| 10th week of 2014 patent applcation highlights part 41 |
| Patent application number | Title | Published |
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| 20140063732 | PORTABLE COMPUTER HAVING HEAT DISSIPATION STRUCTURE - A portable computer having a heat dissipation structure includes a main body in which a heat generation device generating heat is arranged, wherein a sealed space that is sealed to prevent intrusion of external water and an exposed space into which external air is taken, a heat transfer unit connected to the heat generation device and extended to the exposed space in the sealing space of the main body and transferring the heat of the heat generation device to the exposed space, and a heat dissipation unit arranged in the exposed space of the main body and dissipating the heat transferred by the heat transfer unit. The intrusion of water into the main body may be prevented and simultaneously the heat generated by the heat generation devices may be efficiently dissipated. Thus, the portable computer may be used even in an inferior outdoor environment during rain. | 2014-03-06 |
| 20140063733 | ELECTRONIC DEVICE WITH FAN - An electronic device includes a mainboard and a fan mounted on the mainboard. The fan includes a stator and a rotor. The rotor includes a hub covering around a periphery of the stator, and a plurality of blades disposed at a periphery of the hub. The stator is directly fixed to and directly electrically connected to the mainboard. | 2014-03-06 |
| 20140063734 | MOUNTING ASSEMBLY - There is disclosed a mounting assembly for structurally mounting a peripheral device to a portable computer. The mounting assembly comprises a bracket arranged to be structurally secured to the portable computer and comprising a first coupling; and a second coupling which in use is attached to or part of the peripheral device. The first and second couplings are arranged to be releasably engaged to form a structural connection, such that in use the peripheral device can be structurally mounted to the portable computer. There is also disclosed a portable computing apparatus comprising a portable computer, a peripheral device and a mounting assembly; and a electronic entry control board for mobile telemetry monitoring apparatus comprising a portable computer, a wireless communication unit and a mounting assembly. | 2014-03-06 |
| 20140063735 | TABLET PERSONAL COMPUTER - Disclosed is a tablet PC. The tablet PC includes a pad main body which includes an input portion for inputting predetermined data, and an output portion for outputting results corresponding to input data; a detachable auxiliary device which is detachably coupled to one side of the pad main body to assist functions of the pad main body; and a fastening unit which is provided in the pad main body and fastens the detachable auxiliary device to the pad main body. With this, it is possible to use various auxiliary functions such as convenience in mobility, physical distribution management, inventory control, payment, personal authentication, etc. | 2014-03-06 |
| 20140063736 | Restricted Breathing Enclosure - An electrical apparatus, comprises a restricted breathing enclosure having an interior cavity, and a temperature regulator having at least an interior sensing portion within the interior cavity, the temperature regulator including a processor responsive to the interior sensing portion to send control signals to a heat transfer portion of the temperature regulator. | 2014-03-06 |
| 20140063737 | COMPACT FRONT TO BACK HORIZONTAL COOLING FOR RACK MOUNTED CHASSIS - An improved electronic communications system and process | 2014-03-06 |
| 20140063738 | HEAT-DISSIPATING TYPE OF POWER CONVERTER - A heat-dissipating type of power converter comprises a support unit, at least one power module, at least one pair of rails and at least one main air duct module corresponding to the at least one power module. The pair of rails are fixed to the support unit and parallel to each other. The power module comprises a mounting plate module, a power unit and a radiator. wherein the power unit is fixed to the radiator, and the mounting plate module and the radiator are fixedly connected to each other. the main air duct module is fixed to the support unit and provided between the pair of rails, a second opening is defined in a side of the main air duct module toward the power module. The power module is assembled with or disassembled from the main air duct module by sliding along the pair of rails. Wherein after the power module is assembled with the main air duct module, the radiator is plugged into the main air duct module through the second opening, the power unit is positioned outside the main air duct module, and the main air duct with a sealed sidewall is defined by the mounting plate module, the radiator and the main air duct module. | 2014-03-06 |
| 20140063739 | HEAT-DISSIPATING SYSTEM FOR HIGH-POWER CABINET AND STATIC VAR COMPENSATION SYSTEM - A heat-dissipating system for high-power cabinet is provided, which comprises: a cabinet; at least one main air duct, which is formed in the cabinet with a first opening and a second opening, and a first heat-generating assembly, a second heat-generating assembly and at least one first fan, which are mounted in the at least one main air duct, wherein the first fan is mounted between the first heat-generating assembly and the second heat-generating assembly; and the outlet of the first fan faces the first heat-generating assembly, airflow enters the main air duct from the first opening of the main air duct, flows through the second heat-generating assembly, an inlet of the first fan, an outlet of the first fan, and the first heat-generating assembly in sequence, and finally is discharged out of the cabinet from the second opening of the main air duct cabinet. | 2014-03-06 |
| 20140063740 | COMMUNICATION MODULE-COOLING STRUCTURE AND COMMUNICATION DEVICE - A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces. | 2014-03-06 |
| 20140063741 | POWER ELECTRONICS SYSTEM WITH LIQUID COOLING SYSTEM - A power electronics system includes a multipart housing having three housing elements of cuboid basic structure to define a central element with inlet and outlet ports for a cooling liquid, an upper and lower cover elements which are arranged on opposite connection surfaces of the central element. A plurality of power electronics switching devices is accommodated in the housing, and a condenser device having condenser connection elements is arranged in the central element of the housing> Further provided is a liquid cooling system having at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element. The upper and lower cooling chambers are configured for circulation of the cooling liquid entering through the inlet port and exiting through the outlet port of the housing. | 2014-03-06 |
| 20140063742 | Thermally Enhanced Electronic Component Packages with Through Mold Vias - Systems and methods for thermally enhanced electronic component packaging with through mold vias are described. In some embodiments, a method may include forming one or more vias through an encapsulant with a laser, each of the one or more vias having one end proximal a top surface of an electronic component covered by the encapsulant and another end proximal an outer surface of the encapsulant. The method may also include inserting a thermally conductive material into the one or more vias, providing a heat spreader over the outer surface of the encapsulant, the heat spreader thermally coupled to the thermally conductive material, and reflowing the thermally conductive material. | 2014-03-06 |
| 20140063743 | METHODS AND SYSTEMS FOR DISSIPATING HEAT IN OPTICAL COMMUNICATIONS MODULES - Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another. | 2014-03-06 |
| 20140063744 | Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance - A power FET ( | 2014-03-06 |
| 20140063745 | HOUSING UNIT WITH HEAT SINK - Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover. | 2014-03-06 |
| 20140063746 | ELECTRONIC DEVICE WITH HEAT DISSIPATION ASSEMBLY - An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board. | 2014-03-06 |
| 20140063747 | COOLING STRUCTURE FOR A SHUNT RESISTOR AND INVERTER APPARATUS USING THE SAME - A cooling structure for a shunt resistor has a semiconductor switching element mounted on a component side of a circuit board, a shunt resistor surface-mounted a solder side of the circuit board, a radiator for releasing heat generated from the semiconductor switching element and the shunt resistor, and an insulating material interposed between the shunt resistor and the radiator and having a high thermal conductivity. | 2014-03-06 |
| 20140063748 | METHOD FOR PRODUCING A CIRCUIT BOARD SYSTEM AND A CIRCUIT BOARD ARRANGEMENT - Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder. | 2014-03-06 |
| 20140063749 | AUTOMATED BANKING MACHINE WITH SLIDE MOUNTED DEVICES - An apparatus including an automated banking machine is operative to cause financial transfers responsive at least in part to data read from data bearing records. The machine includes a card reader that is operative to read card data usable to identify at least one of a user of the machine and a financial account. A computer associated with the machine is operative to cause card data to be read through operation of the card reader, and to cause a determination to be made that read card data corresponds to a financial account authorized to conduct a transaction through the machine. The computer is operative responsive at least in part to the determination to cause the financial account to be at least one of assessed and credited with a value associated with a financial transaction. Transaction function devices of the machine are supported through slides that can be configured in different ways to facilitate mounting of devices within the machine. | 2014-03-06 |
| 20140063750 | HINGE, SUPPORTING MODULE HAVING THE HINGE, AND DISPLAY DEVICE HAVING THE SUPPORTING MODULE - A hinge for pivotally interconnecting first and second brackets includes a shaft having a shaft body extending through the first and second brackets and formed with an engaging end portion proximate to the second bracket, a fixing member connected to the engaging end portion, a ratchet sleeved rotatably on the shaft body between the fixing member and the second bracket, a friction mechanism having an urging unit sleeved on the shaft body between the ratchet and the fixing member and pressing the ratchet toward the second bracket, and a brake mechanism disposed on the second bracket and having a pawl member releasably engaged to the ratchet. | 2014-03-06 |
| 20140063751 | CIRCUIT MODULE - A circuit module includes a circuit board and electronic components mounted on the circuit board. The mounted electronic components include at least one discrimination-target electronic component and at least one module-discrimination electronic component. In addition, the circuit board includes land electrodes allowing the module-discrimination electronic component to be mounted at different positions and/or orientations with respect to the circuit board, and the module-discrimination electronic component is mounted at any one position and/or orientation among different positions and/or orientations with respect to the circuit board in accordance with the type of the discrimination-target electronic component. | 2014-03-06 |
| 20140063752 | SYSTEM AND METHOD OF POWER CONTROL FOR A HIGH-AVAILABILITY SYSTEM - Maintenance of reliable and highly available electronic systems to perform servicing and preventive maintenance may need to be performed without interruption of operations. Removal of circuit cards from a chassis may render the connectors on a chassis vulnerable to inadvertent short circuiting of power sources by stray metallic objects. A configuration where the power is removed from a connector as the circuit card is being extracted eliminates his possibility. The control circuits for the power supply connections and the power supplies are themselves redundant so that they may be similarly serviced. | 2014-03-06 |
| 20140063753 | ELECTRONIC MODULE, ELECTRONIC DEVICE, AND MOBILE UNIT - An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element. | 2014-03-06 |
| 20140063754 | PRINTED-CIRCUIT BOARD ARRANGEMENT FOR MILLIMETER-WAVE SCANNERS - A printed-circuit board arrangement electrically connects the at least one transmitter and/or receiver unit with at least one antenna element, whereas the at least one transmitter and/or receiver unit and the at least one antenna element are at least partially integrated into the printed-circuit board arrangement. In this context, the printed-circuit board arrangement includes different printed circuit boards, which are mechanically connected to one another in a rigid manner. A first part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a first material which is suitable for high-frequency, and a second part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a second material different from the first material, which is still sufficiently suitable for a low frequency and/or for a direct-voltage range. | 2014-03-06 |
| 20140063755 | TERMINAL INCLUDING TOUCH UNIT AND METHOD FOR MANUFACTURING TOUCH UNIT - A terminal includes: a touch unit that includes first electrodes connected in a first diagonal direction, the first diagonal direction being oblique to each side of the touch unit, and a second electrodes disposed in the second diagonal direction which intersects the first diagonal direction, the second diagonal direction being oblique to each side of the touch unit, and a Printed Circuit Board (PCB) configured to receive information generated in response to electric signals from one or more of the first electrodes and the second electrodes. Accordingly, a width of the terminal may be reduced as signal wirings need not be formed at the side surface thereof. | 2014-03-06 |
| 20140063756 | PRINTED CIRCUIT BOARD (PCB), LAMINATING METHOD OF THE PCB AND CHIP ON FLEXIBLE PRINTED CIRCUIT BOARD, AND LCD DEVICE - A laminating method of a chip on flexible printed circuit board (COF) and a printed circuit board assembly (PCBA) includes
| 2014-03-06 |
| 20140063757 | JOINT STRUCTURE OF PACKAGE MEMBERS, METHOD FOR JOINING SAME, AND PACKAGE - According to an embodiment, a joint structure of package members housing or holding an electronic component includes a first member, a second member joined to the first member, and a joint portion provided between the first member and the second member. The joint portion contains a metal element with a melting point of 400° C. or more and the metal element of 98 percent by weight or more. | 2014-03-06 |
| 20140063758 | DUAL SCREEN ELECTRONIC DEVICE AND DETACHABLE DISPLAY MODULE THEREOF - A dual screen electronic device includes a main device having a first casing and a display screen, and a detachable display module. The first casing has a first opening. The display screen is located on the first casing and exposed from the first opening. The detachable display module includes a second casing, a power supply module, an electrophoretic display (EPD) module, and a control module. The second casing is detachably positioned on the first casing, and has a second opening. The power supply module is arranged on the second casing. The EPD module is fixed to the second casing, or is detachably positioned on the second casing, and has a display region exposed from the second opening. The control module is selectively located on the second casing or on the EPD module, and is electrically connected to the EPD module and the power supply module. | 2014-03-06 |
| 20140063759 | DRIP-PROOF STRUCTURE OF ELECTRONIC APPARATUS - A drip-proof structure of an electronic apparatus in which a printed circuit board is fixed to a stud provided on a housing includes a concave portion and/or a convex portion that is provided around the stud on the housing. Therefore, when a liquid, such as a cutting fluid, flows on the housing, the flow of the liquid from the stud to the printed circuit board is prevented by the concave portion and/or the convex portion. | 2014-03-06 |
| 20140063760 | ELECTRONIC DEVICE, MANUFACTURING METHOD AND CONNECTION METHOD - An electronic device includes: a case; a first board that includes a first connector; a positioning section that positions the first board with respect to the case; a second board that includes a second connector; a guide rail that has an end portion on the first board side formed with a fitting port into which the first connector fits, and that guides the second connector towards the first connector that is fitted into the fitting port; a pair of sloping portions formed to edge portions on both guide rail pivot direction sides of the fitting port; and a pair of stoppers respectively disposed at each of the guide rail pivot direction sides so as to restrict the pivot range of the guide rail such that the first connector is insertable between the pair of sloping portions. | 2014-03-06 |
| 20140063761 | OFF-PLANE CONDUCTIVE LINE INTERCONNECTS IN MICROELECTRONIC DEVICES - Off-plane conductive line interconnects may be formed in microelectronic devices. In one example, such as device includes a first set of metal conductive lines in a dielectric substrate at a first horizontal layer of the substrate, a second set of metal conductive lines in the substrate at the first horizontal layer of the substrate and vertically offset from the first set of metal lines, and a dielectric material insulating the metal lines from each other and the first horizontal layer from other horizontal layers. Vias in the dielectric material to connect both the first and second set of metal lines to metal lines at a second horizontal layer of the substrate. | 2014-03-06 |
| 20140063762 | SILVER ALLOY WIRE FOR BONDING APPLICATIONS - A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties:
| 2014-03-06 |
| 20140063763 | WIRING BOARD - A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component. | 2014-03-06 |
| 20140063764 | ELECTRONIC COMPONENT INCORPORATED SUBSTRATE - An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post. | 2014-03-06 |
| 20140063765 | TRANSMISSION SYSTEM AND METHOD FOR CONSTRUCTING BACKPLANE SYSTEM - A through-hole stub AC termination circuit including a resistor and a capacitor, is connected to an open end of a stub of a through-hole provided in a circuit board. | 2014-03-06 |
| 20140063766 | LATERAL ELEMENT ISOLATION DEVICE - Representative implementations of devices and techniques provide isolation between a carrier and a component mounted to the carrier. A multi-layer device having lateral elements provides electrical isolation at a preset isolation voltage while maintaining a preselected thermal conductivity between the component and the carrier. | 2014-03-06 |
| 20140063767 | CIRCUIT DEVICE - A circuit device according to one exemplary embodiment includes a ceramic substrate, a first conductive pattern provided on one face of the ceramic substrate, a second conductive pattern, formed mainly of Cu, which is provided on the other face of the ceramic substrate, and a semiconductor element provided on an island that constitutes the second conductive pattern. An electrode, whose outermost surface is formed mainly of Cu, is provided in the semiconductor element, and the interface between the island and the electrode is directly fixed by solid-phase bonding. | 2014-03-06 |
| 20140063768 | ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INCORPORATED SUBSTRATE - An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate. | 2014-03-06 |
| 20140063769 | Component Mounting Structures with Breakaway Support Tabs - Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations. | 2014-03-06 |
| 20140063770 | METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULTI-PIECE BOARD AND MULTI-PIECE BOARD - A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board. | 2014-03-06 |
| 20140063771 | MOUNT BASE AND ELECTRONIC APPARATUS - A mount base includes: a rotary seat rotatably provided against a stand unit by a shaft member, the shaft member being fixed to the stand unit; a rotary prop that rotates along with the rotary seat; and a cable that goes through a fixing portion provided on the rotary prop and a holding portion provided on the shaft member, and connects a first electronic device attached to a tip side of the rotary prop to a second electronic device attached to the stand unit. | 2014-03-06 |
| 20140063772 | ELECTRONIC APPARATUS - An electronic apparatus includes a main body having a first surface having a display surface, a second surface opposite to the first surface, and a first support disposed between the first surface and the second surface being capable of contacting with a put-on surface; a stand member attached to the main body having a second support being capable of contacting with the put-on surface; and a hinge unit having a hinge rotatably supporting the stand member against the main body between a first rotational position for standing up the main body on the put-on surface and a second rotational position for laying the main body over the put-on surface, and an elastic member disposed at the hinge for adding a rotational force from a second rotational position side to a first rotational position side. | 2014-03-06 |
| 20140063773 | Low-Force Gap-Filling Conductive Structures - Electronic devices may be provided with conductive structures and antennas mounted near a gap between the conductive structures. A conductive member may be used to at least partially fill the gap in order to prevent emission from the antenna from entering the gap and interfering with the operation of the antenna. The conductive gap-filling member may include a conductive outer layer and a non-conductive inner layer. The inner layer may have opposing edge portions that are attached to each other or may be a continuous tubular insulating layer. The outer layer may be a layer of conductive fabric having opposing edge portions that are attached to each other or to opposing edge portions of the inner layer. An edge portion of the outer layer may be attached to a conductive structure. An insulating material may be formed between another edge portion of the outer layer and a second conductive structure. | 2014-03-06 |
| 20140063774 | ELECTROMAGNETIC SHIELD CONFIGURED TO INHIBIT DEFORMATION - An electromagnetic shield is provided, for example for a printed circuit board. A shield lid fits onto a base structure having at least two, more typically four, opposing sidewalls. The lid includes a top portion and a lip extending downward from the top portion to cap the base structure. The lid includes at least one deformation inhibiting feature extending downward from the top portion, for placement near or against an interior portion of a sidewall, for example against an edge of a folded-over sidewall. The deformation inhibiting feature may include one or more half-dimples stamped into the lid. In response to an external force, the deformation inhibiting feature presses against its adjacent sidewall in order to brace the shield lid. This inhibits the base structure from deforming the lip due to outward pressure of a sidewall onto a portion of the lip, located opposite the deformation inhibiting feature. | 2014-03-06 |
| 20140063775 | LIGHTING APPARATUS USED IN PHOTOGRAPHY AND MOBILE ELECTRONIC DEVICE PROVIDED WITH SAME - The present invention includes a light-emitting element, and a reflector including a reflection face that reflects light from the light-emitting element toward a rectangular area to be photographed. The reflection face includes a pair of first refection faces facing each other with the light-emitting element interposed therebetween in a direction corresponding to a long-side direction demarcating the area to be photographed, and a pair of second reflection faces facing each other with the light-emitting element interposed therebetween in a direction corresponding to a short-side direction demarcating the area to be photographed. Furthermore, a height of the second reflection faces is lower than a height of the first reflection faces. This makes it possible to achieve a lighting apparatus used in photography, which is small and with which the whole area to be photographed is illuminated uniformly. | 2014-03-06 |
| 20140063776 | LED lighting system - A lighting system includes a low-profile LED driver box with quick connect LED drivers that are accessible through service doors, panels or plates. The LED driver box attaches to a ceiling mount to support or suspend an LED light fixture. The LED light fixture is suspended from the LED driver box through a power-feed suspension mechanism that includes at least one direct current power conductor cable to power to the LED light fixture. The LED light fixture includes one or more linear arrays of LEDs. The system also includes a controller or dimming circuit for controlling light output and/or a backup battery for providing power to the LED light fixture in the event of a power failure. | 2014-03-06 |
| 20140063777 | Light Bulb with Automated Emergency Operation - A self cooling light effects device for use in a standard light bulb socket having a socket adaptor, surface embedded LEDs as means to generate light effects, means to control light effects, and means for cooling. Fiber optic cables provide further light effects. Means to control 5 light effects may include a logic board. Means for cooling may be any combination of fans, heat sinks, heat pipes, thermoelectric cooling, a heat conductive filler, and a heat conductive housing. | 2014-03-06 |
| 20140063778 | POINTER OF AN INSTRUMENT DRIVEN WITH A SHAFTLESS STEPPER MOTOR CONTAINING A LIGHTING MECHANISM FOR LIGHTING THE POINTER - A system includes a layer, a shaftless stepper motor, a lighting element, an input magnet, an output magnet, and a pointer. The layer includes first and second opposed sides. The shaftless stepper motor is disposed on the first opposed side of the layer. The lighting element is disposed on the first opposed side of the layer. The input magnet is disposed on the first opposed side of the layer and is connected to the shaftless stepper motor. The output magnet is disposed on the second opposed side of the layer. The pointer is connected to the output magnet. The input magnet connected to the shaftless stepper motor moves, through magnetism, the output magnet and the connected pointer, and the lighting element transmits lights to light the pointer. | 2014-03-06 |
| 20140063779 | LIGHTING DEVICE INCLUDING SPATIALLY SEGREGATED LUMIPHOR AND REFLECTOR ARRANGEMENT - A lighting device includes one or more lumiphoric materials spatially segregated from one or more electrically activated (e.g., solid state) emitters and arranged to emit light toward a reflector for reflection of lumiphor-converted light emissions toward a light transmissive end of the lighting device. One or more adjustment elements may be arranged adjust position of the at least one lumiphoric material, and/or to adjust at least one of (a) position, (b) aim, and (c) focus, of the at least one electrically activated light emitting source. | 2014-03-06 |
| 20140063780 | DRIP CHAMBER ILLUMINATION DEVICE - A drip chamber illumination device including a body and an illumination arm coupled to the body. A light source is disposed on or near the end of the illumination arm wherein the light source may comprise at least one light, but preferably two lights spatially offset that are directed toward a substantially common focal area. The lights may be able to illuminate in different colors. The illumination device further includes a clip attached to the body and configured to removably couple the illumination device to a tube/flush line positioned below a drip chamber. A switch on the device allows a user to selectively provide power from a power source to the lights. The illumination arm may be angled with respect to the body so that the illumination arm may have a substantially vertical orientation when and embodiment of the illumination device is clipped to the tube. | 2014-03-06 |
| 20140063781 | ELECTRONIC INCENSE ASSEMBLY - An electronic incense assembly includes a light source, a collimating lens, a lens array, a number of electronic incense sticks. The light source is configured for emitting a first light beam having a divergent angle. The collimating lens is configured for collimating the first light beam into a parallel second light beam. The lens array has an array of converging lenses, each of which is configured for converging a part of the second light beam passing therethrough into a third laser beam. Each of the electronic incense sticks has an open end arranged to receive one third light beam and a transparent bubble formed at an end opposite to the open end. | 2014-03-06 |
| 20140063782 | POST MOUNTED DISPENSING DEVICE - A unit for dispensing repellant that is mounted on a fence post. The unit also has a lighting system for illuminating an area. The dispensing system and lighting system are operable independently of each other. | 2014-03-06 |
| 20140063783 | LIGHTING DEVICE FOR VENTILATING FAN - A lighting device for a ventilating fan comprising a power pack module and a light-emitting module composed of a lighting louver and a radiator, wherein first positioning lugs projected out of a horizontal projection plane of the power pack module are formed on the top of the power pack module and fixed on the light-emitting module by screws; and a through hole which a cable, used for supplying power for a light-emitting unit, runs through is respectively formed on a side face of the radiator making contact with the power pack module and a side face of the power pack module making contact with the radiator. The lighting device for the ventilating fan further comprises hooks formed on the radiator and a second positioning lug formed on the power pack module, wherein the hooks and the second positioning lug are used for fixing the lighting device on the ventilating fan. | 2014-03-06 |
| 20140063784 | Multi-Layered Electronic Device Cover - A multi-layered decorative electronic device cover that fastens to an electronic device, such as the outer screen of a laptop computer. The electronic device cover is sufficiently rigid to protect the laptop, yet also transparent enough to allow the light form a light source on the laptop to pass through. A passive light can passes through the translucent material of the cover. An active light can pass through a decoratively designed hole in the cover. The cover includes a first layer that attaches directly to the laptop. A second layer may attach to the first layer, and a third layer can also overlay the second layer. Each layer can have its own unique functional and decorative characteristics. Each layer can include a lens for taking pictures, a screen for displaying images, a prism. An optical fiber can also carry light from the laptop's light source to each layer. | 2014-03-06 |
| 20140063785 | DIRECT BACKLIGHT MODULE AND LED ENCAPSULATION THEREOF - The present invention discloses an LED encapsulation for direct backlight module, which includes a base, which is mounted to an LED chip set on a backplane of the direct backlight module; and a support section, which extends from a surface of the base for supporting and fixing a diffusion board of the backlight module. The present invention also discloses a direct backlight module. Practicing the direct backlight module and the LED encapsulation thereof according to the present invention eliminates the need for individually mounting a support structure on the backplane of the backlight module to support a diffusion board and reduces the working hours and the expense for processing the backplane so as to further reduce the cost of the backlight module. | 2014-03-06 |
| 20140063786 | BACKLIGHT MODULE AND BACKLIGHT LAMP GUIDE THEREOF - A backlight module and a backlight lamp guide for the backlight module. The backlight lamp guide ( | 2014-03-06 |
| 20140063787 | Liquid Crystal Device, Backlight Module, and Backplane - A backplane for a backlight module is disclosed. The backplane includes a light incident support for arranging a light source of the backlight module. The light incident support includes an aeration tank for dissipating heat generated from the light source, a sidewall and a connected bottom, wherein the light incident support is formed by extruded alumni. A liquid crystal device and a backlight module are also disclosed. The above backplane, backlight module and liquid crystal device may reduce the cost and enhance the heat dissipation performance. | 2014-03-06 |
| 20140063788 | Backlight System and Liquid Crystal Devices with the Same - A backlight system and the liquid crystal device are disclosed. The backlight system includes a back plate, optical films and a protecting member. The back plate includes at least two main connecting members, and at least one main connecting member includes a top plate and a down plate. The protecting member includes a first portion and a second portion. The protecting member is fixed on the top plate so that the first portion is arranged above the top plate to separate the top plate and the liquid crystal panel above the top plate. The second portion is arranged on a down surface of the top plate to separate the top plate and the optical films. In this way, the assembling efficiency is high and the labor cost is low. In addition, the risk of scratching the liquid crystal panels and the optical films during the assembling process of the backlight system is also reduced. | 2014-03-06 |
| 20140063789 | BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY DEVICE USING SAME - The present invention discloses a backlight module, which includes a light source and an aluminum extrusion. The aluminum extrusion forms at least one thermal chamber. The thermal chamber is a penetrating hollow structure having an opening. The present invention also discloses a liquid crystal display device having the backlight module. Practicing the backlight module of the present invention and the liquid crystal display device using the backlight module allows a channel for air flow to be formed in the interior of the thermal chamber to enhance heat dissipation performance, eliminate the operations of forming a light bar through packaging the light source and an MCPCB and bonding the light bar to the aluminum extrusion, decrease thermal resistance interface, and saves assembling material. | 2014-03-06 |
| 20140063790 | LED Based Lighting Systems for Use on Wearable Articles - The present invention is directed to an LED lighting system adapted for use on the surface of wearable articles, such as headwear (e.g., helmets), outwear (coats, jackets), and sporting wear (uniforms). The LED lighting system may be used to provide safety lighting, for example, ambient illumination of the wearer's movements. | 2014-03-06 |
| 20140063791 | Tactical Flashlight and Accessory - In some embodiments, a flashlight may include a tubular body and a finger rotation feature disposed on the tubular body. In other embodiments, a flashlight accessory may include a flashlight connector to removably attach to a flashlight, a finger rotation feature, and a finger trigger to activate the flashlight. | 2014-03-06 |
| 20140063792 | Hyperbolic Ceiling-Reflector For Directional Light Sources - A downlight fixture includes an optic housing, a light-emitting diode (LED) array, and a lens-less reflector. The LED array emits directional light rays in a downward direction towards an illuminated target. The reflector is mounted within the optic housing and adjacent to the LED array. The reflector has a hyperbolic wall continuously extending between a narrow neck and a wide bell. The light rays are spread into a light beam within the reflector upon making contact solely with the hyperbolic wall. | 2014-03-06 |
| 20140063793 | SEALED LED LIGHT FIXTURE FOR USE IN FOOD PROCESSING APPLICATIONS - A light fixture having a “U”-shaped frame inside a sealed cylindrical housing. Mounted along the center of the face of the frame are one or more LED lamp panels, which include a number of LEDs, some of which may be powered by a back-up source such as an optionally supplied battery for emergency egress lighting. The lamp panels are mounted using a thermal interface material to promote heat transfer from the LED lamp panels to the frame, which in turn radiates the heat into the volume of the housing to enhance cooling. To each side of the LED lamp panels, a highly polished reflector is attached to the frame to focus and concentrate the light while simultaneously shielding the LEDs from heat radiated from the frame. Attached to the obverse side of the frame is a “U”-shaped back cover that forms an electrical enclosure. An optional diffuser may be supplied. | 2014-03-06 |
| 20140063794 | CURVED PRINTED CIRCUIT BOARDS, LIGHT MODULES, AND METHODS FOR CURVING A PRINTED CIRCUIT BOARD - Curved printed circuit boards, light modules, and methods for curving a printed circuit board are disclosed. An example light module includes a curved printed circuit board having electrical connections and a plurality of light sources attached to the curved printed circuit board and electrically coupled to the electrical connections. A power supply is electrically coupled to the plurality of light sources through the electrical connections of the curved printed circuit board and is configured to provide power to the plurality of light sources. An example method for curving a printed circuit board includes forming a plurality of cuts on a substantially flat printed circuit board substrate and bending the printed circuit board substrate to form a curved printed circuit board. | 2014-03-06 |
| 20140063795 | HEADLIGHT COMPRISING LIGHT-EMITTING DIODES - For a headlight comprising a plurality of light-emitting diode arrangements (LG) arranged in a manner distributed in planar fashion on a carrier plate (TP), a cooling device for dissipating thermal power losses arising in the individual light-emitting diode arrangements, in which cooling device a plurality of flow channels extending parallel in terms of flow engineering are provided. The individual flow channels each contain a heat sink (KK), around which flows the partial air flow through the flow channel (FR) for the transfer of heat and which is connected to the relevant assigned light-emitting diode arrangement in a manner exhibiting good thermal conductivity. | 2014-03-06 |
| 20140063796 | ILLUMINATION GRILLE AND ASSEMBLY METHOD - Embodiments of the invention provide an illumination grille assembly comprising a frame and a ventilation grille coupled to the frame, and a plurality of light-emitting diodes coupled with the frame and at least partially covered with a light transparent cover. Some embodiments of the invention provide a lighting and ventilating system including a main housing including an inlet through which air can be received within the main housing and an outlet through which the air can exit the main housing. A blower assembly can be supported in the main housing and it can be operable to generate a flow of air. In some embodiments, an illumination grille assembly can be coupled to the main housing to allow fluid to flow through the illumination grill assembly to the main housing. In some embodiments, the set of illumination devices can be configured and arranged to emit light through the light transparent cover. | 2014-03-06 |
| 20140063797 | MULTIPLE WAVELENGTH LED ARRAY ILLUMINATOR FOR FLUORESCENCE MICROSCOPY - One embodiment provides light along an optical axis. It comprises a substrate and at least one array of multiple LED chips without individual packaging supported by the substrate. The LED chips emit light within different wavelength ranges and are distributed laterally with respect to the axis over an area, the LED chips having light emitting surfaces for emitting light in directions transverse to the area. An optical element adjacent to the light emitting surfaces of the LED chips in the at least one array collects and directs light emitted by the LED chips of the at least one array along the axis towards a target. Another embodiment is directed to a method for providing multiple wavelength light for fluorescent microscopy using the above system. Electric current is supplied to the multiple LED chips, causing them to emit light of multiple wavelengths. The currents supplied to the multiple LED chips are controlled so as to control the exposure of fluorescent dyes with different excitation wavelengths wherein the light emitted by the multiple LED chips include wavelength components at such different excitation wavelengths without having to move the multiple LED chips. | 2014-03-06 |
| 20140063798 | THERMAL SOLUTION FOR LED CANDELABRA LAMPS - A lighting device that uses one or more LEDs, an optical element (e.g, diffuser), and a heat sink to provide thermal management is provided. The overall shape of the lighting device, particularly the heat sink, can be configured to imitate the appearance of a traditional incandescent candelabra lamp. One or more features are also provided to assist with the conduction of heat away from the LED(s) and to the heat sink. The lighting device can provide improved lumen output and light distribution. | 2014-03-06 |
| 20140063799 | WAFER EDGE INSPECTION - Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images. | 2014-03-06 |
| 20140063800 | LIGHTING DEVICE FOR AN LED LAMP - A lighting device has a holder, multiple LED modules and multiple light-homogenized elements. The holder has an axis and multiple working surfaces. The axis is defined axially through the pillar and the base. The working surfaces are formed in an outer side surface of the holder and are arranged around the axis. The LED modules are respectively mounted on the working surfaces of the holder. The light-homogenized elements are respectively mounted on the working surfaces of the holder. Therefore, the LED modules are respectively positioned on the working surfaces to increase the illumination of the side area of the lighting device, and the light-homogenized effect of the light emitted from the lighting device is improved by the light-homogenized elements. | 2014-03-06 |
| 20140063801 | ILLUMINATION LENS AND ILLUMINATION MODULE - An illumination lens includes a light receiving surface | 2014-03-06 |
| 20140063802 | Optical System for LEDs for Controlling Light Utilizing Reflectors - Methods and apparatus for an optical system for LEDs for control of light output from the LEDs. One or more optical pieces may be provided with each being over one or more LEDs and configured to direct a majority of light output from such one or more LEDs toward a desired illumination direction. A formed reflector array may be placed over the optical pieces and include openings each sized to at least partially receive one of the optical pieces and reflectors each extending upward from and provided partially over one of the openings and one of the optical pieces. | 2014-03-06 |
| 20140063803 | ADJUSTABLE LED ASSEMBLY, OPTICAL SYSTEM USING SAME AND METHOD OF ASSEMBLY THEREFOR - Described are various embodiments of a length adjustable LED assembly, optical system using same, and method of assembly therefor. In one embodiment, an optical system comprises a first LED and second LED board each comprising a plurality of LEDs operatively mounted thereon along their respective lengths in accordance with a designated array. The second LED board is adjustably fixable in lengthwise overlapping relationship to the first LED board to provide a length adjustable extension thereto and substantially continuously maintain an optical system output over a combined length of the first LED board and the second LED board. | 2014-03-06 |
| 20140063804 | MODULAR MULTICHANNEL CONNECTOR SYSTEM AND METHOD - Modular multichannel light sources connector systems and methods are provided. A lighting assembly includes substrates, each with a respective plurality of ports and conductive path configurations. Each path configuration includes a plurality of conductive paths between the respective plurality of ports. At least two conductive path configurations are the same. A connector couples one of a plurality of first ports on a first substrate to one of a plurality of second ports on a second substrate. A multichannel power supply's outputs are each coupled to an associated conductive path on the first substrate. A first light source is coupled to two conductive paths on the first substrate, and to a first output. A second light source is coupled to two conductive paths on the second substrate, corresponding to the conductive paths on the first substrate, and to a second output, different from the first output. | 2014-03-06 |
| 20140063805 | LIGHT SOURCE ASSEMBLY - Provided is a light source assembly including: a frame including a device region; a radiator mounted on the device region and detachable therefrom; and a light source including a light emitting device disposed at a position corresponding to the device region above the radiator. | 2014-03-06 |
| 20140063806 | Heat-Dissipating Structure for an LED Lamp - A heat-dissipating structure for LED lamp has a lamp cover, and a power conversion device and a ceramic substrate mounted inside the lamp cover. The lamp cover has multiple heat-dissipating holes and multiple mounting ears. Each mounting ear is formed on an edge of one of the heat-dissipating holes and is bent inwardly with the heat-dissipating hole uncovered. The ceramic substrate is mounted on the mounting ears. The ceramic substrate has multiple LEDs mounted thereon, absorbs heat generated when the LEDs emit light and conducts the heat to the lamp cover through the mounting ears. The heat generated when the LEDs are lit and the power conversion converts a mains power is transferred to a heat convection space between the ceramic substrate and the lamp cover, and is further dissipated to an ambient environment, thereby achieving fast heat dissipation and a light LED lamp without additional heat sink thereon. | 2014-03-06 |
| 20140063807 | LIGHT EMITTING STRUCTURE AND LIGHTING UNITS THEREOF - A lighting unit includes a base and light emitting elements. At least a pin is disposed at the top of the base, and the light emitting units are provided on and electrically connected to the pin. At least a conductive hole is formed at a location in the base corresponding to the pin for communicating with the top and the bottom of the base. Also, a plurality of the lighting units are integrally arranged to form a light emitting structure. | 2014-03-06 |
| 20140063808 | LASER LIGHTING DEVICE - In a laser lighting device, a fly's eye lens and a condenser lens are disposed in an optical path of pulsed laser light emitted from a light source, and an electro-optical crystal element for continuously changing the deflection direction of the pulsed laser light with respect to the incident light and allowing the deflected light to pass therethrough is disposed in a position between the light source and the fly's eye lens or between the fly's eye lens and the condenser lens. The electro-optical crystal element is formed, for example, of a pair of electrodes and an optical crystal material disposed between the electrodes, and a voltage is applied between the electrodes to produce an electric field that changes the refractive index of the electro-optical crystal element. As a result, non-uniform illumination due to interference fringes produced by light having passed through the fly's eye lens can be reduced. | 2014-03-06 |
| 20140063809 | LED BASED LAMP ASSEMBLY - An LED device such as a lamp or light comprises an LED for emitting light and electronics for powering the LED. An enclosure retains at least a portion of the electronics. A heat sink for dissipating heat from the LED assembly is provided where a portion of the heat sink clamps the enclosure to secure the heat sink structure to the enclosure. | 2014-03-06 |
| 20140063810 | MODULAR OPTIC FOR CHANGING LIGHT EMITTING SURFACE - An LES is a surface from which light emanates from a lighting fixture. The present disclosure relates to a providing a lighting fixture that has an actual light emitting surface (A-LES), which is substantially smaller than the maximum potential LES (M-LES) for the lighting fixture. The M-LES is defined as the theoretical maximum LES for the mounting structure of the lighting fixture, and the A-LES is defined as the actual LES of the lighting fixture, as dictated by the lens or optical structures of the lighting fixture. The A-LES may provide an LES that is not only smaller, but also shaped differently, from the M-LES, to help control the light output of the lighting fixture based on the lighting application. | 2014-03-06 |
| 20140063811 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed. | 2014-03-06 |
| 20140063812 | Wall-Wash Fixture For Directional Light Sources - A downlight reflector assembly for a light-emitting diode (LED) light source includes a kicker reflector and an upper scoop. The kicker reflector has a reflector wall extending between a small top opening and a large bottom opening along a transverse axis. The reflector wall has an internal surface with an illuminated area and a non-illuminated area. The upper scoop is mounted in the small top opening of the kicker reflector and has a reflective multi-faceted surface with a concave curvature relative to the LED light source. The upper scoop extends from the top opening in part along the transverse axis and covering a portion of the top opening. The multi-faceted surface faces both of the illuminated area of the kicker reflector and the top opening for reflecting light rays received through the top opening towards the illuminated area. | 2014-03-06 |
| 20140063813 | Projection Lamp - A projection lamp includes a bulb, a main reflective cover and a secondary reflective cover. The bulb includes a wick and a lamp tube which wraps the wick. The wick is configured to emit divergent light beams while the bulb is lit up. The main reflective cover is connected to the lamp tube and includes a main reflective surface facing the wick. The main reflective surface is configured to convert the divergent light beams into projection beams. The secondary reflective cover is melt bonded to the lamp tube and includes a secondary reflective surface facing both of the wick and the main reflective surface. The secondary reflective surface is configured to reflect a portion of the divergent light beams, cannot be directly emitted onto the main reflective surface, onto the main reflective surface while the bulb is lit up. | 2014-03-06 |
| 20140063814 | ILLUMINATION SYSTEM - An illumination system may include a receiver which is mounted on a support surface, such as a heat sink, and a light module that may include a cover and an LED assembly. The LED assembly is rotateably attached to the cover and seats within the receiver. The receiver may have touch-safe terminals attached thereto for providing power to the LED assembly. The LED assembly may include a cup which enables potting material to be easily included in the assembly during manufacturing. When the LED assembly is attached to the receiver, blades on the LED assembly mate with the terminals on the receiver. | 2014-03-06 |
| 20140063815 | LED LAMP - An LED lamp includes a base, a driving circuit board mounted to the base, a lighting module, a light guide member, and a reflecting member for reflecting light transmitted from the light guide member. The lighting module includes LEDs annularly disposed on and connected electrically to the driving circuit board. The light guide member has a light-receiving end corresponding in position to the LEDs. The reflecting member has an annular reflecting portion disposed in the light guide member, and a covering portion extending outwardly from a distal end of the annular reflecting portion and covering a distal end of the light guide member. | 2014-03-06 |
| 20140063816 | OPTICAL ELEMENT AND ILLUMINATION UNIT - An optical element according to the present invention includes a light receiving surface which is designed to cover an emitting surface of a planar light source device, a reflecting surface, a light exit surface which is contiguous to the periphery of the reflecting surface. When the center of the emitting surface is designated as a point O and an axis which passes through the point O and is perpendicular to the emitting surface is designated as an optical axis of the optical element, the reflecting surface has a concave portion around the optical axis and an outer edge surrounding the concave portion. | 2014-03-06 |
| 20140063817 | Lighting Device - A lighting device, in particular in the form of a ceiling, wall, floor or outside light, having a punctiform light source, preferably in the form of an LED, and a lens assigned to the light source, which has a light entry recess in the form of a bowl or blind hole, which deflects at least part of the incident light, indirectly or directly, onto a totally reflecting and/or mirrored lateral surface, which in turn deflects the light onto a light exit surface, which forms a front side of the lens located opposite the light entry recess. The lateral surface of the lens, which deflects the light coming directly or indirectly from the light entry surface onto the light exit surface by means of total reflection and/or mirroring, is provided with a multiplicity of facets. | 2014-03-06 |
| 20140063818 | MODULAR OPTIC FOR CHANGING LIGHT EMITTING SURFACE - An LES is a surface from which light emanates from a lighting fixture. The present disclosure relates to a providing a lighting fixture that has an actual light emitting surface (A-LES), which is substantially smaller than the maximum potential LES (M-LES) for the lighting fixture. The M-LES is defined as the theoretical maximum LES for the mounting structure of the lighting fixture, and the A-LES is defined as the actual LES of the lighting fixture, as dictated by the lens or optical structures of the lighting fixture. The A-LES may provide an LES that is not only smaller, but also shaped differently, from the M-LES, to help control the light output of the lighting fixture based on the lighting application. | 2014-03-06 |
| 20140063819 | REFLECTOR FOR LIGHT-EMITTING DIODE AND HOUSING - Provided is a reflector for a light-emitting diode which has a small decrease in reflectance in a range from the ultraviolet region to visible region, and has excellent heat resistance, light resistance, and weather resistance, and a housing having this reflector. The reflector for a light-emitting diode is obtained by molding a fluororesin composition containing a filler with an average particle diameter of smaller than 1 μm, wherein the difference between the maximum value and the minimum value of the reflectance at a wavelength of 240-700 nm is within 25%. | 2014-03-06 |
| 20140063820 | LAMP TUBE - A lamp tube includes a light transmission tube, a heat dissipation structure, a die bonding substrate and at least one light source. The light transmission tube includes first guiding rails disposed on opposite positions of the inner wall thereof. The first guising rails and the inner wall of the light transmission tube form first grooves. The heat dissipation structure inserts into the light transmission tube, and includes a die bonding area, extending arms downwardly extended from opposite sides of the heat dissipation structure, and connecting arms connected to the extending arms. Each of the extending arms includes second guiding rails and second grooves. The second guiding rail is engaged with the first groove, and the first guiding rail is engaged with the second groove. The die bonding substrate is placed on the die bonding area. The light source is placed on the die bonding substrate. | 2014-03-06 |
| 20140063821 | ENCLOSURE ASSEMBLY AND SYSTEMS AND METHODS FOR USING THE SAME - An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the module to prevent the spread of EMI, to assist in heat dissipation, to protect the structural integrity of the module, and the like. | 2014-03-06 |
| 20140063822 | WIRING BOARD, LIGHT-EMITTING DEVICE, AND METHOD OF MANUFACTURING THE WIRING BOARD - According to one embodiment, a wiring board includes a base assuming a flat plate shape, a wiring pattern provided in a position on one surface of the base and apart from a peripheral edge of the base, a first metal layer provided on the opposite side of the base side of the wiring pattern, and a second metal layer configured to cover the first metal layer and a sidewall of the wiring pattern. | 2014-03-06 |
| 20140063823 | LIGHTING APPARATUS - A lighting apparatus includes an apparatus body, an LED unit including an LED substrate, and a fixing member which attaches the LED substrate to a bottom surface of the apparatus body. The fixing member has elasticity and includes: a fixing claw having a flat plate, which protrudes in a planar direction and which presses the LED substrate against the bottom surface of the apparatus body; and a positioning claw having an L-shape, which protrudes in the planar direction and which contacts at least one side of the LED substrate in the planar direction. | 2014-03-06 |
| 20140063824 | SYSTEM AND METHOD FOR CONTROLLING HEAD LAMP FOR VEHICLE - A system and method for controlling a head lamp for a vehicle are provided. The system includes a first head lamp that is configured to block a part of a first light emitted from a first light source to form a first shaded line on a front road of a vehicle. In addition, a second head lamp is configured to block a part of a second light emitted from a second light source to form a second shaded line on the front road of the vehicle. | 2014-03-06 |
| 20140063825 | REAR STRUCTURE OF SADDLE-RIDE TYPE VEHICLE - A rear structure of a saddle-ride type vehicle for preventing rainwater or the like splashed by a rear wheel from entering a fresh air inlet of an engine intake system. The rear structure of a saddle-ride type vehicle includes a rear fender halved into a first fender and a second fender connected to each other. The first fender is formed with a hanging portion so as to cover the rear and upside of a rear wheel and the second fender covering the upside of the rear wheel with a fresh air inlet being provided lateral to and in front of the rear wheel. The first fender and the second fender are disposed to overlap each other in an anteroposterior direction. The second fender is disposed on the vehicle-widthwise inside of the first fender. The second fender has anteroposteriorly and downwardly extending sidewalls at both vehicle-widthwise lateral end portions. | 2014-03-06 |
| 20140063826 | HEADLIGHT SUPPORT STRUCTURE FOR SADDLE TYPE VEHICLE - A saddle type vehicle provided with a headlight stay for permitting a harness laying operation to be easily carried out. A motorcycle is provided with the headlight stay which is supported on a head pipe and extends toward the vehicle front side from the head pipe. A headlight unit is attached to the headlight stay. The headlight stay includes a first stay extending forward from the head pipe, in a side view of the vehicle and a second stay which is supported in a cantilever manner by a front portion of the first stay and extends rearwardly and upwardly. The headlight unit is partly disposed on the front side of the second stay and is disposed so as to overlap with the first stay. | 2014-03-06 |
| 20140063827 | Watercraft Light - A watercraft includes a light source illuminated in response to a sound signal. The light source may be a decorative light or color coded to function as a port light, a starboard light, or an aft light. The sound source may be from a wireless transmission, line level output from a media player, or speaker output from media player, as examples. | 2014-03-06 |
| 20140063828 | Enhanced Watercraft - A paddleboard system includes a paddleboard having an upper surface, a lower surface and a specific peripheral outer shape, and a fitted skirt having the specific peripheral outer shape of the paddleboard and additional material providing a first extension on the lower surface and a second extension on the upper surface fully around the specific peripheral outer shape, such that the fitted skirt is enabled to engage the paddleboard and stay in place in use. | 2014-03-06 |
| 20140063829 | HEAT DISSIPATING SYSTEM FOR A LIGHT, HEADLAMP ASSEMBLY COMPRISING THE SAME, AND METHOD OF DISSIPATING HEAT - In an embodiment, a heat dissipating system for a light can include: a light source comprising an LED; a reflector adjacent the LED; a housing around the LED module; and a flexible conductive connector attached at one end to a heat sink and at another end to the light source, and configured to conduct heat away from the light source and to the heat sink. The heat sink is located remote from the light source. In an embodiment, a method of dissipating heat away from a LED module can include: conducting heat from the LED module through a flexible conductive connector to a heat sink, wherein a lamp comprises the LED module, a housing, and a reflector, and wherein the heat sink is located external to the LED housing. | 2014-03-06 |
| 20140063830 | LIGHTING APPARATUS FOR VEHICLE AND MANUFACTURING METHOD FOR THE SAME - A lighting apparatus for a vehicle may include a flexible printed circuit board of which at least one lighting source may be mounted on an upper surface of the flexible printed circuit board, and a cover which may be made of flexible material, and connected on the printed circuit board for the at least one lighting source to be disposed within the cover, wherein the cover distributes a light emitted from the at least one lighting source to an upper direction of the cover. | 2014-03-06 |
| 20140063831 | METHODS OF MAKING AND ARTICLES COMPRISING A YELLOWING RESISTANT POLYCARBONATE COMPOSITION - Disclosed herein are methods and compositions of polycarbonate blends having, among other characteristics, improved heat resistance. The resulting polycarbonate blends, comprising a first polycarbonate comprising structural repeating units derived from bisphenol acetophenone and optionally a second polycarbonate polymer comprising structural repeating units derived from bisphenol A, can be used in the manufacture of articles while still retaining the advantageous physical properties of blended polycarbonate compositions with improved heat resistance. The disclosed polycarbonate blends optionally comprise one or more polycarbonate blend additives. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention. | 2014-03-06 |
