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-Out
2021-03-11
20210074602
CHIP PACKAGE STRUCTURE HAVING WARPAGE CONTROL AND METHOD OF FORMING THE SAME
2021-03-11
20210074603
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
2021-03-11
20210074604
PACKAGE STRUCTURE FOR POWER DEVICE
2021-03-11
20210074605
HEAT EXCHANGER FOR ELECTRONICS
2021-03-11
20210074606
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2021-03-11
20210074607
HEAT SINK-ATTACHED POWER MODULE SUBSTRATE BOARD AND POWER MODULE
2021-03-11
20210074608
SEMICONDUCTOR PACKAGE HAVING LIQUID-COOLING LID
2021-03-11
20210074609
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
2021-03-11
20210074610
Electronic device
2021-03-11
20210074611
SEMICONDUCTOR DEVICE
2021-03-11
20210074612
SEMICONDUCTOR DEVICE
2021-03-11
20210074613
Flippable Leadframe for Packaged Electronic System Having Vertically Stacked Chip and Components
2021-03-11
20210074614
Multi-Chip Package
2021-03-11
20210074615
CHIP ON FILM AND DISPLAY DEVICE
2021-03-11
20210074616
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
2021-03-11
20210074617
CONNECTION TERMINAL UNIT
2021-03-11
20210074618
ELECTRONIC IC DEVICE COMPRISING INTEGRATED OPTICAL AND ELECTRONIC CIRCUIT COMPONENT AND FABRICATION METHOD
2021-03-11
20210074619
SEMICONDUCTOR DEVICE
2021-03-11
20210074620
INTERCONNECTION STRUCTURE FABRICATION USING GRAYSCALE LITHOGRAPHY
2021-03-11
20210074621
SEMICONDUCTOR PACKAGE
2021-03-11
20210074622
CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME
2021-03-11
20210074623
REDISTRIBUTION LAYERS INCLUDING REINFORCEMENT STRUCTURES AND RELATED SEMICONDUCTOR DEVICE PACKAGES, SYSTEMS AND METHODS
2021-03-11
20210074624
Semiconductor Module and Method for Producing the Same
2021-03-11
20210074625
GRAPHITE-LAMINATED CHIP-ON-FILM-TYPE SEMICONDUCTOR PACKAGE HAVING IMPROVED HEAT DISSIPATION AND ELECTROMAGNETIC WAVE SHIELDING FUNCTIONS
2021-03-11
20210074626
ELECTRONIC MODULE, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELECTRONIC MODULE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE
2021-03-11
20210074627
Semiconductor Die Contact Structure and Method
2021-03-11
20210074628
Interconnect Clip with Angled Contact Surface and Raised Bridge
2021-03-11
20210074629
STACKED CAPACITOR
2021-03-11
20210074630
IC HAVING TRENCH-BASED METAL-INSULATOR-METAL CAPACITOR
2021-03-11
20210074631
SEMICONDUCTOR DEVICE
2021-03-11
20210074632
SELF ALIGNED GRATINGS FOR TIGHT PITCH INTERCONNECTS AND METHODS OF FABRICATION
2021-03-11
20210074633
METHOD OF MANUFACTURING CHIP PACKAGING STRUCTURE
2021-03-11
20210074634
MODULE STRUCTURE AND METHOD FOR MANUFACTURING THE MODULE STRUCTURE
2021-03-11
20210074635
Semiconductor Device and Method
2021-03-11
20210074636
PATTERNING APPROACH FOR IMPROVED VIA LANDING PROFILE
2021-03-11
20210074637
SEMICONDUCTOR DEVICE
2021-03-11
20210074638
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2021-03-11
20210074639
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
2021-03-11
20210074640
ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
2021-03-11
20210074641
SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER
2021-03-11
20210074642
SEMICONDUCTOR DEVICE HAVING METAL INTERCONNECTS WITH DIFFERENT THICKNESSES
2021-03-11
20210074643
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-03-11
20210074644
WAFER STACKING METHOD AND WAFER STACKING STRUCTURE
2021-03-11
20210074645
CHIP PACKAGE STRUCTURE USING SILICON INTERPOSER AS INTERCONNECTION BRIDGE
2021-03-11