10th week of 2011 patent applcation highlights part 12 |
Patent application number | Title | Published |
20110057298 | Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging - A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation. | 2011-03-10 |
20110057299 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - Height control of a capillary is performed in a stitch bonding (2nd bond) in a wire bonding, so that a thickness of a stitch portion can be controlled, thereby ensuring a bonding strength at the stitch portion and achieving an improvement in a bonding reliability. Also, the stitch portion has a thick portion, and a wire and a part (α portion) of a bonding region of an inner lead is formed to a lower portion of the thick portion, thereby sufficiently ensuring a thickness of the stitch portion and a bonding region. | 2011-03-10 |
20110057300 | Direct contact leadless flip chip package for high current devices - Some exemplary embodiments of an advanced direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor devices, have been disclosed. One exemplary structure comprises a mold compound enclosing a first contact lead frame portion, a paddle portion, and an extended contact lead frame portion held together by a mold compound. A first semiconductor device is attached on top of the lead frame portions as a flip chip, while a second semiconductor device is attached to a bottom side of said paddle portion and is in electrical contact with said the first semiconductor device. The extended contact lead frame portion is in direct electrical contact with the second semiconductor device without using a bond wire. Alternative exemplary embodiments may include additional extended lead frame portions, paddle portions, and semiconductor devices in various configurations. | 2011-03-10 |
20110057301 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a patterned metal foil, a chip, wires, a patterned dielectric layer, an adhesive layer, and a molding compound. The patterned metal foil has a first surface and a second surface opposite thereto. The patterned dielectric layer is disposed on the second surface and has openings exposing at least a portion of the patterned metal foil to form joints for external electrical connection. The chip is disposed on the first surface. The adhesive layer is disposed between the chip and the patterned metal foil. The wires respectively connect the chip and the patterned metal foil. The patterned dielectric layer is located below intersections between the wires and the patterned metal foil. The patterned dielectric layer, the wires, and the patterned metal foil overlap with one another on a plane. The molding compound is disposed on the first surface and covers the chip and the wires. | 2011-03-10 |
20110057302 | IMPEDANCE OPTIMIZED CHIP SYSTEM - A high bandwidth circuit is segmented into a plurality of portions, each portion for implementation on a corresponding semiconductor chip, an arrangement of one or more die bond pads for each corresponding chip is generated, and a chip location for each corresponding chip is generated, given package and given package I/O arrangement is generated, the generation of the die bond arrangements and the chip position being relative to given chip package parameters, and being generated to establish bond wire lengths meeting given characteristic impedance parameters. Boundary parameters for generating the segmenting are provided, including a bound on the number of portions and optionally a including bound on the area parameters of the corresponding semiconductor chips. | 2011-03-10 |
20110057303 | Package for an Integrated Circuit - According to various illustrative embodiments of the present invention, a device for an integrated circuit includes a monolithic frame having a plurality of alignment features disposed thereon, the monolithic frame having a mounting surface disposed thereon for the integrated circuit, the monolithic frame also having a thermal interface area disposed thereon for the integrated circuit. The device also includes an electrical interface capable of providing an electrical connection for the integrated circuit, the plurality of alignment features being substantially independent of the electrical interface, and an adhesive layer disposed between the monolithic frame and the electrical interface. | 2011-03-10 |
20110057304 | METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE - A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer. | 2011-03-10 |
20110057305 | PACKAGE SUBSTRATE HAVING SEMICONDUCTOR COMPONENT EMBEDDED THEREIN AND FABRICATION METHOD THEREOF - A package substrate having a semiconductor component embedded therein and a method of fabricating the same are provided, including: providing a semiconductor chip with electrode pads disposed on an active surface thereof; forming a passivation layer on the active surface and the electrode pads; forming on the passivation layer metal pads corresponding in position to the electrode pads, respectively, so as for the semiconductor chip to be fixed in position to an opening of a substrate body; forming a first dielectric layer on the semiconductor chip and the substrate body; forming dielectric layer openings by laser and preventing the electrode pads from being penetrated by the metal pads; removing the metal pads and the passivation layer in the dielectric layer openings so as to expose the electrode pads therefrom; and forming a first wiring layer on the first dielectric layer for electrical connection with the electrode pads. | 2011-03-10 |
20110057306 | EDGE MOUNTED INTEGRATED CIRCUITS WITH HEAT SINK - A module has a substrate, first and second integrated circuits, and a heat sink. The integrated circuits each have a first major surface, a second major surface, a first edge, a second edge, and a third edge and have optical circuits having ports on the first edge and electronic circuits having ports on the second edge. The second edges are connected to the substrate. The first major surface of the second integrated circuit is parallel with the second major surface of the first integrated circuit. The heat sink has a backplane adjacent to the third edge, a first portion along the first major surface of the first integrated circuit, a second portion along the second major surface of the second integrated circuit extending from the backplane, and an insert between the first major surface of the second integrated circuit and the second major surface of the first integrated circuit. | 2011-03-10 |
20110057307 | Semiconductor Chip with Stair Arrangement Bump Structures - Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical contact with the first conductor structure. The second conductor structure is adapted to be coupled to a solder structure and includes a stair arrangement that has at least two treads. | 2011-03-10 |
20110057308 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive pillar, having substantially parallel vertical sides, in direct contact with the substrate; mounting an integrated circuit to the substrate beside the conductive pillar; and encapsulating the integrated circuit with an encapsulation having a top surface formed for the conductive pillar to extend beyond. | 2011-03-10 |
20110057309 | STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN FCB PACKAGING - Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective on of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump. | 2011-03-10 |
20110057310 | SEMICONDUCTOR PACKAGE HAVING MEMORY DEVICES STACKED ON LOGIC DEVICE - A semiconductor package includes a base substrate, a logic device with a serializer/deserializer (SerDes), a plurality of odd memory devices disposed on a lower surface of the logic device and operatively stack-connected with the SerDes, and a plurality of even memory devices disposed on an upper surface of the logic device and operatively stack-connected with the SerDes, such that the plurality of odd memory devices and the plurality of even memory devices are connected in parallel by the SerDes. | 2011-03-10 |
20110057311 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A semiconductor device is obtained, in which excellent characteristics are achieved, the reliability is improved, and an SiC wafer can also be used for the fabrication. A plurality of Schottky-barrier-diode units | 2011-03-10 |
20110057312 | CONTACT STRUCTURE AND METHOD FOR PRODUCING A CONTACT STRUCTURE - The invention relates to a contact structure ( | 2011-03-10 |
20110057313 | Enhanced Copper Posts for Wafer Level Chip Scale Packaging - An enhanced wafer level chip scale packaging (WLCSP) copper electrode post is described having one or more pins that protrude from the top of the electrode post. When the solder ball is soldered onto the post, the pins are encapsulated within the solder material. The pins not only add shear strength to the soldered joint between the solder ball and the electrode post but also create a more reliable electrical connection due to the increased surface area between the electrode post/pin combination and the solder ball. Moreover, creating an irregularly shaped solder joint retards the propagation of cracks that may form in the intermetal compounds (IMC) layer formed at the solder joint. | 2011-03-10 |
20110057314 | CONDUCTORS FOR PHOTOVOLTAIC CELLS - The invention relates to conductive pastes including one or more acids, or acid-forming components for silicon semiconductor devices and photovoltaic cells. | 2011-03-10 |
20110057315 | MEMORY DEVICE PERIPHERAL INTERCONNECTS - An integrated circuit memory device, in one embodiment, includes a substrate and first and second inter-level dielectric layers successively disposed on the substrate. One or more contacts in the peripheral extend through the first inter-level dielectric layer to respective components. One or more vias and a plurality of dummy vias extend through the second inter-level dielectric layer in the peripheral area. Each of the one or more peripheral vias extend to a respective peripheral contact. The peripheral dummy vias are located proximate the peripheral vias. | 2011-03-10 |
20110057316 | COPPER WIRING LINE OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - A copper wiring of a semiconductor device is which is resistant to unwanted diffusion of copper from away from the copper wiring is presented. The copper wiring includes an interlayer dielectric, a self-assembly monolayer, a plurality of catalyst particles, a metal layer, and a copper layer. The interlayer dielectric on the semiconductor substrate has a wiring forming region. The self-assembly monolayer is the wiring forming region. The plurality of catalyst particles are adsorbed onto the surface of the self-assembly monolayer. The metal layer is formed on the self-assembly monolayer which has the adsorbed catalyst particles such that the metal layer serves as both a seed layer and as a diffusion barrier. The copper layer substantially fills in the wiring forming region. | 2011-03-10 |
20110057317 | Contact plug structure, semiconductor device, and method for forming contact plug - A contact plug structure formed on a contact hole of an insulating layer of a semiconductor device includes a metal silicide layer formed on a bottom part of the contact hole of the insulating layer, a manganese oxide layer formed on the metal silicide layer in the contact hole, and a buried copper formed on the manganese oxide layer which substantially fills the contact hole. | 2011-03-10 |
20110057318 | Die Package - A die is packaged. The package of the die has a line groove filled with a conductive material. A metal pad is exposed out of a solder mask. And the metal pad is connected with a die pad on the die through the line groove in a deflective way. In this way, a wiring space of a wafer is efficiently used; and a manufacturing yield of the wafer is enhanced. | 2011-03-10 |
20110057319 | ARRANGING THROUGH SILICON VIAS IN IC LAYOUT - A portion of an IC layout that includes a plurality of through silicon vias (TSVs) is evaluated to identify linearly aligned TSVs. The portion of the IC layout is modified to reduce a number of the linearly aligned TSVs, resulting in less wafer breakage. | 2011-03-10 |
20110057320 | SEMICONDUCTOR INTEGRATED CIRCUIT AND DESIGN METHOD THEREOF - In a layout process of a semiconductor integrated circuit, a power supply is initially formed in an arrangement in which the current threshold value is not exceeded. In a case where the excess over the current threshold value occurs after the power supply is formed, the power supply arrangement is changed according to the current threshold value, design rule data base, and power supply wiring density so as not to exceed the current threshold value. | 2011-03-10 |
20110057321 | 3-D MULTI-WAFER STACKED SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A 3-D multi-wafer stacked semiconductor structure and method for manufacturing the same. The method comprises steps of: providing a first wafer, a first circuit layer being formed on a surface thereof; bonding the first circuit layer with a carrier; performing a first thinning process on the first wafer; forming a first mask on the other surface of the thinned first wafer; providing a second wafer, a second circuit layer being formed on a surface thereof; bonding the second circuit layer with the first mask; and forming at least a through via filled with a conductor to electrically connect a first connecting pad on the first circuit layer and a second connecting pad on the second circuit layer. | 2011-03-10 |
20110057322 | CARBON NANOTUBE INTERCONNECT AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a carbon nanotube interconnect includes a first interconnection layer, an interlayer dielectric film, a second interconnection layer, a contact hole, a plurality of carbon nanotubes and a film. The interlayer dielectric film is formed on the first interconnection layer. The second interconnection layer is formed on the interlayer dielectric film. The contact hole is formed in the interlayer dielectric film between the first interconnection layer and the second interconnection layer. The carbon nanotubes are formed in the contact hole. The carbon nanotubes have a first end connected to the first interconnection layer and a second end connected to the second interconnection layer. The film is formed between the interlayer dielectric film and the second interconnection layer. The film has a portion filled between the second ends of the carbon nanotubes. | 2011-03-10 |
20110057323 | PACKAGING STRUCTURE HAVING EMBEDDED SEMICONDUCTOR ELEMENT AND METHOD FOR FABRICATING THE SAME - A method for fabricating a packaging structure having an embedded semiconductor element includes: providing a substrate having opposite first and second surfaces and at least an opening region predefined on the first surface; forming a first metallic frame around the periphery of the predefined opening region on the first surface; forming at least an opening inside the first metallic frame by laser ablation; disposing a semiconductor chip in the opening; forming a first dielectric layer on the first and second surfaces and the chip; forming a first wiring layer on the first dielectric layer of the first surface; and forming a first built-up structure on the first dielectric layer and the first wiring layer of the first surface. The invention can precisely control the shape of the opening through the first metallic frame around the periphery of the predefined opening region, thereby allowing the chip to be precisely embedded in the substrate. | 2011-03-10 |
20110057324 | Structure And Method Of Making Interconnect Element Having Metal Traces Embedded In Surface Of Dielectric - An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns. | 2011-03-10 |
20110057325 | CHIP-SIZE DOUBLE SIDE CONNECTION PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A low resistance metal is charged into holes formed in a semiconductor substrate to thereby form through electrodes. Post electrodes of a wiring-added post electrode component connected together by a support portion thereof are simultaneously fixed to and electrically connected to connection regions formed on an LSI chip. On the front face side, after resin sealing, the support portion is separated so as to expose front face wiring traces. On the back face side, the semiconductor substrate is grounded so as to expose tip ends of the through electrodes. The front face wiring traces exposed to the front face side and the tip ends of the through electrodes exposed to the back face side are used as wiring for external connection. | 2011-03-10 |
20110057326 | METHOD FOR FORMING THROUGH ELECTRODE AND SEMICONDUCTOR DEVICE - An electrode on a first surface of a semiconductor substrate and a second surface of the semiconductor substrate are connected with each other by a through electrode. A through hole is formed through the semiconductor substrate from the second surface of the semiconductor substrate to an interlayer insulating film on the first surface, and an insulating film is formed on a side surface and a bottom surface of the through hole as well as on the second surface of the semiconductor substrate, so that by simultaneously etching the insulating film on the bottom surface of the through hole and the interlayer insulating film, thus formed, the through hole is formed so as to reach the electrode on the first surface of the semiconductor substrate. | 2011-03-10 |
20110057327 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a first wiring hoard, a second semiconductor chip, and a second seal. The first wiring board includes a first substrate, a first semiconductor chip, and a first seal. The first semiconductor chip is disposed on the first substrate. The first seal is disposed on the first substrate. The first seal surrounds the first semiconductor chip. The first seal has the same thickness as the first semiconductor chip. The second semiconductor chip is stacked over the first semiconductor chip. The first semiconductor chip is between the second semiconductor chip and the first substrate. The second semiconductor chip is greater in size in plan view than the first semiconductor chip. The second seal seals at least a first gap between the first semiconductor chip and the second semiconductor chip. | 2011-03-10 |
20110057328 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed. | 2011-03-10 |
20110057329 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE - It is desired to provide an electronic device which can be easily taken out of a mold after resin sealing processing. The electronic device includes: an insulating layer; a wiring layer formed on a surface of the insulating layer; a first solder resist formed to cover the insulating layer and the wiring layer and including a particle of a first elastomer; and a second solder resist formed to cover a surface of the first solder resist. A surface of the second solder resist has smaller adhesive strength than the surface of the second solder resist at a glass transition point of the first elastomer. | 2011-03-10 |
20110057330 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - It is desired to provide an electronic device which can be easily taken out of a mold after a resin sealing processing. The electronic device include: an insulating layer; a wiring formed on the insulating layer; and a solder resist layer formed to cover the insulation layer and the wiring and including particles of an elastomer. An asperity is formed on a surface of the solder resist layer. | 2011-03-10 |
20110057331 | THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE - An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J/mm | 2011-03-10 |
20110057332 | SEMICONDUCTOR CHIP WITH CONDUCTIVE ADHESIVE LAYER AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor chip with a conductive adhesive layer including steps of: forming a conductive adhesive layer on back side of a wafer on which a semiconductor element is formed; laminating a flexible substrate on back side of the conductive adhesive layer; forming a dicing groove which reaches from a front of the wafer to the conductive adhesive layer and a bottom of which is in the conductive adhesive layer; pressing from back side of the flexible substrate in such a way that the conductive adhesive layer is cut with the dicing groove as an origin point; and separating the flexible substrate from the conductive adhesive layer. | 2011-03-10 |
20110057333 | METHOD FOR THE REAL-TIME MONITORING OF INTEGRATED CIRCUIT MANUFACTURE THROUGH LOCALIZED MONITORING STRUCTURES IN OPC MODEL SPACE - The present disclosure relates to a method of controlling the manufacturing of integrated circuits, comprising steps of determining parameters that are characteristic of a curve of radiation intensity applied to a semiconductor wafer through a mask, in critical zones of structures to be formed on the wafer, for each of the critical zones, placing a measuring point in a multidimensional space each dimension of which corresponds to one of the characteristic parameters, placing control points in the multidimensional space that are spread around an area delimited by the measuring points, so as to delimit an envelope surrounding the area, for each control point, defining control structures each corresponding to a control point, generating a mask containing the control structures, applying a process involving the generated mask to a semiconductor wafer, and analyzing the control structures transferred to the wafer to detect any defects therein. | 2011-03-10 |
20110057334 | DEVICE FOR INSERTING GAS BUBBLES INTO A LIQUID - The invention relates to a device ( | 2011-03-10 |
20110057335 | Wetted wall venturi scrubber with a 2-stage venturi throat - A venturi scrubber which avoids clogging in the throat by dust particles is developed. The scrubber includes a venturi tube, two scrubbing fluid conduits and a storage tank. The venturi tube has a converging section, a diverging section and a throat section which is connected between the converging section and the diverging section. The scrubbing fluid conduit has a top end connected with the bottom end of the converging section of the venturi tube, and a bottom end extending into the storage tank. Thereby, scrubbing fluid can be guided directly into the storage tank without passing through the throat section. As a result, the clogging of dust particles on the converging section of the venturi throat can be minimized and the abnormal increase in the pressure drop of the air flow through the throat can also be avoided. | 2011-03-10 |
20110057336 | CONTROL OF SURFACE ROUGHNESS AND PATTERNS BY LIGHT ORIENTATION - A method of forming an optical device having secondary surface features thereon includes disposing a photopolymerizable material between a first substrate and a second substrate such that a rear surface of the photopolymerizable material contacts the first substrate and a front surface of the photopolymerizable material contacts the second substrate, the first substrate being a compliant substrate; and irradiating the photopolymerizable material from the front surface thereof using collimated light so as to induce at least partial polymerization of the photopolymerizable material, wherein the secondary surface features are formed at the rear surface of the photopolymerizable material. | 2011-03-10 |
20110057337 | PLASTIC CASTINGS MOLDS - The invention is concerned with the problem that with known plastic casting moulds, especially those of polypropylene, the lenses produced with these moulds have a slippery surface. The invention solves this problem through the use of polymers which are notable for their very low oxygen permeability. | 2011-03-10 |
20110057338 | SEMI-CONTINUOUS TWO-COMPONENT METHOD FOR OBTAINING A COMPOSITE EXPLOSIVE CHARGE WITH POLYURETHANE MATRIX - The present invention relates to a semi-continuous method for obtaining a composite explosive charge comprising a solid polyurethane matrix loaded with a charge, the charge being in powder form and comprising at least one nitro-organic explosive. The said method comprises the following successive steps: | 2011-03-10 |
20110057339 | Polymer Blend-Bioceramic Composite Implantable Medical Devices - Methods and devices relating to polymer blend/bioceramic composite implantable medical devices are disclosed. | 2011-03-10 |
20110057340 | SELF-REPAIRING COMPOSITION, SELF-REPAIRING MATERIALS, SELF-REPAIRING METHODS AND APPLICATIONS - The invention relates to a micro-encapsulated self-repairing polymerizable composition that comprises at least one selected polymerizable compound to be integrated into organic, inorganic or composite materials for the self-repairing of damages incurred in the use conditions thereof, characterised in that micro-encapsulated polymerizable composition is integrated alone into said materials and, after the release of the microcapsule and in the absence of a catalyst, spontaneously polymerises in the presence of a polymerisation-triggering agent that is absent in said materials but naturally occurs during the use thereof, thus repairing said damages. | 2011-03-10 |
20110057341 | WASTE TREATMENT METHOD AND CORRESPONDING DEVICE - The present invention relates to a recycling process for recycling fiber-reinforced and/or fiber based semi-finished products and/or components for later use in the production of fiber-reinforced and/or fiber based semi-finished products and/or components, wherein the semi-finished products and/or components are comprised of fibers and a matrix material, and the fibers are arranged in the matrix material in the form of a fabric, unidirectional layers and/or plies and/or individual reinforcing fibers and/or reinforcing fiber bundles, and further, a device for carrying out the recycling process. | 2011-03-10 |
20110057342 | METHOD AND DEVICE FOR INSTALLING AND/OR REMOVING BLOW MOULDS - A method for removing blow moulds from a forming device for transforming plastic preforms into plastic containers may include arranging a multi-piece blow mould on a blow mould carrier. The method may include separating the blow mould in at least partly assembled state from the blow mould carrier. | 2011-03-10 |
20110057343 | METHOD AND DEVICE FOR BLOW MOLDING CONTAINERS - A method for blow molding containers in blow molds of a device operated with the recovery of air from the blow molds, where operation is accomplished consecutively in a preblow stage with a low pressure and at least two further blow stages with respective higher pressures, and where subsequently, in a recovery phase with several pressure stages, air is fed from the respective blow mold, air from the blow mold is first fed into the volumes allocated to the preblow stage, with priority over a feeding at least into the volume allocated to the pressure stage following the preblow stage. Further, a blow control and a control means for the pressure in the volume, where the blow control has a program section for primarily feeding air first into the volume, and possibly for limiting the pressure in the volume to a multiple of the pressure. | 2011-03-10 |
20110057344 | METHOD AND DEVICE FOR THE MOLDING OF PLUGS AS PART OF A PIPE CONNECTION - The invention relates to a device for the molding of plugs as part of a pipe connection and a method used for the device, wherein the pipe connection is constructed as a sealing plug-in connection with a connecting piece and a plug that can be locked with the connecting piece, wherein the plug exhibits an outer part and an inner part that are connected to each other in a single piece and forms an annular gap on the rear free end. | 2011-03-10 |
20110057345 | IMITATION STONE SIDING SYSTEM - Imitation stone ( | 2011-03-10 |
20110057346 | ART OF USING REGENERATED FIBERS IN MULTI PROCESS NON-WOVENS - Processes for producing non-woven materials from regenerated cotton and other fibers are disclosed. In one embodiment, the processes involve first regenerating cotton fibers from post-consumer or post-industrial waste. These regenerated fibers can be blended with other fibers, and intimately blended to provide a uniform blend of fibers. The fibers can then be subjected to a carding process to orient the fibers, and bound together using mechanical, chemical, or thermal binding processes to form a non-woven material. This material can then be used to form finished goods. | 2011-03-10 |
20110057347 | Process of manufacturing a plastic product with decorated surfaces - A process of manufacturing a plastic product includes selecting natural or synthetic fiber as a material; adhering a thermoplastic resin onto surfaces of the material to form a thin film thereon by soaking or heating; heating the thin film; forming two releasable films on upper and lower surfaces of the thin film respectively; cutting the thin film into thin film units; heating and pressing the thin film units to form cured thin film units; applying one of the cured thin film units onto an inner surface of a first mold; further heating and pressing the cured thin film unit to form a thin film structure; placing the thin film structure inside a second mold; and injecting a thermoplastic material into the second mold to adhere onto an outer surface of the thin film structure to produce the finished plastic product. | 2011-03-10 |
20110057348 | Method and System for Processing A Headliner - A method for processing a headliner, comprising the steps of forming a headliner having an edge, removing excess material from at least a portion of the edge to define a trimmed edge portion and sealing off at least a portion of the trimmed edge portion. | 2011-03-10 |
20110057349 | PHOSPHITE STABILIZERS FOR IONOMERIC POLYESTER COMPOUNDS - The use of oxidizable phosphorus or phosphorous stabilizers, such as the phosphites, to reduce the color formation of the ionomeric polyester compositions is disclosed. | 2011-03-10 |
20110057350 | Method and Device for Making a Reinforcement by Winding a Tape on Itself - A device intended for creating a reinforcing strip formed by flattening a tube (t) comprising a first means for dispensing a tape (b) comprising an interleaf (D on one of its faces, at a given linear speed, and a second means comprising two rolls intended to flatten the said tube (t), in which device the said first and second means are able to be set in rotation relative to one another about an axis of rotation (XX′) parallel to the direction (p) in which the tape (b) progresses through the device, so that when the device is operating, the tape (b) is wound in a spiral on itself in contiguous turns to form a tube (t) the axis of which corresponds substantially to the axis (XX′) of rotation of the first means with respect to the second means, characterized in that it comprises a means ( | 2011-03-10 |
20110057351 | METHODS OF PRODUCING SEALING POLYESTER FILM FOR PHOTOVOLTAIC CELL MODULE - A method of producing sealing film for photovoltaic cell module including a layer composed of at least one substance selected from the group consisting of metals, metal oxides, and inorganic compounds; and a polyester film having a thermal shrinkage ratio within (0±2)% at 150° C. in both length-wise and width-wise directions, and difference between the thermal shrinkage ratios at 150° C. in the length-wise and width-wise directions of 2% or less. | 2011-03-10 |
20110057352 | PRESS AND METHOD FOR FORMING A BEAM FROM GLUE-COATED WOOD CHIPS - The invention relates to a press for pressing glue-coated wood chips for forming a beam having at least one substantially U-shaped cross-sectional portion. The press comprises a master tool ( | 2011-03-10 |
20110057353 | Flexible Shutoff Insert Molding - Method and device for sealing an insert in a molded part to avoid the escape of flash, the device includes an upper mold and a lower mold halves that mate together to define a cavity configured to receive the insert. A compressible material is coupled to the lower mold half to facilitate engagement of the inserted workpiece. The lower mold half has a slide, operated by a cam pin in the upper mold half when the upper and lower mold halves mate together. The upper mold half includes an upper plunger having first and second surfaces and a spring is coupled to the mating surface of the upper mold half. The spring compresses the compressible material and engages the inserted workpiece to form a flash barrier along the molding chamber. | 2011-03-10 |
20110057354 | IMPRINTING METHOD AND IMPRINTING APPARATUS - In an imprinting method for transferring a pattern of a mold to a resin coated on a substrate by using an imprinting apparatus including a mold holding unit and a resin coating unit, the resin is coated in n shot areas arranged in a direction parallel to a direction in which the holding unit and the coating unit are arranged where n is an integer equal to or greater than 2, and the pattern is transferred to the shot areas on a one-by-one basis. A distance D between the coating unit and the mold and a width W of each shot area as seen in the direction parallel to the direction in which the holding unit and the coating unit are arranged are selected so as to satisfy a condition D>(3/2−1/n)W, and the coating and the transferring are performed repeatedly on the substrate. | 2011-03-10 |
20110057355 | Injection Moulding Process For Making Parts Using A Polypropylene Composition Comprising Calcium Carbonate - An injection moulding process for making parts, comprising the steps of: providing molten polypropylene composition comprising particulate CaCO | 2011-03-10 |
20110057356 | Setting Laser Power For Laser Machining Stents From Polymer Tubing - Laser machining polymer tubing sections to form stents such that the power of the laser machining is adjusted for each tubing section to obtain repeatable strut widths for stents formed from different tubing sections is disclosed. A threshold power for laser machining each section is determined and the power used for machining each section is based on the threshold power. | 2011-03-10 |
20110057357 | DEVICE FOR CONVERTING MATERIALS USING INDUCTION HEATING AND DEFORMABLE COMPACTING MEANS - A heating device for the transformation of a material, includes: a lower mold element or matrix, made of an electrically conductive material and having a molding zone for contacting with the material to be transformed; an upper element that lacks a molding zone, made of an electrically conductive material; inductor elements for generating a magnetic field that envelops the matrix and the upper element, with the matrix and the element being electrically insulated from one another during the induction heating phase so that the surfaces opposite these two elements delimit an air gap in which the magnetic field that induces currents circulates at the surface of the molding zone of the matrix, thus making it possible to localize the action of the inductors at the interface of the molding zone/material to be transformed; and deformable pressure element, arranged between the matrix and the upper element, able to exert uniform pressure on the material to be transformed. | 2011-03-10 |
20110057358 | METHOD OF PRODUCTION OF SOLID AND POROUS FILMS FROM PARTICULATE MATERIALS BY HIGH HEAT FLUX SOURCE - A method for producing a solid and/or porous film Includes preparing a suspension of solid particles in a solvent and spreading the suspension as a uniform layer of powder particles on a high melting point support. The solvent is eliminated so as to dry the uniform layer of powder particles into a dried porous uniform layer and surface melting/sintering of the dried uniform layer is carried out by direct contact with a concentrated heat source having a controlled gas composition so as to melt/sinter the layer into a solid/porous film. | 2011-03-10 |
20110057359 | Manufacturing method for an article of photo-curing compose resin - A manufacturing method for an article of photo-curing compose resin includes the following steps. First step is providing a plastic article with an upper surface and a bottom surface, a photo-curing compose resin, an ink layer, and a plastic material. Second, coating the photo-curing compose resin on the upper surface of the plastic article. Third, pressing and curing the photo-curing compose resin to form a plurality of patterns. Fourth step is shaping the plastic article with the patterns. Fifth step is coating the ink layer on the bottom surface of the plastic article. At the sixth step is injecting the plastic material to attach the plastic material with the ink layer. | 2011-03-10 |
20110057360 | METHOD OF DEPOSITING MATERIAL - A method for depositing material at an intersection region ( | 2011-03-10 |
20110057361 | PROCESS FOR MAKING A STRETCH-BLOW MOULDED CONTAINER HAVING AN INTEGRALLY MOULDED HANDLE - The present invention relates to a process for making a container having an integral handle, comprising the steps of:
| 2011-03-10 |
20110057362 | METHOD AND DEVICE FOR BLOW MOLDING CONTAINERS - A method for blow molding containers having cross-sections of a non-circular shape from preforms, in which a temperature profile varying at least in the circumferential direction of the preform is produced by means of at least one heat transfer element, for which purpose the preform and at least the heat transfer element are oriented toward one another by a relative rotational movement in the circumferential direction of the preform, the heat transfer element is rotated relative to the stationary preform about a heat transfer element axis during the relative rotational movement. Further, a device for blow molding such containers where the heat transfer element and the holder are rotatable about a heat transfer element axis and are coupled with a rotational drive. | 2011-03-10 |
20110057363 | MELT-EXTRUDED ARTICLES WITH SMOOTH SURFACES - The present invention relates to the field of copolyester elastomer compositions for manufacturing articles by melt extrusion processes at high extrusion rate, which articles exhibit higher quality smooth surface appearance than the articles made from compositions of the state of the art. | 2011-03-10 |
20110057364 | SYSTEM, METHOD, AND APPARATUS FOR POURING CASTING MATERIAL IN AN INVESTMENT CAST - An apparatus for bottom pouring into an investment cast includes a container that holds a melted casting material, where the container moves from a first container position to a second container position. In the first container position, holes on a stationary nozzle are not exposed to the interior of the container, and the melted casting material remains in the container. In the second container position, holes on the stationary nozzle are exposed to the interior of the container, and the melted casting material flows out the bottom of the container through the stationary nozzle. A temperature detection device determines the temperature of the melted casting material, and a heating device heats the melted casting material to a specified temperature. | 2011-03-10 |
20110057365 | APPARATUS FOR BRACING OF SHEET-METAL JOINTS IN A HIGH-TEMPERATURE ANNEALING FURNACE - An apparatus is described for bracing of sheet-metal joints ( | 2011-03-10 |
20110057366 | AXIALLY DAMPED HYDRAULIC MOUNT ASSEMBLY - A hydromount assembly includes a first fluid chamber and a second fluid chamber that communicate with one another through an inertia track. The inertia track is interposed between the first and second fluid chambers, and is used as a fluid actuating plunger to move relative to at least one of the first and second chambers in response to vibration to pump fluid from the first chamber to the second chamber, and vice versa, through the inertia track. An opening extends through the first and second fluid chambers and the inertia track and receives a shaft therein. The inertia track is secured to the shaft so that axial movement of the shaft results in axial movement of the inertia track. Elastomeric portions of the hydromount may be differently tuned from one another. The center mount hydromount may be selectively assembled with a body mount, or the body mount integrated into the hydromount whereby the center mount arrangement increases the functionality of the damper. | 2011-03-10 |
20110057367 | ACTIVE VIBRATION DAMPER AND METHOD OF MANUFACTURING ACTIVE VIBRATION DAMPER - An active vibration damper including: an inner shaft member provided to a movable member; an outer tube member provided to a stator; a pair of leaf springs elastically connecting axially both sides of the inner shaft member and the outer tube member so as to make a linear actuator operatable by itself; an elastic connecting rubber connecting the inner shaft member and the outer tube member; a mass body holding portion provided to the inner shaft member for holding an additional mass body that is disposed further outwardly than the elastic connecting rubber; and a housing having a structure dividable in an axial direction in which respective openings are secured to each other with an annular seal being interposed therebetween at an outer peripheral side of the elastic connecting rubber. | 2011-03-10 |
20110057368 | SPRING - The first corner portion elastically deforms in application of load such that the angle of the first corner portion changes depending on the pressing force from the first member. In this case, the first corner portion can move toward the outside of the inner periphery portion of the main body portion while the angle changes. The second corner portion has the same function as that of the first corner portion, and it can move toward the outside of the outer periphery portion of the main body portion while the angle changes depending on the pressing force from the second member in the elastic deformation of the second corner portion. As a result, the spring can prevent generation of hysteresis in load characteristics without increasing the number of parts, and enables height adjustment of the spring. | 2011-03-10 |
20110057369 | Plastic Spring For A Motor Vehicle Chassis - A plastic spring having a corrugated tubular body with connection surfaces at its ends for transmitting force between two structural component parts which are movable relative to one another. A connection surface of the plastic spring is constructed as a tubular body which engages in a cup element of one of the supporting structural component parts. The cup element can be filled with a displacement mass, and the tubular body accordingly carries out a displacing movement within the cup element for axially adjusting the preloading of the plastic spring. | 2011-03-10 |
20110057370 | CUSHION DEVICE AND MOTORCYCLE - A cushion device includes a shock absorber and an accumulator. As a piston moves in a certain direction in a cylinder so that the shock absorber is compressed, oil in an oil chamber is discharged to the accumulator through an oil hose. The compression operation of the piston allows a slide member to slide and the capacity of an oil chamber is reduced. The oil in the oil chamber is discharged to a regulation unit through an oil hose. The regulation unit controls a valve by the pressure of the oil coming in from the oil chamber and applies resistance to the oil discharged from an oil chamber to an oil chamber. | 2011-03-10 |
20110057371 | Suspension Mechanism - An improved suspension unit which is quite and compact is revealed. The suspension unit includes a hanger member having a load bearing portion and a front face with an aperture and a control arm having a front face with an aperture and a load bearing portion. The control arm is pivotally attached to and depends from the hanger such that the front face of the hanger and the front face of the control arm are opposed one another with the aperture on the front face of the hanger being aligned with the aperture on the front face of the control arm and with the load bearing portion of the hanger positioned above the load bearing portion of the control arm. A jounce spring and a rebound spring are coaxially mounted to a shaft having opposite first and second ends, the shaft being mounted through the aperture of the front face of the hanger and the aperture of the front face of the control arm, the rebound spring being positioned between the front face of the hanger and the front face of the control arm, the jounce spring being positioned to one side of both the front face of the hanger and the front face of the control arm. | 2011-03-10 |
20110057372 | DEVICE FOR FIXING OR MANIPULATING OBJECTS - A device for the temporary fixing or manipulation of objects including a first head with a front active face and a rear active face and a second head with a front active face and a rear active face. The front and rear active faces of the first head are movable relative to one another and the front and rear active faces of the second head are movable relative to one another. The rear active face of the first head is immovably connected to the front active face of the second head. The device also includes a force mechanism for introducing an active force to the first and second heads. | 2011-03-10 |
20110057373 | WORK INSPECTOR AND CARRIER - A work inspector and carrier according to the present invention includes a carrier unit ( | 2011-03-10 |
20110057374 | Worktable and Its Mounting Structure - A worktable includes a first platform made of metal, a mounting structure fixed to the first platform and being utilized to mount the first platform on a machine, and at least one second platform made of granite and detachably joined to a lateral peripheral edge of the first platform and connected to the mounting structure in order to prevent the at least one second platform from disengagement from the first platform. Additionally, the first platform includes a first top side and the at least one second platform includes a second top side cooperating with the fist top side to form a flat surface, and with the flat surface adapted to allow a workpiece that is moved thereon to be manufactured precisely. | 2011-03-10 |
20110057375 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle in which printed sheets are bundled, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, and a fold reinforcing unit configured to reinforce the fold line formed by the fold unit, the fold reinforcing unit includes a roller unit that includes a reinforce roller with a structure for preventing an occurrence of a wrinkle, and moves along a direction of the fold line while applying pressure by the reinforce roller to the fold line of the sheet bundle transported from the fold unit, and a drive unit configured to move the roller unit along the direction of the fold line from a standby position located at a position separate from an end of the sheet bundle. | 2011-03-10 |
20110057376 | SHEET PROCESSING APPARATUS AND SHEET PROCESSING METHOD - There is provided a technique which can greatly improve throughput at the time when, after a folding process is performed to a bundle of sheets, the bundle of sheets subjected to the folding process is transported to a downstream side, and can prevent a wrinkle from occurring in the bundle of sheets at the time of the folding process. A sheet transport speed of a pair of rollers is changed from a first transport speed to a second transport speed at a specified timing between when a folding blade finishes a pressing operation of the bundle of sheets and starts a return operation to a waiting position and when a rear edge of the bundle of sheets pressed into a nip of a pair of rollers by the folding blade passes through the nip of the pair of rollers. | 2011-03-10 |
20110057377 | APPARATUS AND METHOD FOR SEALING PAPER WITH PASTE - An apparatus for sealing paper with paste includes a paper-feeding unit, a pasting main body which seals open ends of a sheet of paper by an adhesive, and a paper-receiving unit on which the sealed sheets of paper are loaded. The pasting main body includes an opening mechanism which opens a closed sheet of paper, an adhesive applying mechanism which applies a peelable temporary adhesive in a streaky form to a lower folded piece of the opened sheet of paper, a sealing mechanism which superposes an upper folded piece on the lower folded piece, and which temporarily adheres the open ends of the upper and lower folded pieces, and a conveying mechanism. | 2011-03-10 |
20110057378 | SHEET PROCESSING APPARATUS AND SHEET PROCESSING METHOD - There is provided a technique in which a retracting operation of a bundle of sheets from a stapler after a staple process can be stably performed irrespective of the number of sheets constituting the bundle of sheets or the transport resistance. When the bundle of sheets subjected to the staple process is moved by a stacker in a direction of retracting from the stapler, an alignment roller is caused to come in contact with the bundle of sheets held by the stacker and to assist the movement of the bundle of sheet. | 2011-03-10 |
20110057379 | RECORDING APPARATUS - A recording apparatus according to an aspect of the invention includes a sheet feeding cassette that can accommodate a stack of recording materials; a pick-up roller that comes into contact with the top recording material of the recording materials accommodated in the sheet feeding cassette to feed the recording material; a roller holder that is supported at a base end so as to be rotatable and has the pick-up roller at a tip, the pick-up roller being pressed against the recording material; and a lever that is supported at a base end so as to be rotatable and has a pressing portion at a tip, the pressing portion being pressed against the recording material. The lever is disposed on the roller holder and is supported coaxially with the roller holder. | 2011-03-10 |
20110057380 | IMAGE FORMING APPARATUS - Disclosed is an image forming apparatus that includes an image forming unit that forms an image and a conveyance unit that conveys a medium to be recorded opposing the image forming unit. The conveyance unit includes a platen member that guides the medium to be recorded and has plural suction holes formed therein, plural air chambers that the plural suction holes formed in the platen member face, and plural suction units that suction air inside the plural air chambers through the suction holes. At least two or more of the plural air chambers are arranged in a direction crossing a conveyance direction of the medium to be recorded. One of the plural air chambers is connected to one of the plural suction units, and one or two or more of the plural air chambers is connected to at least one of the plural suction units. | 2011-03-10 |
20110057381 | INSERT FEEDER APPARATUS - A sheet separator for a paper handling apparatus comprising: a pick-up shaft having an axis; a plurality of pick-up wheels mounted on the shaft for rotation about the axis; and wherein the axial location, on the pick-up shaft, of at least one pick-up wheel is adjustable. | 2011-03-10 |
20110057382 | RECORDING APPARATUS AND DRIVING CONTROL METHOD THEREOF - Provided is a recording apparatus including: a holding tray which is inserted in a transportation path facing a recording head, and is capable of holding a recording medium on a front surface thereof, the holding tray having a plane area used to horizontally hold the recording medium and a sloped area provided in a rear end in a transportation direction and inclined toward a rear surface thereof as it becomes closer to a rear edge; a driving roller which comes into contact with the rear surface of the holding tray; a driven roller which comes into contact with the front surface of the holding tray and pinches the holding tray between the driving roller and the driven roller; and a control device which controls the driving roller in response to the case of transporting the plane area of the holding tray and the case of transporting the sloped area thereof. | 2011-03-10 |
20110057383 | MEDIUM PROCESSING APPARATUS - According to one embodiment, a medium processing apparatus includes a support axis and height-adjusting pins. The support axis movably supports a printer unit so that a front end of a conveying path is moved upward and downward. The height-adjusting pins are installed on a moving end of the printer unit. The height-adjusting pins are inserted to be guided into slit portions of brackets of a front panel by the sliding movement of any one of the front panel and the printer unit, thereby moving the printer unit around the axis and positioning the front end of the conveying path with respect to a medium inlet of the front panel. | 2011-03-10 |
20110057384 | METHOD FOR THE OPTIMAL ALIGNMENT OF VENEER SHEETS AT A LAY-UP STATION - The invention relates to a method for the optimal positioning of veneer sheets at a lay-up station, wherein the veneer sheets are attached for a veneer assembly composed of veneer sheets glued on top of each other. The method comprises determining an optimal position for each veneer sheet and a location for virtual alignment edges and laying up the veneer sheets as positioned in accordance with the virtual alignment edges, for a veneer assembly. | 2011-03-10 |
20110057385 | HITTING GAME MACHINE AND METHOD FOR MULTIPLE PERSONS - The present invention relates to a hitting game machine and method for multiple persons. The hitting game machine includes a rotating circular plate, a plurality of targets, hitting object guides installed to cover sections, target sensing units provided for respective sections, display units for displaying free gifts, and target erection units. Accordingly, the present invention is advantageous in that a plurality of game players can selectively fell targets in consideration of the rotating speed of the circular plate and the descending speed of hitting objects, thus increasing interest in the game. | 2011-03-10 |
20110057386 | Enhanced Reel Strip And Method For Assembling Same - An enhanced reel strip includes a base reel strip and an overlay strip, wherein the base reel strip has symbols applied thereto and the overlay strip has designated portions thereof removed to create cut-outs. The base reel strip and overlay strip are affixed in such a manner that the symbols of the base reel strip are visible through the cut-outs of the overlay strip. The joined strips produce an enhanced reel strip. Furthermore, these enhanced reel strip production methods dramatically improve the quality and appearance of reel strips while utilizing a relatively simple manufacturing process that maintains cost effectiveness. | 2011-03-10 |
20110057387 | Cylinder cube - A cylinder cube in one embodiment includes a disc base having an extending threaded shank; four cylindrical units each rotatably put on the shank and comprising four lengthwise sliding faces spaced around an outer surface, and four lengthwise sliding grooves each formed between two sliding groove; a plurality of arc shaped sliding blocks each comprising a lengthwise dovetail on an inner surface fit into the sliding groove; a cylindrical manipulation block rotatably put on the shank and comprising a lengthwise sliding recess on an outer surface and two lengthwise troughs on both sides of the sliding recess, the troughs and the sliding recess together forming a shape complementary to a shape of the sliding block, and the manipulation block sized as a combination of the unit and the sliding blocks assembled thereon; and a disc head threadedly secured to the shank. | 2011-03-10 |
20110057388 | Chosun prophecy game - The Chosun Prophecy Game is a unique fortune-telling game which incorporates the ancient Chinese philosophy of the I Ching with concepts of the Tarot. The game consists of sixteen sets of eight different I Ching trigram cards, in which two sets or sixteen trigrams are randomly selected and then placed, by eight randomly picked Chosun Prophecy Coins, into eight specific prognosticative sites, filling both the upper and lower sections of each, forming a pattern of eight hexagrams on the game board. A psychic reading is formulated by relating the I Ching context of the eight unified hexagrams with specific line analysis to their game board inscriptions as this data applies to the query. | 2011-03-10 |
20110057389 | FINANCIAL BOARD GAME - A financial board game for use with a targeted population subset, typically including at least one child, is disclosed. The board game includes a board indicating at least one path including a plurality of spaces, wherein each space represents a single playing piece step, wherein each space corresponds to at least one color of a plurality of colors, a plurality of cards, wherein each card specifies at least one financially related question, each of the plurality of cards corresponding to at least one color of the plurality of colors, a plurality of pieces, wherein each pieces represents a player or a plurality of players, each of the plurality of pieces corresponding to at least one color of the plurality of colors, each of the plurality of pieces corresponding to the color of the start position, and a dice or die to generate random criteria for advancing each of the plurality of pieces. | 2011-03-10 |
20110057390 | PLAYER ELECTIVE COMBINATION CARD GAME APPARATUS AND METHOD - A method is disclosed for a player elective combination card game. In one exemplary method, player elects participation in first card game and/or second card game prior to any cards being dealt by placing respectively a first or second wager. Player dealt two cards face up responsive to player providing first wager or second wager. Dealer dealt one card face up responsive to player providing first wager or second wager. To evaluate if winning combination results, player's first hand formed of two cards face up to player and one card face up to dealer is evaluated against odds payout scheme. Player's second hand formed with two cards face up to player. Player requests successive hits of one or more cards dealt to player's second hand in response to player providing second wager until player anticipates win against dealer's hand that includes one card face up to dealer or goes bust. | 2011-03-10 |
20110057392 | ACOUSTIC BAFFLE - A heat expandable baffle having a shape corresponding to, but smaller than, the shape of the cross section of a cavity to be sealed, and comprising a rigid support plate, a carrier for a heat expandable material and a heat expandable material mounted only to the outer periphery of the carrier. When activated by heating, the expandable material expand radially from the carrier to seal the cross sectional gap between the carrier and the cavity wall. | 2011-03-10 |
20110057393 | HIGH-VACUUM SEAL - The invention relates to an improved O-ring seal for use as a high vacuum seal. A limitation of standard O-rig seals is the permeation of water through the O-ring. Especially for instruments in which parts are kept at a cryogenic temperature, such as a cryogenic electron microscope, the presence of water in the vacuum is a problem, as this results in ice growth on the cryogenic parts. As a solution often a double O-ring seal is used, or a metal seal. Both of these solutions have severe draw-backs. | 2011-03-10 |
20110057394 | SEAL - A seal is inserted into a space to be sealed. First and second end portions of the seal are engaged with first and second end surfaces of the space. The seal is compressed between the first and second end surfaces. The compression strains the seal. The strain includes the rotation of a cross-section of the seal so as to bias the seal into engagement with a surface forming one of an inboard surface and an outboard surface of the space. | 2011-03-10 |
20110057395 | SEAL ELEMENT - A seal element ( | 2011-03-10 |
20110057396 | Air Riding Seal - An improved air-riding seal system for turbine engines is presented. The seal system includes a movable primary seal assembly, a stationary secondary seal assembly, and at least one structure to increase the stiffness of a thin film between the primary seal and a rotating component. The primary seal assembly includes an annular seal ring and an arcuate support arm. The annular seal ring has a cross section that is substantially L-shaped and a surface with a step face and a circumferential dam. The arcuate support arm has a tooth at one end adjacent to an outermost circumferential surface along the seal runner, which could include an optional notch. The tooth and outermost circumferential surface are separated by a gap. The secondary seal ring is disposed between and contacts the primary seal assembly and housing structure so as to form a bore seal and a face seal therewith. A plurality of hydrodynamic pockets disposed along the circumferential dam and/or a plurality of radial dams disposed along the surface in an outward radial arrangement from the circumferential dam are provided to improve the stiffness of the thin film. Features of the invention allow for higher operating speeds. | 2011-03-10 |
20110057397 | Chuck with jaws moved radially outwardly for clamping - The invention relates to a chuck comprising a chuck casing ( | 2011-03-10 |
20110057398 | LOW SWAGE LOAD FASTENING SYSTEM AND METHOD - A collet for a fastener installation tool having a pull section with a fastener engagement end and a plurality of teeth. The teeth include a first tooth with a first inner diameter, and each of the remainder of teeth includes a second inner diameter, the first inner diameter being greater than the second inner diameter. The pull section includes a protrusion extending from the fastener engagement end, thereby extending the length of the pull section. The pull section includes a cross-sectional thickness, wherein the collet is adapted to engage a pin member having a locking portion with a first diameter and a pull portion with a smaller second diameter. An increase in the difference between the first diameter of the locking portion and the second diameter of the pull portion of the pin member allows for a corresponding increase in the cross-sectional thickness of the collet, thereby extending the fatigue life of the tool. | 2011-03-10 |